TW567133B - Method for micro hot embossing by pressurized gas - Google Patents

Abstract

This invention provides a method for micro hot embossing by pressurized gas, comprising the steps of placing an object to be embossed are flatly above a mold, that is covered by a sealed chamber to form a sealed space; elevating the temperature until the object to be embossed reaches a thermoplastic sate; introducing pressurized gas to the object to be embossed. Hot embossing by evenly distributed pressure may be realized due to the equal-pressure distribution characteristic of gas molecules. Because gas is used to achieve hot embossing by evenly distributed pressure, the area of the hot embossing will not be limited such that such a method may be applied in directly hot embossing silicon wafers.

Description

567133 A7 B7 V. Description of the invention (1) The present invention relates to a gas micro-heat embossing method for microstructures. Specifically, the invention relates to a method in which a high-pressure gas is directly pressurized onto a mold to be imprinted on a mold, and the mold The micro-heat embossing method is used to transfer the microstructure to the target to be embossed. Since the 1990s, the development of Micro-Electro-Mechanical System (MEMS) has attracted much attention around the world. It includes the integration of multiple technologies such as machinery, optics, electronics, materials, control, and chemistry. It is hoped that by using this new manufacturing technology, products can be miniaturized to improve their performance, quality, reliability, and added value, while reducing production costs and energy consumption, and making production and life applications more convenient. Hot Embossing is the main microstructure replication technology in the field of microelectromechanical systems. Microstructure refers to the unit of measurement in μm or nm. The microstructure can be used directly as a component or used in other processes. Because this process is simple and can be made in a hybrid, if you can control the forming accuracy and quality of fiber products, it can become one of the key processes to increase the production of micro-electromechanical products. In the past, the micro-hot stamping process used a hydraulic cylinder, a pneumatic cylinder, or a motor / screw pressurizing mechanism to directly drive the pressing plate to hold the plastic and the mold for hot pressing. In order to better understand the background of the present invention, a conventional micro-heat embossing apparatus and method will be described. * Refer to Figure 6, it is known that the hot age is difficult. Firstly, put the mold on the ship. On the mold 102, a cushion-layer cushioning material (usually Shi Xijiao) is usually added as the target to be imprinted. The plastic material 101 is placed at the lower platen 103b. The platen is a heating and cooling device, and the structure 2 can be used to heat and cool plastics and molds. After that, the hydraulic cylinder, pneumatic cylinder or motor / screw pressurizing mechanism ，) directly drives the pressure plate to press the plastic and the mold to avoid hot pressing; after a certain period of embossing time has elapsed, the mold is opened and the finished product is taken out after cooling. Using the above-mentioned conventional hot stamping process method, there will be uneven distribution of the stamping force, which will affect the finished product.

The issue of dimensional reproduction accuracy printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs; and the direct platen hot embossing mechanism method, the problem of pressure distribution is a challenge in the area of large-area rail embossing. Therefore, the current hot stamping area is limited to a small size. For example, the world's largest hot stamping machine manufacturer, Germany's JEN_K Norway, the most advanced model of the shirt company HEX-03, has a maximum hot stamping area of only 4 British pairs. The micro-hot embossing method is mainly used in the towels in the manufacturing field of Wei Wei Niu. It is an important micro-structure replication facial technique. The Saki method is the microstructure on the wire-thinning electroformed mask of the silk saki μ 嶋 thief to complete the reduction and rapid reproduction of high-quality MEMS finished products. This method has excellent forming characteristics. It has low scale, low flow rate, fine texture, and is not easy to produce stress surface problems. It is very suitable for forming optical elements or various fine structures. Its application fields can be divided into micro-lens, micro-grating, micro-diffraction, and other micro-optical element molding; microbial wafers, micro-channels, micro-sensing, Lai Biotechnology; micro-mechanical element surfaces such as Lai, Borrow, and Micro-Record; micro acceleration Regulations include microelectronic circuits and microstructures. If it cooperates with automation, it can increase the production volume and achieve the purpose of mass production. Therefore, the hot stamping process is considered to be a key process in the micro-electromechanical industry to reduce production costs and increase production capacity. The basic principle of the micro-hot stamping process is: material preparation, heating, hot pressing, pressure-holding cooling, and demoulding to take out the finished product, and complete the entire process. The temperature of the returning material must be at least its glass transition temperature (Transition Temperature, Tg) when it is hot. It will begin to soften when the pressure of the pressure plate is reduced to hold the plastic / mold. The plastic will fill the microcavities due to the flow deformation caused by the imprint force. . After the plastic is filled, the temperature must be lowered below the glass transition temperature for demoulding. At this time, the temperature drop will cause the plastic material to shrink, so it is necessary to maintain a certain embossing force as a holding pressure, so that the plastic in the mold 6 can continue to have plastic filling the mold cavity while shrinking, and supplement the plastic shrinkage. In part, the temperature is lowered below the glass transition temperature and demolded to remove the finished product. The conventional micro-hot stamping process uses hydraulic cylinders, pneumatic cylinders or motor / screw pressurization mechanisms, directly III ϋ--H-1 ·--i ^^ w · (Please read the notes on the back 顼 before filling (This page) 567133 A7 B7 V. Description of the invention (3) Drive the pressure plate to press the plastic and mold to hot press. For example, currently the world's largest hot stamping mechanism manufacturer, the US Patent No. 5,993,189 and the German Patent No. 196,48,844 proposed by JENOPTIKMikrotechnik of Germany, all adopt a direct hot pressing mechanism using a platen. In addition, the nano-imprint microlithography method (Hot) disclosed in U.S. Patent No. 5,772,905 (Stephen Y. Chou et al.)

Embossing Lithography (HEL or Nano Imprint Lithography, NIL) also adopts direct hot-press molding method. During hot embossing, the embossing force is large at the middle of the platen, and it is small near the edge of the platen. Therefore, the silicon rubber (Silicone Rubber) is usually used as the cushioning pad of the mold in order to alleviate and balance the influence of pressure to achieve uniform molding. However, Shixi rubber sheet is easily stretched and deformed, and due to the stretch characteristics of the solid material itself, the embossing force cannot reach the ideal uniform distribution state. In the filling stage, the uneven distribution of the embossing force will cause the flaps to not fill the cooling stage of each microcavity. The unevenness of the embossing force will cause the plastic to shrink unevenly, which will seriously affect the size of the finished microstructure after rewriting. , So that the finished micro-electromechanical products can not meet the requirements of high precision and high quality. This defect makes the current hot stamping process yield low, and the replication mass production function is greatly reduced. In addition, with the rapid development of semiconductor industry technology, the production area of Shi Xi process has also become larger and larger. From the early 4 pairs of wafers (Wafer), it has gradually progressed to 6 o'clock, 8 pairs, and even 12 pairs of wafers of the current highest-level technology. An increase in wafer area 'means a reduction in manufacturing costs per unit area and an increase in overall productivity. Micro-electro-mechanical systems are mainly based on the Shixi process, and the development trend is also towards large-area wafer fabrication. At the current stage, the hot stamping process technology is generally still at 4 JENOPTIK Mikrotechnik company, the most advanced model HEX-G3, the largest hot stamping area is inches, and the pressing method is still directly Type of embossing mechanism. At present, academia and industry all over the world are devoted to the research and development of large-area micro-heat embossing, and the present invention discloses that the micro-heat embossing is performed. 'Boots. Secondly, in the hot stamping process, the current conventional technology uses the direct platen stamping method. _-6- ^ paper size _ + _ CNS surface binding 567133 A7

When the mold is a miscellaneous material (such as __, Lai master plate), it is expected that cracks will occur. Therefore, t is used as an electroforming method for wafers (Eleetf_ti is converted into a postal letter M_, which is then used to print. However, in the electroforming process, due to the electrochemical reaction, a large number of various heavy metal electroforming is required. Acids, minus, various additives (such as stress relief, buttoning agents, wetting agents, etc.) 'These chemical solutions are not expensive and expensive, which greatly increases the burden on the environment. In addition, there are many defects in the electroforming process, such as replication efficiency, needle There are still many problems to be solved, such as holes, _, surface accuracy, mechanical properties, and poor thickness uniformity.

Therefore, if a large number of micro-electromechanical system products are to be produced commercially and can meet the quality requirements of high precision and high quality i, it is necessary to solve the problems of uneven distribution of embossing force and limited hot pressing area. !

In view of the problems of the above-mentioned conventional techniques, the present invention provides a gas miscellaneous hot stamping molding method capable of uniform force. Member of the Intellectual Property Bureau of the Ministry of Economic Affairs

According to the object of the present invention, a method for forming an air-breathing seal with an unsightly structure is provided. A mold with a structure is set on the operation pad; the target to be imprinted is flatly placed on the mold eight and 70. Wang Di covers the mold, the surface area of the target to be imprinted is large enough to completely cover the mold and leave the remaining part to be tightly connected with the operating table strip; __cover the remaining part of the health-printed label 'and make the interior of the fine cavity Combined with the mold to be imprinted on the closed shaft part to form a closed space; the pure to miscellaneous shape of the surface imprinted mark and the high-pressure clock to the closed space of the facial cavity are all secreted to the health Mark Printing Agency, embossed the mark by the micro-knot on the mold. According to the present invention, the purpose of the method is to improve the appearance of the airship clock seal, which is used to transfer microstructures to both sides of the target to be imprinted, including the step of: Dividing the lion into the mold with the required inspection structure, the mold is lowered, and the target to be embossed is sandwiched on the mold, the sandwich is stacked, and the paper is folded. Off ^ (CNS) A4 Specification (2nd Edition 297 Gongchu) ""

V. Description of the invention (5) mm / ± m imprinted label t will print the micro-junction case on the upper mold and the lower mold to the ready to be installed. According to this failure and another _ purpose, to provide the surface _ structure of the gas ship The method of color printing includes the following steps: in operation a, gland, ^ Shi = ^ 丨 > auxiliary ⑼θ /, σ to place a substrate coated with a single layer of hardened local molecules on a micro ... The simple towel has a microstructure-the polymer monomer layer on the surface of the silk is in contact, and the mold / substrate stacking age is 70%; the embarrassment of the crevice is covered by the combination of the mold / basic stack and sealed. Film / mold / base stacking combination. The surface area of the sealing film is large enough to completely cover it.-Ming: Stack and leave the remaining part to be tightly connected with the operation table. Cover the sealed cavity with the remaining part of the sealing film. The stacking assembly is completely located in the sealed space of the closed cavity; the polymer monomer layer is heated to a buttonable state; and the button gas is passed through the sealed cavity of the closed cavity to evenly press the stacking assembly. Saki mold's micro-job ffl misprints to the high-quality monomer layer. In addition, when performing hot embossing, the pressure of the high-pressure gas is 10 kg / cn ^ 200 kg / cm2, and the hot pressing time is 1 to 30 minutes. According to the present invention, in a confined space, high pressure gas is used for micro-heat embossing to reach a state where the uniform pressure of the J-yuan king sentence is cloth. By virtue of the isobaric distribution characteristics of gas molecules, the hot-embossing area is not limited ', and large-area hot-embossing can be incorporated, and the finished product has excellent dimensional accuracy. In addition, according to the present invention, the use of gas pressure can eliminate the direct pressure method of the conventional platen mechanism, so that the silicon wafer can be directly imprinted without the need to turn the silicon wafer into an electroformed nickel mold, which can simplify the paper. Aircraft uses Chinese National Standard (CNS) A4 (21Gx297 public love) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by employee consumer cooperatives 567133 V. Description of invention (6) Chemical process and reduce costs ΜΛMM In the following description with reference to the drawings, The above and other objects, advantages, and features of the present invention will be more clearly presented. Among them, FIGS. 1 (a) to 1 (d) are schematic diagrams for explaining the first operation of the gas micro-hot embossing method according to the present invention. Examples. Figs. 2 (a) to 2 (d) are schematic views for explaining a second embodiment of the operation of the gas micro-hot stamping method according to the present invention. Figs. 3 (a) to 3 (e) are schematic views for explaining a third embodiment of the operation of the gas micro-hot stamping method according to the present invention. Figs. 4 (a) to 4 (e) are not intended to illustrate the fourth embodiment of the operation of the gas micro-hot stamping method according to the present invention. Figures 5 to 5A are schematic views for explaining the fifth embodiment of the operation of the gas micro-hot stamping method according to the present invention. Fig. 6 shows a conventional micro-embossing embodiment. Main component comparison table 1 2 molds 2a upper mold 2b lower mold 3 plastic plate-9 to be embossed-This paper size is suitable for G family standard (CNS) A4 specification (21GX297 meal) ~ '------- ------- t · ----- IT ------ (Please read the precautions on the back before filling this page) 567133 A7 B7 V. Description of the invention (7) 4 Layer to be imprinted 5 Substrate 8 Sealing film Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 10 Heating and cooling plate 12 Closed cavity 14 Pipe 16 Pressure control valve 18 High-pressure gas compressor 101 Target to be imprinted 102 Mold 103a Upper plate 103b Lower plate 105 Heating and cooling device 106 Pressurizing mechanism (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210x297 mm) 567133, invention description (8) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Detailed description of the preferred embodiment: Figures 1 (a) to 1 (d) show the first practical example of the gas micro-hot stamping method according to the present invention. As shown in FIG. 1 (a), a film such as a plastic film material as a target to be imprinted is placed on a mold 2 having a predetermined microstructure in advance, and one side of the mold 2 having the microstructure is in contact with the sample to be sampled. The thus-formed plastic / mold stack combination is set on the heating and cooling ^ 10 as an operation table. This heating and cooling plate can be used to heat and cool plastic. Then, as shown in ® 1 (b), a closed cavity 12 is covered on this plastic / mold stack combination, and the plastic / mold stack is formed to form a Lai space, and the closed cavity is connected to an oil pressure or a crank (not shown in the figure) ) For quick opening and closing. This cavity is connected to a high-pressure gas compressor M and a pressure control valve 16 via a f-way 14. Then, as shown in ® 1 (c), use a heating and cooling plate to heat it up and increase the temperature to above the degree of glass transition of the petals. At a high pressure, the molding pressure conditions of this aerodynamic force mixed by the pressure control side are exemplified and the gas pressure is about 10 to 200 kg / cm2. At this time, the plastic starts to fill the cavity depending on the embossing force, and after a period of time, it starts to cool and continues to maintain the pressure. After the angelica has completed the filling of the entire workpiece wheel, the air is blown out through the pressure control valve 16, and then the closed chamber is opened to take out the finished product (as shown in Fig. 1 (d)). Embodiment 2 Figures 2 (a) to 2 (d) show a second embodiment of the gas micro-hot stamping method according to the present invention, except that the hot stamping mold 2 used is a brittle material (such as a stone xi wafer mother) Mold, glass master mold) and Lai-11 This paper size is applicable to China National Standard (CNS) A4 (210x297mm H) Note page binding 567133 A7

Binding 567133 A7

The staff of the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives at this time began to fill the cavity of the plastic film 1 due to the embossing force. After a period of time, the cold part was started and the pressure was maintained. The secret pressure time is preferably in a minute. In addition, the sealing film has a glass transition temperature that is robustly high. 2. After the outline of the entire microstructure is completely transferred to the plastic film, the body / ¾ out through the pressure control valve π and then open the cavity 12, and take out the finished product (as shown in Figure ⑽). Embodiment 4 Figs. 4 (a) -4 (e) show a fourth embodiment according to the present invention, in which a microstructure element is molded on a plate-shaped target. As shown in FIG. 4 (a), the Na plate 3 (for example, PMMA plate) as the target to be imprinted is placed on the mold 2 with microstructure in advance, and it is in contact with the microstructure __ of the mold 2, and The stacking age of the completed flap plate / mold is __ plus age, and the heating and cooling plate 10 can be used to heat and cool plastic. σ Next ', as shown in FIG. 4 (b), a piece of airtight film 8 is laid on this plastic plate / mold stack combination to form a three-layer stack combination of sealing film / plastic plate / mold. The function of the sealing film is to cooperate with the closed cavity to perform gas micro-heat embossing of the plate micro-structure elements. Next, as shown in FIG. 4 (c), a closed cavity 12 is covered by the three-layer stacking combination to make it a closed space. The frontal cavity 12 is connected to a Lai or crank (not shown in the figure). Closed cavity action. The closed chamber is connected to a high-pressure gas compressor 18 and a pressure control valve 16 via a pipeline 14. Then, as shown in FIG. 4 (d), the plastic plate 3 is heated by a heating and cooling plate 10, and the temperature is increased above the glass transition temperature of the plastic plate, so that the flap plate is softened and the high-pressure gas compressor 18 is turned on. The human sewing gas is controlled by the pressure control program 16 to adjust the facial strength to the molding pressure condition of the plastic plate 3, for example, a gas pressure of about 10 to 200 kg / cm2. At this time

Order

-13- 567133 B7 V. Description of the invention (11) 2 After the embossing force starts to fill the cavity, after __ some time, cooling will be started and at the same time, when the plastic plate 3 completes the filling of the overall workpiece contour, The pressure control valve% blows out the gas, and then opens the closed chamber 12 to take out the finished product (as shown in FIG. 4 (e)). Eight/

tMM page order Figures 5 (a) to 5 (e) show a fifth embodiment of the gas micro-hot stamping method according to the present invention. As shown in FIG. 5 (a), a polymer monomer such as a photoresist is coated on a substrate $ such as a broken wafer in advance, and then baked and hardened to form a layer 4 to be imprinted. One side of the mold 2 is placed on the layer 4 to be embossed to become a mold / crystal combination. The scale stack is placed on a 1G cooling plate 1G, and the heating and cooling plate H) can be used to heat and cool the layer 4 to be imprinted on the substrate 5. … Then, as shown in FIG. 5 (b), a sheet of the sealing film 8 is laid on this mold / shixi wafer stacking assembly to form a layered stacking assembly of sealing tools / bases. The function of this sealing film is to match the closed cavity for gas micro-heat embossing. Then, as shown in FIG. 5 (a), a closed cavity 12 is covered by this layered stacking combination to make it a damaged workshop. The closed cavity Π is connected to an oil pressure or a crank (not shown in the figure) for quick operation. Opening and closing the closed cavity 12 moves. The closed chamber 12 is connected to a high-pressure gas compressor 18 and a pressure control valve 16 via a pipeline 14. Then, as shown in FIG. 5 (d), the heating and cooling plate 10 is used to heat the layer 4 to be imprinted, and the temperature is increased above the glass transition temperature of the layer 4 to be imprinted, so that the layer 4 to be imprinted is in a soft and plastic state. Use two gas repetitive shrinking machines 18 to pass in high-moving gas, and at the same time, adjust the gas force to the molding condition of the repeated printing layer 4 through the control valve 16. For example, about 10 ~ -20kg / cm2 of gas-14- > Paper size applicable_ 国 @ 家 标准 (CNS) A4 size (210x297 male H) Printed on 567133 A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (12) '' -------- Body pressure. At this time, the embossing layer 4 is subjected to embossing force to start filling of the cavity. After a period of time, cooling is started and the pressure is continuously maintained. When the overall microstructure outline on the mold 2 is completely transferred to the layer 4 to be imprinted, the gas is blown out through the pressure control 16 and then the closed cavity is opened to take out the finished product (as shown in Figure 5). Although the present invention has been described with the preferred embodiments, it is for illustrative purposes only and is not intended to limit the present invention. Anyone who knows this young artist can implement the above-mentioned implementation within the spirit and scope of the present invention. _Changes and modifications, the scope of the present invention_ The attached towel is subject to the scope of the patent. For example, according to the present invention, the gas used for performing gas micro-hot stamping is air, or other inert gas (such as argon, nitrogen, etc.), or a mixture of these gases. For example, in addition to high molecular monomers such as plastic molds, plastic plates, and photoresistors to be imprinted, gold shots such as | and gold can also be used. In addition, the Na plate referred to in this description # means a thickness of 0.2 mm or more, and the plastic film means a thickness of 0 2 mm or less. For another example, the micro-hot stamping mold (master) used in the present invention includes: a micro-machined micro-machined mold, and a silicon wafer master mold (for example, a 4-inch, 6-inch, 8-inch, 12-inch or larger), electroformed nickel molds, glass substrate molds, or other micro-molds through various micro-processing. The features and advantages of the present invention are summarized as follows: 1. According to the gas micro-hot embossing method of the present invention, gas is used to directly perform micro-hot embossing on an imprint target without any other actuator and / or pressure mechanism. . Due to the isotropic and isobaric pressure distribution characteristics of gas molecules, a completely uniform pressure can be achieved. -15- This paper is suitable for CNS A4 specifications (21GX297). ---- III ϋ-I- ---(Please read the notes on the back before filling out this page) 567133 、 Instructions of the invention (13) Micro hot stamping of the distribution. 2. The prostitutes printed on the basis of this nucleus can produce a progress effect of completely uniform pressure. And the isobaric distribution characteristics of the gas, so the hot embossing area is not 3, and can be hot embossing with a very large area (for example, 4 inches, 6 inches, 8 inches, 12 inches and superior). " ^ 3. Compared with the conventional hot stamping customary technology, the gas micro-hot stamping method according to the present invention 'uses gas pressure in the manufacturing process, which can eliminate the direct pressing method of the traditional platen mechanism, so it can be directly pressed. "God Wafers" no longer need to be turned into wafers for electroforming. It simplifies manufacturing steps, reduces costs, and is environmentally friendly, clean, and energy efficient. 4. According to the invention, the printed surface of the swollen micro-medullary is green, and the double-sided micro-structure hot stamping can be performed on the scale, and the process has great flexibility. 5. Compared with the conventional micro-heat embossing technology, the gas micro-heat embossing method according to the present invention can avoid the use of a hot embossing molding machine that is expensive, has limited functions, has a complicated machine design, and is difficult to maintain. The above items are printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The paper size is applicable to China National Standard (CNS) A4 (210x297 mm).

Claims (1)

567133 Amendment: Chuan Ling> Application scope of patent. A gas micro-heat embossing molding method for molding microstructures. In a closed room, when the target to be marked on the mold is heated to a softened and plastic state, Directly applying a castle to the combination of the mark to be printed and the mold to form a combination of 'y' to transfer the microstructure on the mold to the mark to be imprinted, which is characterized in that: In the first and second spaces, the mold and the one to be pressed 1 and 5 are in the first space, a high-pressure gas is applied in the first space, and the high pressure is directly applied to the scales to take the mark. Miscellaneous combination, do not touch any surface pressure to I The combination of the target to be imprinted and the mold. The old method 2. According to the method described in the patent application No. 丨, the towel is subjected to hot embossing for 1 to 30 minutes at the high pressure button pressure of iGkg / cm2 || to 200 kg / cm2. 3. According to the method described in item i of the application, the towel to be embossed is plastic. 4. The method described in item 3 of the patent # patent range, and the thickness of the valve in the towel is in the range of mm. Film. 0.025mm to 〇 · 2 order 5 · The method described in item # 1 of the application #patent, wherein the target to be embossed is a metal box. 6. The method according to claim w of the patent application scope, wherein the high-pressure gas system is selected from one of the group consisting of air, inert gas, nitrogen and their mixed gas. 7. · A method for moulding microstructure shouting micro-hot embossing. In a closed room, a sealing film, a mold set, and a mark to be imprinted are formed to be imprinted. When the mark to be imprinted is heated to soften the plastic shape L = directly from the combination to the to-be-embossed to transfer the microstructure on the set to the to-be-embossed ", characterized in that the sealing film separates the closed chamber into first and second spaces, The imprint configuration is located in the second space. The high-pressure gas is added in the first space. The high-pressure gas is 567133 and the scope of patent application is A8 B8 C8 D8. Amendment date: September 9, 91 10. The "embossing combination" does not apply pressure to the to-be-embossed combination by any pressure applying mechanism. 8. The method described in item 7 of the patent application, wherein the reliance group is composed of two subdivision upper and lower molds, The scale embossing mark is secretly arranged between the upper and lower molds, so that the upper and lower surfaces of the mark to be embossed are respectively provided with microstructured facing surfaces of the upper and lower molds. Any of the items—the method according to the item, wherein the surface pressure at the high pressure is 10 kgW to 2 At 00kg / cm2, perform hot embossing] to 30 minutes. Tr patented petals 8 tender, the emblem of Yang Yangna is plastic film. Please fill in this page for the note items above. Method, where the thickness of the plastic film is in the range of 0 milk 1. 0.2 to the tender plastic touches the imprint _ member law of the Intellectual Property Bureau of the Ministry of Economic Affairs, where the target to be imprinted is painted = please patent No. 7 and 8 The method described in any one of the items, wherein the target to be imprinted is gold 14. The two-molecule monomer layer cooperative which is applied to the substrate and cured as described in the application scope of items 7 and 8 + any_ item 15. The method as described in item 14 of the patent application, wherein the substrate is selected from the group consisting of silicon wafers, glass & Zhang scale_Zhongguanjiaxian (CNS) A4 specification 567133 A8 B8 C8 D8 Revision date: the year of the Republic of China September 9th, one of the groups consisting of plastic plates covered by the patent application 16. The method described in any one of items 7 and 8 of the patent application scope, wherein the sealing film is a plastic film < 17. The method according to any one of claims 7 and 8, wherein the sealing film Is a metal foil | 18. The method according to any one of items 7 and 8 of the scope of patent application, wherein the high-pressure gas is selected from one of the group consisting of air, inert gas, nitrogen, and a mixture thereof. Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 9- This paper size applies to China National Standard (CNS) A4 (210x297 mm)