TW564554B - Package for an optical chip in a metal cup plus a tilted reflection wall - Google Patents

Abstract

This invention discloses a metal sheet with metal cup to house at least one optical chip to elevate heat dissipation. Circuit board with through holes is overlaid to provide circuits for the chip(s), titled reflection wall made within the through holes aligned with the metal cup for reflection.

Description

564554

1 · Background illustration Figure 1 · Knowledge skills Figure 1 The applicant of the knowledge skills in the application of 2002 No. 09 1 1 No. 20673 was applied in 2002. Τ ", the technique of placing members on the substrate 1 7 through 1 as a concave cup 1 4 is not a skill. The mold (through the hole, the concave cup material is coated on the mold ㈣ / not shown) is placed on the perimeter, e, Yang, chess equipment, after molding, the mold and sweat 1 汗 first remove the mold and then harden Molding, making concave right, s 2 丨 by ',-the disadvantage of the technique is that the heat dissipation effect is not in this hole. This WL, Q, 1 ♦ In order to disperse this deficiency ", one by one comes out with metal The concave cup houses the wafer, and covers the circuit board base # to provide the required circuits: The reflective wall is made of the hole wall of the through hole of the material, and it is placed on the base to improve the heat dissipation effect of the product. The female can be placed on top of the metal concave cup. 2 · Summary of this technique One of the purposes of this technique is to design the heat-seal. The second purpose of this technique is to design the heat-seal package. An optical wafer with a metal concave cup An optical wafer with a reflective inclined wall Figure 2 · Display Package, package 4

Page 4 1Detailed description of this technique 564554

V. Description of the invention (2) Contains: (1) the substrate 17 is made into a through hole; (2) the first metal η is made, and the lower surface of the substrate is connected to form the first bottom surface extended metal 11 B; (3) the The metal material 12 is made on the hole wall, and passes through the upper and lower surfaces of the substrate to form a second bottom surface extension metal 12B. (4) A reflective inclined wall 21 is formed around the hole wall to form a through hole 141 with a reflective inclined wall. Figure 3. Step 2 of the first embodiment of the present technique—the placement of a metal recessed cup shows that a metal recessed cup 22C is made of sheet metal 22, and the metal recessed cup 22c is placed below a through hole 141 with a reflective inclined wall. In the metal concave cup 22C, the surface electrode of the wafer 10 is electrically coupled to the first metal 11 by a wire 18, and the bottom electrode of the wafer 10 is contact-coupled to electrically close the second metal 12; The 12 contacts are coupled to the sheet metal 22, and the metal concave cup of this technique has an optical chip heat dissipation package with a reflective inclined wall. The bottom surface of the sheet metal 22 and the bottom surface of the first extension metal 11B constitute two electrodes whose surfaces are adhered to the packaged product. Fig. 4 · Embodiment 2 of the present technology shows that the chip 10 can be a dual-surface electrode, and is electrically coupled to the first metal 11 and the second metal 12 with wires 1 8. 2 8 respectively. Figure 5 · Embodiment 3 of this technique

Page 5 564554 V. Description of the invention (3)-The through holes of the display substrate 17 may also be those without a metal material, and the example is applicable to the wafer i. The system has a surface electrode and a bottom: electricity: donor. The surface electrode is electrically coupled to the first metal n by a wire 18; the bottom electrode is electrically coupled to the metal concave cup 2 2c by a contact-and-combination type. Figure 6 · The fourth embodiment of the technology shows that when the wafer 20 has a double-surface electrode, the conductive material 122 can also be turned on the substrate 17 to the bottom of the substrate 17 to form a second extended metal, 122B: and the contact is coupled to the sheet Metal 22. The two electrodes of the wafer ⑼ are electrically coupled to the first metal n and the second metal 22, respectively. Figure 7 · The fifth embodiment of the present technology can be used to fix the light containing fluorescent materials or other pigments on the wafer 10, so as to change the terameter of the outgoing light and make it different. The original light emitted from the wafer 10. Figure 8 · Sixth embodiment of this technology = This = enables: Protective colloid 24, encapsulation and protection of 70 pieces of crystal wire 18 mentioned above 'to improve product reliability. Figure 9 · Seventh embodiment of this technology It is shown that this technique can increase the metal 22 to approach the first extension sound, material 25, and place it on the aforementioned thin sheet * and rhenium electrodes to avoid subsequent solder short circuits.

Page 6 564554

V. Description of the invention (4) Fig. 10 · Embodiment 8 of the present technology The reflective substrate 2 7 is directly made into a reflective inclined wall 32 to provide a reflective effect. Fig. 11 · Ninth embodiment of the present technology The outside of the reflective inclined wall 32 shown in Fig. 10 can be made of reflective metal 33 to improve the reflective effect. Fig. 12 · The tenth embodiment of the technique shows the design of Fig. 11. An insulating material 25 can be added and placed on the aforementioned cymbal metal 2 2 near the first extension electrode to avoid subsequent solder short-circuits. 0 Fig. 1 · Implementation of this technique Example 11 shows that the design of FIG. 11 'can increase the reflective inclined wall 3 丨 outside the substrate inclined wall 3 2' to change the reflection angle or the reflection effect. Fig. 14 · Embodiment 12 of the present technique shows that the device shown in Fig. 11 can add a reflective inclined wall to the outside of the reflective metal inclined wall to change the reflective angle or the reflective effect. Figure 15 · Thirteenth embodiment of this technique Shows the design of Figure 14. Insulation material 25 can be added and placed on the cymbal metal 2 2 near the first extension electrode to avoid subsequent solder shorts.

564554

2. Description of the invention (5) :: The description of the drag reveals the preferred embodiment of the technology. The preferred embodiment and the design drawings are just examples.%: 3: Schematic. However, the scope of the right of the technology is here. Anyone who implements this technique with the equal m 2 of restricting himself or with the following “Zone of the scope of patent application” shall not depart from the scope of the right of the spirit of this technique but the rights of the applicant. range.

Page 8 564554 Simple illustration of the diagram 4. Simple illustration of the diagram Figure 1. Know-how

Figure 2. Step 1 of the first embodiment of this technique _ making a reflective inclined wall Figure 3. Step 2 of the first embodiment of this technique _ placing a metal concave cup Figure 4. Embodiment 2 of the technique Figure 5 · Embodiment 3 of the technique Figure 6 The fourth embodiment of the technique Figure 7. The fifth embodiment of the technique Figure 8. The sixth embodiment of the technique Figure 9. The seventh embodiment of the technique Figure 10 0 The eight embodiment of the technique Figure 11. The ninth embodiment of the technique Figure 1 2 Figure 10 of the tenth embodiment of this technology Figure 13 of the eleventh embodiment of this technology Figure 4 of the twelfth embodiment of this technology Figure 1 of the twelfth embodiment of this technology

5. Component number table Optical wafer 1 0. Conductive material 11. 12. 11B. 12B. Substrate 17. Recessed cup 1 4.

Page 9 564554 Schematic illustration of reflective oblique wall through hole 1 41 wire 1 8. 282. reflective oblique wall 21. through hole 2 4 metal sheet 22. metal concave cup 2 2 C. modified colloid 23. protective colloid 24. insulation Material 2 5 Substrate 27. Reflective inclined wall 31. Substrate inclined wall 32. Metal material 33.

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Claims (1)

564554 1 · A type of metal containing: a chip package, including a light reflecting sloping wall above the concave cup, J1, and Θ (1) an optical chip with a first electrode and a second electrode (2), a thin sheet of metal with a metal recess The cup is provided with a front cymbal, which is electrically coupled to the aforementioned second electrode; the front, "a wafer is formed in the cup to form a second extension electrode; the base of the metal concave cup bottom (3) is made with a through hole," It has a first metal electrode, a surface, and is electrically coupled to the aforementioned first substrate of the wafer. The second substrate metal material is conducted under the substrate to form the first first extension electrode of the first extension antenna. And the second extension electrode ㉟ 2 丄 the two required electrodes mentioned above, and the surface 4 耆 package (4) reflective inclined wall 'made on the wall of the through hole mentioned above, above the concave cup' providing a reflective function ' Enhancing the effect of the outgoing light. The result of item 2 of the gold concave cup described in item 1 above is a reflective slant between the hole wall and the oblique wall of the substrate. / 4 3 · As stated in item 1 of the scope of patent application An optical chip package with a reflective inclined wall above the metal concave cup, The inclined wall mentioned herein refers to the substrate that is directly cut or drilled to form the inclined wall of the substrate. 4 · The reflective inclined surface above the metal concave cup as described in the third item of the patent application scope 564554 1) Prepare an optical wafer with a first electrode and a second electrode; prepare a sheet of metal with a metal concave cup to house the aforementioned optical wafer 乂, and be electrically coupled to the aforementioned second electrode; the aforementioned bottom constitutes the first Two extension electrodes; _ concave cup (^) to prepare the substrate, with through holes; the first electrode with the first metal material on the aforementioned material surface and electrically coupled to the aforementioned wafer; the aforementioned brother is a metal material And it is conducted to the bottom of the substrate to form a first extended electrode, a μ & ^ extended electrode, and a second extended electrode, forming two electrodes required for surface adhesion packaging; and (4) making a reflective oblique wall on The aforementioned through-hole hole wall is disposed above the aforementioned metal concave cup to provide a reflective function and enhance the effect of outgoing light. Page 13