TW558549B - A manufacturing method for chip-type microchannels - Google Patents

A manufacturing method for chip-type microchannels Download PDF

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TW558549B
TW558549B TW91134535A TW91134535A TW558549B TW 558549 B TW558549 B TW 558549B TW 91134535 A TW91134535 A TW 91134535A TW 91134535 A TW91134535 A TW 91134535A TW 558549 B TW558549 B TW 558549B
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TW91134535A
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TW200408607A (en
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Chih-Sheng Yu
Tsung-Hsun Yang
Yi-Chiuem Hu
Hsiao-Yu Chou
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Prec Instr Dev Ct Nat S
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Abstract

The chip with microchannels is used for testing a fluid sample, comprising a substrate having several channels as the reaction and testing zone in which the fluid sample is flowing; and a covering layer over the substrate having plural openings for sample injection and discharge to/from the channels. This invention uses a hot embossing and bonding process to produce a micro-fluidic glass chip with high resolution and high bio-compatibility, which can achieve mass-production, rapid manufacturing, cost-saving, and high-throughput parallel inspection for biomedical purposes.

Description

558549 五、發明說明(1) 發明領域: 本發明係關於一種晶片型微流道之製作方法,尤其關 於一種利用一熱壓成型技術(Hot embossing)及一密封接 合(bonding)製程產製之生物檢測晶片。 發明背景: 微機電製程技術擁有將傳統大型儀器微小化之特性, 而在生物分子檢測的領域中,檢測儀器之微小化是為一必 然之趨勢。從生物分子的取樣、傳輸、反應、分離及最後 的檢測,微機電製程之相關技術已被視為發展生物晶片的 重要技術’而另一方面,玻璃材料亦被視為產製高解析度 生物晶片之基本材料。 在習知微機電的領域中,體型微加工是一種經常被使 用到的製程’顧名思義,體型微加工是將矽晶圓或玻璃材 料^成一塊加工之母材,對其進行餘刻切削,而體型微加 工製程大部份是使用濕式蝕刻(Wet etch)或是乾式蝕刻 (Dry etch)的方式來進行,然而利用這些方式加工玻璃基 材,往往都無法得到滿意的加工成效。 土 在濕式姓刻(Wet etch)中,矽晶片或是玻璃上在旋佈 光阻後,經由光罩定義後且曝光顯影後,再以此光阻當罩 幕(Mask),此時要蝕刻的區域將會裸露出來,並放置於 K0H或HF的飯刻液中進行蝕刻,以得到所需的結構。其姓 刻過程是利用化學反應來進行蝕刻,因此玻璃材料之垂直 方向及水平方向將受到均等量的蝕刻,稱之為等向性558549 V. Description of the invention (1) Field of the invention: The present invention relates to a method for manufacturing a wafer-type microfluidic channel, and more particularly to a biological product produced by a hot embossing and a bonding process. Inspection wafer. BACKGROUND OF THE INVENTION: Micro-electro-mechanical process technology has the characteristics of miniaturizing traditional large-scale instruments. In the field of biomolecule detection, miniaturization of detection instruments is an inevitable trend. From the sampling, transmission, reaction, separation, and final detection of biomolecules, the related technologies of microelectromechanical processes have been regarded as important technologies for the development of biochips. On the other hand, glass materials are also regarded as the production of high-resolution organisms. The basic material of the wafer. In the field of conventional micro-electromechanical technology, body micro-machining is a process that is often used. As the name implies, body micro-machining is the process of cutting a silicon wafer or glass material into a parent material, and cutting it. The bulk micro-machining process is mostly performed by wet etch or dry etch. However, when these methods are used to process glass substrates, satisfactory processing results are often not obtained. In the wet name (Wet etch), a silicon wafer or glass is rotated by a photoresist, defined by a photomask, and exposed and developed, and then this photoresist is used as a mask. The etched area will be exposed and placed in a KHH or HF rice carving solution to be etched to obtain the desired structure. The engraving process uses chemical reactions to etch, so the vertical and horizontal directions of the glass material will be equally etched, which is called isotropic.

558549 五、發明說明(2) (Isotropic)韻刻,所以钱刻出來的輸廓(pr〇fi le)將會與 设4之結構有所差距。在濕式蝕刻中除了上述之間題外, 化學廢液之處理成了另一個嚴重問題。蝕刻液會隨著使用 次數增加而使效率隨之遞減,因此製程中將會有強酸、強 驗之廢液產生,p遺著環意識的升高,在製程中應盡量避免 強酸強鹼的化學廢液產生。 而在乾式蝕刻(Dry etch)中,進行乾式蝕刻之前,同 樣需經過光罩定義的製程,目的要將姓刻之區域定義出 來。由於此银刻方式是利用物理作用來進行敍刻,藉由電 漿(Plasma)產生粒子轟擊,因此可進行非等向性 (Anisotropic)蝕刻。雖然其方式可以製作出玻璃結構, 但是由於蝕刻的速度相當緩慢,並且蝕刻機台的成本相當 昂貴,在加上要維謾的機台費用更筆可觀的數目。 另在微機電之技術領域中,熱壓成型技術(H〇t emb〇ssing technique)係用以產生大量微結構。該製程方法,乃係利 用兩塊加熱之平板,將材料加熱玻璃轉換溫度點(G 1558549 V. Description of the invention (2) (Isotropic) rhyme, so the inscription (pr0fi le) carved by money will be a little different from the structure of set 4. In addition to the above problems in wet etching, the disposal of chemical waste liquid has become another serious problem. The etching solution will reduce its efficiency with the increase of the number of uses. Therefore, strong acid and strong waste liquid will be generated in the process, and the awareness of the legacy ring will increase. In the process, the chemistry of strong acid and alkali should be avoided as much as possible. Waste liquid is generated. In dry etch, before dry etching, the same process of mask definition is required to define the area where the last name is engraved. Because this silver engraving method uses physical action to perform engraving, particle bombardment is generated by plasma (Plasma), so anisotropic etching can be performed. Although a glass structure can be produced by this method, since the etching speed is relatively slow and the cost of the etching machine is quite expensive, the cost of the machine to be maintained is more considerable. In the field of micro-electromechanical technology, hot stamping technology is used to generate a large number of microstructures. This process method is to use two heated flat plates to heat the material to the glass and change the temperature point (G 1

Temperature ; Tg),使材料介於軟化而尚未融化的 狀悲時,並施加壓力於金屬模仁及欲成型的塑膠材料上, 成型所需之微結構。但是為了與生物分子相容,尚必 ,,材料上覆加一特殊的後續處理製程才可以提供生物 相谷之環境供給檢測。 綜合上述的結果,目前急需一種製程簡單、省成 ίΐ大量生產的製程’藉由此製程可以得到能夠快速平行 才双測、一致性高且可拋棄式的晶片基板。 仃 558549Temperature; Tg), when the material is in a soft but unmelted state, and pressure is applied to the metal mold core and the plastic material to be formed, the required microstructure is formed. However, in order to be compatible with biomolecules, it is still necessary to cover the material with a special post-processing process to provide the biophase valley environment supply test. Based on the above results, there is an urgent need for a manufacturing process that is simple and saves mass. Through this process, wafer substrates can be obtained that can be quickly parallel, double-tested, highly consistent, and disposable.仃 558549

職是之故,申請人鑑於習知技術之缺失,乃經悉心 驗與研究,並一本鍥而不捨之精神,終研發出本案:一ς 應用於檢測流體樣本之玻璃基材檢測晶片,並可以一 之製程方式產製。 1 發明說明: 本案之主要目的為提供一種以玻璃為基材之 流道製作方法,其係利用一熱壓成型技術(H〇t ^ embossing)及一密封接合(b〇nding)製程,來產製一種高 解析度及與生物分子相容性高的微流體檢測玻 以達到快速製造、大量生產、鲔念劣士 a ^ B曰 ^ 八里玍座 即名成本及生物醫學之高通 量平行檢測目的。 本案之玻璃基材晶片型微流道之製作方法,苴 熱壓成型程序係包含下列步驟: 〃 (a )提供一基板; (b)在該基板上形成複數個凹槽通道,此凹槽通道乃 是用以提供該流體流動、混合、反應、分離,及9檢測之區 域; 身(C)提供一透光板及一覆蓋層,透過該覆蓋層將該透 光板與該基板接合,俾使該複數個凹槽通道形成一密封性 區域, 及 (d)在該覆蓋層上定義出複數個注入口及流出口;以 (e )去除該透光板,以得到該檢測晶片。For this reason, the applicant has carefully studied and researched in view of the lack of know-how, and has developed a case of perseverance. This case is: a glass substrate detection wafer used to detect fluid samples, and Production process. 1 Description of the invention: The main purpose of this case is to provide a glass-based flow channel manufacturing method, which uses a hot press forming technology (Hot embossing) and a sealing bonding process to produce Production of a high-resolution microfluidic detection glass with high compatibility with biomolecules in order to achieve rapid manufacturing, mass production, and memory of the bad guys purpose. The manufacturing method of the glass substrate wafer-type micro-flow channel in this case, the hot pressing forming process includes the following steps: (a) providing a substrate; (b) forming a plurality of groove channels on the substrate, and the groove channels It is used to provide the area for fluid flow, mixing, reaction, separation, and detection; body (C) provides a light-transmitting plate and a cover layer, through which the light-transmitting plate is bonded to the substrate, 俾The plurality of groove channels are formed into a sealing area, and (d) a plurality of injection ports and outflow ports are defined on the cover layer; (e) the light transmitting plate is removed to obtain the detection wafer.

第7頁 558549 五、發明說明(4) 根據上述構想,其中該步驟(b)更包含下列步驟· (b 1 )提供一模具,用以套模於該基板上' (b2)加熱該基板至一反應溫 i ^ 板施壓;以及 又亚以忒杈具對該基 、(b3)將該基板降溫,以使該基板自該桓且由始私 並於該基板上形成該複數個凹槽通道。 、/、 , 度 根據上述構想,其中該反應溫度為該基板之轉換溫 根據上述構想 根據上述構想 根據上述構想 其中該基板為一玻璃基板。 其中該透光板為一透光玻螭。 其中該複數個注入口乃兮 係分別位於該複數個凹槽通道各 ^複數個流出 根據上述構想,其中該覆蓋 J據上述構想,其中該= 犧牲層。 0 3 結構層及一 根據上述構想,其中該結構層係且 性,即未經光昭射日卑合八 ’…、有一負光阻之特 4曰姑U ^〜射會分解,其中該結構声為一 Q TT η 根據上述構想,其中該犧牲層係且二; 8。 性,即經光照時會分解,其中該犧牲二冗一^阻之特 4620。 饿狂增為一ΑΖ 根,上述構想,其中該複數 由ϋ V層以曝光顯影定義。 入口及流出口,係經 本案之破螭基材晶片型微流道之 合(Bonding)係包含下列步驟··、乍方法,其密封接Page 7 558549 V. Description of the invention (4) According to the above idea, wherein step (b) further includes the following steps: (b 1) Provide a mold for nesting the mold on the substrate '(b2) Heat the substrate to A reaction temperature i ^ the plate is pressurized; and the substrate is cooled with a handle, (b3) the substrate is cooled, so that the substrate is formed from the substrate and the grooves are formed on the substrate aisle. According to the above concept, wherein the reaction temperature is the conversion temperature of the substrate, according to the above concept, according to the above concept, according to the above concept, wherein the substrate is a glass substrate. The transparent plate is a transparent glass bulb. Wherein the plurality of injection ports are respectively located in the plurality of groove channels and each of the plurality of outflows. According to the above-mentioned concept, wherein the covering J is according to the above-mentioned concept, wherein the = sacrificial layer. 0 3 structure layer and a concept according to the above, wherein the structure layer is coherent, that is, the light is not exposed to light, it has a negative photoresistance characteristic, and the structure will decompose. Is a Q TT η according to the above concept, wherein the sacrificial layer is two; 8. Sex, that is, it will decompose when exposed to light. Hunger increases to an AZ root, the above concept, where the complex number is defined by the ϋV layer by exposure development. The inlet and the outlet are the bonding of the wafer-type micro-flow channel (Bonding) of the broken substrate in this case. The method includes the following steps:

surface

第8頁 558549 五、發明說明(5) (a )提供一基板, (b )在該基板上形成複數個凹槽通道, (c)在該基板上覆蓋一覆蓋層;以及 (d )在遠覆蓋層上形成複數個注入口及複數個流出 口,以得到垓檢測晶片,俾使該複數個凹槽通道形成一密 封性區域。 根據上述構想,其中該複數個注入口及該複數個流出 口,係分別位於該複數個凹槽通道各末端之上。 根據上述構想,其中該覆蓋層係為一 ϋ V膠層。 ι ^據上述構想’其中該U V膠層更包含-結構層及-犧牲層。 根據上述構想,其中該結構層係具有一負光阻之特 性’即未經光照射時會分解,其中該結構層為一 $ ^ 8。 根據上述構想,#中該犧牲層係具有一正光阻之特 性,即經光照時會分解,其中該 4 6 2 0。 对& ί據上述構想,其中該複數個凹槽通道,係經由埶壓 模造成型。 … 乂艮據上述構想’其中該複數個注入口及流出口,係經 由U V層以曝光顯影定義。 2:上述構想’其中該基板為一玻璃基板。 之泣,二^另一主要目的為提供一種應用於流體樣本檢測 ^ ^ —二二晶片,該檢測晶片為一種高解析度及與生物分 子相谷性南的微流體檢測玻璃晶片,可大量生產、快速製Page 8 558549 V. Description of the invention (5) (a) providing a substrate, (b) forming a plurality of groove channels on the substrate, (c) covering a covering layer on the substrate; and (d) far away A plurality of injection ports and a plurality of outflow ports are formed on the cover layer to obtain a detection wafer, so that the plurality of groove channels form a tight area. According to the above concept, the plurality of injection ports and the plurality of outflow ports are respectively located above the respective ends of the plurality of groove channels. According to the above concept, the cover layer is a V glue layer. ι ^ According to the above concept, wherein the U V adhesive layer further includes a -structural layer and -a sacrificial layer. According to the above-mentioned concept, the structure layer has a negative photoresistance characteristic, that is, it will decompose without being irradiated with light, and the structure layer is a $ ^ 8. According to the above concept, the sacrificial layer in # has the characteristics of a positive photoresistance, that is, it will decompose when illuminated, where the 4 6 2 0. To & According to the above concept, wherein the plurality of groove channels are formed by press molding. … According to the above-mentioned concept ′, the plurality of injection ports and outflow ports are defined by exposure and development through the U V layer. 2: The above idea 'wherein the substrate is a glass substrate. Weep, two. Another main purpose is to provide a fluid sample detection method. Two-two wafer, which is a high-resolution microfluidic detection glass wafer with a high resolution and biomolecular phase, can be mass-produced and fast. system

第9頁 558549 五、 造,並可達 本案用 板,其係具 測之區域, 根據上 A * 口,以 通道。 根據上 口’係分別 根據上 根據上 根據上 模造成型。 根據上 由曝光顯影 根據上 到省成本及生物醫學之高通量平行檢測目的。 以檢測-流體樣本之檢測晶片,其係包含一基 有複數個凹槽通道,用以提供該流體流動與檢 以及-覆蓋層,其係覆蓋於該基板上。 述構想’其中該覆蓋層更具有複數個注入口及 分別使該流體樣本,注人及流出該複數個凹槽 述構想’其中該複數個注入口及該複數個流出 位於該複數個凹槽通道各末端之上。 述構想’其中該覆蓋層係為一 U V膠層。 述構想’其中膠層為一 SU8。 述構想,其中該複數個凹槽通道,係經由熱壓 係經 述構想’其中該複數個注入口及流出 定義而成。 述構想,其中該基板為一破螭基板。 實施例說明: 本發明之具體化詳細說明可由第一圖至第三圖所查 知。而發明係利用一熱壓成型法的製程技術,在玻璃基板 上成型出所需之微結構,用以製得本發明所述之生物醫學 用之檢測晶片。 第一圖係為本發明之流體檢測晶片之微流道示意圖。 其中第一圖(a)為本發明檢測晶片之立體圖。而第二圖(b)Page 9 558549 V. Manufacture and reach the board for this case, which is the area to be tested, according to the above A * port, to the channel. According to the upper mouth 'are respectively formed according to the upper according to the upper mold. According to the above development and development according to the top to save costs and biomedical high-throughput parallel detection purposes. A detection wafer for a detection-fluid sample includes a plurality of groove channels based on the fluid flow and detection and a cover layer, which covers the substrate. The concept "wherein the cover layer further has a plurality of injection ports and the fluid sample is injected into and out of the plurality of grooves" The concept "wherein the plurality of injection ports and the plurality of outflows are located in the plurality of groove channels Above each end. Said conception, wherein the cover layer is a U V glue layer. Said conception 'wherein the glue layer is a SU8. The concept, wherein the plurality of groove channels is defined by the hot pressing system through the concept, wherein the plurality of injection ports and outflows are defined. The concept is described, wherein the substrate is a broken substrate. Description of the embodiments: The detailed description of the embodiment of the present invention can be found in the first to third figures. The invention is a process technology using a hot press forming method to form a desired microstructure on a glass substrate to prepare a biomedical test wafer according to the present invention. The first figure is a schematic view of a microchannel of a fluid detection wafer of the present invention. The first figure (a) is a perspective view of a detection wafer of the present invention. And the second picture (b)

第10頁 558549 五、發明說明(7) 則第 …不圖(a)中A-A之剖面圖。如第一圖所示,本發明之檢 測晶片係為一玻璃晶片10,其係包含一玻璃基板12、UV膠 13及微流道14所構成,其中該玻璃基板12與該叭膠13係透 過忒玻璃基板12上之黏著面15而黏合;而該ϋν膠層13具 將微流道14密封之功能。本發明所述之熱壓製程 有塑膠材料及低溫玻填等,而本實施例僅就一 、 以說明。 π日日乃加 第一圖係為本發明中熱壓模造玻璃製程流程圖, :(:)』玄熱壓玻璃模造之前置作業;第二圖⑻為該埶壓; 处玻璃之過程;第二圖(C)為該熱壓模造玻璃之脫模' 程;而第二圖⑷則為該熱壓模造玻璃之結阁 所示,本發明所述之熱壓玻璃模造 第-圖 首先提供一破璃基板材料24,並將該二 24放置於一下模板22上, 材料 表面25以完成一預壓的動作,並開 料之 換溫度點,待溫度到達時,開始施加壓力轉 料24。當壓力到達所需的之設定時,寺二=材 即可進行脫模的動作。 于 &時間後, 而在進行脫模之前需先進行一分段降溫, 基板材料24之溫度降至其玻璃轉換溫度點:下以1吏;破璃 以開始將上模板21及下模板22分離。其 :^後才可 在避在冷卻的過程中產生4裂之象之。目的 第11頁 558549 五、發明說明(8) 圖(a)為本發明之玻璃基板之示意圖;第三圖(b)為本發明 之透光玻璃旋佈上兩層UV膠之示意圖;第三圖(c)為本發 明透光玻璃與玻璃基板結合後之示意圖;第三圖(d)為結 合後經由UV光曝光之示意圖;第三圖(e)則為本發明去除 到犧牲層後之示意圖;而第三圖(f )則為本發明在曝光顯影 後之結果。 第三圖明確地揭示本發明之檢測晶片製造流程中接合 流程’其中檢測晶片之結構包含一透光玻璃丨丨、玻璃基板 12、犧牲層UV膠131、結構層UV膠132、微流通道14及黏著 面15等。而其接合方式為將透光玻璃丨丨上旋佈上兩層uv 膠’犧牲層UV膠131及結構層UV膠132,並置於加熱板上加 熱’爾後在一降溫過程中將該玻璃基板12之黏著面15放上 透光玻璃11具UV膠的一面,一起冷卻,並將此元作放置於 一 UV光下進行曝光,則在經由光罩定義後,再經由一顯影 步驟’則生物樣本檢測晶片上之注入及流出口 2 6便因而生 成。 本發明之檢測晶片製造方法,最後還需要將透光玻璃 Π去除才可以得到本發明所述之最後之檢測晶片結構丨〇, 將照完UV光後之結構體放置於丙酮(Acetone)中,以把犧 牲層UV膠131去除,而透光玻璃11也隨之脫落,之後再將 UV膠1 3 2顯影,最後便可得到本發明之檢測生物分子之晶 片。 綜上所述,本案提供一種高解析度及與生物分子相容 性高的微流體檢測玻璃晶片,用以達到大量生產、快速製Page 10 558549 V. Description of the invention (7) Section… not shown in section (A) of A-A. As shown in the first figure, the detection wafer of the present invention is a glass wafer 10, which is composed of a glass substrate 12, a UV glue 13, and a microchannel 14, wherein the glass substrate 12 and the glue 13 are transparent. The adhesive surface 15 on the glass substrate 12 is adhered; and the adhesive layer 13 has a function of sealing the microchannel 14. The hot-pressing process described in the present invention includes plastic materials and low-temperature glass filling, etc., and this embodiment is only one example. The first picture of π-Day-Naga is the flow chart of the hot-pressed glass molding process in the present invention: (:) "Xuan hot-pressed glass molding before the operation; the second picture is the press; the process of processing glass; The second picture (C) is the demolding process of the hot-pressed glass; and the second picture (1) shows the structure of the hot-pressed glass. A glass substrate material 24 is broken, and the two 24 are placed on the lower template 22. The material surface 25 is used to complete a pre-pressing action, and the material is changed to a temperature point. When the temperature reaches, the pressure transfer material 24 is started. When the pressure reaches the required setting, the temple can be demoulded. After & time, and before the demoulding, a step cooling is required, and the temperature of the substrate material 24 drops to its glass transition temperature point: the bottom is 1; the glass is broken to start the upper template 21 and the lower template 22 Separation. Its: ^ can be avoided in the cooling process to produce a cracked image. Purpose Page 11 558549 V. Description of the invention (8) Figure (a) is a schematic diagram of the glass substrate of the present invention; third figure (b) is a schematic diagram of two layers of UV glue on the transparent glass spin cloth of the present invention; Figure (c) is a schematic view of the combination of the transparent glass and the glass substrate of the present invention; third figure (d) is a schematic view of exposure through UV light after the combination; and third figure (e) is a view of the invention after removing the sacrificial layer A schematic diagram; and the third diagram (f) is the result of the invention after exposure and development. The third figure clearly reveals the bonding process in the manufacturing process of the inspection wafer according to the present invention. The structure of the inspection wafer includes a transparent glass, a glass substrate, a sacrificial layer UV glue 131, a structural layer UV glue 132, and a microfluidic channel 14. And adhesive surface 15 and so on. The bonding method is to place two layers of UV glue 'sacrifice layer UV glue 131 and structural layer UV glue 132 on a light-transmitting glass, and place them on a heating plate to heat the glass substrate 12 in a cooling process. The adhesive surface 15 is placed on the side of the transparent glass 11 with UV glue, and cooled together, and the element is exposed to a UV light for exposure. After being defined by the photomask, it is further subjected to a development step. The injection and outflow ports 26 on the detection wafer are thus generated. In the manufacturing method of the detection wafer of the present invention, it is necessary to remove the transparent glass Π before the final detection wafer structure described in the present invention can be obtained. The structure after UV light is placed in acetone (Acetone), In order to remove the sacrificial layer UV glue 131, the transparent glass 11 also falls off, and then the UV glue 1 3 2 is developed, and finally the wafer for detecting biomolecules of the present invention can be obtained. In summary, this case provides a microfluidic detection glass wafer with high resolution and high compatibility with biomolecules to achieve mass production and rapid manufacturing.

第12頁 558549Page 12 558549

第13頁 558549 _式簡單說明 圖示簡單說明: $ —圖(a)為根 第一圖(b)為單 第一圖(c)為單 苐 第 第 第 第 第 第 .圖(a )為根 、圖(b )為根 -圖(c )為根 -圖(d )為根 .圖(a )為根 -圖(b)為透 、圖(c)為透 第三圖(d)為結 第三圖(e)為去 第三圖(f)為顯 據in一平行檢測晶片示意圖; 才双測7L件之示意圖; 一檢測元件A-A之剖面圖; 據本發明之一熱壓玻璃之前 據本發明之一埶壓 生 乍業, 據本發明之一熱壓模造坡璃枉, 據本發明之一熬壓模造坡璃之結:過程; 據本發明之玻璃基材示意圖;'、Q , 光玻璃旋佈上兩層UV膠示意圖· 光玻璃與基板結合後的結果示今。 合後經UV光曝光示意圖; ’、思、圖; 除到犧牲層之示意圖; 影後之結果示意圖。 及流出 符號說明: 1 0、101流體檢測晶片 12玻璃基本 1 32結構層υν膠 15 玻璃黏著面 2 2熱壓設備下模 2 4 玻璃材料 2 6生物樣本之注入 11 透光玻螭 1 3 1犧牲層U V膠 1 4微流通道 21熱壓設備上模 23金屬模仁 25破璃材料接觸面Page 13 558549 _ simple description of the diagram simple illustration: $ — Picture (a) is the root first picture (b) is the single first picture (c) is the single first and the first. The picture (a) is Root and graph (b) are root-graph (c) is root-graph (d) is root. Figure (a) is root-graph (b) is transparent and graph (c) is transparent. The third graph (d) is The third diagram (e) is the third diagram (f) is the schematic diagram of the parallel inspection wafer in which the data is shown; the schematic diagram of the double-measurement of 7L pieces; the cross-sectional view of a detection element AA; According to one aspect of the present invention, according to one aspect of the present invention, a hot-pressed mold is used to make sloped glass. According to one aspect of the present invention, a mold is used to make sloped glass: process; Schematic diagram of two layers of UV glue on a light glass spin cloth. The results after combining the light glass and the substrate are shown. Schematic diagram of UV exposure after combining; ′, thinking, and diagram; Schematic diagram of removing to the sacrificial layer; Schematic diagram of the result after shadowing. Explanation of the flow symbols: 1 0, 101 fluid detection wafer 12 glass basic 1 32 structural layer νν adhesive 15 glass adhesive surface 2 2 lower mold of hot pressing equipment 2 4 glass material 2 6 injection of biological samples 11 light transmission glass 1 3 1 Sacrificial layer UV glue 1 4 microfluidic channels 21 hot pressing equipment upper mold 23 metal mold core 25 broken glass material contact surface

Claims (1)

558549 六、申請專利範圍 端之上!複數個/;,L出口,係分別位於該複數個凹槽通道各末 7m:利範圍第1項之製造方法’其中該覆蓋層係為 8包===;項層之製造方法’其中…… 有- Ϊ : : I!::第8項之製造方法,其中該結構層係具 層為二s υ 8 :…即未經光照射時會分解,其中該結構 10·如申請專利範圍第8項之製造方法 有一正光阻之特性,即妳伞昭吐A \ Α 巩4尽你具 一 A Z 4 6 2 0 解,其中該犧牲層為 ^.如申請專利_7項之製造方法,其中 口及流出口,係經由U v層以曝光顯影定義。 /入 12. -種用以檢測一流體樣本之 法,其係包含下列步驟: 乃 灰化方 (a) 提供一基板, (b) 在該基板上形成複數個凹槽通道, (c) 在該基板上覆蓋一覆蓋層;以及 (d) 在該覆蓋層上形成複數個注入口及複數個流 以得到該檢測晶片。 ’ 13·如申請專利範圍第12項之製造方法,其中該複數 入口及該複數個流出口,係分別位於該複數個凹槽& 末端之上。 、道兩 第16頁 558549 六、申請專利範圍 1 4.如申請專利範圍第1 2項之製造方法,其中該覆蓋層係 為一 U V膠層。 1 5.如申請專利範圍第1 4項之製造方法,其中該U V膠層 更包含一結構層及一犧牲層。 1 6.如申請專利範圍第1 5項之製造方法,其中該結構層係 具有一負光阻之特性,即未經光照射時會分解,其中該結 構層為一 S U 8。 1 7.如申請專利範圍第1 5項之製造方法,其中該犧牲層係 具有一正光阻之特性,即經光照時會分解,其中該犧牲層 為一 AZ4620。 1 8.如申請專利範圍第1 2項之製造方法,其中該複數個凹 槽通道,係經由熱壓模造成型。 1 9 ·如申請專利範圍第1 4項之製造方法,其中該複數個注 入口及流出口 ,係經由U V層以曝光顯影定義。 2 0 ·如申請專利範圍第1 2項之製造方法,其中該基板為一 玻璃基板。 2 1. —種流體檢測晶片,用以檢測一流體樣本,其係包 含: 一基板,其係具有複數個凹槽通道,用以提供該流體流 動、檢測混合及分離之區域;以及 一覆蓋層,其係覆蓋於該基板上,俾使該複數個凹槽通 道形成一密封性區域。 2 2.如申請專利範圍第2 1項之流體檢測晶片,其中該覆蓋 層更具有複數個注入口及流出口,以分別使該流體樣本,558549 VI. Above the end of the scope of patent application! A plurality of / ;, L outlets are located at the end of each of the plurality of groove channels respectively 7m: the manufacturing method of the first item of the profit range 'where the cover layer is 8 packs == =; The manufacturing method of the item layer 'where ... there is-Ϊ:: I! :: The manufacturing method of item 8, wherein the structural layer is two layers s υ 8: ... that will decompose without light irradiation, Wherein the structure 10, such as the method of patent application No. 8 manufacturing method has the characteristics of positive photoresistance, that is, your umbrella Zhaotu A \ Α Gong 4 do you have an AZ 4 6 2 0 solution, where the sacrificial layer is ^. The manufacturing method of the 7th patent application, wherein the mouth and the outflow are defined by exposure and development through the Uv layer. / 入 12. A method for detecting a fluid sample, comprising the following steps: (1) providing a substrate, (b) forming a plurality of groove channels on the substrate, (c) in A cover layer is covered on the substrate; and (d) forming a plurality of injection ports and a plurality of flows on the cover layer to obtain the detection wafer. 13. The manufacturing method according to item 12 of the scope of patent application, wherein the plurality of inlets and the plurality of outlets are located above the ends of the plurality of grooves & respectively. Daoliang Page 16 558549 6. Scope of Patent Application 1 4. The manufacturing method according to item 12 of the scope of patent application, wherein the covering layer is a U V adhesive layer. 15. The manufacturing method according to item 14 of the scope of patent application, wherein the U V adhesive layer further includes a structural layer and a sacrificial layer. 16. The manufacturing method according to item 15 of the scope of patent application, wherein the structural layer has a negative photoresistance characteristic, that is, it will decompose without being irradiated with light, and the structural layer is a S U 8. 17. The manufacturing method according to item 15 of the scope of patent application, wherein the sacrificial layer has a characteristic of positive photoresistance, that is, it will decompose when illuminated, and the sacrificial layer is an AZ4620. 18. The manufacturing method according to item 12 of the scope of patent application, wherein the plurality of groove channels are formed by hot stamping. 19 · The manufacturing method according to item 14 of the scope of patent application, wherein the plurality of injection inlets and outlets are defined by exposure and development through the U V layer. 20 · The manufacturing method according to item 12 of the scope of patent application, wherein the substrate is a glass substrate. 2 1. A fluid detection wafer for detecting a fluid sample, comprising: a substrate having a plurality of groove channels for providing a region for the fluid to flow, detect mixing and separation; and a cover layer It is covered on the substrate, so that the plurality of groove channels form a sealing area. 2 2. The fluid detection wafer according to item 21 of the patent application scope, wherein the covering layer further has a plurality of injection ports and outflow ports, so that the fluid samples are respectively, 第17頁 558549 六、申請專利範圍 注入及流出該複數個凹槽通道。 2 3.如申請專利範圍第2 2項之流體檢測晶片,其中該複數 個注入口及該複數個流出口,係分別位於該複數個凹槽通 道各末端之上。 24.如申請專利範圍第22項之流體檢測晶片,其中該複數 個注入口及流出口,係經由曝光顯影定義而成。 2 5.如申請專利範圍第2 1項之流體檢測晶片,其中該覆蓋 層係為一 U V膠層。 2 6.如申請專利範圍第2 5項之流體檢測晶片,其中該U V 膠層為一 S U 8。 2 7.如申請專利範圍第2 1項之流體檢測晶片,其中該複數 個凹槽通道,係經由熱壓模造成型。 2 8.如申請專利範圍第2 1項之流體檢測晶片,其中該基板 為一玻璃基板。Page 17 558549 VI. Scope of patent application Fill and drain the groove channels. 2 3. The fluid detection wafer according to item 22 of the patent application scope, wherein the plurality of injection ports and the plurality of outflow ports are respectively located above the ends of the plurality of groove channels. 24. The fluid detection wafer according to item 22 of the application, wherein the plurality of injection ports and outflow ports are defined by exposure and development. 25. The fluid detection wafer according to item 21 of the patent application scope, wherein the covering layer is a U V adhesive layer. 2 6. The fluid detection wafer according to item 25 of the patent application scope, wherein the U V adhesive layer is a S U 8. 2 7. The fluid detection wafer according to item 21 of the patent application scope, wherein the plurality of groove channels are formed by hot stamping. 2 8. The fluid detection wafer according to item 21 of the application, wherein the substrate is a glass substrate. 第18頁Page 18
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