556460556460
一、【發明所屬之技術領域】 卷明為有關於一種積層型電子元件外端電極沾漿處理 ί、尤其係扣可多組排列一次壓印實施外端電極沾漿處理 之方法，進而能提升生產效率，降低製造成本者。 二、【先前技術】 •專荨電子元件辱了提升 來達成。又如第一圖所示 之外觀示意圖，其積層型 覆一層導電漿30，得以有 按，一般如排電容、排電感· · 工作特性皆採用積層線路製程方式 係為一積層型電子元件製出成型後 電子元件2 0之外端電極各侧外部披 利於上板銲接處理者。 上述 用網版印 之外端 刷槳層 每一積層型電子 電極披 處理達 元件之 由側®縱向披 一圖所示）， 處理時 刷漿層 組披覆面 翻 導電漿需 面（如第 施網版印 侧縱向多 刷上端面 面，如此 不僅因刷 故目前產 三、【發 本發 求，乃提 多組周緣披覆 每一積層型電 程多工 較少採 ] 於積層 出一種多組排 守电策之 ，以網版 極端在披 延伸至上 板鲜接作 多次印刷 左側縱向 面印刷下 需作四次 費時，較 方式。 漿層製 業上已 明内容 明者基 覆一層 成。然 外端電 覆面再 以利上 需分面 面印刷 面-> 翻 子元件 繁瑣且 用此種 處理製 印刷漿 覆導電 下兩端 業，因 處理， 多組披 端面多 網版印 不合乎 程，目 層處理 漿時， 面之周 此外端 亦即先 覆面-^ 組周緣 刷漿層 生產效 前可採 而言 該披覆 緣彼覆 電極實 印刷右 翻面印 彼覆 處理， 益性， 型電子元件之外端電極 列之積層電子元件外端 沾漿製程的需 電極沾漿處理I. [Technical Field to which the Invention belongs] The invention relates to a laminated type electronic component outer electrode dipping treatment, in particular, a buckle can be arranged in multiple groups to perform embossing treatment on the outer electrode. Production efficiency, reducing manufacturing costs. 2. [Previous Technology] • Special electronic components have been improved to achieve this. As shown in the first diagram, the laminated type is covered with a layer of conductive paste 30, which can be used. Generally, such as capacitors, inductors, etc. · The operating characteristics are produced by a laminated circuit process system for a laminated electronic component. After forming the electronic component 20, the outer electrodes on each side of the outer electrode are beneficial to the upper board soldering processor. For the above-mentioned screen printing, the outer end of the paddle layer is used to brush each laminated electronic electrode to reach the side of the element (as shown in the figure below). During the processing, the coating surface of the brush layer group is turned over to the conductive paste surface (such as the first application). The upper side of the screen printing side is often brushed on the upper end surface, so not only is the current production due to brushing. [Facilities are issued, but multiple sets of perimeters are covered with each layer type. Electricity is less multi-tasking.] The organization and defense of the electric strategy, the screen version of the extreme extension of the cover to the upper plate fresh for multiple printing on the left side of the longitudinal printing requires four time-consuming, relatively mode. 。 However, the outer end of the electrical coating to benefit the need to separate the surface of the printing surface- > The flip element is cumbersome and use this process to make printing paste covering the conductive lower ends of the industry, due to processing, multiple sets of end faces and multiple screen printing In accordance with the process, when the pulp is processed by the mesh layer, the outer end of the surface is covered first-^ Before the production of the brush layer of the peripheral edge can be applied, the cover edge can be covered with electrodes and printed on the right side. Other than electronic components Electrode paste for an end process of dip outer laminate electronic element electrode column as slurry dip process
911215.ptd 第5頁 556460 五、發明說明（2) 方法，並配合一創新之沾漿治具辅助實施，進而達 產效率，降低製造成本等效益，供以產業上利用。 斤 本發明所採用之技術手段，乃以一 層型電子元件之外端電極沾聚處理，其實施積 漿治具之沾座表面塗覆一層導電漿，再予以/ ^係以沾 刮漿處⑨，以#留預言免對應外端電極之 的面進行 ;實施·印沾漿處理，治具辅 j理，即能利用沾槳治具一次處理；m乾 電極沾漿處理。 積層電子疋件之外端 又’在外端電極沾漿處理時，能 電漿壓觸時所溢出導電漿之導入導槽作為導 元件兩相鄰之外端電極發生搭ς可：：積層型電子 之沾漿品質。 見象’以確保外端電極 件之ί:電沾聚治具—次可處理多組積層型… 干之外私电枝，占漿處理，不僅 玉电于π -種多組排列之積層型電 速，且提供 而能提升生產效率，達到降低】處理方法’造 研發之主要目的。 本荨效▲，此乃本發明 四、【實施方式】 端電:沾漿】::2=^:排;;;層型電子元件外 步驟（1)為沾浆治具塗衆處圖理二4驟：下說明·· 你奴供一以沾座1 〇及 I幽 第6頁 9ll2l5.ptd 556460 五、發明說明（3) 刮板11公母配合之沾漿治具（如第三圖所示），於沾座1 〇對 接表面披覆一層導電漿30，該導電漿30可為銀漿或其他導電 體，再以刮板11嵌置配合於沾座10對接面上進行刮漿位移 (=第四圖所示），使沾座10上只保留沾漿條101表面沾覆 一^導電漿3G (如第五圖所示），且沾座1G之沾聚條1〇1每 厂，印一次積層型電子元件2〇之外端電極21沾漿後，再重複 f ^ -人塗漿處理。其中該沾座丨〇係於對接面上凸立出複數 1 /、積層—型電子元件20之外端電極21同等距對應之沾漿條 4 且母一相鄰沾漿條1〇1間並區隔出一導槽102，而該刮 ^係與沾座1〇對接面上凸設有與導槽1〇2對應嵌置之凸板 ，且凸板條111之高度高於導槽102，使沾座10及刮板 嵌置時，該沾座1〇之沾漿條1〇1與刮板n對接面保持 雪」5 J #以保留沾漿條101所沾覆導電漿，以提供外端 電極2 1壓印沾聚處理。 步冑（2 )為一次側外端電極壓印沾浆處理，係以多組 β子/件20 一側外端電極21直接對應壓觸於沾座10之 '1 面上進行壓印沾覆一層導電漿30，使積層型電 :::2山0之侧面所有外端電極21可直接完成侧面縱向披覆面 iim緣披覆面之沾聚處理。且外端電極21壓印沾漿 二A连雷if利用# 一 4目鄰沾漿條101㈤所區隔出之導槽102 =導電激3。壓觸時所溢出導電浆3〇之導入容置槽（如第六 #觸^^ ΐ可防乾積層型電子元件20兩相鄰之外端電極21 成籍厗却雷:接紐路現象，以令一次壓印沾漿處理能同時完 、曰 兀件20所有同侧之外端電極21上坡覆一層導電911215.ptd Page 5 556460 V. Description of the invention (2) The method, combined with an innovative dipstick fixture, will help to achieve production efficiency, reduce manufacturing costs and other benefits for industrial use. The technical means used in the present invention is to apply a layer of conductive paste to the outer electrode of the one-layer electronic component, and apply a layer of conductive paste to the surface of the dip seat of the slurry fixture. , With # 留 预言 waived on the surface corresponding to the outer electrode; implementation of the printing and staining treatment, the jig is supplemented with j, that is, the paddle jig can be used for one treatment; m dry electrode staining treatment. When the outer end of the laminated electronic component is treated with a paste on the outer electrode, the introduction groove of the conductive paste that can overflow when the plasma is pressed can be used as a conductive element to overlap the two adjacent outer electrodes. The quality of dipping. See the 'to ensure the outer end of the electrode: 沾 polyelectrode fixture-can handle multiple sets of multi-layer type ... dry and private electric branches, accounting for pulp processing, not only Yudian in π-a multi-layered multi-layer type The speed of electricity and the provision of it can improve production efficiency and achieve a reduction of the main purpose of processing methods. This effect is ▲, this is the fourth aspect of the present invention. [Embodiment] Termination: Dipping paste :: 2 = ^: Row ;; Steps outside the layered electronic component (1) Applying the drawing to the dipping fixture Step 4: The following description: · Your slaves will stick to the seat 10 and I. Page 6 9ll2l5.ptd 556460 5. Description of the invention (3) Squeegee 11 with male and female squeegee (as shown in the third picture) (Shown), a layer of conductive paste 30 is coated on the butt surface of the dipstick 10, the conductive paste 30 may be silver paste or other conductive body, and then the scraper 11 is embedded and fitted on the butt surface of the dipstick 10 to perform scraping displacement. (= Shown in the fourth figure), so that only the surface of the sticking pad 101 on the sticking base 10 is covered with a ^ conductive paste 3G (as shown in the fifth figure), and the sticking stick 1G of the sticking stick 101 is manufactured per factory. After the outer electrode 21 of the multilayer electronic component 20 is printed with a paste, the f ^ -human paste process is repeated. Wherein, the dip seat 丨 0 is formed on the abutting surface with a plurality of bulges 1 /, the outer end electrode 21 of the multilayer-type electronic component 20 is equally spaced from the corresponding dip strip 4 and the mother-adjacent dip strip 10 is parallel. A guide groove 102 is separated, and the scraping plate is convexly provided with a convex plate corresponding to the guide groove 102 on the abutting surface with the dip seat 10, and the height of the convex strip 111 is higher than the guide groove 102. When the dipstick 10 and the scraper are embedded, the abutment surface of the dipstick 10 of the dipstick 10 and the scraper n keep snow "5 J # to keep the conductive paste covered by the dipstick 101 to provide external The terminal electrode 21 is embossed and polymerized. Step (2) is a primary side electrode imprinting and dipping process, which uses a plurality of sets of β sub / pieces 20 on one side and the outer electrode 21 directly presses the '1 side of the dipstick 10 for imprinting and dipping. A layer of conductive paste 30 makes all the outer electrodes 21 on the side of the laminated electric :: 2 mountain 0 directly complete the adhesion treatment on the side vertical coating surface iim edge coating surface. And the outer end electrode 21 is embossed with a paste, and the second A is connected with a lead if # 1 4 mesh adjacent to the paste with a guide groove 102 separated by a guide groove 102 = conductive excitation 3. The conductive paste 30 which overflowed during the pressure is introduced into the receiving groove (such as the sixth # contact ^^), which can prevent the two adjacent outer electrode 21 of the dry-laminated electronic component 20 from being registered. In order to make one embossing and dipping process at the same time, all the outer electrodes 21 on the same side of the element 20 are covered with a layer of conductivity
556460 五、發明說明（4) 漿30。 步驟（3 )為一次侧外端電極沾漿烘乾處理，係將積層 電子元件20所有完成一次侧沾漿處理之外端電極21進行烘乾 處理。 步驟（4 )為二次侧外端電極壓印沾漿處理，係以多組 積層型電子元件2 0另一側外端電極2 1直接對應壓觸於沾座j 〇 之沾漿條101表面上進行壓印沾覆一層導電漿3〇，即能完成 積層型電子元件20所有外端電極21沾覆一層導電漿3〇。 步驟（5 )為二次側外端電極沾漿烘乾處理，係將積層 電子元件20所有完成二次侧沾漿處理之外端電極21進行烘乾 處理，即順利完成積層電子元件20所有外端電極21之沾漿處 理，以利上板銲接作業者。 管浐ΐ 5實施步驟說明得知，本發明利用-沾漿治具輔助 =積”電子元件20之外端電極21沾漿處理，不僅一次即 積：型電子元件20 一次侧之外端電㈣沾聚處理 ΐ覆Ϊ二次側之外端電極21以沾浆治具辅助 處理，即能利=將L再實施二次侧沾漿之外端電極21烘乾 J用沾水>口具1 〇 —次處理多組声 且二第七圖所示），不僅沾漿製程簡單 漿處理方法，進而能層型電子元件外端電極沾 益；又，在外端電極21沾赞声^ ’達到降低製造成本之效 …作為導電聚30 -觸時所溢处夺，將，二沾座」〇之導槽 電子70件20兩相鄰之外端電極2!發生搭接短路現 第8頁 911215.ptd 556460 五、發明說明（5) 象，以確保外端電極21之沾漿品質， *綜上所述，本發明所提供多組排列^產業利用性。 舳電極沾漿處理方法，確實能達 之積層型電子7C件外 j供沾漿治具也為首創，實已充分符=實用功效’ f其所 件，故爰依法提出發明專利之申請。明專利所規疋之要 五、【圖式簡單說明】 明。 第一圖所示為積層型電子 ― ^二圖所示為本發明積層電子元件卜=圖。 流程示意圖。 電極沾漿處理方法之 Ϊ三圖所示為本發明沾漿治具之外觀示音圖 第四圖所示為本發明沾漿治具之沾座盥ς始二 示意圖。 一 I板進行刮漿處理之 第五圖所示為本發明沾漿治具之沾 示意圖。 進仃刮漿處理後之外觀 第六圖所示為本發明積層電 示意圖。 丁兀1干心電極壓印沾漿處理之 第七圖所示為本發明以沾漿治具可進行多組 之外端電極壓印沾漿處理示意圖。 、’曰電子元件 € 第9頁 911215.ptd 556460 圖式簡單說明 第一圖所示為積層型電子元件之外觀示意圖。 第二圖所示為本發明積層電子元件外端電極沾漿處理方法之 流程不意圖。 第三圖所示為本發明沾漿治具之外觀示意圖。 第四圖所示為本發明沾漿治具之沾座與刮板進行刮漿處理之 不意圖。 第五圖所示為本發明沾漿治具之沾座進行刮漿處理後之外觀 不意圖。 第六圖所示為本發明積層電子元件外端電極壓印沾漿處理之 示意圖。 第七圖所示為本發明以沾漿治具可進行多組積層型電子元件 之外端電極壓印沾漿處理示意圖。 符號說明： 沾座............10 沾漿條..........101 導槽............102 刮板............11 凸板條..........111 積層型電子元件..20 外端電極........21 導電漿..........30556460 V. Description of the invention (4) Pulp 30. Step (3) is a drying process of the primary-side outer electrode dipping and drying process, which is to dry all the outer electrode 21 of the laminated electronic component 20 after completing the primary-side dipping process. Step (4) is the secondary side outer electrode embossing and dipping process, which uses multiple sets of laminated electronic components 20 and the other side outer electrode 2 1 is directly pressed against the surface of the dip stick 101 of the dip pad j 0 Imprinting and coating with a layer of conductive paste 30 can complete the application of a layer of conductive paste 30 to all the outer electrode 21 of the laminated electronic component 20. Step (5) is a drying process for the secondary-side external electrode dipping and drying, which is to dry all the external electrodes 21 of the laminated electronic component 20 after completing the secondary-side dipping processing, that is, to successfully complete all the externals of the laminated electronic component 20. The terminal electrode 21 is treated with a paste to facilitate the welding of the upper plate. The description of the implementation steps of the tube 5 shows that the present invention utilizes the “dip sticking jig assist = product” to apply the paste to the outer electrode 21 of the electronic component 20. Dip polymerization treatment: cover the outer electrode 21 on the secondary side with the aid of a dip jig, that is to say, you can use L to dry the outer electrode 21 on the secondary side. 10-time processing of multiple sets of sounds (as shown in Figures 2 and 7), not only the simple slurry processing method of the dipping process, but also the external electrode of the layered electronic component can benefit; also, the external electrode 21 can be praised ^ 'reached The effect of reducing the manufacturing cost ... As a conductive poly 30-the overflow when touched, will be, two dipsticks "0 of the guide groove electronics 70 pieces 20 two adjacent outer end electrodes 2! Lapping short circuit occurs now page 8 911215 .ptd 556460 V. Description of the invention (5) In order to ensure the paste quality of the outer electrode 21, * In summary, the present invention provides multiple sets of arrangements ^ industrial applicability.舳 The electrode dipping treatment method is indeed able to reach outside the laminated electronic 7C parts. J The dipping jig is also the first, and it has already fully conformed to the practical effect ’f. Therefore, it has filed an application for an invention patent in accordance with the law. The key points of the patent regulations are as follows: 5. [Simplified description of drawings]. The first figure shows a multilayer electronic device. The second figure shows a multilayer electronic component of the present invention. Flow diagram. The third diagram of the electrode paste treatment method is shown in the third figure, which shows the external appearance of the paste fixture of the present invention. The fifth diagram of the scraping treatment of an I plate is a schematic diagram of the staining of the staining jig of the present invention. Appearance after squeegeeing treatment Figure 6 shows a schematic diagram of the laminated electric power of the present invention. The seventh figure of the Ding Wu 1 dry-core electrode embossing and dipping treatment is a schematic diagram showing that the present invention can perform a plurality of sets of outer-end electrode embossing and dipping treatment with a dipping jig. ”‘ Electronic components € Page 9 911215.ptd 556460 Brief description of the drawings The first figure shows the appearance of a laminated electronic component. The second figure shows the flow of the method for processing the paste on the outer end electrode of the laminated electronic component according to the present invention. The third figure shows a schematic diagram of the appearance of the dip jig. The fourth figure shows the intention of scraping treatment of the sticking seat and the scraper of the sticking jig of the present invention. The fifth figure shows the appearance of the squeegee seat of the squeegee of the present invention after the squeegeeing treatment is not intended. Fig. 6 is a schematic diagram showing the embossing and dipping treatment of the outer electrode of the laminated electronic component according to the present invention. The seventh figure shows a schematic diagram of the embossing and dipping treatment for the outer electrode of a multi-layer laminated electronic component with a dipping jig. Explanation of symbols: Dip seat ............ 10 Dip strip ......... 101 Guide slot ............ 102 Scraper. ........... 11 Convex strip ......... 111 Multi-layer electronic components ... 20 Outer electrode ... 21 Conductive paste ... ....... 30
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