TW551611U - Improved structure of photo sensor package - Google Patents
Improved structure of photo sensor packageInfo
- Publication number
- TW551611U TW551611U TW91220457U TW91220457U TW551611U TW 551611 U TW551611 U TW 551611U TW 91220457 U TW91220457 U TW 91220457U TW 91220457 U TW91220457 U TW 91220457U TW 551611 U TW551611 U TW 551611U
- Authority
- TW
- Taiwan
- Prior art keywords
- photo sensor
- improved structure
- sensor package
- package
- photo
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91220457U TW551611U (en) | 2002-12-13 | 2002-12-13 | Improved structure of photo sensor package |
JP2003027355A JP2004200631A (ja) | 2002-12-13 | 2003-02-04 | 光センサパッケージ構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91220457U TW551611U (en) | 2002-12-13 | 2002-12-13 | Improved structure of photo sensor package |
Publications (1)
Publication Number | Publication Date |
---|---|
TW551611U true TW551611U (en) | 2003-09-01 |
Family
ID=31493794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91220457U TW551611U (en) | 2002-12-13 | 2002-12-13 | Improved structure of photo sensor package |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2004200631A (zh) |
TW (1) | TW551611U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1513200A2 (en) * | 2003-09-03 | 2005-03-09 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for manufacturing the same |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006120862A1 (ja) | 2005-05-11 | 2006-11-16 | Murata Manufacturing Co., Ltd. | 赤外線センサおよびその製造方法 |
US20100013041A1 (en) * | 2008-07-15 | 2010-01-21 | Micron Technology, Inc. | Microelectronic imager packages with covers having non-planar surface features |
JP5052470B2 (ja) * | 2008-09-25 | 2012-10-17 | 京セラ株式会社 | 多数個取り配線基板および配線基板ならびに電子装置 |
JP5355246B2 (ja) | 2009-06-25 | 2013-11-27 | 京セラ株式会社 | 多数個取り配線基板および配線基板ならびに電子装置 |
JP5155352B2 (ja) * | 2010-03-25 | 2013-03-06 | 日本電波工業株式会社 | 圧電デバイス |
JP6303287B2 (ja) * | 2013-04-30 | 2018-04-04 | 株式会社ニコン | 撮像ユニットおよび撮像装置 |
US10704748B2 (en) * | 2017-05-17 | 2020-07-07 | Mitsubishi Electric Corporation | Light module and production method therefor |
JP6551489B2 (ja) * | 2017-10-25 | 2019-07-31 | 株式会社ニコン | 撮像ユニットおよび撮像装置 |
CN114512413B (zh) * | 2022-04-21 | 2022-07-12 | 威海三维曲板智能装备有限公司 | 一种结合紧密的管芯堆叠体及其制备方法 |
-
2002
- 2002-12-13 TW TW91220457U patent/TW551611U/zh not_active IP Right Cessation
-
2003
- 2003-02-04 JP JP2003027355A patent/JP2004200631A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1513200A2 (en) * | 2003-09-03 | 2005-03-09 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for manufacturing the same |
EP1513200A3 (en) * | 2003-09-03 | 2006-05-24 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for manufacturing the same |
US7378748B2 (en) | 2003-09-03 | 2008-05-27 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method for manufacturing the same |
US7691678B2 (en) | 2003-09-03 | 2010-04-06 | Panasonic Corporation | Solid-state imaging device and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2004200631A (ja) | 2004-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |