TW550118B - Coating apparatus and coating method - Google Patents
Coating apparatus and coating method Download PDFInfo
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- TW550118B TW550118B TW091113762A TW91113762A TW550118B TW 550118 B TW550118 B TW 550118B TW 091113762 A TW091113762 A TW 091113762A TW 91113762 A TW91113762 A TW 91113762A TW 550118 B TW550118 B TW 550118B
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- substrate
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- 238000000576 coating method Methods 0.000 title claims abstract description 189
- 239000011248 coating agent Substances 0.000 title claims abstract description 172
- 239000000758 substrate Substances 0.000 claims abstract description 153
- 230000000873 masking effect Effects 0.000 claims abstract description 73
- 230000002093 peripheral effect Effects 0.000 claims abstract description 36
- 239000007788 liquid Substances 0.000 claims description 36
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 95
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- 238000000034 method Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 241000402754 Erythranthe moschata Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- INTCGJHAECYOBW-APWZRJJASA-N (2s,3r)-4-(dimethylamino)-3-methyl-1,2-diphenylbutan-2-ol Chemical compound C([C@](O)([C@@H](CN(C)C)C)C=1C=CC=CC=1)C1=CC=CC=C1 INTCGJHAECYOBW-APWZRJJASA-N 0.000 description 1
- 240000004282 Grewia occidentalis Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 210000001217 buttock Anatomy 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 235000013351 cheese Nutrition 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/70—Containers, packaging elements or packages, specially adapted for particular articles or materials for materials not otherwise provided for
- B65D85/82—Containers, packaging elements or packages, specially adapted for particular articles or materials for materials not otherwise provided for for poisons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/20—External fittings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/20—External fittings
- B65D25/22—External fittings for facilitating lifting or suspending of containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/38—Devices for discharging contents
- B65D25/40—Nozzles or spouts
- B65D25/48—Separable nozzles or spouts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Coating Apparatus (AREA)
- Electroluminescent Light Sources (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Abstract
Description
550118550118
[發明之技術領域] 本發明係有關在半導基板、液晶顯示裝置用破璃芙 FPD(平板顯示器)用基板、光罩用破璃基板及光碟^板等 (以下 ' 簡單稱4「基板」)的上面為了塗布有機材料,所 使用足塗布裝置,尤其是有關改良由移動式之吐出式噴嘴 吐出塗布液後之散開方式塗布之塗布裝置。 [先前技術] 一向,做為微影蝕刻技術中不可欠缺之光阻材料,為了 塗布在基板(半導體晶片)上面的塗布裝置,為了有效利用 光阻材料,在基板上殘留光阻成分為9〇%以上,抑制光阻 材料<損失成分在1〇%以下之塗布方法,不旋轉基板下是 被認為是使用完全平板分散喷嘴之方式,圖7表示一向認定 之平板分散方式之塗布裝置重要構造概略圖。 即,面向在停止狀態基板W之上面,將噴嘴1〇〇一面向圖 π中箭頭方向A移動,一面自尖端部將光阻材料以噴霧狀 吐出塗布者,此時,藉由控制基板w之搬送速度與光阻材 料之吐出速度來控制在基板W上所形成之光阻膜膜厚。 然而實際之製程中,由圖7塗布裝置在基板貿上塗布光阻 膜時’在基板W周圍部分因為也會付著光阻膜之故,必要 在光阻膜塗布後除去基板W周圍部之不要光阻膜的步驟, 伴隨此步驟因會產生灰塵,是造成之後步驟(圖型蝕刻等) 之基板搬送時,產生粒子的原因而造成不適當之處。 在此,日本公開特許公報特開平6_224114公報中所提供 的是’針對在停止狀態之基板W周圍部由接觸,或是不接 -4 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)[Technical Field of the Invention] The present invention relates to a semiconductor substrate, a FPD (flat panel display) substrate for a liquid crystal display device, a glass substrate for a photomask, and an optical disc plate (hereinafter, simply referred to as "4 substrates" In order to apply organic materials to the above, a foot coating device is used, and in particular, a coating device for improving a spreading method after the coating liquid is discharged from a mobile discharge nozzle is improved. [Prior technology] As a photoresist material indispensable in lithographic etching technology, in order to coat the substrate (semiconductor wafer) with a coating device, in order to effectively use the photoresist material, the remaining photoresist component on the substrate is 9 °. % Or more, coating method for suppressing photoresist material < 10% or less loss component, without rotating the substrate is considered to be a method using a completely flat plate dispersion nozzle, FIG. 7 shows the important structure of a coating device that has been recognized as a plate dispersion method Sketch map. That is, facing the top of the substrate W in the stopped state, the nozzle 100 is moved toward the arrow direction A in FIG. Π, and the photoresist material is sprayed from the tip portion to the applicator. At this time, by controlling the substrate w The transfer speed and the discharge speed of the photoresist material control the thickness of the photoresist film formed on the substrate W. However, in the actual manufacturing process, when the photoresist film is coated on the substrate by the coating device of FIG. 7 'the photoresist film is also attached to the surrounding portion of the substrate W. Therefore, it is necessary to remove the photoresist film around the substrate W after the photoresist film is applied. The step of avoiding photoresist film is accompanied by this step, which may cause dust, which may cause particles to be generated when the substrate is transferred in the subsequent steps (pattern etching etc.). Here, what is provided in Japanese Patent Application Laid-Open Publication No. 6_224114 is' for contacting or not connecting around the substrate W in the stopped state -4-This paper size applies the Chinese National Standard (CNS) A4 specification (210X (297 mm)
裝 訂Binding
550118 A7550118 A7
觸’自由接近、離間之設計,㈣嘴⑽吐“Touch the design of ‘free approach and alienation’
板w之周圍部掩蔽之付加周圍部掩蔽裝置1〇1的塗布科裝將基 依此以往之技術的話,如圖8⑷〜⑷所示般,因有 掩敝裝置101之故,在基板…的周圍部们塗布光阻膜可: =止,又,在光阻塗布後為了除去周園部W1上不要之光 膜因不必要專用裝置’所以製程之生產量提高,再者,在 基板W的周圍部臀丨不用除去光阻膜之步驟,所以不奋 步驟產生灰塵。 H 另一方面,近年,將有機EL(電子發光)材料在基板上塗 布所足圖型形狀,於製造有機EL顯示裝置步驟中,也是使 用如上述之塗布裝置。一向之有機EL顯示裝置是如下面所 述般製造。首先在玻璃基板之表面上做成透明之Ιτ〇(錮錫 氧化物)膜,其次將在此玻璃基板上成膜之ΙΤ〇膜,使用光 微影蝕刻印刷技術,在多數本之條狀第丨電極中形成圖型。 此第1電極是相當於陽極者。其次如圍著條狀第丨電極般在 玻璃基板上突出電氣絕緣性之隔壁,使用光微影蝕刻印刷 技術形成。 因此,由塗布裝置之噴嘴將有機EL材料噴向隔壁内之條 狀第1電極’在隔壁内之條狀第1電極上塗布有機El材料, 具體的說,在某些隔壁内之條狀第1電極上由紅色有機EL 材料用噴嘴塗布紅色有機EL材料,由綠色有機EL材料用噴 嘴塗布綠色有機EL材料,青色有機EL材料用喷嘴塗布青色 有機EL材料,在青色有機EL材料塗布之第1電極所鄰接之 其次第1電極上,塗布紅色有機EL材料,如此,紅、綠、 -5 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 裝 訂The coating of the peripheral part of the plate w is added to the coating device of the peripheral part masking device 101. Based on this conventional technology, as shown in Figures 8⑷ to ⑷, there is a masking device 101 on the substrate ... Peripheral parts can be coated with photoresist film: = Only, after photoresist coating, in order to remove unnecessary light film on the peripheral part W1, special equipment is unnecessary because of this, so the production volume of the process is increased. Furthermore, around the substrate W, The buttocks do not need to remove the photoresist film, so they do not work hard to produce dust. H On the other hand, in recent years, organic EL (electronic light-emitting) materials have been coated on a substrate with a sufficient pattern shape. In the process of manufacturing an organic EL display device, a coating device as described above is also used. The conventional organic EL display device is manufactured as described below. Firstly, a transparent ITO (thin oxide) film is made on the surface of the glass substrate, and then the ITO film is formed on this glass substrate. Using photolithography etching printing technology,丨 A pattern is formed in the electrode. This first electrode is equivalent to an anode. Secondly, an electrically insulating partition wall is protruded on the glass substrate like a strip-shaped first electrode, and is formed using a photolithography etching printing technique. Therefore, the nozzle of the coating device sprays the organic EL material to the strip-shaped first electrode in the partition wall. The organic El material is coated on the strip-shaped first electrode in the partition wall. Specifically, the strip-shaped first electrode in the partition wall is coated with the organic EL material. 1 The electrode is coated with a red organic EL material with a red organic EL material nozzle, a green organic EL material with a nozzle coated green organic EL material, a cyan organic EL material with a nozzle coated cyan organic EL material, and the first coating on the cyan organic EL material The second electrode adjacent to the electrode is coated with red organic EL material, so red, green, -5-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) binding
550118550118
青色之有機EL材料依此順序個別塗布在第丨電極上。 其次,對向第丨電極直交般之條狀第2電極用真空蒸著法 在玻璃基板上形成並設之多數本,第丨電極與第2電極間挾 著有機EL材料,此第2電極因是相當於陰極者,如此,可 製造出,第1電極與第2電極為配列成單純之χγ矩型狀可以 顯示全彩之有機EL顯示裝置。 [發明所欲解決之課題] 然而,因應如有機EL材料塗布般之微細圖型形狀需要之 塗布材料者,被認定一向之平面分散方式塗布裝置是不適 用的’在此’很多是採用可以線狀吐出塗布液之1種微細孔 吐出喷嘴方式(以下稱為直線噴嘴)之塗布裝置。 如此,直線噴嘴在所期望範圍内有必要將塗布喷嘴沿著 圖型以直線移動進行塗布之過程,如此為了提高生產量, 此直線移動也需高速化,如一向技術般,用基板W之周圍 部掩蔽裝置將基板W周圍部W1掩蔽之情形,會產生如下面 般之問題。 如圖9所示般,直線喷嘴102向箭印方向Β以高速移動 時,在所噴射之塗布液L也沿著箭印方向Β進行慣性力運 動,此之結果,直線噴嘴102在移動開始側之塗布範圍W2 中,會產生塗布液L塗布不完全之區域W3,又,直線噴嘴 102在移動終了側,塗布液L在基板W之周圍部W1區域W4 會飛散。 在此,隨著直線喷嘴102之高速移動,塗布液L藉由慣性 力而發生向直線噴嘴102之移動方向流動而塗布之現象。 -6 -The cyan organic EL materials are individually coated on the first electrodes in this order. Secondly, a plurality of stripe-shaped second electrodes that are orthogonal to the first electrode are formed and arranged on a glass substrate by vacuum evaporation. An organic EL material is interposed between the second electrode and the second electrode. It is equivalent to a cathode. In this way, it is possible to manufacture an organic EL display device in which the first electrode and the second electrode are arranged in a simple χγ rectangular shape and can display full color. [Problems to be Solved by the Invention] However, those coating materials that are required to meet the fine pattern shapes such as organic EL material coating are considered to be inapplicable to the conventional flat dispersion coating device. 'Here', many of them are available. A coating device that discharges a coating liquid in a fine hole discharge nozzle method (hereinafter referred to as a linear nozzle). In this way, it is necessary for the linear nozzle to move the coating nozzle linearly along the pattern to perform coating in the desired range. In order to increase the production volume, this linear movement also needs to be speeded up. When the part masking device masks the part W1 around the substrate W, the following problems occur. As shown in FIG. 9, when the linear nozzle 102 moves at a high speed in the arrow mark direction B, the sprayed coating liquid L also performs inertial force movement in the arrow mark direction B. As a result, the linear nozzle 102 is on the movement start side. In the coating range W2, a region W3 in which the coating liquid L is not completely applied is generated. In addition, when the linear nozzle 102 is on the moving end side, the coating liquid L is scattered in a region W1 around the substrate W1. Here, as the linear nozzle 102 moves at a high speed, the coating liquid L flows in the direction of movement of the linear nozzle 102 and is applied by the inertial force. -6-
裝 訂Binding
本纸張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐) 550118 A7 B7 五、發明説明(4 ) 即,塗布液L通常向直線噴嘴1〇2之進行方向流入,本來不 能不塗布之塗布範圍W2就會形成不完全之塗布膜,塗布液 L在非塗布區之基板w周圍部貿丨會有塗布,塗布液[會有不 必要之消耗。 本發明之目的是為了解決上述問題點,提供可以期望減 少塗布液之使用量,減少損失分(處分量),對基板上之圖 型也可以形成均勻性優異之塗布膜的塗布裝置。 [課題之解決手段] 為了達成上述目的,本發明中將塗布液塗布在基板上之 塗布裝置其特彳政疋具備有,一面在停止狀態之基板上的 橫切方向吐出式噴嘴移動,一面在基板上面自吐出式噴嘴 吐出塗布液之塗布喷嘴手段,與針對上述基板之周圍部設 ”十’自上述喷嘴手段將所吐出之塗布液掩蔽在基板之周圍 部的掩蔽手段’與將上述掩蔽手段在上述喷嘴手段之移動 方向或在逆方向移動之移動之控制手段。 本發明之作用如下,在請求第1項有關發明之塗布裝置 中’藉由噴嘴手段塗布液之塗布範圍是由掩蔽手段來設 疋’此塗布時’掩蔽手段是在噴嘴手段之移動方向與逆方 向移動’其結果’隨著噴嘴手段之移動,塗布液由慣性力 向喷嘴手段之移動方向流動的情形,藉由掩蔽手段所掩蔽 頃域為對逆方向限制,塗布液流動所塗布的區域也受到限 制。即’掩蔽手段以移動確實限定塗布液之塗布範圍在所 期望之範圍。 清求第2項相關之發明是,在請求第1項所述之塗布裝置 國國豕標準(CNS) A4規格(210X297公釐) 550118 五、發明説明(5 ) 中,將上述喷嘴手段,由上述基板之一方周圍部放置之掩 蔽手段上面通過基板上面之塗布範圍後,到上述基板之另 一方向周圍部放置掩蔽手段上面為止當做是移動範圍。 在請求第2項相關發明之塗布裝置中,由掩蔽手段所掩 蔽之基板中,能確實達成塗布範圍内之塗布液塗布。 請求第3項相關之發明是,在請求第2項之所述塗布裝置 中將上述掩蔽手#又,針對上述基板之周圍部分配置成有 間隙,在上述移動控制手段中具有下述特徵,噴嘴手段之 移動方向將上流側之掩蔽手段向基板的周圍部上移動,同 時移動方向將下流側之掩蔽手段向基板的塗布範圍上移 動。 在請求第3項相關發明之塗布裝置中,噴嘴手段之移動 方向將上流側之掩蔽手段向基板的周圍部上移動者,可以 防止在塗布範圍中塗布膜之不均勾。另一方面,移動方向 將下流側之掩蔽手段向基板的塗布範圍上移動者,可以防 止塗布液對基板周圍部塗布。 請求第4項相關發明之特徵是,在請求第2或3項之所述 塗布裝置中,在上述噴嘴手段之上述移動範固末端由將移 動万向反轉反覆塗布不同之移動範圍,將上述噴嘴手段再 備有控制驅動之驅動控制手段,在上述移動控制手段=, 於喷嘴手段之反轉中連動來調整移動方向。 又 在請求第4項相關發明之塗布裝置中,噴嘴手段反轉之 重復塗布,可以廣範圍地塗布基板,此時,掩蔽手段為= 嘴手段之反轉中連動移動之故,對塗布範圍以外之不必要 550118 A7This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 550118 A7 B7 V. Description of the invention (4) That is, the coating liquid L usually flows in the direction of the linear nozzle 102. The coating coating range W2 will form an incomplete coating film, and the coating liquid L will be coated in the surrounding portion of the substrate w in the non-coating area, and the coating liquid [will have unnecessary consumption. An object of the present invention is to solve the above-mentioned problems, and provide a coating device that can reduce the amount of coating liquid used, reduce the loss component (disposal amount), and form a coating film with excellent uniformity on the pattern on the substrate. [Means for Solving the Problems] In order to achieve the above-mentioned object, the coating device for coating a coating liquid on a substrate in the present invention has a special feature that the ejection nozzle in the transverse direction on the substrate in a stopped state moves while the A coating nozzle means for discharging a coating liquid from a discharge nozzle on a substrate, and a "masking means for masking the discharged coating liquid on the periphery of the substrate" from the nozzle means for the peripheral portion of the substrate, and the masking means. In the moving direction of the nozzle means or the control means for moving in the reverse direction, the effect of the present invention is as follows. In the coating device requesting the first related invention, the application range of the coating liquid by the nozzle means is covered by the masking means. Suppose that the "masking method" is to move the nozzle means in the moving direction and the reverse direction. "Result" As the nozzle means moves, the coating liquid flows from the inertial force to the moving direction of the nozzle means. The masked area is restricted in the reverse direction, and the area covered by the flow of the coating liquid is also restricted. By means of movement, the application range of the coating liquid is surely limited to the desired range. The invention related to the second item is to request the national standard (CNS) A4 specification (210X297 mm) of the coating device described in the first item. 550118 5. In the description of the invention (5), the nozzle means is covered by the masking means placed on one side of the substrate above the coating range on the substrate, and then the masking means is placed on the surrounding part in the other direction of the substrate as the above. It is a range of movement. In the coating device requesting the second related invention, the coating of the coating liquid within the coating range can be surely achieved in the substrate masked by the masking means. When the third related invention is requested, the second item is requested. In the coating device, the above-mentioned masking hand is arranged with a gap for a peripheral portion of the substrate, and the movement control means has the following characteristics. The moving direction of the nozzle means moves the masking means on the upstream side to the periphery of the substrate. Moving at the same time, the moving direction moves the masking means on the downstream side toward the coating range of the substrate. The third related invention is requested. In the coating device, the moving direction of the nozzle means moves the masking means on the upstream side toward the peripheral portion of the substrate, which can prevent uneven coating film coating in the coating range. On the other hand, the moving direction shifts the masking means on the downstream side toward A person who moves on the substrate coating area can prevent the coating liquid from being applied to the periphery of the substrate. A feature of the fourth related invention is that, in the coating device according to the second or third aspect, the moving range of the nozzle means is the The fixed end is repeatedly coated with different moving ranges by reversing the moving gimbal, and the nozzle means is further provided with a driving control means for controlling driving. The movement control means =, in conjunction with the reversing of the nozzle means, adjusts the moving direction. In the coating device requesting the fourth related invention, the substrates can be coated in a wide range by repeating the coating with the nozzle means reversed. At this time, the masking means = the nozzle means are moved in conjunction with each other. Unnecessary 550 118 A7
塗布’或在塗布範圍中可以防止塗布膜之不均句。 、又,請求第5項相關發明是,將塗布液在基板上塗布之 塗布万法中具備有,在停止狀態之基板上以橫切方向吐出 式嘴=移動之嘴嘴移動步驟,與針對上述基板之周圍部設 置掩蔽,自上述吐出式喷嘴所吐出之塗布液掩蔽上述基2 周圍部之掩蔽步驟,與將上述掩蔽在上述吐出式噴嘴^動 方向與逆方向移動之移動步驟,以及自上述吐出式噴嘴在 上述基板之上面吐出塗布液後塗布之吐出步驟。 依請求第5項發明之相關塗布方法,與請求第丨項之發明 相同,藉由塗布液之塗布範圍可以確實限制在所期望之範 圍内。 又,請求第6項相關之發明是,在請求第5項發明中的塗 布方法中,於上述吐出式喷嘴中,在上述基板之一方向周 圍部放置之上述掩膜上面通過基板上面之塗布範園後,到 上述基板另一方向周圍部放置之上述掩膜上面為止做為移 動範圍來移動。 依請求第6項發明之相關塗布方法,與請求第2項之發明 相同,可以確實達成對塗布範圍之塗布液塗布。 又,請求第7項相關之發明是,在請求第6項發明中相關 之塗布方法中,將上述掩膜,針對上述基板之周圍部配置 成有間隙’在上述移動步驟中是含有,將上述吐出式噴嘴 移動方向將上流側之上述掩膜向基板的周圍部上移動之步 驟’與將上述吐出式噴嘴移動方向將下流側之上述掩膜向 基板的塗布範圍上移動之步驟。 -9 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 參 裝 訂Coating 'or in the coating range can prevent unevenness of the coating film. In addition, the fifth related invention is requested to include a coating method for applying a coating solution on a substrate, and a nozzle in a transverse direction on a substrate in a stopped state. A nozzle type = moving nozzle, and a step of moving the nozzle. A mask is provided around the substrate, a masking step for masking the peripheral part of the base 2 by the coating liquid discharged from the discharge nozzle, and a moving step for moving the mask in the movement direction and the reverse direction of the discharge nozzle, and from the above. A discharge-type nozzle is a discharge step of applying a coating liquid onto the upper surface of the substrate. The coating method according to the fifth invention is the same as the invention of the fifth invention, and the application range of the coating liquid can be surely limited to the desired range. In addition, the invention related to the sixth aspect of the present invention is the coating method of the fifth aspect of the present invention. In the above-mentioned ejection nozzle, the upper surface of the mask placed on the periphery of the substrate in one direction passes the coating method on the substrate. After the circle, it is moved as a moving range until the upper surface of the mask placed on the peripheral portion in the other direction of the substrate. According to the coating method related to the sixth invention, the same coating method as in the second invention can be reliably applied to the coating liquid in the coating range. In addition, the invention related to the seventh aspect of the invention is the method for applying the sixth aspect of the invention, wherein the mask is disposed with a gap to a peripheral portion of the substrate, and is included in the moving step. A step of moving the mask on the upstream side toward the peripheral portion of the substrate by the discharge nozzle moving direction and a step of moving the mask on the downstream side toward the coating range of the substrate by the discharge nozzle moving direction. -9-This paper size is applicable to China National Standard (CNS) A4 (210X 297mm)
550118 A7550118 A7
依請求第7項發明之相關塗布方法,斑 相同,塗布範園中可以防止塗布膜之不求第3項之發明 止塗布液對基板周圍部之塗布。 句句化,同時,防 又’請求第8項相關之發明是,在社 相關塗布方法中含有,在上述喷嘴:;=6或 嘴之上述移動範圍末端,反轉移動方:塗 動範圍重覆反復步驟,在上述移動步驟中,在上述吐= 喷嘴又反轉中連動後調整移動方向之步驟。 , 依請求第8項發明之相關塗布方法的話,與請求第*項之 發明相同’可以在基板廣範圍中塗布,同時在塗布範圍以 外之不必塗布,或在塗布範圍中可以防止塗布膜之不均勻。 [發明之實施形態] 以下以本發明之實施例形態,參照添付之圖面來詳細說 明。 本發明之實施例相關塗布裝置是,具體的說是將做為塗 布液之有機EL材料,塗布在矩形之玻璃基板(簡單稱為基 板S)上之所定圖型形狀中之製造有機el顯示裝置。圖1表 示在本發明實施例之相關有機EL顯示裝置之製造過程中 塗布裝置的重要部分概略構成圖。 此塗布裝置是藉由基板搬送裝置(圖中並未表示)對所搬 送的基板S上面,自吐出式喷嘴4a〜4c(直線喷嘴)之尖端部 將有機EL材料以直線棒狀吐出塗布者。 塗布裝置是如圖1所示般由,接受紅、綠、青色之有機 EL材料10a〜10c之塗布的基板S載置平台1、在此平台1所定 -10 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 550118According to the coating method related to the seventh invention, the spots are the same, and the coating film can prevent the coating film from being invented according to the third invention. The coating liquid is not applied to the periphery of the substrate. Sentence-by-sentence, meanwhile, anti-'request for the eighth related invention is to include in the company-related coating method, at the above nozzle:; = 6 or the end of the above-mentioned movement range of the nozzle, reverse the moving side: the coating movement range is heavy Repeat the steps. In the above-mentioned moving step, the step of adjusting the moving direction after interlocking in the above-mentioned ejection = nozzle reversal. According to the relevant coating method of the eighth invention, the same as the invention of the eighth * can be coated in a wide range of substrates, and it is not necessary to coat outside the coating range, or it can prevent the coating film from being affected in the coating range. Even. [Embodiment of the invention] The embodiment of the present invention will be described in detail below with reference to the drawings. The coating device related to the embodiment of the present invention is, specifically, an organic EL display device in which the organic EL material as a coating liquid is coated in a predetermined pattern shape on a rectangular glass substrate (simply referred to as a substrate S). . FIG. 1 is a schematic configuration diagram of an important part of a coating device in a manufacturing process of an organic EL display device according to an embodiment of the present invention. In this coating device, a substrate transfer device (not shown in the figure) ejects the organic EL material in a linear rod shape from the tip of the self-ejecting nozzles 4a to 4c (linear nozzles) on the substrate S to be transferred. The coating device is a substrate S mounting platform 1 that receives coating of red, green, and cyan organic EL materials 10a to 10c as shown in FIG. 1. The platform 1 is set to -10.-This paper size applies Chinese national standards ( CNS) A4 size (210X297 mm) 550118
五、發明說明(8 ) 2向移動之平台移動機構2、檢出在基板s所形成位置合成 標誌之位置的位置合成檢出部3、將紅色有機EL材料10a供 應到、,工色用噴嘴4a之第1供給部5、將綠色有機EL材料1〇b '、〜到、、彔色用噴嘴4b之第2供給部6、將青色有機EL材料 10c供應到綠色用噴嘴4c之第3供給部7、將各色之噴嘴 〜4 c在所定方向移動之噴嘴移動機構8、將基板$周圍部覆 蓋之周園部掩蔽裝置50、以及控制平台移動機構2與位置合 成標誌檢出部3及第i〜第3供應部5〜7與噴嘴移動機構8^ 周圍部掩蔽裝置50之控制部9所構成。 以下詳細說明各部之構造,同時,如圖2、圖3所示般, 在接受紅、綠、青之有機EL材料10a〜1〇c塗布之基板s表面 上’塗布各色之有機EL材料10a〜10c因應所定圖型形狀之 條狀溝11,是形成並設的多數本,圖2表示塗布有機el材 料因應完全所定圖型形狀之溝,為在表面上所形成之基板 S自上面看到狀態之概略平面圖。圖3是表示在圖2所示基 板S之一部分的剖面概略圖。 在此’有關接受各色有機EL材料l〇a〜l〇c塗布之基板8製 造步驟說明。首先,在平板狀之基板S表面上形成透明之 ιτο(錮鍚氧化物)膜,其次,在此基板s上將所成膜之IT〇 膜’使用光微影蝕刻印刷技術,在多數本之條狀第1電極j 2 上形成圖型,此第1電極12是相當於陽極者。 其次,將條狀第1電極12圍繞在基板S上突出之電氣絕緣 性隔壁13,使用光微影蝕刻印刷技術形成,此隔壁丨3是, 例如,以鎘(Cr)或以乾燥薄膜所形成,如此基板s之表面 550118 A7 B7 五、發明説明(9 ) 上,塗布各色有機EL材料10a〜1〇c之條狀糾是形成多數 本並設狀。 同時,在此溝Η内條狀第!電極12上是,將正孔積極的 在有機EL材料l〇a〜10c之—方形成輸送之正孔輸送層μ , 做為此正孔輸送層14者,例如是採用pEDT(聚乙埽二氧 吩)-PSS(聚苯乙烯硫磺酸),溝12之寬度為,例如是丨⑻ 程度,溝11之深度,例如是hiOpm程度,溝u與溝n之間 的距離,例如是10〜20 μηι程度。如此,製造出接受各色有 機EL材料l〇a〜i〇c塗布狀態之基板s。 回到圖1,第1供應部5是備有,例如是紅色有機材料 10a《供給源2〇a、為了自此供給源2〇a取出紅色有機队材 料之幫浦21、檢出紅色有機EL材料1〇a流量之流量計22、 及為了除去紅色有機EL材料l〇a中雜質的過濾器23。 第2供應部6是備有,例如是綠色有機EL材料1〇b之供給 源2〇b、為了自此供給源20b取出綠色有機EL材料之幫 21、檢出綠色有機El材料10b流量之流量計22、及為了 去綠色有機EL材料l〇b中雜質的過濾器23。 第3供應部7是備有’例如是青色有機EL材料1〇0之供 源20c、為了自此供給源20c取出青色有機El材料之幫 21、檢出青色有機EL材料l〇c流量之流量計22、及為了 去綠色有機EL材料l〇c中雜質的過濾器23。 如圖4所示般,喷嘴移動機構部8是備有,各色之噴嘴 4a〜4c、保持此等喷嘴4卜乜在並設狀態之保持部材3丄、 持此保持部材31在支持軸34周圍自由回轉之支持部材32 . 裝 浦 除 浦 除 支 訂 線. 12 - 本紙張尺度適用中㈣家料(CNS) A4規格(21GX297公爱) 550118 A7 --------—— —__B7 五、發明説明(一~' ---~ =為了 Λ著此支持部材32移動之引導部材”。圖4(4是噴 嘴移動機構部之概略斜視圖,圖4⑻是自喷嘴移動機構部 上面看到心概略平面圖,圖4(c)表示保持部材在支持部材 之支持軸周圍回轉狀態的概略平面圖。 、在支持部材32中,於保持部材31之喷嘴並設面垂直方向 汉1有支持轴34,在保持部材31,設計有為了與此支持軸 34嵌口之敗合孔35,在支持部材“之支持軸μ嵌合有保持 部材31<嵌合孔35,支持部材32是支持保持部材31在支持 軸34周圍自由回轉。 例如圖4(c)所示般,保持部材31在支持軸34周圍回轉, 在圖4(b)所示狀態中各色之塗布調子間隔p丨可以比塗布調 子間隔P2更狹’彳以碉整將各色之塗布調子間隔做成更 狹,同時,此等之噴嘴4a〜4c*為了輸出有機£乙材料之孔 徑,是比在基板s所形成之溝丨丨寬度更小,例如數十μιη程 度,在此為10〜70 μπι。 做為位置組合標誌檢出部3者,例如,採用CCD照相機, 位置組合標誌檢出部3,是自控制部9接受指示,在圖2所示 玻璃基板s之四角落,分別照射所形成位置組合標誌M,此 等照射位置標I志Μ之畫像資料由控制部9來輸出。 周圍部掩蔽裝置50是由,將停止狀態之基板8周圍部掩 蔽的一對長尺掩蔽板5 1、52,將此掩蔽板5 1、52分別獨立 後直線移動之圓筒等驅動手段53、54所構成,因此,周圍 部掩蔽裝置50是針對在停止狀態之基板s周圍部於可能之 不接觸近處,或離間,在圖示箭印的X方向,往復自由移 -13 - 本紙張尺度適用中國國家標準(CNS) Α4規格(21〇X 297公釐) 550118 五、發明説明(11 動所構成。與基板S表面之間隙是設定在05〜2mm,以 某程度上防止有機EL材料之迴入掩蔽板51、52之裏面 ^倘若沒有此間隙,則掩蔽板51、52裏面與基板s表面 曰擦拭因而產生垃圾,因而並不佳。 控制部9是在位置組合標誌檢出部3所照射之畫像資料 為基本檢出位置組合標誌M之位置。控制部7是使 CAD(電腦輔助設計)所設計之第!電極i2iui等之擺設資 料預先賦與者。控制部9是由位置组合標誌M之位置所算出 之結果、與預先賦與溝Η之擺設資料為基本’塗布之開始 點、即,算出基板S之溝116勺一方向末端侧開始之塗布開V. Description of the invention (8) 2 Directional moving platform movement mechanism 2, Position synthesis detection unit that detects the position of the position synthesis mark formed on the substrate s 3, Red organic EL material 10a is supplied to, and working color nozzles First supply part 5 of 4a, second supply part 6 for supplying green organic EL material 10b ', ~ to, black nozzle 4b, third supply of cyan organic EL material 10c for green nozzle 4c Section 7, Nozzle moving mechanism 8 that moves nozzles of various colors to 4c in a predetermined direction, Peripheral section masking device 50 covering the periphery of the substrate $, Control platform moving mechanism 2 and position synthesis mark detection section 3, and i The third supply unit 5 to 7 and the control unit 9 of the nozzle moving mechanism 8 and the peripheral portion masking device 50 are configured. Hereinafter, the structure of each part will be described in detail. At the same time, as shown in FIG. 2 and FIG. 3, the organic EL materials 10a ~ of various colors are coated on the surface of the substrate s which is coated with the organic EL materials 10a ~ 10c of red, green, and blue. 10c The stripe grooves 11 corresponding to the predetermined pattern shape are formed and arranged in parallel. FIG. 2 shows the grooves coated with organic el material in accordance with the completely patterned shape. The substrate S formed on the surface is seen from above. A rough plan view. Fig. 3 is a schematic cross-sectional view showing a part of the substrate S shown in Fig. 2. Here, a description is given of the manufacturing steps of the substrate 8 which is coated with the organic EL materials 10a to 10c of various colors. First, a transparent ITO film is formed on the surface of the flat substrate S. Secondly, the formed IT0 film is formed on the substrate S using photolithography etching printing technology. A pattern is formed on the strip-shaped first electrode j 2, and the first electrode 12 is equivalent to an anode. Next, the strip-shaped first electrode 12 is formed around the electrically insulating partition wall 13 protruding on the substrate S using a photolithography etching printing technique. The partition wall 3 is, for example, formed with cadmium (Cr) or a dry film. In this way, the surface of the substrate s 550118 A7 B7 V. In the description of the invention (9), the stripe coating of coating the organic EL materials 10a to 10c of each color is formed in a plurality of parallel shapes. At the same time, strips in this gully! On the electrode 12, a positive hole transport layer μ is formed by positive holes in the organic EL material 10a ~ 10c. As the positive hole transport layer 14, for example, pEDT (polyethylene terephthalate) is used. Oxyphene) -PSS (Polystyrene Sulfuric Acid), the width of groove 12 is, for example, the degree of ⑻, the depth of groove 11 is, for example, the degree of hiOpm, and the distance between groove u and groove n is, for example, 10 to 20 μηι degree. In this manner, the substrate s which receives the coated state of the organic EL materials 10a to 10c is manufactured. Returning to FIG. 1, the first supply unit 5 includes, for example, a red organic material 10a, a supply source 20a, a pump 21 for taking out a red organic team material from the supply source 20a, and a red organic EL is detected. A flow meter 22 for the flow of material 10a, and a filter 23 for removing impurities in the red organic EL material 10a. The second supply unit 6 is provided with, for example, a supply source 20b of the green organic EL material 10b, a gang 21 for taking out the green organic EL material from the supply source 20b, and a flow rate at which the green organic El material 10b is detected. A meter 22 and a filter 23 for removing impurities in the green organic EL material 10b. The third supply unit 7 is provided with a supply source 20c of, for example, a cyan organic EL material 100, a gang 21 for taking out the cyan organic EL material from the supply source 20c, and a flow rate at which the cyan organic EL material 10c is detected. A meter 22 and a filter 23 for removing impurities in the green organic EL material 10c. As shown in FIG. 4, the nozzle moving mechanism 8 is provided with nozzles 4 a to 4 c of various colors, holding members 3 that hold the nozzles 4 in a juxtaposed state, and holding the holding member 31 around the support shaft 34. Supporting materials for free rotation 32. Installation and removal of the thread removal line. 12-This paper size is suitable for CNS A4 specification (21GX297 public love) 550118 A7 ------------ —__ B7 V. Description of the invention (1 ~ '--- ~ = Guide member for moving the supporting member 32 in order to Λ ". Fig. 4 (4 is a schematic perspective view of the nozzle moving mechanism section, and Fig. 4 is a view from the nozzle moving mechanism section. Figure 4 (c) is a schematic plan view showing the state where the holding member rotates around the supporting shaft of the supporting member. In the supporting member 32, the nozzle of the holding member 31 is set in a vertical direction. A support shaft 34 is provided. In the holding member 31, a failure hole 35 is designed to be inserted into the support shaft 34. A holding member 31 is fitted into the supporting shaft μ of the supporting member < fitting hole 35, and the supporting member 32 is a support holding member 31. Freely rotate around the support shaft 34. For example, as shown in Fig. 4 (c), hold The member 31 rotates around the support shaft 34. In the state shown in FIG. 4 (b), the coating tone interval p 丨 of each color can be narrower than the coating tone interval P2. The coating tone interval of each color can be narrowed by trimming. At the same time, in order to output the pore diameter of the organic material B, these nozzles 4a to 4c * have a smaller width than the groove formed on the substrate s, for example, about tens of μm, and here 10 to 70 μm. The position combination mark detection unit 3, for example, uses a CCD camera. The position combination mark detection unit 3 receives instructions from the control unit 9 and irradiates the formed position combination marks at the four corners of the glass substrate s shown in FIG. 2 respectively. M, the image data of these irradiation position marks I and M are output by the control unit 9. The peripheral masking device 50 is a pair of long-length masking plates 5 1 and 52 that mask the peripheral portion of the substrate 8 in the stopped state. The masking plates 51 and 52 are independently constituted by driving means 53 and 54 such as a cylinder that moves linearly after being independent. Therefore, the peripheral masking device 50 is aimed at the vicinity of the substrate s in the stopped state so that it may not touch the vicinity, or Alienation, X in the arrow Free to move back and forth -13-This paper size applies Chinese National Standard (CNS) A4 specification (21〇X 297 mm) 550118 V. Description of the invention (consisting of 11 movements. The clearance from the surface of the substrate S is set to 05 ~ 2mm, to prevent the organic EL material from returning to the inside of the masking plates 51 and 52 to a certain extent ^ If there is no such gap, the inside of the masking plates 51 and 52 and the surface of the substrate s will be wiped, resulting in garbage, which is not good. 9 is the position where the image data irradiated by the position combination mark detection unit 3 is the position where the position combination mark M is basically detected. The control section 7 is the first one designed by CAD (Computer Aided Design)! The electrode i2iui is given in advance. The control unit 9 calculates the result from the position of the position combination mark M and the furnishing data provided in advance. The coating start point is calculated, that is, the coating opening from the end of the groove 116 of the substrate S in one direction is calculated.
始位置(相當於後述之塗布開始位置B1),同時在此,基板S 所形成位置组合標誌“雖做四點,但也可以例如做成2點 等,4點以上之點數。 ” 控制部9是如圖5般’將平台^定方向(y方向)以所定量 移動般,控制平台移動機構部2,噴嘴4a〜4c在所定方向& 万向)移動所定量般控制噴嘴移動機構部8,如圖丨所示般, 自第1〜第3供給部5〜7之各流量計22之因應檢出量&〜c,自 喷嘴4a〜4c流出所定流量之有機EL材料丨“〜i〇c般在第卜 第3供給部5〜7之各㈣21輸出指令d〜f。圖5是為了說明平 台與噴嘴之移動方向之概略側面圖。 控制部9是控制噴嘴移動機構部8,同時,控制驅動手段 53 '、54之驅動万向’依掩蔽板51、52來調整基板s之掩蔽 區域。 同時,上述之喷嘴移動機構部8與噴嘴4a~4c是相當於在 本發明中之喷嘴,上述之控制部9為被當作在本發明中之驅 -14 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公着) 550118 A7 一 - - —_B7 五、發明説明(12 ) 動控制手段機能。X,上述之掩蔽板51、52是相當於在本 發明中<掩蔽手段,驅動手段53、54與控制部9為當作在 發明中之控制手段機能。 其次如上述般由構成塗布裝置製造有 製造步驟,在以下說明。 衮置又 、如圖2、圖3所示般,係有關製造接受有機EL材料l〇a〜10c <塗布狀態<基板S,因如上述般,說明在平台丨上所載置 <基板s溝11,塗布有機£]^材料1〇a〜1〇c之步驟。 控制部9是賦與,將在平台丨上所載置之基板8四角位置 組合標誌Μ分別以照像般之位置組合標誌檢出部3指示。位 置組合標誌檢出部3是,將照像位置組合標誌Μ之畫像資料 自控制部9輸出。控制部9是,在位置組合標誌檢出部3以昭 像^得畫像資料為基準算出位置組合標諸Μ之位置。控制 部9疋,以位置組合標誌%之位置算出結果,與以預先賦與 溝擺設資料為基準,算出塗布之起點,即在基板§溝以 < 一方末端部側,算出開始塗布之塗布開始位置Β1。 k制部9疋,如圖5(a)、(b)所示般,預先移動周圍部掩 蔽裝置5〇,圖5(a)、(b)是,一面移動4a〜4c,一面在吐出有 機EL材料l〇a〜10c塗布時,周圍部掩蔽裝置5〇將基板s之周 圍部W1 ’ W1设定成掩蔽狀態之樣子的顯示側面圖,(a)是 嘴嘴4a〜4C向箭印B方向移動之情形,(b)是噴嘴4a〜4c向箭 印B方向及逆方向移動之情形。 首先,掩蔽板51、52是如圖5(a)所示般配置在圖中、左 側移動,即,噴嘴4a〜4c之移動開始位置側掩蔽板5 1是,從 上方看見可以面臨周圍部W1,噴嘴牦〜4(:之移動方向側之 -15 -Start position (equivalent to the coating start position B1 described later), and at this time, the position combination mark formed on the substrate S "is made of four points, but it can also be made, for example, at two points or more." Control section 9 is shown in FIG. 5, which controls the platform moving mechanism unit 2 by moving the platform in a predetermined direction (y direction) at a predetermined amount, and the nozzles 4a to 4c move the nozzle moving mechanism unit in a predetermined direction & universal direction). 8. As shown in FIG. 丨, according to the detected amount & ~ c of each flowmeter 22 from the first to third supply sections 5 to 7, the organic EL material with a predetermined flow rate flows from the nozzles 4a to 4c. Ioc generally outputs commands d to f at each of the ㈣21 of the third supply unit 5 to 7. Fig. 5 is a schematic side view for explaining the movement direction of the platform and the nozzle. The control unit 9 is a control unit 8 for controlling the nozzle movement, At the same time, the control of the driving universal of the driving means 53 ', 54 adjusts the masking area of the substrate s according to the masking plates 51, 52. At the same time, the nozzle moving mechanism 8 and the nozzles 4a to 4c described above are equivalent to those in the present invention. Nozzle, the above-mentioned control part 9 is regarded as the driving force in the present invention -14-Paper The standard is applicable to China National Standard (CNS) A4 specification (210X297) 550118 A7 One----B7 V. Description of the invention (12) Function of the dynamic control means. X, the above-mentioned masking plates 51 and 52 are equivalent in the present invention. < The masking means, the driving means 53, 54 and the control unit 9 function as control means in the invention. Next, the manufacturing steps are made from the constituent coating device as described above, and will be described below. As shown in FIG. 3, it is related to the manufacture and acceptance of organic EL materials 10a to 10c < coated state > substrate S. As described above, it is explained that the substrate s groove 11 is placed on the platform and coated with organic. ] ^ The steps of material 10a to 10c. The control unit 9 is assigned and instructs the four-corner position combination marks M of the substrate 8 placed on the platform to be indicated by the image-like position combination mark detection unit 3, respectively. The position combination mark detection unit 3 outputs the image data of the photographed position combination mark M from the control unit 9. The control unit 9 calculates the position based on the image data obtained by the position combination mark detection unit 3 based on the image data obtained from the image. The position of the combination mark M. The control section 9 The calculation result of the position of the combination mark% is calculated based on the pre-applied groove setting data, and the starting point of coating is calculated, that is, the coating starting position B1 at the end of the substrate § groove is calculated on the side of one end portion of the substrate. That is, as shown in FIGS. 5 (a) and 5 (b), the surrounding area masking device 50 is moved in advance. In FIGS. 5 (a) and 5 (b), while moving 4a to 4c, the organic EL material is being discharged. a ~ 10c When applying, the peripheral masking device 50 sets the peripheral portion W1 'W1 of the substrate s to a masked side view, and (a) is the case where the mouths 4a to 4C move in the direction of the arrow mark B. (B) is the case where the nozzles 4a to 4c move in the arrow mark B direction and the reverse direction. First, the masking plates 51 and 52 are arranged on the left side of the figure as shown in FIG. 5 (a), that is, the movement start position of the nozzles 4a to 4c. The side masking plate 51 is viewed from above and can face the surrounding portion W1. , Nozzle 牦 ~ 4 (:-15 of the moving direction side-
550118 A7550118 A7
掩敝板52是’向基板s之塗布範圍^之上方之掩蔽板以 到重覆位置之移動。換言之,配置成在噴嘴乜〜仏之移動方 向的B方向與逆方向移動,又,基板s之塗布開始位置⑴ 是設定在掩蔽板51之上方。 乙制祁9疋,如圖6所示般,在塗布開始位置B丨放置喷嘴 4a〜4c,控制平台移動機構部2與噴嘴移動機構部8。圖6是 為了說明貪鳴移動路徑之模式圖,同時,噴嘴移動機構部8 之支持部材32是,紅、綠、青色之各個噴嘴乜〜“在以溝n 之寬方向之中心附近,分別調整在良好位置上。又,噴嘴 4a〜4c與基板S上之溝11間之距離是設定在,預先算出有機 EL材料吐出後也維持直線棒狀之液柱距離。 其’入,如圖5及圖6所示般,在塗布開始位置B丨,噴嘴 4a〜4c放置時,控制部9是指示各幫浦21開始,自各噴嘴 4a〜4c向基板S上之溝11内流入有機EL材料1〇a〜1〇c,同 時,控制有機EL材料l〇a〜l〇c一面沿著基板s上之溝u,一 面流入此溝11内’將支持部材3 2沿著引導部材3 3移動,如 此’紅、綠、音色之有機EL材料l〇a〜^(^在同時流入個別 之溝11内。 此時,自噴嘴4a〜4c之塗布是自掩蔽板51之上面開始, 通過掩蔽板51後向基板S之上方移動,於是,在吐出之有 機EL材料10a〜10 c是對移動方向之b方向行慣性力作用,不 成為掩蔽板51之境界下,向基板S之周圍部wi之有機£乙材 料10a〜10c是用慣性力流動在塗布範圍W2中塗布,即,掩 蔽板51因在上方不存在’向基板S之周圍部wi之有機el材 -16 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 装 訂The masking plate 52 is a masking plate which is moved upward to the application range of the substrate s to the repeated position. In other words, it is arranged to move in the B direction and the reverse direction of the moving directions of the nozzles 乜 to 仏, and the coating start position 基板 of the substrate s is set above the masking plate 51. As shown in FIG. 6, the second part 9 is placed at the coating start position B 丨, and the nozzles 4a to 4c are placed to control the platform moving mechanism section 2 and the nozzle moving mechanism section 8. FIG. 6 is a schematic diagram for explaining the greed movement path. At the same time, the supporting members 32 of the nozzle moving mechanism section 8 are red, green, and cyan nozzles 乜 ~ "adjusted in the vicinity of the center in the width direction of the groove n. In a good position. The distance between the nozzles 4a to 4c and the groove 11 on the substrate S is set, and the liquid column distance that maintains a linear rod shape even after the organic EL material is ejected is calculated in advance. As shown in FIG. 6, when the nozzles 4a to 4c are placed at the coating start position B 丨, the control unit 9 instructs each of the pumps 21 to flow into the grooves 11 on the substrate S from the nozzles 4a to 4c into the organic EL material 1. a ~ 10c, at the same time, while controlling the organic EL material 10a ~ 10c along the groove u on the substrate s, it flows into this groove 11 while 'moving the support member 32 along the guide member 33, so 'Red, green, and tone organic EL materials 10a ~ ^ (^ flow into the individual grooves 11 at the same time. At this time, the coating from the nozzles 4a to 4c starts from the top of the masking plate 51 and passes through the masking plate 51. Moves above the substrate S, so that the organic EL material 10a ~ 10c that is ejected is moved toward In the direction of b, the inertial force acts and does not become the masking plate 51. The organic material 10a to 10c is applied to the surrounding area wi of the substrate S in the coating range W2 by inertial force flow, that is, the masking plate 51. Because there is no upper part of the organic el material to the surrounding part of the substrate S-16-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) binding
550118 A7 B7 五、發明説明(14 ) ^ 料10a〜10c變成以慣性力塗布在塗布範圍W2。 此結果如圖5(a)所示般,在塗布範圍W2之開始末端之塗 布膜可以防止變薄,此有機EL材料l〇a〜i〇c為以慣性力塗 布塗布範圍W2,設定掩蔽板51之移動量,預先以實驗求得 因噴嘴4a〜4c之移動速度、有機EL材料l〇a〜10c之吐出速 度、與自噴嘴4a〜4c到基板S為止之距離關係所求得之移動 範圍。如是,將此值記憶到控制部9中,只要控制驅動手段 53之移動量就可以了,同時,控制部9是,在條狀溝η之各 點變成均勻有機EL材料之塗布量,因應噴嘴4a〜4 c之移動 速度來控制此塗布量。 控制部9是,在基板S溝11之另一方之末端側,在停止之 塗布停止位置E上塗布,喷嘴4a〜4c放置時,指示各幫浦21 停止自各喷嘴4a〜4c流到基板S上溝11内之有機EL材料 10a〜10c ’同時,停止支持部材32沿著引導部材33之移動。 同時’在塗布停止位置E中,只要喷嘴4a〜4c之移動停止, 有機EL材料l〇a〜i〇c之吐出繼續也可以,因有,此掩蔽板52 之故’在基板S上有機EL材料l〇a〜10c可能不塗布,再者, 依此操作可以減低再吐出動作起動之必要負苛,因此之後 的塗布停止位置E也同樣良好。 此時,喷嘴4a〜4c的塗布停止位置E是設定在掩蔽板52之 上面’因此,在吐出之有機EL材料1〇a〜1〇c向移動方向B方 向是慣性力的作用,掩蔽板52所出現之境界向基板s之有 機EL材料i〇a〜10c為用慣性力流動,而塗布位在掩蔽板52 下面之塗布範圍貿2。本來,因有掩蔽板52,所以由上方, -17 - 本紙尺度中@ a家標準(CNS) A4規格(加X撕公爱) 裝 訂550118 A7 B7 V. Description of the invention (14) ^ The materials 10a to 10c become coated with inertial force in the coating range W2. This result is shown in FIG. 5 (a). The coating film at the beginning and end of the coating range W2 can be prevented from becoming thin. The organic EL material 10a to ioc is used to coat the coating range W2 by inertial force, and a masking plate is set. The moving amount of 51 is determined in advance by experiments based on the moving speed of the nozzles 4a to 4c, the discharge speed of the organic EL material 10a to 10c, and the distance relationship from the nozzles 4a to 4c to the substrate S. . If so, the value is memorized in the control unit 9 as long as the amount of movement of the driving means 53 is controlled. At the same time, the control unit 9 changes the coating amount of the organic EL material uniformly at each point of the stripe groove η according to the nozzle The moving speed of 4a ~ 4c is used to control the coating amount. The control unit 9 applies the coating to the stopped application stop position E on the other end side of the substrate S groove 11 and instructs the pumps 21 to stop flowing from the nozzles 4a to 4c to the groove on the substrate S when the nozzles 4a to 4c are placed. At the same time, the organic EL materials 10a to 10c in 11 are stopped from moving along the guide member 33 along the support member 32. At the same time, in the coating stop position E, as long as the movement of the nozzles 4a to 4c is stopped, the discharge of the organic EL material 10a to ioc can continue. For this reason, the masking plate 52 is organic EL on the substrate S. The materials 10a to 10c may not be coated, and furthermore, the operation can reduce the need to start the re-ejecting operation. Therefore, the subsequent coating stop position E is also good. At this time, the coating stop positions E of the nozzles 4a to 4c are set above the masking plate 52. Therefore, the inertia force acts on the discharged organic EL material 10a to 10c in the direction of the moving direction B, and the masking plate 52 The organic EL materials 10a to 10c appearing toward the substrate s flow with inertial force, and the coating area 2 is located below the masking plate 52. Originally, because there was a masking plate 52, it was bound from the top, -17-this paper standard @ a 家 标准 (CNS) A4 size (plus X tear public love) binding
k· 550118 A7 B7 五、發明説明(15 面臨基板S之塗布範圍W2之有機EL材料10a〜10c,為用慣 性力流動範圍當作塗布範圍W2般,控制掩蔽板52之移動, 而變成塗布塗布範圍W2。 此結果,如圖5(a)所示般,在塗布範圍W2之終了末端部 可以防止塗布膜塗布在周圍部W1,此有機EL材料10a〜l〇c 是用慣性力塗布掩蔽板52下側之塗布範圍W2所設定之掩 蔽板52移動量,是預先以實驗求得,由喷嘴4a〜4c之移動速 度、有機EL材料10 a〜10c之吐出速度、與自喷嘴4a〜4c到基 板S為止之距離關係所求得之移動範圍。如此,將此值記 憶到控制部9内,控制驅動手段54之移動量就可以。 如此做,完成塗布有機EL材料l〇a〜10c三列分之溝11, 在溝11内波入之有機EL材料1〇a〜1 0c厚度,雖可以利用有 機EL材料l〇a〜i〇c之流入量來調整,但在此有機EL材料 10a〜10c之厚度一般是形成(Μ μηι程度。 其次,如圖6所示般,將平台1在y向只有溝丨丨三列分分 批送出,向其次之三列分溝11進行有機EL材料10a〜10c之 塗布,上述之最初溝11三列分中,將溝丨丨之左末端側當作 塗布開始位置B 1,將溝11之右末端側當作停止塗布位置 E,將噴嘴4a〜4c沿著溝11自左向右移動,在分別之溝^内 流入有機EL材料10a〜10c,但在其次之溝11三列分中,將 溝11之右末端側當作塗布開始位置B 1,將溝11之左末端側 當作停止塗布位置E,將噴嘴4a〜4c沿著溝11自右向左移 動,在分別之溝11内流入有機EL材料l〇a〜i〇c。 同時,掩蔽板51、52也如圖5(b)所示般,圖中,在右移 -18- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) # 裝 訂k · 550118 A7 B7 V. Description of the invention (15 Organic EL materials 10a to 10c facing the coating range W2 of the substrate S, in order to use the inertial force flow range as the coating range W2, control the movement of the masking plate 52 to become coating coating Range W2. As a result, as shown in FIG. 5 (a), the end portion of the coating range W2 can prevent the coating film from being applied to the peripheral portion W1. The organic EL material 10a to 10c are coated with a mask by inertial force. The moving amount of the masking plate 52 set in the coating range W2 on the lower side of 52 is obtained experimentally in advance, from the moving speed of the nozzles 4a to 4c, the discharge speed of the organic EL material 10a to 10c, and from the nozzles 4a to 4c to The range of movement obtained from the distance relationship between the substrate S. In this way, this value is memorized in the control section 9 and the amount of movement of the driving means 54 can be controlled. In this way, the coating of the organic EL material 10a to 10c is completed in three rows The groove 11 is divided into the thickness of the organic EL material 10a to 10c that is waved in the groove 11. Although the inflow amount of the organic EL material 10a to 10c can be adjusted, the organic EL material 10a to 10c The thickness of 10c is generally formed to the extent of μm. Second, As shown in FIG. 6, the platform 1 is sent in batches in the y direction to only three rows, and the organic EL materials 10a to 10c are applied to the next three rows of the trenches 11. In the middle, the left end side of the groove 丨 丨 is regarded as the coating start position B 1, the right end side of the groove 11 is regarded as the coating stop position E, and the nozzles 4 a to 4 c are moved along the groove 11 from left to right, respectively. The organic EL material 10a to 10c flows into the groove ^, but in the next three rows of the groove 11, the right end side of the groove 11 is regarded as the coating start position B 1, and the left end side of the groove 11 is regarded as the coating stop position E. The nozzles 4a to 4c are moved from right to left along the groove 11, and the organic EL material 10a to ioc flows into the grooves 11. Meanwhile, the masking plates 51 and 52 are also shown in FIG. 5 (b). Generally, in the figure, shift to the right -18- This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) # Binding
春· 550118 A7Spring55055 A7
動,將停止塗布位置E當作塗布開始位置B1,塗布開始位 置B1設定為停止塗布位置E,針對塗布開始位置bi及停止 塗布位置E與喷嘴4a〜4c之配置關係是與上述之最初溝丨丨三 列刀相同之配置關係,同時,此時,噴嘴4a〜4c通常是位在 掩蔽板51、52之上面,設定掩蔽板51、52之大小及移動量。 因此,基板S上殘留之溝n ,以反覆進行上述動作,將 各色之有機EL材料l〇a〜l〇c流入各自之溝u中,如此紅、 綠、青色之有機EL材料l〇a〜10c依紅、綠、青色之順序配 列成條狀之各自溝11,也就是說形成條狀配列。 同時,在圖6所示半圓狀之虛線,是各個噴嘴4a〜4c在其 /人之二列分溝11移動所顯示者,各個噴嘴4a〜4c實際上並沒 有在此虛線所示半圓狀路徑移動,如上述般,將平台1在又 方向移動,使各個喷嘴4a〜4c在X方向移動,在溝η内能良 好地流入有機EL材料l〇a〜10c。 其次’向基板S上之全溝11内完成塗布有機el材料 10a〜10c時,將與第1電極12垂直之對向條狀第2電極,以真 芝蒸著法在基板S上形成多數本並設般,第1電極12與第2 電極間挾著有機EL材料l〇a〜10c,此第2電極是相當於陰極 者’如此第1電極12與第2電極單純地以XY矩形狀配列,而 製得可以全彩色顯示之有機EL顯示裝置。 如此,基板S是以周圍掩蔽裝置50來掩蔽,塗布完對應 所定之圖型形狀,移動噴嘴4a〜4c來塗布有機EL材料 10a〜10c。如是,將掩蔽板51、52在喷嘴4a〜4c之移動方向 及逆方向移動所定之量之故,可以確實在基板S塗布有機 -19- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 參 裝 訂The coating stop position E is regarded as the coating start position B1, and the coating start position B1 is set as the coating stop position E. The arrangement relationship between the coating start position bi and the coating stop position E and the nozzles 4a to 4c is the same as the initial groove described above.丨 Three rows of knives have the same arrangement relationship. At this time, the nozzles 4a to 4c are usually located above the masking plates 51 and 52, and the size and moving amount of the masking plates 51 and 52 are set. Therefore, the grooves n remaining on the substrate S are repeatedly performed as described above, and the organic EL materials 10a to 10c of each color are flowed into the respective grooves u, so that the red, green, and cyan organic EL materials 10a to 10a ~ 10c arranges the respective grooves 11 in a strip form in the order of red, green, and cyan, that is, forms a strip arrangement. At the same time, the semi-circular dashed line shown in FIG. 6 is shown by the movement of each nozzle 4a to 4c in its two-row groove 11, and each of the nozzles 4a to 4c does not actually have a semi-circular path shown in this dotted line. The movement, as described above, moves the platform 1 in the other direction, so that each of the nozzles 4a to 4c moves in the X direction, and the organic EL material 10a to 10c can flow well in the groove n. Secondly, when the organic el material 10a to 10c is applied to the entire groove 11 on the substrate S, the second stripe-shaped second electrode that is perpendicular to the first electrode 12 is formed on the substrate S by a method such as real cheese evaporation. In a parallel arrangement, the organic EL material 10a to 10c are interposed between the first electrode 12 and the second electrode. The second electrode is equivalent to the cathode. Thus, the first electrode 12 and the second electrode are simply arranged in an XY rectangular shape. , And an organic EL display device capable of full-color display is manufactured. In this way, the substrate S is masked by the surrounding masking device 50, and after coating, the organic EL materials 10a to 10c are moved by moving the nozzles 4a to 4c in accordance with the predetermined pattern shape. If so, the substrates S, 51 and 52 are moved by the predetermined amount in the moving direction of the nozzles 4a to 4c and the reverse direction, so that the substrate S can be coated with organic-19.- This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) Stapling
550118550118
EL材料l〇a〜10c在所期望塗布範圍上。 此、”α果,塗布後因不必要為了除去基板周圍部上不要之 塗布膜的專用裝置,所以製程之收率提高,可以大幅度降 低成本,又,在塗布後因不必要除去基板周圍部上不要之 塗布膜的步驟’隨著此步驟不會產生灰塵,在之後之步驟 (做成圖型、蝕刻等)能消除基板搬運時之粒子產生之原因。 同時,本發明是,不限定上述之實施例及變形例而已, 也可以進行如下般之其它形態。 (1) 在上述實施例中,如圖6所示般,將載置基板s之平 台1,在對此基板S上之溝11長方向(x方向)垂直的方向&方 向)分批送入,使喷嘴4a〜4c在溝11之長方向^方向)移動, 雖基板S之溝11内流入有機EL材料1〇a〜1〇c,但平台1固 定,使噴嘴4a〜4c在對此基板s上之溝U長方向垂直的方向 分批送入,使此噴嘴4a〜4c在此溝11之長方向移動,基板s 之溝11内也可以流入有機EL材料l〇a〜i〇c。 (2) 在上述實施例中,用紅、綠、青色3個1組之噴嘴4a〜4c 在基板S之溝11内雖流入有機EL材料i〇a〜10c,但將此3個i 組之噴嘴4a〜4c設計成多數組,基板S之各溝u内也可以流 入有機EL材料l〇a〜10c。如此,塗布處理所花之時間可以 縮短。 又,以4的倍數或分數來配置各喷嘴4a〜4c之間隔,相鄰 接之溝11的間隔(或自溝11寬中心到其鄰接之溝11寬中心 之間隔),在對溝11長方向垂直的方向,也可以以3的倍數 或分數間隔此等之噴嘴4a〜4c相鄰接溝11之距離並分批送 -20 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 550118 A7 B7 入,如此噴嘴間變寬可以容易維護。 (3)在上述實施例中,基板s雖是用玻璃基板做的,但玻 璃以外材料之基板,及.其形狀不限制是矩形,即使圓形也 可以將塗布範圍以掩蔽裝置加以限制之情形,在本發明中 也可以採用。 * (4)同時,上述各實施例,是顯示用有機材料(聚亞醯胺 等)塗布之情形,但以其它光阻材料塗布之情形也可以在本 發明中使用。 其它,在申請專利範圍内所述之技術事項範圍,可以進 行各種變更設計。 [發明之效果] 從以上(說明可知,依本發明的話,塗布液在基板上所 定之圖型形狀上可以塗布之裝置中,即使移動噴嘴供應塗 布液S塗布時’ &塗布液塗布區域可以確實限制,可以 防止對塗布區域以外之飛散,同時可以達到均勾之。 [圖式說明] 圖1表衫發明實施例中相關塗布裝置之重要部分 構成塊狀圖。 圖2表示將有機EL材料塗布在所定圖型形狀之對應溝表 面上’顯示自所形成之基板上面所看到之狀態概岭平面圖。 圖3表不圖2所示基板之一部分剖面概略剖面圖。 圖4⑷㈣本發明實施射之噴嘴移動機構部之概要斜 面(b)表示自喷嘴移動機構部上面所見之概略平面圖, ⑷表示支持部材圍繞支持部材之支持轴周圍轉動狀態之 -21 - 丨金桎箪mNS、A4規格(210X297公著) 550118The EL materials 10a to 10c are in a desired coating range. Therefore, since “α” is unnecessary after coating, a special device for removing unnecessary coating film on the periphery of the substrate is not necessary, so the yield of the process is improved, and the cost can be greatly reduced. Moreover, it is unnecessary to remove the periphery of the substrate after coating. Unnecessary step of coating the film 'With this step, no dust is generated, and the subsequent steps (patterning, etching, etc.) can eliminate the cause of particle generation during substrate transportation. Meanwhile, the present invention is not limited to the above Only the embodiment and the modification example may be performed in the following other forms. (1) In the above embodiment, as shown in FIG. 6, the platform 1 on which the substrate s is placed is grooved on the substrate S. 11 longitudinal direction (x direction) vertical direction & direction) are fed in batches, and the nozzles 4a to 4c are moved in the long direction of the groove 11 (direction ^), although the organic EL material 10a ~ flows into the groove 11 of the substrate S 10c, but the platform 1 is fixed, so that the nozzles 4a to 4c are fed in batches in a direction perpendicular to the long direction of the groove U on the substrate s, and the nozzles 4a to 4c are moved in the long direction of the groove 11 and the substrate s The organic EL material 10a ~ i〇c can also flow into the trench 11. (2) In the above embodiment, three sets of nozzles 4a to 4c of red, green, and cyan are used to flow the organic EL material i0a to 10c into the groove 11 of the substrate S, but these three groups of i The nozzles 4a to 4c are designed as multiple arrays, and the grooves u of the substrate S can also flow into the organic EL material 10a to 10c. In this way, the time taken for the coating process can be shortened. Furthermore, it is arranged in multiples or fractions of 4 The interval between the nozzles 4a to 4c and the interval between the adjacent grooves 11 (or the interval from the wide center of the groove 11 to the adjacent wide center of the groove 11) can be perpendicular to the longitudinal direction of the groove 11 by 3. These nozzles 4a ~ 4c are spaced by multiples or fractions adjacent to the groove 11 and sent in batches of -20-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 550118 A7 B7, so The widening between the nozzles can be easily maintained. (3) In the above embodiment, although the substrate s is made of a glass substrate, the substrate is made of a material other than glass, and its shape is not limited to a rectangular shape, and even a circular shape can be coated. A case where the range is limited by a masking device can also be adopted in the present invention. * (4) At the same time, Each of the embodiments described above shows the case of coating with an organic material (polyimide, etc.), but the case of coating with other photoresistive materials can also be used in the present invention. Other, technical matters described in the scope of the patent application The range can be designed in various ways. [Effects of the invention] From the above description, it can be seen that according to the present invention, the coating liquid can be applied on a substrate with a predetermined pattern shape, even when the coating liquid S is applied by moving the nozzle. '& The coating liquid coating area can be strictly restricted, which can prevent scattering outside the coating area and achieve uniformity at the same time. [Illustration of the drawing] Figure 1 The block diagram of the important part of the relevant coating device in the embodiment of the table shirt invention . Fig. 2 is a schematic plan view showing a state in which an organic EL material is coated on a corresponding groove surface of a predetermined pattern shape as viewed from above the formed substrate. FIG. 3 is a schematic cross-sectional view of a part of the substrate shown in FIG. 2. Fig. 4 斜 The outline of the nozzle moving mechanism part of the implementation of the present invention (b) is a schematic plan view seen from above the nozzle moving mechanism part, ⑷ shows the rotation state of the support member around the support axis of the support member -21-丨 Jin mNS, A4 specifications (210X297) 550118
概略平面圖。 圖5為了說明在本實施例中基板# 移動方向之概 略側面圖’⑷表示喷嘴向B方向移動之情形⑻表示喷嘴 向B方向及逆方向移動之情形。 圖6說明在本實施例中噴嘴移動路徑之模式圖。 圖7說明一向所認定之平板分喪+斗、 、 丁极刀政万式塗布裝置的重要部 分構造圖。 圖8表示-向裝置構造之基板周圍部掩蔽裝置例之顯示 概略構成的概略構造說明圖,(a)是平面圖、(b)是側面圖、 (C)是塗布處理後之基板說明平面圖。 圖9表示依以往之塗布裝置的塗布處理概略圖。 -22 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 550118 A7 B7 五、發明説明(2G ) 符號之說明 序號 元件符號 原文 中文 W、S 基板 基板 W1 周緣部 周圍部 W2 塗布範圍 塗布範圍 W3 塗布不充分領域 塗布不完全區域 W4 周緣部W1領域 周圍部W1之區域 L 塗布液 塗布液 1 Stage 平台 2 Stage移動機構部 平台移動機構部分 4a、4b、4c、100 Nozzle 喷嘴 8 Nozzle移動機構部 喷嘴移動機構部分 9 制御部 控制部 10a、10b、10c 有機EL材料 有機EL材料 50、101 周緣部musk 周圍部掩蔽裝置 5卜52 Musk 板 掩蔽板 53、54 驅動手段 驅動裝置 裝 訂Sketchy plan view. Fig. 5 is a schematic side view for explaining the movement direction of the substrate # in this embodiment; ⑷ shows the case where the nozzle moves in the B direction; ⑻ shows the case where the nozzle moves in the B direction and the reverse direction. FIG. 6 is a schematic diagram illustrating a nozzle moving path in this embodiment. Fig. 7 illustrates the structure of an important part of the conventional flat plate dividing + doubling, bucket, and Dingji knife-type coating device. Fig. 8 is a diagram showing an example of a masking device showing a schematic configuration of a substrate peripheral portion to a device structure. (A) is a plan view, (b) is a side view, and (C) is a plan view illustrating a substrate after coating. FIG. 9 is a schematic diagram of a coating process by a conventional coating apparatus. -22-This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 550118 A7 B7 V. Description of the invention (2G) Symbol No. Component Symbol Original Chinese W, S Substrate Substrate W1 Peripheral part W2 Coating range Coating range W3 Insufficient coating area Incomplete coating area W4 Peripheral portion W1 Area surrounding area W1 L Coating liquid coating liquid 1 Stage Platform 2 Stage moving mechanism portion Platform moving mechanism portion 4a, 4b, 4c, 100 Nozzle nozzle 8 Nozzle moving mechanism part Nozzle moving mechanism part 9 Control part control part 10a, 10b, 10c Organic EL material Organic EL material 50, 101 Peripheral part musk Peripheral part masking device 5 Bu 52 Musk board masking plate 53, 54 Driving means Drive device binding
-23 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)-23-This paper size applies to China National Standard (CNS) A4 (210X 297mm)
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI508785B (en) * | 2012-10-19 | 2015-11-21 | Asahi Kasei E Materials Corp | A coating head with a fixed device |
CN116321788A (en) * | 2021-10-13 | 2023-06-23 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
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CN100459060C (en) | 2003-02-05 | 2009-02-04 | 株式会社半导体能源研究所 | Manufacture method of display device |
JP4748990B2 (en) | 2003-02-06 | 2011-08-17 | 株式会社半導体エネルギー研究所 | Manufacturing method of semiconductor device |
WO2004070821A1 (en) | 2003-02-06 | 2004-08-19 | Semiconductor Energy Laboratory Co., Ltd. | Display manufacturing method |
JP4422667B2 (en) | 2005-10-18 | 2010-02-24 | 富士フイルム株式会社 | Imaging apparatus and imaging method |
JP6232239B2 (en) | 2013-09-30 | 2017-11-15 | 株式会社Screenホールディングス | Coating device |
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KR940015615A (en) * | 1992-12-30 | 1994-07-21 | 이헌조 | Sealant printing device for liquid crystal display device |
JP3183980B2 (en) * | 1993-01-28 | 2001-07-09 | 株式会社東芝 | Organic material coating equipment |
KR100226165B1 (en) * | 1995-11-30 | 1999-10-15 | 김영남 | Coating method of phosphor of plasma display panel |
KR970076079A (en) * | 1996-05-30 | 1997-12-10 | 곽정소 | Fine pattern formation method |
JP2001232251A (en) * | 2000-02-21 | 2001-08-28 | Casio Comput Co Ltd | Screen mask and method for forming thin film |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI508785B (en) * | 2012-10-19 | 2015-11-21 | Asahi Kasei E Materials Corp | A coating head with a fixed device |
CN116321788A (en) * | 2021-10-13 | 2023-06-23 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
CN116321788B (en) * | 2021-10-13 | 2024-02-06 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
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