TW546185B - Polishing apparatus and polishing method - Google Patents

Abstract

A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface.

Description

546185 V. Description of the Invention (1) [Field of the Invention] The present invention relates to a device for performing planarization and polishing of a substrate, and more particularly to a chemical mechanical polishing for performing a substrate (such as a semiconductor wafer). Device to smooth the substrate. [Background of the Invention] In the early polishing apparatus, a polished substrate was placed on the lower surface of a substrate carrier. In order to polish the substrate, when a polishing abrasive is supplied to the polishing pad surface of a polishing pad, the substrate is pressed to the light-removing pad to generate a relative movement between the substrate and the polishing pad. The substrate carrier also provides a positioning ring to prevent the substrate from moving from the lower surface of the substrate carrier during polishing. The substrate is kept positioned on the carrier J10 by a positioning ring that surrounds the periphery. However, during the polishing of the elastic polishing pad, excessive polishing that occurs on the periphery of the workpiece will cause an effect called 'edge rounding'. . In order to suppress this edge rounding effect, the positioning ring system is pressed to the polishing pad to shrink slightly downwards at its periphery. In the conventional polishing device as described above, although pressing the positioning ring to the polishing pad can solve the problem of edge rounding and thus improve the surface polishing accuracy of the workpiece to be polished, it also causes the abrasive on the surface of the workpiece to be polished. Uneven distribution results in slower polishing and lower productivity. This phenomenon is more pronounced when the polished surface is a metal film. Therefore, this conventional light-removing device is very unsuitable for south-speed polishing, because high-speed polishing requires a large amount of abrasive to be supplied to the polishing surface. In recent years, polishing using a fixed abrasive member instead of a polishing pad has been developed.

313737.ptd Page 5 546185 Today 5. Description of Invention (2). Because when a workpiece is pressed to a polishing device using a fixed abrasive member, there is almost no shape deformation, and only a small amount of edge rounding is generated, even without the downward pressure exerted by the positioning ring. However, if this solid abrasive is applied to a conventional polishing device and used for polishing, since Dingxiang is being pressed on a fixed abrasive, the positioning ring will be worn and has a short speed. Service life, which in turn causes a relative increase in cost. [Summary of the Invention] Therefore, an object of the present invention is to provide a polishing device and method capable of performing polishing and reducing edge rounding effects, thereby improving the polishing accuracy of a polished workpiece and supplying a large amount of polishing solution to a polishing surface to increase the polishing speed. And improve production capacity. In order to achieve the above object, according to a first aspect of the present invention, a polishing device 1, as shown in the examples of FIGS. 1 and 2, includes a substrate carrier having a positioning ring 3 surrounding the substrate S to Positioning the substrate s;-a polishing tool i5 for polishing the substrate S;-a substrate pressure mechanism π for guiding the substrate S to contact the polishing surface 17 of the polishing tool 15; a positioning A ring pressing mechanism 16 is used to bring the positioning ring 3 into contact with the polishing surface 17; and a positioning ring-positioning adjustment mechanism 4 is used to adjust the positional relationship between the positioning ring 3 and the polishing surface 17 so that The material S is in contact with the polishing surface 17 and a gap is formed therebetween. This configuration has a positioning ring pressing mechanism 16 to press the positioning ring 3 to the polishing surface 17. Therefore, when the substrate surface S A is polished by the polishing surface 17, it can prevent the formation of edge rounding, thereby improving the surface polishing of the polished substrate S.

313737.ptd Page 6 546185 V. Description of the invention (3) Light accuracy. This configuration also includes a positioning ring positioning adjustment mechanism 4. When necessary, the positioning ring positioning adjustment mechanism 4 can be used to adjust the positional relationship between the positioning ring 3 and the polishing surface 17 so that when the substrate s is pressed to the polishing surface 17, the positioning ring 3 and the polishing surface are adjusted. A gap is formed between 丨 7. When performed as described above, there will be no physical contact between the locating ring 3 and the polishing surface, and the polishing speed (polishing rate) can be increased, thereby improving polishing productivity. In addition, according to the second aspect of the present invention, the polishing device 1 of the first aspect will add two sensors (8 and 19) to sense the polishing of the substrate S polished by the polishing tool 5 the amount. This method will enable the device to be converted between the two plates over and over again. 'Positioning ring 3 is a polishing mode where the positioning ring pressing mechanism 6 is pressed to the polishing surface 17 and the positioning ring 3 and the polishing surface 7 are not in contact with each other. The polishing mode 'and perform appropriate polishing based on the performed polishing amount sensed by the sensors (18 and 19). In addition, according to the third aspect of the present invention, it is used to accomplish the above-mentioned purpose. The example shown in FIG. 1 and FIG. 2 includes a first step: two positioning rings wound around the substrate carrier 10 3 to keep the substrate 3 on it; the second door · When adjusting the positional relationship between the positioning ring 3 and the polishing surface 丨 7 to shape the material between them, the substrate 5 is in contact with the polishing surface 17 and The above table '17 generates-relative movement to perform polishing;-when the first light surface contacts the polishing surface 17, the substrate 3 and the polishing movement are advanced =: between the material 8 and the polishing surface 17-relative three states 2nd- According to a polishing method according to the fourth aspect of the present invention, the first step is to polish the surface 17 as a fixed polishing member 15B:

546185 V. Description of the invention (4) The polishing surface in the three steps 7 is a polishing pad 1 5 A. In addition, a polishing method according to a fifth aspect of the present invention is that at least one of the second or third steps in the third or fourth aspect of the method includes a fourth step of measurable polishing amount, and wherein the polishing amount is After reaching a pre-specified value, the polishing method will continue from the fourth step to the second and third steps. [Detailed description] The best execution mode of the present invention will be described below with reference to the diagram. To achieve the purpose of the description, when the same or equivalent component items appear in more than one figure, we will An identical number will be assigned, and the description of the component item will not be repeated. FIG. 1 is an external view of a polishing apparatus according to an embodiment of the present invention. The configuration of this polishing apparatus will be described below with reference to FIG. The polishing device 1 includes a substrate carrier 10 for holding a substrate S, a carrier driving shaft 12 for driving the substrate carrier to rotate, a carrier head 13 for supporting the carrier driving shaft 12 and a pivot shaft. 14. The pivot shaft 14 rotates with its own axis as the movement center, so that the carrier head 13 and the substrate carrier 10 have a similar rotation. μ polishing device 1 also includes a polishing table 36 ---

A polishing tool 15 is added thereon; and a rotary conveyor 27 is used to transport objects between an elevator 29 and a push plate 30 (both will be described later). The light tool 15 has a polishing pad 15 A and a fixed abrasive member 15B. The polishing second has a turntable 36A, a polishing pad 15A attached thereto, and a 36B, a fixed abrasive member 15β attached thereto. Polishing of the polishing tool 15

546185 V. Description of the invention (5) The surface 17 is composed of a polishing surface 17A of a polishing pad 15A and a polishing surface of a fixed abrasive member 15β. During polishing, purified water, an abrasive, or a chemical solution (or a combination of these) may be supplied to the turntable 364 and the reel table 36B as a polishing solution. By rotating the pivot shaft 14, the substrate carrier 10 can be positioned directly on the turntable 36A, the reel table 36B, or a push plate 30 (to be described later). The pivot shaft 14 has a positioning mechanism (not shown) so that the substrate carrier 10 can be pivotally positioned through it. The polishing device 1 also includes a substrate inverter 28 for inverting the substrate s; an elevator 29 for transporting the substrate S between the substrate inverter 28 and the rotary conveyor 27; a push plate 30 for receiving The substrate s carried by the conveyor 27 is rotated and transferred to the substrate carrier 10; a first dresser 20 is used to modify the polishing pad i5A of the turntable 36A; and a second dresser 50 is used to 36B fixed abrasive member 15B. Article God Please also refer to Figure 2 for the description of the substrate carrier 10. The substrate carrier 1-0 has a substrate carrier body that is shaped like a cylindrical container. It has an inner: ΐ: Ξ: Γ and a positioning ring 3 mounted on the substrate carrier body 2 to form a Individual units are in it. In the enclosed space surrounded by the substrate carrier body 2 =, it includes-a clip-on f to the top of the substrate S to keep clothes like I '-a frame-shaped retaining ring 5' and an approximately circular disk shape的 材 Ϊ 面 SA ， 料 42。 Material surface SA, material 42. The lower surface of the base material is a polished base. The ring 42 is composed of an elastic film, and its periphery is sandwiched between the clothespin 6 and the bottom of the retaining ring 5. ) While covering, 313737.ptd ugly

Page 9 546185 V. Description of the invention (6) The outer edge of the upper surface, the outer part and the bottom surface of the chuck 6. This will create a space g between the seal ring 42 and the missing plate 6. During polishing, the sealing ring 42 is closely adhered to the upper surface of the substrate s to seal the space g. A pressure piece 7 made of an elastic film is stretched between the retaining ring 5 and the substrate carrier body 2. The pressure piece 7 is sandwiched between a casing 2 of the substrate carrier body 2 and a pressure piece support 28 through its outer peripheral edge portion, and its inner peripheral edge portion is clamped on the top of the retaining ring 5 5A and brake 5B. The substrate carrier body 2, the chuck 6, the retaining ring $ and the pressure sheet 7 are combined in the substrate carrier body 2 to form a pressure chamber 21. A fluid path 31 is composed of pipes, connectors, etc., and communicates with pressure = 21. The pressure chamber 21 is connected to a compressed air supply through a valve R 1 provided in the fluid path (Not shown). The space formed between the substrate s and the chuck 6 has a /:: 9 in contact with the substrate S. The center bag 8 has a round contact surface and a connection: Ϊ I :, bottom The center of the surface; and the annular tube 9 has a ring-shaped outer circle and surrounds it. The space formed between the chuck 6 and the substrate s is divided into a plurality of spaces. Among them, a pressure The ventricular J-heart bag 8 and J-shaped official 9 and the ring-shaped Q door, the two pairs of force I to 22 are formed between the center bag 8 and 幵 / g 9 and the pressure chamber 23 is formed outside the ring. In the bag 8, a central pressure chamber (also turned into A long & 9 outside in the middle film 8 1 ία ,, and ϋ on behalf of the force chamber) 2 4 is held by an elastic 溥 暝 81 and a medium ~ bag The pressure chamber (also simply referred to as the pressure chamber) 25 is formed by the one-and-two-shaped tube 9 :: shaped tube holder 92 2. The fluid path 32, 33, and 35 knife 313737.ptd by police road, connector, etc. Page 10 546185 1. Description of invention (7), and communicate with pressure chambers 22 and 23, central pressure chamber 24 and intermediate pressure chamber 25. These pressure chambers 2 2 , 2 3, 2 4 and 2 5 are connected to a pressure-side air supply (not shown) through regulating valves R2, R3, R4, and R5 provided in the fluid paths 32, 33, 34, and 35, respectively. This system is set up so that a fluid (such as air) can be supplied to the chuck 6 located above the pressure chamber 21 in a pressurized state or atmospheric pressure, and is similarly supplied through the fluid path (31 to 35). The corresponding pressure chambers (22 to 25) communicate with each other. The pressure of the pressurized fluid supplied to each of the pressure chambers (21 to 25) can be adjusted by a regulating valve (ri to R5) provided in the fluid path (31 to 35). And adjustment. Therefore, the pressure in each pressure chamber (21 to 25) can be controlled separately or can be set at atmospheric pressure. Use the regulating valve (R 1 to R 5) = make different pressure chambers ( 2 1 to 25) The pressure can be adjusted separately, so that the substrate s is pressed to the polishing pad 1 5A so that each part of the substrate is uniform. Can be adjusted separately. In addition, the pressure chambers 22 and 23 are configured to be switchably connected to a vacuum source (not shown in the figure), so that the pressure chambers 2 2 and 23 are switched to a vacuum. There is a small gap between the outer peripheral surface of the sealing ring 4 2 and the positioning ring 3. This surface configuration constitutes a floating structure, some of which are similar to the retaining ring 5, the chuck 6, and the seal installed on the chuck 6. The ring 42) is a vertical movement of the base material carrier main body 2 and the positioning ring 3. Similarly, the part 5 is a plurality of protrusions at some positions of the actuator 5B of the holding ring 5. The protrusions are vertically moved around and protrude outward. The position of the movable ring (retaining ring 5 and the like) of the ring 3 is limited to a given point, which is a specific point where the protruding portion% engages with the upper surface 3B of a portion 3A of the positioning garment 3.疋 Regulators R1 to R5, fluid paths 31 to 35, pressure chambers 21 to 25, and clamps

546185 V. Description of the invention (8) The disc 6 is all parts of the substrate pressure mechanism 11. Next, the mechanism for rotating and moving the substrate carrier 10 will be described later. The substrate carrier 10 is connected to a load battery 51 at the bottom end of the substrate carrier driving shaft 12 through a universal joint ball mechanism 5 2. The substrate carrier driving shaft 12 is vertically positioned in the device, and is inserted into a rack bearing 53 and then sequentially inserted into a pulley 54. The pulley 54 is rotatably disposed in an inner hole 5βA of a supporting unit 56. The vertical direction of the substrate carrier driving shaft 12 is set to support the single tg56 in the horizontal direction. The driving device (not shown in the figure) drives the substrate carrier driving shaft 透过 through a belt 54 and a belt 55 (indicated by a dotted line in the figure), and operates in the internal hole 56A. -Pulse motor 57 ^ is placed above the supporting early element 56 and combined with the ball screw 58 series bolts on a roll of enamel ship Furuzaki 的 The composite substrates are as good as 仏, 〇 Chuleizhongmu 5 9 The ball nut 5 9 is the top end of the drive shaft 1 2.囡 屮 ，， 知 ， R ^ ， 基 姑 # JLMi b # Therefore, by operating the pulse motor, the material load 8-10 and the connected beauty are all made into the same unit and can be retracted in the well type, the material load /, and the drive shaft. 12 can be viewed as motor or servo 5 up to γ ^ i + and stop at the desired height. Both stepper / = motors can be used as the pulse motor 57. It should be noted that, although the second image element 56 is not visible with the inclusion of a standpoint (see figure 1), the support shaft 12 of the substrate carrier 2 extends downward, and The battery 51 and some parts are connected to the support unit 56, and the air-resistance load is called 6; :::: == measuring device mechanism 18, reel i 36B :; measuring; the mechanism is a- The sensor mechanism is a second terminal 313737.ptd Page 12 546185 V. Description of the invention (9) —: ^: Institution 19. The first and second end-point sensor mechanisms 18 and 19 detect whether or not Ϊ = Ϊ has been reached to the specified value (end point), and outputs a detection signal to the two-system mechanism (not shown) here. The sensors used for the first and second terminals ^ mechanisms i 8 and 19 may be optical or overload current # to type sensors. If an optical torque sensor (not shown in the figure) is used in the polishing device to sense the polishing torque, and the polishing torque value of U 2 is used to determine the polishing amount, it is not necessary to provide an end point sensing mechanism. this. & its motor 57, ball screw 58, ball nut 59, chrysanthemum battery 51 ^ eight drive shafts 12 are included in the positioning ring positioning adjustment mechanism 4 Similarly, the pulse motor 57, ball screw 58, ball screw The cap M, the load 'pool 51, and the substrate carrier driving shaft 12 are also included in the positioning ring pressing mechanism. In one embodiment of the present invention, the operation of the substrate carrier 10 of the polishing device i will be described in the first paragraph. Fig. 2 and refer to Fig. 丨 and Fig. 3. In the polishing apparatus 1 of this embodiment, in order to obtain and position the substrate S in the substrate carrier 10, the entire substrate carrier 10 must first be positioned directly above the substrate 3. Then, the center bag 8 and the pressure chambers 24 and 25 (in the annular pipe 9) are supplied with a pressurized fluid 'to pressurize it to a prescribed pressure. Then, a pulse signal is transmitted from the control mechanism (not shown) to the pulse motor 57 to lower the substrate carrier 10. In response to this pulse signal, the pulse motor 57 turns the ball screw 58 to drive to the ball nut 59, causing the substrate carrier driving shaft 12 to descend, thereby lowering the substrate carrier 10 until the bottom surface of the center bag 8 and The ring-shaped tube 9 creates a tight seal on the held substrate S.

3l3737.ptd Page 13 546185 V. Description of the invention (ίο) Secondly, the pressure chambers 2 2 and 2 3 are connected to the vacuum source (not shown) through the fluid path 3 2 and 3 3 respectively in the pressure chambers 22 and 23 Negative pressure is generated and adhered by adsorption to generate the suction required to hold the substrate s. Then, a control mechanism (not shown in the figure) transmits a pulse signal to the pulse motor 57 to raise the substrate carrier 10 and the substrate S which is quickly held thereon by suction. The pulse motor 57 is lowered in a similar manner to that described above (through the ball screw 58, the ball nut 59, and the substrate carrier drive shaft 12), but rotates in the opposite direction. Secondly, the pivot axis 4 is rotated to move the entire substrate carrier 10 and positioned above the required turntable 36A and its polishing pad 15A. Similarly, the periphery of the substrate S is fixed by the positioning ring 3 to prevent it from being displaced from the substrate carrier 10 during polishing. Next, the 'substrate carrier 10 is lowered so that the surface of the substrate S to be polished and the bottom surface of the positioning ring 3 are brought into contact with the polishing pad 15A. When the substrate S is in contact with the positioning ring 3 and the polishing surface 17 A, a load is applied to a load battery 51 which is mounted on the bottom end of the substrate carrier drive shaft 12. The load battery 5i senses the load and transmits a 'load sensing' signal to a control mechanism (not shown). At this time, the control mechanism confirms that the substrate S and the positioning ring 3 are in contact with the polishing pad 15A. The control mechanism then sends a pulse signal to the pulse motor 57 to rotate the pulse motor to lift the substrate carrier 10 to a specified position. In this way, the polishing pad 15 A and the positioning ring 3 can be maintained at the same position regardless of whether the positioning ring 3 is worn or not '. More specifically, when the substrate carrier 10 is lifted to a height of about 0.2 mm, since the thickness of the substrate S is about 0.8 mm, the substrate will not leave the substrate carrier 1 during polishing. bottom of. In the device in this state, the supply to the pressure chambers 2 1 to 2 3 has a specified surface.

I side

313737.ptd Page 14 546185 V. Description of the invention (π) Pressurized fluid under pressure to press the substrate S to the polished surface 17A on the turntable 36A. The polishing solution is caused to flow from a polishing solution supply nozzle (not shown) while maintaining a sufficient amount of polishing solution on the polishing pad 15 A to ensure that polishing can always be performed with the polishing solution, where the polishing solution is to be polished. Between the substrate surface SA and the polishing surface 17A of the polishing pad 15A. During this period (see Figure 3), by supplying the fluid pressure in the pressure chambers 22 and 23, the C2 and C4 parts of the substrate S (placed under the pressure chambers 22 and 23) are respectively pressed down to polishing Surface 1 7 A ,. Similarly, the part C1 of the substrate S located in the central pressure chamber 24 is pressed against the polishing pad 15 A by a pressurized fluid, and this acts on the central pressure chamber 24 through the elastic film 81 of the central bag 8 . The C3 portion of the substrate S provided below the intermediate pressure chamber 25 passes through the elastic film 9 1 of the annular tube 9 and is applied to the intermediate pressure chamber 25 by the pressure of the pressurized fluid and pressed down to the polished surface 17A. In addition, the force for pressing the substrate s to the polishing surface 17 A can be changed by supplying a pressurized fluid to the pressure chamber 21 or changing the pressure of the pressurized fluid. Therefore, the polishing pressure applied to the substrate S can be adjusted by controlling the pressure of the pressurized fluid applied to each of the pressure chambers 21 to 25. In other words, the force for pressing the substrate S against the polishing pad 15 A on the turntable 3 6 A can be adjusted for each individual C1 to C4 portion of the substrate S, respectively. The above functions adjust the pressures of the pressurized fluids applied to the individual pressure chambers 21 to 25 by adjusting the regulating valves R1 to r5 provided in the fluid paths 31 to 35, respectively. In this mode, each of the c 1 to C 4 portions of the substrate S can be pressed down to the polishing pad 15A in the rotary dial 36A by applying a polishing pressure that can be individually adjusted to a desired value. By properly adjusting the substrate s to the polishing pad

313737.ptd Page 15 546185 V. Description of the invention (12) The pressure of 15A is on the surface of the substrate s (C1, located below the central pressure chamber 24, C2, located below the pressure chamber 22; C3, It is arranged below the intermediate pressure chamber 25; and part C4, it is arranged under the pressure chamber 22), the pressure distribution will be adjusted as needed. Thus, 'the substrate S can be divided into four concentric circles (circular portion c 1 and ring portions C2 to C4)' and each of the other C 1 to C 4 portions can be pressed with a separately defined pressure. Since the polishing rate depends on the pressure used to press the substrate s to the polishing pad 15A, and because each of the pressure applied to the substrate s can be adjusted as described above, therefore (^ to 4 The polishing rate of the different parts can also be controlled independently. In this way, the entire surface of the substrate S will be free from under-polishing or over-pol ishing problems to obtain uniform polishing. , Even when the film on the surface of the substrate S to be polished has a radial film thickness distribution. The substrate S can also be polished in a mode where the positioning ring 3 is not in contact with the polishing surface ι7Α. With the positioning ring 3 and The mode of contact of the polishing surface 17A is compared with 'this will allow more polishing solution to enter the substrate surface SA and the polishing surface 17A of the substrate S to be polished, thereby increasing the polishing rate. In addition to increasing the polishing rate' The non-contact of the positioning ring 3 with the polishing surface 17 during polishing will also reduce the wear of the positioning ring 3 and effectively increase the service life of the positioning ring 3. In order to perform polishing when the positioning ring 3 is in contact with the polishing pad 1 ^ , After the substrate carrier 10 has been lowered enough to bring the substrate 3 into contact with the positioning ring 3 and the polishing pad 1 5 A, the following operation will be performed: a pulse signal will be transmitted from the controller (not shown) to the pulse motor 5 7 to cause the pulse motor 5 7 to roll

313737.ptd Page 16 546185 V. Description of the invention (13) Ball screw 58. The ball screw 58 operates in conjunction with the ball nut 59 and the substrate carrier drive shaft 12 to further reduce the substrate carrier 10, and With an increasing force, the positioning ring 3 is pressed against the polishing pad 15 A until the load battery 5 detects the load value of the positioning ring pressure set in the preset polishing program. Polishing force is controlled by feedback control. Therefore, when the positioning ring 3 is pressed to the polishing 塾 1 5 A, a load is applied to the load battery 5 ^, and when the load reaches a specified value, a load signal is transmitted from the load battery 5 i to the control mechanism 'to stop Rotation of the pulse motor 57. Then, as described above, the substrate S is pressed to the polishing pad 15A by pressing the pressure chambers 21 to 23; and if necessary, the pressure in the central and intermediate pressure chambers 24 and 25 can be changed; and the turntable 3 6 A Turn to perform the polishing operation. When all the above steps are completed, the "edge rounding" problem of the polishing pad will occur when using polishing cloth such as ici 〇〇〇 / SUBA4〇〇i as the polishing pad ι5A. This problem can be controlled by the pressure of the positioning ring And resolved. It also improves the uniformity on the surface of the substrate and increases productivity. With reference to the figure, the operation of the polishing device 1 of this embodiment will describe the polishing process performed when the position% 3 is in contact with the polishing surface 丨 7, and the position% 3 is not in contact with the polishing surface 丨 7 Contact with another polishing process. In this regard, the polisher used in the turntable 36A and the reel table 36B. 15 will be described later. The polishing procedure (1) will be described with reference to FIG. 2, and at the same time, refer to FIG. 5 and FIG. 4A. ^ L, _ In this process, a metal film 6 1 will be polished first, or the remaining part of the metal film 61 and the metal film 6 2 will be polished together!

546185 V. Description of the invention (14) At this time, as shown in FIG. 5, a polishing pad 15A 'used on the turntable 36A is the same as that shown in FIG. 1, but a polishing pad 115A is used on the reel table 36B ( Instead of using a fixed polishing member 15B) as a polishing tool. The polishing pad 115A has a polishing surface 117A. A cross-section of a substrate S1 is shown in FIG. 4 (A), and has a metal thin film 6 1 (copper metal, etc.) formed by a process such as electricity ore and a metal thin film 62. As a barrier layer under the metal thin film 61. The polishing of the metal thin film 61 is performed only to the height indicated by the meaning in the illustration; then, the polishing of the metal thin film 6 and the metal thin film 6 from the height X1 to the height Y1 will be performed simultaneously. First, the substrate carrier head 13 is rotated around the pivot axis 14 as a center to position the substrate carrier 10 above the push plate 30. Next, pressurize the pressure chambers 24 and 25 ′ and raise the push plate 30 until the polished substrate s 1 contacts the bottom of the substrate carrier 10 (the seal ring 4 2 and the elastic film 8 1 and 8 2 ). Then, a negative pressure is obtained in the pressure chambers 22 and 23 to generate an adsorption force and cause the substrate s 1 to be adsorbed on the substrate carrier 10. At this time, the base material 81 held by the base material carrier 10 is surrounded by the positioning ring 3. Next, 'position the substrate carrier 10 directly above the turntable 36A, and then rotate the pulse motor 57 axis to lower the substrate carrier 10 and bring the positioning ring 3 into contact with the polishing pad 15A on the turntable 36A, and place the substrate The material S1 is pressed to the polishing pad 15A. After the substrate carrier 10 contacts the polishing pad 15 A, the pulse motor 57 is inverted to slightly raise the substrate carrier 10 (for example, 0.2 mm), thereby positioning the positioning ring 3 above the polishing pad 15A. A predetermined size gap is formed between the bottom of the positioning ring 3 and the polishing surface 17 A of the polishing pad i5A.

313737.ptd Page 18 546185 V. Description of the invention (15) Next, pressurize the pressure chambers 21 to 23 to press the substrate S1 to the polishing pad 15A; the turntable 36A is rotated to cause the substrate Si and the polishing surface 17A. Relative motion; so that the metal film 61 is polished. This technique (that is, the positioning ring 3 is not in contact with the polishing surface 17A during polishing) can improve the entry of the polishing solution between the polished substrate surface SA1 and the polishing surface 17A of the substrate S1, and will increase the polishing rate. In addition, because this technology will also reduce the wear of the positioning ring 3, the service life of the positioning ring 3 can be greatly increased. When the device has performed a specified amount of polishing, and the first end point sensing mechanism 18 detects that the surface SA 丨 of the polished substrate has reached the height of χ 丨, the rotation of the turntable 36A is stopped. Next, the pressure chamber 21 is subjected to atmospheric pressure, and the pressure chambers 22 and 23 are subjected to negative pressure, thereby generating an adsorption force to make the substrate "adhere to the substrate carrier 10. The pulse motor 57 starts to operate to lift the substrate tool 10. Finish the polishing process on the turntable 36A. Then, the substrate carrier head 13 is rotated around the pivot axis 14 and the substrate carrier 10 is positioned directly above the reel table 36B. This reduces the pressure chambers 21 to 23 It is pressurized, and is thrown on the surface of the material, and is pressed to the polishing pad U5A. The polishing is started. After the substrate carrier 5A is in contact with it, the substrate carrier 10 does not need to be lifted. Rotate to lower the substrate carrier slightly, pulse motor polishing pad 115A 'to polish metal film 61 and metal: film & stand, 3 while pressing the soil to perform polishing' Polishing pad 115 eight will + will have a circle = This mold will make the edge of the surface SA1 of the substrate to be polished. Flatness. Light, thereby increasing when a predetermined amount of polishing is performed, change the end point of Tiandi 313737.ptd Page 19 546185

When the mechanism 19 detects that the surface of the substrate to be polished s A 1 reaches the height of Υ 1, the polishing is stopped. Then, the pressure chamber 21 is made to receive the atmospheric pressure and the pressure chambers 22 and 23 are made to receive the negative pressure, thereby generating an adsorption force to keep the substrate s 丨 on the substrate carrier i 0. Next, the substrate carrier 10 is lifted, and the polishing process on the reel table 36B is ended. Secondly, 'position the substrate carrier 10 directly above the push plate 30, and the push plate 30 is lifted to the transfer position of the substrate, and the pressure chambers 22 and 23 are returned to atmospheric pressure to make the substrate The carrier 10 releases the substrate "and transfers it to the push plate 30. The above-mentioned polishing procedure (1) describes the polishing process of a substrate S1 including a metal film 61 and a metal film 62 in a polished portion. However, Yu Yu The polishing part only has a metal film 6 1 for the substrate polishing (shown in Figure 4β), which can be polished to the height of X 2 first, and then polished to the height of γ 2, and then the same polishing process is continued for the two parts (1 ). In this case, the polishing rate of this part before the χ2 height can be increased to improve productivity; polishing can be performed between χ2 * γ2 heights to obtain the best suitable surface flatness. Use a single polishing The polishing procedure (2) of the stage 36 for polishing the metal thin film βΐ will be described in FIG. 2 with reference to FIG. 4 (b). This embodiment uses the turntable 36A shown in FIG. 2 and polishes Pad 1 5Α is set on turntable 36Α (Figure 2). Shown at The substrate S2 in FIG. 4 (B) is a substrate to be polished. The following description will only describe the polishing procedure (2) which is different from the polishing procedure Q): the height is increased to X 2 and the polishing of the substrate s 2 is performed. A gap under the positioning ring 3 is used, and the substrate carrier 10 is lifted here. Then, the substrate carrier

313737.ptd Page 20 546185

The tool 10 is lowered again (without moving it on the reel table 36B), and the positioning ring 3 pressed down to the polishing surface 1 17A is polished from the height 2 to the "height. Use the results obtained in these two procedures Basically the same, but alas, the process time using the polishing procedure (2) will be shorter because it can save time in moving the substrate carrier 10 to the reel table 36β. Next, the polishing procedure (3) will utilize Figure 6 illustrates and reference can be made to Figure 4. The polishing performed is performed using a fixed polishing member i 5B followed by a polishing pad 15A. The polishing procedure (3) is basically the same as the polishing procedure (1).

Unlike the apparatus in Fig. 1, the apparatus in Fig. 6 uses a fixed polishing member 15β on a turntable 36A and a polishing pad 15A on a reel table 36b. The workpiece can be the substrate S1 shown in FIG. 4 (A) or the substrate S2 shown in FIG. 4 (B).

The following description can also be applied to a substrate S2. In other words, in the following, 'S2' can replace S1 in all embodiments. First, the substrate carrier 10 is used to stabilize the substrate S1 using an adsorption force. Next, the substrate carrier 10 is moved on the turntable 3βA and lowered until the positioning ring 3 (Fig. 2) contacts the fixed polishing member 15B. After the positioning ring 3 contacts the fixed polishing member 15B, the substrate carrier 10 is slightly lifted to form a gap of a specified size between the positioning ring 3 and the polishing surface 17 B of the fixed polishing member 15B. Next, polishing is performed so that the substrate s 丨 is pressed down to the fixed light-removing member 15B. Since the initial pressure of the positioning ring 3 on the fixed polishing member 15B does not cause a "edge rounding" problem, in this case, it is not necessary to continuously hold the positioning ring 3 against the polishing surface 17B to suppress the rebound. Because a gap of a specified size has been formed in the positioning ring 3 and fixed polishing

3l3737.ptd Page 21 546185 V. Description of the invention (18) Between the polished surface 17B of the 15B piece, the polishing surface 1 between the polished substrate surface SA1 of the substrate S1 and the fixed polishing member 1 5B can be improved. Intermittent polishing solution enters, and will increase the polishing rate. In addition, because this technology will also reduce the wear of the positioning ring 3, it will greatly extend the service life of the positioning ring 3. When the device has performed a specified amount of polishing, that is, the first end sensor mechanism 18 detects that the surface of the polished substrate S1 of the substrate S1 has reached the height of X1 (if the substrate S2 is changed to X2ifj Degrees), after the substrate carrier iq is lifted, the polishing operation on the turntable 3 6 A ends. Secondly, because the substrate carrier 10 is used to stabilize the substrate s 丨, the base material carrier 10 is moved to the position above the push plate 30, and then the positioning ring 3 is lowered until it reaches the polishing pad 1 5 A. Phase contact. Then, the substrate carrier is slightly lowered 'so that the positioning ring 3 is pressed to the polishing pad 15 A. Next, the substrate s 1 is pressed against the polishing pad 15A, which will enable the edge of the substrate S1 to be uniformly polished. α When the equipment has performed a predetermined amount of polishing, and the second end sensor 1 sensor mechanism 19 senses that the surface of the polished substrate sa 1 has reached γ 1 height 0 guard (if it is S 2 then change to X 2 height), the substrate carrier 丨 〇 will be lifted, and the polishing operation on the reel table 3 6 B will end. The substrate carrier 10 is then moved on the push plate 30 to transfer the polished substrate S1 to the push plate 30. In addition, in the polishing procedure (3), the polishing step using a fixed polishing piece 15B is not performed first, but the polishing step using a polishing pad 15A is performed, and the order of these steps can be interchanged. Even when the order of the steps is reversed, 2 can cause the positioning ring 3 to press the polishing pad 15A to perform the first step using the polishing pad 15A, and the polishing step using a fixed polishing material 15β should be formed

546185 5. Description of the invention (19) is performed in a specified gap between the positioning ring 3 and the fixed polishing piece 15B. In the above embodiment, a single substrate carrier is used to perform the continuous polishing process of two different polishing tools 15. However, the present invention is also obviously applicable to a polishing execution using three or more polishing tools 15. In addition, the above specific examples only illustrate polishing of metal thin films, but the present invention should also be applicable to other thin film polishing processes such as insulator films or shallow trench isolation (STI) processes. In addition, the polishing apparatus 1 of the present invention requires only one polishing tool 5 to maintain operation, and an additional polishing tool 15 may be used. The polishing device 1 can not only apply a pressing force to the positioning% 3 to maintain the operation, but also provide one between the positioning ring 3 and the polishing surface 丨 7 without applying pressure to the positioning ring 3. Therefore, the present invention provides a polishing and polishing method to provide a substrate with a high flatness and a high polishing rate 'productivity' to support a wide range of polishing applications. The throwing light in the example is a polishing device of another embodiment. The difference between this embodiment of the positioning adjustment mechanism 4 Λ is the positioning ring positioning adjustment H :: 2! In a device, no positioning ring or fixed air cylinder 12 is used as its actuating device. … The pressing mechanism without using the pulse motor 57 will be described later: The positioning mechanism of this embodiment cannot accurately adjust the positioning ring positioning mechanism. The mechanism of this embodiment cannot be used on the relatively polished surface of this embodiment. In the actual situation, adding one upward and two acting = f, when the positioning ring is in contact with the polishing surface, it is sufficient to maintain the positioning tightness by one positioning ^ to produce adjustment. The applied force is only ^ the contact between the polished surfaces, allowing a polishing

546185 V. Description of the invention (20) The solution easily enters the soil by positioning 5. The space between the king's clothing and the polished surface and between the light surface 'is connected to the root L virtual A / I account for an increased polishing rate in this embodiment The fixed A center stem mm ^ ^ position positioning adjustment mechanism can also be separated from the polishing surface, such as μ, +, in the embodiment of the present invention. Depressing the positioning ring to throw the same as above, a problem of rounding of the positioning ring, field surface. Therefore, when a positioning ring position w is provided to improve the polishing accuracy c of the substrate, the mechanism can adjust the positioning ring between the standing ring and the polishing surface in ΐ 3 weeks. And polishing polishing surface or make the positioning ring and polishing surface light rate (speed of non-physical contact between light or light A improve polishing productivity. Into the substrate table. How will undoubtedly the positioning ring pressure mechanism polishing surface, the same as the next to hold the polishing Its positioning point is slightly touched to touch the surface and the ground, and the side of the remote system is also used to raise the surface to shape the touch.

546185 Brief description of the drawings [Simplified description of the drawings] These features, aspects and advantages of the present invention will be easier to understand by the following description, patent scope and accompanying drawings. FIG. 1 is an external view of a polishing device in an embodiment of the present invention; FIG. 2 is a partially enlarged cross-sectional view of the polishing device in FIG. 1, and the substrate carrier is positioned directly above the turntable; FIG. 3 is a plan view of a substrate carrier on which the substrate is positioned in the polishing device of FIG. 1; FIG. 4 (A) shows a part of the polished substrate, and the substrate is A metal film and another metal film between the metal thin films; FIG. 4 (B) is a cross-sectional view of a substrate composed of a metal thin film, wherein the metal thin film is polished; FIG. 5 shows another aspect of the present invention. An embodiment-an external view of a polishing device; FIG. 6 is an external view of a polishing device according to yet another embodiment of the present invention; and FIG. 7 is a partially enlarged cross-sectional view of a polishing device according to another embodiment of the present invention. c > [number description] 1 polishing device 2 substrate carrier body 3 positioning ring 4 Positioning ring Positioning adjustment mechanism 5 Retaining ring 5A Top part 5B Actuator 5C protruding part

313737.ptd Page 25 546185 Brief description of drawings 6 Chuck 7 Pressure plate 8 Center bag 9 Ring tube 10 Substrate carrier 11 Substrate pressure mechanism 12 Substrate carrier drive shaft 13 Carrier head 14 柩 Rotor 15A Polished Pad 1 5B Fixed polishing piece 17 Polished surface 18 First-finish sensor mechanism 19 Second finish sensor mechanism 20 First trimmer 21 to 23 Pressure chamber 24 Central pressure chamber 25 Middle pressure chamber 27 Rotary conveyor 28 Rotator 29 Elevator 30 Push plate 31 to 35 Fluid path R1 to R5 Adjust Λ- / Γ namely valve 36A turntable 36B reel stand 42 seal ring 50 second dresser 51 load battery 52 universal ball hinge mechanism 53 rack bearing 54 pulley 55 Timing belt 56 Support unit 56A Internal hole 57 Pulse motor 58 Ball screw 59 Ball nut 60 Moisture barrier 61 Metal film 62 Metal film 81, 8 2 thin film 9b 92 elastic thin film 115A polishing pad

313737.ptd Page 26 546185 Schematic description 117A Polished surface 120 Air cylinder

1HH 313737.ptd Page 27

Claims (1)

546185 Case No. 91111401 Sixth, the scope of patent application ^ April, April K. Rev. J _ month 1. A polishing device, which includes a device to apply the substrate, a certain position of the pressure machine, a certain positioning, a fixed table 2. If applied It specifically includes a first carrier which can be a substrate and the pressing-down to two polishing table, a substrate carrier which is close to a first polishing table with respect to the direction, a surface pressing mechanism of the substrate, and the base position. Ring, the structure is pressed to the positioning ring, the positioning direction of the ring, the surface direction of the second polishing table is moved, the first polishing surface or the second polishing surface is in contact with the substrate to adjust and away from the substrate, and has a first polishing A substrate and the first polishing table are held to adjust the first throwing surface and the first adjusting mechanism provided on the first polishing surface of the substrate carrier, so that the substrate is pressed to the first surface. The polishing device of the first polishing item has a polishing surface of a substrate held by a second body and a polishing surface contacting the light surface, wherein the positioning ring positions the positioning ring and the light surface of the second polishing surface, and Position the substrate to make contact with each other Light pressing surface, and in contact by the polishing surface; on, has been to surround the substrate, and the substrate is adjusted relative to the first towards and away from the surface. Wherein the polishing device polishes the surface, the substrate, and selectively makes the contact; the pressure applying mechanism is that the substrate system and the first positioning adjustment mechanism are capable of pressing the positioning ring system on the substrate in a direction. 3. The polishing device according to item 2 of the application, wherein the first polishing surface is harder than the second polishing surface. 4. The polishing device according to item 2 of the patent application, wherein a fixed polishing member is provided on the first polishing table and defines the first polishing surface; and III Μ B 313737.pic Page 1 of 2003. 04. 25.027 righteousness ί: repair E 546185 years η d ι_ not _ 91111401_ 1 on the 9th month of the year j, Γ Amended _ Lee scope of the second polishing table The upper system provides a polishing pad and defines the second polishing surface. 5. The polishing device according to any one of claims 2 to 4, wherein at least one of the first polishing table and the second polishing table includes an end point sensor to detect whether the substrate pressed on it is Polished to a specified amount. 6. The polishing device according to item 1 of the patent application scope, wherein the pressure applying mechanism comprises: a substrate pressing member provided by a substrate holding side of the substrate carrier and defining a base An expandable chamber between the material holding side and the substrate held thereon; a pressurized fluid supply system for supplying a pressurized fluid into the expandable chamber; the positioning ring is fastened on the substrate carrier And the positioning ring positioning adjustment mechanism is capable of adjusting and positioning the positioning ring relative to the substrate, wherein the substrate is pressed to the first polishing surface by a substrate pressing member, and a pressurized fluid is introduced to the The expansion produced by the expansion chamber is caused and pressure is applied in a direction toward and away from the second polished surface. 7. The polishing device according to item 2 of the patent application scope, wherein the pressure applying mechanism comprises: a pressure applying member provided by a substrate holding side of the substrate carrier and defining a substrate holding An expandable chamber between the side and the substrate held thereon; 313737.ptc Page 2 2003.05.05.028 The expandable chamber; the positioning ring is fastened to the substrate carrier; and the positioning ring positioning adjustment mechanism is capable of adjusting and positioning the positioning ring relative to the substrate, wherein the substrate is a pressure member by the substrate The pressing to the first polishing surface is caused by the swelling caused by the introduction of a pressurized fluid into the expandable chamber, and the pressure is applied in a direction toward and away from the first polishing surface. 8. The polishing device of claim 6 or claim 7, wherein the positioning ring pressure mechanism includes: a chuck, which is disposed on a substrate holding side of the substrate carrier; and an elasticity The sheet is connected between the peripheral edge of the chuck and the peripheral part of the substrate carrier to define the expandable chamber by using the substrate holding side of the substrate carrier, the chuck and the elastic sheet. 9. The polishing device according to item 8 of the patent application scope, wherein the positioning ring pressing mechanism comprises: at least one elastic member provided by the substrate holding side of the chuck holding substrate, and each elastic member defines a An expandable chamber between the substrate holding side of the chuck and the substrate; and the pressurized fluid supply system for supplying pressurized fluid to individual expandable chambers. 1 0. A polishing method for polishing a substrate, wherein the substrate is pressed to a polishing surface, and the substrate is surrounded by a positioning ring. The method includes: 313737.ptc Page 3 2003.04. 25.029 〆1546185,-^, · ·--/ / _ No. 91111401_V April 4, __ VI. Application for a patent scope a first step to make the substrate and the polished surface Generating a relative slide to polish the substrate under this condition, the substrate is pressed against the polishing surface, and the positioning ring is disposed away from or slightly contacts the polishing surface; and a second step for making the A relative sliding occurs between the substrate and the polishing surface to polish the substrate in this condition, and the positioning ring and the substrate both press against the polishing surface. 11. The polishing method according to item 10 of the application, wherein the polishing surface used in the second step is harder than the polishing surface used in the first step. 12. The polishing method according to item 11 of the patent application, wherein a polishing pad is used to define the polishing surface in the first step. 1 3. The polishing method according to item 11 or 12 of the scope of patent application, wherein a fixed abrasive member is used to define the polishing surface in the second step. 0 1 4. The polishing method of this item further includes: a third step for sensing whether the substrate has been polished to a specified amount in at least the first or second step. 15. The polishing method according to item 10 of the patent application scope, wherein the second step is performed after the first step. 16. The polishing method according to item 10 of the application, wherein the first step is performed after the second step. 313737.ptc Page 4 2003. 04. 25.030 / 546185 _ Case No. 91111401_h April _ ^ _ VI. Application for patent scope 1 7. A polishing method for polishing a substrate, which is based on the substrate The material is pressed to a polishing surface, and the substrate is surrounded by a positioning ring. The method includes: polishing the substrate in this condition, the substrate is pressed to a first polishing surface, and the positioning ring is Set away from or slightly contact the first polishing surface; and polish the substrate under this condition, the positioning ring and the substrate are both pressed against the second polishing surface. 18. The polishing method according to item 17 of the scope of patent application, wherein the first polishing surface is harder than the second polishing surface. 19. The polishing method according to item 17 of the patent application, wherein the first polishing surface is made of a fixed abrasive member, and the second polishing surface is made of a polishing pad. 〇p i: | r--u: year and month κ Fuyun 丨 313737.ptc Page 5 2003. 04.25.031 546185 546185 4. Y2 X2 Figure 4B Dongzheng S46185 4 J2 59 56 56A 5 5