TW534851B - Slurry arm - Google Patents

Slurry arm Download PDF

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Publication number
TW534851B
TW534851B TW90127582A TW90127582A TW534851B TW 534851 B TW534851 B TW 534851B TW 90127582 A TW90127582 A TW 90127582A TW 90127582 A TW90127582 A TW 90127582A TW 534851 B TW534851 B TW 534851B
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Taiwan
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patent application
mortar
arm
cleaning liquid
item
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TW90127582A
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Chinese (zh)
Inventor
Fu-Dau He
Yin-Jr Liou
Yung-Shiang Hu
Jr-Shin Chiou
Bai-Chung Liou
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Taiwan Semiconductor Mfg
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Publication of TW534851B publication Critical patent/TW534851B/en

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Abstract

A slurry arm is characterized in that the upper surface of the slurry arm consists of two inclined planes intersected at a ridge line and the upper surface of the slurry arm has a nozzle capable of discharging de-ionized water. The invented slurry arm has the advantages of using de-ionized water to automatically clean the slurry arm, reducing the surface area of the slurry arm possibly being adhered by slurry, and reducing the production of fine particles.

Description

534851 Λ7 五、發明說明() 發明領域: 本發明係有關於一種研漿臂,特別是有關於一種用以 將研漿與去離子水提供至研磨墊上且具有自動清潔功能之 化學機械研磨(chemical mechanical polishing; CMP)機台之 研漿臂。 發明背景: 半導體製程中所謂的平坦化(planarization)就是把隨晶 圓表面起伏的薄膜外觀’加以使其平坦的一種半導體製程 技術。目前進行平坦化的製程有兩種方式。第一種是旋塗 式玻璃(spin-on glass ; SOG)法。此種旋塗式玻璃製程的平 坦化技術只能對薄膜提供局部性(10 c a 1)平坦化。若晶圓的 表面需要全面性(global)平坦化,則必須使用另一種平坦化 技術’稱為化學機械研磨。 劑晶 溶在 於佈 溶塗 種經 1 於 用由 利。 係上 , 賞見 單晶 簡在 很佈 理塗 原式 的方 術的 技塗 璃旋 玻以 式, 塗料 旋材 的 内 ----1-------— -----訂·--------—^w— (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 以的 可化 此坦 因平 , 性 動部 流局 上成 面達 表而 的, 圓 内 晶槽 在凹 劑的 溶面 著表 隨圓 以晶 可入 料填 材的 的易。 上容的 圓很目 公 97 12 X 110 /—\ 格 規 A4 S) N (C 準 標 家 國 國 中 用 適 度 尺 張 紙 本 534851 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明() ^'要進一步執行全面性的平坦化’則必須使用化學機 械研磨技術。此種平坦化技術之原理,是利用類似“磨刀” 之機械式研磨之原理,以研磨墊配合適當的研漿,將晶圓 表面南低起伏的輪廓,一併加以磨平的平坦化技術。 化學機械研磨可移除晶圓表面的材質,讓晶圓表面變 得更平坦。藉著具有研磨性物質的機械式研磨與酸鹼溶液 的化學式研磨兩種作用可使晶圓表面達到全面性的平坦 化’以利後續薄膜沉積之進行。 在化學機械研磨製程的硬體設備中,研磨頭被用來將 晶圓壓在研磨墊上,並帶動晶圓旋轉,而研磨墊則以相反 的方向旋轉。在進行研磨時,由研磨顆粒所構成的研漿會 被置於晶圓與研磨墊間。影響化學機械研磨製程的變數 有:研磨頭所施的壓力與晶圓的平坦度、晶圓與研磨墊的 旋轉速度、研漿與研磨顆粒的化學成份、溫度、及研磨墊 的材質與磨損性等等。 上述由研磨顆粒所構成的研漿係經由如第1A圖與第 1B圖所繪示之研漿臂提供至研磨墊上。第ia圖係繪示習 知研衆臂之上視圖,且帛1B @係緣示習知研衆臂之前視 圖。來自研漿提供裝置(未㈣)之研聚依序流經研聚入口 管40、貫穿研衆臂10之研浆通道2〇 本纸張尺度適用中國國家標準(CNS)A4規格(210 x 297公^ ------K---.-----1----^---------線 (請先閱讀背面之注意事項再填寫本頁) 534851 Α7 R7 五、發明說明() 最後落在研磨塾(未緣示)上。同理,來自去離子水提供裝 置(未繪示)之用以稀釋研漿之去離子水依序流經去離子水 入口管50、貫穿研漿臂10之去離子水通道30、以及去離 子水出口管5 5,最後亦落在研磨塾上。 如第1A圖與第1B圖所緣示的習知研衆臂在嗔出研漿 與去離子水至研磨墊的過程中由於研磨塾係在旋轉狀態而 使研漿容易附著在研漿臂的表面。附著在研漿臂表面的研 漿乾燥後因剝落而產生的微粒容易進一步附著在晶圓上。 目前解決此問題的方法係在使用研漿臂一段時間後以人工 進行清潔研漿臂以去除附著在研漿臂上的研漿之工作。然 而,以人工清潔研聚臂的方法不僅麻煩而且費時。因此, 有必要尋求解決之道。 發明目的及概述: 鑒於上述發明背景中,習知 為夫研製臂之缺點,因此本發 明之一目的為提供一種研漿臂, ^ a j用來以去離子水自動清 潔研漿臂。 α ------- ------· 1 I I I----------I I —Awl (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本發明之另一目的為提供 能被研漿附著的研漿臂表面積 種岍聚 臂,可用以減少可 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ29Γ^ 534851 A7 五、發明說明() 本發明之又一目的為提供一種研漿臂,可用以減少微 粒的產生。 (請先閱讀背面之注意事項再填寫本頁) 依據本發明之上述目的,因此本發明提供一種研漿 臂,適用於將來至研漿提供裝置之研漿與來至清潔液體提 供裝置之清潔液體提供至化學機械研磨機台之研磨墊上, 至少包括下列元件:主體,其中此主體之上表面係由複數 個斜面組成,且這些斜面相交於至少一條脊線上;清潔液 體通道,自主體的其中一端貫穿至另一端;以及喷嘴,其 中此噴嘴先穿過主體之上表面再連接至清潔液體通道,且 此喷嘴具有複數個小孔。 圖式簡單說明: 本發明的較佳實施例將於往後之說明文字中輔以下列 圖示做更詳細的闡述,其中: 第1 A圖係繪示習知研漿臂之上視圖; 第1 B圖係繪示習知研漿臂之前視圖; 經濟部智慧財產局員工消費合作社印制衣 第2A圖係繪示本發明之一較佳實施例之研漿臂之上 視圖; 第2B圖係繪示本發明之一較佳實施例之研漿臂之前 視圖; 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 534851 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明() 第2 C圖係繪示本發明的研漿臂之噴嘴之放大上視 圖; 第 2D圖係繪示本發明的研漿臂之噴嘴之放大前視 圖;以及 第2E圖係繪示第2A圖中的a-a’剖面圖與b-b’剖面 圖。 圖號對照說明: 10 研 漿 臂 20 研 漿 通 道 30 去 離 子 水 通道 40 研 漿 入 口 管 45 研 漿 出 π 管 50 去 離 子 水 入 π 管 55 去 離 子 水 出α 管 110 主 體 120 研 漿 通 道 130 清 潔 液 體 通 道 140 研 漿 入 口 管 145 研 漿 出 α 管 150 清 潔 液 體 入口 管 155 清 潔 液 體 出 口 管 160 脊 線 170 喷 嘴 180 剖 面 190 水 平 面 200 第 一 斜 面 210 第 一 夾 角 220 第 二 斜 面 230 第 二 夾 角 240 剖 面 260 小 孔 270螺紋 (請先閱讀背面之注意事項再填寫本頁) it 訂---------線- 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) 534851 A7 Β7 五、發明說明() 發明詳細說明: 本發明係有關於一種具有自動清潔功能之化學機械研 磨機台之研漿臂。請參考第2A圖與第2B圖所分別繪示之 本發明之一較佳實施例之研漿臂的上視圖與前視圖。來自 研漿提供裝置(未繪示)之研漿依序流經研漿入口管140、由 主體110的一端貫穿至另一端之研漿通道120、以及研榮 出口管145,最後落在研磨墊(未繪示)上。同理,來自清潔 液體提供裝置(未繪示)之用以稀釋研漿之清潔液體依序流 經清潔液體入口管150、由主體11〇的一端貫穿至另一端 之清潔液體通道1 3 0、以及清潔液體出口管1 5 5,最後亦落 在研磨塾上,其中此清潔液體例如可為去離子水。 (請先閱讀背面之注意事項再填寫本頁) ΑΨ 經 濟 部 智 慧 財 產 局 員 工 消 費 合 社 印 製 本發明的特徵之一係為具有噴嘴170,其中嘴嘴17〇 先穿過主體11〇的上表面再連接至清潔液體通道13〇。本 發明的另一特徵則為主體1 10的上表面係由複數個斜面所 組成。第2A圖與第2B圖中係綠示例如為兩個极 阿徊斜面所組成 之主體110的上表面,且此兩個斜面相交於畚6 、3深16 0。以 下以第2C圖至第2Ε圖詳細說明本發明之此兩個特徵與其 用途。 第2 C圖與第2 D圖係分別繪示本發明之研將 |水成之喷嘴 的上視圖與前視圖。喷嘴1 7 0的形狀例如可為由 π Υ工但上端 —訂---------線 534851 A7B7 經濟部智慧財產局員工消費合作社印製 五、發明說明( 訶阳且卜鲕岡欲< a柱,然不限定於此。只要喷嘴170穿 過主體no的上表面再連接至清潔液體通道13〇時清潔液 體可進入喷嘴170的内部空間即可。另外,喷嘴丨7〇的俄 壁具有複數個小孔260,可讓從噴嘴17〇的底部進入喷嘴 170的内部空間之清潔液體可進一步流出至主體u〇的上 表面。這些小孔260的數目例如可為16個且形狀例如可為 圓形。以上小孔260的數目與形狀僅為舉例。實際上,無 論是小孔260的數目或形狀’甚至是位置,。要具備本謂 明書所述的喷嘴17G的小孔26Q之功能,發^ 範圍内。此外,噴嘴170更具有例如螺紋"Ο之設計,用 以使喷嘴鎖進請圖中主體⑴的上表面再連接至 清潔液體通道130。 請參考第2E圖所繪示之第2A圖中的u,剖面圖與卜 b,剖面圖。a-a,剖面圖中的剖面180具有第—斜面2〇〇與第 二斜面220’ 1第-斜面2〇〇與第二斜面22()相交於脊線 160(脊線160在此a-a,剖面圖中以一點表示)。第一斜面2〇(] 與水平面190的夾角為第一夾角210,且此第一夾角21(] 例如為約8度。第二斜面220與水平面19〇的失角為第二 夾角230,且此第二夾角230例如為約8度。同理,b-b, 剖面圖中的剖面240具有第一斜面200與第二斜面22〇, 且第一斜面200與第二斜面220相交於脊線丨6〇(脊線ι6(] 在此b-b’剖面圖中以一點表示)。第一斜面2〇〇與水平面19(] 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) u n II ϋ n d n n i i n I i ϋ n- n 一 I n n n n In tn n f (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 534851 A7 _B7_ 五、發明說明() 的夾角為第一夹角2 1 0,且此第一夾角2 1 0例如為約8度。 第二斜面220與水平面190的夾角為第二夾角230,且此 第二夾角2 3 0例如為約8度。 本發明之一較佳實施例之研將臂在使用的過程中,來 自清潔液體提供裝置的清潔液體部分由清潔液體出口管 1 55流出至研磨墊上,部分則往上先流至喷嘴1 70的内部 空間中,再由喷嘴170的小孔260流出且由於第一夾角210 與第二夾角230的引導向下流至第一斜面200與第二斜面 220上,藉以達到自動清潔研漿臂的目的。一旦本發明之 研漿臂具有自動清潔的功能,當然會大幅減少可能被研漿 附著的研漿臂表面積,進一步則可避免產生附著在研漿臂 上的研漿乾燥後所導致之微粒。 綜合上述,本發明之研漿臂之一優點為提供一研漿 臂,可用來以去離子水自動清潔研漿臂。 本發明之研漿臂之另一優點為提供一研漿臂,可用以 大幅減少可能被研漿附著的研漿臂表面積。 本發明之研漿臂之又一優點為提供一研漿臂,可用以 以減少微粒的產生。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公t ) ------!!λψ------- —訂---------線 (請先閱讀背面之注意事項再填寫本頁) 534851 A: m 五、發明說明( 的 解 瞭 所 員 人 之 術 技丨 此例 悉施 熟實 如佳 較 之 以 已 而 以 用 br 並 本 定 明範 發利 本專 為請 僅申 述之 所明 上 f 改 效 等 之 成。 完内 所圍 下範 神利 精專 之請 示申 揭之 所述 明下 發在 本含 離包 脫應 未均 它 , 其飾 凡修 •’ 或 圍變 (請先閱讀背面之注意事項再填寫本頁) if 丁 If I in n J · en n ϋ m «aB8 iw ΛΜΜ9 I 言 -¾¾ 經濟部智慧財產局員工消費合作社印製 ο 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)534851 Λ7 V. INTRODUCTION TO THE INVENTION Field of the Invention: The present invention relates to a slurry grinding arm, and in particular to a chemical mechanical polishing (chemical mechanical polishing) for providing slurry and deionized water to a polishing pad and having an automatic cleaning function. mechanical polishing; CMP). Background of the invention: The so-called planarization in semiconductor manufacturing is a semiconductor manufacturing technology that flattens the appearance of a thin film undulating with the surface of a wafer. There are two ways to perform the planarization process. The first is a spin-on glass (SOG) method. The flattening technology of this spin-on glass process can only provide localized (10 c a 1) flattening of the film. If the surface of the wafer needs global planarization, another planarization technique must be used ', called chemical mechanical polishing. The agent crystals are dissolved in the cloth. In the system, I can see that the single crystal is in the technique of painting the original method of painting. The inside of the coating material is 1 ----------- ----- Order · --------— ^ w— (Please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs, this Tannin Ping, sexual activity stream It is easy to fill the surface with the crystals in the round. Appearance of the circle is very eye-catching 97 12 X 110 /-\ Standard A4 S) N (C quasi-standard home country and middle school with a moderate rule paper 534851 A7 B7 Printed by the Intellectual Property Bureau of the Ministry of Economy Staff Consumer Cooperatives () ^ 'To further perform comprehensive planarization', chemical mechanical polishing technology must be used. The principle of this planarization technology is to use the principle of mechanical polishing similar to the "grinding knife", and use a polishing pad with appropriate research Slurry, flattening technology that flattenes the undulating contour of the wafer surface to the south. Chemical mechanical polishing removes the material on the wafer surface to make the wafer surface flatter. By using abrasive materials Mechanical polishing and chemical polishing of acid and alkali solutions can achieve comprehensive planarization of the wafer surface to facilitate subsequent film deposition. In the hardware equipment of the chemical mechanical polishing process, the polishing head is used to The wafer is pressed on the polishing pad and drives the wafer to rotate, and the polishing pad rotates in the opposite direction. During polishing, a slurry composed of abrasive particles is placed on the wafer and Between the pads. The variables that affect the chemical mechanical polishing process are: the pressure applied by the polishing head and the flatness of the wafer, the rotation speed of the wafer and the polishing pad, the chemical composition of the slurry and the polishing particles, the temperature, and the polishing pad. Material and abrasion resistance, etc. The above-mentioned grinding slurry composed of abrasive particles is provided to the polishing pad via the grinding arms as shown in Figures 1A and 1B. Figure ia shows the arms of a conventional researcher. Top view, and front view of 帛 1B @ 系 缘 示 习 知 研 众 臂. The research aggregates from the research pulp supply device (not shown) flow through the research aggregate inlet pipe 40 and pass through the research tunnel 2 of the research arm 10 〇 This paper size is applicable to China National Standard (CNS) A4 (210 x 297 mm) ^ ------ K ---.----- 1 ---- ^ -------- -Line (please read the precautions on the back before filling this page) 534851 Α7 R7 V. Description of the invention () Finally falls on the grinding mill (not shown). Similarly, from the deionized water supply device (not shown) The deionized water used to dilute the slurry is sequentially passed through the deionized water inlet pipe 50, the deionized water channel 30 passing through the slurry arm 10, and the deionized water outlet. The tube 5 5 finally fell on the grindstone. As shown in Figures 1A and 1B, the conventional researcher ’s arm was rotating during the process of pouring mortar and deionized water to the polishing pad because the grindstone was rotating. The state makes the slurry easily adhere to the surface of the slurry arm. The particles generated by the slurry that is attached to the surface of the slurry arm after drying are likely to further adhere to the wafer. The current solution to this problem is to use the slurry. After a period of time, the arm manually cleans the mortar arm to remove the mortar attached to the mortar arm. However, the method of manually cleaning the mortar arm is not only cumbersome and time consuming. Therefore, it is necessary to find a solution. Invention Purpose and summary: In view of the disadvantages of the conventionally-developed arm in the background of the invention, one object of the present invention is to provide a mortar arm, which is used to automatically clean the mortar arm with deionized water. α ------- ------ · 1 II I ---------- II —Awl (Please read the notes on the back before filling out this page) Employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Consumption cooperatives printed another object of the present invention to provide a mortar arm surface that can be adhered to the mortar, which can reduce the size of the paper. Applicable to China National Standard (CNS) A4 (210 χ 29Γ ^ 534851 A7) 2. Description of the invention () Another object of the present invention is to provide a slurry grinding arm, which can be used to reduce the generation of particles. (Please read the precautions on the back before filling this page.) According to the above purpose of the present invention, the present invention provides a Grinding arm, suitable for grinding pulp to the grinder providing device and cleaning liquid from the cleaning liquid providing device to be supplied to the polishing pad of the chemical mechanical polishing machine, at least including the following components: the main body, wherein the upper surface of the main body is Consists of a plurality of inclined planes, which intersect on at least one ridge line; clean the liquid passage from one end of the main body to the other end; and a nozzle, where the nozzle passes through the upper surface of the main body before connecting to The nozzle is provided with a plurality of small holes. The drawing is briefly explained: The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, in which: Figure 1 A Figure 1 shows the top view of the conventional mortar arm; Figure 1B shows the front view of the conventional mortar arm; Figure 2A shows one of the preferred inventions. Top view of the mortar arm of the embodiment; Figure 2B is a front view of the mortar arm of a preferred embodiment of the present invention; This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 534851 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Figure 2C is an enlarged top view of the nozzle of the mortar arm of the present invention; Figure 2D is the mortar of the present invention An enlarged front view of the nozzle of the arm; and FIG. 2E is a cross-sectional view of aa 'and b-b' in FIG. 2A. Drawing number comparison description: 10 slurry arm 20 slurry channel 30 deionization Water channel 40 grout inlet pipe 45 grind Pulp out π tube 50 Deionized water in π tube 55 Deionized water out of α tube 110 Main body 120 Grinding channel 130 Clean liquid channel 140 Grinding inlet tube 145 Grinding out α tube 150 Clean liquid inlet tube 155 Clean liquid outlet tube 160 Ridge 170 Nozzle 180 Section 190 Horizontal plane 200 First bevel 210 First included angle 220 Second bevel 230 Second included angle 240 Section 260 Small hole 270 thread (Please read the precautions on the back before filling this page) it Order ---- ----- Line- This paper size applies to Chinese National Standard (CNS) A4 (210 x 297 mm) 534851 A7 B7 V. Description of the invention () Detailed description of the invention: The present invention relates to a kind of automatic cleaning function. Grinding arm of chemical mechanical grinding machine. Please refer to FIG. 2A and FIG. 2B respectively, which are a top view and a front view of a mortar arm according to a preferred embodiment of the present invention. The slurry from the slurry supply device (not shown) flows through the slurry inlet pipe 140, the slurry channel 120 passing from one end of the main body 110 to the other end, and the grind exit pipe 145, and finally falls on the polishing pad. (Not shown). In the same way, the cleaning liquid from the cleaning liquid supply device (not shown) for diluting the slurry flows through the cleaning liquid inlet pipe 150 in sequence and passes from one end of the main body 110 to the cleaning liquid channel 1 30, And the cleaning liquid outlet pipe 1 5 5 finally falls on the grinding mill. The cleaning liquid may be, for example, deionized water. (Please read the precautions on the back before filling out this page) Α 印 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs One of the features of the present invention is a nozzle 170, in which the nozzle 170 passes through the body 11 The surface is then connected to the cleaning liquid channel 13o. Another feature of the present invention is that the upper surface of the main body 110 is composed of a plurality of inclined surfaces. Figures 2A and 2B are examples of green. The upper surface of the main body 110 is composed of two polar ramps, and the two ramps intersect at 畚 6, 3 deep, 160. In the following, Figures 2C to 2E illustrate these two features of the present invention and their uses in detail. Fig. 2C and Fig. 2D respectively show the top view and the front view of the nozzle of the researcher | The shape of the nozzle 1 70 can be, for example, printed by π Υ 工 but the upper end-order --------- line 534851 A7B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs For a column, it is not limited to this. As long as the nozzle 170 passes through the upper surface of the body no and is connected to the cleaning liquid passage 13o, the cleaning liquid can enter the internal space of the nozzle 170. In addition, the nozzle The Russian wall has a plurality of small holes 260, so that the cleaning liquid that enters the inner space of the nozzle 170 from the bottom of the nozzle 170 can further flow to the upper surface of the main body u. The number of these small holes 260 can be, for example, 16 and the shape For example, it can be circular. The number and shape of the above small holes 260 are just examples. In fact, regardless of the number or shape of the small holes 260, or even the position, it is necessary to have the small holes of the nozzle 17G described in this specification. The function of 26Q is within the range. In addition, the nozzle 170 has a design such as a thread ", for locking the nozzle into the upper surface of the main body 图 中 in the figure and then connecting it to the cleaning liquid channel 130. Please refer to FIG. 2E U shown in Figure 2A, The top view and the bb, the cross-sectional view. Aa, the cross-section 180 in the cross-sectional view has a first-slope 200 and a second slope 220 ′, and a first-slope 200 and a second slope 22 () intersect at a ridge 160 ( The ridge line 160 is indicated by a point in the cross section.) The angle between the first inclined surface 20 () and the horizontal plane 190 is the first included angle 210, and the first included angle 21 () is, for example, about 8 degrees. The second inclined surface The missing angle between 220 and the horizontal plane 19 is a second included angle 230, and the second included angle 230 is, for example, about 8 degrees. Similarly, bb, the section 240 in the cross-sectional view has a first inclined plane 200 and a second inclined plane 22, and The first beveled surface 200 and the second beveled surface 220 intersect at a ridge line 60 (ridge line ι6 () is indicated by a point in the b-b 'cross-sectional view.) The first inclined surface 200 and the horizontal surface 19 () This paper Applicable to China National Standard (CNS) A4 specifications (210 X 297 mm). Printed by the Bureau's Consumer Cooperatives 534851 A7 _B7_ V. The included angle of the invention description is the first included angle 2 1 0, and this first included angle 2 1 0 If it is about 8 degrees, the included angle between the second inclined surface 220 and the horizontal plane 190 is the second included angle 230, and the second included angle 2 3 0 is, for example, about 8 degrees. According to a preferred embodiment of the present invention, the arm is in use. During the process, part of the cleaning liquid from the cleaning liquid supply device flows out of the cleaning liquid outlet pipe 1 55 onto the polishing pad, and part of it flows up to the internal space of the nozzle 1 70 first, and then flows out from the small hole 260 of the nozzle 170 due to The guidance of the first included angle 210 and the second included angle 230 flows down to the first inclined surface 200 and the second inclined surface 220, so as to achieve the purpose of automatically cleaning the mortar arm. Once the mortar arm of the present invention has an automatic cleaning function, of course, the surface area of the mortar arm that may be adhered to by the mortar is greatly reduced, and further, the particles caused by the mortar adhered to the mortar arm after drying can be avoided. In summary, one of the advantages of the slurry arm of the present invention is to provide a slurry arm which can be used to automatically clean the slurry arm with deionized water. Another advantage of the mortar arm of the present invention is to provide a mortar arm, which can be used to greatly reduce the surface area of the mortar arm that may be attached by the mortar. Another advantage of the mortar arm of the present invention is to provide a mortar arm which can be used to reduce the generation of particles. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 metric t) ------ !! λψ ------- --Order --------- line (please first Read the precautions on the back and fill in this page) 534851 A: m 5. Description of the invention (The solution of the skill of the person 丨 This example shows that Shi Shushi is better than using only br, and the prescribed formula is issued. Liben is specially designed for the purpose of improving the effectiveness of f, etc. Only the description of Fan Shenli ’s request for disclosure shall be included in this document.凡凡 修 • 'or perimeter change (please read the precautions on the back before filling this page) if ding If I in n J · en n ϋ m «aB8 iw ΛΜΜ9 I 言 -¾¾ Printed by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs System ο This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

534851 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8 t、申請專利範圍 ι· 一種研漿臂,適用於將來至一研漿提供裝置之一研 漿與來至一清潔液體提供裝置之一清潔液體提供至一化學 機械研磨(chemical mechanical polishing; CMP)機台之一研 磨墊上,其中該研漿臂至少包括: 一主體,其中該主體之一上表面係由複數個斜面組 成,且該些斜面相交於至少一脊線; 一清潔液體通道,自該主體之一端貫穿至另一端;以 及 一喷嘴,其中該喷嘴先穿過該主體之該上表.面再連接 至該清潔液體通道,且該喷嘴具有複數個小孔。 2 ·如申請專利範圍第1項所述之研漿臂,其中該清潔 液體為去離子水。 3. 如申請專利範圍第1項所述之研漿臂,其中該些斜 面與一水平面之一夾角為約8度。 4. 如申請專利範圍第1項所述之研漿臂,其中該些小 孔之數目為約1 6個。 5·如申請專利範圍第丨項所述之研漿臂,其中該些小 孔之形狀為圓形。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) , In In n n n n«f— n i T4 I · n n (ilT先¾讀背面之注意事項再填寫本頁) 訂· .線 534851 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8六、申請專利範圍 6. 如申請專利範圍第1項所述之研漿臂,其中該喷嘴 更具有一螺紋,用以先鎖進該主體之該上表面再連接至該 清潔液體通道。 7. 如申請專利範圍第1項所述之研漿臂,其中更包括 一研漿通道,亦自該主體之該端貫穿至該另一端。 8. —種研漿臂,適用於將來至一研漿提供裝置之一研 漿與來至一清潔液體提供裝置之一清潔液體提供至一化學 機械研磨機台之一研磨墊上,其中該研漿臂至少包括: 一主體,其中該主體之一上表面係由複數個斜面組 成,且該些斜面相交於至少一脊線;以及 一喷嘴,其中該噴嘴先穿過該主體之該上表面再連接 至自該主體之一端貫穿至另一端之一清潔液體通道,且該 喷嘴具有複數個小孔。 9·如申請專利範圍第8項所述之研漿臂,其中該清潔 液體為去離子水。 10.如申請專利範圍第8項所述之研漿臂,其中該些斜 面與一水平面之一夾角為約8度。 1 1.如申請專利範圍第8項所述之研漿臂,其中該些小 (請先閱讀背面之注意事項再填寫本頁) 4 · 線 12 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 534851 A8 B8 C8 D8 t、申請專利範圍 孔之數目為約1 6個。 1 2 ·如申請專利範圍第8項所述之研漿臂,其中該些小 孔之形狀為圓形。 13·如申請專利範圍第8項所述之研漿臂,其中該喷嘴 更具有一螺紋,用以先鎖進該主體之該上表面再連接至該 清潔液體通道。 14.如申請專利範圍第8項所述之研漿臂,其中更包括 一研漿通道,亦自該主體之該端貫穿至該另一端。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)534851 Printed by A8, B8, C8, D8 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics, patent application scope. A kind of mortar grinding arm, suitable for one of the mortar grinding supplies and one of the cleaning liquid supplying devices. The cleaning liquid is provided on a polishing pad of a chemical mechanical polishing (CMP) machine, wherein the slurry arm includes at least: a main body, wherein an upper surface of one of the main bodies is composed of a plurality of inclined surfaces, and the The inclined planes intersect at least one ridge line; a cleaning liquid passage that runs from one end to the other end of the body; and a nozzle, wherein the nozzle first passes through the upper surface of the body. The surface is then connected to the cleaning liquid passage, and The nozzle has a plurality of small holes. 2 · The mortar arm according to item 1 of the patent application scope, wherein the cleaning liquid is deionized water. 3. The mortar grinding arm described in item 1 of the scope of patent application, wherein the angle between the inclined surfaces and a horizontal plane is about 8 degrees. 4. The mortar arm described in item 1 of the scope of patent application, wherein the number of the holes is about 16. 5. The mortar grinding arm described in item 丨 of the patent application scope, wherein the shapes of the small holes are circular. This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm), In In nnnn «f— ni T4 I · nn (ilT read the precautions on the back before filling this page) Order. .Line 534851 Printed by A8, B8, C8, D8, Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 6. Patent application scope. 6. The slurry grinding arm described in item 1 of the patent application scope, in which the nozzle has a thread to lock into the main body first. The upper surface is connected to the cleaning liquid channel. 7. The mortar grinding arm described in item 1 of the scope of patent application, which further includes a mortar grinding passage, which also runs from the end of the main body to the other end. 8. —A kind of grinding arm, which is suitable for supplying grinding liquid to a grinding slurry supply device and cleaning liquid from a cleaning liquid supply device to a polishing pad of a chemical mechanical polishing machine. The arm includes at least: a main body, wherein an upper surface of the main body is composed of a plurality of inclined planes, and the inclined planes intersect at least a ridge line; and a nozzle, wherein the nozzle passes through the upper surface of the main body before being connected A cleaning liquid channel runs from one end of the main body to the other end, and the nozzle has a plurality of small holes. 9. The mortar grinding arm according to item 8 of the scope of patent application, wherein the cleaning liquid is deionized water. 10. The mortar arm according to item 8 of the scope of patent application, wherein the included angle between the inclined surfaces and a horizontal plane is about 8 degrees. 1 1. The mortar arm described in item 8 of the scope of patent application, which are small (please read the precautions on the back before filling out this page) 4 · Thread 12 This paper size applies to China National Standard (CNS) A4 specifications ( 210 X 297 mm) 534851 A8 B8 C8 D8 t. The number of holes in the scope of patent application is about 16. 1 2 · The mortar arm as described in item 8 of the patent application scope, wherein the shapes of the small holes are circular. 13. The slurry grinding arm according to item 8 of the scope of patent application, wherein the nozzle further has a thread for locking into the upper surface of the main body before connecting to the cleaning liquid passage. 14. The mortar grinding arm described in item 8 of the scope of patent application, which further includes a mortar grinding passage, which also runs from the end of the main body to the other end. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is in accordance with China National Standard (CNS) A4 (210 X 297 mm)
TW90127582A 2001-11-06 2001-11-06 Slurry arm TW534851B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI466757B (en) * 2008-10-31 2015-01-01 Applied Materials Inc Self cleaning and adjustable slurry delivery arm
TWI777630B (en) * 2020-06-24 2022-09-11 美商應用材料股份有限公司 Cleaning apparatus, tool, and method for polishing liquid delivery arm, and polishing assembly thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI466757B (en) * 2008-10-31 2015-01-01 Applied Materials Inc Self cleaning and adjustable slurry delivery arm
TWI777630B (en) * 2020-06-24 2022-09-11 美商應用材料股份有限公司 Cleaning apparatus, tool, and method for polishing liquid delivery arm, and polishing assembly thereof
TWI829280B (en) * 2020-06-24 2024-01-11 美商應用材料股份有限公司 Cleaning apparatus, tool, and method for polishing liquid delivery arm, and polishing assembly thereof

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