TW533526B - Method and apparatus to provide for automated process verification and hierarchical substrate examination - Google Patents

Method and apparatus to provide for automated process verification and hierarchical substrate examination Download PDF

Info

Publication number
TW533526B
TW533526B TW090124775A TW90124775A TW533526B TW 533526 B TW533526 B TW 533526B TW 090124775 A TW090124775 A TW 090124775A TW 90124775 A TW90124775 A TW 90124775A TW 533526 B TW533526 B TW 533526B
Authority
TW
Taiwan
Prior art keywords
substrate
optical
page
data
processing chamber
Prior art date
Application number
TW090124775A
Other languages
English (en)
Chinese (zh)
Inventor
Reginald Hunter
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/685,191 external-priority patent/US7012684B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW533526B publication Critical patent/TW533526B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Biochemistry (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Input (AREA)
TW090124775A 2000-10-06 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination TW533526B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/685,191 US7012684B1 (en) 1999-09-07 2000-10-06 Method and apparatus to provide for automated process verification and hierarchical substrate examination

Publications (1)

Publication Number Publication Date
TW533526B true TW533526B (en) 2003-05-21

Family

ID=24751113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090124775A TW533526B (en) 2000-10-06 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination

Country Status (4)

Country Link
JP (1) JP2004529485A (fr)
KR (1) KR100871495B1 (fr)
TW (1) TW533526B (fr)
WO (1) WO2002029390A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408333B (zh) * 2005-12-06 2013-09-11 Shibaura Mechatronics Corp 面粗糙度檢查裝置
TWI664508B (zh) * 2014-07-07 2019-07-01 日商Ｓｍｃ股份有限公司 致動器用之節奏量測裝置，及感測器信號偵測裝置
TWI757907B (zh) * 2020-10-07 2022-03-11 財團法人國家實驗研究院 一種在真空環境中叢集式即時線上製程暨分析傳輸系統
TWI799385B (zh) * 2016-08-03 2023-04-21 美商蘭姆研究公司 用於監視電漿處理系統與先進製程及工具控制的方法及系統
TWI829121B (zh) * 2021-03-24 2024-01-11 日商斯庫林集團股份有限公司 基板處理裝置、解析方法、顯示裝置及程式

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7085622B2 (en) * 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7265382B2 (en) * 2002-11-12 2007-09-04 Applied Materials, Inc. Method and apparatus employing integrated metrology for improved dielectric etch efficiency
JP5002367B2 (ja) * 2007-08-10 2012-08-15 浜松ホトニクス株式会社 光学式検査装置、ピンホール検査装置、膜厚検査装置、および表面検査装置
US9405287B1 (en) * 2015-07-22 2016-08-02 Applied Materials, Inc. Apparatus and method for optical calibration of wafer placement by a robot
WO2021076320A1 (fr) 2019-10-15 2021-04-22 Tokyo Electron Limited Systèmes et procédés de surveillance d'un ou plusieurs caractéristiques d'un substrat
WO2021091634A1 (fr) 2019-11-04 2021-05-14 Tokyo Electron Limited Système et procédé pour étalonnage d'une pluralité de modules de système d'inspection de tranche (wis)
WO2021091635A1 (fr) 2019-11-04 2021-05-14 Tokyo Electron Limited Procédés et systèmes pour surveiller, commander et synchroniser des systèmes de distribution
US20210129166A1 (en) 2019-11-04 2021-05-06 Tokyo Electron Limited Systems and Methods for Spin Process Video Analysis During Substrate Processing
US11276157B2 (en) 2019-11-14 2022-03-15 Tokyo Electron Limited Systems and methods for automated video analysis detection techniques for substrate process
US11624607B2 (en) 2020-01-06 2023-04-11 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208751B1 (en) * 1998-03-24 2001-03-27 Applied Materials, Inc. Cluster tool
US6020957A (en) * 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
US6707544B1 (en) * 1999-09-07 2004-03-16 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408333B (zh) * 2005-12-06 2013-09-11 Shibaura Mechatronics Corp 面粗糙度檢查裝置
TWI664508B (zh) * 2014-07-07 2019-07-01 日商Ｓｍｃ股份有限公司 致動器用之節奏量測裝置，及感測器信號偵測裝置
TWI799385B (zh) * 2016-08-03 2023-04-21 美商蘭姆研究公司 用於監視電漿處理系統與先進製程及工具控制的方法及系統
TWI757907B (zh) * 2020-10-07 2022-03-11 財團法人國家實驗研究院 一種在真空環境中叢集式即時線上製程暨分析傳輸系統
TWI829121B (zh) * 2021-03-24 2024-01-11 日商斯庫林集團股份有限公司 基板處理裝置、解析方法、顯示裝置及程式

Also Published As

Publication number Publication date
KR20040012667A (ko) 2004-02-11
WO2002029390A2 (fr) 2002-04-11
KR100871495B1 (ko) 2008-12-05
WO2002029390A3 (fr) 2003-04-17
JP2004529485A (ja) 2004-09-24

Similar Documents

Publication Publication Date Title
TW511214B (en) Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques
TW511213B (en) Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques
TW522447B (en) Method and apparatus for embedded substrate and system status monitoring
TW512227B (en) Method and apparatus for substrate surface inspection using spectral profiling techniques
TW526574B (en) Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems
TW516146B (en) Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis
US7012684B1 (en) Method and apparatus to provide for automated process verification and hierarchical substrate examination
US6707544B1 (en) Particle detection and embedded vision system to enhance substrate yield and throughput
TW533526B (en) Method and apparatus to provide for automated process verification and hierarchical substrate examination
US7072034B2 (en) Systems and methods for inspection of specimen surfaces
EP1636572B1 (fr) Systemes de controle de plaquettes structurees ou non structurees et d'autres specimens
US6809809B2 (en) Optical method and apparatus for inspecting large area planar objects
US7728965B2 (en) Systems and methods for inspecting an edge of a specimen
US20040032581A1 (en) Systems and methods for inspection of specimen surfaces
US7130036B1 (en) Methods and systems for inspection of an entire wafer surface using multiple detection channels
JP2008032433A (ja) 基板検査装置
JP4876744B2 (ja) 検査装置
CN114144662B (zh) 半导体装置中的内部裂痕的组合透射及反射光的成像
US20240151653A1 (en) System and method for detecting a defect in a specimen
WO2002073173A2 (fr) Systeme et procedes d'inspection de surfaces de specimen
WO2022169673A1 (fr) Amélioration de sensibilité d'inspection de défauts optique et meb

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees