TW533526B - Method and apparatus to provide for automated process verification and hierarchical substrate examination - Google Patents

Abstract

The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one embodiment, a substrate process inspection system comprises a plurality of optical inspection systems each configured to perform an optical inspection process at a first degree of optical resolution and an inspection platform configured to perform an optical inspection process at a second degree of optical resolution. The plurality of optical inspection systems each comprises a transmitter unit and a receiver unit. The substrate process inspection system further comprises a controller system connected to the plurality of optical inspection systems and the inspection platform. The controller system is configured to (i) process optical signal information indicative of a topographical condition on a substrate inspected by at least one of the plurality of optical inspection systems and (ii) in response to the topographical condition, cause execution of one of a plurality of subsequent substrate handling steps. In one embodiment, a first substrate handling step comprises transferring the substrate to the inspection platform for further optical inspection.

Description

533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention () Field of the Invention: The present invention relates to inspection methods and equipment. More specifically, the present invention relates to a method and equipment for inspecting a substrate to identify defective processes and processing conditions. BACKGROUND OF THE INVENTION: The technical field involved in a wafer manufacturing equipment is wide. A wafer storage box for semiconductor wafers is bypassed to various devices in the device for processing or inspection. Generally speaking, semiconductor processing includes processing steps of depositing a material onto a substrate and removing (etching) the material on the substrate. Among them, typical processes include chemical vapor deposition (CVD), physical vapor deposition (pvd), electroplating, chemical mechanical planorization (CMP), and other processes. During the processing of the substrate, the substrate structure and chemical properties change. The aforementioned changes in the substrate include changes in the thickness of each layer deposited on the substrate, changes in the material of the layer formed on the substrate, changes in surface texture, changes in element patterns, and the like. These changes must be controlled in order to form pre-electrochemical features on the substrate. For example, in the last name process, the end point detection method is used to decide when to remove the necessary amount of material from the substrate. Furthermore, successful process processing must ensure correct process parameters to control the process (eg, gas flow, temperature, pressure, electromagnetic energy, processing time, etc.). In addition, the processing environment must be sufficiently stable and free from pollution. The above stains Page 5 (Please read the precautions on the back before filling in this page) · Packing

V. Description of the invention () f Please read the precautions on the back, and then fill in the clothing pages.) Dye sources include abrasion due to mechanical behavior, aging of sealants, polluting gases, other polluting substrates, and peeling in the processing room. Deposited materials, nucleation of reaction gases, condensation during pumping down of the processing chamber, arc reaction in the plasma processing chamber, and other effects. Particles from the above-mentioned pollution sources come into contact with the substrate and cause defects in the component. When the feature geometry shrinks, the impact caused by contamination will rise. As a result, today's semiconductor manufacturing process routines include inspecting substrates to find "dirty" processes and equipment. In addition, during semiconductor processing, in order to obtain the relevant position information of the substrate, the centerfinding and positioning steps of the substrate must be performed. In the conventional system, the above processing program is executed at a specified position in the process system. Therefore, any processing of the substrate must be moved back and forth to reach the designated position, and the system output is reduced. # Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Another situation that causes increased processing costs is that substrates are improperly bypassed in wafer manufacturing equipment. Occasionally, the substrate is bypassed to a processing chamber, where the processing conditions of the processing chamber cause a volatilization reaction, thereby damaging the substrate and / or the processing chamber. For example, consider an example in which a substrate having a photoresist layer is accidentally bypassed to a PVD processing chamber. It is well known that when the substrate is processed in a PVD processing chamber, the processing chamber will be damaged, resulting in increased subsequent repair and replacement costs. Because today's process systems do not prevent substrates from being bypassed improperly, they increase the cost to the process system owner. In today's applications, in a wide range of substrate testing and analysis for process integration and process pollution measurement, one or more substrates need to be periodically or frequently removed from the processing environment to a test environment. Page 6 This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 V. Description of the invention () Therefore, the output will be interrupted during the process of transferring and inspecting the substrate. As a result, traditional measurement inspection methods for wafer manufacturing necessarily lead to increased management time. Furthermore, due to the negative impact of the above inspection methods on the yield and its periodic sampling only, many contaminated substrates were produced without inspection to produce defective components. If a particular batch of manufactured substrates is redispersed, this problem will become more complicated and the source of contamination will be more difficult to find. Therefore, it is necessary to propose a gate-keeper, equipment and method of an integrated measurement and process inspection system, which inspects the substrate by examining certain specific characteristics, which include particles, Process errors, orientation, center positioning, reflectivity, substrate type, discontinuities, etc. are inseparable parts of the process system. The above inspection methods can be used before and during substrate processing. It is better to carry out after the substrate processing to determine the real-time substrate pre-processing and post-processing conditions. Other routine tasks in traditional process systems and inspections include the calibration of robots and inspection equipment. When performing today's calibration methods, it is necessary to interrupt Production lines, which will reduce output. Usually it is not until the catastrophic error 'is known how serious the situation is. A better process system should include an integrated or inlay component that can be continuously monitored Robots and inspection systems, and speed up automatic correction. Therefore, the process system said to further integrate 'increased output. In addition, the above The integrated component is better able to monitor the robot operator. The concerns of robot operation include acceleration, speed, reproducibility, stability, etc. In addition, the first paper size of this integration applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling out this page), I · Binding. Order. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Explanation () The receiving element is better to determine the degree of contamination on the robot carrier tray used to support the substrate during the transportation process. During the substrate management steps or process by-product accumulation, the above-mentioned pollutants will scratch the back of the substrate But in the current process system, the integrated components or methods mentioned above do not exist. Another disadvantage of the traditional inspection system is that the cost of the system is too high. Existing systems are generally independent platforms that occupy clean room space and are expensive. Since the independent inspection platform needs to occupy a large area or "track", the operating cost to own such a system is also high. The cost of particle detection is further increased due to the use of optoelectronic equipment. In order to detect small particles with high resolution, this equipment requires a high-precision mechanism, and the cost of operating the equipment is very expensive. In addition, due to the above-mentioned tradition The inspection system reduces the output and also increases the cost. Therefore, a rapid inspection of the semiconductor substrate and the determination of one or more conditions of the substrate to detect anomalies can facilitate the integration of subsequent substrate management decisions. The system does have its necessity. Purpose and summary of the invention: Generally, the present invention provides a substrate inspection system for use in a substrate processing system. In one aspect of the present invention, at least one optical inspection is used. The system is used to inspect the topography of the surface of the processed substrate. The optical inspection system transmits a characteristic signal representing the topography of the surface of a processed substrate to a process management controller, which is set to operate One or more optical viewing systems. In an embodiment, the process management controller compares the reference value of the substrate. Page 8 This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling this page) Load.% 533526 A7

V. Description of the invention () Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Determine the surface state of a certain substrate. If the characteristics of the substrate exceed a preset value, the substrate is sent to a second measurement review step for more detailed and in-depth analysis. Furthermore, the & Mind Management Controller can use the information to change or optimize the substrate manufacturing process of the process system. In another embodiment, a multiple optical inspection system is used to manage the topography of the substrate surface at different inspection positions along a plurality of substrate transfer paths with a single Kaowang processing controller. The above-mentioned process management system can optimize the output of substrate processing through continuous management and analysis. The integrated viewing system optimizes process parameters through near real-time monitoring of process parameter changes and subsequent effects of processing. An embodiment of the present invention relates to a software control and state output enhancement system for process inspection. The system includes at least a data processing system, and the data processing system further includes a controller including a program for process control. The above program running on the data processing system is used to organize the following steps: In response to a system configuration, organizing an optical viewing system first 'it is used to adjust settings of the optical viewing system; receiving the base from the optical viewing system Topographical information on the surface of the material to determine whether the substrate's surface has exceeded a predetermined value; and if the surface of the substrate has exceeded a pre-set value ', it is determined whether the substrate needs to be further analyzed. An embodiment of the present invention includes a program product including a program for optical feature identification and particle and defect detection. 2. The program is executed by a controller, including the following steps: a system configuration response, organizing an optical viewing system; providing adjustment settings for the optical viewing system; providing a signal from a signal source to a receiver, where Page 9 of this signal (please read the precautions on the back before filling out this page) • Binding. Ordering · Extravagant • This paper size applies to China National Standard (CNS) A4 (210X297 mm) 533526

、 Explanation of invention (The reflection and / or scattering signal characteristics received by the substrate or signal receiver from the surface of the substrate are used to detect surface topography defects. Reflection materials, spectral data, spectral data, two references "one-dimensional to image data, substrate defect information, substrate damage data, particle support data, letters and numbers Symbol characteristic data, machine operation data, robot calibration data, transmission components and / or receiving components, and any of the above combinations are preferred.

In order to further explain the above brief summary, the present invention will be described in detail with reference to the embodiments in the attached drawings. It should be noted that this additional drawing is not only a typical embodiment of the present invention, but is not intended to limit the scope of the present invention. The present invention also includes other equivalent embodiments. FIG. 1A shows a plan view of a typical semiconductor process system. The invention uses such a semiconductor process system to bring benefits; FIG. 1B shows a schematic diagram of a high-level system of a process inspection system; FIG. 1C shows a schematic diagram of a process inspection system. The processing review (please read the precautions on the back before filling this page) · Installation · .Ordering · Printing and printing of several copies printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs & Increasing device proliferation & YU XVU Xueguang Guangyi should be coupled with China 'Mingtong hair is based on the inspection package to make the Tong Guangming Department of the hair system coupler to receive the use of the hair and the receiver to make the reception of all the information shown in Figure 2 And this one. The photo is transmitted through the second part of the package, including the packaged surface and the factory; the workpiece is as small as OM 1A. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 533526 A7 B7 5 3. Description of the invention (3) Figure AC is a top view of the process system shown in Figure 2. During the linear movement of the closed pod container tray, a substrate is shown at various positions on a tray; The figure shows a perspective view of an embodiment of a factory interface of the present invention. The factory interface used in the present invention includes at least a transmission component and a receiving component. Figures 5A-C are top views of the process system shown in Figure 4. During the extended movement of the closed pod-type container carrier tray, a The substrate is located at various positions on a carrier plate. FIG. 6 shows a partial perspective view of an embodiment of a transfer processing chamber of the present invention. The embodiment of the transfer processing chamber of the present invention includes at least a transmitting component and a receiving component. Figures 7A-C are top views of the embodiment of the process system shown in Figure 6. During the extension and rotation of the carrier tray, a basic Figures 8A-C are top views of the process system shown in Figure 6. During the linear movement of the tray, a substrate is shown at various locations on the tray; FIG. 9 is a cross-sectional view of a processing chamber and a cover, illustrating an embodiment of an optical inspection system; FIG. 10 is a cross-sectional view of a processing chamber and a cover, illustrating a Example of an optical inspection system; Figure 11 shows a perspective view of a processing chamber and a cover to illustrate an example of an optical inspection system; page 本 The paper dimensions apply to Chinese National Standard (CNS) A4 specifications ( 210X 297 mm) (Please read the precautions on the back before filling out this page) · Binding · Binding · Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ( Figures 12A-C are cross-sectional views of a processing chamber and a cover shown in Figure 11. During the linear movement of the carrier plate, a substrate is shown at various positions on the carrier plate. Figure 1 3 AC Shown is a cross-sectional view of a processing chamber and a cover, illustrating the process of scanning an optical inspection system on the surface of a substrate, showing various positions of a substrate on a carrier disk; FIG. 14 shows FIG. 15 is a schematic diagram of an embodiment of a substrate detection system according to the present invention; FIG. 15 shows a substrate patterned by a light source, and a spectral intensity distribution diagram; FIG. 16 shows a patterned pattern. A schematic diagram of the comparison of the spectral intensity distribution of a substrate; Figure 17 shows the difference in spectral signal characteristics with respect to the engraved time of 40 seconds; Figure 18 shows the plasma density in the manufacturing process. Schematic diagram of the end point of etching obtained by changing to the basis; Figure 19 shows the change of the average intensity value of various over-etching times, and Figure 20 shows the 5--average intensity value change obtained by continuous inspection of the substrate; The picture shows the eclipse Schematic diagram of the change in the spectral signal characteristics obtained from the peeling time of the photoresist; Figure 22 shows the relationship between the strength and the peeling time compared with a reference substrate; page 12 This paper applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) (Please read the precautions on the back before filling out this page) -Installation-, order · #_ 533526 A7 B7 V. Description of the invention () Figure 23 shows the photoresist after peeling off. The intensity of time shows Siguo. Figure 24 shows the relationship between the reproducibility difference and the system noise. Figure 25 shows a comprehensive schematic diagram of the substrate surface for spectral analysis. Figure 26 shows a system. A schematic diagram of a high-level structure embodiment, the system is configured to perform particle detection and other process management methods; FIG. 27 shows a flowchart of a program control method using the system for process management and particle detection; and 28 The figure shows a flowchart for process management and process report generation. Comparative description of drawing numbers: (Please read the precautions on the back before filling in this page) · Installation 'Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Printed by the Consumer Cooperatives 37 Substrate 41 Cavity 42 Transfer Processing Chamber 44 True 2 Processing Chamber 46 Lens 48 Bearing Disk 50 Robot 51 Hub 52 Cover 53 Projected Light Site 54 Signal Characteristics 56A, 56B Light Sources 58A-D Light Receiver 58 Spectrum Analyzer 60 Light Source 61 Optical Path 62 Beam Shaping Optical Device 64 View Port 66 Disk 69 Signal Feature Page 13 This paper size applies to Chinese National Standard (CNS) A4 (210X 297 mm) 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) · Order · V. Description of the invention 70 Viewport 7 4 Reflective part of the substrate 77 Scattered part of the substrate 82 Detector 90 Input-output cable I 0 0 Processing system 104 Front-end environment 106 Vacuum blocking processing chamber II 0 Transfer processing room II 4 Process processing room 1 2 0 View port 132,134,138 Arrow 141 Optical signal multiplier 150A-F Optical inspection sub-system 1 5 9 Industrial interface 166 Transfer support element Pieces 170 optical accessories 6 1 6 receiver I 1 0 1 process processing room 1104 bottom III 0, 1112, 1114 port 1118, 1120 light source II 3 0 cover 1 122, 1 124, 1 126 window 72 plate 7 5 obstruction 80 Optical accessories 86 Process monitoring controller 92 Leading edge 102 Process system controller I 〇5 Closed. Closed pod container 108A-B Pod container loader 113 Robot II 6 Service processing room 122, 124 Arrow 1 3 5 Inspection platform 143A -H optical fiber cable 1 5 2 user-assisted interface 162 base material manufacturing data server 176 component 2 1 8 frame 1100 cover 1102 side wall 1106 support member III 6 camera 1128 signal characteristic reflection plane 1 1 52- 1 1 54 support Brackets 1 121, 1 123 Optical accessories Page 14 This paper size is applicable to China National Standard (CNS) A4 (210X 297 mm) 533526 A7 B7 (Please read the precautions on the back before filling this page) · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () I 128 inner surface II 5 0 spectrometer 1 300 cover 1 304 bottom 1 307 reflected and / or scattered light 13 10 port 1 3 1 8 rod member 1 400A, B substrate detection system 1430A, B Area 2600 system 2604 driver layer 2608 internal hardware layer 2612 worker interface layer 2622 server processing 2626 process monitoring processing 2630 semiconductor device communication standard interface 2 6 3 6 light source interface 2705-2755 step 2822, 2824 logical path 1130 surface 11 5 5 optical fiber Cable 1 3 02 Side wall 1 3 06 Support member 1 3 0 8 Connecting member 1 3 1 2 Medium 1 3 2 5 Scanning member 1410A, B Detector 2505-2540 Substrate area 2602 Application layer 2606 Hardware interface layer 2 6 1 0 External hardware layer 2620 Graphic user interface 2624 Particle detection processing 2628 Database 2632 Reporter interface 2634 Camera interface 2700 Method 2805-2820, 2825-2856 Steps Detailed description of the invention: The embodiment of the present invention is used for multiprocessing This is especially true for laboratory process systems (for example, a cluster of tools). Commonly used in semiconductor industry page 15 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) 533526 A7 V. Description of invention It is called a cluster tool, which is suitable for supporting the detection equipment described here. The cluster tool is a modular system including at least multiple processing chambers, which can perform various functions, including: finding and positioning the center point of the substrate, and degassing (Degassing), annealing, deposition, and / or etching. These multi-processing chambers are used in conjunction with a central transfer processing chamber, where the transfer processing chamber has a robot for transferring substrates between the processing chambers. 15 The transfer processing chamber. It is typically maintained in a vacuum state and is used as a transition stage for transferring substrates from one processing chamber to another processing chamber and / or a vacuum barrier, where the vacuum barrier is located at the front of the cluster tool. Figure 1A shows A plan view of a typical semi-conductor system system 100 'The present invention can use such a semiconductor process system to bring benefits. Centura® and Endura® are The two platforms of the process system 100 are described, and both are purchased from American Applied Materials. A detailed description of this stage vacuum substrate manufacturing system can be found in the US patent application 5 1 $ 6 71 "Staged-Vacuum Wafer Processing The contents of System and Method are disclosed here, and the content of the application is incorporated here as the actual arrangement and combination of the reference data processing room, which will be changed depending on an execution step of the manufacturing process. In the embodiment of the present invention, the process system 1 00—Generally includes at least several processing chambers and robots, and preferably has a process system controller 丨 02 to perform various processing methods in the process system 1 00. A front-end environment (also referred to herein as a factory interface ( (Factory Interface), or indicated) can be selectively connected with a pair of vacuum barrier processing chambers 106. Pod container loaders located in the front-end environment 108A-B can page 16 This paper size applies Chinese national standards ( CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling out this page)-Binding, ordering, Chenghuan FI, line 533526 A7 B7 Intellectual Property Bureau, Ministry of Economic Affairs Printed by the Industrial and Consumer Cooperatives. 5. Description of the invention () The substrate is transported between the vacuum blocking chamber 106 and a plurality of closed pod containers 105 in a sexual, rotating and vertical moving manner, and the latter two are supported on the front-end environment 104. Vacuum The blocking chamber 106 provides one of the first vacuum interfaces in the front-end environment 104 and a transfer processing S 110. The two vacuum blocking chambers 106 increase output by alternately connecting the transfer processing chamber 110 and the front-end environment 104. Therefore, when a vacuum blocking chamber 106 is connected to the transfer processing chamber u0, a second vacuum blocking chamber 106 is connected to the front-end environment 104. A robot 113 is provided at the center of the transfer processing chamber 110 to transfer the substrate from the vacuum blocking chamber 106 to one of the process processing chambers 114 and the service processing chamber Π6. The process processing chamber 114 can perform various processes, such as physical vapor deposition, chemical vapor deposition, and etching, and the service processing chamber 116 is suitable for degassing, positioning, cooling, and the like. The provision of several viewports 120 enables the transfer processing chamber 110 to be observed visually. The embodiment of the present invention includes an Optical Inspection Sub-System (OIS) 150 for collecting optical data. The optical inspection system is described below. A 0IS 丨 50 generally includes a transmission component suitable for generating signal characteristics and a reflection (bright field illumination) and / or scattering (dark field illumination) for receiving signal characteristics on the substrate surface. ) Partial optical — receiving component. When used for 1 management, multiple QI g 1 500 can be set up and / or integrated into any position of the process system 1 00, for example: at the industrial interface 104, transfer processing room 110, process processing room 114, and service processing Within the room. Any information received by ΟIS 1 50 can be subsequently processed to determine the various conditions of the substrate as it moves through the process system 1000. Page 17 This paper size applies to Chinese National Standard (CNS) A4 specifications (21〇χ 297 male double) (Please read the precautions on the back before filling out this page) Binding · # 533526 A7 ___ B7 Employee Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the cooperative V. Description of the invention () Each OIS 150 embodiment includes various receivers and transmitters. In one embodiment, the receiver is a charge coupled device (CCD) camera for detecting light in the visible spectral range. The other receiver may be a spectrometer for receiving the incoming light and outputting the characteristics of the wavelength and signal strength of various lights. Taking a red light as an example, most of its components are located in the short-wavelength visible spectrum. The spectrometer typically includes an optical prism (or light tree) interface 'to separate the incoming signal and obtain its optical components, which are successively projected onto a linear CCD detector array device. -An embodiment of the spectrometer may include at least a CCD detector array device ', wherein the CC0 detector array device includes at least thousands of independent t detector elements to receive a spectrum generated by a prism (grating). The relative intensities of the spectral constituents represent all the colors of a substrate surface, substrate surface pattern, or plasma treatment. In another embodiment, the receiver is an optical feature recognition (OCR) receiver. The OCR receiver is used to detect and discern differences between optical characteristics and substrate patterns. The substrate usually has identifiable information on the surface. Typically, the identification data is characteristic data composed of a continuous alphabet and a number. In an embodiment, the 10c R receiver is used to detect the characteristic data and determine whether the substrate with an OCR mark is being properly processed (eg, bypassed to the correct processing room for processing) ). In another embodiment, the OCR receiver is used to correlate related metrics. Each receiver may include at least optical elements to gather and collect the reflection and / or scattering signal characteristics of the substrate. For example, a spectrometer with page 18 (please read the precautions on the back before filling out this page)-binding-binding · #. This paper size applies to China National Standard (CNS) A4 (210x297 public love) 533526 A7 B7 Five Consumers ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a description of the invention () A fiber optic collector is used to receive and transmit the spectrum; or it may be equipped with a" lens perspective system "(for example: a wide-angle lens) to collect a large amount of light; or Can be equipped with special lenses to improve the viewing field of a certain substrate. In addition, the lenses can be arranged to add or collect light. More light collected by a wider field of view can average local differences on the substrate surface. 〇IS 150's transmitters have various configurations during the process review process to suit a particular application. For example, in the process of collecting spectral data, a linear light source is used to irradiate only one part of the substrate, or a flash element is used to irradiate the substrate with flash light. Any transmitter includes a beam focusing optical system to focus and project energy onto a substrate. The various receiver and transmitter embodiments can be used individually or in combination to collect process data in the entire centering system 100. The data collected in the various embodiments is used to monitor the substrate processing status at various stages of the manufacturing process. The operation of OIS 150 is controlled by a process monitoring controller (PMC) 86. As shown in FIG. 1A, PMC 86 is electrically coupled to each OIS 150 through a 10 (input-output) cable 90, of which 10 line 90 is used to send a command signal to the corresponding OIS 150. Furthermore, PMC 86 receives the corresponding 0IS 丨 50 output signal through 10 cables 90. Although the process system controller 10 for the process system 100 is preferably separated from ρ μ c 8 6, in one embodiment of the PMC 86, the pmc 86 can be used as one of the control components of the process system 100. This eliminates the need for additional control components. With the start of a user, PMC 86 continuously monitors and enters page 19. This paper standard applies Chinese National Standard (CNS) A4 specification (2ΐ〇χ 297 公 楚) " Xiong ------ (Please read first Note on the back, please fill in this page again.) Packing.. # 533526 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (〇IS 150? See the base material. If PMC At τ w $, σ “Detection When one or two (for example, a contaminated substrate) is being monitored, a warning message will be displayed, '~ 737 (not shown), and the user will be warned. In addition, the process system control $ 102 can be subject to PMc 86 instructions to transfer the substrate to a certain one: set to 1 for final processing, cleaning, and 4-step inspection. For example ... In the embodiment, the "process" 100 includes a inspection platform 135 for detecting particles, but the inspection The platform < function can be expanded by adding ⑽150 to other parts of UIH, process system, and system 150. The inspection platform 135 is suitable for performing various measurement tasks, such as surface irregularity detection, pattern recognition, spectrum / spectrum analysis, and particle detection. The inspection platform Π5 is an integrated particle surveillance (IPM) system used in many embodiments of the present invention. Generally speaking, IPM is a particle detection platform used by the cluster tool. One of the cores used in the present invention is Excite ™ ', which is from Applied Materials Corporation. When an IPM is performed in accordance with the present invention, the IPM is a process monitoring element that has the capability to monitor the process of the present invention (including any type of process). The 'viewing platform 1 3 5' described above has the capability of particle detection, and its power is not limited to this. In one embodiment, the location of an OIS 150 is a location in which the substrate is run in the process system 100 (the benefits of using a robot), and the location needs to be an accessible and processable location. For example, because Vision 120 provides a robotic tray 48 that enters or leaves a processing chamber (vacuum resistor 106, cooling processing chamber 116, or process processing chamber 114), or an observation field of vision that moves between transfer processing chambers. Itch page 20 This paper size applies Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling out this page) ·· Packing. It can be sent if it can be placed around the room bearing 120 # 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description () A suitable location for OIS 150 can be provided. In the figure, arrows 122, 124 indicate the positions where a substrate can be optically detected using the viewport 20. Among them, the arrow 122 indicates the position where the robot rotates, and the arrow 124 indicates the position where the robot is extended or retracted. In one embodiment, the IS is located on the transfer processing main 110. This embodiment will be fascinated with reference to the sixth The figure illustrates it. In some embodiments, the OIS 150 may be located anywhere in the process system in which the substrate travels. In one embodiment, the worker interface 104 provides additional viewing positions. The viewing positions of the icons are indicated by arrows 1 2 3, 3, 4 and i 3 8 and these arrows 132, 134, 138 are also used to describe the transfer path of the substrate. Arrow 136 indicates that the substrate moves between the factory interface 104 and the closed pod valley device 105; arrows 132 and 138 indicate that the substrate moves between the worker interface 104 and the vacuum blocking chamber 106; and arrow 134 indicates that the substrate moves between the factory interface Within 104 (more specifically, it is moved between the pod container loaders 108A and 108B) "〇IS 150 can be set along any transfer path 1 32,1 3 4,1 3 8 to monitor manufacturing process. However, some embodiments also allow inspection of unmoved substrates, as described below. Figure 1B shows a high-level diagram of a substrate inspection system. In one embodiment, the inspection system includes at least one PMC 86 coupled to a process system controller 102, a process interface 159, a plurality of ISO 150, and an inspection system 135. P M C 8 6 is used to control and monitor 0IS 1 50. The user-assisted interface 1 52 can be operated independently, so an operator can independently control P M C 86. In one embodiment, the interface 152 is a graphical user interface (GUI). The process monitoring data is directly on page 21 via cable 90 (please read the precautions on the back before filling this page). One pack ·, OK · # · This paper size applies Chinese National Standard (CNS) A4 specification (21〇χ 297 (Public love) 533526 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () Obtained from the material manufacturing data server 1 62. For example, in one embodiment, the OIS 150 may include a light source cluster and a receiver. The plurality of light sources 56 and the optical fiber cables 143A-H shown in FIG. 1C, wherein the optical fiber cables 143A-H are coupled to an optical signal. Multiplier 141, the optical signal multiplier 141 is sufficient to communicate with the receiver. The optical fiber is arranged to collect reflected and / or scattered light through the window, and then sends the optical signal to the multiplier 141. The multiplier 141 transmits optical data to the spectrum analyzer 58 in a multiplexed transmission mode, enabling a single receiver to effectively monitor multiple viewing positions. In one embodiment, the receiver is a spectrometer. II. Factory interface In the embodiment shown in Figs. 1, 2, and 4, the transmission and receiving module embodiments of the IS 150 are marked along the arrows 1 3 2, 1 3 4, 1 3 6, 1 3 8 Various substrate moving paths can be set on or inside the FI 104, of course, other embodiments can also be used to bring benefits. Figure 2 is a schematic diagram of ρ I 1 0 4. FI104 includes at least a pod container loader 1088, 1083, OIS 150A, a support assembly 160, and a transfer support element including one of the substrate alignment detectors. 166, and a substrate support 162aFI 104 further includes a frame 218, and the device element 160 is fastened to the frame 2 with a conventional device (such as a bolt, a screwdriver, or a fastener in other conventional technologies).丨 8. Figure 2 is an example of an OIS 150 scanning substrate along arrow 134. An OIS 150A includes at least a pair of light sources 56A, 56B (eg, transmitters), and a receiver 58 on a support assembly 160. Light source page 22 This paper size is in accordance with Chinese National Standard (CNS) A4 specifications (210x297 cm) ^ --- (Please read the precautions on the back before filling out this page) Binding · Binding · # 533526 A7 B7 V. Description of the invention ( ) 5 6 A, 5 6B are set at an angle to provide two kinds of lighting angles. In the illustration, the light source 56A provides front lighting and the light source 56B provides rear lighting. In one embodiment, the light source 56 A, The angle between 5 and 6B is about right angle to minimize the degree of illumination overlap (ie, lighting interference). Light source 56 A, 5 6B may include beam-shaping optical devices (such as lenses and such devices), so that The light beam generated by each light source can be enhanced and adjusted. The light receiver 58 is arranged to receive the light reflection and / or scattering part from the surface of the substrate 37. Among them, the light receiver 58 is selected according to the pre-collected data In the illustrated embodiment, the light receiver 58 includes at least a CCD element, a time delay integration (TDI) camera, a photomultiplier tube (PMT), a spectrometer, an OCR camera, etc. The light receiver 58 May include more suitable for enhanced data collection For example, 'in one embodiment, the light receiver 5 8 A includes a bundle of optical fibers to capture and bypass the light received from the viewing point to the receiver 58. During operation, the base The material 37 is moved between the FI internal positions by the pod container loaders 108A, 108B. The OIS 150A then scans the substrate 37, so that the light receiver 58 receives the reflected and / or scattered light required by the process, As described below, when the substrate 37 is moved between the vacuum blocking chamber 106 and the substrate holder 162, one of the pod container loaders 108 A and 108B places the substrate 37 under the OIS 150A. In order to facilitate the scanning action. In addition, the substrate 37 is preferably scanned when the normal substrate is supported. For example, a normal substrate between the pod container loaders 108A and 108B In the material exchange step, the substrate being transported can be scanned by 01S150A. Page 23 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 Five Description of the invention () The substrate 37 is moved from the pod container loader 108 to a pod container loader 108B. First, the substrate 37 is carried by the pod container loader 108 and is placed on the substrate support In the device 62, the substrate support 162 is used to assist the transfer / exchange process between the pod container loaders 108A and 108B. During this movement, the substrate 37 is hidden by the front-end lighting source 56A In one embodiment, the substrate 37 is moved beyond the middle point to scan the entire surface of the substrate. Figure 3 A-C shows the movement of the substrate 37 during scanning using the front-end illumination light source 5 6 A. FIG. 3A shows the pod container tray 48 immediately after the substrate 37 is moved toward the substrate support 162. At this time, the leading edge of the substrate 37 is located on the signal characteristic path. Therefore, a part of the light source 56A forming the projection light 53 (shown by the shaded area) is intercepted from the leading edge of the substrate. As shown in Figs. 3B-C, the continuous movement of the pod-type container tray 48 causes the projected light 53 to sweep on the surface of the substrate 37. The reflected and scattered light is received by the receiver for processing 'which will be explained below. The pod-type container loader 108B can scan the substrate 37 in the same manner as described above. In another embodiment, the substrate is moved by a single pod-type container loader 108 and operates in conjunction with the two light sources 56A, 56B. For example, when loading a substrate to a substrate support 162 via a pod container loader 108A, the OIS 150A scans the substrate using a front illumination light source 56A; when the substrate is separated from the substrate by the pod container loader 108A When the substrate holder 162 is used, the rear illumination light source 56B is excited to scan the substrate. The receiver 158A receives the reflected and / or scattered light from the substrate when the substrate is placed on the substrate support 162 or the substrate is removed by the pod container loader 08A. Page 24 This paper size applies the Chinese National Standard (CNS) a4 specification (210X297 mm) (Please read the precautions on the back before filling out this page) Order Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 533526 A7 B7 V. Description of the invention () Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative, Figure 4 shows another example of using IS 150B when the substrate moves along the transfer path shown by arrows 1 32, 1 38. . 〇IS 150B includes at least a single light source 56 A (which can include optical devices for beam shaping), and a light receiver 58 °. IS 150C is placed on the device element 160. The light source 56A is used to provide substrate illumination and includes a beam shaping optical device. In one embodiment, when the substrate 37 is moved from the factory interface 104 to the vacuum blocking chamber 106, the receiver 58 transmits the signal characteristics for receiving reflected and scattered light to the pMC 86, as described below. Figures 5A-C show the sequence of scanning using 〇IS 150B. FIG. 5A is a schematic diagram of the pod-type container carrying tray 48 after the substrate 37 moves toward the vacuum blocking chamber 106. At this time, the leading edge of the substrate 37 is located on the signal characteristic path 54. Therefore, a portion of the projected light 53 (represented by the shaded area) is intercepted from the leading edge of the substrate. As shown in Figs. 5B-C, during the continuous movement of the pod-type container carrying tray 48, the projection light 53 scans the upper surface of the substrate 37. The receiver 58 receives the reflected and scattered light, which will be described later. As mentioned above, in all OIS 105 embodiments, the receiver can be a CCD element, a time delay integration (TDI) camera, a photomultiplier tube (PMT), an OCR camera, and any of these devices. One. Generally speaking, CCD, TDI, and PMT are used for the analysis of a certain signal characteristic to collect the difference in image intensity through the substrate and related differences in flake / particle pollution. The spectrometer is arranged to collect the reflected and / or scattered light signal characteristics at the surface of the substrate 37, and is used to generate the output of the color spectrum component of the output. The OCR collects the reflections on the surface of the substrate 37. Please read-Notes on the backside

· I page 25 This paper is in accordance with China National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention () and / or scattered light An output representing the optical characteristics of the upper surface of the substrate 37. In any embodiment, the 'optical element' can be added to bring benefits. In the case of a spectrometer, the collected optical signals can be transmitted through a fiber from a collection point to the spectrometer. In addition, a diffuser lens can be transferred to the fiber to effectively increase the field of view and deliver it to the spectrometer for an average image spectrum. In addition, the 0IS 1 50 receiver can also contain a set of detection elements. For example, a receiver embodiment includes at least a spectrometer and a CCD camera. In the above embodiment, the spectrometer is disposed adjacent to the CCD camera, and the position must conform to the principle that the spectrometer and the CCD camera have the same field of view for the substrate 37. Taking the above embodiment as an example, the data acquisition time when multiple process monitoring methods are in parallel will not increase significantly. The process monitoring method will be explained in more detail below. It should be understood that the relationship between the transmitter (ie, the light source) and the receiver described above is for illustration purposes only. In any of the embodiments described above, the positions of the receiver and the transmitter can be inverted. For example, the OIS 1 50A shown in FIG. 2 may include at least a pair of receivers' and the pair of receivers are disposed at the light sources 56A-B. A light source is then fixed at the receiver 58a. In this embodiment, the receiver is inclined relative to the substrate, and the substrate is located directly below the light source. During operation, the receiver is arranged to receive a portion of reflected and / or scattered light at the surface of the substrate. When the substrate 37 is moved between the pod-type container loaders 108a and B, OIS 150A # conceals the substrate 37, and the reflected and / or scattered light is transmitted by the receiver. Page 26 This paper applies the Chinese National Standard (CNS) A4 specifications (210x297 mm) (Please read the notes on the back before filling out this page)-Binding · Ordering · # 533526 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention () Received for later The processing described in the text. In addition, the movement of the substrate 37 between the pod container loaders is the same as that illustrated in Figs. 3A-C. III. Transfer processing chamber FIG. 6 is a cut perspective view of a process system 1 Q 〇 according to the present invention. The process system 100 includes at least a transfer processing chamber 42 and a true 2 processing chamber 44 (see Figure 3A-C). The transfer processing chamber 42 and the true 2 processing chamber 44 are selectively selected through an aperture 46. The aperture 46 is sealed by a conventional device (for example, the slotted gate window above a slotted gate (not shown). The size of the aperture 46 is based on the principle of allowing the substrate to be transported between them.) The robot 50 is disposed at the center of the transfer processing chamber 42 ′, and the robot 50 includes at least a carrier plate 48 for supporting the substrate j7, and the carrier plate 48 is coupled to the robot center 51 by a frog foot link 39. The robot 50 can rotate the carrier plate 48 along a transfer plane and move it in a radial direction, so that the substrate can be transferred between various positions in the system. The transfer processing chamber 42 and the vacuum processing A 4 4 are used as the process system 1 The composition of 〇〇 is more preferable, for example, it can be the composition of the processing chamber shown in FIG. 1A. Therefore, the transfer processing chamber 42 can be a vacuum blocking processing chamber 106 as a vacuum environment connected with the surrounding processing chambers. Hour 'Vacuum Processing Room 44 is used as an interface processing chamber between a front-end environment and a transfer processing chamber 42; and the transfer processing chamber 42 provides a vacuum environment in which processing chambers can be aligned with each peripheral ring. In addition, the real jade processing A 44 can be a process processing chamber 'If a cooling processing room or page 27, this paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) " --- ................. ....... (Please read the precautions on the back before filling out this page) 533526 A7 B7 Printed by the Consumer Consumption Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Positioning processing room, the following examples will cooperate with the 12A-C. As shown in FIG. 6, a transmission module 56 and a receiving module 58 are externally mounted on a cover 52 of the transfer processing chamber 42. In one embodiment, the transmission module 56 includes A light source 60 and a beam-shaping optical device 62 are provided, and the transmission component 56 is arranged to excite a signal 54 which enters the cavity 41 of the transfer processing chamber 42 through a view port 64. The view port 64 contains at least An empty hole formed in the cover, and the view port 64 is a material that can be penetrated by the signal 54 of the light source 60 A plate member 66 is sealed. In one embodiment, the plate member 66 includes at least quartz glass (Quartz GlassTM) or any light-transmitting medium such as glass, transparent polymer, gallium argon, and such materials. These materials can be processed to make them light-transmissive. During operation, the signal 54 advances parallel to the X-axis direction in Figure 2 and is guided to rotate through the cavity 41 of the transfer processing chamber 42 An upper surface of the substrate 3 7 (or a relative movement relative to the signal characteristic 5 4). This signal when projected on the substrate 37 constitutes a projected light region 53, which will be described later. The size of the projected light region 53 may be different depending on the size of the substrate, and the changing method is to adjust the position between the optical device 62 and the light source 60 for beam shaping. In an embodiment of a light source 60, the light source 60 may be a coherent light source (such as a laser), a non-coherent broadband light source, or other non-correlated narrow-band light sources (such as an infrared light source). In other embodiments, the light source 60 may include an illumination signal, such as a radio frequency signal and a microwave signal. Page 28 This paper size applies to China National Standard (CNS) A4 specification (21 × 297 mm) '— (Please read the precautions on the back before filling this page) [装 · ， 可' # Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the consumer cooperative 533526 A7 A___B7 V. Description of the invention () Generally speaking, the choice of the light source 60 is based on the required scattering intensity, brightness and cost. When a laser light source is used, its laser light source is preferably about 0.8 nm. However, other laser light source wavelengths (for example: 65nm or 680nm) can also be used. In general, the size of the 53 points of the projected light is generally determined by the relative positions of the beam forming optical device 62 and the transmission component 56 to the surface of the substrate. The selection of the 'beam shaping optical device 62' depends on the size of the substrate. In one embodiment, the light spot is focused into a compact light beam, wherein the light beam is wide enough to accommodate the movement (eg, vertical movement) of the carrier disk. Taking a substrate with a diameter of 260 cm as an example, the spot size of the projected light 53 on the upper surface of a substrate is about 1 mm (width) and about 260 cm (length; Y axis) of the substrate width. good. Therefore, after a single scan during operation, the total width of the substrate with a diameter of 260 cm is exposed to the signal 54. However, in other embodiments, only a portion of the substrate is exposed to the signal 54. Take particle contamination detection as an example (a typical source of extreme severe processing chamber pollution, such as flakes (also known as processing chamber excursions), which can generate hundreds of particles that fall on the surface of the substrate in the processing chamber Top). Although it is better to inspect all substrates, successful process inspection only needs to confirm the contamination of some contaminated substrates. In addition, other substrate characteristics (such as film thickness, endpoint confirmation, etc.) The process monitoring can also be used to view the limited surface, that is, "5J". The receiving module 58 is located in the viewport 7 inside a cover 52, and is used to define the substrate 37 as it moves through the cavity 41. Orientation <-page 29 This paper size applies Chinese National Standard (CNS) A4 specifications (21〇 > < 297 Gongchu) (Please read the precautions on the back before filling this page)

533526 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Signal path 6 1. The receiving component 58 is fastened to an energy penetrating disk 72. The material of the energy penetrating disk 72 is determined by the wavelength of the signal 54 and is the same as the disk 66 disposed inside the view port 64. The material is better. For example, when a laser light source with a wavelength of about 808 cm is used, the constituent materials of the disks 66, 72 are selected to be able to accommodate a signal with a wavelength of 808 nm. In operation, the receiving component 58 is arranged to receive the scattering portion 74 of the signal 54 emitted by the substrate 37. The scattered and / or reflected light portion 74 on the upper surface of the substrate 37 is indicated by multi-directional arrows in the drawing, and the angle between the direction of these arrows and the upper surface of the substrate 37 is different, and can indicate the obstacle on the substrate 37. The presence of objects such as contaminated particles or element patterns on the upper surface of the substrate 37. The angle between the direction of travel of the reflective portion 69 and the surface of the substrate 37, which is one of the signals 54, is approximately equal to the incident angle α. The reflecting portion 69 indicates a portion of the signal 54 which is not obstructed when in contact with the upper surface of the substrate 37. The receiving component 58 includes an optical accessory 80. The optical accessory 80 includes at least one or more lenses and a detector 82. The detector 82 of the receiving component 58 is preferably one that includes at least one charge-coupled device (CCD) linear camera. One of the CCD linear cameras is a better choice because at this time, for the entire range of substrates, The angle between the light source and the receiver is maintained, resulting in a uniform lighting receiving environment. In the receiving environment, a CCD linear camera is used to scan a moving substrate, and an image is formed. Although a CCD detector is preferred in use, other detectors may be used in the embodiments of the present invention, including: a time delay integration (TDI) camera or a photomultiplier tube (ρMT). Others Page 30 (Please read the notes on the back before filling out this page) One Pack-Order.% This paper size applies to China National Standard (CNS) A4 (210x297 public love) B7

533526 Α7 5. Description of the invention () In the embodiment, the receiving components 58 and 8 are selected from one or more spectrometers and OC receivers. The above description of the setting of the transmitting component 56 and the receiving component 58 is only used to illustrate that ′ other setting embodiments may also be used. For example, the transmission module 56 and the receiving module 58 shown in FIG. 6 are located outside the cavity 41 of the transfer processing chamber 42. In another embodiment, the transmission module 56 and the receiving module 58 are located in the cavity. 4 1 is inside, so it is located in a vacuum environment; but in another embodiment, a mirror surface may be provided inside the cavity 41 so that the number of critical angles can be increased. The operation example in FIG. 6 can be explained by the top view of the process system 100 in FIG. 7 A-C. Figures 7A-C show various positions of the carrier tray 48 and the substrate 37 during the rotation through the transfer processing chamber 42. Figure 3A shows the carrier disk 48 at the beginning of counterclockwise rotation. At this time, the leading edge 92 of the substrate 37 is located on the signal 54 path. Therefore, a part of the projected light 53 indicated by the shaded area is where the leading edge 92 of the substrate 37 meets the incident light. During the continuous rotation of the carrier plate 48, the projected light 53 scans the upper surface of the substrate 37, and is illustrated in Figs. 3B-C. The projected light 5 3 hits the obstacle 7 5 on the substrate 3 7, and the signal 5 4 forms scattering and reflection. Although the size of the obstacle 75 may be in the order of micrometers, the pattern is exaggerated for clarity. The obstruction 75 may be a thin film of a process chamber, a surface defect (defect such as erosion, dent, etc.), or a characteristic area of a component. The scattering and / or reflecting portion 74 of the signal 54 is then collected by the receiving component 58. When the detector 82 is a CCD, the scattering and / or reflection parts 74 are collected by the receiver optical device 80 '. Then on page 31, this paper size is applicable to China National Standard (CNS) A4 (210X297 mm). tr (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 V. Description of the invention () Imaging on the CCD element, then converting it into an electronic signal and transmitting it to pMe 8 6 For processing. It should be understood that the above sequence of execution steps may be performed before and / or after the processing cycle of the substrate 37 in a process chamber. For example, Figures 3 A-C show a substrate being transferred, which is transferred from a vacuum barrier processing chamber to a process processing chamber along a process inspection bypass path 122,124. In addition, Figures 7A-C show that a treated substrate is transferred to a cooling process chamber or returned to a vacuum barrier chamber 106. In another embodiment, the process inspection action is performed when the robot 50 is retracted or extended along the inspection bypass path 1 24 to enter or leave a process processing room, a service processing room, and a vacuum blocking room. Figures 8A-C show the actions of the review embodiment. Figures 8A-C are top views of the process system 100, which show various positions when the carrier tray 48 and the substrate 37 pass linearly through the processing chamber 44 to the transfer processing chamber 42. f Please read the precautions on the back before filling in this page.) · Binding · Binding · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives. Figure 8 AC is a top view of the process system 100, which shows the carrier plate 48 and the substrate 37. At this time, the carrier tray 48 enters the processing chamber 44 from the transfer processing chamber 42 through the aperture 46, where the processing chamber 44 can be any type of processing chamber, for example: a process processing chamber cooling processing chamber, a metrology processing chamber Or a substrate positioning processing chamber. In FIG. 8A, the linear movement from the vacuum processing chamber 44 to the transfer processing chamber 42 is shown in the load tray 4 8 at the beginning of the operation. At this time, the front edge 92 of the substrate 3 7 is located on the signal 54 path. Therefore, the part of the projected light 53 indicated by one of the shaded areas is cut off from the leading edge 92 of the substrate 37. In order to maximize the exposed surface area of the substrate 37, the paper dimensions on page 32 apply Chinese national standards ( CNS) A4 specification (210X297 male ^ ----- A7

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 V. Description of Invention () When the material 37 leaves the processing chamber 42 at the aperture 46, the signal 54 is better to be able to intercept the material 37. After the carrier tray 48 is fully contracted, the substrate 37 can ensure that almost all of its upper surface is exposed, and the surface area of the substrate scanned by the signal 37 is thus maximized. As shown in Figures 8B-C, during the continuous linear movement of the carrier disk, the 'projected light 5 3 scans the upper surface of the substrate 3 7. The examples in Figs. 4, 7A-C and 8A-C are proposed for illustration. In another embodiment, a combination of a pair of transmitting components 56 and a receiving component 58 is used to monitor the linear movement or rotation of a substrate. This setting can improve the detection accuracy. Those skilled in the art will know that there are still other embodiments of the present invention. Furthermore, when performing the process monitoring method of the present invention, the scanning substrate < a single surface can provide a high degree of accuracy, and other methods can also enhance the process monitoring capability. For example, a robot carrier plate 48 may oscillate or move, so an obstacle can be moved into the field of view of another CCD detection element (or an auxiliary high-resolution camera) of the array element. In addition, the use of a multi-mode camera can be used to automatically change the focal length, field of view, etc. to enhance the ability to observe obstructions. Adding a robot to a multi-detection component group enables additional resolutions for the execution of various surveillance methods. In another embodiment, the OIS 150 is configured to receive the main reflected light from the transfer processing chamber 110 in a gray-field configuration. Figures 9 and 10 show a partial cross-sectional view of the process system 丨 〇 〇, and actually a partial cross-sectional view of a process processing room 114 and the transfer processing room no. Among them, the robot 133 used to carry a substrate 37 page 33 This paper size applies to China National Standard (CNS) A4 (210x297 cm) (Please read the precautions on the back before filling this page)

533526

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, adjacent to the entrance of the processing room 1 1 4. The receiving component 5 8 C and the transmitting component 5 6 in Fig. 9 are fixed to the component 丨 76, and are arranged in a viewing port 120, and have a field of view for viewing the substrate 37. In another embodiment, the receiving component 5 8 D and the transmitting component 56 of FIG. 10 are fixed to the component 176, are disposed in a viewing port 120, and have a field of view for viewing the substrate 37. Among them, the receiver 5 8 c or 5 8 d is preferably any device capable of receiving spectral data. When the substrate 37 is located below the 〇IS 150C, the light emitted by the transmission component 56 is reflected and / or scattered by the upper surface of the substrate 37: when the substrate 37 is located below 〇IS 1 5 〇 as shown in FIG. 10 The light emitted by the transmitting component 56 is the reflection and / or scattering of the upper surface of the substrate 37. In some embodiments, the 'substrate 37 is scanned using an illumination light source 5 6 in the manner described above; but in other embodiments All or substantially all substrates are illuminated by a broadband flash device or similar device. In any case, the reflected light is collected by the receiving unit 58C in FIG. 9 or the receiving unit 58 in FIG. 10 and transmitted to PMC86 for processing. In particular, the collected data is processed to identify the spectral characteristics of the substrate 37, and the detailed steps of the spectral analysis are described below. As an embodiment shown in FIG. 9, the receiving component may be a spectrometer 58C, which is used to receive the incident energy / signal and output the distribution and intensity of its spectral composition to determine the existing energy composition. The spectrometer 58C is coupled to the field of view of the viewing port 66 through an optical accessory 170, where the optical accessory 1 70 includes at least a fiber optic cable and / or a wide-angle lens, and / or astigmatic lenses and other optical devices for focusing, shaping, and Control News Page 34 (Please read the precautions on the back before filling this page) _Package-I .-- Order. # This paper size applies to China National Standard (CNS) A4 (210X297 mm) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Consumption Cooperative 533526 A7 _________B7 V. The invention description () number, so that the spectrometer 58C can see all the substrate 37 and / or part of the substrate 37. According to an embodiment shown in FIG. 10, the receiving component 5 8 C includes at least an OCR camera 58D. 〇cR camera 58D is set to extract the characteristic image of the upper surface of the substrate 37 for identification of the substrate. Features on this substrate include barcodes and other symbol identification marks. The description of this device has been listed above and will not be discussed in detail here. In the embodiments shown in Figures 6,7A-C, 9,10, the transmission module% and the receiving module 58 are located on the transfer processing room or inside the transfer room or inside the room. Other embodiments may also be used. To help. Generally speaking, the transmitting component 56 and the receiving component 58 can be set at any position in the manufacturing system 100, but it must be signaled to the upper surface of the moving or non-moving substrate, and the receiving component 58 can The principle is to detect scattered and / or reflected signals. Multiple transmitters / receivers can be placed throughout the system. IV. Covers Figures 11 and 12A-C show a cover 1100 and are used to illustrate an OIS 150 embodiment. The cover 1100 is set on a (or part of) a process processing room or a service processing room. The cover 1100 contains various devices and features that are part of the OIS 150 in operation. The cover 1100 usually includes a body structure in which the inner part is made of three ports 1110, 11 12, 1114. In an embodiment, a first port 111 can provide a line of sight of a receiving component or camera 111 16, wherein the latter can be a charge coupled device (CCD) for receiving an optical input signal from the interior of the processing chamber. First page 35 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) ----... 丨 · .... 0 ^ ....... 丨 丨 Ίπ .... ..... f Please read the notes on the back before writing this page} 533526 A7 B7 V. Description of the invention () The second port 1112 and the third port 1114 are formed in the cover 1100 to provide one or more The transmission component or light source 11 1 8, 1 1 2 0 can be coupled to the processing chamber through any port and provide light traps (ie, reflections and / or scattered light at the substrate) of the light sources 1118, 1120. Source). In another embodiment, the light sources 1 1 1 8 and 1 1 20 are a combination of an optical fiber and a light source for forming a horizontal light. Each of the camera 1116 and the light sources 1118, 1120 is fixed to the processing chamber using support brackets 1152, 1153, 1154. In one embodiment, the light sources 1118, 1120 may be a halogen light source or other light sources with an operating wavelength range of 400 nm to 750 nm. Each of the ports 1110, 1112, 1114 has an energy penetration window 1122, 1124, 1126 to provide vacuum isolation of the processing chamber, and the cover is located above the processing chamber. In a special embodiment, the cover 丨 丨 i 〇 also includes optical accessories 1121, 1123, the latter located between the windows 1124, 1126 and the light sources 1Π, 1120, respectively. The optical accessories 11 2 1 and 1 1 2 j may be any combination of a mirror, a astigmatism lens, and a lens. The cover 111, which is fixed to the windows 1122, 1124, 1126, the CCD or camera 1116, and the light source 1U8, 1120, can be composed of aluminum metal or other processable materials to meet the utgassing and Need for Porosity Any surface within the β cover 1 1 10 is preferably provided with a predetermined reflective surface by processing or grinding. In one embodiment of the cover member 110, it may be made of a metal material, which may be at least a surface 1130 having a suitable roughness or polishing degree. For the holes used in the light sources 1118, 1120 and CCD 1116, the surfaces are polished. For example, the surface energy processing in the CCD port u10 is based on page 36. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2Ϊ0 × 297 mm ~ (Please read the precautions on the back before filling this page). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 Five Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Invention Description () to 32 RA, the surface energy in the first light source 1114 is processed to 16 RA, and the second light source U The surface energy within 1 2 can be processed to 8 RA ^ All the above surfaces are processed to a certain degree of surface flatness' based on the principle that the secondary light scattering of the light environment returned to the processing chamber can be minimized. Due to a high reflectivity The presence of the surface thus effectively reflects the light through the window 1126 and / or 1124 and leaves the processing chamber. Figures 12A-C show the cover 1 1 0 at the top of a process processing chamber 1101 (eg, a cooling processing chamber). Sectional view of 0. The processing chamber 1 1 0 1 roughly includes a main body of the processing chamber having a side wall 1 102 and a bottom 1 104. A support member H06 can be provided at the bottom of the processing chamber to receive and support a guide. To the processing room Substrate 37. The support member 1106 may include a cooling system (such as a fluid channel and a cooling fluid source) for cooling the substrate, etc. The cover 1110 has an OIS 15 0E, wherein the latter is placed on top of the former, and The former is located at the upper surface of the processing chamber wall and forms a plug at the upper surface of the processing chamber wall. Port 1110 used by CCD 1116—the horizontal line is at a first angle of 01, and the horizontal line is the substrate 37 being guided. The direction to the processing chamber 1101 (that is, a substrate transfer path). The line of sight provided by this angle can see the substrate 37 enters the processing chamber 1101 and is placed on a robotic tray 48. It is used for the light source 1 1 1 8 , 1 1 2 0 any port 111 〇, 1 11 2, 1 1 1 4 angle setting so that a first light source 1 1 1 8 can provide a substrate 3 7 front lighting, and a second light source 1 1 2 The principle of providing the rear part of the substrate is illuminated. The substrate 3 7 is illuminated when it enters the processing room 1 1 0 1 corresponding to c CD 11 1 6. The front and rear lighting can be illuminated simultaneously or separately. Processing chamber i 丨 〇i Page 37 This paper ruler_Specifications (210x297 public love)-..... 0 ^. ............ (Please read the precautions on the back before filling out this page) 533526 A7 B7 V. Description of the invention (printed and introduced or contracted by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs) When returning to the substrate, Zhao Ming > 〒 ..., Ming < (for example, a substrate is introduced and its substrate is retracted). 槔 m2 used to provide the first light source uu is located at the second angle —2 'this Angle and port. And the angle 01 of the camera 1116 is different. Used for the second light source You 1120 (the back-illuminated light source U2〇) port 1 1 1 4 is located at — 篥 = Di Yi angle θ3, the third angle 63 is relative to the transfer plane of the substrate ^ ^ Zhu Yi is ten-sided and & is different from the first included angle and the second cool angle θ2. A signal reflection plane 11 28 ′ is provided on one of the side walls of 4 1114 to make the first light source ii 20 have a relatively steep angle of incidence relative to the substrate, and still make the angle of incidence incident on the substrate 37 meet the requirements. . As shown in the figure, the incident angle of the light beam emitted by the light source 1120 with respect to the substrate 37 is 04. In two embodiments, the direction of the camera 1116 and the light source 18, 112 () can be adjusted automatically (as opposed to manual adjustment). For example, a servomotor or similar actuator (although not shown) integrated into a control system can be used to move various components, adjust the aperture size, and focus from a distance. In the embodiment, the two cameras ㈣ui6 are arranged side by side to increase the viewing field of the substrate, and increase the resolution of the image when arranged in a back and forth arrangement. Any "1112" for the first and second light sources 1118'112G is provided as a light-trapping trap for one of the other light sources. That is, 崞 1114 for the two light sources H20 is used as the first light source, and 8 traps of light reflected and scattered by the substrate surface; similarly, port 1112 for the first light m8 is used as the second light source 1120. The surface of the substrate reflects the trapping light of the politic light. The cover adjacent to the light source 崞 1126, page 38. The paper size is applicable to China National Standard (CNS) A4 specifications (210X 297 public love). The 114th table is source radiation 1130 (please read the / X meaning on the back first) (Fill in this page)

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 __ B7 V. The polished surface of the invention () can also be used as a light capture trap by minimizing the backscattering behavior of light in the line of sight of the CCD Π 1 6 The inner surface of the cover member 1 1 30 adjacent to the light source 1 1 2 6 can be ground to minimize backscattering of light in the main axis of the camera. Any port used for CCD 1116 and light sources 1118, 1120 1 1 12, Π 1 4, 1 1 1 10 can also include filters, such as: polarizers, color spectrum spectroscopy, and other bandwidth selection media. The filter can be placed on the atmospheric side of the window 1 1 2 6, 1 1 2 2, 1 1 2 4 in each opening of Chun 1112, 1114, 1110. In addition, the filter can be placed in or integrated with the windows 1126, 1122, 1124. The filter can increase the contrast intensity between the patterned background and the obstacle on the substrate 37, and reduce the image quality degradation by removing the longer light wavelength that is not focused, or reducing the light reflection component and increasing the scattering component. . For example, 'in one embodiment, a color spectrum filter can be used to enhance or select the collected energy (ie, signal strength) of the obstruction image. If the material on the substrate is blue (such as a photoresist material) and the obstacle is red, a red spectral filter can be used on the light source and the camera to minimize the photoresist material. Associated wavelength intensity and enhanced wavelength intensity associated with the barrier. Linear polarizing filters can be used to distinguish the reflected and scattered components of the received light. For example, when a pattern is observed through a linear polarizer with a 90 ° relative direction, the main scattering component of the light is filtered out. Changes in the diffusing composition represent changes in the pattern structure and / or contamination in the substrate. Filters can be used to enhance optical identification (ie, 0CR). Page 39 This paper is sized to the Chinese National Standard (CNS) A4 (210X297 mm) ............... .... (Please read the precautions on the back before filling out this page) 533526 A7 B7 5. Description of the invention () This feature makes it useful for a variety of purposes. For example, when a filter is used to enhance particle detection, a filter can be used to identify stubborn features (eg, substrate feature recognition). In one embodiment, “the light sources 1 1 1 8 1 2 1 0 and the receiver CCD 1 1 1 6 can each include at least several different calenders to provide different images during multi-substrate scanning” to further enhance the process. Review ability. In another embodiment of the filter and the optical mirror, 'the optical mirror (not shown) is disposed between the CCD 1 1 1 6 and the optical 1 1 2 4. Operation is irrelevant. In Figs. 12A-C, the direction of the first light source 1 1 1 8 for front lighting is at an angle with the sight of C C D 11 1 6. The incident angle of the light source 1 11 8 to the substrate 37 is determined, so the reflected light from the light source 1118 enters the light trapping trap formed by the port 1 1 1 4 of the second light source 11 20. Thus, C C D 1 11 6 only collects reflections and / or scattered light from obstacles on the surface of the illuminated substrate. The remaining reflected light will be absorbed or bypassed by light trapping 11 1 2, 111 4, or reflected off the surface 1 1 3 0. The second light source 11120 projects light to the CCD 1116 at an angle, and illuminates the substrate Π 08 at this angle to generate a backlight. As shown in Figures 12A-C, the second light source 1 120 is disposed at an angle that is opposite to the direction in which the light source 11 20 must project. The first light source 1 1 1 8 irradiates the inner surface 11 2 8 of the signal port 111 4 and reflects it to the substrate 37 at a predetermined angle. The reflected light along the forward projection direction of the second light source 11 20 is reflected into the light trapping trap formed by the first light source 1118. The reflected light caused by the irregularity of the surface of the substrate 37 can be reflected along the line of sight of the CCD 116. '' Page 40 This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling out this page) · Install · OK-Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives Manufacturing 533526 A7

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () 罘 The 12A-C diagram is a first light source 1118 and a second light source n2 0 γ D%. However, the single-light source used (that is, the first light source 111 $ or the first light source Η 20) can have its benefits, depending on the process or substrate used. For example, —the detection of flat substrates may require a single light source. But relatively speaking, it is best to use a% source and polarizer once the patterned substrate is the best. It is generally believed that the embodiment of the two light sources can help the contrast between the images generated by the regular and back lighting to help i reflect the data received and interpreted by the detection system along the line of sight of the camera or c CD, so that the provided The information is sufficient to judge a process. Furthermore, a sweeping action can use one of the light sources m8 and n20 to act on the substrate inserted into the processing chamber; and another scanning action can be used when the substrate 37 is removed from the processing chamber, so that the same substrate 37 can be used. Provides two different visions to enhance process monitoring. Figures 12A-C show a process of "hiding the upper surface of the substrate h08", which shows three positions where the carrier disk 48 extends into the processing chamber ηι. During operation, the optical data collected by the receiver unit U16 (for example: OCR camera) is used to analyze the characteristics of the substrate 37, such as: particles, defects, surface damage, patterns, identification data (for example: digital or The characteristics represented by symbols), etc. The methods for processing the above information are discussed below. In another embodiment, the cover Π 0 0 further includes a spectrometer 1 150. Therefore, in Figs. 12A-C, a spectrometer 1150 is provided near the light source 11 2 0 on the supporting member 11 5 2. The spectrometer 11 5 0 is coupled to a window 1 1 2 6 via a fiber optic cable 11 5 5 in which the fiber optic cable 1 1 5 5 page 41 This paper size applies to China National Standard (CNS) A4 (210X 297) ) ------------- ^ ------- Order (Please read the notes on the back before filling this page) 533526 Α7

5. Description of the invention () The center is not located at the true center, but is close to the main axis of the reflected light of the light source n20 and / or 111 8. In this configuration, the fiber optic cable 11 5 5 captures a large amount of data used to provide other substrates with viewing of multi-frequency light sources. In addition, the spectrometer can be positioned and coupled to any of the windows 1122, 1124, 1126 via an optical fiber cable. V. Scanner Figures 13A-C are cross-sectional views of a cover 1300 'which are used to illustrate an embodiment of the ISO 150 for a process processing chamber 114 (such as a cooling chamber). The processing chamber 114 generally includes a processing chamber body having a side wall 1302 and a bottom 1304. A supporting member 1 3 06 is disposed at the bottom of the processing chamber to receive and support a substrate 37 introduced into the processing chamber. The supporting member 1 3 06 may include a cooling system (such as a fluid channel and a cooling fluid source) for cooling the substrate. 〇IS 150F includes at least a receiver 58, a conveyor 56, a connecting member 1308 on the upper surface of the processing chamber wall, and a sealable seat on the connecting member 1308. The cover usually includes a main body with a port 1310 inside the main body, which is used to provide the sight of the receiver 58 and the transmitter 56. In one embodiment, the port 1310 is sealed with an energy penetrable medium 1312 so that the signal 54 can be transmitted by the transmitter 56. The receiver 58 and the transmitter 56 are coupled to each other via a connecting member 1330 to form a scanning member 1325. The position and direction of the receiver 58 and the transmitter 56 are at an angle with each other so that the reflected and / or scattered light π 〇07 can be page 42. This paper size applies the Chinese National Standard (CNS) A4 specification (210x297 public love) (please Read the notes on the back before filling out this page} · Install. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7-B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Enter the receiver 5 8 The dark field illuminator highlighting the light field is preferred. The scanning member 325 includes at least a motor (not shown), and the scanning member 1325 is formed by the rod member 1 3 1 8 along the length of the cover member 1 3 00 and It moves back and forth in the width direction 3. Among them, the rod member 1 3 1 8 is preferably able to make the support member 丨 3 008 completely traverse the substrate 37. Figures 13A-C show an embodiment of a process inspection operation process. Section 13A -C picture is a side view of the processing chamber 114, which shows the different positions of the scanning member 1j25 in the process processing chamber 1 丨 4. Figure 13A is a side view of the member 1300 to show the process processing i 中 Π4 supporting element 1308 and the substrate 37 located thereon. Figure 7A shows the scanning member 1 3 25 after the linear movement is started. At this time, the leading edge 92 of the substrate 37 is located on the path of the signal 54. The process processing chamber 1 1 4 can be any type of processing chamber, for example: a cooling A processing chamber or a substrate positioning processing chamber. Furthermore, 〇IS 15 〇F can be located anywhere on the tool 100, or can be located in an inspection / measurement dedicated processing chamber 'for process monitoring. Scanning component 1 3 2 5 Continue to move from one side of the processing chamber 11 to an opposite side. In order to enhance the resolution, continuous scanning can be supplemented with 0IS 150F, and the substrate is scanned to the substrate in a gradual and progressive scanning manner. A new area. The signal 54 thus moves through the substrate 37, and the upper surface of the substrate 37 is thus exposed to the signal 54. Obstacles (particles, patterns, depressions, and such barriers) located on the upper surface of the substrate 37 Object) causes the signal 54 to scatter and / or reflect, and is indicated by arrow 74 1. The scattering portion 74 of the signal 54 is collected by the receiving component 5 8 and then converted into an electronic signal, and page 43 (please read the note on the back first) (Please fill in this page for more details) Binding and binding. # This paper size Printed in Chinese National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (transmitted to PMC 86 for processing. Figures 13B-C show a scan Component 1 3 2:> Continuous linear movement again, at this time, the signal and 5 4 are irradiated on the upper surface of the substrate 3 7. The embodiment shown in Figs. U and 13 is performed by using a process processing chamber u 4. The embodiment can also be used in other areas of the tool, such as: transfer processing chamber 110, vacuum barrier interface and / or factory interface 104. These locations ensure that the substrate is inspected before and after processing without compromising system throughput. VI. Alignment and detection of substrates By identifying certain features on the substrate or the carrier plate, the location of defects on the substrate can be determined. For example, in one embodiment of PMC 86, when the substrate is moved linearly or rotationally, the pMC 86 is programmed to detect the leading edge of the substrate (that is, the substrate curved portion that first enters the field of view of the receiver) and the rear Edge (that is, the last curve of the substrate detected by the receiver during the linear movement or rotation of the substrate). Because the acquisition rate and the field of view of the CC detector element are known, a number of reference points on the edge of the substrate can then form one of two coordinates, namely the X-axis and Y-axis. During the movement of the substrate in the (: (: 0) field of view of the detector, the acquisition rate refers to the straight line acquisition frequency of the camera when generating the image. Of course, when the continuous image is generated, there is no overlap or miss of the substrate image. It is better. Therefore, the output signal of the processed CCD detector is the "optical pattern" of the entire surface of the substrate. The detection array device using the CCD detector can determine the location of defects / obstructions. Paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page) Binding · Ordering · # 533526 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Explanation () Figure 14 shows a schematic diagram of a substrate detection system ι400. 'The substrate detection system 1 400 includes at least two or more sensors' The sensor is used to detect In one embodiment, the detection system includes at least a first detector 1410A and a second detector 1410B. The sensor is used to detect the edge of the carrier disk 48 and move through the sensor 1 4 1 〇A-B substrate. Detection The operation is shown in Figure 14. Figure 14 shows the substrate 37 supported by a carrier plate and moving through the sensor 14iAB. When the substrate moves into the sensor 1410A-B signal During the optical path, the waveform of the output signal changes. The results of the output signal waveform change can be used to determine the presence, location, and movement rate of the substrate. In particular, the detector output signal is a high level Electronic signal for active detection in the state. At the time ti, the output signal of position A changes its signal output waveform from low level to high level to show that the substrate has just been detected. 1 4 1 〇A The high output signal waveform indicates that the sensor 1 4 1 OA detects the carrier disk at time ti. At time t2, the high signal output waveform shows that the carrier disk 4 8 edge passes the detector 1 4 1 0. The low output signal detected by sensor 1 4 1 Ο B indicates that sensor 1 4 1 0B has not detected carrier disk 4 8. Positions C and E are not the edges of carrier disk 4 8 Detector 1 4 1 Ο B. At time t3, the signal output waveform changes to The level indicates that the sensor 1 4 1 0B has detected the edge of the carrier disk. At time t2 and h, the carrier disk has completely passed the detector, and the substrate is in the sensing state! S. When The substrate has an irregular reflection table. Page 45 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297) .... ........ (Please read the precautions on the back before filling out this page) 533526 Test plus time A7 B7 V. Description of the invention () In the front, the area 1 43 0A and 1 43 0B may cause improper time Hair (trigger). At time ti, t2, t3, and t4, 'area 1 430A-B?' 0 is an ignored area.确认 These unique parameters can be identified by confirming and comparing the uniqueness of the edge velocity, width, sensor spacing, and angle of the carrier disk in the time zone. The sensor 1410A or 1410B first detects the signal of the substrate to which α_, '′ is corrected for processing, and thus the direction of travel of the substrate can be known. The method of determining the moving speed of the coil can be obtained by dividing the distance between the two known detectors by 1 Α through the required time for the coil to pass. VII. Results of Equipment Discussion • The foregoing embodiments provide a detection device and method capable of performing on-ihe-fly monitoring of a substrate, and the monitoring work is capable of synchronizing with a process system. In synchronous monitoring, the 'fi-they' inspection method reduces the need for traditional independent inspection platforms for special actuation mechanisms, which are common users of those skilled in the technology. . In other embodiments, the subject is a stationary substrate (eg, a substrate located in a cooling processing chamber). Furthermore, the embodiments of the present invention can also benefit many components of any conventional process system (for example, the robot 113 not shown in Figure 1A) to obtain a stageUss inspection system. In any case, when the process is carried out in the normal and necessary operating sequence, the above-mentioned process monitoring method can be defined at many locations in the process system, because the substrate does not need to be transferred to a separate independent inspection system for inspection, so The reduction of output by monitoring actions is minimized. Because on page 46-..... · Installation ........: Order ......... # (Please read the notes on the back before filling out this page) Intellectual Property of the Ministry of Economic Affairs Printed by Bureau Consumers Cooperative

533526 Α7 ~ -----_ 5. Description of the invention () Therefore, any substrate that passes through the process system can be inspected, which improves the customary technology and can only be sampled periodically in the process, which results in output. Negative impact. In the production process, embodiments of the present invention provide feasible measures to determine whether production should be interrupted and a substrate to be inspected in more detail due to contamination, process-related defects, or bypass errors. Therefore, only additional inspection of the selective substrate is required. If the substrate is confirmed by the system, the substrate does not need to be positioned or adjusted further. Furthermore, when applying the technology of the present invention, traditional features (such as: the transfer processing chamber 'process processing chamber (cooling or positioning processing chamber), and the transfer robot in which the view port is located) or existing systems can be easily modified to meet all requirements. No need to waste modification time, clean up, and re-evaluate. It should be noted that although embodiments of the present invention facilitate dynamic viewing

But other embodiments would rather benefit from a dedicated measurement platform (eg, viewing platform 135 in Figure i A). In particular, the process monitoring methods described below (for example: reflection and / or scattering, and spectral analysis) do not need to rely on a mechanism to be implemented, and can also be performed in a dynamic environment. 0 νπι · Included process monitoring The applicant of this case has found that the viewing elements described herein can be applied to perform various functions required in the process system (achievable and functions of the present invention), such as the determination of selective substrate characteristics. The feature package 4 Pollution, reflectivity, (reflective or scattering) substrate type, discontinuity, ..., page 47 * This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the note on the back first Please fill in this page again for the items} • Installation · ', one: f Participant-Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperative 533526 A7 B7 5. Description of the invention () Finding and performing robot calibration, inspection equipment, and monitoring Robot behavior. Many embodiments of the present invention are provided in the following discussion, but are not limited to these embodiments. Those skilled in the art will be able to easily understand and know other possible implementations. In addition, the present invention can also monitor the process and then further evaluate the process by the inspection system 1 35. After a substrate is processed, each 〇IS 150 produces a spectral signal characteristic, color, etc. to indicate the substrate Situation / Status. In one embodiment, PMC 86 can use the data obtained by OIS 150 to monitor the substrate at any processing step. If a defect is detected under this condition, then p MC 8 6 It can be determined whether the substrate should be sent to the inspection platform 135 for further analysis, or the operator is required to remove the problematic substrate in the system, or continue to make the substrate to the next scheduled processing step. In one embodiment, Inspection platform 丨 3 5 is used to perform test work like OIS 1 50. At this time, not only higher resolution can be achieved, but also all substrates or only a part of the substrate can be inspected. Unless there are extreme serious events that make the process Interruption, otherwise the metrology component can inspect the suspicious substrate under the condition that the process continues, so the output is not significantly affected. The inspection platform 1 3 5 is only one of the places for further inspection of the substrate. Generally speaking, a system can have any number of viewing locations except for ISO 150. Therefore, in some embodiments, a second viewing platform is provided, and even a third viewing platform is provided. According to the above description, the present invention is Provide a device and method for generating timely information on the selective characteristics of a substrate. Inspection of the substrate page 48 This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) (Please read the note on the back first Please fill in this page again for the matter} I · · 装 · · # Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 533526 A7

V. Description of the invention () It is better to carry out before or after the treatment. A better operation method of the present invention can be better understood by referring to FIG. 1A. The optical inspection of the substrate was first performed by the 01S 50 located in the factory interface 104. Therefore, the substrate can be analyzed before it enters the vacuum environment of the process system (the location of the process processing room and the service processing room). When a substrate is transferred from the transfer processing chamber 110 to a process processing chamber 11 or a service processing chamber 116 by the robot 113, the present invention can effectively scan the substrate or retrieve the entirety of the substrate or Partial image. After processing, the substrate is retracted from the process or service processing room, and the substrate is scanned again during this retraction period. In addition, the process results can be judged. For example, the collected substrate sweep images can be used to generate consistency related to the process and can be used to confirm that the end of the process has been reached. Based on the above description, the substrate can be continuously monitored at various locations in the process system 100. In any case, the resulting image can be related to process uniformity, flatness, substrate type, orientation, center finding, discontinuities / edge defects (for example ... substrates due to thermal segregation effects Structural defects that break part of the substrate), reflected or scattered signals, particles present, and other process conditions. In one embodiment, the OIS 150 and the PMC 86 are operated to generate a map of the substrate (eg, two-dimensional or three-dimensional). The map is then analyzed to obtain the structural characteristics of the substrate such as flatness, consistency, and thickness. In addition, any substrate defects or damages (such as notches or cracks) can be detected and mapped. In addition, the use of a color CCD detector and / or spectrometer can enhance analysis performance. Page 49 This paper size is in accordance with Chinese National Standard (CNS) A4 (210x297 mm) (Please read the precautions on the back before filling out this page) * Yes. # Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 5. Description of the invention () In addition, the characteristics of the substrate that can be broken are the optical characteristics of the surface of the substrate. Data related to the surface's optical characteristics can be used to determine whether certain process conditions (such as the end of an inscription process) have been successfully achieved. Because the final shell material is obtained by a near-real the method (that is, approximately at the same time as the process arrives at the end point), a substrate being processed is immediately returned to the ^^ processing 罜 for additional processing), and The substrate is placed close to the processing chamber, so the treated substrate can be returned immediately for reprocessing. But in traditional equipment, the substrate must be sent to a distant location for its end point inspection. A subsequent decision on a substrate that is being processed usually results in discarding the substrate, as the return time of the substrate undergoing additional processing will cause the cost of the growth of Angbe's natural oxides. Furthermore, during the processing of the substrate, the processing time is often extended to prevent potential problems, and the system output may be reduced by β. Therefore, in a processing process, the present invention provides a substrate manufacturing process and Near real-time information after the process. Since this information is generated in near real-time, the management of defective substrates can be achieved immediately and at a low cost. In addition, all substrates are inspected immediately after processing in the system (as opposed to the selection of certain substrates in a batch of substrates for processing), so the obtained data can be used for other identified substrates and The process environment is quickly corrected to define issues. As a result, near-instant process monitoring can optimize process parameters / strategies and approach process tolerance, resulting in increased output. According to the above description, 'This equipment can be used as the gate-keeper of a process system' to continuously perform the characteristics of the substrate and the system. Page 50—The standard of this paper applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) ^ --- ----:… ..... • Equipment ........: Order ......... # '. (Please read the note on the back first Please fill in this page again for details) 533526 A7 B7 Five invention descriptions (in the standard case, this is divided into *. ,, and yang. Such an opportunity, # can not have a negative impact. Check the classification task. When the process event can not meet the acceptable, you can view the platform 1 3 5 or a similar inspection platform. Additional systems can indeed increase the determination of the most diverse process processing results in the field management bypass defects without causing any output A. Reflection analysis In one embodiment, reflection and / or scattering For information

-A material characteristics. Such an embodiment is useful for patterned substrates, where the patterned substrate has a topological difference and thus is particularly suitable for scattering of incident light. For the inspection of the patterned substrate, the present invention generates a unique signal characteristic intensity distribution through the patterned substrate through the ",", and the " " number characteristic is generated by the pattern / structure on the substrate. The topological patterns of the patterns formed on the substrate by pw are substantially the same because the signal characteristics of any substrate treated by the same treatment are approximately the same, and the substrates treated by other methods are different. Therefore, this is the only 〜 ～ 绫 绫, β 征 征 can be mixed in the memory, and used to compare the bases of the production process, " ^ the surface shape of the substrate. In addition, the final "η, This feature can be used as a dynamic reference substrate (or calibration substrate). … Figure 15 shows-3 million data points of the substrate obscuration, to show the reflection and / or scatter signal characteristics 150 obtained by scanning a calibration substrate according to the above-mentioned description technique, in which the intensity is shown on the axis) and the number of occurrences ^ Axis), these measurement results are obtained by detection equipment. Alas, two different test substrates were scanned in a comparable manner, and thus two = identical reflected signal characteristics were generated. In order to determine the relative state of the surface of the two test substrates, the signal characteristics are compared with the signal characteristics of the calibration substrate. Figure 丨 ^ Page 51 533526 A7 B7 5. The chart curve 152 of the description of the invention (152, 154) is the result obtained by calibrating the number of occurrences of each strength of the two substrates at the same intensity. Therefore, the first chart 15 2 indicates the difference between the first test substrate and the calibration substrate recorded by the detection device 1 'the difference value appears to be minimal; and the second chart 1 5 4 indicates the detection device 1 The difference between the first test substrate and the calibration substrate shows that the difference between them is quite large, which indicates that there is a difference in the surface state of the compared substrates. Reflection and / or scattering data can be collected, for example, as described above with a linear camera (e.g., C C D 1 1 6 shown in Figures 11 and 12A-C). In this embodiment, the linear camera is provided to collect scattered light from the substrate. When the collector is a CCD camera, the CCD detector of the camera may include 4096 pixel elements arranged in a linear array. These components can be used to provide X-axis light intensity values' and Y-axis values are generated by the robot moving the substrate into (or leaving) the cooling processing chamber by collecting a series of data sets (X-axis values). The light intensity value of each pixel in this data set is divided into 2 6 6 levels (that is, 0 to 2 5 5 units), which shows the light intensity collected from a certain substrate site. In this way, each substrate is being scanned (please read the precautions on the back before filling in this page) Some of these alpha numbers are high, and the strong analysis of Baxter's No. 5-16 is possible. The body A is scattered and the super OR is measured. The detective and the child's shot will be retrograde. Logic. The usefulness of Ata · a g. ΙΠ½ ½¾: 歹 It can be directly connected to a certain figure. The strength of the graph can be measured according to the length and length of the graph. The strength can be 5 5 〇 Because 2 ~ of 'ο The structure is shown, and the surface of the example in the figure is applied with a long surface and a solid sheet. The material of the material is stronger than the value of the hair. Page 2 5 Interpretation This paper size applies Chinese National Standard (CNS) A4 Specifications (210X 297 mm) 533526 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () Unique reflection or / and digital signal characteristics of the substrate obtained after processing in a certain way. Data used when When the amount is large, even slight changes in the surface of the substrate can cause reflected or scattered signals Significant changes have occurred. These changes can be graphically shown to understand the differences between the reflected or scattered signal characteristics of these substrates and the signal characteristics of the reference object, where the reference signal characteristics obtained from other characteristics can represent ideal / predictive characteristics. Let the signal characteristics be the principle. When a certain process has confirmed that a certain failure mode exists, the signal characteristics can also be used as a reference material, and the obtained differences are used to indicate the structural changes on the surface of the substrate. Figure 17 The difference between the reflected or / and scattered signal characteristics obtained from a series of over-etching processes with an over-etching time of 40 seconds (nominal time) is shown. For clarity, the distribution / range of the intensity value 25 5 The selected one is displayed as 100. As shown in Figure 17, the different process conditions make the reflection and / or scattering signal characteristics change considerably. For example, when the intensity is less than 8, the etching time is less than the standard. The number of occurrences of 40 seconds is about 26.0 million times more than that of the last time greater than 40 seconds; but when the intensity is greater than 18, the etching time is less than the nominal 40 seconds. If the time is less than 40 seconds, the time is more than several hundred thousand times. In other words, due to the different processing of the substrate, the characteristics / structures are different, and the characteristics of these detection signals are also different. The etching time is less than 40 seconds At this time, the substrate structure has not been fully represented; and when the etching time exceeds 40 seconds, the etching action is acting on the aluminum connection. For clearer explanation, this case uses a traditional etching endpoint map shown in Figure 18, where Various over-etched sections are marked. Page 53 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) — ^ ----- .... ........ ...— ·: Ordering ............ • Refer to (please read the notes on the back before filling out this page) 533526 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Reflected and / or scattered signals can be averaged (Fig. 19) in Table TF to provide you i · / -a · users with a more simplified display style. When the system is processing the substrate, the system's operation observes the average value of a series of events, which are marked with a number of prominent obituaries and out of beta warnings, so that users can quickly learn about the entire process. Figure 20 shows the average intensity value of the substrate, and the intensity value is represented by the average value of δ calculated from the characteristics of a reference reflection and / or scattering woman riding a knee-shaped alum. … The mean value is the weighted average brightness value of the substrate intensity I distribution obtained relative to a reference average brightness value. In (20), those shown are a series of 6 average values of the base material relative to the one + material average. As mentioned above, the eye-catching climbing blanket-r a u alarm and a tf area enable users to quickly know the entire process. Although the above description has been made with respect to the reflection and / or scattering signal characteristics obtained from the etched area having an execution endpoint system, the embodiments of the present invention are also applicable to the monitoring of other process steps that can bring about changes in the structure of the substrate. For example, Figure 21 shows how the reflection and / or scattering signal characteristics change with the peeling resist time. The example substrate is processed in a Centura system with a DSP metal etching processing chamber and an ASP ionization / passivation processing chamber, where the two processing chambers are purchased from Applied Materials Corporation after the etching and peeling process. The hot substrate is sent to a cooling processing chamber to be cooled to near room temperature, and the cooling processing chamber includes an equipment system according to an embodiment of the present invention. Page 54 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before writing this page)

533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () Use the equipment of Applied Materials to perform all steps except for lithographic processing, where the processed substrate includes EPIC substrate. The photoresist / metal stack layer structure on this substrate is: 8000 angstrom DUV photoresistor / 250 angstrom, TiN ARC / 5 500 angstrom, Al-Cu 0.5% / 250 angstrom, TiN / 200 Egyptian Ti thermal oxide / 3000 Angstroms. The dense pattern coverage on the substrate was 50%, and its line width / space was 0.2 5 microns. Any substrate is engraved using typical parameters. This pattern of etching will etch all metal stacks, leaving a photoresist of about 52,000 angstroms on most of the patterned features (3700 angstroms at the shoulders of the patterned lines). When the size of the wafer is reduced, more changes are observed between the stack of thin metal 1 and (especially the logic element) the uppermost metal, and the wafer for communication is more preferable. As for the communication chip, it has an iS metal 1 of 4000 angstroms and an inscription metal with a thickness of 4 micrometers. Therefore, the Asp process must also process all metal stacks', but at this time the yield will be more easily changed by corrosion and changes in the remaining photoresist conditions on the substrate. μ adopts an ASP strategy for experimental purposes. In this strategy, only one processing step is used, that is, only Ηβ is introduced into it, and the pressure when introducing water is lower than that existing in traditional ASP processing chambers. The new parameter used in this strategy is: temperature 250. 〇0.5 Torr pressure, 75 ° sccm h2〇 flow rate, 1 400 watts microwave power, and processing time depending on the specific substrate material. The measurement of the etched substrate is performed at various ASP treatment times of 0.25, 20, 26, 40, 50 seconds and up to 200 seconds. Figure 22 shows the intensity change graph obtained from various processing times of ASP. Page 55 of this paper is based on the Neway Chinese National Standard (CNS) A4 specification (21GX297 public variable) '-(Please read the precautions on the back before (Fill in this page) I ·, \ 呑 # 533526 A7 B7 5. The maximum time shown in the description of the invention () is 50 seconds. In Fig. 22, the measurement of peeling time exceeding 40 seconds is similar to that of 40-50 seconds, and the intensity results exceeding this time are plotted again in Fig. 23. The two figures show that the photoresist is completely removed in 40 seconds. There is no obvious trend in these curves, so the jitter values on these curves are guessed as noise. In order to determine the size of the noise, a single substrate that has been peeled off is inspected six times in succession to determine its reproducibility. This data is shown in Figure 24. If the reproducibility is similar to that of Figure 23, then it can be inferred that the substrate's complete peel time is 40 seconds, and the noise size is limited to a certain envelope; at zero intensity, the noise size is equivalent to 1 5000 occurrences of this, and the value decays with increasing brightness. This curve range can be multiplied by 3 times to provide a 3 σ range curve. Any data exceeding this 3 σ curve is considered statistically valid. In a production facility, the σ value can be applied to any product and can provide a holistic study of the source of variation. In any case, a prominent point with an intensity value of 10 and occurrences of 70,000 occurs at the 26th second of the peeling time, which is more than twice the expected value of the 3σ curve. The above is the reference measurement method for residual photoresistance. The photoresist should be measured on a substrate with a stripping time of 35 seconds, as this signal may be greater than 3 sigma. Therefore, the photoresist thickness on the substrate that can be detected at this time is 700 angstroms. In another embodiment, a moving average of an average value (for example, a box car average) is used. In the production process, the average of subsequent averages is obtained by adding the value of the previous average and dividing it by the subsequent average. Page 56 This paper applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) ) (Please read the notes on the back before filling out this page), τ--Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 V. The total number of invention descriptions (). As long as the average of the average is obtained, the average of the average can be used as a moving reference value to compare with the average of a new substrate. When the average value of the new substrate is within the allowable value range of the average of the average value, a current average value is calculated from a current substrate as described above, and the current average value replaces the previous average value and is calculated. The average of a new reference mean. The warning of the warning control range is continuously maintained to ensure that the average value of the average value does not move up or down and exceeds the process allowable range. By using the optimally processed substrate as a reference signal feature, a variety of experimental strategies can be performed and results can be obtained. At this time, there is no need to perform additional confirmation actions on the substrate. This scanning operation is continued until the signal characteristics are quite close. In addition, the image of the patterned substrate obtained according to the embodiment of the present invention has useful data and can be used to measure other parameters related to the manufacturing of the substrate on the substrate. For example, after the metal surname is etched and stripped / purified, the residual photoresist on the patterned substrate can be detected. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs During the metal etching process, the substrate is etched and stripped off-site. The substrate treated with and is necessary for in-situ peeling and passivation to prevent the etched aluminum metal structure from being corroded. All photoresists need to be removed from the substrate because the photoresist layer has chlorine and is included in the manufacturing atmosphere—in the case of this moisture, the substrate is exposed to the environment and causes rotten names and metal. In a typical manufacturing scenario, this type of corrosion will not occur if the substrate is exposed to the air for 1 hour to 1 day before the subsequent processing steps are performed. P.57 This paper is sized for China National Standard (CNS) A4 (210X297), 533526 A7 B7

5. Description of the invention (5) Printed by a consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in a production environment, using one of the present invention 〇IS 15〇 as a photoresistance detector to prevent any substrates with photoresist remaining Sent to the atmospheric environment 'The behavior of rotten names in the atmospheric environment will occur. The embodiments of the present invention can be used to measure the condition of a large number of substrates, such as large particles, residual photoresistance, and oxide thickness at the edges of the substrate. Embodiments of the present invention can also complete other detection processes, which are limited only by the degree of structural change on the surface of the substrate. In one embodiment, the process system 100 has an inspection system to interconnect with each other to form a network system, and it can track individual substrate data to detect problems with substrate integration. For example, for the deposited oxide at the corner of the substrate, performing a spectral scan from the oxide etch / strip to the metal etch / strip can track the thickness of the oxide. In addition, changes in metal stack thickness and consistency can be tracked. Large particles can be traced through various processing steps, and the hardware that generates the particles can be quickly and accurately identified. If a network-based inspection network is used, the entire production line of the manufacturing process can be monitored at this time. In at least one embodiment of the present invention, a two-level particle detection method is used. Among them, the first-level detection method uses various blob analysis techniques to determine the approximate size and position of particles (represented by pixel events). The data obtained by the above method can be used to determine the similarity of these pixels. The second-level detection method determines the warning and warning conditions by the number of pixel events exceeding a threshold intensity. This analysis technique determines the similar size and location of the particles, and determines the individual pixel intensity limits that produce a warning. Page 58 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) 4 *-— installed ------ order (please read the precautions on the back before filling this page) 533526 Five Ministry of Economy wisdom Printed by A7, B7, and Consumer Cooperatives of the Property Bureau. Invention Description () In one embodiment, the task of maximizing the comparison of obstacles is achieved by selecting a suitable polarized light source and a linear polarizing filter. Among them, the setting of the linear polarizing filter is used to select a light having a difference of 90 degrees from the polarization direction of the polarizing light source to pass through. This "staggered polarization" method can obtain scattered light, and the scattered light is the main component that enters the receiver. Among them, the scattered signal refers to a signal that has been scattered in a scattered form, and this rotation is due to the signal This signal is generated when the signal is irradiated to the surface features / structures of the substrate. The staggered polarization method can be used to selectively remove the reflective component of the reflected light of the substrate, and the scattered light part is highlighted to increase the contrast of the obstacle. The technology can emphasize the degree of light contribution of the structure of the patterned substrate, thus increasing sensitivity to process issues, substrate layer or thickness issues, and / or bypass errors. In another embodiment, changes in the intensity of the reflected signal The detection system is used to highlight the reflected light. One possible source of this reflected light is the micromirror effect existing at the "dishing" on the surface of the substrate, that is, the micromirror on the concave surface transmits light back to the receiver. Demonstrated effect. B. Spectral Analysis In other embodiments, the spectral data obtained from a substrate is useful. Among them, the spectral data can be obtained by a spectrometer (for example, a color CCD camera or other devices in the conventional technology) 'wherein the embodiment described above is using a color image capture device' For example: FIG. 9 And OIS 150 in Figs. 12A-C uses a spectrometer as the spectral data acquisition device. Page 59 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) .....------- Order ......... # (Please read the note on the back first Please fill in this page again) 533526 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () In one embodiment, the spectral data obtained from a known substrate is used to generate a spectral signal, and the reflection signal is also Obtained in a very similar way. The spectral signal indicates the color composition and intensity of the substrate. It is equivalent to the description of the characteristics of the reflection signal, and this color signal characteristic can then be compared with a reference color signal characteristic 'to determine the characteristics of the substrate type and residual material in processing. Figure 25 shows the regions of a substrate 37. The reflection data generated by these regions can identify process problems. For example, the 'substrate region 2 5 5' represents a hash region of the substrates of various electronic components engraved or processed during the processing. The substrate region 2510 is an enlarged view of one of the processed regions of the substrate. The substrate region 2520 is an open region where the substrate 37 is processed, but without any etching treatment. The substrate area 2 5 3 0 is an overall thumbnail of the substrate 37, which is to take all the substrates from a microscopic field of view in a field of view. The substrate region 2540 is shown as another region of the substrate 37, which is the observation field of view of one of the receiving elements of an OIS 150 in the description. When a signal (eg, a light source) is illuminated, all these areas provide spectral data. Different color / spectral signal characteristics can be used to determine the abnormal behavior of the segment and the entire process. For example, when the spectrometer observes, the substrate region 2520 whose normal color is green is taken as an example. During the process inspection of 〇is 150, the spectrometer captured the field of view of the substrate region 2 5 20 from a new substrate, and found that the original color had a blue component. It is generally known that when the thickness of the substrate changes, the change of the color from green to blue-green indicates a process problem, that is, the color change indicates that the layer thickness of the substrate is incorrect. Page 60 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) ........... t ..., ...: order ... · (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 V. Description of the invention () Any display area 2510, 2520, 2530, 2540 indicates different process monitoring points and potential problem. For example, the original color of the substrate region 2520 can represent the change in plasma density during processing. Excessive residual processing can also produce a different spectral signal characteristic. In one embodiment, successive scanning color maps of a substrate are superimposed to prepare a color map outline of the substrate. The color map outline enhances the process inspection function by effectively marking the color change on the substrate. For example, under normal circumstances, a substrate with a uniform and flat twist surface should not change much in color. The color map outline of a substrate can indicate color differences related to the thickness of the substrate and / or plasma processing steps—variation in consistency. In another embodiment, the amount of energy received is a function of the size of the fiber optic cable. For example, as shown in Figure 9, one of the fiber optic cable workers 70 is used to transmit the reflected light at the light source 56, which is composed of several standard optical fiber double-line long fibers. Increasing the number of standard fiber optic cables can increase the signal energy transmitted to the spectrometer 5 8C. In one embodiment, the angle of the detector or fiber optic cable is moved relative to the major axis of the reflected light to enhance a certain color spectrum. Different spectra are material differences related to the topology and / or substrate (thickness of substrate, barrier, form of substrate material, and factors of such substrate). C. Substrate Type Determination and Detour In one embodiment, the present invention determines the type of substrate. As explained above, the substrate pattern provides unique reflection and spectral signatures. The present invention scans the substrate according to the scanning method described above, and uses the paper size on page 61 to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) ---- ----... … Order ......... # f Please read the notes on the back before filling out this page} 533526 A7 B7 V. Description of the invention () Signal characteristics obtained to identify the type of substrate 'and the received signal Send to PMC 86 for processing. Referring to Figure 9 mentioned above, the receiver 5 8 receives the reflected and / or scattered parts of the light to determine the color of the surface of the substrate. The scanned pattern is then compared with previously recorded color and / or spectral signal characteristics to determine the type of substrate. The above application method provides a function to detect substrate bypass errors. For example, 0IS 1 50 detected a substrate with photoresist, which bypassed and reached a physical vapor deposition (PVD) processing chamber, and returned the substrate to avoid a process processing chamber and Potential damage to the substrate. In addition, the identification of the substrate pattern will automatically adjust the process parameters based on the identified substrate type. Furthermore, substrate identification allows the device to automatically select the appropriate test / monitoring criteria for warning and alert conditions. D. j D imaging The present invention can also monitor obstacles in three-dimensional (3D) space. Referring again to the embodiment of FIG. 2, the light source 56A scans the substrate in two or more directions, and then, the light source 56B also scans the substrate in two or more directions. The receiver 58 captures reflection and / or scattering signals from light sources 56A-B including at least two or more different images. When the angles of the light sources 56α · β are approximately at right angles to each other, the light illumination illuminates the obstacles on the surface of the substrate at different angles (that is, perspective). Therefore, the image obtained from the light source 56A is one of the side-related data of the obstacle, and the image obtained from the light source 56B is the opposite side-related data of the obstacle. The light sources 56A-B can be used to scan the substrate in any plane and in any direction of movement. For example, a substrate can be moved on page 62 of the light source 56A. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page). Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 V. Description of the invention () Scanning direction and subsequent movement in the same direction, or ~ silicon moving in different directions (one scanning direction of light source 5 6B). In one embodiment, several light sources are used at different angles to scan the substrate. Using data integration and image processing technology, it is possible to obtain —, an approximately two-dimensional display image of the surface of the coil material ^ This image enables the clothing wind system to clearly define the height of a certain obstacle, or patterned structure, and / or Therefore, the two-dimensional imaging technology can map the substrate table back to the topological state, and compare it with the topological state of other substrates to determine the relative consistency of He Yimian. E. Optical Feature Recognition In another embodiment of the present invention, an Optical Character Recognition (OCR) technology is provided. 〇cr technology uses video imaging to detect and process the features formed by related alphabetic and numeric symbols. The substrate is usually defined by the characteristics shown on its surface. As shown in Fig. 10, the transmitting module (hidden) and the receiving module 58 of the present invention provide a device having the feature of illuminating and detecting, and then transmitting a signal to the PMC 86 for processing. The receiver 58 is configured to receive reflected and / or scattered light. During operation, a substrate is scanned in the manner described above, and the signal feature 54 irradiates the characteristic structure of the substrate, and the signal is reflected and y or scattered according to the geometric characteristic structure of the substrate. As described above, in terms of the arrangement and configuration of the characteristic structure, it has a unique reflection and / or scattering signal. OCR technology usually uses a pattern recognition algorithm suitable for identifying and reading images (eg, features, labels, bar codes, and such images). Page 63 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page) ¥, Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives 533526 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention () F. Alignment and Finding Center In another embodiment, 'determining the orientation and center of a substrate. For a substrate to be processed in a processing chamber, the alignment and finding of the substrate are necessary steps to ensure that it is placed in the proper position. For example, the etch process usually involves the use of a mask, ground ring, or clamp to cover part of the surface of the substrate. In order to not place the cover, ground, or sandwich it on the appropriate part of the substrate, the center of the substrate must be accurately placed in the processing chamber. The curvature of the substrate edge can thus be used to locate and locate the center of the substrate. In addition, typical flat areas or dents on the substrate can be used to change the orientation of the substrate. The conventional way to find the center of a substrate is to use one or more sensors to determine the center of the substrate. Using the present invention makes it easier to find the center of the substrate and reduces its need for additional sensors. In particular, the substrate can be scanned in FI 104 for process monitoring and particle detection. The data received can be processed during scanning, so that the center of the substrate can be found and / or positioned. In one embodiment, the center and orientation of the substrate are found when the substrate is moving. During the contraction, extension, and / or rotation of the carrier disk as described above, a substrate can be illuminated and scanned by the OIS 150 (i.e., the transmitter unit 56 and the receiver unit 58). The diameter and center of the substrate in one embodiment can therefore be determined by PMC 86. For example, 'When a substrate enters a signal path, the leading edge of the substrate is detected due to reflected light. In another embodiment, a substrate is placed in a processing chamber (that is, 'page 64 (please read the precautions on the back before filling this page). · .V-sr · # This paper size applies to China Standard (CNS) A4 specification (210X 297 mm) 533526 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Invention description () The substrate is in a fixed state) and the orientation and center of the substrate are found, where the treatment The chamber may be a cooling processing chamber, a degas processing chamber, or any other processing chamber in a process system shown in FIG. 1A. By placing the substrate in the field of view of the receiver unit 58 ', the center and orientation of the substrate can be found simultaneously. Figures 13A-C show an embodiment of the 0IS 1 50 for finding the orientation and center of an unmoved substrate. Irradiating the surface of the substrate is achieved by moving the OIS component, rather than by moving the substrate. In addition, please refer to Figure 9 and Figure 10. The transmitter can be used to illuminate a sufficient portion of the substrate without moving the OIS component and the substrate (the transmitter unit includes at least a flash element and any respective optical Component). When implemented in this way, the processing chamber can be used as an area for analyzing substrates and perform a process function (such as cooling or exhausting). Therefore, the analysis does not affect the output of the process system. G. Component Calibration In addition to inspecting the substrate, the present invention is also suitable for calibration. In one embodiment, the present invention is used to calibrate a detection element. The irradiation and detection elements used in the present invention may not be consistent, so they must be normalized. In one embodiment, the normalization process is achieved by the following steps. When setting up the OIS 150 (the transmitting and receiving components) for the first time, a substrate was placed down on a robotic tray to provide a scattering surface. The robot then moves the substrate under the OIS 150. During the rotation or linear movement of the carrier, OIS 150 measures the peak-to-peak and root-mean-square values of the passing substrate surface and transmits the values. Page 65 Applicable to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) I ·-· Binding · Order * 533526 A7

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of Invention () to PMC 86. Continue to compare the average readings of any 0IS ho measurements to determine the correction factor required to normalize the system. The substrate is then removed, and the solid portion of the robot carrier disk (ie, including voids and edge portions) is scanned in a similar manner ^, and then the peak value and average intensity value are compared with the normalization correction factor The comparison is performed to determine the appropriate correction factor for the load plate during the concealment process. When the carrier correction factor is an appropriate value, the carrier can be used as a remaining calibration reference. Therefore, OIS 150 (connected to PMC 86) can monitor the vacant carrier tray under normal operation to determine whether the receiver and transmitter are functioning properly. If the receiver and transmitter are contaminated or degraded, perform the background test described above. Furthermore, the flatness and consistency of the carrier can be monitored and confirmed. H. Contamination of the carrier disk In addition, the contamination on the surface of the carrier disk can also be detected through the test of the above embodiment. The presence of contaminants on the carrier tray indicates that some areas of the back of the substrate were scratched while handling the substrate and / or residual process by-products collected on the substrate. Therefore, if contaminants are detected on the carrier disk, the system is interrupted for inspection to avoid further pollution of the process environment. I. Robot Calibration In another embodiment, Oils 1 50 facilitates robot calibration. Robots in the process system (such as the robot in the transfer processing room Π 3) need to be periodically calibrated to ensure normal orientation and alignment. Because OIS 150 is located on the 66th page of a manufacturing system, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ......... ^^ ..... •: Order ......... # (Please read the notes on the back before writing this page) 533526 A7 B7 V. Description of the invention () A fixed place above the system, the OIS The 150 can provide a reference point for PMC 86 transfer process chamber robot calibration. Once the normalization factor of the carrier disk is determined (as described above), the robot position is changed to detect the characteristics of the carrier disk. Velocity and vibration energy are monitored as monitoring / adjusting proportional terms, which are integral and derivative (pIM) values of the motion control system. A sufficient difference between the detected position and the calibrated position stored by the PMC 86 indicates that the carrier is misaligned. This misalignment was automatically corrected. J. Robot Behavior The present invention can also be used to monitor robot behavior. For example, when the robot rotates and passes the optical path 61 (shown in Fig. 6) of the receiver device 58, the edge of the tray closest to the center of rotation will enter the optical path first. This edge then continuously enters the field of view (FOVs) of any of the detector elements at a rate that is determined by the speed of the carrier disk. This method enables OOIS 150 to independently monitor the characteristic behavior of a robot, such as the settlement time, acceleration, and stability that can be measured / monitored. The collected data can set the PID parameters of the robot 113 manually or automatically. Detailed descriptions of other possible applications are not provided here. For example, the present invention can also be used to detect the presence of a substrate on a robotic tray and whether the substrate is held in a sweet manner by a tray to stabilize the substrate during the movement of the tray. Those skilled in the art will recognize that other applications can be implemented with the present invention. Page 67 This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back before filling out this page). · Packing. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. 533526 Economy Printed by the Consumers ’Cooperative of the Ministry of Intellectual Property Bureau A7 B7 V. Description of the Invention () Therefore, the present invention is beneficial to use different components of a typical processing tool to achieve multifunctional integration. Effectively setting one or more OIS units 50 (for example, in a transfer processing center) can perform multi-process management functions. In summary, the present invention provides a multi-purpose device that achieves a fairly high-level system integration and reduces the operating cost of the system. K. First wafer influence A common situation in semiconductor manufacturing is the well-known “First wafer influence”. The first wafer (ie, the substrate) affects the damage to the cleanliness of the processing room when the substrate is buried. The processing chamber must be cleaned periodically to remove residual material that accumulates on the surface of the internal processing chamber over time. However, it was found that the processing results of the previously cleaned substrate were different from those of the subsequent clean substrates. Specifically, the first N substrates obtained after a cleaning cycle show different characteristics from those of the subsequent processed substrates. In summary, the cleanliness of a processing chamber is affected by an aging treatment. The aging treatment is used to bring the processing chamber to an equilibrium state, and then the substrate can be uniformly processed under this equilibrium state. The aging treatment involves operating the processing chamber under process conditions (or improved processing conditions to accelerate the desired results), and coating the surface of the processing chamber with a material. Furthermore, one of the problems in aging treatment is when to decide when the processing chamber is sufficiently aged. An embodiment of the present invention takes into consideration the detection of an end point of the aging process. Specifically, during the aging process in the processing chamber, the substrate is processed in a clean processing chamber. Then, any substrate is inspected with one or more OIS-50. Once the treated substrate shows predetermined characteristics, page 68 of this paper applies Chinese National Standard (CNS) A4 (21〇χ 297 mm), ----------- ^ --- ---- I ^ (谙 Please read the notes on the back before filling this page) 533526 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention () You can know that the processing room is fully aged. L. Output monitoring In another embodiment, 'monitoring of output. Throughput can be monitored by deciding when a known substrate enters the process system and when it leaves the process system (or completes a processing stage in the system). In addition, it is also possible to observe and record the time that the substrate stays in the cooling treatment chamber. Multi-substrate data collected using this method is then used to determine peak output, average output *, frequency of arrival, frequency variability, and other relevant information. M. Process Monitoring Normalization In one embodiment, process differences are normalized. The process system 100 may include several 0IS 150s, each of which monitors a different processing area. Each OIS 150 provides a variable process baseline reading when processing the substrate. After a period of time, a sufficient amount of variation in the value of any 〇IS 丨 50 results in a false process degradation reading and a warning. In order to minimize the number of false alarms, a normalized substrate is sent to the process system and measured by any 0IS 1 50. With this normalized substrate, any OIS 150 differences can be normalized. In one embodiment, a reference wafer is used to calibrate other process systems. For the sake of example, based on a reference substrate value, the same substrate value, or a similar substrate value, the process system 100 can have other known values expected to be obtained by the same process system. Page 69 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) —— '· :::' -...-.........: Order ... · # (Please read the precautions on the back before filling this page) 533526 V. Description of the invention (The data processing system for the printed data processing system of the Employee Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is read by PMC 86 to determine which one should be used. Work. Xi rush 4 execute μ formula is one of PMC 86 software that can be read and the scoop does not produce substrate position data, substrate reflectance information, reflection and dagger information, substrate defect information, substrate damage data, use Yu Pingshui 2 — Graphical information on particle contamination of substrates, used for robotic trays:: Contaminant data, feature data consisting of letters and numbers::, robot behavior data, used for robotics and detection The calibration data of the device and the code of any combination of the above materials are preferred. In a consistent embodiment, the present invention executes a computer program to control _ 86. This program defines the functions stated in this embodiment here, and The program is provided to a computer via each of the media containing the signal. The media containing the signal contains at least (not limited to the following applications): ⑴ fixed on non-writeable storage media (for example: a read-only memory device in a computer, CD-ROM or DVD_ROM device can read Read-only cd_r0m disk); (U) rewritable data stored in m-type media (floppy disk in hard disk drive); or (iii) transmitted to a Data in a computer, for example, via a computer or telecommunications network that includes no communication. In another embodiment of the present invention, the above-mentioned signal-containing medium is used to transmit computer-readable instructions that lead the functions of the present invention. It can also be noted What is more, the present invention, which can develop part of the program and implement it separately, also includes an embodiment combining the above part of the program. Figure 26 shows a high-order structure for a system 2600 configuration. Insert or package ..... M ...... 1-Order ......... f Please read the precautions on the back before writing this page) 533526 A 7 B7 Ministry of Economy Wisdom Printed by the Consumers' Cooperative of the Property Bureau V. Description of the Invention () The examples show that this structure is used To perform particle detection and other process monitoring methods. Although the present invention separately describes the system 2600 and the PMC 86 herein, the system 2600 may be an embodiment of the PMC 86 or may be integrated with the PMC 86. The system 2600 generally includes an application layer 2602, a driver layer 2604, a hardware interface layer 2606, an internal hardware layer 2608, an external hardware layer 2610, and a factory interface layer 2612. Each layer of the system 2600 may contain any combination of hardware and software suitable for supporting a particular function. Generally speaking, the application layer 2602, the driver layer 2604, the hardware interface layer 2606, and the internal hardware layer 2608 are the constituent elements of the optical inspection system (OIS) 150 in the above description. The external hardware layer 2610 is used to represent any system that has been implemented in ISO 150. For example, the external hardware layer 2610 may be the clustering tool described above (please refer to Figure 2 for the factory interface layer 2612 for representing the operation points between the peripheral device, 0is 150, and the external hardware layer 2610. In one embodiment, the factory interface layer 2612 includes a host and a data collection server. The application layer 2602 includes at least a graphical user interface (GUI) 2620, a server process 2622, a particle detection process 2624, and a process monitor Process 2626 and a database 2628. GUI 2620 is a working configuration of a user and server processing interface. In some embodiments, GUI 2620 includes at least a dialog box for data transmitted or requested by the user (shown in A monitor). In particular, GUI 2 622 is used to generate a local request in response to a command issued by the user. The command can be input from any input device (eg, a keyboard, keypad, light pen, page 71 ( (Please read the precautions on the back before writing this page.) Binding · Order · # This paper size applies to China National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 Intellectual Property of the Ministry of Economic Affairs Printed by the employee consumer cooperative V. Description of the invention () Touch screen, trackball, speech recognition device, voice / audio player, and such devices) for input. Part of the request generated by GUI 2 620 is sent to the server The processing is handled as processing. In addition, the server processing 2622 can also receive the request from the remote client by the request received by the local client (for example: GUI 2622). In Figure 26, the selected client is externally hardened. The body layer 2 6 10 and the external interface layer 2612 indicate this. In response to various client requests, the server process 2622 takes steps to generate a response or process the request. For example, a user's command from 2 620 may cause feeding The server process 2622 calls the particle detection process 2624 and the process monitoring process 2626. The two processes are described in more detail below. In addition, the server process 2622 is responsible for the pain in other layers of the system 2 600. The server process 2622 is more It is suitable for the initialization of line system 2600. The initialization process may include reading a configuration file, and the configuration building contains data for configuring the system 600. The configuration file Stored in the database 2628. Therefore, the operation server processes 2622 as a central data management entity for the application layer 2602. In general, the particle detection process 2624 supports particle inspection of the substrate image and generates reports. To achieve this For this purpose, the particle detection process 2 6 2 4 executes one or more particle detection algorithms. For example, the above algorithms include "Blob's" analysis algorithms and "pixel" analysis algorithms. Via remote processing 2 6 2 4 The viewer can be a flat (unpatterned) or patterned substrate. Process monitoring process 2626 Performs one or more process monitoring processes. Page 72 This paper size applies Chinese National Standard (CNS) A4 specifications (210 parent 297 male cage) (Please read the precautions on the back before filling this page). -· # 533526 A7 B7 V. Explanation of the invention () Algorithm, such as average intensity analysis. Generally speaking, the process monitoring process 2 6 2 6 has a long bar view and generates comparison icons. Embodiments of the particle detection process 2624 and the process monitoring process 2626 are described below with reference to FIGS. 27-28. The application layer 2602 communicates with other layers of the system 2600 through one of a variety of interfaces. The application layer 2602 for explanation includes a semiconductor device communication standard (SECS) interface 2630, a reporter interface 2632, a camera interface 2634, and a light source interface 2636. The SECS interface 2630 reorganizes the data between the server processing 2622 and the remote client and circulates the data. The remote client is represented by an external hardware layer 2610 and an external interface layer 2612. The reporter interface 2632 is an interface task responsible for generating a report each time a substrate is viewed, and then storing the report in a local or remote disk storage device. In one embodiment, the magnetic disk storage device is a part of the industrial waste interface layer 2612. The camera interface 2 6 3 4 is an interface that is organized to support the receiving unit (and other detection devices, such as substrate sensors) described above, and the camera interface 2634 is represented by an internal hardware layer 2608. In general, the camera interface 2634 enhances the accuracy of the substrate image, performs process monitoring, and sets the receiving unit. The steps of setting the receiving unit include downloading the receiver settings, focusing the receiver, and adjusting the position (orientation) of the receiver. In addition, the camera interface 2 6 3 4 initially generates a request for the generated report (by the reporter interface 2632). During the operation, the camera interface 2634 receives the transmission from the server processing 2622. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) 、 1 '# Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by 533526 A7 B7 ----- 5. Description of the invention () Instructions for receiving unit operations. The command is then transmitted to the internal hardware layer 2608 via the driver interface 2604 and the hardware interface layer 2606. Then, the command responded by the driver layer 2604 is received by the camera interface 2634 and transmitted to the server for processing 2622. 〆In the embodiment, the driver layer 2604 includes at least a driver for an international instrument image driver (NIIMAQ) and a hardware interface layer 2606. The hardware interface layer 2606 includes at least an RS232 interface and a frame receiver interface card with a TTL transmission port. Grabber Card), each driver layer 2604 is used to support the information that is detoured between the camera interface 2634 of any internal hardware layer 2608. The light source interface 2 6 3 4 is an interface that is organized to support the above-mentioned description transmission unit το, and the light source interface 2634 is shown by an internal hard layer 2608. Generally speaking, the functions of the light source interface 2634 include determining the existing light intensity and adjusting the light intensity. During operation, the data received by the server processing 2 622 is transmitted to a driver in the driver layer 2604 through the light source interface 2634, and then to the card in the hardware interface layer 2606. In the known example, the driver is an Omega ADLIB driver, and the card is a DI / DO card. The internal hardware layer gj ^ # detours to the light source interface in a reverse manner. Although the above description is a single system, the composition of the application layer 2602 is dispersed in a network environment. For example, G u I 620 can be located on a network workstation at the remote end of a computer server, which is used to perform server processing 2622. Particle detector applications and process monitoring applications. Figure 2 7 shows the use of the system 2 600, for process monitoring and granulation. Page 74 This paper is sized for China National Standard (CNS) A4 (210X297 mm) ---------- -^ ......- 一 丨 — ^ Γ ......... (Please read the notes on the back before filling this page) 533526 A7 B7 V. Description of the invention () Sub-investigation, inspection A flowchart of a method 2700 for a control program. For the sake of brevity, process monitoring will be described using reflection analysis only. However, those skilled in the art will recognize other process monitoring embodiments of the present invention that include spectral analysis. When the system 2600 is started, the method 2700 proceeds to step 2705. At step 27, the system 2600 is initialized and ready to receive events entered by the program. At step 2712. The system 2700 receives an event. When proceeding to step 27 1 5, the method decides whether or not to generate a system configuration. System configuration events include storage of organization data, creating defect maps, setting alerts, limiting the number of defects, and other program settings. If a system configuration event has not occurred, method 2700 proceeds to step 2725 in the description below; if a system configuration event has occurred, method 2700 proceeds to step 2720 to obtain and set the system configuration. In step 2720, the behavior of the program can be adjusted, the execution time can be set to track the operation of the program, and other system configurations can be set via the system parameters contained in one or more data structures. In one embodiment, the data structure includes the system configuration that may be stored in a database 2626 (shown in Figure 26). In step 2725, method 2700 determines whether a system setup event has occurred. If a system erection event has not occurred, method 2700 proceeds to step 2735. The system setup events include receiver calibration (such as alignment and focus), setting the receiver sampling rate, setting receiver parameters, and other system adjustments. If a system erection event occurs, how? 70. Proceed to step 2730 to set up the system. For illustration, step 2730 includes the reflected image that can be viewed and adjusted by the user, and the respective signals on page 75. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) " " " " ------------- (Please read the notes on the back before filling out this page) * π · · # Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Employee Consumer Cooperative, 533526 A7 B7 Printed by the Consumer Cooperative of the Property Bureau staff. 5. The static information of the pattern (), so it provides meaningful feedback to the user to adjust the alignment characteristics of the receiver 616. In addition, the receiver sampling rate is set in step 2730. In one embodiment, step 2730 includes allowing the user to individually calibrate and adjust the transfer unit so that the substrate achieves a pre-obtained illuminance. In step 2735, the method 2700 determines whether the event is an event for particle detection or process monitoring. If the event is not an event for particle detection or process monitoring, the method 270 proceeds to step 2 7 4 5. If the event is for particle detection, method 2700 proceeds to step 2740 to detect contaminants on the substrate. An embodiment of the method for particle detection / process monitoring of the present invention is described below with reference to FIG. 28. In step 2745, the method 2700 queries whether the event is a termination event ', such as when a user closes an ongoing application. If the event is a termination event, the method 2700 jumps to step 275 5. Otherwise, the method 2700 processes the event at step 2750 and then returns to step 2 7 12 to obtain the next event. Figure 28 shows a flowchart of a method 2800 for particle detection and process monitoring. The method 2800 proceeds from step 2740 to step 2805. In steps 28 and 10, the PMC 86 is operated to detect the produced substrate. A method for detecting a substrate is described below with reference to FIG. 14. In step 2 8 1 5, scan the substrate or illuminate the substrate and store the generated signal pattern. Examples of scanning / illuminating the substrate have been described previously. In step 2820, method 2800 is based on page 76 collected in step 28 丨 5 (please read the precautions on the back of the vg before filling this page). Binding and sound This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ) 533526 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The information of the invention description () generates a bar graph of pixel intensity (also refer to the existing bar graph here). In addition, one average strength value of the substrate was calculated. Method 2 8 0 follows the pre-executed processing and then proceeds along two logical paths. In the embodiment of particle detection, method 2 8 0 0 arrives at step 2825 through logical path processing 2822; in the practical example of process inspection, method 2 8 0 0 arrives at step through logical path 2 8 2 4 processing 28 50 〇 If method 2800 is processed via path 2822, the data is binarized at step 2825. The binary processing is a two-dimensional representation of a gray-scale substrate image. The gray-scale substrate image is represented by a pixel array value ranging from 0 to 255, where the value of 0 indicates the substrate. The image is black and the value of 2 5 5 indicates that the substrate image is white. By selecting an intensity boundary to binarize a grayscale image, any grayscale image value below the intensity boundary represents black, and any grayscale image value above the intensity boundary represents white. Among them, the limit is mainly determined according to an application. Furthermore, at step 2825, the captured image can be processed and enhanced by filtering noise and other irrelevant signal data. Noise may be caused by substrate distortion and vibration (for example, the substrate is not completely flat or does not remain stationary at all times), and the scattering / reflection signal variations (such as power changes) are inadvertently generated. In addition, changes in the environment of the processing chamber and pollutants (such as floating particles in the processing chamber, degradation of the optical characteristics of the window, heat flow inside the processing chamber, and such factors) can also change over time, resulting in noise. Furthermore, the paper size of the transmission unit 56 and page 77 is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). F Please read the precautions on the back before filling this page.) Pack.-一 poor # 533526 A7 B7 5. Description of the invention () The receiving unit 58 also generates electronic noise (such as electrical noise, white light noise, pink noise, and such factors). Filtering signal noise is a well-known method, depending on the type of noise you want to filter. Among them, some methods of filtering signal noise include the use of digital signal processing (DSP), electrical filters (such as low-pass, high-pass, and such filters), signal sampling, signal averaging, and such technologies will filter To the received signal. Image enhancement is achieved through a conventional spectrum selection algorithm that enhances image contrast and color, or uses spectral filters to block unwanted spectra. In addition, image enhancement processing can also be achieved through DS or other digital enhancement techniques familiar to those skilled in the art. At steps 23 to 80, method 2800 searches for particles in the shadow direction of the substrate based on the intensity and size of the illumination. Blob analysis is used to define the size and location of particles in a region on a substrate by using pixel intensity and proximity values as a means. Steps 2825 and 2830 start Blob analysis. The staff of the Intellectual Property Bureau of the Ministry of Economic Affairs eliminated the cost and printed it with the cooperative. The result of the Blob analysis was then analyzed at step 2835. In addition, the state of the substrate is provided in step 2 83 5. In one embodiment, the substrate state includes a pass inspection state, a warning state, and a failure state. The user is informed of the state of the substrate through voice or video signals. By analyzing the bar graph data and particle data, the method 2800 proceeds to step 2840 to generate a report including a substrate output image, a bar graph data report, and a summary data report obtained by detecting end users. Thereafter, the method is exited from step 2845 to return to method 2700. Return to step 2820, if you choose to go through the logical path 2824, page 78 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 533526 5. Description of the invention ()

Method, the method 2800 will continue to step 28 50 following the wall and Jiayi s H. In step Mα, draw the bar graph data of Zhaoliu p, step 2850 ^ water, produced in step 2820, into a relationship diagram. At step 2852, 'County Xi Qiazhi Mountain λα ε You will make a bar graph with 涊, · and — bar :: line comparison, the result of marginal comparison is used to represent the existing length ... Η Reference bar Difference. In step plus 4, method 2_xu makes out the existing bar graph-averaged intensity trend generated by comparing the reference bar graph. A chart example plots this trend with reference to Figure 20 described above. Then, the steps 2852 and 2854 are analyzed to determine the state of the multiple substrates in the step 2 586 ... the embodiment of the substrate. The state of the substrate includes a pass state, a warning state, and a failure state. Step 2800 then proceeds to step 2840 to generate a report viewable by the end user. The report may include a substrate output image, a bar graph data report, and detection summary data. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In one embodiment, a warning is transmitted to a user by a predetermined event occurring to indicate a defective substrate. Based on the majority of events exceeding the critical intensity defined by the user, the user is allowed to define warning details. Therefore, the detection warning limit can be moved closer to the noise level established by a patterned substrate. Intensity events that exceed this limit are compared with a user-defined quantity limit. If the total event exceeds the number limit, a warning is transmitted. For example, the intensity limit level accumulated throughout the image can be set to 3,500 times (+/- 50 times), exceeding 3 by using a contaminated substrate and obtaining 3,55,5 intensity events'. Warning events will occur at these 5 events of 5,000 times. Therefore, 'when the number of events exceeding this number limit increases, the number of warnings will also increase. Page 79 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economy 533526 A7 B7 V. Description of the invention () Plus. This represents a second orientation quality score and can be used to build confidence zones. In another embodiment, an automatic mode is implemented to define the warning and warning limits. This automatic mode uses static values such as the average intensity or standard deviation of the intensity of the same or more reference substrates. The warning limit can then be determined by these standard deviations based on the user or predetermined primary data. The standard deviation of a flat wafer is smaller than that of a patterned wafer, so the detection limit will be closer to the average. An automated method thus avoids any undesired effects caused by the subjective setting of the warning or warning limit by the user. The foregoing description is based on the preferred embodiments of the present invention. Other or more embodiments do not depart from the basic scope of the present invention. The scope of the present invention is based on the scope of the patent application described later. Page 80 This paper size is in accordance with China National Standard (CNS) A4 (210X297 cm) (Please read the precautions on the back before filling this page)

Claims (1)

533526 ABCD Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. Scope of patent application1. A method of operating a control system, which is connected to an inspection platform and several optical inspection systems, where the inspection platform is first An optical inspection process is performed under the first-level optical resolution, and the optical inspection systems perform an optical inspection process at the second-level optical resolution. Each of the optical inspection systems is located in a substrate processing system. At different locations in the method, the method includes at least the following steps: receiving a process data reading from one of the plurality of optical viewing systems; the process data reading includes at least optical signal data representing a sense of topography on a substrate, wherein The topology on the substrate is obtained by the owner of the optical inspection system; and the process data reading is processed to determine a subsequent substrate management step. 2. The method according to item 1 of the scope of patent application, wherein the step of processing the process data reading to determine a subsequent substrate management step includes at least the following steps: determining whether the process data reading exceeds a predetermined value; and if the The data reading exceeds the predetermined value, and it is determined that there is an unacceptable topology on the substrate. 3. The method as described in item 1 of the scope of patent application, wherein the above optical signal data includes at least substrate reflectance data, reflection data, optical data, substrate defect data, substrate damage data, and particle contamination. Page 81 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm)-. 0 t — — — — — — — III ^^^^ 1 1 ^^ — — — — — INI — • One (Please (Please read the notes on the back before filling this page) 533526 Printed by ABCD Employee Consumer Cooperatives of the Ministry of Economic Affairs Intellectual Property Co., Ltd. 6. Patent application information, letter and number symbol characteristics, non-uniform plasma deposition, and any combination of the above At least one. 4. The method according to item 1 of the scope of patent application, wherein the step of processing the process data reading to determine a subsequent substrate management step at least includes determining whether the substrate needs to be transferred to the viewing platform for the next step Optical inspection steps. 5. The method described in item 1 of the scope of patent application, wherein the above subsequent step is a process end step. 6. The method according to item 1 of the scope of patent application, wherein the step of processing the process data reading to determine a subsequent substrate management step at least includes determining the position of the substrate in the process system to determine the substrate Steps in detour order. 7. A substrate process inspection system, the system includes at least: a plurality of optical inspection systems, each of which performs an optical inspection process at a first-level optical resolution, and each includes at least a transmitter Unit and a receiver unit: an inspection platform that performs an optical inspection processing control at a second optical resolution: and a control system connected to the optical inspection systems and the inspection platform, the control system is used to ：： Page 82 This paper size applies to Chinese National Standard (CNS) A4 (210X 297mm) (Please read the precautions on the back before filling this page) 533526 Printed by A8, B8, C8, D8, and Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. (I) Processing of optical signal data representing the topological state on a substrate. Obtained from the inspection system; and (ii) performing one of several subsequent substrate management steps according to the obtained topology state, wherein a first substrate management step includes at least transmitting the substrate to the inspection plane for Steps for the next optical review. 8. The system described in item 7 of the scope of patent application, wherein any one of the above optical inspection systems is located in a process system and placed along one of the transport paths of the substrate. 9. The system according to item 7 of the scope of patent application, wherein the receiver unit includes at least one of a charge coupled device (C CD) camera and a spectrometer. 10. The system according to item 7 of the scope of patent application, further comprising an input unit for inputting controls for operating the control system. 1 1. The system according to item 7 of the scope of patent application, wherein the control system starts the execution of the first substrate management step, and the first substrate management step includes at least: determining the number of optical inspection systems to collect Whether the optical inspection data exceeds a predetermined value; and page 83, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) 533526 A BCD 6. Information on the scope of the patent application. The topological state of the substrate is obtained through the inspection of at least one of the optical inspection systems; and (Please read the precautions on the back before writing this page. ) (ii) performing one of several subsequent substrate management steps according to the topology state, wherein a first substrate management step includes at least a step of transferring the substrate to the viewing plane for the next optical review; and (d)-input device to enable an operator to start the operation of the controller. 15. The system according to item 14 of the scope of patent application, wherein the cluster tool includes at least a transfer processing chamber and a process processing chamber, the process processing chamber is connected to the transfer processing chamber, and the optical inspection systems At least one of them is located on the transfer processing chamber, and at least one of the plurality of optical inspection systems is located on the process processing chamber. 16. The system according to item 14 of the scope of patent application, wherein any one of the above-mentioned optical inspection systems is located on a process processing chamber and is placed along one of the transport paths of the substrate. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 7. The system described in item 14 of the scope of patent application, wherein the receiver unit includes at least one of a charge coupled device (C CD) camera and a spectrometer. Page 85 This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 533526 ABCD VI. Patent application scope 1 8. The system described in item 14 of the patent application scope further includes an input unit To enter control data for operating the control system. (Please read the precautions on the back before filling this page) 1 9. The system described in item 14 of the scope of patent application, wherein the above control system must perform the first substrate management step, the first substrate management step At least: determining whether the optical inspection data collected by the optical inspection systems exceeds a predetermined value; and if the optical inspection data exceeds the predetermined value, determining that an unacceptable process state of the substrate already exists. 20. The system according to item 19 of the scope of patent application, wherein the optical inspection data includes at least substrate reflectance data, reflection data, spectral data, substrate defect data, substrate damage data, particle pollution data, and letters. And numerical symbol feature data, non-uniform plasma deposition, and any combination of the above. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 2 1 · The system described in item 19 of the scope of patent application, where the above-mentioned unacceptable process state of the substrate exists, the control system executes a system shutdown procedure to The substrate is removed from the process system. P.86 This paper size applies to China National Standard (CNS) A4 (210X 297 mm)