TW533526B - Method and apparatus to provide for automated process verification and hierarchical substrate examination - Google Patents
Method and apparatus to provide for automated process verification and hierarchical substrate examination Download PDFInfo
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Description
533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 發明領域: 本發明係關於檢視方法及設備。更特定而言,本發 明係關於一種檢視基材之方法及設備,以鑑別出有缺陷 的製程及處理狀況。 發明背景: 一晶圓製造設備所涉及的技術領域範圍廣泛。收納 半導體晶圓之晶圓收納盒被繞行至該設備中的各種裝 置,以加以處理或檢視。 一般而言,半導體處理包含沉積材料至基材上,及 移除(蝕刻)基材上的材料之處理步驟。其中,典型製程 包含化學氣相沉積法(CVD)、物理氣相沉積法(pvd)、 電鍍、化學機械平坦化(chemicai mechanical planorization; CMP)姓刻及其它處理。在處理基材過程 中’基材結構及化學性質會產生改變。上述提及之基材 變化包含沉積於基材上的各層厚度的改變、形成於基材 上之層的材料發生變化、表面型態產生改變、元件圖案 產生變化等。這些變化必須加以控制才能在基材上形成 預疋電性特徵之元件。舉例而言,在姓刻處理中,終點 偵測方法係用以決定何時從基材移除必要之材料數量。 再者,成功之製程處理必須確保正確之製程參數以控制 製程(例如:氣體流量、溫度、壓力、電磁能、處理時 間等參數)。 此外,處理環境必須足夠穩定且杜絕污染。上述污 第5頁 (請先閱讀背面之注意事項再填寫本頁) ·裝· 丨丨訂· #. 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 533526 A7533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention () Field of the Invention: The present invention relates to inspection methods and equipment. More specifically, the present invention relates to a method and equipment for inspecting a substrate to identify defective processes and processing conditions. BACKGROUND OF THE INVENTION: The technical field involved in a wafer manufacturing equipment is wide. A wafer storage box for semiconductor wafers is bypassed to various devices in the device for processing or inspection. Generally speaking, semiconductor processing includes processing steps of depositing a material onto a substrate and removing (etching) the material on the substrate. Among them, typical processes include chemical vapor deposition (CVD), physical vapor deposition (pvd), electroplating, chemical mechanical planorization (CMP), and other processes. During the processing of the substrate, the substrate structure and chemical properties change. The aforementioned changes in the substrate include changes in the thickness of each layer deposited on the substrate, changes in the material of the layer formed on the substrate, changes in surface texture, changes in element patterns, and the like. These changes must be controlled in order to form pre-electrochemical features on the substrate. For example, in the last name process, the end point detection method is used to decide when to remove the necessary amount of material from the substrate. Furthermore, successful process processing must ensure correct process parameters to control the process (eg, gas flow, temperature, pressure, electromagnetic energy, processing time, etc.). In addition, the processing environment must be sufficiently stable and free from pollution. The above stains Page 5 (Please read the precautions on the back before filling in this page) · Packing
五、發明説明() f請先閲讀背面之注意事项、再填寫衣頁) 染源包含因機械行為而產生之磨耗、密封劑老化、污染 性氣體、其它污染性基材、處理室中剥落之沉積材料、 反應氣體之成核反應(nucleation)、處理室抽氣下降期間 之凝結作用、電漿處理室中的電弧反應及其它影響。上 述污染源所產生之粒子接觸到基材,並使元件產生缺 陷。當元件特徵之幾何形狀收縮時,將使污染所致之衝 擊上升。因而,現今半導體製造處理例行上包含檢視基 材以找出“骯髒”之處理及設備。 訂· 此外,在半導體處理期間,為了獲得基材相關位置 資訊,必需施以尋找基材中心點(centerfinding)及定位 步驟。在傳統系統中,上述處理程序係在製程系統中的 指定位置執行之。因此,基材要施以任何處理必須來回 移動以到達指定位置,系統產出量因而降低。 # 經濟部智慧財產局員工消費合作社印製 另一種造成處理成本增加的情形是基材被不當地繞 行於晶片製造設備中。偶爾,基材會被繞行至一處理室, 其中該處理室之處理條件會造成一揮發反應,因而損害 該基材及/或該處理室。舉例而言,考量具有一光阻層 之基材不慎繞行至一 PVD處理室的例子。眾所皆知, 該基材於PVD處理室中進行處理時,會造成該處理室 損傷,導致後續修復及置換成本增加。因為現今製程系 統無法防止基材被不當繞行,因此會增加製程系統所有 人所要支付之成本。現今應用上,在用於製程整合及製 程污染量測的廣泛基材試驗及分析中,需要週期性或時 常從處理環境中固定移出一或多個基材至一試驗環境。 第6頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533526 A7 B7 五、發明說明() 因而在轉送及檢視基材過程中,產量會被打斷。因此, 關於晶片製造之傳統量度檢视方法必然導致管理時間增 加。再者,因上述檢視方法對產率的負面影響及其只作 週期性取樣,造成許多受污染之基材在未經檢視下被製 造成具缺陷之元件。若某一批特定之已製造完成的基材 被重新分散,將使此問題變得更複雜,也更難找出污染 源。 因此,有必要提出一種整合型度量及製程檢視系統 之“看門人(gate-keeper),,設備及方法,其係藉由檢視 某些特定的特徵來檢驗基材,該特定的特徵包含粒子、 製程上的錯誤、方位、中心定位、反射率、基材型態、 不連續性等等’其係為製程系統中不可分離的一部位。 上述檢視方法能於基材處理前、基材處理中及基材處理 後進行為佳’藉以決定即時之基材前處理及後處理條 件。 傳統製程系統及檢視中的其它例行工作包含機器人 及檢視設備之校準。在執行現今校準方法時,因需中斷 生產線,因此會降低產出量。通常要到出現災難性的錯 誤時’才會知道情況有多嚴重。一較佳製程系統應包含 一整合型、或鑲崁式元件,其係能持續地監視機器人及 檢視系統的狀禮、並加快自動修正作用。因此,該製程 系統说進一步整合’增加產出量。此外,上述整合型元 件以能監視機器人操作者為佳。機器人操作之關注事項 包含加速性、速度、再現性、穩定性等。此外,該整合 第頂 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁) , I ·裝. 訂. 經濟部智慧財產局員工消費合作社印製 A7 B7 經濟部智慧財產局員工消費合作社印製 533526 五、發明説明() 受元件較佳係能決定輸送過程中用以支撐基材之機器人 承載盤上的污染程度。在基材管理步騾或製程副產物堆 積過程中,上述污染物質會刮傷基材背部。但在現今的 製程系統中,並不存在上述整合型元件或方法。 傳統檢視系統之另一缺點為系統之成本過高。現存 系統一般都是會佔據潔淨室空間且價格昂貴的獨立平 台。由於獨立檢視平台需要佔據大區域或“軌跡”,擁 有此種系統所要支付的操作成本亦較高。進行粒子偵測 時因使用光電設備,成本會進一步增加。此設備係為 了能對小尺寸粒子進行高解析度偵測,因此需要高精確 度機制,操作該設備成本亦非常昂貴。此外,因上述傳 統檢視系統降低產出量之故,也使成本支出增加。 因此,一種快速檢視半導體基材及決定該基材一或 多個條件以偵測異常現象,而有助於後續基材管理決定 之整合系統確有其提出之必要性。 發明目的及概述: 一般而T ,本發明提供一種用於基材製程系統中的 基材檢視系統。在本發明一態樣中,使用至少一個以上 的光學檢視系統以檢視經處理之基材表面拓樸型態。該 光學檢視系統會傳輸可代表在某一處理之基材表面拓樸 特徵訊號至一製程管理控制器,該製程管理控制器係設 置以操作一或多個光學檢視系統。 在一實施例中,製程管理控制器對照基材參考值, 第8頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁) ·裝. % 533526 A7V. Description of the invention () f Please read the precautions on the back, and then fill in the clothing pages.) Dye sources include abrasion due to mechanical behavior, aging of sealants, polluting gases, other polluting substrates, and peeling in the processing room. Deposited materials, nucleation of reaction gases, condensation during pumping down of the processing chamber, arc reaction in the plasma processing chamber, and other effects. Particles from the above-mentioned pollution sources come into contact with the substrate and cause defects in the component. When the feature geometry shrinks, the impact caused by contamination will rise. As a result, today's semiconductor manufacturing process routines include inspecting substrates to find "dirty" processes and equipment. In addition, during semiconductor processing, in order to obtain the relevant position information of the substrate, the centerfinding and positioning steps of the substrate must be performed. In the conventional system, the above processing program is executed at a specified position in the process system. Therefore, any processing of the substrate must be moved back and forth to reach the designated position, and the system output is reduced. # Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Another situation that causes increased processing costs is that substrates are improperly bypassed in wafer manufacturing equipment. Occasionally, the substrate is bypassed to a processing chamber, where the processing conditions of the processing chamber cause a volatilization reaction, thereby damaging the substrate and / or the processing chamber. For example, consider an example in which a substrate having a photoresist layer is accidentally bypassed to a PVD processing chamber. It is well known that when the substrate is processed in a PVD processing chamber, the processing chamber will be damaged, resulting in increased subsequent repair and replacement costs. Because today's process systems do not prevent substrates from being bypassed improperly, they increase the cost to the process system owner. In today's applications, in a wide range of substrate testing and analysis for process integration and process pollution measurement, one or more substrates need to be periodically or frequently removed from the processing environment to a test environment. Page 6 This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 V. Description of the invention () Therefore, the output will be interrupted during the process of transferring and inspecting the substrate. As a result, traditional measurement inspection methods for wafer manufacturing necessarily lead to increased management time. Furthermore, due to the negative impact of the above inspection methods on the yield and its periodic sampling only, many contaminated substrates were produced without inspection to produce defective components. If a particular batch of manufactured substrates is redispersed, this problem will become more complicated and the source of contamination will be more difficult to find. Therefore, it is necessary to propose a gate-keeper, equipment and method of an integrated measurement and process inspection system, which inspects the substrate by examining certain specific characteristics, which include particles, Process errors, orientation, center positioning, reflectivity, substrate type, discontinuities, etc. are inseparable parts of the process system. The above inspection methods can be used before and during substrate processing. It is better to carry out after the substrate processing to determine the real-time substrate pre-processing and post-processing conditions. Other routine tasks in traditional process systems and inspections include the calibration of robots and inspection equipment. When performing today's calibration methods, it is necessary to interrupt Production lines, which will reduce output. Usually it is not until the catastrophic error 'is known how serious the situation is. A better process system should include an integrated or inlay component that can be continuously monitored Robots and inspection systems, and speed up automatic correction. Therefore, the process system said to further integrate 'increased output. In addition, the above The integrated component is better able to monitor the robot operator. The concerns of robot operation include acceleration, speed, reproducibility, stability, etc. In addition, the first paper size of this integration applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling out this page), I · Binding. Order. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Explanation () The receiving element is better to determine the degree of contamination on the robot carrier tray used to support the substrate during the transportation process. During the substrate management steps or process by-product accumulation, the above-mentioned pollutants will scratch the back of the substrate But in the current process system, the integrated components or methods mentioned above do not exist. Another disadvantage of the traditional inspection system is that the cost of the system is too high. Existing systems are generally independent platforms that occupy clean room space and are expensive. Since the independent inspection platform needs to occupy a large area or "track", the operating cost to own such a system is also high. The cost of particle detection is further increased due to the use of optoelectronic equipment. In order to detect small particles with high resolution, this equipment requires a high-precision mechanism, and the cost of operating the equipment is very expensive. In addition, due to the above-mentioned tradition The inspection system reduces the output and also increases the cost. Therefore, a rapid inspection of the semiconductor substrate and the determination of one or more conditions of the substrate to detect anomalies can facilitate the integration of subsequent substrate management decisions. The system does have its necessity. Purpose and summary of the invention: Generally, the present invention provides a substrate inspection system for use in a substrate processing system. In one aspect of the present invention, at least one optical inspection is used. The system is used to inspect the topography of the surface of the processed substrate. The optical inspection system transmits a characteristic signal representing the topography of the surface of a processed substrate to a process management controller, which is set to operate One or more optical viewing systems. In an embodiment, the process management controller compares the reference value of the substrate. Page 8 This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling this page) Load.% 533526 A7
五、發明説明() 經濟部智慧財產局員工消費合作社印製 決疋某一基材表面狀態。如果基材特徵超越預設值,基 材被送至第二度量檢視步驟以進行更精細及深入分析。 再者 &心管理控制器也可使用資訊以改變製程系統之 基材製造過程或將其最佳化。 在另一實施例中,使用複數光學檢視系統,以一製 考王處理控制器沿著多種基材轉送路徑,於不同檢視位置 處管理基材表面拓樸型態。上述製程管理系統經由持續 管理及分析能最佳化基材處理之產出量。該整合型檢視 系統藉由製程參數變化之近即時管理(near real_time monitoring)及處理之後續影響而最佳化製程參數。 本發明一實施例係關於一種製程檢視之軟體控制及 州出量增強系統。該系統至少包含一資料製程系統,該 資料製程系統更包含一内含程式之控制器,該程式用以 製程控制。執行於該資料製程系統的上述程式係用以組 織下列步驟:對一系統組態之回應,組織一光學檢視系 先’ it供該光學檢視系統之調整設定;從該光學檢視系 統處’接收基材表面拓樸資料以決定該基材表面祐樸狀 態是否已經超過預定值;及如果該基材表面已經超過預 疋值’決定該基材是否有再作更深入分析之需求性。 本發明一實施例包含一程式產品,該程式產品包今 用以光學特徵辨識、及粒子與缺陷偵測之一程式。、妙由 一控制器執行該程式,包含下列步驟:一系統組態之回 應,組織一光學檢視系統;提供該光學檢视系統之調整 設定;從一訊號源提供一訊號至一接收器,其中該訊號 第9頁 (請先閲讀背面之注意事項再填寫本頁) •裝. 訂· 奢· 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533526V. Description of the invention () Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Determine the surface state of a certain substrate. If the characteristics of the substrate exceed a preset value, the substrate is sent to a second measurement review step for more detailed and in-depth analysis. Furthermore, the & Mind Management Controller can use the information to change or optimize the substrate manufacturing process of the process system. In another embodiment, a multiple optical inspection system is used to manage the topography of the substrate surface at different inspection positions along a plurality of substrate transfer paths with a single Kaowang processing controller. The above-mentioned process management system can optimize the output of substrate processing through continuous management and analysis. The integrated viewing system optimizes process parameters through near real-time monitoring of process parameter changes and subsequent effects of processing. An embodiment of the present invention relates to a software control and state output enhancement system for process inspection. The system includes at least a data processing system, and the data processing system further includes a controller including a program for process control. The above program running on the data processing system is used to organize the following steps: In response to a system configuration, organizing an optical viewing system first 'it is used to adjust settings of the optical viewing system; receiving the base from the optical viewing system Topographical information on the surface of the material to determine whether the substrate's surface has exceeded a predetermined value; and if the surface of the substrate has exceeded a pre-set value ', it is determined whether the substrate needs to be further analyzed. An embodiment of the present invention includes a program product including a program for optical feature identification and particle and defect detection. 2. The program is executed by a controller, including the following steps: a system configuration response, organizing an optical viewing system; providing adjustment settings for the optical viewing system; providing a signal from a signal source to a receiver, where Page 9 of this signal (please read the precautions on the back before filling out this page) • Binding. Ordering · Extravagant • This paper size applies to China National Standard (CNS) A4 (210X297 mm) 533526
、發明説明( 基材或訊號接收器從基材表面所接收到的反射及/ 或散射訊號特徵,用以偵測表面拓樸缺陷。 該程式產品以適用於 供基材&置資料、基材反射 貝料、頻譜資料、光譜資料、二 咨」 一維〜像資料、基材缺陷 會枓、基材損傷資料、基材支撐元件及置故其上基材之 粒子污染資料、字母及數字符號特徵資料、機^操作 資料、機器人之校準資料一傳送組件及/或接收組件、 及任何上述組合方式者為佳。 I式簡箪說明:、 Explanation of invention (The reflection and / or scattering signal characteristics received by the substrate or signal receiver from the surface of the substrate are used to detect surface topography defects. Reflection materials, spectral data, spectral data, two references "one-dimensional to image data, substrate defect information, substrate damage data, particle support data, letters and numbers Symbol characteristic data, machine operation data, robot calibration data, transmission components and / or receiving components, and any of the above combinations are preferred.
本發明為更進一步說明上述簡要總結,而參考附加 圖示中的實施例以詳細說明。但應當注意的是,該附加 圖不僅為本發明之典型實施例,並非用以限定本發明範 圍,本發明也包含其他等效實施例Q 第1A圖所示為典型半導體製程系統之平面圖。本發明 使用此種半導體製程系統而帶來效益; 第1 B圖所示為一製程檢視系統之高階系統示意圖; 第1 C圖所示為一處理檢視系統之示意圖。該處理檢視 (請先閲讀背面之注意事項再填寫本頁) ·裝· .丨訂· 經濟部智慧財產局員工消費合作社印製 數本 之與 器器 殖殖 增增 &YU XVU 學學 光光 一 該 至中 合其 耦’ 明統 發系 本視 含檢 包學使 統光明 系個發 繫 聯 器 收 接 之 用 明 發 本用收 為使接 示所個 所明一 圖 2 第 工 之 發及 本件 。 組 圖送 視傳 透個 之二 供含 施包 實 面 介 廠介 ,厥; 工件 少 至 面 OM 1A 舞 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 533526 A7 B7 五、發明説明() 第3 A-C圖為第2圖中所示之製程系統的上視圖,在密 閉莢式容器承載盤線性移動過程中,顯示一基 材位於一承載盤上的各種位置; 第4圖所示為本發明一工廠介面實施例之透視圖。本發 明所使用之工廠介面至少包含一傳送組件及一 接收組件; 第5A-C圖為第4圖中所示之製程系統的上視圖,在密 閉莢式容器承載盤延伸移動過程中,顯示一基 材位於一承載盤上的各種位置; 第 6圖所示為本發明一轉送處理室實施例之部分透視 圖。本發明之轉送處理室實施例至少包含一傳 送組件及一接收組件; 第7A-C圖為第6圖中所示之製程系統實施例的上視 圖,在承載盤延伸轉動過程中,顯示一基材位 於一承載盤上的各種位置; 第8A-C圖為第6圖中所示之製程系統的上視圖,在承 載盤線性移動過程中,顯示一基材位於一承載 盤上的各種位置; 第9圖所示為一處理室及一蓋件之剖面圖,以圖示說明 一光學檢視系統實施例; 第10圖所示為一處理室及一蓋件之剖面圖,以圖示說 明一光學檢視系統實施例; 第11圖所示為一處理室及一蓋件之透視圖,以圖示說 明一光學檢視系統實施例; 第Η頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁) ·裝· 訂· 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 第12A-C圖為第11圖中所示之一處理室及一蓋件之剖 面圖,在承載盤線性移動過程中,顯示一基材 位於一承載盤上的各種位置; 第 1 3 A-C圖所示為一處理室及一蓋件之剖面圖,以圖 示說明一光學檢視系統在基材表面掃瞄循序過 程中,顯示一基材位於一承載盤上的各種位置; 第14圖所示為本發明一基材偵檢系統實施例之進行示 意圖; 第1 5圖所示為經由一光源照明而圖案化之一基材,其 光譜強度分佈示意圖; 第1 6圖所示為經圖案化之一基材,其光譜強度分佈比 較示意圖; 第1 7圖所示為相對於4 0秒鐘之過姓刻時間,光譜訊號 特徵差異示意圖; 第1 8圖所示為以製程中電漿密度改變為基礎所得之蝕 刻終點示意圖; 第1 9圖所示為各種過蝕刻時間之平均強度值變化示意 圖, 第20圖所示為連續檢視基材所得之5 -平均強度值變化 的示意圖; 第21圖所示為蝕刻光阻之剝離時間所得之光譜訊號特 徵變化示意圖; 第22圖所示與一參考基材相比較,強度與剝離時間之 關係圖; 第12頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) -裝- 、訂· #_ 533526 A7 B7 五、發明説明() 第23圖所示為在光阻移除後,用以剝離時間之強度示 思國, 第24圖所示為再現性差異與決定系統噪音之關係圖; 第25圖所示為用以光譜分析之基材表面的综合示意 圖, 第26圖所示為一系統之高階結構實施例的示意圖,該 系統係設置以執行粒子偵剛及其它製程管理方 法; 第27圖所示利用該系統以進行製程管理及粒子偵測之 程式控制方法之流程圖;及 第28圖所示為用以製程管理及產生製程報告之一流程 圖。 圖號對照說明: (請先閱讀背面之注意事項再填寫本頁) ·裝‘ 經濟部智慧財產局員工消費合作社印製 37 基材 41 空腔 42 轉送處理室 44 真2處理室 46 鏡片 48 承載盤 50 機器人 51 中樞 52 蓋件 53 投射光部位 54 訊號特徵 56A,56B 光源 58A-D光接收器 58 光譜分析器 60 光源 61 光學路徑 62 光束成形之光學裝置 64 視埠 66 盤件 69 訊號特徵之 第13頁 位 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) ·裝· 訂· 五、發明説明() 70 視埠 7 4 基材的反射部位 77 基材的散射部位 82 偵檢器 90 輸入-輸出纜線 I 0 0 處理系統 104 前端環境 106 真空阻絕處理室 II 0 轉送處理室 II 4 製程處理室 1 2 0 視埠 132,134,138 箭頭 141 光訊號倍增器 150A-F光學檢視次系統 1 5 9 工廒介面 166轉送支撐元件 170光學配件 6 1 6接收器 I 1 0 1製程處理室 1104底部 III 0,1112,1114 埠 1118,1120 光源 II 3 0蓋件 1 122,1 124,1 126 窗口 72 盤件 7 5 阻礙物 80 光學配件 86 製程監視控制器 92 前緣 102 製程系統控制器 I 〇 5 密.閉莢式容器 108A-B莢式容器負載器 113 機器人 II 6 服務處理室 122,124 箭頭 1 3 5 檢視平台 143A-H 光纖纜線 1 5 2 使用者輔助介面 162基材製造數據伺服器 176構件 2 1 8 框架 1100蓋件 1102側壁 1106支撐構件 III 6攝相機 1128訊號特徵反射平面 1 1 52- 1 1 54支撐托架 1 121,1 123光學配件 第14頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 533526 A7 B7 (請先閲讀背面之注意事項再填寫本頁) ,裝· 訂· 經濟部智慧財產局員工消費合作社印製 五、發明説明() I 128内表面 II 5 0光譜儀 1 300蓋件 1 304底部 1 307反射及/或散射光 13 10 埠 1 3 1 8桿構件 1 400A、B基材偵檢系統 1430A、B 區域 2600系統 2604驅動器層 2608内部硬體層 2612工戚介面層 2622伺服器處理 2626製程監視處理 2630半導體設備溝通 標準介面 2 6 3 6光源介面 2705-2755 步驟 2822、2824邏輯路徑 1130表面 11 5 5光纖纜線 1 3 02側壁 1 3 06支撐構件 1 3 0 8連結構件 1 3 1 2介質 1 3 2 5掃瞄構件 1410A、B偵檢器 2505-2540基材區域 2602應用層 2606硬體介面層 2 6 1 0外部硬體層 2620圖形使用者介面 2624粒子偵檢處理 2628資料庫 2632報告者介面 2634攝相機介面 2700方法 2805-2820,2825-2856 步驟 發明詳細說明: 本發明實施例在用於多處理室製程系統(例如:一 叢集工具)時特別能展現其優勢。普遍應用於半導體工 第15頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533526 A7 五、發明説明( 經濟部智慧財產局員工消費合作社印製 業之多處理室製程系統範例被稱作叢集工具,其適於支 持此處說明之偵檢設備。叢集工具為至少包含多處理室 之一種模組系統,其能執行各種功能,包含:基材中心 點找尋及定位、除氣(degassing)、退火、沉積及/或蝕 刻。這些多處理室與一中心轉送處理室搭配為用,其中 該轉送處理室内具有一機器人,用以在處理室之間輸送 基材15該轉送處理室典型上維持於真空狀態,並作為從 一處理室輸送基材至另一處理室及/或一真空阻絕室之 過渡階段,其中該真空阻絕室位於該叢集工具之前端。 第1A圖所示為一典型半導·體製程系統1〇〇之平面 圖’本發明可使用此種半導體製程系統而帶來效益。 Centura®及Endura®是上述製程系統1〇〇的兩種平台, 且皆購自美國應用材料公司。該階段式真空之基材製 系統的洋細說明可見於美國專利申請案 5 1 $ 6 71 “Staged-Vacuum Wafer Processing System and Method, 之揭露内容,在此處合併該申請案内容作為參考資料 處理室之實際排列及組合方式,則端視製造過程之某 執行步驟加以變化之。 在本發明實施例中,製程系統1 00 —般至少包含 數個處理室及機器人,並以具有一製程系統控制器丨02 以執行製程系統1 00中各種處理方法者為佳。一前端 境(此處也稱作一工廠介面(Factory Interface),或以 表示)顯示可與一對真空阻絕處理室1 0 6進行選擇性 繫。位於前端環境中的莢式容器負載器108A-B能 第16頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) -裝· 訂· 程 環 FI 聯 以線 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 性、旋轉、垂直移動方式輸送基材於真空阻絕室106與 複數個密閉莢式容器1 05之間,其中後兩者支撐於前端 環境104上。真空阻絕室1〇6提供位於前端環境1〇4及 一轉送處理S 110之一第一真空介面。二真空阻絕室1〇6 藉由與轉送處理室110及前端環境104交替聯繫而增加 產出量。因此,在一真空阻絕室1〇6與轉送處理室u〇 聯繫時’一第二真空阻絕室106與前端環境1〇4產生聯 繫。一機器人113設置於轉送處理室11〇之中心處,用 以從真空阻絕室106中輸送基材至各製程處理室114及 服務處理室Π6之一者。製程處理室114能執行各種處 理,例如··物理氣相沉積、化學氣相沉積及蝕刻處理, 而服務處理室116適用於除氣、定位、冷卻等。若干個 視埠1 2 0的提供能使轉送處理室1 1 〇得以目視觀察。 本發明實施例中包含用以收集光學資料之光學檢視次系統(Optical InSpecti〇n Sub-System(OIS))150。該光 學檢視次系統於下文說明之,一 0IS丨5〇大致包含適用 於產生訊號特徵之一傳送組件及用以接收基材表面訊號 特徵之反射(亮場照射)及/或散射(暗場照射)部分光的— 接收組件。 用於1 管理時,複數個Q I g 1 5 〇可被設置及/气 辛禹合於製程系統1 〇 〇之任何位置,例如:位於工廒介面 104、轉送處理室110、製程處理室114及服務處理室 等之内。ΟIS 1 5 0所接收的任何資料能隨後加以處理, 以決定基材於製程系統1 〇〇中移動時的各種狀況。第17頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇χ 297公雙) (請先閲讀背面之注意事項再填寫本頁) 裝 訂· # 533526 A7 ___ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明() 各OIS 150實施例中包含各種接收器及傳送器。在 一實施例中,該接收器為用以偵檢可見光譜範圍之光線 的一電荷耦合元件(CCD)攝相機。另一接收器可為用以 接收進來的光線及輸出表示各種光之波長及其訊號強度 特徵的—光譜儀。以一紅光為例,其多數成份皆位於短 波長可見光譜中。該光譜儀典型上包含一光學棱鏡(或 光樹)介面’以使進入訊號分離而得到其光學組成成份, 這些成分接續被投射至一線性CCD偵檢器陣列裝置 上。—光譜儀實施例可至少包含一 CCD偵檢器陣列裝 置’其中該CC0偵檢器陣列裝置至少包含數千個獨立 t偵檢器元件,以接收棱鏡(光柵)所產生的光譜。該光 譜組成成份之相對強度表示一基材表面、基材表面圖 案、或電漿處理等之全部顏色。 在另一實施例中,該接收器為一光學特徵辨識(OCR) 接收器。該OCR接收器係用以偵檢及辨別光學特徵及 基材圖案間的差異。基材在表面上通常具有可供辨識的 資料。典型而言,該辨識資料為一連續之字母及數字符 號組成之特徵資料。在一實施例中,一 〇 c R接收器係 用以偵測該等特徵資料及決定具有某一 OCR標記之基 材疋否正受到適當處理(例如:繞行至正確之處理室而 加以處理)。在另一實施例中,〇CR接收器係用以使相 關度量資料產生關聯性。 每一接收器可至少包含光學元件,以聚集及收集基 材的反射及/或散射訊號特徵。舉例而言,一光譜儀配 第18頁 (請先閲讀背面之注意事項再填寫本頁) -裝- 訂· #. 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公爱) 533526 A7 B7 五 經濟部智慧財產局員工消費合作社印製 發明説明() 以一光纖收集器,以接收及傳送光譜;或可配以一「鏡 片透視系統」(例如:一廣角鏡頭),以收集大量光線; 或可配以特殊鏡片,以改良某一基材之檢視視野。此外, 該等鏡片可加以排列而增加或聚集光線。由較寬廣視野 所收集彳于之更多光線能將基材表面局部的差異加以平均 化。 〇IS 150之傳送器在製程檢視過程具有各種組態以 適用於某一用途。例如:在收集光譜資料之處理過程中, 使用一線性光源只對基材一部位進行照射、或使用一閃 光元件以閃光照射基材。任何傳送器包含一光束聚焦光 學系統,以將能量聚集及投射至基材上。 各種接收器及傳送器實施例能個別或組合使用,以 收集整個製心系統1 0 0中的製程資料《各種實施例所收 集的資料係用以監視製造過程的各種階段之基材處理狀 態。OIS 150之操作由一製程監視控制器(PMC)86加以 控制。如第1A圖所示,PMC 86藉由一 1〇(輸入-輸出) 纜線90與每一 OIS 150電性耦合,其中1〇境線9〇用 以將命令訊號送至相對應之OIS150中。再者,PMC 86 藉由10纜線90接收相對應之0IS丨50的輸出訊號。雖 然用於製程系統1 0 0之製程系統控制器1 〇 2以與ρ μ c 8 6 分離為佳,但在PMC 86之一實施例中,pmc 86可作 為製程系統1 00之一控制組件,藉此消除額外控制組件 之需求。 藉由一使用者之啟動動作,PMC 86持續監視進入 第19頁 本紙張尺度適用中國國家標準(CNS)A4規格(2ΐ〇χ 297公楚) "雄 -----— (請先閲讀背面之注意事項再填寫本頁) 裝· . # 533526 經濟部智慧財產局員工消費合作社印製 五、發明説明( 〇IS 150 ?見野之基材。如果PMC At 一 τ w $、σ “偵測到正在監視的 於一、二Γ例如:一受污染基材)時,警示訊息會顯示 、’〜737置(未顯示)上,使用者因而受到警示。此外, 製程系統控制$ 102可受到PMc 86指示而轉送基材至 某一:置1進行最終處理、清理、4進_步檢視。舉 例…在-實施例中’製程“ 100包含一用以偵測 粒子的檢视平台135,但檢視平台 <功能可加以擴 充,即在Π UH及製程系、统150其它處加以⑽15〇。、 檢視平台135適用於執行各種量測工作,例如:表 面不規則性偵測、圖案辨識、光譜/頻譜分析、及粒子 偵測之此類量測工作。檢視平台Π5為本發明諸多實施 例所採用之一種整合型粒子監視(IPM)系統。一般而言, IPM為叢集工具所利用之一種粒子檢測平台,其中一 用於本發明之心為Excite™’其係講自美國應用材 公司。依據本發明執行IPM時,IPM為具有監視本 明製程(包含任何等類製程)能力之一製程監視元件。 上文所述’檢視平台1 3 5具有粒子偵測之能力,且其 力不僅限於此。 在一實施例中,一 OIS 150之所在位置係由基材 行於製程系統100(因使用機器人而帶來效益)中的 置,且該位置還需是可接近及處理的位置。舉例而+ 因為視淳120提供對進入或離開一處理室(真空阻^ 106、冷卻處理室116、或製程處理室114)之機器人 載盤48,或在轉送處理室間移動的觀察視野,視痒 第20頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) ··裝. 可 料 發 如 能 繞 位 室 承 120 # 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明() 可提供OIS 150合適位置。在圖式中,箭頭122,124指 出一基材可利用視埠丨20進行光學檢測之位置。其中, 箭頭122指出機器人轉動之位置,而箭頭124指出機器 人延伸或縮回之位置α在一實施例中,〇IS 係位於 轉送處理主110上,該實施例將迷於下文,並參照第6 圖說明之。 在一些實施例中,OIS 150可位於基材行進之製程 系統中的任何位置。在一實施例中,工戚介面1 〇 4提供 另外的檢視位置。圖示檢視位置係以箭頭1 3 2,丨3 4,i 3 8 表示之且這些箭頭132,134,138也用以說明基材之轉送 路徑。其中箭頭136指出基材移動於工廠介面104及密 閉莢式谷器105間;箭頭132,138指出基材移動於工戚 介面104及真空阻絕室1〇6間;而箭頭134指出基材移 動於工廠介面1〇4内(更詳而言之,其係移動於莢式容 器負載器108A與108B間)《〇IS 150可沿任一轉送路 徑1 32,1 3 4,1 3 8設置,以監視製造過程。然而,一些實 施例亦可對未移動之基材進行檢視,下文將有說明。 第1 B圖所示為一基材檢視系統之高階示意圖。在 一實施例中,該檢視系統至少包含耦合至一製程系統控 制器102之一 PMC 86、一工咸介面159、複數個〇IS 1 5 0、及一檢視系統1 3 5。P M C 8 6用以控制監視ΟIS 1 5 0。 使用者辅助介面1 5 2得進行獨立操作,一操作者因此得 以獨立控制P M C 8 6。在一實施例中,介面15 2為一圖 形使用者介面(GUI)。製程監視資料係經由纜線90直接 第21頁 (請先閲讀背面之注意事項再填寫本頁) 一裝· 、可· #· 本紙張尺度適用中國國家標準(CNS)A4規格(21〇χ 297公爱) 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 從基材製造數據伺服器1 62處而得。 舉例而言,在一實施例中,OIS 150可包含一光源 叢集及一接收器。第1 C圖所示之複數光源5 6及光纖纜 線143A-H,其中該光纖纜線143A-H耦合至一光訊號. 倍增器141,該光訊號倍增器141足與接收器進行溝通。 該光纖纖線係設置以收集通過窗口之反射及/或散射 光,接著將光訊號送至倍增器141。倍增器141以多工 傳輸模式將光學數據傳輸送至光譜分析器58,使單一 接收器能有效監視眾多檢視位置。在一實施例中,接收 器為一光譜儀。 II.工廠介面 在第1,2,4圖所示之實施例中,〇IS 150之傳送組 件及接收組件實施例係沿著箭頭1 3 2,1 3 4,1 3 6,1 3 8標示 的各種基材移動路徑以設置於FI 104上或其内部,當 然其他貫施例亦可使用而帶來效益。第2圖為ρ I 1 0 4 之示意圖,FI104至少包含莢式容器負載器1〇8八,1〇83、 OIS 150A、支撐組件160、包含一基材對位偵檢器之一 轉送支撐元件166、及一基材支撐器162aFI 1〇4更包 含一框架218,且裝置元件16〇係以傳統裝置(例如:螺 栓、螺絲鉗、或其他習知技術中的扣件)緊扣至框架2丨8。· 第2圖為OIS 150沿著箭頭134掃瞄基材之一實施 例。一 OIS 150A至少包含一對光源56A,56B(例如:傳 送器)、及位於支撐組件160上的—接收器58八。光源 第22頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公楚^ --- (請先閲讀背面之注意事項再填寫本頁) 裝· 訂· # 533526 A7 B7 五、發明説明() 5 6 A,5 6B被加以一角度設置,以提供二種照明角度。圖 示說明中,光源56A提供一前部照明,而光源56B提 供後部照明。在一實施例中,光源56 A,5 6B間的角度約 為直角,以使照明重疊(亦即照明干擾)程度降至最低° 光源56 A,5 6B可包含光束成形之光學裝置(例如··鏡片 及此類裝置),以使各光源產生之光束得以增強及調整。 光接收器5 8係設置以接收從基材3 7表面處之光線反射 及/或散射部份。其中,光接收器58端視預收集的數據 而選擇之。在圖示實施例中,光接收器58至少包含一 CCD元件、一時間延遲積分(TDI)攝相機、一光倍增管 (PMT)、一光譜儀、一 OCR攝相機等。光接收器58可 更包含適用於增強資料收集之光學元件。舉例而言’在 一實施例中,光接收器5 8 A包含一捆光纖,以擷取及 繞行從檢視點接受到的光線至接收器5 8。 在操作過程中,基材 37藉由莢式容器負載器 108A,108B而在FI内部位置間移動。OIS 150A隨後掃 瞄基材3 7,以使光接收器5 8接收製程進行所需之反射 及/或散射光,如下文所述。 圖式說明中,當基材37移動於真空阻絕室106及 基材支撐器162間時,莢式容器負載器108 A,108B之一 者將基材37置於OIS 150A下,以利掃瞄動作之進行。 此外,基材37以在正常基材支撐時亦加以掃瞄為佳。 舉例而言,在莢式容器負載器1〇8Α,1〇8Β間的一正常基 材交換步驟中,正在輸送之基材可以01S150A掃瞄之。 第23頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 裝· 、? 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 五、發明説明() 以基材37從莢式容器負載器i〇8A移動至莢式容器 負載器108B。首先,基材37藉由莢式容器負載器i〇8A 搬運,且置放於基材支撐器丨62中,其中基材支撐器162 用以協助莢式容器負載器1〇8Α,1〇8Β間的傳送/交換處 理。在此種移動過程中,基材37利用前端照明光源56A 掃瞒之。在一實施例中,基材3 7移動超過中間點的位 置,以對基材表面加以全部的掃描。第3 A-C圖中所示 為利用前端照明光源5 6 A掃瞄時基材3 7的移動情形。 第3A圖所示為基材37在剛往基材支撐器162移動時 荚式容器承載盤48的情形,此時基材37前緣位於訊號 特徵路徑上。因此,光源56A形成投射光53的部份部 位(陰影區表示處)與基材前緣相截。如第3B-C圖所示 之荚式容器承載盤48連續移動過程中,投射光53在基 材37表面上掃動。反射及散射光由接收器所接收,以 利處理’將於下文說明之。莢式容器負載器1〇8Β可使 用上述同一方式掃瞄基材37。 在另一實施例中,以一單一莢式容器負載器1〇8移 動基材,並與二光源56A,56B共同動作。舉例而言,經 由荚式容器負載器108A負載基材至基材支撐器162 時’ OIS 150A使用前部照明光源56A掃瞄該基材;當 基材藉由莢式容器負載器108A而脫離基材支撐器162 時,後部照明光源56B受到激發以掃瞄基材。當基材置 放於基材支撐器162或由莢式容器負載器ι〇8Α將基材 移離時,接收器158A接收基材的反射及/或散射光。 第24頁 本紙張尺度適用中國國家標準(CNS)a4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂· 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 五、發明説明() 經 濟 部 智 慧 財 產 局 員 X 消 費 合 作 社 印 製 第4圖所示為當基材沿著如箭頭1 32,1 3 8所示之轉 送路徑動時、使用〇IS 150B之另一實施例。〇IS 150B 至少包含單一光源56 A(可包含光束成形之光學裝置)、 及一光接收器58°〇IS 150C設置於裝置元件160上。 光源56A用以提供基材照明,並包含光束成形之光學 裝置。在一實施例中,當基材37從工廠介面104移動 至真空阻絕室1〇6時,接收器58將接收反射及散射光 的訊號特徵輸送至pMC 86,如下文所述。 第5A-C圖中所示為使用〇IS 150B掃瞄之次序。第 5A圖所示為莢式容器承載盤48在基材37往真空阻絕 室1 0 6辅開始移動後的示意圖,此時基材3 7之前緣位 於訊號特徵路徑54上。因此,一投射光53之部份(陰 影區表示者)與基材前緣相截。如第5B-C圖所示之莢式 容器承載盤48連續移動過程中,投射光53掃瞄基材37 之上表面。接收器58接收反射及散射光,將於下文說 明之。 如上文所述,在所有的OIS 105實施例中,接收器 可為一 CCD元件、一時間延遲積分(TDI)攝相機、一光 倍增管(PMT)、一 OCR攝相機及此種裝置之任一者。一 般而言’ CCD,TDI,PMT係用於某一訊號特徵分析用途 而收集通過基材之影像強度差異及相關之薄片/粒子污 染的差異性。該光譜儀係設置以收集基材3 7表面處的 反射及/或散射光訊號特徵,並用以產生該輸出之採色 光譜成份之輸出。該OCR收集基材37表面處的反射及 請 先 閱 讀- 背 面 之· 注 意 事 項I裝 頁In order to further explain the above brief summary, the present invention will be described in detail with reference to the embodiments in the attached drawings. It should be noted that this additional drawing is not only a typical embodiment of the present invention, but is not intended to limit the scope of the present invention. The present invention also includes other equivalent embodiments. FIG. 1A shows a plan view of a typical semiconductor process system. The invention uses such a semiconductor process system to bring benefits; FIG. 1B shows a schematic diagram of a high-level system of a process inspection system; FIG. 1C shows a schematic diagram of a process inspection system. The processing review (please read the precautions on the back before filling this page) · Installation · .Ordering · Printing and printing of several copies printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs & Increasing device proliferation & YU XVU Xueguang Guangyi should be coupled with China 'Mingtong hair is based on the inspection package to make the Tong Guangming Department of the hair system coupler to receive the use of the hair and the receiver to make the reception of all the information shown in Figure 2 And this one. The photo is transmitted through the second part of the package, including the packaged surface and the factory; the workpiece is as small as OM 1A. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 533526 A7 B7 5 3. Description of the invention (3) Figure AC is a top view of the process system shown in Figure 2. During the linear movement of the closed pod container tray, a substrate is shown at various positions on a tray; The figure shows a perspective view of an embodiment of a factory interface of the present invention. The factory interface used in the present invention includes at least a transmission component and a receiving component. Figures 5A-C are top views of the process system shown in Figure 4. During the extended movement of the closed pod-type container carrier tray, a The substrate is located at various positions on a carrier plate. FIG. 6 shows a partial perspective view of an embodiment of a transfer processing chamber of the present invention. The embodiment of the transfer processing chamber of the present invention includes at least a transmitting component and a receiving component. Figures 7A-C are top views of the embodiment of the process system shown in Figure 6. During the extension and rotation of the carrier tray, a basic Figures 8A-C are top views of the process system shown in Figure 6. During the linear movement of the tray, a substrate is shown at various locations on the tray; FIG. 9 is a cross-sectional view of a processing chamber and a cover, illustrating an embodiment of an optical inspection system; FIG. 10 is a cross-sectional view of a processing chamber and a cover, illustrating a Example of an optical inspection system; Figure 11 shows a perspective view of a processing chamber and a cover to illustrate an example of an optical inspection system; page 本 The paper dimensions apply to Chinese National Standard (CNS) A4 specifications ( 210X 297 mm) (Please read the precautions on the back before filling out this page) · Binding · Binding · Printed by the Consumers 'Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ( Figures 12A-C are cross-sectional views of a processing chamber and a cover shown in Figure 11. During the linear movement of the carrier plate, a substrate is shown at various positions on the carrier plate. Figure 1 3 AC Shown is a cross-sectional view of a processing chamber and a cover, illustrating the process of scanning an optical inspection system on the surface of a substrate, showing various positions of a substrate on a carrier disk; FIG. 14 shows FIG. 15 is a schematic diagram of an embodiment of a substrate detection system according to the present invention; FIG. 15 shows a substrate patterned by a light source, and a spectral intensity distribution diagram; FIG. 16 shows a patterned pattern. A schematic diagram of the comparison of the spectral intensity distribution of a substrate; Figure 17 shows the difference in spectral signal characteristics with respect to the engraved time of 40 seconds; Figure 18 shows the plasma density in the manufacturing process. Schematic diagram of the end point of etching obtained by changing to the basis; Figure 19 shows the change of the average intensity value of various over-etching times, and Figure 20 shows the 5--average intensity value change obtained by continuous inspection of the substrate; The picture shows the eclipse Schematic diagram of the change in the spectral signal characteristics obtained from the peeling time of the photoresist; Figure 22 shows the relationship between the strength and the peeling time compared with a reference substrate; page 12 This paper applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) (Please read the precautions on the back before filling out this page) -Installation-, order · #_ 533526 A7 B7 V. Description of the invention () Figure 23 shows the photoresist after peeling off. The intensity of time shows Siguo. Figure 24 shows the relationship between the reproducibility difference and the system noise. Figure 25 shows a comprehensive schematic diagram of the substrate surface for spectral analysis. Figure 26 shows a system. A schematic diagram of a high-level structure embodiment, the system is configured to perform particle detection and other process management methods; FIG. 27 shows a flowchart of a program control method using the system for process management and particle detection; and 28 The figure shows a flowchart for process management and process report generation. Comparative description of drawing numbers: (Please read the precautions on the back before filling in this page) · Installation 'Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Printed by the Consumer Cooperatives 37 Substrate 41 Cavity 42 Transfer Processing Chamber 44 True 2 Processing Chamber 46 Lens 48 Bearing Disk 50 Robot 51 Hub 52 Cover 53 Projected Light Site 54 Signal Characteristics 56A, 56B Light Sources 58A-D Light Receiver 58 Spectrum Analyzer 60 Light Source 61 Optical Path 62 Beam Shaping Optical Device 64 View Port 66 Disk 69 Signal Feature Page 13 This paper size applies to Chinese National Standard (CNS) A4 (210X 297 mm) 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) · Order · V. Description of the invention 70 Viewport 7 4 Reflective part of the substrate 77 Scattered part of the substrate 82 Detector 90 Input-output cable I 0 0 Processing system 104 Front-end environment 106 Vacuum blocking processing chamber II 0 Transfer processing room II 4 Process processing room 1 2 0 View port 132,134,138 Arrow 141 Optical signal multiplier 150A-F Optical inspection sub-system 1 5 9 Industrial interface 166 Transfer support element Pieces 170 optical accessories 6 1 6 receiver I 1 0 1 process processing room 1104 bottom III 0, 1112, 1114 port 1118, 1120 light source II 3 0 cover 1 122, 1 124, 1 126 window 72 plate 7 5 obstruction 80 Optical accessories 86 Process monitoring controller 92 Leading edge 102 Process system controller I 〇5 Closed. Closed pod container 108A-B Pod container loader 113 Robot II 6 Service processing room 122, 124 Arrow 1 3 5 Inspection platform 143A -H optical fiber cable 1 5 2 user-assisted interface 162 base material manufacturing data server 176 component 2 1 8 frame 1100 cover 1102 side wall 1106 support member III 6 camera 1128 signal characteristic reflection plane 1 1 52- 1 1 54 support Brackets 1 121, 1 123 Optical accessories Page 14 This paper size is applicable to China National Standard (CNS) A4 (210X 297 mm) 533526 A7 B7 (Please read the precautions on the back before filling this page) · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () I 128 inner surface II 5 0 spectrometer 1 300 cover 1 304 bottom 1 307 reflected and / or scattered light 13 10 port 1 3 1 8 rod member 1 400A, B substrate detection system 1430A, B Area 2600 system 2604 driver layer 2608 internal hardware layer 2612 worker interface layer 2622 server processing 2626 process monitoring processing 2630 semiconductor device communication standard interface 2 6 3 6 light source interface 2705-2755 step 2822, 2824 logical path 1130 surface 11 5 5 optical fiber Cable 1 3 02 Side wall 1 3 06 Support member 1 3 0 8 Connecting member 1 3 1 2 Medium 1 3 2 5 Scanning member 1410A, B Detector 2505-2540 Substrate area 2602 Application layer 2606 Hardware interface layer 2 6 1 0 External hardware layer 2620 Graphic user interface 2624 Particle detection processing 2628 Database 2632 Reporter interface 2634 Camera interface 2700 Method 2805-2820, 2825-2856 Steps Detailed description of the invention: The embodiment of the present invention is used for multiprocessing This is especially true for laboratory process systems (for example, a cluster of tools). Commonly used in semiconductor industry page 15 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) 533526 A7 V. Description of invention It is called a cluster tool, which is suitable for supporting the detection equipment described here. The cluster tool is a modular system including at least multiple processing chambers, which can perform various functions, including: finding and positioning the center point of the substrate, and degassing (Degassing), annealing, deposition, and / or etching. These multi-processing chambers are used in conjunction with a central transfer processing chamber, where the transfer processing chamber has a robot for transferring substrates between the processing chambers. 15 The transfer processing chamber. It is typically maintained in a vacuum state and is used as a transition stage for transferring substrates from one processing chamber to another processing chamber and / or a vacuum barrier, where the vacuum barrier is located at the front of the cluster tool. Figure 1A shows A plan view of a typical semi-conductor system system 100 'The present invention can use such a semiconductor process system to bring benefits. Centura® and Endura® are The two platforms of the process system 100 are described, and both are purchased from American Applied Materials. A detailed description of this stage vacuum substrate manufacturing system can be found in the US patent application 5 1 $ 6 71 "Staged-Vacuum Wafer Processing The contents of System and Method are disclosed here, and the content of the application is incorporated here as the actual arrangement and combination of the reference data processing room, which will be changed depending on an execution step of the manufacturing process. In the embodiment of the present invention, the process system 1 00—Generally includes at least several processing chambers and robots, and preferably has a process system controller 丨 02 to perform various processing methods in the process system 1 00. A front-end environment (also referred to herein as a factory interface ( (Factory Interface), or indicated) can be selectively connected with a pair of vacuum barrier processing chambers 106. Pod container loaders located in the front-end environment 108A-B can page 16 This paper size applies Chinese national standards ( CNS) A4 specification (210X297 mm) (Please read the notes on the back before filling out this page)-Binding, ordering, Chenghuan FI, line 533526 A7 B7 Intellectual Property Bureau, Ministry of Economic Affairs Printed by the Industrial and Consumer Cooperatives. 5. Description of the invention () The substrate is transported between the vacuum blocking chamber 106 and a plurality of closed pod containers 105 in a sexual, rotating and vertical moving manner, and the latter two are supported on the front-end environment 104. Vacuum The blocking chamber 106 provides one of the first vacuum interfaces in the front-end environment 104 and a transfer processing S 110. The two vacuum blocking chambers 106 increase output by alternately connecting the transfer processing chamber 110 and the front-end environment 104. Therefore, when a vacuum blocking chamber 106 is connected to the transfer processing chamber u0, a second vacuum blocking chamber 106 is connected to the front-end environment 104. A robot 113 is provided at the center of the transfer processing chamber 110 to transfer the substrate from the vacuum blocking chamber 106 to one of the process processing chambers 114 and the service processing chamber Π6. The process processing chamber 114 can perform various processes, such as physical vapor deposition, chemical vapor deposition, and etching, and the service processing chamber 116 is suitable for degassing, positioning, cooling, and the like. The provision of several viewports 120 enables the transfer processing chamber 110 to be observed visually. The embodiment of the present invention includes an Optical Inspection Sub-System (OIS) 150 for collecting optical data. The optical inspection system is described below. A 0IS 丨 50 generally includes a transmission component suitable for generating signal characteristics and a reflection (bright field illumination) and / or scattering (dark field illumination) for receiving signal characteristics on the substrate surface. ) Partial optical — receiving component. When used for 1 management, multiple QI g 1 500 can be set up and / or integrated into any position of the process system 1 00, for example: at the industrial interface 104, transfer processing room 110, process processing room 114, and service processing Within the room. Any information received by ΟIS 1 50 can be subsequently processed to determine the various conditions of the substrate as it moves through the process system 1000. Page 17 This paper size applies to Chinese National Standard (CNS) A4 specifications (21〇χ 297 male double) (Please read the precautions on the back before filling out this page) Binding · # 533526 A7 ___ B7 Employee Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the cooperative V. Description of the invention () Each OIS 150 embodiment includes various receivers and transmitters. In one embodiment, the receiver is a charge coupled device (CCD) camera for detecting light in the visible spectral range. The other receiver may be a spectrometer for receiving the incoming light and outputting the characteristics of the wavelength and signal strength of various lights. Taking a red light as an example, most of its components are located in the short-wavelength visible spectrum. The spectrometer typically includes an optical prism (or light tree) interface 'to separate the incoming signal and obtain its optical components, which are successively projected onto a linear CCD detector array device. -An embodiment of the spectrometer may include at least a CCD detector array device ', wherein the CC0 detector array device includes at least thousands of independent t detector elements to receive a spectrum generated by a prism (grating). The relative intensities of the spectral constituents represent all the colors of a substrate surface, substrate surface pattern, or plasma treatment. In another embodiment, the receiver is an optical feature recognition (OCR) receiver. The OCR receiver is used to detect and discern differences between optical characteristics and substrate patterns. The substrate usually has identifiable information on the surface. Typically, the identification data is characteristic data composed of a continuous alphabet and a number. In an embodiment, the 10c R receiver is used to detect the characteristic data and determine whether the substrate with an OCR mark is being properly processed (eg, bypassed to the correct processing room for processing) ). In another embodiment, the OCR receiver is used to correlate related metrics. Each receiver may include at least optical elements to gather and collect the reflection and / or scattering signal characteristics of the substrate. For example, a spectrometer with page 18 (please read the precautions on the back before filling out this page)-binding-binding · #. This paper size applies to China National Standard (CNS) A4 (210x297 public love) 533526 A7 B7 Five Consumers ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs printed a description of the invention () A fiber optic collector is used to receive and transmit the spectrum; or it may be equipped with a" lens perspective system "(for example: a wide-angle lens) to collect a large amount of light; or Can be equipped with special lenses to improve the viewing field of a certain substrate. In addition, the lenses can be arranged to add or collect light. More light collected by a wider field of view can average local differences on the substrate surface. 〇IS 150's transmitters have various configurations during the process review process to suit a particular application. For example, in the process of collecting spectral data, a linear light source is used to irradiate only one part of the substrate, or a flash element is used to irradiate the substrate with flash light. Any transmitter includes a beam focusing optical system to focus and project energy onto a substrate. The various receiver and transmitter embodiments can be used individually or in combination to collect process data in the entire centering system 100. The data collected in the various embodiments is used to monitor the substrate processing status at various stages of the manufacturing process. The operation of OIS 150 is controlled by a process monitoring controller (PMC) 86. As shown in FIG. 1A, PMC 86 is electrically coupled to each OIS 150 through a 10 (input-output) cable 90, of which 10 line 90 is used to send a command signal to the corresponding OIS 150. Furthermore, PMC 86 receives the corresponding 0IS 丨 50 output signal through 10 cables 90. Although the process system controller 10 for the process system 100 is preferably separated from ρ μ c 8 6, in one embodiment of the PMC 86, the pmc 86 can be used as one of the control components of the process system 100. This eliminates the need for additional control components. With the start of a user, PMC 86 continuously monitors and enters page 19. This paper standard applies Chinese National Standard (CNS) A4 specification (2ΐ〇χ 297 公 楚) " Xiong ------ (Please read first Note on the back, please fill in this page again.) Packing.. # 533526 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (〇IS 150? See the base material. If PMC At τ w $, σ “Detection When one or two (for example, a contaminated substrate) is being monitored, a warning message will be displayed, '~ 737 (not shown), and the user will be warned. In addition, the process system control $ 102 can be subject to PMc 86 instructions to transfer the substrate to a certain one: set to 1 for final processing, cleaning, and 4-step inspection. For example ... In the embodiment, the "process" 100 includes a inspection platform 135 for detecting particles, but the inspection The platform < function can be expanded by adding ⑽150 to other parts of UIH, process system, and system 150. The inspection platform 135 is suitable for performing various measurement tasks, such as surface irregularity detection, pattern recognition, spectrum / spectrum analysis, and particle detection. The inspection platform Π5 is an integrated particle surveillance (IPM) system used in many embodiments of the present invention. Generally speaking, IPM is a particle detection platform used by the cluster tool. One of the cores used in the present invention is Excite ™ ', which is from Applied Materials Corporation. When an IPM is performed in accordance with the present invention, the IPM is a process monitoring element that has the capability to monitor the process of the present invention (including any type of process). The 'viewing platform 1 3 5' described above has the capability of particle detection, and its power is not limited to this. In one embodiment, the location of an OIS 150 is a location in which the substrate is run in the process system 100 (the benefits of using a robot), and the location needs to be an accessible and processable location. For example, because Vision 120 provides a robotic tray 48 that enters or leaves a processing chamber (vacuum resistor 106, cooling processing chamber 116, or process processing chamber 114), or an observation field of vision that moves between transfer processing chambers. Itch page 20 This paper size applies Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling out this page) ·· Packing. It can be sent if it can be placed around the room bearing 120 # 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description () A suitable location for OIS 150 can be provided. In the figure, arrows 122, 124 indicate the positions where a substrate can be optically detected using the viewport 20. Among them, the arrow 122 indicates the position where the robot rotates, and the arrow 124 indicates the position where the robot is extended or retracted. In one embodiment, the IS is located on the transfer processing main 110. This embodiment will be fascinated with reference to the sixth The figure illustrates it. In some embodiments, the OIS 150 may be located anywhere in the process system in which the substrate travels. In one embodiment, the worker interface 104 provides additional viewing positions. The viewing positions of the icons are indicated by arrows 1 2 3, 3, 4 and i 3 8 and these arrows 132, 134, 138 are also used to describe the transfer path of the substrate. Arrow 136 indicates that the substrate moves between the factory interface 104 and the closed pod valley device 105; arrows 132 and 138 indicate that the substrate moves between the worker interface 104 and the vacuum blocking chamber 106; and arrow 134 indicates that the substrate moves between the factory interface Within 104 (more specifically, it is moved between the pod container loaders 108A and 108B) "〇IS 150 can be set along any transfer path 1 32,1 3 4,1 3 8 to monitor manufacturing process. However, some embodiments also allow inspection of unmoved substrates, as described below. Figure 1B shows a high-level diagram of a substrate inspection system. In one embodiment, the inspection system includes at least one PMC 86 coupled to a process system controller 102, a process interface 159, a plurality of ISO 150, and an inspection system 135. P M C 8 6 is used to control and monitor 0IS 1 50. The user-assisted interface 1 52 can be operated independently, so an operator can independently control P M C 86. In one embodiment, the interface 152 is a graphical user interface (GUI). The process monitoring data is directly on page 21 via cable 90 (please read the precautions on the back before filling this page). One pack ·, OK · # · This paper size applies Chinese National Standard (CNS) A4 specification (21〇χ 297 (Public love) 533526 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () Obtained from the material manufacturing data server 1 62. For example, in one embodiment, the OIS 150 may include a light source cluster and a receiver. The plurality of light sources 56 and the optical fiber cables 143A-H shown in FIG. 1C, wherein the optical fiber cables 143A-H are coupled to an optical signal. Multiplier 141, the optical signal multiplier 141 is sufficient to communicate with the receiver. The optical fiber is arranged to collect reflected and / or scattered light through the window, and then sends the optical signal to the multiplier 141. The multiplier 141 transmits optical data to the spectrum analyzer 58 in a multiplexed transmission mode, enabling a single receiver to effectively monitor multiple viewing positions. In one embodiment, the receiver is a spectrometer. II. Factory interface In the embodiment shown in Figs. 1, 2, and 4, the transmission and receiving module embodiments of the IS 150 are marked along the arrows 1 3 2, 1 3 4, 1 3 6, 1 3 8 Various substrate moving paths can be set on or inside the FI 104, of course, other embodiments can also be used to bring benefits. Figure 2 is a schematic diagram of ρ I 1 0 4. FI104 includes at least a pod container loader 1088, 1083, OIS 150A, a support assembly 160, and a transfer support element including one of the substrate alignment detectors. 166, and a substrate support 162aFI 104 further includes a frame 218, and the device element 160 is fastened to the frame 2 with a conventional device (such as a bolt, a screwdriver, or a fastener in other conventional technologies).丨 8. Figure 2 is an example of an OIS 150 scanning substrate along arrow 134. An OIS 150A includes at least a pair of light sources 56A, 56B (eg, transmitters), and a receiver 58 on a support assembly 160. Light source page 22 This paper size is in accordance with Chinese National Standard (CNS) A4 specifications (210x297 cm) ^ --- (Please read the precautions on the back before filling out this page) Binding · Binding · # 533526 A7 B7 V. Description of the invention ( ) 5 6 A, 5 6B are set at an angle to provide two kinds of lighting angles. In the illustration, the light source 56A provides front lighting and the light source 56B provides rear lighting. In one embodiment, the light source 56 A, The angle between 5 and 6B is about right angle to minimize the degree of illumination overlap (ie, lighting interference). Light source 56 A, 5 6B may include beam-shaping optical devices (such as lenses and such devices), so that The light beam generated by each light source can be enhanced and adjusted. The light receiver 58 is arranged to receive the light reflection and / or scattering part from the surface of the substrate 37. Among them, the light receiver 58 is selected according to the pre-collected data In the illustrated embodiment, the light receiver 58 includes at least a CCD element, a time delay integration (TDI) camera, a photomultiplier tube (PMT), a spectrometer, an OCR camera, etc. The light receiver 58 May include more suitable for enhanced data collection For example, 'in one embodiment, the light receiver 5 8 A includes a bundle of optical fibers to capture and bypass the light received from the viewing point to the receiver 58. During operation, the base The material 37 is moved between the FI internal positions by the pod container loaders 108A, 108B. The OIS 150A then scans the substrate 37, so that the light receiver 58 receives the reflected and / or scattered light required by the process, As described below, when the substrate 37 is moved between the vacuum blocking chamber 106 and the substrate holder 162, one of the pod container loaders 108 A and 108B places the substrate 37 under the OIS 150A. In order to facilitate the scanning action. In addition, the substrate 37 is preferably scanned when the normal substrate is supported. For example, a normal substrate between the pod container loaders 108A and 108B In the material exchange step, the substrate being transported can be scanned by 01S150A. Page 23 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page). Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 Five Description of the invention () The substrate 37 is moved from the pod container loader 108 to a pod container loader 108B. First, the substrate 37 is carried by the pod container loader 108 and is placed on the substrate support In the device 62, the substrate support 162 is used to assist the transfer / exchange process between the pod container loaders 108A and 108B. During this movement, the substrate 37 is hidden by the front-end lighting source 56A In one embodiment, the substrate 37 is moved beyond the middle point to scan the entire surface of the substrate. Figure 3 A-C shows the movement of the substrate 37 during scanning using the front-end illumination light source 5 6 A. FIG. 3A shows the pod container tray 48 immediately after the substrate 37 is moved toward the substrate support 162. At this time, the leading edge of the substrate 37 is located on the signal characteristic path. Therefore, a part of the light source 56A forming the projection light 53 (shown by the shaded area) is intercepted from the leading edge of the substrate. As shown in Figs. 3B-C, the continuous movement of the pod-type container tray 48 causes the projected light 53 to sweep on the surface of the substrate 37. The reflected and scattered light is received by the receiver for processing 'which will be explained below. The pod-type container loader 108B can scan the substrate 37 in the same manner as described above. In another embodiment, the substrate is moved by a single pod-type container loader 108 and operates in conjunction with the two light sources 56A, 56B. For example, when loading a substrate to a substrate support 162 via a pod container loader 108A, the OIS 150A scans the substrate using a front illumination light source 56A; when the substrate is separated from the substrate by the pod container loader 108A When the substrate holder 162 is used, the rear illumination light source 56B is excited to scan the substrate. The receiver 158A receives the reflected and / or scattered light from the substrate when the substrate is placed on the substrate support 162 or the substrate is removed by the pod container loader 08A. Page 24 This paper size applies the Chinese National Standard (CNS) a4 specification (210X297 mm) (Please read the precautions on the back before filling out this page) Order Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 533526 A7 B7 V. Description of the invention () Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, X Consumer Cooperative, Figure 4 shows another example of using IS 150B when the substrate moves along the transfer path shown by arrows 1 32, 1 38. . 〇IS 150B includes at least a single light source 56 A (which can include optical devices for beam shaping), and a light receiver 58 °. IS 150C is placed on the device element 160. The light source 56A is used to provide substrate illumination and includes a beam shaping optical device. In one embodiment, when the substrate 37 is moved from the factory interface 104 to the vacuum blocking chamber 106, the receiver 58 transmits the signal characteristics for receiving reflected and scattered light to the pMC 86, as described below. Figures 5A-C show the sequence of scanning using 〇IS 150B. FIG. 5A is a schematic diagram of the pod-type container carrying tray 48 after the substrate 37 moves toward the vacuum blocking chamber 106. At this time, the leading edge of the substrate 37 is located on the signal characteristic path 54. Therefore, a portion of the projected light 53 (represented by the shaded area) is intercepted from the leading edge of the substrate. As shown in Figs. 5B-C, during the continuous movement of the pod-type container carrying tray 48, the projection light 53 scans the upper surface of the substrate 37. The receiver 58 receives the reflected and scattered light, which will be described later. As mentioned above, in all OIS 105 embodiments, the receiver can be a CCD element, a time delay integration (TDI) camera, a photomultiplier tube (PMT), an OCR camera, and any of these devices. One. Generally speaking, CCD, TDI, and PMT are used for the analysis of a certain signal characteristic to collect the difference in image intensity through the substrate and related differences in flake / particle pollution. The spectrometer is arranged to collect the reflected and / or scattered light signal characteristics at the surface of the substrate 37, and is used to generate the output of the color spectrum component of the output. The OCR collects the reflections on the surface of the substrate 37. Please read-Notes on the backside
者· I 第25頁 本紙張尺度適用中阖國家標準(CNS)A4規格(210X297公釐) 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() /或散射光,並產生一表示基材37上表面之光學特徵的 輸出。在任何實施例中’光學元件皆可加入其中而帶來 效益。以光譜儀而言,收集到的光訊號可經由光纖傳輸 從一收集點至該光譜儀。此外,—散光鏡片(diffuser lens) 可轉合至該光纖,以有效增加視野及輸送至光譜儀以一 平均影像光譜。 此外,ΟIS 1 5 0接收器也可包含一組偵檢元件。舉 例而言’一接收器實施例至少包含一光譜儀及一 CCD 攝相機。在上述實施例中,該光譜儀係設置於鄰近該CCD 攝相機處,且該位置必須符合光譜儀及CCD攝相機對 於基材3 7 .皆有相同之視野的原則。以上述實施例為之 時,以多種製程監視方法並行時的數據取得時間並不會 明顯增加,其中製程監視方法於下文中將有更詳盡的說 明。 應當瞭解的是,上述傳送器(亦即光源)及接收器之 關係僅作為說明用。在上述說明之任何實施例中,該接 收器及傳送器之位置能加以倒置。舉例而言,第2圖所 示之OIS 1 50A可至少包含一對接收器’且該對接收器 設置於光源56A-B處。一光源隨後固定於接收器58a 處。在該實施例中,該接收器傾斜相對於基材為傾斜者, 且該基材位於該光源之正下方。在操作過程中,該接收 器係設置以接收基材表面處的反射及/或散射光的部 份。當基材37位於莢式容器負載器108a,B之間移動時, OIS 150A#瞒基材37,反射及/或散射光由該接收器所 第26頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) (請先閲讀背面之注意事項再填寫本頁) -裝· 訂· # 533526 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明() 接收,以供後文所述之處理用。此外,基材3 7在莢式 容器負載器之間的移動情形同於第3A-C圖所圖示說明 者。 III.轉送處理室 第6圖為本發明一製程系統1 Q 〇之切割透視圖。製 程系統1 0 0至少包含一轉送處理室4 2及設置其上的一 真2處理室44(見於第3A-C圖轉送處理室42及真 2處理室44係藉由一孔徑46進行選擇性連結,且該孔 徑46得以一傳統裝置(例如:位於一開縫閘門(未顯示) 上方的該開缝閘門窗口)密閉之。孔徑46的尺寸大小以 旎讓基材在其間傳送為原則。一機器人5 〇係設置於轉 送處理室42中心處’且機器人50至少包含用以支撐基 材j7之一承載盤48,該承載盤48藉由蛙腳式連桿39 而耦合至該機器人中樞51。機器人5〇能使承載盤48 沿一轉送平面進行旋轉及放射向移動,以使基材得在系 統内的各種位置間輸送基材。轉送處理室42及真空處 理A 4 4以作為製程系統1 〇 〇之組成者為更佳,如可為 第1A圖所示之處理室的組成。因此,轉送處理室42 可為一真空阻絕處理室106,以作為與周圍各處理室聯 繫的一真空環境時’真空處理室44以作為一前端環境 與轉送處理室42間的一介面處理室;而轉送處理室42 提供一可與各周環排列之處理室的真空環境。另外,真 玉處理A 44可為一製程處理室’如一冷卻處理室或一 第27頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐)" --- .... .................... (請先閲讀背面之注意事項再填寫本頁) 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 定位處理室,下文之實施例將配合第12A-C圖加以說 明。 如第6圖所示,一傳送組件5 6及一接收組件5 8外 側鑲設至轉送處理室42之一蓋件52上。在一實施例中, 傳送組件56包含一光源60及光束成形之光學裝置62, 且傳送組件56係設置以激發一訊號54,而該訊號54 經由一視埠6 4進入轉送處理室4 2之空腔41内。視埠 64至少包含一形成於蓋件内部的一空孔,且視埠64係 由光源60之訊號54可穿透之材料構成的一盤件66加 以密封。在一實施例中,盤件66至少包含石英玻璃 (Quartz GlassTM)或任何光線能穿透之媒介,例如:玻璃、 透明聚合物、氬化鎵及此種材料,這些材料皆可經過處 理而使其為光可穿透。 在操作過程中,訊號54以平行第2圖中的X軸方 向前進,且被導引至透過轉送處理室42之空腔41轉動 的基材3 7 (或相對於訊號特徵5 4產生相對移動)一上表 面。該訊號在落於基材37上時構成一投射光區53,將 於下文中說明之。投射光區53之大小可依基材大小而 不同,而改變的方式為調整光束成形之光學裝置62及 光源60間的位置。 在一光源60實施例中,該光源60可為一具相干性 之光源(例如:雷射)、一非相干性寬頻光源、或其他非 相關性窄頻光源(例如:紅外光源)。在其他實施例中, 光源6 0可包含照明訊號,例如:射頻、微波等訊號。 第28頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇X297公釐) ' — (請先閲讀背面之注意事項再填寫本頁) 【裝· 、可' # 經濟部智慧財產局員工消費合作社印製 533526 A7 一 ___B7 五、發明説明() 一般而言,光源60則的選擇係依所需之散射強度、亮 度及成本而定。使用一雷射光源時,其雷射光源以約8 〇 8 奈米者為佳。不過,其他雷射光源波長(例如:65〇奈米 或680奈米)也能被使用。 一般而言,投射光53點的大小大體上為光束成形 之光學裝置62及傳送組件56與基材表面的相對位置而 定。其中’光束成形之光學裝置62的選擇係依基材尺 寸而定。在一實施例中,光點被聚集成一緊密光線,其 中該光線寬能容納該承載盤的移動(例如:垂直移動)。 以一直徑260釐米之基材為例,投射光53於一基材上 表面上的光點大小以約為1毫米(寬度)及約為該基材寬 度260釐米(長度;Y軸)者為佳。因此,在操作過程之 單一掃瞄後,直徑260釐米之基材總寬度皆暴露於訊號 54之中。然而,在其他實施例中,基材只有部份部位 暴露於訊號54之中。以粒子污染偵測為例(一種典型的 極度嚴重處理室污染源’如薄片(亦稱為處理室循行者 (excursions),其能產生數百個粒子,這些粒子落居在 處理室中的基材表面上)。雖然以檢視全部基材者為佳, 但成功之製程檢視只需對部分受污染之基材進行污染確 認即可。此外,其他基材特徵(例如:膜厚、終點確認 等特徵)之製程監視也能以對有限之表面加以檢視即 "5J" 〇 接收組件58設於一蓋件52内部之視埠7〇中,並 用以界定基材37移動通過空腔41時一往基材方向<一 第29頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇><297公楚) (請先閱讀背面之注意事項再填寫本頁)· I page 25 This paper is in accordance with China National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention () and / or scattered light An output representing the optical characteristics of the upper surface of the substrate 37. In any embodiment, the 'optical element' can be added to bring benefits. In the case of a spectrometer, the collected optical signals can be transmitted through a fiber from a collection point to the spectrometer. In addition, a diffuser lens can be transferred to the fiber to effectively increase the field of view and deliver it to the spectrometer for an average image spectrum. In addition, the 0IS 1 50 receiver can also contain a set of detection elements. For example, a receiver embodiment includes at least a spectrometer and a CCD camera. In the above embodiment, the spectrometer is disposed adjacent to the CCD camera, and the position must conform to the principle that the spectrometer and the CCD camera have the same field of view for the substrate 37. Taking the above embodiment as an example, the data acquisition time when multiple process monitoring methods are in parallel will not increase significantly. The process monitoring method will be explained in more detail below. It should be understood that the relationship between the transmitter (ie, the light source) and the receiver described above is for illustration purposes only. In any of the embodiments described above, the positions of the receiver and the transmitter can be inverted. For example, the OIS 1 50A shown in FIG. 2 may include at least a pair of receivers' and the pair of receivers are disposed at the light sources 56A-B. A light source is then fixed at the receiver 58a. In this embodiment, the receiver is inclined relative to the substrate, and the substrate is located directly below the light source. During operation, the receiver is arranged to receive a portion of reflected and / or scattered light at the surface of the substrate. When the substrate 37 is moved between the pod-type container loaders 108a and B, OIS 150A # conceals the substrate 37, and the reflected and / or scattered light is transmitted by the receiver. Page 26 This paper applies the Chinese National Standard (CNS) A4 specifications (210x297 mm) (Please read the notes on the back before filling out this page)-Binding · Ordering · # 533526 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention () Received for later The processing described in the text. In addition, the movement of the substrate 37 between the pod container loaders is the same as that illustrated in Figs. 3A-C. III. Transfer processing chamber FIG. 6 is a cut perspective view of a process system 1 Q 〇 according to the present invention. The process system 100 includes at least a transfer processing chamber 42 and a true 2 processing chamber 44 (see Figure 3A-C). The transfer processing chamber 42 and the true 2 processing chamber 44 are selectively selected through an aperture 46. The aperture 46 is sealed by a conventional device (for example, the slotted gate window above a slotted gate (not shown). The size of the aperture 46 is based on the principle of allowing the substrate to be transported between them.) The robot 50 is disposed at the center of the transfer processing chamber 42 ′, and the robot 50 includes at least a carrier plate 48 for supporting the substrate j7, and the carrier plate 48 is coupled to the robot center 51 by a frog foot link 39. The robot 50 can rotate the carrier plate 48 along a transfer plane and move it in a radial direction, so that the substrate can be transferred between various positions in the system. The transfer processing chamber 42 and the vacuum processing A 4 4 are used as the process system 1 The composition of 〇〇 is more preferable, for example, it can be the composition of the processing chamber shown in FIG. 1A. Therefore, the transfer processing chamber 42 can be a vacuum blocking processing chamber 106 as a vacuum environment connected with the surrounding processing chambers. Hour 'Vacuum Processing Room 44 is used as an interface processing chamber between a front-end environment and a transfer processing chamber 42; and the transfer processing chamber 42 provides a vacuum environment in which processing chambers can be aligned with each peripheral ring. In addition, the real jade processing A 44 can be a process processing chamber 'If a cooling processing room or page 27, this paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) " --- ................. ....... (Please read the precautions on the back before filling out this page) 533526 A7 B7 Printed by the Consumer Consumption Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Positioning processing room, the following examples will cooperate with the 12A-C. As shown in FIG. 6, a transmission module 56 and a receiving module 58 are externally mounted on a cover 52 of the transfer processing chamber 42. In one embodiment, the transmission module 56 includes A light source 60 and a beam-shaping optical device 62 are provided, and the transmission component 56 is arranged to excite a signal 54 which enters the cavity 41 of the transfer processing chamber 42 through a view port 64. The view port 64 contains at least An empty hole formed in the cover, and the view port 64 is a material that can be penetrated by the signal 54 of the light source 60 A plate member 66 is sealed. In one embodiment, the plate member 66 includes at least quartz glass (Quartz GlassTM) or any light-transmitting medium such as glass, transparent polymer, gallium argon, and such materials. These materials can be processed to make them light-transmissive. During operation, the signal 54 advances parallel to the X-axis direction in Figure 2 and is guided to rotate through the cavity 41 of the transfer processing chamber 42 An upper surface of the substrate 3 7 (or a relative movement relative to the signal characteristic 5 4). This signal when projected on the substrate 37 constitutes a projected light region 53, which will be described later. The size of the projected light region 53 may be different depending on the size of the substrate, and the changing method is to adjust the position between the optical device 62 and the light source 60 for beam shaping. In an embodiment of a light source 60, the light source 60 may be a coherent light source (such as a laser), a non-coherent broadband light source, or other non-correlated narrow-band light sources (such as an infrared light source). In other embodiments, the light source 60 may include an illumination signal, such as a radio frequency signal and a microwave signal. Page 28 This paper size applies to China National Standard (CNS) A4 specification (21 × 297 mm) '— (Please read the precautions on the back before filling this page) [装 · , 可' # Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the consumer cooperative 533526 A7 A___B7 V. Description of the invention () Generally speaking, the choice of the light source 60 is based on the required scattering intensity, brightness and cost. When a laser light source is used, its laser light source is preferably about 0.8 nm. However, other laser light source wavelengths (for example: 65nm or 680nm) can also be used. In general, the size of the 53 points of the projected light is generally determined by the relative positions of the beam forming optical device 62 and the transmission component 56 to the surface of the substrate. The selection of the 'beam shaping optical device 62' depends on the size of the substrate. In one embodiment, the light spot is focused into a compact light beam, wherein the light beam is wide enough to accommodate the movement (eg, vertical movement) of the carrier disk. Taking a substrate with a diameter of 260 cm as an example, the spot size of the projected light 53 on the upper surface of a substrate is about 1 mm (width) and about 260 cm (length; Y axis) of the substrate width. good. Therefore, after a single scan during operation, the total width of the substrate with a diameter of 260 cm is exposed to the signal 54. However, in other embodiments, only a portion of the substrate is exposed to the signal 54. Take particle contamination detection as an example (a typical source of extreme severe processing chamber pollution, such as flakes (also known as processing chamber excursions), which can generate hundreds of particles that fall on the surface of the substrate in the processing chamber Top). Although it is better to inspect all substrates, successful process inspection only needs to confirm the contamination of some contaminated substrates. In addition, other substrate characteristics (such as film thickness, endpoint confirmation, etc.) The process monitoring can also be used to view the limited surface, that is, "5J". The receiving module 58 is located in the viewport 7 inside a cover 52, and is used to define the substrate 37 as it moves through the cavity 41. Orientation <-page 29 This paper size applies Chinese National Standard (CNS) A4 specifications (21〇 > < 297 Gongchu) (Please read the precautions on the back before filling this page)
533526 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 訊號路徑6 1。該接收組件5 8係牢固於一能量穿透盤件 72上,其中能量穿透盤件72的組成材料係依訊號54 之波長而定,並以與設置於視埠64内部之盤件66同一 材料為更佳。舉例而言,當使用波長約為8 0 8釐米之一 雷射光源時,盤件66,72之組成材料選定為能容納一 808 奈米波長之訊號者。操作中,接收組件58的設置用以 接收由基材37所發出之訊號54的散射部份74。基材37 上表面之散射及/或反射光部份74在圖式中以多方向箭 頭表示之,這些箭頭方向與基材37上表面的夾角為不 同者’並能指出基材3 7上阻礙物(例如:污染粒子或位 於基材37上表面上的元件圖案)之存在。訊號54之一 反射部份69的行進方向與基材37表面之夾角大致等於 入射角α。反射部份69表示與基材37上表面接觸時並 無阻礙之訊號54部份。 接收組件 5 8包含一光學配件80,該光學配件 80 至少包含一或多個鏡片及一偵檢器82。接收組件5 8之 偵檢器82以至少包含一電荷耦合元件(CCD)線性攝相 機者為佳,其中一 CCD線性攝相機為一較佳選擇,因 為此時對於基材之全部範圍而言、光源與接收器之間的 角度皆得以維持,因而產生一致照明接收環境。在接收 環境中,使用一 CCD線性攝相機而掃瞄一行動中的基 材,一影像因此形成。雖然,在使用上以CCD偵檢器 為佳,但本發明實施例中也可使用其他偵檢器,包含: 時間延遲積分(TDI)攝攝相機或光倍增管(ρΜΤ)。在其他 第30頁 (請先閲讀背面之注意事項再填寫本頁) 一裝- 訂. % 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公爱) B7533526 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Signal path 6 1. The receiving component 58 is fastened to an energy penetrating disk 72. The material of the energy penetrating disk 72 is determined by the wavelength of the signal 54 and is the same as the disk 66 disposed inside the view port 64. The material is better. For example, when a laser light source with a wavelength of about 808 cm is used, the constituent materials of the disks 66, 72 are selected to be able to accommodate a signal with a wavelength of 808 nm. In operation, the receiving component 58 is arranged to receive the scattering portion 74 of the signal 54 emitted by the substrate 37. The scattered and / or reflected light portion 74 on the upper surface of the substrate 37 is indicated by multi-directional arrows in the drawing, and the angle between the direction of these arrows and the upper surface of the substrate 37 is different, and can indicate the obstacle on the substrate 37. The presence of objects such as contaminated particles or element patterns on the upper surface of the substrate 37. The angle between the direction of travel of the reflective portion 69 and the surface of the substrate 37, which is one of the signals 54, is approximately equal to the incident angle α. The reflecting portion 69 indicates a portion of the signal 54 which is not obstructed when in contact with the upper surface of the substrate 37. The receiving component 58 includes an optical accessory 80. The optical accessory 80 includes at least one or more lenses and a detector 82. The detector 82 of the receiving component 58 is preferably one that includes at least one charge-coupled device (CCD) linear camera. One of the CCD linear cameras is a better choice because at this time, for the entire range of substrates, The angle between the light source and the receiver is maintained, resulting in a uniform lighting receiving environment. In the receiving environment, a CCD linear camera is used to scan a moving substrate, and an image is formed. Although a CCD detector is preferred in use, other detectors may be used in the embodiments of the present invention, including: a time delay integration (TDI) camera or a photomultiplier tube (ρMT). Others Page 30 (Please read the notes on the back before filling out this page) One Pack-Order.% This paper size applies to China National Standard (CNS) A4 (210x297 public love) B7
533526 Α7 五、發明説明() 實施例中,接收組件5 8係自一或多個光譜儀及〇CR接 收器中選出。 上述對於傳送組件5 6及接收組件5 8的設置說明僅 用於說明’其他設置實施例亦可使用之。舉例而言,第 6圖所示之傳送組件5 6及接收組件5 8係位於轉送處理 室42之空腔41外側;在另一實施例中,傳送組件56 及接收組件5 8係位於空腔4 1内部,因而位於真空環境 下;但在另一實施例中,在空腔41内部可設置鏡面, 以能使臨界角數目變得較多。 第6圖中的操作實施例可由第7 A-C圖製程系統1〇〇 的上視圖加以說明。第7A-C圖顯視在轉動通過轉送處 理室42之過程中、承載盤48及基材37的各種位置。 第3 A圖所示為逆時鐘轉動甫開始時的承載盤4 8,此時 基材37前緣92係位於訊號54路徑上。因此,以陰影 區表示的一投射光53部位即為基材37前緣92與入射 光之交會處。在承載盤48之連續轉動過程中,投射光 53掃瞄基材37之上表面,以第3B-C圖說明之。投射 光5 3照射到基材3 7上的阻礙物7 5,訊號5 4因此形成 散射及反射。雖然阻礙物7 5尺寸可能為微米級,但圖 式為求清晰而將其放大。阻礙物7 5可能為一製程處理 室薄片、一表面缺陷(沖蝕、凹陷等缺陷)、或一元件特 徵區。訊號54之散射及/或反射部份74隨後以接收組 件58加以收集。當偵檢器82為一 CCD時,該散射及/ 或反射部位74係由接收器光學裝置80加以聚集’接著 第31頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 裝tr (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 五、發明説明() 成像至CCD元件上,隨後轉換成電子訊號並傳送至pMe 8 6,用以進行處理。 應當瞭解的是,上述執行步驟順序可在基材37於 一製程處理室中的處理週期前及/或後執行之。舉例而 言,第3 A-C圖顯示一正傳送中之基材,該基材沿製程 檢視繞行路徑122,124從一真空阻絕處理室轉送至—製 程處理室。另外,第7 A - C圖顯示一經處理過之基材被 轉送至一冷卻處理室或返回至一真空阻絕室1〇6。 在另一實施例中,製程檢視動作係執行於機器人5 〇 沿檢視繞行路徑1 24縮回、或延伸而進入、或離開一製 程處理室、一服務處理室、真空阻絕室之時。第8A-C 圖所示即為檢視實施例之動作。弟8 A - C圖為製程系统 100之上視圖,其中顯示承載盤48及基材37線性通過 該處理室44而至轉送處理室42時的各種位置。 f請先閱讀背面之注意事项再填寫本頁) ·裝· 訂· 經濟部智慧財產局員工消費合作社印製 第8 A-C圖為製程系統 100 之上 視圖 ,其 中顯示 有 承 載盤48及基材37,此時 承載 盤48從轉送處理室 42 通 過孔徑4 6而進入處理室 44 〇 其中 ,處 ,理室 44可 為 任 何形式之處理室,例如: 一製 程處 理室 冷卻處 理 室 、一度量處理室、或一基 材定 位處 理室 。在 第8Α 圖 中 ,所示者為從真空處理室 44 線性 移動 至轉 送處理 室 42 動作甫開始時之承載盤4 8,此時基材 3 7前 •緣92 位 於 訊號 54路徑上。因此, 以陰 影區 域表 示之 一投射 光 53 部位與基材37之前緣92 相截 〇 為達到最大化基材3 7 暴露 表面 區域 之目 的,當 基 第32頁 舞 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公^ ----- A7533526 Α7 5. Description of the invention () In the embodiment, the receiving components 58 and 8 are selected from one or more spectrometers and OC receivers. The above description of the setting of the transmitting component 56 and the receiving component 58 is only used to illustrate that ′ other setting embodiments may also be used. For example, the transmission module 56 and the receiving module 58 shown in FIG. 6 are located outside the cavity 41 of the transfer processing chamber 42. In another embodiment, the transmission module 56 and the receiving module 58 are located in the cavity. 4 1 is inside, so it is located in a vacuum environment; but in another embodiment, a mirror surface may be provided inside the cavity 41 so that the number of critical angles can be increased. The operation example in FIG. 6 can be explained by the top view of the process system 100 in FIG. 7 A-C. Figures 7A-C show various positions of the carrier tray 48 and the substrate 37 during the rotation through the transfer processing chamber 42. Figure 3A shows the carrier disk 48 at the beginning of counterclockwise rotation. At this time, the leading edge 92 of the substrate 37 is located on the signal 54 path. Therefore, a part of the projected light 53 indicated by the shaded area is where the leading edge 92 of the substrate 37 meets the incident light. During the continuous rotation of the carrier plate 48, the projected light 53 scans the upper surface of the substrate 37, and is illustrated in Figs. 3B-C. The projected light 5 3 hits the obstacle 7 5 on the substrate 3 7, and the signal 5 4 forms scattering and reflection. Although the size of the obstacle 75 may be in the order of micrometers, the pattern is exaggerated for clarity. The obstruction 75 may be a thin film of a process chamber, a surface defect (defect such as erosion, dent, etc.), or a characteristic area of a component. The scattering and / or reflecting portion 74 of the signal 54 is then collected by the receiving component 58. When the detector 82 is a CCD, the scattering and / or reflection parts 74 are collected by the receiver optical device 80 '. Then on page 31, this paper size is applicable to China National Standard (CNS) A4 (210X297 mm). tr (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 V. Description of the invention () Imaging on the CCD element, then converting it into an electronic signal and transmitting it to pMe 8 6 For processing. It should be understood that the above sequence of execution steps may be performed before and / or after the processing cycle of the substrate 37 in a process chamber. For example, Figures 3 A-C show a substrate being transferred, which is transferred from a vacuum barrier processing chamber to a process processing chamber along a process inspection bypass path 122,124. In addition, Figures 7A-C show that a treated substrate is transferred to a cooling process chamber or returned to a vacuum barrier chamber 106. In another embodiment, the process inspection action is performed when the robot 50 is retracted or extended along the inspection bypass path 1 24 to enter or leave a process processing room, a service processing room, and a vacuum blocking room. Figures 8A-C show the actions of the review embodiment. Figures 8A-C are top views of the process system 100, which show various positions when the carrier tray 48 and the substrate 37 pass linearly through the processing chamber 44 to the transfer processing chamber 42. f Please read the precautions on the back before filling in this page.) · Binding · Binding · Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives. Figure 8 AC is a top view of the process system 100, which shows the carrier plate 48 and the substrate 37. At this time, the carrier tray 48 enters the processing chamber 44 from the transfer processing chamber 42 through the aperture 46, where the processing chamber 44 can be any type of processing chamber, for example: a process processing chamber cooling processing chamber, a metrology processing chamber Or a substrate positioning processing chamber. In FIG. 8A, the linear movement from the vacuum processing chamber 44 to the transfer processing chamber 42 is shown in the load tray 4 8 at the beginning of the operation. At this time, the front edge 92 of the substrate 3 7 is located on the signal 54 path. Therefore, the part of the projected light 53 indicated by one of the shaded areas is cut off from the leading edge 92 of the substrate 37. In order to maximize the exposed surface area of the substrate 37, the paper dimensions on page 32 apply Chinese national standards ( CNS) A4 specification (210X297 male ^ ----- A7
經濟部智慧財產局員工消費合作社印製 533526 五、發明説明() 材37在孔徑46處離開處理室42時,訊號54以能與基 材37相截為更佳。在承載盤48完全收縮後,基材37 能確保其大致全部上表面全部暴露,經由訊號37掃瞄 之基材表面區域因此得以最大化。如第8B-C圖所示, 在承載盤連續線性移動過程中’投射光5 3掃瞄基材3 7 之上表面。 第4,7A-C,8A-C圖中的實施例的提出為說明用。另 一實施例中’結合一對傳送組件5 6及一接收組件5 8以 監視一基材的線性移動或旋轉轉動過程,此設置能改善 偵測精準度。習知此項技藝者皆可知本發明仍有其他實 施例。再者,在執行本發明之製程監視方法時,掃瞄基 材 < 單一表面能提供高度精確性,而採用其他方法亦可 增強製程監視能力。舉例而言,一機器人承載盤48可 能震盪或位移,因此某一阻障物能被移進陣列元件之另 一 CCD偵檢元件(或一辅助式高解析度攝相機)的視野 中。此外,使用一多模式攝相機可用以自動改變焦距、 視野等以增強對阻礙物之觀察能力。在多偵檢元件群中 加入機器人可使各種監視方法的執行得到額外的解析 度。 在另一實施例中,OIS 150係設置以一灰階組態 (gray-field configuration )從轉送處理室11〇中接收主 要反射光。第9,1 0圖所示為製程系統丨〇 〇之部分剖面 圖,且就實際而言為一製程處理室114及轉送處理室n〇 之部分剖面圖。其中,用以搬運一基材37之機器人133 第33頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公楚) (請先閲讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 V. Description of Invention () When the material 37 leaves the processing chamber 42 at the aperture 46, the signal 54 is better to be able to intercept the material 37. After the carrier tray 48 is fully contracted, the substrate 37 can ensure that almost all of its upper surface is exposed, and the surface area of the substrate scanned by the signal 37 is thus maximized. As shown in Figures 8B-C, during the continuous linear movement of the carrier disk, the 'projected light 5 3 scans the upper surface of the substrate 3 7. The examples in Figs. 4, 7A-C and 8A-C are proposed for illustration. In another embodiment, a combination of a pair of transmitting components 56 and a receiving component 58 is used to monitor the linear movement or rotation of a substrate. This setting can improve the detection accuracy. Those skilled in the art will know that there are still other embodiments of the present invention. Furthermore, when performing the process monitoring method of the present invention, the scanning substrate < a single surface can provide a high degree of accuracy, and other methods can also enhance the process monitoring capability. For example, a robot carrier plate 48 may oscillate or move, so an obstacle can be moved into the field of view of another CCD detection element (or an auxiliary high-resolution camera) of the array element. In addition, the use of a multi-mode camera can be used to automatically change the focal length, field of view, etc. to enhance the ability to observe obstructions. Adding a robot to a multi-detection component group enables additional resolutions for the execution of various surveillance methods. In another embodiment, the OIS 150 is configured to receive the main reflected light from the transfer processing chamber 110 in a gray-field configuration. Figures 9 and 10 show a partial cross-sectional view of the process system 丨 〇 〇, and actually a partial cross-sectional view of a process processing room 114 and the transfer processing room no. Among them, the robot 133 used to carry a substrate 37 page 33 This paper size applies to China National Standard (CNS) A4 (210x297 cm) (Please read the precautions on the back before filling this page)
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經濟部智慧財產局員工消費合作社印製 鄰近於製程處理室1 1 4的入口處。第9圖中的接收組件 5 8 C及傳送组件5 6係固定於構件丨7 6處,且被設置於 一視埠120内,並擁有觀察基材37之視野。在另一實 施例中’第1 0圖的接收組件5 8 D及傳送組件5 6係固 定於構件176處,且被設置於一視埠12〇内,並擁有觀 察基材3 7之視野。其中,接收器5 8 c或5 8 d以為任何 能接收光譜數據之裝置為佳。 當基材37位於〇IS 150C下方時,傳送組件56所 發出之光為基材37上表面反射及/或散射:當基材37 如第1 0圖所示位於〇 IS 1 5 〇 D下方時,傳送組件5 6發 出之光為基材37上表面反射及/或散射^在一些實施例 中’基材3 7係以上述方式使用一照明光源5 6掃瞄之; 但在其他實施例中,全部或大致全部之基材由寬頻閃光 裝置或類似裝置照明之。在任何情況下,反射光係由第 9圖中的接收組件58C、或第1〇圖中的接收組件58〇 收集之’並傳送至PMC86,以供作處理用。特定而言, 收集到的資料被加以處理,以辨識基材37之光譜特徵, 光譜分析之詳細步驟則於下文予以說明。 如第9圖中所示之一實施例,該接收組件可為一光 譜儀58C ,用以接收入射能量/訊號、及輸出其光譜組 成之分佈與強度,以決定存有之能量組成。光譜儀58C 藉由一光學配件170與視埠66之視野耦合,其中光學 配件1 70至少包含一光纖纜線、及/或廣角鏡頭、及/或 散光鏡片及其他光學裝置,用以聚焦、成形、及控制訊 第34頁 (請先閲讀背面之注意事項再填寫本頁) _裝- I.--訂. # 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 經濟部智慧財產局員工消費合作社印製 533526 A7 _________Β7 五、發明説明() 號,以使光譜儀58C得視見全部基材37及/或基材37 之部分部位。 如第1 0圖中所示之一實施例,接收組件5 8 C至少 包含一 OCR攝相機58D。〇cR攝相機58D係設置以掏 取基材3 7上表面之特徵影像,供作辨識基材用。這歧 基材上的特徵包含條碼及其他符號辨識標記。這種裝置 的說明已列於前文,在此將不進行細部討論。 第6,7A-C,9,l〇圖所示之實施例中,傳送組件%及 接收組件5 8係位於轉送處理室上、或位於轉送處垤室 内部,也可採用其他實施例而帶來助益。一般而言,傳 送組件56及接收組件5 8可設置於製程系統1 〇〇的任何 位置上,但必須以訊號可導至移動中或未移動基材之上 表面上、且接收組件5 8可偵測到散射及/或反射訊號為 原則。多傳送器/接收器可置於該系統各處。 IV.蓋件 第11及12A-C圖所示為一蓋件1100,並用以說明 一 OIS 150實施例。蓋件11〇〇設置於一(或一部分)製程 處理室或一服務處理室上。蓋件1100包含各種在操作 上為OIS 150之一部位的各種裝置及特徵。蓋件11〇〇 通常包含一將其内部分作三埠1110,11 12,1114的體結 構。在一實施例中,一第一埠111 〇能提供一接收組件 或攝相機111 6之視線,其中後者可為一電荷耦合元件 (CCD),用以接收處理室内部發出光學輸入訊號。一第 第35頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ----…丨·.....0^.......丨丨Ίπ......... f請先閲讀背面之注意事項再場寫本頁 } 533526 A7 B7 五、發明説明() 二埠1112及第三埠1114形成於蓋件1100内,用以提 供一或多個傳送組件、或光源11 1 8,1 1 2 0能藉由任何埠 而與該處理室耦合,並提供光源1118,1120之光線陷阱 (traps)(即基材處的反射及/或散射光的出處)。在另一實 施例中,光源1 1 1 8,1 1 20為一光纖及光源的組合,用以 形成一水平光線。攝相機1116及光源1118,1120之任 一者皆使用支撐托架1152,1153,1154固接至該處理室。 在一實施例中,光源1118,1120可為一鹵素光源或操作 波長範圍為 400奈米至 750奈米的其他光源。埠 1110,1112,1114之任一者之内皆具有一能量穿透窗口 1122,1124,1126,用以提供該處理室之真空隔離,該蓋 件則位於該處理室之上。在一特殊實施例中,蓋件丨丨i 〇 也包含光學配件1121,1123,後者分別位於窗口 1124,1126與光源1Π8,1120之間。其中,光學配件 11 2 1,1 1 2 j可為遽鏡、散光鏡、透鏡等構成的任意組合。 固接至窗口 1122,1124,1126、該CCD或攝相機 1116、及光源1U8,1120之蓋件111〇可由鋁金屬或其他 可加工之材料構成,以符合真空環境中逸氣(〇utgassing) 及多孔性的需求β蓋件1 1 1 〇内的任何表面以經由加工 或研磨而提供一預定反射性表面為佳。在蓋件丨11〇之 一實施例中,其可由一金屬材料製成,該金屬材料至少 可為一具有合適之粗糙度或拋光度之表面1130。以光 源1118,1120及CCD 1116所用之孔而言,其表面皆經 過研磨處理。舉例而言,CCD埠u1〇内之表面能加工 第36頁 本紙張尺度適用中國國家標準(CNS)A4規格(2Ϊ0Χ297公釐~ (請先閲讀背面之注意事項再填寫本頁) 裝· 訂· 經濟部智慧財產局員工消費合作社印製 533526 五 經濟部智慧財產局員工消費合作社印製 A7 B7 發明説明() 至32 RA,第一光源1114内之表面能加工至16 RA,而 第二光源U 1 2内之表面能加工至8 RA ^上述表面皆加 工至一定的表面平整度以上’以能將返回至處理室之光 環境之二次光的散射減至最低為原則。 由於一高反射性表面的存在,反射光因而得有效經 過窗口 1126及/或1124而離開處理室。 第12A-C圖所示為位於一製程處理室1101(例如: 一冷卻處理室)上端之蓋件1 1 0 0的剖面圖。製程處理室 1 1 0 1大致包含具有側壁1 1 02及一底部1 1 04之一處理 室主體。一支撐構件H〇6可設置該處理室底部,以接 收及支撐一導至處理室中的基材37。支撐構件1106 可包含一冷卻系統(例如一流體通道、及冷卻流體源), 用以冷卻基材等。蓋件1110具有一 OIS 15 0E,其中後 者置於前者之上,而前者位於該處理室壁之上表面處, 並形成該處理室壁上表面處的一封塞。 CCD 1116所用之埠1110 —水平線相夾第一角度01 處,該水平線即該基材37被導至處理室11〇1之方向(亦 即一基材轉送路徑)。此角度提供之視線能看見基材37 進入處理室1101而置放於一機器人承載盤48上。用於 光源1 1 1 8,1 1 2 0之任何埠111 〇,1 11 2,1 1 1 4的角度設置以 使一第一光源1 1 1 8能提供一基材3 7之前部照明、而一 第二光源1 1 2 0提供該基材之後部照明為原則其中該基 材3 7係相對應於c C D 11 1 6而進入處理室1 1 0 1之時受 到照明。前部及後部照明可同時或分開在對處理室i丨〇 i 第37頁 本紙張尺舰财_ 規格(210x297公爱) —— .....0^.......· ......... (請先閲讀背面之注意事項再填寫本頁) 533526 A7 B7 五、發明説明( 經濟部智慧財產局員工消費合作社印製 導入或縮回基材時昭明> 〒…、明 <(例如··一基材導入、而其基 材縮回)。用於提供第-光源uu之槔m2係位於— 第二角度㊀2處’此角度與埠⑴。及攝相機1116的夾 角01不同。用於第二光源〗 尤你1120(吓即背部照明光源U2〇) 之埠1 1 1 4係位於—篥= 弟一角度θ3處,該第三角度63係 相對於基材之轉送平面而^ ^竹忆十面而& ,並與第一夾角及第二 爽角θ2不同。在4 1114之一侧壁上有一訊號反射平面 11 28 ’用以使第—光源i i 2〇相對於基材有一較陡峭之 入射角,並仍能使入射至基材37之入射角符合所需。 如第以圖中所示’相對於基材37,光源1120所發射 之光束的入射角為04。 在二只施例中,攝相機1116及光源ιι18,112() 方向可自動調整(相對於手動方式調整)。舉例而言, 合至一控制系統之伺服電動器或類似之致動器(雖未 示)可用以移動各種組件、調整孔徑尺寸、及從一遠 處聚焦。在-實施例中,二攝㈣ui6係以側靠側 方式排列,以增大對基材的觀看視野,並在前後歇接 設置方式排列時增加影像之解析度。 用於第-及第二光源1118’112G之任何槔1112丄 係設置作為其他光源之一光線捕捉陷阱。亦即,用於 二光源H20之崞1114作為第一光源ιιΐ8處由基材 面反射及散射之光的捕捉陷阱;相同地,用於第一光 m8之埠1112作為第二光源1120處由之基材表面反 及政射之光的捕捉陷畔。鄰接於光源崞1126之蓋件 第38頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公爱) 之 顯 之 114 第表 源射 1130 (請先閲讀背面之:/X意事項再填寫本頁)Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, adjacent to the entrance of the processing room 1 1 4. The receiving component 5 8 C and the transmitting component 5 6 in Fig. 9 are fixed to the component 丨 76, and are arranged in a viewing port 120, and have a field of view for viewing the substrate 37. In another embodiment, the receiving component 5 8 D and the transmitting component 56 of FIG. 10 are fixed to the component 176, are disposed in a viewing port 120, and have a field of view for viewing the substrate 37. Among them, the receiver 5 8 c or 5 8 d is preferably any device capable of receiving spectral data. When the substrate 37 is located below the 〇IS 150C, the light emitted by the transmission component 56 is reflected and / or scattered by the upper surface of the substrate 37: when the substrate 37 is located below 〇IS 1 5 〇 as shown in FIG. 10 The light emitted by the transmitting component 56 is the reflection and / or scattering of the upper surface of the substrate 37. In some embodiments, the 'substrate 37 is scanned using an illumination light source 5 6 in the manner described above; but in other embodiments All or substantially all substrates are illuminated by a broadband flash device or similar device. In any case, the reflected light is collected by the receiving unit 58C in FIG. 9 or the receiving unit 58 in FIG. 10 and transmitted to PMC86 for processing. In particular, the collected data is processed to identify the spectral characteristics of the substrate 37, and the detailed steps of the spectral analysis are described below. As an embodiment shown in FIG. 9, the receiving component may be a spectrometer 58C, which is used to receive the incident energy / signal and output the distribution and intensity of its spectral composition to determine the existing energy composition. The spectrometer 58C is coupled to the field of view of the viewing port 66 through an optical accessory 170, where the optical accessory 1 70 includes at least a fiber optic cable and / or a wide-angle lens, and / or astigmatic lenses and other optical devices for focusing, shaping, and Control News Page 34 (Please read the precautions on the back before filling this page) _Package-I .-- Order. # This paper size applies to China National Standard (CNS) A4 (210X297 mm) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Consumption Cooperative 533526 A7 _________B7 V. The invention description () number, so that the spectrometer 58C can see all the substrate 37 and / or part of the substrate 37. According to an embodiment shown in FIG. 10, the receiving component 5 8 C includes at least an OCR camera 58D. 〇cR camera 58D is set to extract the characteristic image of the upper surface of the substrate 37 for identification of the substrate. Features on this substrate include barcodes and other symbol identification marks. The description of this device has been listed above and will not be discussed in detail here. In the embodiments shown in Figures 6,7A-C, 9,10, the transmission module% and the receiving module 58 are located on the transfer processing room or inside the transfer room or inside the room. Other embodiments may also be used. To help. Generally speaking, the transmitting component 56 and the receiving component 58 can be set at any position in the manufacturing system 100, but it must be signaled to the upper surface of the moving or non-moving substrate, and the receiving component 58 can The principle is to detect scattered and / or reflected signals. Multiple transmitters / receivers can be placed throughout the system. IV. Covers Figures 11 and 12A-C show a cover 1100 and are used to illustrate an OIS 150 embodiment. The cover 1100 is set on a (or part of) a process processing room or a service processing room. The cover 1100 contains various devices and features that are part of the OIS 150 in operation. The cover 1100 usually includes a body structure in which the inner part is made of three ports 1110, 11 12, 1114. In an embodiment, a first port 111 can provide a line of sight of a receiving component or camera 111 16, wherein the latter can be a charge coupled device (CCD) for receiving an optical input signal from the interior of the processing chamber. First page 35 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) ----... 丨 · .... 0 ^ ....... 丨 丨 Ίπ .... ..... f Please read the notes on the back before writing this page} 533526 A7 B7 V. Description of the invention () The second port 1112 and the third port 1114 are formed in the cover 1100 to provide one or more The transmission component or light source 11 1 8, 1 1 2 0 can be coupled to the processing chamber through any port and provide light traps (ie, reflections and / or scattered light at the substrate) of the light sources 1118, 1120. Source). In another embodiment, the light sources 1 1 1 8 and 1 1 20 are a combination of an optical fiber and a light source for forming a horizontal light. Each of the camera 1116 and the light sources 1118, 1120 is fixed to the processing chamber using support brackets 1152, 1153, 1154. In one embodiment, the light sources 1118, 1120 may be a halogen light source or other light sources with an operating wavelength range of 400 nm to 750 nm. Each of the ports 1110, 1112, 1114 has an energy penetration window 1122, 1124, 1126 to provide vacuum isolation of the processing chamber, and the cover is located above the processing chamber. In a special embodiment, the cover 丨 丨 i 〇 also includes optical accessories 1121, 1123, the latter located between the windows 1124, 1126 and the light sources 1Π, 1120, respectively. The optical accessories 11 2 1 and 1 1 2 j may be any combination of a mirror, a astigmatism lens, and a lens. The cover 111, which is fixed to the windows 1122, 1124, 1126, the CCD or camera 1116, and the light source 1U8, 1120, can be composed of aluminum metal or other processable materials to meet the utgassing and Need for Porosity Any surface within the β cover 1 1 10 is preferably provided with a predetermined reflective surface by processing or grinding. In one embodiment of the cover member 110, it may be made of a metal material, which may be at least a surface 1130 having a suitable roughness or polishing degree. For the holes used in the light sources 1118, 1120 and CCD 1116, the surfaces are polished. For example, the surface energy processing in the CCD port u10 is based on page 36. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2Ϊ0 × 297 mm ~ (Please read the precautions on the back before filling this page). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 Five Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Invention Description () to 32 RA, the surface energy in the first light source 1114 is processed to 16 RA, and the second light source U The surface energy within 1 2 can be processed to 8 RA ^ All the above surfaces are processed to a certain degree of surface flatness' based on the principle that the secondary light scattering of the light environment returned to the processing chamber can be minimized. Due to a high reflectivity The presence of the surface thus effectively reflects the light through the window 1126 and / or 1124 and leaves the processing chamber. Figures 12A-C show the cover 1 1 0 at the top of a process processing chamber 1101 (eg, a cooling processing chamber). Sectional view of 0. The processing chamber 1 1 0 1 roughly includes a main body of the processing chamber having a side wall 1 102 and a bottom 1 104. A support member H06 can be provided at the bottom of the processing chamber to receive and support a guide. To the processing room Substrate 37. The support member 1106 may include a cooling system (such as a fluid channel and a cooling fluid source) for cooling the substrate, etc. The cover 1110 has an OIS 15 0E, wherein the latter is placed on top of the former, and The former is located at the upper surface of the processing chamber wall and forms a plug at the upper surface of the processing chamber wall. Port 1110 used by CCD 1116—the horizontal line is at a first angle of 01, and the horizontal line is the substrate 37 being guided. The direction to the processing chamber 1101 (that is, a substrate transfer path). The line of sight provided by this angle can see the substrate 37 enters the processing chamber 1101 and is placed on a robotic tray 48. It is used for the light source 1 1 1 8 , 1 1 2 0 any port 111 〇, 1 11 2, 1 1 1 4 angle setting so that a first light source 1 1 1 8 can provide a substrate 3 7 front lighting, and a second light source 1 1 2 The principle of providing the rear part of the substrate is illuminated. The substrate 3 7 is illuminated when it enters the processing room 1 1 0 1 corresponding to c CD 11 1 6. The front and rear lighting can be illuminated simultaneously or separately. Processing chamber i 丨 〇i Page 37 This paper ruler_Specifications (210x297 public love)-..... 0 ^. ............ (Please read the precautions on the back before filling out this page) 533526 A7 B7 V. Description of the invention (printed and introduced or contracted by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs) When returning to the substrate, Zhao Ming > 〒 ..., Ming < (for example, a substrate is introduced and its substrate is retracted). 槔 m2 used to provide the first light source uu is located at the second angle —2 'this Angle and port. And the angle 01 of the camera 1116 is different. Used for the second light source You 1120 (the back-illuminated light source U2〇) port 1 1 1 4 is located at — 篥 = Di Yi angle θ3, the third angle 63 is relative to the transfer plane of the substrate ^ ^ Zhu Yi is ten-sided and & is different from the first included angle and the second cool angle θ2. A signal reflection plane 11 28 ′ is provided on one of the side walls of 4 1114 to make the first light source ii 20 have a relatively steep angle of incidence relative to the substrate, and still make the angle of incidence incident on the substrate 37 meet the requirements. . As shown in the figure, the incident angle of the light beam emitted by the light source 1120 with respect to the substrate 37 is 04. In two embodiments, the direction of the camera 1116 and the light source 18, 112 () can be adjusted automatically (as opposed to manual adjustment). For example, a servomotor or similar actuator (although not shown) integrated into a control system can be used to move various components, adjust the aperture size, and focus from a distance. In the embodiment, the two cameras ㈣ui6 are arranged side by side to increase the viewing field of the substrate, and increase the resolution of the image when arranged in a back and forth arrangement. Any "1112" for the first and second light sources 1118'112G is provided as a light-trapping trap for one of the other light sources. That is, 崞 1114 for the two light sources H20 is used as the first light source, and 8 traps of light reflected and scattered by the substrate surface; similarly, port 1112 for the first light m8 is used as the second light source 1120. The surface of the substrate reflects the trapping light of the politic light. The cover adjacent to the light source 崞 1126, page 38. The paper size is applicable to China National Standard (CNS) A4 specifications (210X 297 public love). The 114th table is source radiation 1130 (please read the / X meaning on the back first) (Fill in this page)
經濟部智慧財產局員工消費合作社印製 533526 A7 __ B7 五、發明説明() 的研磨表面亦可藉由將CCD Π 1 6視線内的光線背向散 射行為最小化之方式而作為一光捕捉陷阱,而鄰接於光 源淳1 1 2 6之蓋件1 1 3 〇的内表面可加以研磨處理,以在 該攝相機主要軸向之光線背向散射行為得以最小化。 用於 CCD 1116及光源1118,1120之任何埠 1 1 1 2,Π 1 4,1 1 1 〇也可包含濾光器,例如:偏光器、彩色 光譜遽光森、及其他頻寬選擇介質。該濾光器能被設置 於淳1112,1114,1110之每一開孔内的窗口 1 1 2 6,1 1 2 2,1 1 2 4之大氣側邊上。此外,該濾光器也能設 置於窗口 1126,1122,1124内或與後者整合成體。 濾光器能增加基材3 7上的圖案化背景與阻礙物間 的對比強度,並藉由去除聚焦不當之較長光波長、或減 少光反射成份及增加散射成份的方式減少影像品質下降 程度。舉例而言’在一實施例中,彩色光譜濾光器能用 以增強或選擇阻礙物影像之收集能量(亦即訊號強度)。 如果在基材上的材料為藍色(如一光阻材料),而阻障物 為紅色時,則能在該光源及該攝相機使用一紅色光譜濾 光器,以最小化與該光阻材料相關之波長強度及增強與 該阻障相關之波長強度。 線性偏光濾光器能用以區別接收到光線之反射及散 射成份。舉例而言,經過相對方向為9〇度之二線性偏 光遽光器對圖案進行觀察時,該光主要散射成份得以滤 除。射散成份之變化代表基材内的圖案結構及/或污染 物產生改變。濾光器能用以增強光學辨識(亦即0CR)能 第39頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ................... (請先閱讀背面之注意事項再填寫本頁) 533526 A7 B7 五、發明説明() 力,這特性使其可用在多種用途上。舉例而言,當一滤 光器用於增強粒子檢測時’一;慮光器能用於増強特徵辨 識(例如:基材特徵辨識)。在一實施例中’光源1 1 1 8,1 1 2 0 及接收器CCD 1 1 1 6皆可至少包含數個不同遽光器,以 在多基材掃瞄時提供不同影像’進而增強製程檢視能 力。在另一濾、光鏡實施例中’該遽光鏡(未顯示)係設於 C C D 1 1 1 6與琿1 1 2 4之間,這使得各遽光器的設置與c C D 111 6之操作無關。 第1 2 A - C圖中,用於前部照明的第一光源1 1 1 8的 方向與C C D 11 1 6視線夾一角度。光源1 11 8對於基材3 7 之入射角得以決定之,因而光源1118之反射光進入第 二光源11 20之埠1 1 1 4所形成的光捕捉陷阱中。因而, C C D 1 11 6只收集到在照明之基材表面上的阻障物反射 及/或散射光。該剩餘的反射光將會經由光捕捉陷胖 11 1 2,111 4而吸收或繞道,或反射離開表面1 1 3 〇。 第二光源11120以一角度將光投射至CCD 1116, 以此角度照射基材 Π 〇8得以產生一背部照明。如第 12A-C圖中所示,第二光源1 120係設於一角度處,該 角度與該光源11 20必須投射之方向相反。第一光源1 1 1 8 照射到訊號埠111 4之内表面11 2 8上,並以一預定角度 反射至基材3 7。沿著第二光源11 20之正向投射方向的 反射光係反射至第一光源1118所形成的光捕捉陷阱 中。因基材3 7表面不規則性之影響產生的反射光可沿 CCD 1 16視線反射。 ' 第40頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁) ·裝· 、可- 經濟部智慧財產局員工消費合作社印製 533526 A7Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 __ B7 V. The polished surface of the invention () can also be used as a light capture trap by minimizing the backscattering behavior of light in the line of sight of the CCD Π 1 6 The inner surface of the cover member 1 1 30 adjacent to the light source 1 1 2 6 can be ground to minimize backscattering of light in the main axis of the camera. Any port used for CCD 1116 and light sources 1118, 1120 1 1 12, Π 1 4, 1 1 1 10 can also include filters, such as: polarizers, color spectrum spectroscopy, and other bandwidth selection media. The filter can be placed on the atmospheric side of the window 1 1 2 6, 1 1 2 2, 1 1 2 4 in each opening of Chun 1112, 1114, 1110. In addition, the filter can be placed in or integrated with the windows 1126, 1122, 1124. The filter can increase the contrast intensity between the patterned background and the obstacle on the substrate 37, and reduce the image quality degradation by removing the longer light wavelength that is not focused, or reducing the light reflection component and increasing the scattering component. . For example, 'in one embodiment, a color spectrum filter can be used to enhance or select the collected energy (ie, signal strength) of the obstruction image. If the material on the substrate is blue (such as a photoresist material) and the obstacle is red, a red spectral filter can be used on the light source and the camera to minimize the photoresist material. Associated wavelength intensity and enhanced wavelength intensity associated with the barrier. Linear polarizing filters can be used to distinguish the reflected and scattered components of the received light. For example, when a pattern is observed through a linear polarizer with a 90 ° relative direction, the main scattering component of the light is filtered out. Changes in the diffusing composition represent changes in the pattern structure and / or contamination in the substrate. Filters can be used to enhance optical identification (ie, 0CR). Page 39 This paper is sized to the Chinese National Standard (CNS) A4 (210X297 mm) ............... .... (Please read the precautions on the back before filling out this page) 533526 A7 B7 5. Description of the invention () This feature makes it useful for a variety of purposes. For example, when a filter is used to enhance particle detection, a filter can be used to identify stubborn features (eg, substrate feature recognition). In one embodiment, “the light sources 1 1 1 8 1 2 1 0 and the receiver CCD 1 1 1 6 can each include at least several different calenders to provide different images during multi-substrate scanning” to further enhance the process. Review ability. In another embodiment of the filter and the optical mirror, 'the optical mirror (not shown) is disposed between the CCD 1 1 1 6 and the optical 1 1 2 4. Operation is irrelevant. In Figs. 12A-C, the direction of the first light source 1 1 1 8 for front lighting is at an angle with the sight of C C D 11 1 6. The incident angle of the light source 1 11 8 to the substrate 37 is determined, so the reflected light from the light source 1118 enters the light trapping trap formed by the port 1 1 1 4 of the second light source 11 20. Thus, C C D 1 11 6 only collects reflections and / or scattered light from obstacles on the surface of the illuminated substrate. The remaining reflected light will be absorbed or bypassed by light trapping 11 1 2, 111 4, or reflected off the surface 1 1 3 0. The second light source 11120 projects light to the CCD 1116 at an angle, and illuminates the substrate Π 08 at this angle to generate a backlight. As shown in Figures 12A-C, the second light source 1 120 is disposed at an angle that is opposite to the direction in which the light source 11 20 must project. The first light source 1 1 1 8 irradiates the inner surface 11 2 8 of the signal port 111 4 and reflects it to the substrate 37 at a predetermined angle. The reflected light along the forward projection direction of the second light source 11 20 is reflected into the light trapping trap formed by the first light source 1118. The reflected light caused by the irregularity of the surface of the substrate 37 can be reflected along the line of sight of the CCD 116. '' Page 40 This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling out this page) · Install · OK-Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives Manufacturing 533526 A7
經濟部智慧財產局員工消費合作社印製 五、發明說明() 罘12A-C圖為一第一光源1118及一第二光源n2〇 γ 丁 %、圖。然而,使用之單—光源(亦即第一光源111 $ 或第一光源Η 20)可有其效益,係端視所用之製程或基 材=徵所需而定。舉例而言,—平整基材之偵測可能需 要單光源照射。但相對而言,一經圖案化之基材最好 使用一 %源及偏光器者為最佳。一般相信二光源之實施 例可因則部及背部照明所產生影像間的對比而帶來助 i 為由偵檢系統接收及解譯之資料沿攝相機或c C D 之視線反射,以使提供之資料足以對某一製程作出判 疋。再者’一掃瞒動作可利用光源m8,n2〇之一者而 作用於插設入處理室中的基材;而另一種掃描動作可用 於基材37移出處理室時,藉以對同一基材37提供二種 不同的視野,以強化製程監視效果。 弟12A-C圖中所示為#瞒基材h〇8上表面的一過 程’其中顯示承載盤48延伸進入處理室η〇ι的三個位 置。在操作過程中,由接收器組件U16(例如:OCR攝 相機)收集之光學資料係用以分析基材37之特徵,例如: 粒子、缺陷、表面損傷、圖案、辨識資料(例如:以數 字或符號表示之特徵)等。處理上述資料的方法於下文 中進行討論。 在另一實施例中,蓋件Π 0 0還包含一光譜儀1 1 5 〇。 因此,第12A-C圖中顯示一光譜儀1150設於支撐構件 11 5 2上的光源11 2 0鄰近處。光譜儀11 5 0經由一光纖 纜線11 5 5與一窗口 1 1 2 6耦合,其中該光纖纜線1 1 5 5 第41頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公爱) -------------^-------訂 (請先閲讀背面之注意事項再填寫本頁) 533526 Α7Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () 罘 The 12A-C diagram is a first light source 1118 and a second light source n2 0 γ D%. However, the single-light source used (that is, the first light source 111 $ or the first light source Η 20) can have its benefits, depending on the process or substrate used. For example, —the detection of flat substrates may require a single light source. But relatively speaking, it is best to use a% source and polarizer once the patterned substrate is the best. It is generally believed that the embodiment of the two light sources can help the contrast between the images generated by the regular and back lighting to help i reflect the data received and interpreted by the detection system along the line of sight of the camera or c CD, so that the provided The information is sufficient to judge a process. Furthermore, a sweeping action can use one of the light sources m8 and n20 to act on the substrate inserted into the processing chamber; and another scanning action can be used when the substrate 37 is removed from the processing chamber, so that the same substrate 37 can be used. Provides two different visions to enhance process monitoring. Figures 12A-C show a process of "hiding the upper surface of the substrate h08", which shows three positions where the carrier disk 48 extends into the processing chamber ηι. During operation, the optical data collected by the receiver unit U16 (for example: OCR camera) is used to analyze the characteristics of the substrate 37, such as: particles, defects, surface damage, patterns, identification data (for example: digital or The characteristics represented by symbols), etc. The methods for processing the above information are discussed below. In another embodiment, the cover Π 0 0 further includes a spectrometer 1 150. Therefore, in Figs. 12A-C, a spectrometer 1150 is provided near the light source 11 2 0 on the supporting member 11 5 2. The spectrometer 11 5 0 is coupled to a window 1 1 2 6 via a fiber optic cable 11 5 5 in which the fiber optic cable 1 1 5 5 page 41 This paper size applies to China National Standard (CNS) A4 (210X 297) ) ------------- ^ ------- Order (Please read the notes on the back before filling this page) 533526 Α7
五、發明説明() 中心並非設於真正中心所在,而為近於光源n20及/或 111 8之反射光主軸之處。在此組態中,光纖纜線11 5 5 擷取用以提供其他基材檢視多頻光源之大量資料。此 外,該光譜儀能加以定位、並經由一光纖纔線與窗口 1122,1124,1126 之任,者耦合。 V.掃描器 第13A-C圖為一蓋件1300的剖面圖’其用以說明 一製程處理室114(如一冷卻室)用的一〇IS 150實施例。 處理室114通常包含具有側壁1302及一底部1304的一 處理室主體。一支撐構件1 3 06係設置於處理室底部, 以接收及支撐導入至處理室中的一基材37。支撐構件 1 3 06可包含一冷卻系統(如流體通道及冷卻流體源等), 用以冷卻基材。 〇IS 150F至少包含接受器58、傳送器56、位於處 理室壁之上表面上的連結構件1308及該連結構件1308 上的可密閉座件(seat)。蓋件通常包含一主體,該主體 内部有一埠1310,該埠1310用以提供接受器58及傳 送器5 6之視線。在一實施例中,埠1 3 1 〇係以一能量可 穿透介質1 3 1 2加以密閉,以使訊號5 4得由傳送器5 6 傳輸。 接受器5 8及傳送器5 6經由連結構件1 3 〇 8相互耦 合而形成一掃瞄構件1325。接受器58及傳送器56之 位置方向以相夾一角度、以使反射及/或散射光π 〇7能 第42頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公愛) (請先閱讀背面之注意事項再填寫本頁} ·裝. 經濟部智慧財產局員工消費合作社印製 533526 A7 -- B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 進入接收器5 8中而凸顯出光場之暗場照射者為佳。掃 瞄構件丨325至少包含一馬達(未顯示),掃瞄構件1325 藉由桿構件1 3 1 8以沿著蓋件1 3 00之長度及寬度方向來 回移動3其中,桿構件1 3 1 8以能使支撐構件丨3 〇8完全 橫越基材37為佳。 第13A-C圖所示為一製程檢視之操作過程實施例。 第13A-C圖為處理室114之側示圖,其中顯示掃瞄構件 1j25在製程處理室1丨4中移動過程的各不同位置。 第13A圖為構件13〇〇之側示圖,以表示製程處理 i中Π4支撐元件1308及位於其上的基材37。第7A 圖顯示線性移動甫開始啟動後之掃瞄構件1 3 25,此時 基材37前緣92位於訊號54之路徑上。 製程處理室1 1 4可為任何類型之處理室,例如:一 冷卻處理室或一基材定位處理室。再者,〇IS 15 〇F可 設於工具100上的任何位置,或可位於一檢視/度量專 用處理室内’以供製程監視用。 掃瞄構件1 3 2 5從處理室11 4之一側邊至一相對側 邊持續移動。為增強解析度,連續掃瞄之動作可與〇IS 150F相輔為用,並以逐步漸進掃瞄方式掃至基材一新 區域。訊號54因而移動通過基材37,基材37之上表 面也因此暴露於訊號54之下。位於基材37上表面之阻 障物(粒子、圖案、凹陷、及此種阻障物)使訊號54產 生散射及/或反射,以箭頭74 1標示。訊號54之散射部 份74為接收組件5 8所收集,接著轉換為電子訊號,並 第43頁 (請先閲讀背面之注意事項再填寫本頁) 裝· 訂. # 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明( 傳送至PMC 86用以處理。第13B-C圖所示為掃瞄構件 1 3 2 :>又連續線性移動,此時訊號並5 4照射於基材3 7 上表面 〇 第U及1 3圖所示之實施例係利用製程處理室u 4 而進行,該等實施例也能使用於該工具之其他區域,例 如:轉送處理室110、真空阻絕介面及/或工廠介面1〇4。 上述位置能確保在處理前及處理後檢視基材而不損及系 統之產出量。 VI.基材之對位及偵檢 經由辨識基材或承載盤上的某些特徵能判定出基材 上缺陷之所在位置。舉例而言,PMC 86之一實施例中, 在基材進行線性或旋轉移動時,程式化該pMC 86以偵 測基材前緣(亦即首先進入接收器視野之基材曲部)及後 緣(亦即在基材線性移動或轉動過程中,接收器偵測到 的基材之最後曲邵)。因為取得速率及C C D偵檢器元件 之視野皆為已知’該基材邊緣的數個參考點接著可形成 二座標之一者,亦即X軸及Y軸。在基材位於(:(:〇偵 檢器視野内移動過程中,該取得速率係指攝相機在產生 影像時的直線取得頻率。當然,在產生連影像時,以無 基材影像重疊或錯失為佳。因此,處理後的CCD偵檢 器輸出訊號為一基材完整表面的“光學圖案”。利用 CCD偵檢器之偵檢陣列裝置可決定缺陷/阻礙物之所在 位置® 第44頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁} 裝· 訂· # 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 第14圖所示為一基材偵檢系統ι4〇〇之示意圖。其 中’該基材偵檢系統1 4 0 0至少包含二或更多感測器’ 該感測器用以偵測基材。在一實施例中,該偵檢系統至 少包含一第一偵檢器141 0A及一第二偵檢器141 0B。該 感測器用以偵測承載盤48邊緣及移動通過感測器 1 4 1 〇 A - B的基材。 偵檢器之操作以第1 4圖表示之。第1 4圖所示為受 一承載盤支撐、並移動通過感測器14i〇A-B的基材37。 當基材移動進入感測器1410A-B訊號之光學路徑時, 輸出訊號之波形發生改變。上述輸出訊號波形變化的結 果能用以判定基材之存在與否、位置、及移動速率。特 定而言,該偵檢器輸出訊號為一種以高位準狀態時進行 主動偵測動作之電子訊號。 位置A之輸出訊號在時間ti時,其訊號輸出波形 由低準位轉變為高準位,以顯示基材剛受到偵測。1 4 1 〇 A 之高輸出訊號波形表示在時間t i時,感測器1 4 1 〇 A對 承載盤進行偵測。位置β在時間t2時,其高訊號輸出 波形顯示承載盤4 8邊緣通過偵檢器1 4 1 0。感測器1 4 1 Ο B 偵測到的低輸出訊號指出感測器1 4 1 0B還未偵測到承載 盤4 8。位置C及E所不為承載盤4 8邊緣移動通過感測 器1 4 1 Ο B。在時間t3時,訊號輸出波形轉變為高準位, 指出感測器1 4 1 0B已偵測到承載盤邊緣。 在時間t2及h時,該承載盤已完全通過偵檢器,而 基材正處於感測狀·!S中。當基材具有一不規則之反射表 第45頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公楚) ................... 訂......... (請先閲讀背面之注意事項再填寫本頁) 533526 測 識 加 之 時 A7 B7 五、發明説明() 面時,區域1 43 0A及1 43 0B可引發不當的 間發(trigger)。 在時間ti,t2,t3及t4時’區域1 430A-B么‘ 〇為忽略區域。噔 由確認及比較時間區段中承載盤邊緣速 '、寬度、感 器間距及角度的唯一性,這些可能的參 9成矾號可被辨 出。 將感測器1 4 1 〇A或1 4 1 0B首先偵測糾α _ 、'』到的基材訊號 以處理,基材的行進方向可因此獲知。 卷材移動速率 決定方式可由已知二偵檢器間距離除以1 Α卷材通過所需 間而獲得之。 VII·設備討論之結果 •前述實施例中提供一種能對基材加以動態(on-ihe-fly)監視、且該監視工作與製程系統具同步工作能力的 偵檢設備及方法。在同步監視中’動態(〇卜the-fiy)檢視 方式得減少傳統獨立式檢視平台對專用致動機構之需求 性,這些致動機構為熟習該項技術者所常使用者。。在 其他實施例中,受檢視者為固定狀態之基材(例如:位 於冷卻處理室中之基材)。再者,本發明實施例也得 使任何傳統製程系統的諸多組件受惠(例如:第1 A圖中 所不的機器人113),以獲得一無階(stageUss)檢視系統。 在任何情況下,,於正常及依必要之操作次序進行製程 時’上述之製程監視法可在製程系統的諸多位置處進行 义’由於基材不需轉送至分離之獨立檢視系統中檢視, 因此監視動作對產出量之降低情形得以減至最小。因 第46頁 —— .....·裝........:訂.........# (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製5. Description of the invention () The center is not located at the true center, but is close to the main axis of the reflected light of the light source n20 and / or 111 8. In this configuration, the fiber optic cable 11 5 5 captures a large amount of data used to provide other substrates with viewing of multi-frequency light sources. In addition, the spectrometer can be positioned and coupled to any of the windows 1122, 1124, 1126 via an optical fiber cable. V. Scanner Figures 13A-C are cross-sectional views of a cover 1300 'which are used to illustrate an embodiment of the ISO 150 for a process processing chamber 114 (such as a cooling chamber). The processing chamber 114 generally includes a processing chamber body having a side wall 1302 and a bottom 1304. A supporting member 1 3 06 is disposed at the bottom of the processing chamber to receive and support a substrate 37 introduced into the processing chamber. The supporting member 1 3 06 may include a cooling system (such as a fluid channel and a cooling fluid source) for cooling the substrate. 〇IS 150F includes at least a receiver 58, a conveyor 56, a connecting member 1308 on the upper surface of the processing chamber wall, and a sealable seat on the connecting member 1308. The cover usually includes a main body with a port 1310 inside the main body, which is used to provide the sight of the receiver 58 and the transmitter 56. In one embodiment, the port 1310 is sealed with an energy penetrable medium 1312 so that the signal 54 can be transmitted by the transmitter 56. The receiver 58 and the transmitter 56 are coupled to each other via a connecting member 1330 to form a scanning member 1325. The position and direction of the receiver 58 and the transmitter 56 are at an angle with each other so that the reflected and / or scattered light π 〇07 can be page 42. This paper size applies the Chinese National Standard (CNS) A4 specification (210x297 public love) (please Read the notes on the back before filling out this page} · Install. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7-B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Enter the receiver 5 8 The dark field illuminator highlighting the light field is preferred. The scanning member 325 includes at least a motor (not shown), and the scanning member 1325 is formed by the rod member 1 3 1 8 along the length of the cover member 1 3 00 and It moves back and forth in the width direction 3. Among them, the rod member 1 3 1 8 is preferably able to make the support member 丨 3 008 completely traverse the substrate 37. Figures 13A-C show an embodiment of a process inspection operation process. Section 13A -C picture is a side view of the processing chamber 114, which shows the different positions of the scanning member 1j25 in the process processing chamber 1 丨 4. Figure 13A is a side view of the member 1300 to show the process processing i 中 Π4 supporting element 1308 and the substrate 37 located thereon. Figure 7A shows the scanning member 1 3 25 after the linear movement is started. At this time, the leading edge 92 of the substrate 37 is located on the path of the signal 54. The process processing chamber 1 1 4 can be any type of processing chamber, for example: a cooling A processing chamber or a substrate positioning processing chamber. Furthermore, 〇IS 15 〇F can be located anywhere on the tool 100, or can be located in an inspection / measurement dedicated processing chamber 'for process monitoring. Scanning component 1 3 2 5 Continue to move from one side of the processing chamber 11 to an opposite side. In order to enhance the resolution, continuous scanning can be supplemented with 0IS 150F, and the substrate is scanned to the substrate in a gradual and progressive scanning manner. A new area. The signal 54 thus moves through the substrate 37, and the upper surface of the substrate 37 is thus exposed to the signal 54. Obstacles (particles, patterns, depressions, and such barriers) located on the upper surface of the substrate 37 Object) causes the signal 54 to scatter and / or reflect, and is indicated by arrow 74 1. The scattering portion 74 of the signal 54 is collected by the receiving component 5 8 and then converted into an electronic signal, and page 43 (please read the note on the back first) (Please fill in this page for more details) Binding and binding. # This paper size Printed in Chinese National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (transmitted to PMC 86 for processing. Figures 13B-C show a scan Component 1 3 2:> Continuous linear movement again, at this time, the signal and 5 4 are irradiated on the upper surface of the substrate 3 7. The embodiment shown in Figs. U and 13 is performed by using a process processing chamber u 4. The embodiment can also be used in other areas of the tool, such as: transfer processing chamber 110, vacuum barrier interface and / or factory interface 104. These locations ensure that the substrate is inspected before and after processing without compromising system throughput. VI. Alignment and detection of substrates By identifying certain features on the substrate or the carrier plate, the location of defects on the substrate can be determined. For example, in one embodiment of PMC 86, when the substrate is moved linearly or rotationally, the pMC 86 is programmed to detect the leading edge of the substrate (that is, the substrate curved portion that first enters the field of view of the receiver) and the rear Edge (that is, the last curve of the substrate detected by the receiver during the linear movement or rotation of the substrate). Because the acquisition rate and the field of view of the CC detector element are known, a number of reference points on the edge of the substrate can then form one of two coordinates, namely the X-axis and Y-axis. During the movement of the substrate in the (: (: 0) field of view of the detector, the acquisition rate refers to the straight line acquisition frequency of the camera when generating the image. Of course, when the continuous image is generated, there is no overlap or miss of the substrate image. It is better. Therefore, the output signal of the processed CCD detector is the "optical pattern" of the entire surface of the substrate. The detection array device using the CCD detector can determine the location of defects / obstructions. Paper size applies to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page) Binding · Ordering · # 533526 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Explanation () Figure 14 shows a schematic diagram of a substrate detection system ι400. 'The substrate detection system 1 400 includes at least two or more sensors' The sensor is used to detect In one embodiment, the detection system includes at least a first detector 1410A and a second detector 1410B. The sensor is used to detect the edge of the carrier disk 48 and move through the sensor 1 4 1 〇A-B substrate. Detection The operation is shown in Figure 14. Figure 14 shows the substrate 37 supported by a carrier plate and moving through the sensor 14iAB. When the substrate moves into the sensor 1410A-B signal During the optical path, the waveform of the output signal changes. The results of the output signal waveform change can be used to determine the presence, location, and movement rate of the substrate. In particular, the detector output signal is a high level Electronic signal for active detection in the state. At the time ti, the output signal of position A changes its signal output waveform from low level to high level to show that the substrate has just been detected. 1 4 1 〇A The high output signal waveform indicates that the sensor 1 4 1 OA detects the carrier disk at time ti. At time t2, the high signal output waveform shows that the carrier disk 4 8 edge passes the detector 1 4 1 0. The low output signal detected by sensor 1 4 1 Ο B indicates that sensor 1 4 1 0B has not detected carrier disk 4 8. Positions C and E are not the edges of carrier disk 4 8 Detector 1 4 1 Ο B. At time t3, the signal output waveform changes to The level indicates that the sensor 1 4 1 0B has detected the edge of the carrier disk. At time t2 and h, the carrier disk has completely passed the detector, and the substrate is in the sensing state! S. When The substrate has an irregular reflection table. Page 45 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297) .... ........ (Please read the precautions on the back before filling out this page) 533526 Test plus time A7 B7 V. Description of the invention () In the front, the area 1 43 0A and 1 43 0B may cause improper time Hair (trigger). At time ti, t2, t3, and t4, 'area 1 430A-B?' 0 is an ignored area.确认 These unique parameters can be identified by confirming and comparing the uniqueness of the edge velocity, width, sensor spacing, and angle of the carrier disk in the time zone. The sensor 1410A or 1410B first detects the signal of the substrate to which α_, '′ is corrected for processing, and thus the direction of travel of the substrate can be known. The method of determining the moving speed of the coil can be obtained by dividing the distance between the two known detectors by 1 Α through the required time for the coil to pass. VII. Results of Equipment Discussion • The foregoing embodiments provide a detection device and method capable of performing on-ihe-fly monitoring of a substrate, and the monitoring work is capable of synchronizing with a process system. In synchronous monitoring, the 'fi-they' inspection method reduces the need for traditional independent inspection platforms for special actuation mechanisms, which are common users of those skilled in the technology. . In other embodiments, the subject is a stationary substrate (eg, a substrate located in a cooling processing chamber). Furthermore, the embodiments of the present invention can also benefit many components of any conventional process system (for example, the robot 113 not shown in Figure 1A) to obtain a stageUss inspection system. In any case, when the process is carried out in the normal and necessary operating sequence, the above-mentioned process monitoring method can be defined at many locations in the process system, because the substrate does not need to be transferred to a separate independent inspection system for inspection, so The reduction of output by monitoring actions is minimized. Because on page 46-..... · Installation ........: Order ......... # (Please read the notes on the back before filling out this page) Intellectual Property of the Ministry of Economic Affairs Printed by Bureau Consumers Cooperative
533526 Α7 〜-----_ 五、發明説明() 此,任何通過製程系統的基材皆能受到檢視,因而得以 改良習用技術及製程中只能進行週期性取樣而對產出量 造成之負面影響。 在生產過程中,本發明實施例提供判定生產是否應 當中斷及某一基材因污染、製程相關缺陷或繞行錯誤而 再作更詳細檢驗之可行措施。因而,只需對選擇性基材 進行額外檢視。若基材經過系統確認,則該基材不須再 進一步定位或做其他位置調整。再者,在加以本發明之 技術時,傳統特徵(例如:視埠位於其内的轉送處理室' 製程處理室(冷卻或定位處理室)、及轉送機器人)或現存 系統可輕易修改而符合所需,,無需造成修改時間浪費、 清理、及再評估。 應當注意的是,雖然本發明實施例有助於動態檢視533526 Α7 ~ -----_ 5. Description of the invention () Therefore, any substrate that passes through the process system can be inspected, which improves the customary technology and can only be sampled periodically in the process, which results in output. Negative impact. In the production process, embodiments of the present invention provide feasible measures to determine whether production should be interrupted and a substrate to be inspected in more detail due to contamination, process-related defects, or bypass errors. Therefore, only additional inspection of the selective substrate is required. If the substrate is confirmed by the system, the substrate does not need to be positioned or adjusted further. Furthermore, when applying the technology of the present invention, traditional features (such as: the transfer processing chamber 'process processing chamber (cooling or positioning processing chamber), and the transfer robot in which the view port is located) or existing systems can be easily modified to meet all requirements. No need to waste modification time, clean up, and re-evaluate. It should be noted that although embodiments of the present invention facilitate dynamic viewing
的進行,但其他實施例寧使專用度量平台(例如:第i A 圖中的檢視平台135)帶來效益。特定而言,下文說明之 製程監視方法(例如:反射及/或散射、及光譜分析)皆不 需仰賴某一機制方得執行,且不在動態環境下亦可執行 之0 νπι·内含製程監視 本案申請人已發現到此處說明的檢視元件能適用於 執行製程系統中所需求的多種功能(本發明所能達到、 功能),例如··選擇性之基材特徵的決定,該特徵包4 . 污染、反射性、(反射或散射)基材類型、不連續性、、 、方 第47頁* 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁} •裝· '、一:f 參- 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 五、發明説明() 向、中心找尋與執行機器人之校準、檢視設備、及監視 機器人行為。下文討論中提供本發明諸多實施例,但非 僅限定該等實施例,熟習此項技藝者必能輕易瞭解而得 知其他可能之實施例。 此外,本發明還可監視製程並接著由檢視系統1 3 5 進一步對製程加以估量。一基材經過處理後,每一 〇 IS 15〇皆產生光譜訊號特徵、顏色等,以表示該基材情形/ 狀態。在一實施例中,任何處理步驟時,PMC 86皆可 利用OIS 150所獲得之數據來對基材加以監視基材。如 果在此條件下偵測到不良,那麼p M C 8 6可決定該基材 是否應當送至檢視平台135加以進一步分析、或要求操 作者移除系統中產生問題之基材、或持續使該基材進行 下一個排程處理步驟。在一實施例中,檢視平台丨3 5用 於執行如同OIS 1 50之測試工作,此時不但可到較高解 析度,且可檢視全基材或僅基材上之某一部份。除非有 極端嚴重事件使製程中斷,否則該度量構件可在製程繼 續進行得的條件下檢驗可疑基材,因而產出量不受到明 顯影響。 檢視平台1 3 5僅為進一步檢視基材的地點之一。一 般而言,除ΟIS 1 5 0之外,一系統可具有任何數量之檢 視地點。因此,在一些實施例中提供第二檢視平台,甚 至還提供第三檢視平台。 依據上述說明,本發明係提供一種產生關於一基材 選擇性特徵之及時資料的設備及方法。基材之檢視工作 第48頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁} I · ·裝· ·# 經濟部智慧財產局員工消費合作社印製 533526 A7But other embodiments would rather benefit from a dedicated measurement platform (eg, viewing platform 135 in Figure i A). In particular, the process monitoring methods described below (for example: reflection and / or scattering, and spectral analysis) do not need to rely on a mechanism to be implemented, and can also be performed in a dynamic environment. 0 νπι · Included process monitoring The applicant of this case has found that the viewing elements described herein can be applied to perform various functions required in the process system (achievable and functions of the present invention), such as the determination of selective substrate characteristics. The feature package 4 Pollution, reflectivity, (reflective or scattering) substrate type, discontinuity, ..., page 47 * This paper size applies to China National Standard (CNS) A4 (210X297 mm) (Please read the note on the back first Please fill in this page again for the items} • Installation · ', one: f Participant-Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperative 533526 A7 B7 5. Description of the invention () Finding and performing robot calibration, inspection equipment, and monitoring Robot behavior. Many embodiments of the present invention are provided in the following discussion, but are not limited to these embodiments. Those skilled in the art will be able to easily understand and know other possible implementations. In addition, the present invention can also monitor the process and then further evaluate the process by the inspection system 1 35. After a substrate is processed, each 〇IS 150 produces a spectral signal characteristic, color, etc. to indicate the substrate Situation / Status. In one embodiment, PMC 86 can use the data obtained by OIS 150 to monitor the substrate at any processing step. If a defect is detected under this condition, then p MC 8 6 It can be determined whether the substrate should be sent to the inspection platform 135 for further analysis, or the operator is required to remove the problematic substrate in the system, or continue to make the substrate to the next scheduled processing step. In one embodiment, Inspection platform 丨 3 5 is used to perform test work like OIS 1 50. At this time, not only higher resolution can be achieved, but also all substrates or only a part of the substrate can be inspected. Unless there are extreme serious events that make the process Interruption, otherwise the metrology component can inspect the suspicious substrate under the condition that the process continues, so the output is not significantly affected. The inspection platform 1 3 5 is only one of the places for further inspection of the substrate. Generally speaking, a system can have any number of viewing locations except for ISO 150. Therefore, in some embodiments, a second viewing platform is provided, and even a third viewing platform is provided. According to the above description, the present invention is Provide a device and method for generating timely information on the selective characteristics of a substrate. Inspection of the substrate page 48 This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) (Please read the note on the back first Please fill in this page again for the matter} I · · 装 · · # Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 533526 A7
五、發明説明() 以在處理之前或在處理之後進行為佳,其中本發明一較 佳操作方式可經由參閱第1A圖而更加瞭解。基材之光 學檢視係由位於工廠介面1 04中的〇lS 1 50首先加以完 成。因而,基材在進入製程系統真空環境(製程處理室、 服務處理室之所在位置)前’該基材即能先受到分析。 在以機器人113將一基材從轉送處理室11〇轉送至一製 程處理室Π 4或服務處理室1 1 6時,本發明能很有效掃 瞄該基材或擷取該基材之整體或部分影像。經過處理 後,基材從製程或服務處理室縮回,在此縮回時段再次 掃瞄基材。此外,製程結果可得到判斷。舉例而言:收 集到的基材掃瞒影像能用以產生相關於製程之一致性, 並可用以確認達到製程終點。 依據上述說明,基材可製程系統1 00中各種位置處 進行受到連續監視。在任何狀況中,所得到的影像皆可 產生相關於製程一致性、平整度、基材類型、方位、找 尋中心、不連續性/邊緣缺陷(舉例而言··由於熱偏析影 響而產生基材結構性缺陷,使部分基材破裂)、反射或 散射訊號、存在之粒子、及其他製程條件的資訊。在一 實施例中,操作OIS 150及PMC 86以產生一基材之祐 樸地圖(例如:二維或三維)。該地圖隨後加以分析,以 得到該基材之組織特徵例如:平坦性、一致性及厚度。 此外,任何基材缺陷或損傷(例如:缺口或破裂)皆能加 以偵測及映射推知。此外,使用一彩色c C D偵檢器及/ 或光譜儀能增強分析效能。 第49頁 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) (請先閲讀背面之注意事項再填寫本頁) *可. # 經濟部智慧財產局員工消費合作社印製 A7V. Description of the invention () It is better to carry out before or after the treatment. A better operation method of the present invention can be better understood by referring to FIG. 1A. The optical inspection of the substrate was first performed by the 01S 50 located in the factory interface 104. Therefore, the substrate can be analyzed before it enters the vacuum environment of the process system (the location of the process processing room and the service processing room). When a substrate is transferred from the transfer processing chamber 110 to a process processing chamber 11 or a service processing chamber 116 by the robot 113, the present invention can effectively scan the substrate or retrieve the entirety of the substrate or Partial image. After processing, the substrate is retracted from the process or service processing room, and the substrate is scanned again during this retraction period. In addition, the process results can be judged. For example, the collected substrate sweep images can be used to generate consistency related to the process and can be used to confirm that the end of the process has been reached. Based on the above description, the substrate can be continuously monitored at various locations in the process system 100. In any case, the resulting image can be related to process uniformity, flatness, substrate type, orientation, center finding, discontinuities / edge defects (for example ... substrates due to thermal segregation effects Structural defects that break part of the substrate), reflected or scattered signals, particles present, and other process conditions. In one embodiment, the OIS 150 and the PMC 86 are operated to generate a map of the substrate (eg, two-dimensional or three-dimensional). The map is then analyzed to obtain the structural characteristics of the substrate such as flatness, consistency, and thickness. In addition, any substrate defects or damages (such as notches or cracks) can be detected and mapped. In addition, the use of a color CCD detector and / or spectrometer can enhance analysis performance. Page 49 This paper size is in accordance with Chinese National Standard (CNS) A4 (210x297 mm) (Please read the precautions on the back before filling out this page) * Yes. # Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7
經濟部智慧財產局員工消費合作社印製 533526 五、發明説明() 另外可破決足之基材特徵為基材表面之光學特徵。 相關於表面之光學特徵的資料能用以決定某些製程條件 (例如.一姓刻處理之終點)是否已經成功達成。因為終 點貝料係由近即時(near-real the)方式(亦即,大致在該 製程抵達.終點之同時),一正在處理之基材立即返回該 ^ ^處理罜進行額外處理)獲得,且基材與處理室靠得 艮因此該受處理之基材可馬上送回以再處理。但在 傳統设備中’基材必須要送至遠處位置方能進行其終點 檢視。一正在處理之基材的隨後決定結果通常為丟棄該 基材,因為進行額外處理之基材其返回時間會造成成本 昂貝之自然氧化物的成長。再者,在基材處理過程中, 其處理時間經常會加以延長以防止潛在問題發生,系統 產出量因而可能減少β 因此,在一處理過程中,本發明提供一基材的製程 月ϋ及製程後近即時資料。由於該資料係由近即時方式產 生,因此有缺陷之基材的管理能夠以立即、且成本低之 方式達成。再者,所有基材皆係於系統中處理後立即加 以檢視(相對於成批基材中選擇某些基加以處理之方 式),因此所得到的資料能對其它已確定有問題之基材 與製程環境做迅速的改正界定之問題。因此,近即時製 程監視能使製程參數/策略得以最佳化並極逼近製程容 忍度,產出量因而增加。 依據上述說明’該設備可作為一製程系統之看門人 (gate-keeper)”以連續進行基材及系統特徵之第—階严 第50頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐)^ --- ----:….....•裝........:訂.........#'. (請先閲讀背面之注意事項再填寫本頁) 533526 A7 B7 五 發明説明( 標準時,此 分柄*。、、 仰。這樣 機會,# 曰並能 負面影響。 把關分類任務。當製程事件無法符合可接受 時得以檢視平台1 3 5或相似檢視平台另加以 的系統確能增加判定極多樣製程處理結果的 在現场管理繞行缺陷卻不造成任何產出量之 A ·反射分析 在一實施例中,反射及/或散射資料係用Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 5. Description of the invention () In addition, the characteristics of the substrate that can be broken are the optical characteristics of the surface of the substrate. Data related to the surface's optical characteristics can be used to determine whether certain process conditions (such as the end of an inscription process) have been successfully achieved. Because the final shell material is obtained by a near-real the method (that is, approximately at the same time as the process arrives at the end point), a substrate being processed is immediately returned to the ^^ processing 罜 for additional processing), and The substrate is placed close to the processing chamber, so the treated substrate can be returned immediately for reprocessing. But in traditional equipment, the substrate must be sent to a distant location for its end point inspection. A subsequent decision on a substrate that is being processed usually results in discarding the substrate, as the return time of the substrate undergoing additional processing will cause the cost of the growth of Angbe's natural oxides. Furthermore, during the processing of the substrate, the processing time is often extended to prevent potential problems, and the system output may be reduced by β. Therefore, in a processing process, the present invention provides a substrate manufacturing process and Near real-time information after the process. Since this information is generated in near real-time, the management of defective substrates can be achieved immediately and at a low cost. In addition, all substrates are inspected immediately after processing in the system (as opposed to the selection of certain substrates in a batch of substrates for processing), so the obtained data can be used for other identified substrates and The process environment is quickly corrected to define issues. As a result, near-instant process monitoring can optimize process parameters / strategies and approach process tolerance, resulting in increased output. According to the above description, 'This equipment can be used as the gate-keeper of a process system' to continuously perform the characteristics of the substrate and the system. Page 50—The standard of this paper applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) ^ --- ----:… ..... • Equipment ........: Order ......... # '. (Please read the note on the back first Please fill in this page again for details) 533526 A7 B7 Five invention descriptions (in the standard case, this is divided into *. ,, and yang. Such an opportunity, # can not have a negative impact. Check the classification task. When the process event can not meet the acceptable, you can view the platform 1 3 5 or a similar inspection platform. Additional systems can indeed increase the determination of the most diverse process processing results in the field management bypass defects without causing any output A. Reflection analysis In one embodiment, reflection and / or scattering For information
-A 材特徵。這樣的實施例對於經圖案化的基材 土 ΐϊ| 性’其中該圖案化基材具有拓樸差異因而造 尤入射光的 散射。對於圖案化基材的檢視,本發明經由 Ί ’ “、、射一經圖 案化基材而產生唯一訊號特徵強度分佈,其 "" 號特徵為基材上圖案/結構所產生。在某—製p w 於形成於基材上的圖案之拓樸型態大體上相同因 由 經相同處理之任何基材的訊號特徵大約一致,作1^廷些 他方式處理之基材者不同。因此,此唯一訊〜與綾其 , β观待徵可雜 存於圯憶體中,並用於比對生產過程中各基、 " ^ 一 何之表面愔 形。此外,經處理基材之最後“ η,,者的 可j十均矾號特徵 可^作一動態參考基材(或校準基材)。 …第15圖表示-基材掃晦之三百萬個數據點,以顯 不依據上述說明技術掃描一校準基材所得的反射及/戋 散射訊號特徵150,其中顯示強度以軸)與發生次數^ 軸)的關係圖,這些測量結果係由偵檢設備所得。㈣, 以相當方式掃瞄二不同試驗基材,並因此產生兩=同之 反射訊號特徵。為決定二試驗基材表面之相對狀錤,其 訊號特徵與該校準基材訊號特徵進行比對。第丨^圖中 第51頁 533526 A7 B7 五、發明説明() 的圖表曲線152,154為該二基材每一強度之發生次數校 準基材在相同強度之發生次數所得知結果。因此,第1 圖表1 5 2表示偵檢設備1己錄之第一試驗基材及該校準基 材間的差異’該差異值顯得微乎其微;而第2圖表1 5 4 表示偵檢設備έ己錄之第一試驗基材及該校準基材間的差 異’圖中顯示其間的差異相當大,這表示相比較之基材 的表面狀態存有差異。 反射及/或散射資料能加以收集,如以上述說明之 具一線性攝相機(例如··第1 1圖及第12A-C圖中所示之 C C D 1 1 6)之實施例收集之。在這種實施例中,設置該線 性攝相機以收集基材之散射光。當收集者為一 CCD攝 相機時,該攝相機之CCD偵檢器可為包含以線性陣列 方式排列之4096.像素元件者等。該等元件可用以提供 X軸向之光強度數值’而Y軸之數值係由機器人移動基 材進入(或離開)冷卻處理室時藉由收集一連串數據集合 (X軸數值)而產生。該數據集合中的每一像素的光強度 數值劃分成2 6 6級(即0〜2 5 5單位),顯示從某一基材 部位收集到之光強度。以此方式為之時,每一基材在掃 (請先閲讀背面之注意事項再填寫本頁} ** ·裝. 、一盯· 經濟部智慧財產局員工消費合作社印製 據陣 數據 之數 值些 α 數這上 度,認 強析確 個分之 萬徵性 百特致 5號一 16訊程 身 A散及 超或測 一 / 偵 生及子 產射粒 會反 行 皆 用進 時利以 理。用 處列能 Ata· 一g.ΙΠΊ ½¾:歹 以相特 可接 一 數直某 次圖由 條經 長為 佈量 分考 度其 強將 些可 這此 5 5 〇 因 2 ~ 之’ ο 示構 , 表結 中圖的 例條上 施長面 實佈表 一 分材 在度基 強於 一 關 生 發 之 值 數 強 光 頁 2 5 釋 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 533526 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明() 定方式處理後所得之基材之獨一反射或/及数射訊號特 徵。當使用之數據量大時,甚至在基材表面產生些微變 化也會使反射或散射訊號特徵發生大幅改變。這些變化 可加以圖示而得知這些基材之反射或散射訊號特徵與參 考物之訊號特徵間的差異’其中該自其它特徵所獲得之 參考訊號特徵以能表示理想/預設之訊號特徵為原則。 當一特定製程已確知存在某一失效模式時,該訊號特徵 亦可作為一參考資料,所得到的差異用以表示基材表面 上結構之變化。第1 7圖中,所示者為對過蝕刻時間4〇 秒鐘(標稱時間)之一系列過蚀刻處理所得之反射或/及散 射訊號特徵差異。 為清楚說明起見,將強度數值25 5之分佈/範圍中 取如10 〇者加以顯示。如第17圖所示,不同製程條件 使反射及/或散射訊號特徵之變化變得相當大。舉例而 言,在強度小於丨8時,蚀刻時間少於標稱4〇秒鐘者的 發生次數較姓刻時間大於40秒鐘者多出約26〇,〇〇〇次; 但在強度大於1 8時,蝕刻時間少於標稱4〇秒鐘之發生 次數少於較姓刻時間大於40秒鐘者達約數十萬次。換 言之,由於基材的不同處理,特徵/結構因此不同,這 些偵測訊號特徵亦不同。在蝕刻時間少於4〇秒鐘時, 基材結構尚未完全呈現;而在蝕刻時間超過4〇秒鐘時, 蝕刻動作正作用於阻及鋁連線。為更清楚說明之,本案 以第18圖表示一傳統蝕刻終點圖,其中標示有各種過 蚀刻區間嘴段。 第53頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)—^----- .... .....•裝......—·:訂.........•參 (請先閲讀背面之注意事項再填寫本頁) 533526 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明( 該反射及/或散射訊號特 一 幵®万去可以平均亮度值(第 1 9圖)表TF,以提供你i· /-a· 使用者以較簡化之顯示樣式。當系 統處理基材時,該系統之操 會觀祭到一連事平均 值,其中標有若干醒目篸告及罄 β 夂警不£,以使使用者能快 速得知整個製程之情形。 弟20圖所示為基材平均 何卞巧強度值,且該強度值係以 將一參考反射及/或散射娘骑膝 狀耵矾就特徵加以計算而得的δ平 均值表示。…均值係為相對於一參考平均亮度值所 得到的基材強I分佈加權平均亮度值。帛2〇冑中,所 示者為基材相對於一未者 + 材平均值的一連_ 6平均 值。如上所述,醒目攀止芬毯-r a u 警及a tf區旎使使用者快速得知 整個製程情況。 雖然上述係針對已具有一執行終點系統之蝕刻處埋 所得的反射及/或散射訊號特徵加以說明,但本發明之 實施例同樣適用於其他能帶來基材結構變化之製程步驟 的監視上。舉例而言,第21圖即示出反射及/或散射訊 號特徵隨剥離光阻時間變化的情形。 範例 基材在一具有一 DSP金屬蝕刻處理室及一 ASP钊 離/鈍化處理室之Centura系統中進行處理,其中該二處 理室皆為購自美國應用材料公司者在蝕刻及剝離處王里 之後,熱基板被送進一冷卻處理室中冷卻至接近室溫, 該冷卻處理室包含本發明一實施例之一設備系統。 第54頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再場寫本頁}-A material characteristics. Such an embodiment is useful for patterned substrates, where the patterned substrate has a topological difference and thus is particularly suitable for scattering of incident light. For the inspection of the patterned substrate, the present invention generates a unique signal characteristic intensity distribution through the patterned substrate through the ",", and the " " number characteristic is generated by the pattern / structure on the substrate. The topological patterns of the patterns formed on the substrate by pw are substantially the same because the signal characteristics of any substrate treated by the same treatment are approximately the same, and the substrates treated by other methods are different. Therefore, this is the only 〜 ~ 绫 绫, β 征 征 can be mixed in the memory, and used to compare the bases of the production process, " ^ the surface shape of the substrate. In addition, the final "η, This feature can be used as a dynamic reference substrate (or calibration substrate). … Figure 15 shows-3 million data points of the substrate obscuration, to show the reflection and / or scatter signal characteristics 150 obtained by scanning a calibration substrate according to the above-mentioned description technique, in which the intensity is shown on the axis) and the number of occurrences ^ Axis), these measurement results are obtained by detection equipment. Alas, two different test substrates were scanned in a comparable manner, and thus two = identical reflected signal characteristics were generated. In order to determine the relative state of the surface of the two test substrates, the signal characteristics are compared with the signal characteristics of the calibration substrate. Figure 丨 ^ Page 51 533526 A7 B7 5. The chart curve 152 of the description of the invention (152, 154) is the result obtained by calibrating the number of occurrences of each strength of the two substrates at the same intensity. Therefore, the first chart 15 2 indicates the difference between the first test substrate and the calibration substrate recorded by the detection device 1 'the difference value appears to be minimal; and the second chart 1 5 4 indicates the detection device 1 The difference between the first test substrate and the calibration substrate shows that the difference between them is quite large, which indicates that there is a difference in the surface state of the compared substrates. Reflection and / or scattering data can be collected, for example, as described above with a linear camera (e.g., C C D 1 1 6 shown in Figures 11 and 12A-C). In this embodiment, the linear camera is provided to collect scattered light from the substrate. When the collector is a CCD camera, the CCD detector of the camera may include 4096 pixel elements arranged in a linear array. These components can be used to provide X-axis light intensity values' and Y-axis values are generated by the robot moving the substrate into (or leaving) the cooling processing chamber by collecting a series of data sets (X-axis values). The light intensity value of each pixel in this data set is divided into 2 6 6 levels (that is, 0 to 2 5 5 units), which shows the light intensity collected from a certain substrate site. In this way, each substrate is being scanned (please read the precautions on the back before filling in this page) Some of these alpha numbers are high, and the strong analysis of Baxter's No. 5-16 is possible. The body A is scattered and the super OR is measured. The detective and the child's shot will be retrograde. Logic. The usefulness of Ata · a g. ΙΠ½ ½¾: 歹 It can be directly connected to a certain figure. The strength of the graph can be measured according to the length and length of the graph. The strength can be 5 5 〇 Because 2 ~ of 'ο The structure is shown, and the surface of the example in the figure is applied with a long surface and a solid sheet. The material of the material is stronger than the value of the hair. Page 2 5 Interpretation This paper size applies Chinese National Standard (CNS) A4 Specifications (210X 297 mm) 533526 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () Unique reflection or / and digital signal characteristics of the substrate obtained after processing in a certain way. Data used when When the amount is large, even slight changes in the surface of the substrate can cause reflected or scattered signals Significant changes have occurred. These changes can be graphically shown to understand the differences between the reflected or scattered signal characteristics of these substrates and the signal characteristics of the reference object, where the reference signal characteristics obtained from other characteristics can represent ideal / predictive characteristics. Let the signal characteristics be the principle. When a certain process has confirmed that a certain failure mode exists, the signal characteristics can also be used as a reference material, and the obtained differences are used to indicate the structural changes on the surface of the substrate. Figure 17 The difference between the reflected or / and scattered signal characteristics obtained from a series of over-etching processes with an over-etching time of 40 seconds (nominal time) is shown. For clarity, the distribution / range of the intensity value 25 5 The selected one is displayed as 100. As shown in Figure 17, the different process conditions make the reflection and / or scattering signal characteristics change considerably. For example, when the intensity is less than 8, the etching time is less than the standard. The number of occurrences of 40 seconds is about 26.0 million times more than that of the last time greater than 40 seconds; but when the intensity is greater than 18, the etching time is less than the nominal 40 seconds. If the time is less than 40 seconds, the time is more than several hundred thousand times. In other words, due to the different processing of the substrate, the characteristics / structures are different, and the characteristics of these detection signals are also different. The etching time is less than 40 seconds At this time, the substrate structure has not been fully represented; and when the etching time exceeds 40 seconds, the etching action is acting on the aluminum connection. For clearer explanation, this case uses a traditional etching endpoint map shown in Figure 18, where Various over-etched sections are marked. Page 53 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) — ^ ----- .... ........ ...— ·: Ordering ............ • Refer to (please read the notes on the back before filling out this page) 533526 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Reflected and / or scattered signals can be averaged (Fig. 19) in Table TF to provide you i · / -a · users with a more simplified display style. When the system is processing the substrate, the system's operation observes the average value of a series of events, which are marked with a number of prominent obituaries and out of beta warnings, so that users can quickly learn about the entire process. Figure 20 shows the average intensity value of the substrate, and the intensity value is represented by the average value of δ calculated from the characteristics of a reference reflection and / or scattering woman riding a knee-shaped alum. … The mean value is the weighted average brightness value of the substrate intensity I distribution obtained relative to a reference average brightness value. In (20), those shown are a series of 6 average values of the base material relative to the one + material average. As mentioned above, the eye-catching climbing blanket-r a u alarm and a tf area enable users to quickly know the entire process. Although the above description has been made with respect to the reflection and / or scattering signal characteristics obtained from the etched area having an execution endpoint system, the embodiments of the present invention are also applicable to the monitoring of other process steps that can bring about changes in the structure of the substrate. For example, Figure 21 shows how the reflection and / or scattering signal characteristics change with the peeling resist time. The example substrate is processed in a Centura system with a DSP metal etching processing chamber and an ASP ionization / passivation processing chamber, where the two processing chambers are purchased from Applied Materials Corporation after the etching and peeling process. The hot substrate is sent to a cooling processing chamber to be cooled to near room temperature, and the cooling processing chamber includes an equipment system according to an embodiment of the present invention. Page 54 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before writing this page)
533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 使用應用材料公司之設備進行除微影處理之外的全 部步驟,其中經處理之基材包含EPIC基材。該基材上 之光阻/金屬堆疊層結構為:8000埃之DUV光阻/250埃、 TiN ARC/5 500 埃、Al-Cu0.5%/250 埃、TiN/200 埃及 Ti 熱氧化物/3000埃。基材上的緻密圖案覆蓋率為5〇% , 其線寬/線距為0.2 5微米。 任何基材皆使用典型參數進行姓刻。此種餘刻方式 會蝕刻全部金屬堆疊層,而在大部份圖案化特徵結構(在 經圖案化線之肩部處3700埃)上留下約52〇〇埃之光阻。 在晶片體積縮小時,在薄金屬1堆疊及(邏輯元件 特別如此)最上層金屬間觀察到的變化較多,通訊用晶 片更屬其中之取。就通訊用晶片而言,其具有4000埃 之iS金屬1及厚度為4微米之銘金屬。因此,Asp處理 立必須也處理所有的金屬堆疊’不過此時良率將較易因 腐蝕及基材上剩餘光阻條件的改變而改變。 μ 採用一 ASP策略以適用於實驗目的。在此策略中, 僅使用一處理步騾,即只將Ηβ導入其中,且導入水 時的壓力較傳統ASP處理室所存在者為低。而該策略 使用的新參數為:溫度250。〇0.5托耳壓力、75〇 sccm h2〇 流率、1 400瓦特微波功率、隨特定基底材料變化之處 理時間。 在本發明各種ASP處理時間〇,ι〇,20,26,4〇,5〇秒鐘 及長達至200秒鐘進行經蝕刻基材之量測。第22圖所 示為ASP之各種處理時間所得到的強度變化圖,其中 第55頁 本紙張纽賴中國國家標準(CNS)A4規格(21GX297公變) ' - (請先閲讀背面之注意事項再填寫本頁) I· 、\呑 # 533526 A7 B7 五、發明説明() 所示之最大時間為5 0秒鐘。在第2 2圖中,剝離時間超 過4 0秒鐘之量度與4 0 - 5 0秒鐘者相似,再重新將超過 該時間之強度結果繪製於第23圖。該兩圖式得知在40 秒鐘光阻被完全移除。 在這些曲線中沒有有明顯的走勢趨向,因此這些曲 線上的跳動值被猜測為雜訊。為確知雜訊之大小,一單 一經剥離處理之基材被連續檢視六次,以決定其再現 性,此資料顯示於第24圖中。若再現性與第23圖者相 近’那麼便可推斷該基材之完全剥離時間時40秒鐘, 而該雜訊大小限於一定曲線範圍(envelope)内;在零強 度時雜訊大小相當於1 5000此的發生次數,且該值隨亮 度之增加而衰減。該曲線範圍能乘以3倍,以提供一 3 σ範圍曲線。任何超過此3 σ曲線之數據在統計上皆視 為有效數據。在一生產設備中,σ值可應用於任何產品 上,並可提供作為對變異來源的整體性研究。 在任何實例中,剥離時間之第2 6秒鐘時皆出現強 度值為10、而發生次數為70000的突出點,其大於預 計之 3 σ曲線值的兩倍。以上為殘留光阻之參考量測方 式。該光阻應在剝離處理時間為3 5秒鐘之基材上進行 量測,因為此種訊號可能大於3 σ。因此,此時可偵測 到的基材上光阻厚度為700埃。 另一實施例中,使用一平均值之移動平均(例如: 箱型車平均)。在生產過程中,後續平均值之平均數的 取得係由加縳先前平均值之數值、並再除以後續平均值 第56頁 本紙張尺度適用中國國家標準(CNS)A4規格(210Χ 297公釐) (請先閲讀背面之注意事項再填寫本頁) 、τ 參- 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 五、發明説明() 總數而得。只要獲得平均值之平均數,該平均值之平均 數能作為一移動參考值,以與一新基材之平均值做比 對。當該新基材之平均值位於該平均值之平均數的容許 數值範圍内時,如上述方式從一現今基材計算出一現今 平均值,並該現今平均值取代先前平均值,而計算出一 新參考平均值之平均數。警示控制範圍之警告持續維 持,以確保該平均值之平均數不會向上或向下移動而超 過製程容許範圍。 藉由使用經最佳處理之基材作為一參考訊號特徵, 多種實驗策略便能因此進行,並能得到結果,此時不需 對基材再做另外的確認動作。持續進行此種掃瞄式動 作,直至訊號特徵差異相當接近。 此外,依據本發明之實施例所得之經圖案化基材的 影像具有效用之資料,能用於量測基材上其他製裎相關 參數。舉例而言,金屬姓刻及剥離/純化處理後,圖案 化基材上的殘留光阻得以偵檢。 經濟部智慧財產局員工消費合作社印製 在金屬蝕刻過程中,基材被蝕刻及現場剝離之。和 處理之基材具有現場剥離及鈍化處理之必要性,用以防 止經蝕刻之鋁金屬結構被腐蝕。所有光阻皆需從基材上 加以移除,因為光阻層具有氯,在製造氣氛中包含—此 濕氣之情形下,該基材因接觸該種環境而讓氣腐姓及叙 金屬。在一典型製造情形中,執行後續處理步驟前,將 基材暴露於空氣中1小時至1天,該種腐蝕情形將不會 發生。 第57頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公楚) 533526 A7 B7533526 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () Use the equipment of Applied Materials to perform all steps except for lithographic processing, where the processed substrate includes EPIC substrate. The photoresist / metal stack layer structure on this substrate is: 8000 angstrom DUV photoresistor / 250 angstrom, TiN ARC / 5 500 angstrom, Al-Cu 0.5% / 250 angstrom, TiN / 200 Egyptian Ti thermal oxide / 3000 Angstroms. The dense pattern coverage on the substrate was 50%, and its line width / space was 0.2 5 microns. Any substrate is engraved using typical parameters. This pattern of etching will etch all metal stacks, leaving a photoresist of about 52,000 angstroms on most of the patterned features (3700 angstroms at the shoulders of the patterned lines). When the size of the wafer is reduced, more changes are observed between the stack of thin metal 1 and (especially the logic element) the uppermost metal, and the wafer for communication is more preferable. As for the communication chip, it has an iS metal 1 of 4000 angstroms and an inscription metal with a thickness of 4 micrometers. Therefore, the Asp process must also process all metal stacks', but at this time the yield will be more easily changed by corrosion and changes in the remaining photoresist conditions on the substrate. μ adopts an ASP strategy for experimental purposes. In this strategy, only one processing step is used, that is, only Ηβ is introduced into it, and the pressure when introducing water is lower than that existing in traditional ASP processing chambers. The new parameter used in this strategy is: temperature 250. 〇0.5 Torr pressure, 75 ° sccm h2〇 flow rate, 1 400 watts microwave power, and processing time depending on the specific substrate material. The measurement of the etched substrate is performed at various ASP treatment times of 0.25, 20, 26, 40, 50 seconds and up to 200 seconds. Figure 22 shows the intensity change graph obtained from various processing times of ASP. Page 55 of this paper is based on the Neway Chinese National Standard (CNS) A4 specification (21GX297 public variable) '-(Please read the precautions on the back before (Fill in this page) I ·, \ 呑 # 533526 A7 B7 5. The maximum time shown in the description of the invention () is 50 seconds. In Fig. 22, the measurement of peeling time exceeding 40 seconds is similar to that of 40-50 seconds, and the intensity results exceeding this time are plotted again in Fig. 23. The two figures show that the photoresist is completely removed in 40 seconds. There is no obvious trend in these curves, so the jitter values on these curves are guessed as noise. In order to determine the size of the noise, a single substrate that has been peeled off is inspected six times in succession to determine its reproducibility. This data is shown in Figure 24. If the reproducibility is similar to that of Figure 23, then it can be inferred that the substrate's complete peel time is 40 seconds, and the noise size is limited to a certain envelope; at zero intensity, the noise size is equivalent to 1 5000 occurrences of this, and the value decays with increasing brightness. This curve range can be multiplied by 3 times to provide a 3 σ range curve. Any data exceeding this 3 σ curve is considered statistically valid. In a production facility, the σ value can be applied to any product and can provide a holistic study of the source of variation. In any case, a prominent point with an intensity value of 10 and occurrences of 70,000 occurs at the 26th second of the peeling time, which is more than twice the expected value of the 3σ curve. The above is the reference measurement method for residual photoresistance. The photoresist should be measured on a substrate with a stripping time of 35 seconds, as this signal may be greater than 3 sigma. Therefore, the photoresist thickness on the substrate that can be detected at this time is 700 angstroms. In another embodiment, a moving average of an average value (for example, a box car average) is used. In the production process, the average of subsequent averages is obtained by adding the value of the previous average and dividing it by the subsequent average. Page 56 This paper applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) ) (Please read the notes on the back before filling out this page), τ--Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 V. The total number of invention descriptions (). As long as the average of the average is obtained, the average of the average can be used as a moving reference value to compare with the average of a new substrate. When the average value of the new substrate is within the allowable value range of the average of the average value, a current average value is calculated from a current substrate as described above, and the current average value replaces the previous average value and is calculated. The average of a new reference mean. The warning of the warning control range is continuously maintained to ensure that the average value of the average value does not move up or down and exceeds the process allowable range. By using the optimally processed substrate as a reference signal feature, a variety of experimental strategies can be performed and results can be obtained. At this time, there is no need to perform additional confirmation actions on the substrate. This scanning operation is continued until the signal characteristics are quite close. In addition, the image of the patterned substrate obtained according to the embodiment of the present invention has useful data and can be used to measure other parameters related to the manufacturing of the substrate on the substrate. For example, after the metal surname is etched and stripped / purified, the residual photoresist on the patterned substrate can be detected. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs During the metal etching process, the substrate is etched and stripped off-site. The substrate treated with and is necessary for in-situ peeling and passivation to prevent the etched aluminum metal structure from being corroded. All photoresists need to be removed from the substrate because the photoresist layer has chlorine and is included in the manufacturing atmosphere—in the case of this moisture, the substrate is exposed to the environment and causes rotten names and metal. In a typical manufacturing scenario, this type of corrosion will not occur if the substrate is exposed to the air for 1 hour to 1 day before the subsequent processing steps are performed. P.57 This paper is sized for China National Standard (CNS) A4 (210X297), 533526 A7 B7
、發明説明() 五 經濟部智慧財產局員工消費合作社印製 在一生產環境中,採用本發明之一 〇IS 15〇作為一 光阻偵檢器’以防止任何殘留有光阻之基材被送至大氣 環境中’在大氣彡衣境中腐姓行為將會發生。本發明之實 施例能用以測量大量基材的狀況,例如:大粒子、殘留 光阻、基材用緣處之氧化物厚度等。本發明實施例也能 完成其他偵檢處理,僅受限於基材表面上結構之變化程 度。 一實施例中,製程系統1 0 0具有檢視設備者得互連 形成網路系統,且其能追蹤個別基材數據,以偵測基材 整合之問題。舉例而言,對於基材角緣處之沉積氧化物, 從氧化物之蝕刻/剥離處至金屬之蝕刻/剥離處執行光譜 掃瞄能追蹤出該氧化物厚度。此外,金屬堆疊層厚度及 一致性的變化也能加以追蹤。經由各種處理步驟能追縱 出大粒子,產生粒子之硬體因而能被快速精確判知。若 以一網絡式檢視網為之,此時製造程序之整個生產線皆 得以受到監視。 本發明至少一實施例中,使用一種二階層粒子偵檢 方法。其中,該第一階層偵檢方法使用各種凝塊(blob) 分析技術,以決定粒子之近似尺寸及位置(以像素事件 表示)。上述方法所得的資料可用以決定這些像素事的 相近度。該第二階層偵檢方法以超過一門檻強度之像素 事件數決定警告及警示條件。此種分析技術得以決定粒 子之相似尺寸及其位置,並決定產生一警示之個別之像 素強度極限。 第58頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 4*- — 裝------訂 (請先閲讀背面之注意事項再填寫本頁) 533526 五 經濟部智慧財產局員工消費合作社印製 A7 B7 發明説明() 在一實施例中,阻障物之對比的最大化工作是於由 選擇一適用之極化光源及一線性偏光濾光器而達成。其 中’該線性偏光濾光器的設置係用以選擇讓與該偏光源 極化方向相差9 0度之光線透過。此“交錯極化,,之過 ’慮方法可得到散射光,而該散射光為進入接收器的主要 成份。其中,散射訊號係指已經散亂形式轉動之訊號, 且這種轉動是由於訊訊號照射到基材表面特徵/結構時 所產生的。使用交錯極化方法能選擇性移除基材之反射 光的反射成份,並散射光部份突顯出來而增加阻障物之 對比。這種技術能強調經圖案化基材之結構的光貢獻程 度’因而增加了對製程問題、基材層或厚度問題、及/ 或繞行錯誤之靈敏度。 在另一實施例中,反射訊號強度之變化的偵測係用 以突顯該反射光,這種反射光的一可能來源為基材表面 凹陷(d i s h i n g) ”處存在的微鏡效應,即這種凹陷表面 的微鏡將光傳回接收器所表現出的效應。 B •光譜分析 在其他實施例中,由一基材所得到的光譜數據有其 功用。其中,光譜數據的獲得可以一光譜儀(例如:彩 色CCD攝相機、或習知技術中的其他裝置為之)’其中 上述說明之實施例係使用彩色影像擷取裝置為之’例 如:第9圖及第12A-C圖中的OIS 150即以一光譜儀為 光譜數據取得裝置。 第59頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) .....-------訂.........# (請先閱讀背面之注意事項再填寫本頁) 533526 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明() 在一實施例中,從一已知基材所得的光譜數據用 以產生光譜訊號,反射訊號亦以極相近之方式取得。其 中,該光譜訊號表示基材的彩色組成及強度。就與反射 訊號特徵之說明相當,這種彩色訊號特徵接著可與一參 考彩色訊號特徵進行比對’以決定處理中的基材類型及 殘留材料等特徵。 第25圖所示為一基材37的各區域,這些區域所 產生的反射數據得以辨識製程問題。舉例而言’基材區 域2 5 0 5表示處理過程中的經姓刻或處理的各種電子元 件之基材的一雜湊區域。基材區域2510為該基材之一 經處理區域的放大圖。基材區域2520為基材37經處理、 但未經任何蝕刻處理的一開放區域。基材區域 2 5 3 0為 基材3 7之整體縮圖,其係從一微觀視野擷取全部基材 於一視野中。基材區域2540所示為基材37之另一區域, 其為所述說明中一 OIS 150之一接收元件的觀察視野。 當一訊號(例如:一光源)照射時,這些所有區域皆 提供光譜資料。不同之彩色/光譜訊號特徵能用以決定 區段及全部製程的異常行為。舉例而言,以光譜儀觀察 時,其正常顏色為綠色之基材區域2520為例。〇is 150 之製程檢視過程中,光譜儀從一新基材中擷取基材區域 2 5 20之視野,並發現到該原來顏色具有一藍色成分。 一般皆知,當基材厚度改變時,該顏色從綠色變化為藍 綠色所示為一製程問題,亦即該顏色變化表示該基材之 層厚度不正確。 第60頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) .... .....· t......,·:訂.........· (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 五、發明說明() 任何顯示區域2510、2520、2530、2540表示不同 製程監視點及潛在問題。舉例而言,基材區域2 5 2 〇之 原來顏色可表示在處理過程中電漿密度的變化。過度餘 刻處理也會產生一不同之光譜訊號特徵。 在一實施例中,將一基材之連續掃瞄彩色圖重叠 以製備出該基材之一彩色地圖輪廓。其中,該彩色地圖 輪廓藉由有效地標示該基材上的顏色變化來增強製程檢 視功能。舉例而言,正常情況下,具有一均勻且平扭表 面的基材,其顏色變化應該不大。一基材之彩色地圖輪 廓即可指出與該基材厚度及/或電漿處理步驟—致性變 化方面有關的顏色差異。 在另一實施例中,接收之能量數為光纖纜線尺寸 的函數。舉例而言,如第9圖中所示之一光纖纜線工7 〇 係用以輸送光源5 6處的反射光,其由數個標準光纖雙 線長纖維所組成。增加該標準光纖纜線數目則能增加傳 送至光譜儀5 8C收集到的訊號能量。 在一實施例中,偵檢器或光纖纜線之角度係相對 於反射光之主軸而移動以增強某一彩色光譜。不同光譜 係相關於拓樸型態及/或基材(基材厚度、阻障物、基材 材料之形式及此種基材因素)的材料差異。 C .基材類型判定及繞行 在一實施例中,本發明決定基材類型。正如上述 說明’基材之圖案提供獨一無二的反射及光譜訊號特 徵。本發明依據上述說明之掃描方式掃描基材,利用所 第61頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ---- ----·裝......…訂.........# f請先閲讀背面之注意事項再填寫本頁} 533526 A7 B7 五、發明説明() 得之訊號特徵以辨識基材類型’並將接收到的訊號傳送 至PMC 86用以處理。請參閱上述提及之第9圖,接收 器5 8接收到光線的反射及/或散射部位,以決定該基材 表面的顏色。隨後將掃瞄到的圖案與先前記錄之顏色及 /或光譜訊號特徵進行比對,而決定出該基材類型。上 述應用方式提供一種偵測基材繞行錯誤之功能。舉例而 言,ΟIS 1 5 0偵測到具有光阻之一基材,其繞行錯誤而 到達一物理氣相沉積(PVD)處理室,並將該基材送回以 避免一製程處理室及該基材之潛在傷害。此外,基材圖 案之辨識會依據辨識出的基材類型而自動調整製程參 數。再者,基材辨識可使設備自動選擇用於警告及警示 條件的合適試驗/監視標準。 D . j D成像 本發明也能在三維(3 D)空間中監視阻障物。請再次 參照第2圖之一實施例,光源56A以二或更多方向掃 瞒基材,且隨後,光源56B也以二或更多方向掃瞄基材。 接收器58擷取至少包含二或多種不同影像之光源56A-B反射及/或散射訊號。當光源56α·β之角度約互成直 角時,光照明以不同角度(亦即透視)照射基材表面上的 阻障物。因此,從光源5 6 Α所得之影像為阻障物之一 側邊相關資料,而從光源56B所得之影像為阻障物之相 對側邊相關資料。 可以光源56A-B在任何平面、及於任何移動方向 來掃瞄基材。舉例而言,一基材可移動於光源56A之 第62頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂· ·# 經濟部智慧財產局員工消費合作社印製 533526 A7 五、發明説明() 一掃瞄方向且接續以相同方向移動、或 〜矽動於不同方向 (光源5 6B之一掃瞄方向)。在一實施例 在不同角廣 使用數個光源以掃瞄基材。 使用數據整合及影像處理技術,能獲得— , 卷材表 面之约略二維顯示影像^這種影像能使致 衣狂風視系統明 確界定某一阻障物、或圖案化結構之高度、及/戈、菜 因此,二維成像技術能加以映射基材表 回疋拓撲狀態, 而與其他基材拓樸狀態進行比對,以決定 ^ |何衣面之相 對一致性。 E.光學特徵辨識 在本發明另一實施例中,提供光學特徵辨識 (Optical Character Recogniti〇n,0CR)技術。〇cr 技術 係透過視訊成像以偵測及處理相關之字母與數字符號構 成的特徵。基材通常以其表面所顯示出的特徵加以界 定。如第1〇圖中所示,該傳送組件(隱藏)及本發明之 接收組件5 8提供具有照射及偵測該特徵之一設備,並 隨後傳送一訊號至PMC 86用以處理。其中,該接收器 58係設置以接收反射及/或散射光。在操作過中,一基 材以上述方式進行掃瞄,訊號特徵54照射到基材之特 徵結構,且該訊號依據基材之幾何特徵結構被反射及y 或散射。如上述說明,就該特徵結構之某—排列方式及 組態而言’其具有獨一無二的反射及/或散射訊號為。 OCR技術通常使用適於辨識及讀取影像(例如:特徵、 標號、條碼、及此種影像)之圖案辨識演算。 第63頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) ¥ ,言· 經濟部智慧財產局員工消費合作社印製 533526 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明說明() F.對位及尋找中心 另一實施例中’決定一基材方位及中心。對於一 處理室中欲處理的基材而言,該基材之對位及尋找中心 為確保置放其於適當位置的必要步驟。舉例而言,触刻 處理中通常會涉及使用一罩幕、接地環、或夾鉗以覆蓋 基材之部分表面。為没置該罩幕、接地3哀、或夹甜於基 材的適當部位上,則必須將該基材中心精確置放於製程 處理室中。基材邊緣之曲率因而能用以尋找該基材中心 並加以定位。另外,基材上典型的平坦部位或凹痕能用 以改變該基材方位。 習用尋找基材中心的方式係使用一或多個感測器 以決定該基材中心。使用本發明可使尋找基材中心更為 便利,並降低其對額外感測器之需求。特定而言,基材 可在用於製程監視及粒子檢測之FI 1 04中進行掃瞄。 能在掃瞄期間將接收到的資料加以處理,因而得以尋找 出基材中心及/或加以定位。 一實施例中,在基材移動時尋找出該基材中心及 方位。如上所述之該承載盤收縮、延伸及/或旋轉期間, 一基材可藉由OIS 150(亦即傳送器單元56及接收器單 元5 8)以進行照照射及掃瞄。一實施例中’基材之直徑 及中心因此能由PMC 86加以決定。舉例而言’當一基 材進入一訊號路徑時,由於反射光之緣故而偵測到該基 材前緣。 另一實施例中,一基材置放於一處理室中(亦即’ 第64頁 (請先閲讀背面之注意事項再填寫本頁) 裝· .v-sr ·# 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 533526 五 經濟部智慧財產局員工消費合作社印ίί A7 B7 發明説明() 該基材為固定狀態)而尋找出該基材方位及中心,其中 該處理室可為第1 A圖所示之一製程系統中的一冷卻處 理室、除氣(degas)處理室、或任何其他處理室。經由置 放基材於接收器單元58的視野中’能同時尋找該基材 中心及方位。第13A-C圖中所示為一尋找未移動基材 之方位及中心的ΟIS 1 5 0之實施例。照射該基材表面係 以移動該OIS組件的方式,而不是以移動該基材之方式 而達到照射目的。另外,請參考第9圖及第1 〇圖,該 傳送器可用以照射基材之足量部位,而不需移動該 OIS 組件及基材(該傳送器單元至少包含一閃光元件及任何 各自光學組件)。以此方式實施時,該處理室能作為一 分析基材之區域及執行一製程功能(例如··冷卻或排 氣)。因而進行分析時不影響製程系統之產出量。 G.元件校準 本發明除檢視基材外,也適用於校準。在一實施 例中,本發明用以校準偵檢元件。本發明使用之照射及 偵檢元件可能不具一致性,因而必須將其施以正常化處 理。在一實施例中,該正常化處理係由下列步驟而達成。 首次設置 OIS 150(該傳送組件及接收組件)時,一基材 被向下置放於一機器人承載盤上,以提供一散射表面。 該機器人隨後在OIS 150下方移動該基材。在該承載盤 之轉動或線性移動時,OIS 150對通過之基材表面進行 峰·至峰(peak-to-peak)及均方根值之量測,並傳送該值 第65頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) I · -·裝· 訂* 533526 A75. Description of the invention (5) Printed by a consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in a production environment, using one of the present invention 〇IS 15〇 as a photoresistance detector to prevent any substrates with photoresist remaining Sent to the atmospheric environment 'The behavior of rotten names in the atmospheric environment will occur. The embodiments of the present invention can be used to measure the condition of a large number of substrates, such as large particles, residual photoresistance, and oxide thickness at the edges of the substrate. Embodiments of the present invention can also complete other detection processes, which are limited only by the degree of structural change on the surface of the substrate. In one embodiment, the process system 100 has an inspection system to interconnect with each other to form a network system, and it can track individual substrate data to detect problems with substrate integration. For example, for the deposited oxide at the corner of the substrate, performing a spectral scan from the oxide etch / strip to the metal etch / strip can track the thickness of the oxide. In addition, changes in metal stack thickness and consistency can be tracked. Large particles can be traced through various processing steps, and the hardware that generates the particles can be quickly and accurately identified. If a network-based inspection network is used, the entire production line of the manufacturing process can be monitored at this time. In at least one embodiment of the present invention, a two-level particle detection method is used. Among them, the first-level detection method uses various blob analysis techniques to determine the approximate size and position of particles (represented by pixel events). The data obtained by the above method can be used to determine the similarity of these pixels. The second-level detection method determines the warning and warning conditions by the number of pixel events exceeding a threshold intensity. This analysis technique determines the similar size and location of the particles, and determines the individual pixel intensity limits that produce a warning. Page 58 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) 4 *-— installed ------ order (please read the precautions on the back before filling this page) 533526 Five Ministry of Economy wisdom Printed by A7, B7, and Consumer Cooperatives of the Property Bureau. Invention Description () In one embodiment, the task of maximizing the comparison of obstacles is achieved by selecting a suitable polarized light source and a linear polarizing filter. Among them, the setting of the linear polarizing filter is used to select a light having a difference of 90 degrees from the polarization direction of the polarizing light source to pass through. This "staggered polarization" method can obtain scattered light, and the scattered light is the main component that enters the receiver. Among them, the scattered signal refers to a signal that has been scattered in a scattered form, and this rotation is due to the signal This signal is generated when the signal is irradiated to the surface features / structures of the substrate. The staggered polarization method can be used to selectively remove the reflective component of the reflected light of the substrate, and the scattered light part is highlighted to increase the contrast of the obstacle. The technology can emphasize the degree of light contribution of the structure of the patterned substrate, thus increasing sensitivity to process issues, substrate layer or thickness issues, and / or bypass errors. In another embodiment, changes in the intensity of the reflected signal The detection system is used to highlight the reflected light. One possible source of this reflected light is the micromirror effect existing at the "dishing" on the surface of the substrate, that is, the micromirror on the concave surface transmits light back to the receiver. Demonstrated effect. B. Spectral Analysis In other embodiments, the spectral data obtained from a substrate is useful. Among them, the spectral data can be obtained by a spectrometer (for example, a color CCD camera or other devices in the conventional technology) 'wherein the embodiment described above is using a color image capture device' For example: FIG. 9 And OIS 150 in Figs. 12A-C uses a spectrometer as the spectral data acquisition device. Page 59 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) .....------- Order ......... # (Please read the note on the back first Please fill in this page again) 533526 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () In one embodiment, the spectral data obtained from a known substrate is used to generate a spectral signal, and the reflection signal is also Obtained in a very similar way. The spectral signal indicates the color composition and intensity of the substrate. It is equivalent to the description of the characteristics of the reflection signal, and this color signal characteristic can then be compared with a reference color signal characteristic 'to determine the characteristics of the substrate type and residual material in processing. Figure 25 shows the regions of a substrate 37. The reflection data generated by these regions can identify process problems. For example, the 'substrate region 2 5 5' represents a hash region of the substrates of various electronic components engraved or processed during the processing. The substrate region 2510 is an enlarged view of one of the processed regions of the substrate. The substrate region 2520 is an open region where the substrate 37 is processed, but without any etching treatment. The substrate area 2 5 3 0 is an overall thumbnail of the substrate 37, which is to take all the substrates from a microscopic field of view in a field of view. The substrate region 2540 is shown as another region of the substrate 37, which is the observation field of view of one of the receiving elements of an OIS 150 in the description. When a signal (eg, a light source) is illuminated, all these areas provide spectral data. Different color / spectral signal characteristics can be used to determine the abnormal behavior of the segment and the entire process. For example, when the spectrometer observes, the substrate region 2520 whose normal color is green is taken as an example. During the process inspection of 〇is 150, the spectrometer captured the field of view of the substrate region 2 5 20 from a new substrate, and found that the original color had a blue component. It is generally known that when the thickness of the substrate changes, the change of the color from green to blue-green indicates a process problem, that is, the color change indicates that the layer thickness of the substrate is incorrect. Page 60 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) ........... t ..., ...: order ... · (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 B7 V. Description of the invention () Any display area 2510, 2520, 2530, 2540 indicates different process monitoring points and potential problem. For example, the original color of the substrate region 2520 can represent the change in plasma density during processing. Excessive residual processing can also produce a different spectral signal characteristic. In one embodiment, successive scanning color maps of a substrate are superimposed to prepare a color map outline of the substrate. The color map outline enhances the process inspection function by effectively marking the color change on the substrate. For example, under normal circumstances, a substrate with a uniform and flat twist surface should not change much in color. The color map outline of a substrate can indicate color differences related to the thickness of the substrate and / or plasma processing steps—variation in consistency. In another embodiment, the amount of energy received is a function of the size of the fiber optic cable. For example, as shown in Figure 9, one of the fiber optic cable workers 70 is used to transmit the reflected light at the light source 56, which is composed of several standard optical fiber double-line long fibers. Increasing the number of standard fiber optic cables can increase the signal energy transmitted to the spectrometer 5 8C. In one embodiment, the angle of the detector or fiber optic cable is moved relative to the major axis of the reflected light to enhance a certain color spectrum. Different spectra are material differences related to the topology and / or substrate (thickness of substrate, barrier, form of substrate material, and factors of such substrate). C. Substrate Type Determination and Detour In one embodiment, the present invention determines the type of substrate. As explained above, the substrate pattern provides unique reflection and spectral signatures. The present invention scans the substrate according to the scanning method described above, and uses the paper size on page 61 to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) ---- ----... … Order ......... # f Please read the notes on the back before filling out this page} 533526 A7 B7 V. Description of the invention () Signal characteristics obtained to identify the type of substrate 'and the received signal Send to PMC 86 for processing. Referring to Figure 9 mentioned above, the receiver 5 8 receives the reflected and / or scattered parts of the light to determine the color of the surface of the substrate. The scanned pattern is then compared with previously recorded color and / or spectral signal characteristics to determine the type of substrate. The above application method provides a function to detect substrate bypass errors. For example, 0IS 1 50 detected a substrate with photoresist, which bypassed and reached a physical vapor deposition (PVD) processing chamber, and returned the substrate to avoid a process processing chamber and Potential damage to the substrate. In addition, the identification of the substrate pattern will automatically adjust the process parameters based on the identified substrate type. Furthermore, substrate identification allows the device to automatically select the appropriate test / monitoring criteria for warning and alert conditions. D. j D imaging The present invention can also monitor obstacles in three-dimensional (3D) space. Referring again to the embodiment of FIG. 2, the light source 56A scans the substrate in two or more directions, and then, the light source 56B also scans the substrate in two or more directions. The receiver 58 captures reflection and / or scattering signals from light sources 56A-B including at least two or more different images. When the angles of the light sources 56α · β are approximately at right angles to each other, the light illumination illuminates the obstacles on the surface of the substrate at different angles (that is, perspective). Therefore, the image obtained from the light source 56A is one of the side-related data of the obstacle, and the image obtained from the light source 56B is the opposite side-related data of the obstacle. The light sources 56A-B can be used to scan the substrate in any plane and in any direction of movement. For example, a substrate can be moved on page 62 of the light source 56A. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page). Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 533526 A7 V. Description of the invention () Scanning direction and subsequent movement in the same direction, or ~ silicon moving in different directions (one scanning direction of light source 5 6B). In one embodiment, several light sources are used at different angles to scan the substrate. Using data integration and image processing technology, it is possible to obtain —, an approximately two-dimensional display image of the surface of the coil material ^ This image enables the clothing wind system to clearly define the height of a certain obstacle, or patterned structure, and / or Therefore, the two-dimensional imaging technology can map the substrate table back to the topological state, and compare it with the topological state of other substrates to determine the relative consistency of He Yimian. E. Optical Feature Recognition In another embodiment of the present invention, an Optical Character Recognition (OCR) technology is provided. 〇cr technology uses video imaging to detect and process the features formed by related alphabetic and numeric symbols. The substrate is usually defined by the characteristics shown on its surface. As shown in Fig. 10, the transmitting module (hidden) and the receiving module 58 of the present invention provide a device having the feature of illuminating and detecting, and then transmitting a signal to the PMC 86 for processing. The receiver 58 is configured to receive reflected and / or scattered light. During operation, a substrate is scanned in the manner described above, and the signal feature 54 irradiates the characteristic structure of the substrate, and the signal is reflected and y or scattered according to the geometric characteristic structure of the substrate. As described above, in terms of the arrangement and configuration of the characteristic structure, it has a unique reflection and / or scattering signal. OCR technology usually uses a pattern recognition algorithm suitable for identifying and reading images (eg, features, labels, bar codes, and such images). Page 63 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling out this page) ¥, Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives 533526 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention () F. Alignment and Finding Center In another embodiment, 'determining the orientation and center of a substrate. For a substrate to be processed in a processing chamber, the alignment and finding of the substrate are necessary steps to ensure that it is placed in the proper position. For example, the etch process usually involves the use of a mask, ground ring, or clamp to cover part of the surface of the substrate. In order to not place the cover, ground, or sandwich it on the appropriate part of the substrate, the center of the substrate must be accurately placed in the processing chamber. The curvature of the substrate edge can thus be used to locate and locate the center of the substrate. In addition, typical flat areas or dents on the substrate can be used to change the orientation of the substrate. The conventional way to find the center of a substrate is to use one or more sensors to determine the center of the substrate. Using the present invention makes it easier to find the center of the substrate and reduces its need for additional sensors. In particular, the substrate can be scanned in FI 104 for process monitoring and particle detection. The data received can be processed during scanning, so that the center of the substrate can be found and / or positioned. In one embodiment, the center and orientation of the substrate are found when the substrate is moving. During the contraction, extension, and / or rotation of the carrier disk as described above, a substrate can be illuminated and scanned by the OIS 150 (i.e., the transmitter unit 56 and the receiver unit 58). The diameter and center of the substrate in one embodiment can therefore be determined by PMC 86. For example, 'When a substrate enters a signal path, the leading edge of the substrate is detected due to reflected light. In another embodiment, a substrate is placed in a processing chamber (that is, 'page 64 (please read the precautions on the back before filling this page). · .V-sr · # This paper size applies to China Standard (CNS) A4 specification (210X 297 mm) 533526 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 Invention description () The substrate is in a fixed state) and the orientation and center of the substrate are found, where the treatment The chamber may be a cooling processing chamber, a degas processing chamber, or any other processing chamber in a process system shown in FIG. 1A. By placing the substrate in the field of view of the receiver unit 58 ', the center and orientation of the substrate can be found simultaneously. Figures 13A-C show an embodiment of the 0IS 1 50 for finding the orientation and center of an unmoved substrate. Irradiating the surface of the substrate is achieved by moving the OIS component, rather than by moving the substrate. In addition, please refer to Figure 9 and Figure 10. The transmitter can be used to illuminate a sufficient portion of the substrate without moving the OIS component and the substrate (the transmitter unit includes at least a flash element and any respective optical Component). When implemented in this way, the processing chamber can be used as an area for analyzing substrates and perform a process function (such as cooling or exhausting). Therefore, the analysis does not affect the output of the process system. G. Component Calibration In addition to inspecting the substrate, the present invention is also suitable for calibration. In one embodiment, the present invention is used to calibrate a detection element. The irradiation and detection elements used in the present invention may not be consistent, so they must be normalized. In one embodiment, the normalization process is achieved by the following steps. When setting up the OIS 150 (the transmitting and receiving components) for the first time, a substrate was placed down on a robotic tray to provide a scattering surface. The robot then moves the substrate under the OIS 150. During the rotation or linear movement of the carrier, OIS 150 measures the peak-to-peak and root-mean-square values of the passing substrate surface and transmits the values. Page 65 Applicable to China National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) I ·-· Binding · Order * 533526 A7
經濟部智慧財產局員工消費合作社印製 五、發明説明() 至PMC 86。接續進行任何0IS ho量測值之平均讀取 值的比對,以決定將系統正常化所需的修正因子。隨後 移除該基材,並以一相似方式掃瞄該機器人承載盤之固 體部位(亦即,包含空孔及邊緣部位)^而後,將該♦至 峰值及平均強度值與該正常化修正因子進行比對,以決 疋社其掃瞒過程中合適之承載盤修正因子。之承載盤修 正因子為適當值時,該承載盤能作為一剩餘校準參考。 因此,OIS 150(與PMC 86連結)能在正常操作下監視該 空置承載盤以決定該接受器及傳送器是否功能正常。如 果該接受器及傳送器受到污染或功能退化,將其進行上 述背景測試。再者,也能監視及確認該承載盤之平整性 及一致性。 H. 承載盤污染 此外,經由上述實施例之試驗也可偵測出該承載盤 表面上的污染物。該承載盤上存在污染物指出在搬運基 材及/或該基材上所收集到的殘留製程副產物時,該基 材背部之一些地區受到刮傷。因此,若在該承載盤上偵 測到污染物,為進行檢視而將系統中斷,以避免製程環 境進一步污染。 I. 機器人校準 另一實施例中,Oils 1 50有利於機器人校準。製 程系統機器人(如:傳送處理室機器人Π 3)需週期性校 準以確保正常方位及調準。因為OIS 150位於一製程系 第66頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ..................«^........•:訂.........# (請先閲讀背面之注意事項再場寫本頁) 533526 A7 B7 五、發明説明() 統上方的一固定處,該OIS 150能提供用於PMC 86傳 送處理室機器人校準之一參考點。一旦決定出該承載盤 正常化因子(如上所述),改變機器人位置以偵測出該承 載盤特徵。速率及振動能被監視為監視/調整比例項, 亦即行動控制系統的積分及微分(pIM)值。由PMC 86 所儲存的偵測位置值與校準位置值間存在足量差異表示 該承載盤對位不佳情事。該對位不佳情事因而得以自動 修正。 J.機器人行為 本發明也能用於監視機器人行為。舉例而言,當機 器人轉動而通過接收器裝置58之光學路徑61(顯示於第 6圖中)時,最接近轉動中心的該承載盤邊緣會首先進入 該光學路徑。此邊緣隨後持續以一速率進入任一偵檢器 元件之視野(FOVs)中,該行進速率係由該承載盤速率決 定之。此種做法能使ΟIS 1 5 0獨立監視一機器人之特徵 行為,如:可被量測/監視而得的沈降時間、加速度、 及穩定性。該收集所得數據能以手動或自動方式設定機 器人113之PID參數。 此處不再進行其他可能應用之詳細描述。舉例而 言,本發明也能用於偵測一機器人承載盤上一基材的存 在及該基材於該承載盤移動期間是否以一承載盤夾甜方 式以穩固該基材。熟習此項技藝者會承認其他應用可藉 由本發明加以實施。 第67頁 本紙張尺度適用中國國家標準(CNS)A4規格(210Χ 297公釐) (請先閲讀背面之注意事項再填寫本頁) .·裝. 經濟部智慧財產局員工消費合作社印製 533526 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明() 因此,本發明有益於使用一典型處理工具之不同組 件以達成多功能的整合。將一或多個OIS 單元丨50有 效設置(例如.位於一轉送處理置中),能執行多製程管 理功能。综上所述,本發明提供一種具有達成一相當高 階系統整合及減少該系統操作成本的多用途設備。 K.第一晶圓影響 半導製私中一常見情事為熟知的「第一晶圓影 響」。第一晶圓(亦即基材)影響為基材處埋時造成處理 室潔淨程度損害之情事。必須週期性清理處理室以移除 隨時間變化而堆積於該内部處理室表面的殘留物質0然 而,發現到先前潔淨基材之處理結果不同於後續潔淨基 材之處理結果。特定而了,一清理循環後所得之前N 個基材顯示之特徵不同於後續處理基材。综上所述,一 處理室潔淨程度受到一陳化處理的影響,藉由陳化處理 使該處理室達到一平衡狀態,隨後在此平衡狀態下得以 均勻處理基材。該陳化處理涉及於製程條件(或為加速 得到所欲結果之改良製程條件)下操作該處理室,在該 處理室表面上披覆一材料之情事。再者,陳化處理之一 問題點在於何時決定該處理室被充分陳化。 本發明一實施例將陳化處理之一終點偵測納入考 量。特定而言,在處理室之陳化處理期間,基材係位於 一潔淨處理室進行處理。而後,以一或多個〇IS丨5〇檢 視任何基材。一旦一經處理的基材顯示出預定特徵時, 第68頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇χ 297公釐) ,—---------^-------I ^ (諳先閲讀背面之注意事項再填寫本頁) 533526 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明() 就能得知該處理室已充分陳化。 L. 產出量監視 另一實施例中'進行產出量的監視。產出量能藉由 決定一已知基材何時進入製程系統及何時離開製程系統 (或完成該系統中某一處理階段)而加以監視之。此外, 也能加以觀察及記綠該基材停留於冷卻處理室之時間。 而後使用此種方法所收集到的多基材數據以決定尖峰產 出量、平均產出*、到達頻率、頻率之變異性及其他相 關資訊。 M. 製程監視正常化 在一實施例中,將製程差異性于以正常化。製程系 統100可包含數個0IS 150,每—〇IS 15〇監視一不同 處理區域。任一 OIS 150在處理基材時皆提供一變動的 製程底線讀數。經過一段時間後,任一 〇IS丨5〇間的變 動值產生足量差異,而產生一不實的製程退化讀數並發 出警告。為使不實警告次數最小化,將一正常化基材送 至製程系統並由任一 ΟIS 1 5 0進行量測。藉由該正常化 基材,得以正常化任何OIS 150間的差異。 一實施例中’使用參考晶圓以校準其他製程系統 1 0 0。舉例而了’以一參考基材值、相同基材值、或相 似基材值為基礎,製程系統1 00則能具有其他相同製程 系統預期能獲得的已知值。 第69頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ——‘·:::'-·-裝......,:訂.........·# (請先閲讀背面之注意事項再填寫本頁) 533526 五、發明說明( 經濟部智慧財產局員工消費合作社印製 數據製程系統 由PMC 86讀取之一程式來決定應於一基 何種工作。兮赶4 執行 μ 式為PMC 86可讀取之一軟體及勺厶 少產生基材位置資料、基材反射率資訊、反射及匕至 射資訊基材缺陷資訊、基材損傷資料、用於平扭2 — 圖术化基材的粒子污染物資料、用於機器人承載盤: :污染物資料、由字母與數字符號構成的特徵資:、、 器人行為資料、用於機器人及偵檢裝置之校準資料、 上述任何貝料之組合者的程式碼者為佳。 , 在一貫施例中,本發明執行一電腦程式以控制_ 86。該程式定義此處該實施例陳述的功能,並經由各 包含訊號的媒體提供該程式至一電腦。上述包含訊號 媒體至少包含(非用以限定下列應用)··⑴固存於非寫 式儲存媒體(例如:一電腦内的唯讀記憶體裝置, CD-ROM或DVD_R〇M裝置能讀取的唯讀cd_r〇m磁 片)的資料;(U)儲存於m式料媒體(磁碟機 硬碟機内的軟式磁碟片)的可抹寫資料;或(iii)經由傳 媒介而傳送至一電腦中的資料,例如:經由一包含無 通訊的電腦或電訊網路。本發明另—實施例中,上述 含訊號的媒體用以傳輸主導本發明功能的電腦可讀取 指令。也能注意到的是,可發展部分程式並單獨實施之 本發明也包含結合上述部分程式之實施例。 第26圖所示為用於一系統26〇〇組態之一高階結構 第70頁 粒 機 及 種 的 入 碟 或 包 式 .....Μ......1 -訂......... f請先閲讀背面之注意事項再場寫本頁) 533526 A 7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 實施例示意,該結構用以執行粒子檢測及其他製程監視 方法。雖然本發明此處將系統2600及PMC 86分開說 明,但系統2600可為PMC 86之一實施例或能與PMC 86 整合。 系統2600通常包含一應用層 2602、一驅動器層 2 6 04、一硬體介面層 2606、一内部硬體層 2608、一外 部硬體層2610、及一工廠介面層2612。系統2600之每 一層可能包含適用於支援特定功能的任何硬體及軟體的 組合。一般而言,應用層 2602、驅動器層2604、硬體 介面層2606、及内部硬體層2608為上述說明中光學檢 視系統(OIS) 150之組成元件。外部硬體層2610用以表 示一 ΟIS 1 5 0中已執行的任何系統。舉例而言,外部硬 體層2610可為上述說明的叢集工具(請參考第2圖 工廠介面層2612用於表示介於周邊裝置、〇is 150、及 外部硬體層 261 0之間的運算點。在一實施例中,工廠 介面層2612包含一主機及一數據收集伺服器。 應用層 2602 至少包含一圖形使用者介面 (GUI)2620、一伺服器處理2622、一粒子偵檢處理2624、 一製程監視處理2626、及一資料庫2628。GUI 2620為 一使用者及伺服器處理之介面的一工作組態。一些實施 例中,GUI 2620至少包含使用者處所傳送或要求資料 的一對話盒(顯示於一監視器中)。特定而言,使用 GUI 2 622用以產生局部要求以回應該使用者發出的命令。 該命令能以任何輸入裝置(例如:一鍵盤、鍵塾、光筆、 第71頁 (請先閲讀背面之注意事項再場寫本頁) 裝· 訂· # 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533526 A7 B7 經濟部智慧財產局員工消费合作社印製 五、發明説明() 觸控式螢幕、軌跡球、語音辨識裝置、語音/影音播放 機、及此類裝置)加以輸入。 GUI 2 620所產生的局部要求被送至伺服器處理 中作為處理。另外,由局部客戶端(例如:GUI 2622)所 接收到的要求,伺服器處理2622也能接收遠端客戶之 要求。在第2 6圖中,選端客戶係以外部硬體層2 6 1 0及 外部介面層2612表示之。 為回應各種客戶端要求,伺服器處理2622採取步 驟產生一回應或處理該要求。舉例而言,使用者從 2 620發出的命令可能造成飼服器處理2622呼叫粒子偵 檢處理2624及製程監視處理2626,該二處理於下文中 進行更詳細說明。另外,伺服器處理2622用於負責系 統2 600之其他層的溝痛。伺服器處理2622更適用於行 系統2600之初始化。初始化過程可包含讀取一組態檔, 該組態樓包含用以組態該系統600之資料。該組態檔能 儲存於資料庫2628中。因此,操作伺服器處理2622作 為用於應用層2602之一中心資料管理實體。 一般而言,粒子偵檢處理2624支援基材影像之粒 子檢視並產生報告。為達到此種目的,粒子偵檢處理2 6 2 4 執行一或多種粒子偵測演算法。舉例而言,上述演算法 包含「Blob’s」分析演算法及「像素」分析演算法。經 由遠處理2 6 2 4進行檢視者可為平坦(未經圖案化)或經 圖案化之基材。 製程監視處理2626執行一或多種製程監視處理演 第72頁 本紙張尺度適用中國國家標準(CNS)A4規格(210父297公笼) (請先閲讀背面之注意事項再填寫本頁) 裝. 訂- ·# 533526 A7 B7 五、發明説明() 算法,如平均強度分析。一般而言,製程監視處理2 6 2 6 又挺長條形檢視方式並產生比對圖示。粒子偵檢處理 2624及製程監視處理2626之實施例參照第27-28圖於 下文中加以說明。 應用層2602藉由多種介面之一者與系統2600的其 他層進行溝通。用以說明之應用層2602包含一半導體 設備溝通標準(SECS)介面2630、一報告者介面2632、 一攝相機介面2634、及一光源介面2636。 SECS介面2630將伺服器處理2622與遠端客戶間 的資料再次編排並使該資料流通。該遠端客戶以外部硬 體層2610及外部介面層2612表示之。 報告者介面2632為一種每次基材受檢視時負責產 生報告,並隨後儲存該報告至一局部或遠端磁碟儲存裝 置中的一介面工作。在一實施例中,該磁碟儲存裝置為 工廢介面層2612之一部位。 攝相機介面2 6 3 4為一種被組織以支援上述說明接 收單元(及其他偵檢裝置,如:基材感測器)的介面工作, 且攝相機介面2634以内部硬體層2608表示之。一般而 言,攝相機介面2634使基材影像精準度、執行製程監 視、及設定該接收單元得以增強。設定該接收單元的步 驟包含下載該接收器設定、將該接收器聚焦、及調整該 接收器之位置(方位)。此外,攝相機介面2 6 3 4對產生 之報告(由報告者介面2632)初步產生一要求。操作過程 中,攝相機介面2634接收從伺服器處理2622傳送的接 第73頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 、1‘ # 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 ----- 五、發明説明() 收單元操作指令。該指令隨後經由驅動器介面2604及 硬體介面層2606而傳送至内部硬體層2608。而後,驅 動器層2604回應之指令由攝相機介面2634所接收,並 傳送至伺服器處理2622。〆實施例中,驅動器層2604 至少包含一國際儀器影像驅動器(NIIMAQ)之驅動程式 及硬體介面層2606,其中硬體介面層2606至少包含 RS232介面及TTL傳輸埠的幀接收器介面卡(Frame Grabber Card),每一驅動器層2604用以支援任何内部 硬體層2608之攝相機介面2634間繞行的訊息。 光源介面2 6 3 4為一種被組織以支援上述說明傳送 單το的介面工作,且光源介面2634以内部硬體層2608 表不心。一般而言,光源介面2634之功能包含決定現 存光線強度及調整光線強度。在操作過程中,伺服器處 理2 622所接收到的資料經由光源介面2634而傳送至驅 動器層2604内的一驅動器,隨後傳送至硬體介面層26〇6 之卡。 見知例中,該驅動器為一 Omega ADLIB驅 動器、而該卡為一 DI/DO卡。内部硬體層gj ^ # 以反向方式繞行至該光源介面。 雖然上述說明為一單一系統,但應用層2 6 〇 2之組 成此分散於一網路環境中。舉例而言,G u I 2 6 2 0能位 於一電腦伺服器遠端處的一網路工作站上,該電腦词服 器係用以執行伺服器處理2622。粒子偵檢器應用及製 程監視應用。 第2 7圖所示為使用系統2 6 0 0、用於製程監視及粒 第74頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) ------------^......-一丨—^Γ......... (請先閲讀背面之注意事項再填寫本頁) 533526 A7 B7 五、發明說明() 子偵、檢的控制程式的一方法2700流程圖。為使本文簡 潔起見’將製程監視僅以反射分析加以說明之。但熟知 此項技藝者將會承認本發明其他包含光譜分析的製程監 視貫施例。 啟動系統2 6 0 0時,方法2 7 0 0進入步驟2 7 〇 5。步 驟27丨〇時,系統2600被初始化並準備接收程式所輸入 的事件。在步驟2712時。系統2700接收一事件。 當進行至步驟27 1 5時,該方法決定是否產生一系 統組態。系統組態事件包含組織資料之儲存目綠、建立 缺陷地圖、設定警示、缺陷數目極限、及其他程式設定。 若並未發生一系統組態事件,方法27〇〇進行至下文說 明中的步驟2725 ;若已發生一系統組態事件,法27〇〇 進行至步驟2720以取得及設定系統組態。步驟272〇中 能調整程式之行為、設定執行時間以追蹤該程式的操 作、且經由内含於一或多個數據結構中的系統參數而設 定其他系統組態。一實施例中,該數據結構包含可能儲 存於資料庫2626(顯示於第26圖)中該系統組態。 步驟2725中,方法2700決定是否已經發生一系統 架設事件。若未發生一系統架設事件,方法27〇〇進行 至步驟273 5。該系統架設事件包含接收器校準(例如: 對位及聚焦)、設定接收器取樣速率、設定接收器參數、 及其他系統調整值。若一系統架設事件發生時,方法?7〇〇 進行至步驟2730以架設該系統。為用以說明,步驟273〇 包含讓使用者得以視見及調整的反射影像、與各別訊號 第75頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)"""" ------------- (請先閲讀背面之注意事項再填寫本頁) *π· ·# 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明() 圖案之靜態資料,因而提供于該使用者有意義之回饋資 料以調整接收器616之對位特徵。此外,在步驟2730 中進行接收器取樣速率之設定。一實施例中,步驟273 0 包含讓使用者單獨校正及調整傳送單元以使基材達成一 所預獲得之照度。 步驟273 5中,方法2700決定該事件是否為用於粒 子偵檢或製程監視的事件。若該事件不是用於粒子偵檢 或製程監視的事件時,則方法2 7 0 0進行至步驟2 7 4 5。 若該事件係用於粒子偵檢,則方法2700進行至步驟2740 以偵測基材上的污染物。本發明一用以粒子偵檢/製程 監視之方法實施例於下文中配合第2 8圖加以說明。 步驟2745中,方法2700查詢該事件是否為一終止 事件’如一使用者關閉正在進行的應用。若該事件是一 終止事件時,則方法2700跳離而到達步驟275 5。否則, 方法2700於步驟 2750處理該事件且隨後返回至步驟 2 7 1 2以取得下一個事件。 第2 8圖所示為一用於粒子偵檢及製程監視的方法 2800流程圖。方法2800從步驟2740進入步驟2805。 步驟28 10中,操作PMC 86以偵測產出之基材。一用 以偵測一基材之方法於下文中配合第1 4圖說說明之。 步驟2 8 1 5中,掃瞄該基材或照明該基材並儲存產生之 訊號圖案。掃瞄/照明該基材之實施例說明已於前述說 明之。 步驟2820中,方法2800基於在步驟28丨5所收集 第76頁 (請先閲讀背vg之注意事項再填寫本頁) 裝 訂· 聲 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533526 經濟部智慧財產局員工消費合作社印製 五、發明說明() 之資料產生一像素強度的長條圖(也參考此處現存之長 條圖)。此外,計算出該基材之一平均強度值。 方法2 8 0 0依據所預執行的處理隨後沿著二邏輯路 進行處理。在粒子偵檢之實施例中,方法2 8 0 0經由 邏輯路徑處理2822而到達步騾2825;在製程檢視之實 知例中,方法2 8 0 0經由邏輯路徑2 8 2 4處理而到達步驟 28 50 〇 若方法2800經由路徑2822進行處理,於步驟2825 將資料二位元化。二位元化處理為一灰階基材影像之二 ^元表示方式,該灰階基材影像以一數值範圍為0-255 的像素陣列值表示之,其中該數值為〇則表示該基材影 像為黑色而該數值為2 5 5則表示該基材影像為白色。經 由選取一強度界限將一灰階影像施以二位元化,在該強 度界限以下的任一灰階影像數值則表示黑色,而在該強 度界限以上的任一灰階影像數值則代表白色。其中,該 界限主要係依據某一應用而決定。 再者,於步驟2825時,藉由過濾雜訊及其他不相 關的訊號資料之操作方式能處理及增強所擷取的影像。 雜訊的產生可能為由於基材變形及震動(例如:基材不 完全平坦或不隨時保持靜止)而不慎產生散射/反射訊號 之變異(如:功率變動)所造成。另外,處理室環境的變 化及污染物(例如:處理室中浮動的粒子、窗口的光學 特性退化、處理室内部的熱流、及此類因素)也會隨時 間產生變動,因而產生雜訊。再者,傳送單元56及接 第77頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) f請先閲讀背面之注意事項再填寫本頁) 裝. -一贫 # 533526 A7 B7 五、發明説明() 收單元58二者也會產生電子雜訊(如:電性雜訊、白光 雜訊、粉紅雜訊及此類因素)。 過濾訊號雜訊為眾所皆知的方法,端視所欲過濾之 雜訊類型而定。其中,一些過濾訊號雜訊的方法包含使 用數位訊號處理(DSP)、電性過濾器(例如:低通、高通、 及此類過濾器)、訊號取樣、訊號平均化及此類技術將 以過濾到接收到的訊號。 影像增強處理係藉由能增強影像對比及顏色的習知 光譜選取演算法、或使用光譜過濾器以阻擋不想得到的 光譜而達成。另外,影像增強處理也能經由熟習此項技 藝者所熟知的D S P或其他數位加強技術以達成。 在步驟23 80時,方法2800依據照明強度及尺寸搜 尋基材影向上的粒子。使用 Blob分析以像素強度及接 近值為一手段而界定出基材上一區域内的粒子尺寸及位 置。步驟2825及2830 —起進行Blob分析。 經濟部智慧財產局員工消,費合作社印製 該Blob分析產生之結果隨後於步驟283 5進行分 析。此外,基材狀態係於步驟2 83 5中提供。一實施例 中,基材狀態包含一通過檢驗狀態、一警告狀態、及失 效狀態。使用者經由諸語音或視訊號而被知會該基材狀 態。藉由分析長條圖數據及粒子數據,方法2800進行 至步驟 2840以產生一包含一基材輸出影像、一長條圖 數據報告、及對終端使用者偵測而得總結資料的報告。 而後,由步驟2845離開該方法而返回至方法2700。 回至步驟2820,若選擇經由邏輯路徑2824進行處 第78頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 533526 五、發明説明()Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of Invention () to PMC 86. Continue to compare the average readings of any 0IS ho measurements to determine the correction factor required to normalize the system. The substrate is then removed, and the solid portion of the robot carrier disk (ie, including voids and edge portions) is scanned in a similar manner ^, and then the peak value and average intensity value are compared with the normalization correction factor The comparison is performed to determine the appropriate correction factor for the load plate during the concealment process. When the carrier correction factor is an appropriate value, the carrier can be used as a remaining calibration reference. Therefore, OIS 150 (connected to PMC 86) can monitor the vacant carrier tray under normal operation to determine whether the receiver and transmitter are functioning properly. If the receiver and transmitter are contaminated or degraded, perform the background test described above. Furthermore, the flatness and consistency of the carrier can be monitored and confirmed. H. Contamination of the carrier disk In addition, the contamination on the surface of the carrier disk can also be detected through the test of the above embodiment. The presence of contaminants on the carrier tray indicates that some areas of the back of the substrate were scratched while handling the substrate and / or residual process by-products collected on the substrate. Therefore, if contaminants are detected on the carrier disk, the system is interrupted for inspection to avoid further pollution of the process environment. I. Robot Calibration In another embodiment, Oils 1 50 facilitates robot calibration. Robots in the process system (such as the robot in the transfer processing room Π 3) need to be periodically calibrated to ensure normal orientation and alignment. Because OIS 150 is located on the 66th page of a manufacturing system, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ......... ^^ ..... •: Order ......... # (Please read the notes on the back before writing this page) 533526 A7 B7 V. Description of the invention () A fixed place above the system, the OIS The 150 can provide a reference point for PMC 86 transfer process chamber robot calibration. Once the normalization factor of the carrier disk is determined (as described above), the robot position is changed to detect the characteristics of the carrier disk. Velocity and vibration energy are monitored as monitoring / adjusting proportional terms, which are integral and derivative (pIM) values of the motion control system. A sufficient difference between the detected position and the calibrated position stored by the PMC 86 indicates that the carrier is misaligned. This misalignment was automatically corrected. J. Robot Behavior The present invention can also be used to monitor robot behavior. For example, when the robot rotates and passes the optical path 61 (shown in Fig. 6) of the receiver device 58, the edge of the tray closest to the center of rotation will enter the optical path first. This edge then continuously enters the field of view (FOVs) of any of the detector elements at a rate that is determined by the speed of the carrier disk. This method enables OOIS 150 to independently monitor the characteristic behavior of a robot, such as the settlement time, acceleration, and stability that can be measured / monitored. The collected data can set the PID parameters of the robot 113 manually or automatically. Detailed descriptions of other possible applications are not provided here. For example, the present invention can also be used to detect the presence of a substrate on a robotic tray and whether the substrate is held in a sweet manner by a tray to stabilize the substrate during the movement of the tray. Those skilled in the art will recognize that other applications can be implemented with the present invention. Page 67 This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back before filling out this page). · Packing. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. 533526 Economy Printed by the Consumers ’Cooperative of the Ministry of Intellectual Property Bureau A7 B7 V. Description of the Invention () Therefore, the present invention is beneficial to use different components of a typical processing tool to achieve multifunctional integration. Effectively setting one or more OIS units 50 (for example, in a transfer processing center) can perform multi-process management functions. In summary, the present invention provides a multi-purpose device that achieves a fairly high-level system integration and reduces the operating cost of the system. K. First wafer influence A common situation in semiconductor manufacturing is the well-known “First wafer influence”. The first wafer (ie, the substrate) affects the damage to the cleanliness of the processing room when the substrate is buried. The processing chamber must be cleaned periodically to remove residual material that accumulates on the surface of the internal processing chamber over time. However, it was found that the processing results of the previously cleaned substrate were different from those of the subsequent clean substrates. Specifically, the first N substrates obtained after a cleaning cycle show different characteristics from those of the subsequent processed substrates. In summary, the cleanliness of a processing chamber is affected by an aging treatment. The aging treatment is used to bring the processing chamber to an equilibrium state, and then the substrate can be uniformly processed under this equilibrium state. The aging treatment involves operating the processing chamber under process conditions (or improved processing conditions to accelerate the desired results), and coating the surface of the processing chamber with a material. Furthermore, one of the problems in aging treatment is when to decide when the processing chamber is sufficiently aged. An embodiment of the present invention takes into consideration the detection of an end point of the aging process. Specifically, during the aging process in the processing chamber, the substrate is processed in a clean processing chamber. Then, any substrate is inspected with one or more OIS-50. Once the treated substrate shows predetermined characteristics, page 68 of this paper applies Chinese National Standard (CNS) A4 (21〇χ 297 mm), ----------- ^ --- ---- I ^ (谙 Please read the notes on the back before filling this page) 533526 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention () You can know that the processing room is fully aged. L. Output monitoring In another embodiment, 'monitoring of output. Throughput can be monitored by deciding when a known substrate enters the process system and when it leaves the process system (or completes a processing stage in the system). In addition, it is also possible to observe and record the time that the substrate stays in the cooling treatment chamber. Multi-substrate data collected using this method is then used to determine peak output, average output *, frequency of arrival, frequency variability, and other relevant information. M. Process Monitoring Normalization In one embodiment, process differences are normalized. The process system 100 may include several 0IS 150s, each of which monitors a different processing area. Each OIS 150 provides a variable process baseline reading when processing the substrate. After a period of time, a sufficient amount of variation in the value of any 〇IS 丨 50 results in a false process degradation reading and a warning. In order to minimize the number of false alarms, a normalized substrate is sent to the process system and measured by any 0IS 1 50. With this normalized substrate, any OIS 150 differences can be normalized. In one embodiment, a reference wafer is used to calibrate other process systems. For the sake of example, based on a reference substrate value, the same substrate value, or a similar substrate value, the process system 100 can have other known values expected to be obtained by the same process system. Page 69 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) —— '· :::' -...-.........: Order ... · # (Please read the precautions on the back before filling this page) 533526 V. Description of the invention (The data processing system for the printed data processing system of the Employee Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is read by PMC 86 to determine which one should be used. Work. Xi rush 4 execute μ formula is one of PMC 86 software that can be read and the scoop does not produce substrate position data, substrate reflectance information, reflection and dagger information, substrate defect information, substrate damage data, use Yu Pingshui 2 — Graphical information on particle contamination of substrates, used for robotic trays:: Contaminant data, feature data consisting of letters and numbers::, robot behavior data, used for robotics and detection The calibration data of the device and the code of any combination of the above materials are preferred. In a consistent embodiment, the present invention executes a computer program to control _ 86. This program defines the functions stated in this embodiment here, and The program is provided to a computer via each of the media containing the signal. The media containing the signal contains at least (not limited to the following applications): ⑴ fixed on non-writeable storage media (for example: a read-only memory device in a computer, CD-ROM or DVD_ROM device can read Read-only cd_r0m disk); (U) rewritable data stored in m-type media (floppy disk in hard disk drive); or (iii) transmitted to a Data in a computer, for example, via a computer or telecommunications network that includes no communication. In another embodiment of the present invention, the above-mentioned signal-containing medium is used to transmit computer-readable instructions that lead the functions of the present invention. It can also be noted What is more, the present invention, which can develop part of the program and implement it separately, also includes an embodiment combining the above part of the program. Figure 26 shows a high-order structure for a system 2600 configuration. Insert or package ..... M ...... 1-Order ......... f Please read the precautions on the back before writing this page) 533526 A 7 B7 Ministry of Economy Wisdom Printed by the Consumers' Cooperative of the Property Bureau V. Description of the Invention () The examples show that this structure is used To perform particle detection and other process monitoring methods. Although the present invention separately describes the system 2600 and the PMC 86 herein, the system 2600 may be an embodiment of the PMC 86 or may be integrated with the PMC 86. The system 2600 generally includes an application layer 2602, a driver layer 2604, a hardware interface layer 2606, an internal hardware layer 2608, an external hardware layer 2610, and a factory interface layer 2612. Each layer of the system 2600 may contain any combination of hardware and software suitable for supporting a particular function. Generally speaking, the application layer 2602, the driver layer 2604, the hardware interface layer 2606, and the internal hardware layer 2608 are the constituent elements of the optical inspection system (OIS) 150 in the above description. The external hardware layer 2610 is used to represent any system that has been implemented in ISO 150. For example, the external hardware layer 2610 may be the clustering tool described above (please refer to Figure 2 for the factory interface layer 2612 for representing the operation points between the peripheral device, 0is 150, and the external hardware layer 2610. In one embodiment, the factory interface layer 2612 includes a host and a data collection server. The application layer 2602 includes at least a graphical user interface (GUI) 2620, a server process 2622, a particle detection process 2624, and a process monitor Process 2626 and a database 2628. GUI 2620 is a working configuration of a user and server processing interface. In some embodiments, GUI 2620 includes at least a dialog box for data transmitted or requested by the user (shown in A monitor). In particular, GUI 2 622 is used to generate a local request in response to a command issued by the user. The command can be input from any input device (eg, a keyboard, keypad, light pen, page 71 ( (Please read the precautions on the back before writing this page.) Binding · Order · # This paper size applies to China National Standard (CNS) A4 (210X297 mm) 533526 A7 B7 Intellectual Property of the Ministry of Economic Affairs Printed by the employee consumer cooperative V. Description of the invention () Touch screen, trackball, speech recognition device, voice / audio player, and such devices) for input. Part of the request generated by GUI 2 620 is sent to the server The processing is handled as processing. In addition, the server processing 2622 can also receive the request from the remote client by the request received by the local client (for example: GUI 2622). In Figure 26, the selected client is externally hardened. The body layer 2 6 10 and the external interface layer 2612 indicate this. In response to various client requests, the server process 2622 takes steps to generate a response or process the request. For example, a user's command from 2 620 may cause feeding The server process 2622 calls the particle detection process 2624 and the process monitoring process 2626. The two processes are described in more detail below. In addition, the server process 2622 is responsible for the pain in other layers of the system 2 600. The server process 2622 is more It is suitable for the initialization of line system 2600. The initialization process may include reading a configuration file, and the configuration building contains data for configuring the system 600. The configuration file Stored in the database 2628. Therefore, the operation server processes 2622 as a central data management entity for the application layer 2602. In general, the particle detection process 2624 supports particle inspection of the substrate image and generates reports. To achieve this For this purpose, the particle detection process 2 6 2 4 executes one or more particle detection algorithms. For example, the above algorithms include "Blob's" analysis algorithms and "pixel" analysis algorithms. Via remote processing 2 6 2 4 The viewer can be a flat (unpatterned) or patterned substrate. Process monitoring process 2626 Performs one or more process monitoring processes. Page 72 This paper size applies Chinese National Standard (CNS) A4 specifications (210 parent 297 male cage) (Please read the precautions on the back before filling this page). -· # 533526 A7 B7 V. Explanation of the invention () Algorithm, such as average intensity analysis. Generally speaking, the process monitoring process 2 6 2 6 has a long bar view and generates comparison icons. Embodiments of the particle detection process 2624 and the process monitoring process 2626 are described below with reference to FIGS. 27-28. The application layer 2602 communicates with other layers of the system 2600 through one of a variety of interfaces. The application layer 2602 for explanation includes a semiconductor device communication standard (SECS) interface 2630, a reporter interface 2632, a camera interface 2634, and a light source interface 2636. The SECS interface 2630 reorganizes the data between the server processing 2622 and the remote client and circulates the data. The remote client is represented by an external hardware layer 2610 and an external interface layer 2612. The reporter interface 2632 is an interface task responsible for generating a report each time a substrate is viewed, and then storing the report in a local or remote disk storage device. In one embodiment, the magnetic disk storage device is a part of the industrial waste interface layer 2612. The camera interface 2 6 3 4 is an interface that is organized to support the receiving unit (and other detection devices, such as substrate sensors) described above, and the camera interface 2634 is represented by an internal hardware layer 2608. In general, the camera interface 2634 enhances the accuracy of the substrate image, performs process monitoring, and sets the receiving unit. The steps of setting the receiving unit include downloading the receiver settings, focusing the receiver, and adjusting the position (orientation) of the receiver. In addition, the camera interface 2 6 3 4 initially generates a request for the generated report (by the reporter interface 2632). During the operation, the camera interface 2634 receives the transmission from the server processing 2622. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) 、 1 '# Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by 533526 A7 B7 ----- 5. Description of the invention () Instructions for receiving unit operations. The command is then transmitted to the internal hardware layer 2608 via the driver interface 2604 and the hardware interface layer 2606. Then, the command responded by the driver layer 2604 is received by the camera interface 2634 and transmitted to the server for processing 2622. 〆In the embodiment, the driver layer 2604 includes at least a driver for an international instrument image driver (NIIMAQ) and a hardware interface layer 2606. The hardware interface layer 2606 includes at least an RS232 interface and a frame receiver interface card with a TTL transmission port. Grabber Card), each driver layer 2604 is used to support the information that is detoured between the camera interface 2634 of any internal hardware layer 2608. The light source interface 2 6 3 4 is an interface that is organized to support the above-mentioned description transmission unit το, and the light source interface 2634 is shown by an internal hard layer 2608. Generally speaking, the functions of the light source interface 2634 include determining the existing light intensity and adjusting the light intensity. During operation, the data received by the server processing 2 622 is transmitted to a driver in the driver layer 2604 through the light source interface 2634, and then to the card in the hardware interface layer 2606. In the known example, the driver is an Omega ADLIB driver, and the card is a DI / DO card. The internal hardware layer gj ^ # detours to the light source interface in a reverse manner. Although the above description is a single system, the composition of the application layer 2602 is dispersed in a network environment. For example, G u I 620 can be located on a network workstation at the remote end of a computer server, which is used to perform server processing 2622. Particle detector applications and process monitoring applications. Figure 2 7 shows the use of the system 2 600, for process monitoring and granulation. Page 74 This paper is sized for China National Standard (CNS) A4 (210X297 mm) ---------- -^ ......- 一 丨 — ^ Γ ......... (Please read the notes on the back before filling this page) 533526 A7 B7 V. Description of the invention () Sub-investigation, inspection A flowchart of a method 2700 for a control program. For the sake of brevity, process monitoring will be described using reflection analysis only. However, those skilled in the art will recognize other process monitoring embodiments of the present invention that include spectral analysis. When the system 2600 is started, the method 2700 proceeds to step 2705. At step 27, the system 2600 is initialized and ready to receive events entered by the program. At step 2712. The system 2700 receives an event. When proceeding to step 27 1 5, the method decides whether or not to generate a system configuration. System configuration events include storage of organization data, creating defect maps, setting alerts, limiting the number of defects, and other program settings. If a system configuration event has not occurred, method 2700 proceeds to step 2725 in the description below; if a system configuration event has occurred, method 2700 proceeds to step 2720 to obtain and set the system configuration. In step 2720, the behavior of the program can be adjusted, the execution time can be set to track the operation of the program, and other system configurations can be set via the system parameters contained in one or more data structures. In one embodiment, the data structure includes the system configuration that may be stored in a database 2626 (shown in Figure 26). In step 2725, method 2700 determines whether a system setup event has occurred. If a system erection event has not occurred, method 2700 proceeds to step 2735. The system setup events include receiver calibration (such as alignment and focus), setting the receiver sampling rate, setting receiver parameters, and other system adjustments. If a system erection event occurs, how? 70. Proceed to step 2730 to set up the system. For illustration, step 2730 includes the reflected image that can be viewed and adjusted by the user, and the respective signals on page 75. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) " " " " ------------- (Please read the notes on the back before filling out this page) * π · · # Printed by the Ministry of Economic Affairs, Intellectual Property Bureau, Employee Consumer Cooperative, 533526 A7 B7 Printed by the Consumer Cooperative of the Property Bureau staff. 5. The static information of the pattern (), so it provides meaningful feedback to the user to adjust the alignment characteristics of the receiver 616. In addition, the receiver sampling rate is set in step 2730. In one embodiment, step 2730 includes allowing the user to individually calibrate and adjust the transfer unit so that the substrate achieves a pre-obtained illuminance. In step 2735, the method 2700 determines whether the event is an event for particle detection or process monitoring. If the event is not an event for particle detection or process monitoring, the method 270 proceeds to step 2 7 4 5. If the event is for particle detection, method 2700 proceeds to step 2740 to detect contaminants on the substrate. An embodiment of the method for particle detection / process monitoring of the present invention is described below with reference to FIG. 28. In step 2745, the method 2700 queries whether the event is a termination event ', such as when a user closes an ongoing application. If the event is a termination event, the method 2700 jumps to step 275 5. Otherwise, the method 2700 processes the event at step 2750 and then returns to step 2 7 12 to obtain the next event. Figure 28 shows a flowchart of a method 2800 for particle detection and process monitoring. The method 2800 proceeds from step 2740 to step 2805. In steps 28 and 10, the PMC 86 is operated to detect the produced substrate. A method for detecting a substrate is described below with reference to FIG. 14. In step 2 8 1 5, scan the substrate or illuminate the substrate and store the generated signal pattern. Examples of scanning / illuminating the substrate have been described previously. In step 2820, method 2800 is based on page 76 collected in step 28 丨 5 (please read the precautions on the back of the vg before filling this page). Binding and sound This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ) 533526 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The information of the invention description () generates a bar graph of pixel intensity (also refer to the existing bar graph here). In addition, one average strength value of the substrate was calculated. Method 2 8 0 follows the pre-executed processing and then proceeds along two logical paths. In the embodiment of particle detection, method 2 8 0 0 arrives at step 2825 through logical path processing 2822; in the practical example of process inspection, method 2 8 0 0 arrives at step through logical path 2 8 2 4 processing 28 50 〇 If method 2800 is processed via path 2822, the data is binarized at step 2825. The binary processing is a two-dimensional representation of a gray-scale substrate image. The gray-scale substrate image is represented by a pixel array value ranging from 0 to 255, where the value of 0 indicates the substrate. The image is black and the value of 2 5 5 indicates that the substrate image is white. By selecting an intensity boundary to binarize a grayscale image, any grayscale image value below the intensity boundary represents black, and any grayscale image value above the intensity boundary represents white. Among them, the limit is mainly determined according to an application. Furthermore, at step 2825, the captured image can be processed and enhanced by filtering noise and other irrelevant signal data. Noise may be caused by substrate distortion and vibration (for example, the substrate is not completely flat or does not remain stationary at all times), and the scattering / reflection signal variations (such as power changes) are inadvertently generated. In addition, changes in the environment of the processing chamber and pollutants (such as floating particles in the processing chamber, degradation of the optical characteristics of the window, heat flow inside the processing chamber, and such factors) can also change over time, resulting in noise. Furthermore, the paper size of the transmission unit 56 and page 77 is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). F Please read the precautions on the back before filling this page.) Pack.-一 poor # 533526 A7 B7 5. Description of the invention () The receiving unit 58 also generates electronic noise (such as electrical noise, white light noise, pink noise, and such factors). Filtering signal noise is a well-known method, depending on the type of noise you want to filter. Among them, some methods of filtering signal noise include the use of digital signal processing (DSP), electrical filters (such as low-pass, high-pass, and such filters), signal sampling, signal averaging, and such technologies will filter To the received signal. Image enhancement is achieved through a conventional spectrum selection algorithm that enhances image contrast and color, or uses spectral filters to block unwanted spectra. In addition, image enhancement processing can also be achieved through DS or other digital enhancement techniques familiar to those skilled in the art. At steps 23 to 80, method 2800 searches for particles in the shadow direction of the substrate based on the intensity and size of the illumination. Blob analysis is used to define the size and location of particles in a region on a substrate by using pixel intensity and proximity values as a means. Steps 2825 and 2830 start Blob analysis. The staff of the Intellectual Property Bureau of the Ministry of Economic Affairs eliminated the cost and printed it with the cooperative. The result of the Blob analysis was then analyzed at step 2835. In addition, the state of the substrate is provided in step 2 83 5. In one embodiment, the substrate state includes a pass inspection state, a warning state, and a failure state. The user is informed of the state of the substrate through voice or video signals. By analyzing the bar graph data and particle data, the method 2800 proceeds to step 2840 to generate a report including a substrate output image, a bar graph data report, and a summary data report obtained by detecting end users. Thereafter, the method is exited from step 2845 to return to method 2700. Return to step 2820, if you choose to go through the logical path 2824, page 78 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 533526 5. Description of the invention ()
理,則方法2800會繼墙、佳一 s H 續進仃至步驟28 5〇。在步驟Μα 時,將步驟2820所產味的招六p 驟2850 ^水本 的見存長條圖數據繪製成關係 圖。於步驟2852時’縣兮洽制山λα ε 你 將涊、·會製出的長條圖與— 條::行比對,緣製比對的結果用以表示現存長… Η參考長條圖間的差異。步驟加4中,方法2_徐製 出比對㈣參考長條圖而產生的該現存長條圖之—平均 強度趨勢。一圖表範例參考上述說明的第20圖而繪製 出此種趨勢。而後,分析步驟2852及2854以決定在步 驟2 8 5 6巾的眾基材狀態…實施例巾,該基材狀態包 含一通過檢驗狀態、一警告狀態、及失效狀態。步驟28〇〇 隨後進行至步騾2840以產生一終端使用者能視見的報 告。其中,該報告可包含一基材輸出影像、一長條圖數 據報告、及偵測總結資料。 經濟部智慧財產局員工消費合作社印製 一實施例中,藉由發生用以表示一具缺陷之基材的 預定事件,將一警告傳送至使用者。基於多數超過使用 者定義之臨界強度的事件,使用者得以被允許界定警告 細節。因此,該偵測警告界限能移動至更接近於一圖案 化基材所建立的該雜訊等級。合計超過該界限之強度事 件與一使用者定義的數量界限進行比對。若該合計事件 超過該數量界限,則傳送一警告。舉例而言,影像各處 所累積的該強度界限等級可設定為3 5 00次(+ /-50次), 藉由一受污染的基材並獲得3 5 5 5次強度事件’而超過 該3 5 00次的該5次事件會發生警告情事。因此’當超 過該數量界限的事件次數增加時,警告次數也會隨之增 第79頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 經濟部智慧財產局員工消費合作社印製 533526 A7 B7 五、發明説明() 加。此代表一第二取向品質分數且能用以建立信心區 間。 在另一實施例中,執行一用以定義該警示及警告界 限之自動模式。該自動模式使用如同一或多個參考基材 之平均強度或強度之標準差的靜態值。而後,該警示界 限能藉由使用者或預定之首要資料為基礎的該等標準差 而決定出。平坦晶圓之標準差較小於經圖案化晶圓者, 因此偵測界限會更接近於該平均值。一自動化方法因而 能避免任何由使用者主觀上設定該警示或警告界限所產 生的不被希望發生的影響。 上文中係依據本發明之較佳實施例加以說明,其他 或更多實施例並不脫離本發明的基本範圍之外,本發明 範圍當以後述之專利申請範圍為基準。 第80頁 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公漦) (請先閲讀背面之注意事項再填寫本頁)Method, the method 2800 will continue to step 28 50 following the wall and Jiayi s H. In step Mα, draw the bar graph data of Zhaoliu p, step 2850 ^ water, produced in step 2820, into a relationship diagram. At step 2852, 'County Xi Qiazhi Mountain λα ε You will make a bar graph with 涊, · and — bar :: line comparison, the result of marginal comparison is used to represent the existing length ... Η Reference bar Difference. In step plus 4, method 2_xu makes out the existing bar graph-averaged intensity trend generated by comparing the reference bar graph. A chart example plots this trend with reference to Figure 20 described above. Then, the steps 2852 and 2854 are analyzed to determine the state of the multiple substrates in the step 2 586 ... the embodiment of the substrate. The state of the substrate includes a pass state, a warning state, and a failure state. Step 2800 then proceeds to step 2840 to generate a report viewable by the end user. The report may include a substrate output image, a bar graph data report, and detection summary data. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In one embodiment, a warning is transmitted to a user by a predetermined event occurring to indicate a defective substrate. Based on the majority of events exceeding the critical intensity defined by the user, the user is allowed to define warning details. Therefore, the detection warning limit can be moved closer to the noise level established by a patterned substrate. Intensity events that exceed this limit are compared with a user-defined quantity limit. If the total event exceeds the number limit, a warning is transmitted. For example, the intensity limit level accumulated throughout the image can be set to 3,500 times (+/- 50 times), exceeding 3 by using a contaminated substrate and obtaining 3,55,5 intensity events'. Warning events will occur at these 5 events of 5,000 times. Therefore, 'when the number of events exceeding this number limit increases, the number of warnings will also increase. Page 79 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economy 533526 A7 B7 V. Description of the invention () Plus. This represents a second orientation quality score and can be used to build confidence zones. In another embodiment, an automatic mode is implemented to define the warning and warning limits. This automatic mode uses static values such as the average intensity or standard deviation of the intensity of the same or more reference substrates. The warning limit can then be determined by these standard deviations based on the user or predetermined primary data. The standard deviation of a flat wafer is smaller than that of a patterned wafer, so the detection limit will be closer to the average. An automated method thus avoids any undesired effects caused by the subjective setting of the warning or warning limit by the user. The foregoing description is based on the preferred embodiments of the present invention. Other or more embodiments do not depart from the basic scope of the present invention. The scope of the present invention is based on the scope of the patent application described later. Page 80 This paper size is in accordance with China National Standard (CNS) A4 (210X297 cm) (Please read the precautions on the back before filling this page)
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JP5002367B2 (en) * | 2007-08-10 | 2012-08-15 | 浜松ホトニクス株式会社 | Optical inspection device, pinhole inspection device, film thickness inspection device, and surface inspection device |
WO2021076320A1 (en) | 2019-10-15 | 2021-04-22 | Tokyo Electron Limited | Systems and methods for monitoring one or more characteristics of a substrate |
CN114616657A (en) | 2019-11-04 | 2022-06-10 | 东京毅力科创株式会社 | System and method for calibrating a plurality of Wafer Inspection System (WIS) modules |
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TWI799385B (en) * | 2016-08-03 | 2023-04-21 | 美商蘭姆研究公司 | Methods and systems for monitoring plasma processing systems and advanced process and tool control |
TWI757907B (en) * | 2020-10-07 | 2022-03-11 | 財團法人國家實驗研究院 | A cluster real-time online process and analysis transmission system in a vacuum environment |
TWI829121B (en) * | 2021-03-24 | 2024-01-11 | 日商斯庫林集團股份有限公司 | Substrate processing apparatus, analysis method, display device, and program |
Also Published As
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WO2002029390A2 (en) | 2002-04-11 |
JP2004529485A (en) | 2004-09-24 |
KR100871495B1 (en) | 2008-12-05 |
WO2002029390A3 (en) | 2003-04-17 |
KR20040012667A (en) | 2004-02-11 |
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