TWI757907B - A cluster real-time online process and analysis transmission system in a vacuum environment - Google Patents
A cluster real-time online process and analysis transmission system in a vacuum environment Download PDFInfo
- Publication number
- TWI757907B TWI757907B TW109134746A TW109134746A TWI757907B TW I757907 B TWI757907 B TW I757907B TW 109134746 A TW109134746 A TW 109134746A TW 109134746 A TW109134746 A TW 109134746A TW I757907 B TWI757907 B TW I757907B
- Authority
- TW
- Taiwan
- Prior art keywords
- vacuum
- sample
- chambers
- analysis
- real
- Prior art date
Links
Images
Landscapes
- Chemical Vapour Deposition (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
一種在真空環境中叢集式即時線上製程暨分析傳輸系統,包括叢集式真空設備,具有各式子真空腔體且包含數個製程處理室、樣品準備室與樣品分析室;以及機械傳輸模組,設有能夠轉移樣品之基材轉移機械臂與處理室,各式子真空腔體係圍繞在該機械傳輸模組的周圍,其中部分製程處理室與該樣品分析室配設有即時量測的光學組件,可以使樣品藉由該基材轉移機械臂轉移而導入該等各別製程處理室中之晶圓的待命狀態來實行對準,俾透過該機械傳輸模組可於單一真空環境取放該樣品至各式子真空腔體進行PVD、CVD、電漿表面處理與即時分析之工作,同時可於部分子真空腔體中進行材料特性即時檢測,令材料表面處理、元件鍍膜製程與檢測分析在單一真空環境內完成,可降低樣品在多段製程中被汙染的機率,且可進行即時檢測,從而有效提高良率與降低成本。A cluster type real-time online process and analysis transmission system in a vacuum environment, comprising cluster type vacuum equipment, having various sub-vacuum chambers and including several process processing chambers, sample preparation chambers and sample analysis chambers; and a mechanical transmission module, There is a substrate transfer robot arm and a processing chamber capable of transferring samples. Various sub-vacuum chamber systems surround the mechanical transfer module. Some of the process processing chambers and the sample analysis chamber are equipped with optical components for real-time measurement. , the sample can be transferred by the substrate transfer robot and introduced into the standby state of the wafers in the respective process chambers for alignment, so that the sample can be picked up and placed in a single vacuum environment through the mechanical transfer module It can perform PVD, CVD, plasma surface treatment and real-time analysis in various sub-vacuum chambers. At the same time, it can perform real-time inspection of material properties in some sub-vacuum chambers, so that material surface treatment, component coating process and inspection and analysis can be performed in a single Completed in a vacuum environment, it can reduce the probability of sample contamination in multi-stage processes, and can perform real-time detection, thereby effectively improving yield and reducing costs.
Description
本發明係有關於一種在真空環境中叢集式即時線上製程暨分析 傳輸系統,尤指涉及一種用於製造半導體裝置之叢集式真空設備之機械傳輸模組於真空中進行樣品轉移與即時分析,特別係指在真空中採單一式低汙染製程與分析者。 The present invention relates to a cluster real-time online manufacturing process and analysis in a vacuum environment The transfer system, especially refers to a mechanical transfer module of a cluster vacuum equipment used for manufacturing semiconductor devices to perform sample transfer and real-time analysis in vacuum, especially refers to a single low-pollution process and analysis in vacuum.
現階段材料製程為了進行多段式製程時,常採用單一製程腔體, 因此在轉移時常使樣品曝露於大氣中,然而此舉易使樣品表面產生氧化或雜質吸附而生成氧化層,特別在先進製程中,這將會使得元件產生漏電流變大,從而降低晶片效能。故,一般習用者係無法符合使用者於實際使用時之所需。 In order to carry out a multi-stage process in the current material process, a single process cavity is often used. Therefore, the sample is often exposed to the atmosphere during transfer. However, it is easy to cause oxidation or impurity adsorption on the surface of the sample to form an oxide layer. Especially in advanced manufacturing processes, this will increase the leakage current of the device, thereby reducing the chip performance. Therefore, ordinary users cannot meet the needs of users in actual use.
本發明之主要目的係在於,克服習知技藝所遭遇之上述問題並提 供一種叢集式真空設備在單一真空環境中以機械傳輸模組將樣品基材轉移至各製程的子真空腔體進行材料表面處理、元件鍍膜製程與檢測分析,可降低樣品在多段製程中被汙染的機率,且可進行即時檢測,從而有效提高良率與降低成本之一種在真空環境中叢集式即時線上製程暨分析傳輸系統。 The main purpose of the present invention is to overcome the above-mentioned problems encountered in the prior art and to improve For a cluster vacuum equipment to transfer the sample substrate to the sub-vacuum chambers of each process in a single vacuum environment for material surface treatment, component coating process and detection analysis, it can reduce the contamination of the sample in the multi-stage process It is one of the cluster real-time online process and analysis transmission systems in a vacuum environment that can effectively improve yield and reduce costs.
為達以上之目的,本發明係一種在真空環境中叢集式即時線上製 程暨分析傳輸系統,係包括:一叢集式真空設備,係具有各式子真空腔體,包含數個製程處理室、一樣品準備室、與一樣品分析室,其中數個製程處理室分別為電漿表面處理室、真空PVD製程處理室、及CVD製程處理與即時分析室;以及一機械傳輸模組,係設有一能夠轉移樣品之基材轉移機械臂與一處理室,各式子真空腔體係圍繞在該機械傳輸模組的周圍,其中部分製程處理室與該樣品分析室配設有即時量測的光學組件,可以使樣品藉由該基材轉移機械臂轉移而導入該等各別製程處理室中之晶圓的待命狀態來實行對準,俾透過該機械傳輸模組可於單一真空環境取放該樣品至各式子真空腔體進行PVD、CVD、電漿表面處理與即時分析之工作,同時可於部分子真空腔體中進行材料特性即時檢測,令材料表面處理、元件鍍膜製程與檢測分析在單一真空環境內完成。 In order to achieve the above purpose, the present invention is a cluster type real-time online manufacturing in a vacuum environment. The process and analysis transmission system includes: a cluster vacuum equipment with various sub-vacuum chambers, including several process chambers, a sample preparation chamber, and a sample analysis chamber, wherein the several process chambers are respectively Plasma surface treatment chamber, vacuum PVD process chamber, and CVD process treatment and real-time analysis chamber; and a mechanical transfer module, which is provided with a substrate transfer robot arm capable of transferring samples and a processing chamber, various sub-vacuum chambers The system surrounds the mechanical transfer module, and some of the process chambers and the sample analysis chamber are equipped with optical components for real-time measurement, so that samples can be transferred to the respective processes by the substrate transfer robotic arm. The stand-by state of the wafer in the processing chamber is used to perform alignment, so that the sample can be picked up and placed in a single vacuum environment through the mechanical transfer module to various sub-vacuum chambers for PVD, CVD, plasma surface treatment and real-time analysis. At the same time, it can perform real-time detection of material properties in some sub-vacuum chambers, so that material surface treatment, component coating process and detection and analysis can be completed in a single vacuum environment.
於本發明上述實施例中,該基材轉移機械臂包括一樣品承載座、 一多軸式傳輸桿與一定位偵測器,當該樣品放在該樣品承載座上時,該樣品承載座可藉由該多軸式傳輸桿傳輸至該樣品分析室時,透過該定位偵測器可將該樣品擺放於量測路徑上。 In the above embodiments of the present invention, the substrate transfer robot includes a sample carrier, A multi-axis transfer rod and a positioning detector, when the sample is placed on the sample carrier, the sample carrier can be transferred to the sample analysis chamber by the multi-axis transfer rod, and the positioning detector can pass through the positioning detector. The detector can place the sample on the measurement path.
於本發明上述實施例中,該光學組件包含量測用單波長光源、光 學鏡組、光譜儀與真空製程設備。 In the above-mentioned embodiment of the present invention, the optical component includes a single-wavelength light source for measurement, a light Microscope sets, spectrometers and vacuum process equipment.
請參閱『第1圖』所示,係本發明之叢集式真空設備傳輸裝置示
意圖。如圖所示:本發明係一種在真空環境中叢集式即時線上製程暨分析傳輸
系統100,係包括一叢集式真空設備1以及一機械傳輸模組2所構成。
Please refer to "Figure 1", which is the cluster vacuum equipment transmission device of the present invention.
intention. As shown in the figure: the present invention is a clustered real-time online process and analysis transmission in a vacuum environment
The
上述所提之叢集式真空設備1係具有各式子真空腔體,包含一樣
品準備室11、一樣品分析室12與數個製程處理室,而該數個製程處理室分別為電漿表面處理室13、真空PVD製程處理室14、及CVD製程處理與即時分析室15。
The
該機械傳輸模組2係設有一能夠轉移樣品之基材轉移機械臂
21與一處理室22,各式子真空腔體係圍繞在該機械傳輸模組2的周圍,其中部分製程處理室與該樣品分析室12配設有即時量測的光學組件3,可以使樣品藉由該基材轉移機械臂21轉移而導入該等各別製程處理室中之晶圓的待命狀態來實行對準,俾透過該機械傳輸模組2可於單一真空環境取放該樣品至各式子真空腔體進行PVD、CVD、電漿表面處理與即時分析等工作,同時可於部分子真空腔體中進行材料特性即時檢測,令材料表面處理、元件鍍膜製程與檢測分析在單一真空環境內完成,本發明將有效解決傳統製程中因轉換製程時受到的環境汙染(如氧化或碳吸附等),同時可廣泛應用於光電、半導體等真空相關製程。如是,藉由上述揭露之結構構成一全新之一種在真空環境中叢集式即時線上製程暨分析傳輸系統100。
The
於一具體實施例中,上述基材轉移機械臂21包括一樣品承載
座、一多軸式傳輸桿與一定位偵測器,當該樣品放在該樣品承載座上時,該樣品承載座可藉由該多軸式傳輸桿傳輸至該樣品分析室12時,透過該定位偵測器可將該樣品擺放於量測路徑上。
In an embodiment, the
於一具體實施例中,本發明著重於叢集式二維材料製程設備即時
檢測開發,係透過自行設計光學組件3對二維材料進行即時光譜量測,該光學
組件3包含量測用單波長光源31、光學鏡組32、光譜儀33與真空製程設備34,並結合其他製程的子真空腔體成一叢集式真空設備1,透過即時分析以解決二維材料成長時的不確定性,藉此提高良率降低成本。
In one embodiment, the present invention focuses on clustered 2D material process equipment real-time
The detection and development is based on the real-time spectral measurement of two-dimensional materials through self-designed
本發明為解決因傳輸過程遭遇雜質汙染與快速檢測等問題,透過 在叢集式真空設備中建立一機械傳輸模組,以叢集式真空腔體進行多段性材料製程後,透過該機械傳輸模組於單一真空環境中進行樣品傳輸,可在真空中轉移至分析腔體進行結構與光電特性分析,使材料表面處理、元件鍍膜製程與檢測分析在單一真空環境內完成,此舉可有效讓樣品進行製程與分析時受到環境汙染的機率降低,避免因在大氣環境中的傳輸過程被汙染或形成自然氧化層,如此可獲得低汙染之材料特性與即時回饋製程數據達到先進製程開發之目的。 In order to solve the problems of impurity pollution and rapid detection due to the transmission process, the present invention adopts A mechanical transfer module is established in the cluster vacuum equipment. After the multi-stage material process is performed in the cluster vacuum chamber, the sample is transferred through the mechanical transfer module in a single vacuum environment, and can be transferred to the analysis chamber in vacuum. Carry out structural and optoelectronic characteristic analysis, so that material surface treatment, component coating process and detection analysis can be completed in a single vacuum environment, which can effectively reduce the probability of environmental pollution of samples during process and analysis, and avoid the possibility of environmental pollution in the atmospheric environment. The transmission process is polluted or a natural oxide layer is formed, so that the material properties with low pollution can be obtained and the process data can be fed back in real time to achieve the purpose of advanced process development.
因此,本發明具有如下特色: 1. 本發明係有關於用於製造半導體裝置之叢集式真空設備之機械傳輸模組於真空中進行樣品轉移與即時分析。 2. 本發明概念之叢集式真空設備可由多類型分批腔室形成。具體而言,除裝備前端模組之外的剩餘腔室可在真空狀態下轉移基板,以便阻擋外部污染物。 3. 在真空中採單一式低汙染製程與分析。 4. 可應用於光電半導體先進製程。 Therefore, the present invention has the following characteristics: 1. The present invention relates to sample transfer and real-time analysis in vacuum of a mechanical transfer module of a cluster vacuum apparatus for manufacturing semiconductor devices. 2. The cluster vacuum apparatus of the inventive concept can be formed from multiple types of batch chambers. Specifically, the remaining chambers other than the equipped front-end module can transfer substrates under vacuum in order to block external contaminants. 3. Adopt a single low-pollution process and analysis in vacuum. 4. It can be applied to the advanced process of optoelectronic semiconductor.
綜上所述,本發明係一種在真空環境中叢集式即時線上製程暨分 析傳輸系統,可有效改善習用之種種缺點,叢集式真空設備在單一真空環境中以機械傳輸模組將樣品基材轉移至各製程的子真空腔體進行材料表面處理、元件鍍膜製程與檢測分析,可降低樣品在多段製程中被汙染的機率,且可進行即時檢測,從而有效提高良率與降低成本,進而使本發明之產生能更進步、更實用、更符合使用者之所須,確已符合發明專利申請之要件,爰依法提出專利申請。 To sum up, the present invention is a clustered real-time online manufacturing process and analysis in a vacuum environment. The analysis and transfer system can effectively improve the shortcomings of the conventional ones. The cluster vacuum equipment transfers the sample substrate to the sub-vacuum chamber of each process in a single vacuum environment with a mechanical transfer module for material surface treatment, component coating process and inspection and analysis. , which can reduce the probability of the sample being contaminated in the multi-stage process, and can perform real-time detection, thereby effectively improving the yield and reducing the cost, so that the production of the present invention can be more advanced, more practical, and more in line with the needs of users. If the requirements for an invention patent application have been met, a patent application can be filed in accordance with the law.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定 本發明實施之範圍;故,凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。 However, the above are only preferred embodiments of the present invention, and should not be limited to this The scope of implementation of the present invention; therefore, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the invention should still fall within the scope of the patent of the present invention.
100:系統 1:叢集式真空設備 11:樣品準備室 12:樣品分析室 13:電漿表面處理室 14:真空PVD製程處理室 15:CVD製程處理與即時分析室 2:機械傳輸模組 21:基材轉移機械臂 22:處理室 3:光學組件 31:單波長光源 32:光學鏡組 33:光譜儀 34:真空製程設備100: System 1: Cluster vacuum equipment 11: Sample preparation room 12: Sample analysis room 13: Plasma surface treatment room 14: Vacuum PVD process chamber 15: CVD process processing and instant analysis room 2: Mechanical transmission module 21: Substrate transfer robotic arm 22: Processing room 3: Optical components 31: Single wavelength light source 32: Optical lens group 33: Spectrometer 34: Vacuum process equipment
第1圖,係本發明一種在真空環境中叢集式即時線上製程暨分析傳輸系統之架構示意圖。Figure 1 is a schematic diagram of the structure of a clustered real-time online process and analysis transmission system in a vacuum environment of the present invention.
100:系統 100: System
1:叢集式真空設備 1: Cluster vacuum equipment
11:樣品準備室 11: Sample preparation room
12:樣品分析室 12: Sample Analysis Room
13:電漿表面處理室 13: Plasma Surface Treatment Chamber
14:真空PVD製程處理室 14: Vacuum PVD process chamber
15:CVD製程處理與即時分析室 15: CVD process processing and real-time analysis room
2:機械傳輸模組 2: Mechanical transmission module
21:基材轉移機械臂 21: Substrate transfer robot
22:處理室 22: Processing Room
3:光學組件 3: Optical components
31:單波長光源 31: Single wavelength light source
32:光學鏡組 32: Optical lens group
33:光譜儀 33: Spectrometer
34:真空製程設備 34: Vacuum process equipment
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109134746A TWI757907B (en) | 2020-10-07 | 2020-10-07 | A cluster real-time online process and analysis transmission system in a vacuum environment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109134746A TWI757907B (en) | 2020-10-07 | 2020-10-07 | A cluster real-time online process and analysis transmission system in a vacuum environment |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI757907B true TWI757907B (en) | 2022-03-11 |
TW202215566A TW202215566A (en) | 2022-04-16 |
Family
ID=81710603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109134746A TWI757907B (en) | 2020-10-07 | 2020-10-07 | A cluster real-time online process and analysis transmission system in a vacuum environment |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI757907B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW533526B (en) * | 2000-10-06 | 2003-05-21 | Applied Materials Inc | Method and apparatus to provide for automated process verification and hierarchical substrate examination |
TWI256468B (en) * | 2000-10-02 | 2006-06-11 | Applied Materials Inc | Defect source identifier |
TW201724202A (en) * | 2015-09-22 | 2017-07-01 | 應用材料股份有限公司 | Apparatus and method for selective deposition |
TW201835680A (en) * | 2016-12-23 | 2018-10-01 | 美商蘭姆研究公司 | Atomic layer etching methods and apparatus |
TW201946178A (en) * | 2018-03-20 | 2019-12-01 | 日商東京威力科創股份有限公司 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same |
-
2020
- 2020-10-07 TW TW109134746A patent/TWI757907B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI256468B (en) * | 2000-10-02 | 2006-06-11 | Applied Materials Inc | Defect source identifier |
TW533526B (en) * | 2000-10-06 | 2003-05-21 | Applied Materials Inc | Method and apparatus to provide for automated process verification and hierarchical substrate examination |
TW201724202A (en) * | 2015-09-22 | 2017-07-01 | 應用材料股份有限公司 | Apparatus and method for selective deposition |
TW201835680A (en) * | 2016-12-23 | 2018-10-01 | 美商蘭姆研究公司 | Atomic layer etching methods and apparatus |
TW201946178A (en) * | 2018-03-20 | 2019-12-01 | 日商東京威力科創股份有限公司 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same |
Also Published As
Publication number | Publication date |
---|---|
TW202215566A (en) | 2022-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5968279A (en) | Method of cleaning wafer substrates | |
US10497557B2 (en) | Integrated platform for improved wafer manufacturing quality | |
JP2024075581A (en) | Optical stack deposition and on-board metrology | |
JP7526819B2 (en) | Integrated substrate metrology system for improved manufacturing process performance | |
TW200404328A (en) | Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes | |
US20160035563A1 (en) | Apparatus and method for processing semiconductor wafers | |
TWI757907B (en) | A cluster real-time online process and analysis transmission system in a vacuum environment | |
US10665494B2 (en) | Automated apparatus to temporarily attach substrates to carriers without adhesives for processing | |
KR20240115854A (en) | Methods and apparatus for processing substrates | |
CN217468467U (en) | Integrated equipment for producing Micro-LED chips | |
CN102820245B (en) | Thin-film process system with wafer storage groove and wafer accessing method thereof | |
US6727994B2 (en) | Z-axis monitoring apparatus for robot blade | |
US20220181142A1 (en) | Methods and apparatus for processing a substrate | |
EP0653787A1 (en) | Method for preparation of silicon nitride gallium diffusion barrier for use in molecular beam epitaxial growth of gallium arsenide | |
CN116364568A (en) | Method for measuring resistivity of epitaxial wafer | |
CN114284182A (en) | Etching system | |
CN113363135A (en) | Coating processing method for chip | |
CN209216919U (en) | A kind of glass wafer structure | |
Zhang et al. | Enabling glass wafers in a Si fab | |
KR20080079779A (en) | Multi-chamber system for manufacturing semiconductor device | |
US20230151495A1 (en) | Atomic layer roughness reducing methods and devices | |
Mack et al. | Quantifying the Impact of Al Deposition Method on Underlying Al2O3/Si Interface Quality | |
CN1540327A (en) | Method for detecting metal pollution and corpuscle in processing device | |
US20230008695A1 (en) | Integrated wet clean for epitaxial growth | |
Samadi et al. | Particle free handling of substrates |