WO2002029390A3 - Method and apparatus to provide for automated process verification and hierarchical substrate examination - Google Patents

Method and apparatus to provide for automated process verification and hierarchical substrate examination Download PDF

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Publication number
WO2002029390A3
WO2002029390A3 PCT/US2001/042483 US0142483W WO0229390A3 WO 2002029390 A3 WO2002029390 A3 WO 2002029390A3 US 0142483 W US0142483 W US 0142483W WO 0229390 A3 WO0229390 A3 WO 0229390A3
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WO
Grant status
Application
Patent type
Prior art keywords
substrate
inspection
optical
plurality
process
Prior art date
Application number
PCT/US2001/042483
Other languages
French (fr)
Other versions
WO2002029390A2 (en )
Inventor
Reginald Hunter
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers

Abstract

The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one embodiment, a substrate process inspection system (100) comprises a plurality of optical inspection systems (105) each configured to perform an optical inspection process at a first degree of optical resolution and an inspection platform (150) configured to perform an optical inspection process at a second degree of optical resolution. The plurality of optical inspection systems each comprises a transmitter unit and a receiver unit. The substrate process inspection system further comprises a controller system (102) connected to the plurality of optical inspection systems and the inspection platform. The controller system is configured to (i) process optical signal information indicative of a topographical condition on a substrate inspected by at least one of the plurality of optical inspection systems and (ii) in response to the topographical condition, cause execution of one of a plurality of subsequent substrate handling steps. In one embodiment, a first substrate handling step comprises transferring the substrate to the inspection platform for further optical inspection.
PCT/US2001/042483 1999-09-07 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination WO2002029390A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US09/685,191 2000-10-06
US09685191 US7012684B1 (en) 1999-09-07 2000-10-06 Method and apparatus to provide for automated process verification and hierarchical substrate examination

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002532913A JP2004529485A (en) 2000-10-06 2001-10-05 Method and apparatus for defining the automatic processing checks and hierarchical board test
KR20037004935A KR100871495B1 (en) 2000-10-06 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination

Publications (2)

Publication Number Publication Date
WO2002029390A2 true WO2002029390A2 (en) 2002-04-11
WO2002029390A3 true true WO2002029390A3 (en) 2003-04-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/042483 WO2002029390A3 (en) 1999-09-07 2001-10-05 Method and apparatus to provide for automated process verification and hierarchical substrate examination

Country Status (3)

Country Link
JP (1) JP2004529485A (en)
KR (1) KR100871495B1 (en)
WO (1) WO2002029390A3 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7085622B2 (en) * 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7265382B2 (en) * 2002-11-12 2007-09-04 Applied Materials, Inc. Method and apparatus employing integrated metrology for improved dielectric etch efficiency
EP1959487B1 (en) * 2005-12-06 2011-05-04 Shibaura Mechatronics Corporation Surface roughness tester
JP5002367B2 (en) * 2007-08-10 2012-08-15 浜松ホトニクス株式会社 Optical inspection apparatus, the pinhole inspection apparatus, the film thickness inspection device, and the surface inspection device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049500A1 (en) * 1998-03-24 1999-09-30 Applied Materials, Inc. Cluster tool
US6020957A (en) * 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
EP1083424A2 (en) * 1999-09-07 2001-03-14 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049500A1 (en) * 1998-03-24 1999-09-30 Applied Materials, Inc. Cluster tool
US6020957A (en) * 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
EP1083424A2 (en) * 1999-09-07 2001-03-14 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput

Also Published As

Publication number Publication date Type
JP2004529485A (en) 2004-09-24 application
KR100871495B1 (en) 2008-12-05 grant
WO2002029390A2 (en) 2002-04-11 application
KR20040012667A (en) 2004-02-11 application

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