TW533524B - Film carrier tape for mounting multiple-strip electronic components and manufacturing method of the same - Google Patents

Abstract

The present invention provides a manufacturing method of film carrier tape for mounting multiple-strip electronic components, and film carrier tape for mounting multiple-strip electronic components. It is the film carrier tape for multi-strip electronic component mounting, in which a plurality of film carrier tapes for mounting the electronic components of a desired width are formed in a parallel connected state, while sandwiching an insulation film having a predetermined width obtained by adding a width, capable of forming holes necessary to position the insulation film in a width which is integral number times of the width of the carrier tape for mounting the desired component between roller, without using sprocket wheels for conveying and rotating the rollers, in a state in which the plurality of the carrier tapes are connected in parallel. Therefore, it is capable of markedly improving the manufacturing capability of the film carrier tape for mounting the component via one-row manufacturing line without the need for replacing various components which correspond to the width of the carrier tape for mounting a plurality of types of the electronic components.

Description

533524

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a thin film carrier tape for the use of Tray Lightning ^ ^ (belt-type automatic welding) tape T BH \ ⑽ Pr.H Δ, 1 BGA (▼ dot-array arrangement (Tape-Bal 1, Ar ay)) tape, CSP (wafer size seals (—

Package)) belt, c〇F (膣 θ θ u · (hereinafter referred to as "electronic! = 〇n Fllm)) belt, etc." of a number of lines + crossover: strong thin carrier tape ") ^ 7 film carrier tape for cattle and women's clothing and its manufacturing method film carrier tape for mounting electronic τ pieces and its manufacturing method. «Description of Known Techniques Figures 4 to _7, 'Although manufacturing electronic component mounting In the case of a thin film carrier tape, if the tape is not right, a film carrier with the same width as the film carrier for the desired electronic component is obtained, and a conductive film is formed on the substrate to form a conductive pattern to serve the electronic part. Film carrier tape for installation. TAB technology, which is used as an integrated circuit for semiconductor wafers such as integrated circuits (ICs) and semiconductors, will be used in brief. The carrier tape has a long-size base film of the same width and its length side _ I ΐ ~ about 100 meters. After the two outer bottom holes in the width direction, the base film is transported through the positioning holes-while the edge is in the display. $, T layer of conductive metal layer to form a photoresist film, exposed and printed: 惶 社Electrically metal layer is etched, except for the portion where the plating treatment and the like left foot I, Huo layer, and then the conductive metal layer plating at the exposed positive & to obtain a film carrier tape for mounting the electronic component.

533524 f V. Description of the invention (2) However, in actual use, the productivity can usually only be increased by 1¾. In addition, there are many kinds of widths for each kind of parts that you want to get. The other side is not in use. This kind of problem is performed in a short time, such as the method of No. 8_32 1 527 (Figure 4). The use of such a side-mounted film makes it possible to manufacture a plurality of rows at a time, resulting in high productivity. However, the electronic parts with electric power of several types of widths which are multiples of the widths mentioned above are installed at 35mm and 70mm. This type of manufacturing method is not available in various types of widths, and the width of tapes is wide. The manufacturing process is limited to 1 film carrier tape for electronic component mounting. In the case of the obtained film carrier tape for mounting electronic parts, when the width is reached during manufacturing in a series of manufacturing processes, it is necessary to replace various parts corresponding to the width and various parts corresponding to the width not to be manufactured. Idle you. In addition, because the replacement of parts is difficult, the production efficiency is bound to be low. Regarding JP-A No. 2000- 3 1 2 1 3, Japanese Laid-Open Patent Publication No. Hei 2 has disclosed a method of manufacturing a multi-row TAB tape having a wide width. Since the number of desired electronic zero-body tapes is used, A wide base film Y with a double width can be used as a film carrier tape for electronic component mounting, so as to mention the method disclosed in the bulletin, where the base film width is required or a band width is added to it, for example, for a single part For film carrier tapes for mounting and film carrier tapes for various types of wide mounting, although such a doubled relationship can have a significant effect, there is a case where the doubled relationship is as described. , Still need P = the base film of the thin film carrier for the installation of multiple rows of electronic parts, still the same as in the past, for each type:

533524 columns of electrons still need to be improved due to the closeness and high southerly nature, but in some cases they are in the base film. The purpose of producing products is to improve the manufacturing of electronic parts. Various high-manufacturing capacity methods and multiple pieces of the present invention. The purpose of the present invention is to install and replace the electronic functionalization density, and to use the 'manufactured carrier rubber manufacturer's purpose to accompany the failed line when conveying when the wire mesh is positioned. Method for positioning and refining film carriers for thin film manufacturing flow V. Description of the invention (3)-Multi-manufactured base width In addition, the small size and light weight correspond to the reliability of installation in this kind of belt, especially the positioning, The accuracy of the edge of the other end is deteriorated for the 2 feeding holes. SUMMARY OF THE INVENTION The plurality of electric strip electronic components with large force in the present invention provide a method of manufacturing a tape without a width and a large amount. In addition, a plurality of electronic devices The thin phase device industry of this width, highly reliable electronic thin film, electronic zero printing and exposure are also used. The improved stress rate provides a kind of electronic parts for the film carrier film carrier tape used for sub-component installation. The multiple electronic and electronic parts that pass through are also suitable for various developments in which the film carrier film carrier tape is adapted. In order to improve the quality of the low-priced parts, the moving direction of the transmission hole must be deformed when the light used for mounting the parts can be pushed, which is a problem. It is sufficient for a series of film tapes; the present invention is used for mounting a series of parts for mounting, and the mounting is thin for a wide-width part made of tape. Seek the standardization of electronic equipment, etc., and reduce the density of high electronic parts. The thin film carrier adhesive performs the precision, and when the emergence of the transmission hole makes the positioning process more efficient, it also lies in that the carrier adhesive process can be a film carrier tape. Increased degree and height

IM 夂, clarify that a plurality of electronic zeros formed due to accurate positioning. Furthermore, the object of the present invention is also the film carrier tape for mounting film carrier tape parts of zeta 2 and two electronic methods based on these. Same as the manufacture of film carrier tape = multiple electronic strips of electronic film for installation. The micro-counter of the above-mentioned insulating film of the carcass tape is an integer multiple of the width of the object pattern. The width is two. The width is equal to the width of the required positioning hole forming portion. The rollers are clamped near the edge—the U insulation film is at least two degrees in the length direction, and the positioning hole forming portions of the two edge portions in the direction of the length of the insulating film are one to ^ and the insulating film is grown into a positioning hole, and &# & amp The interval between the ridges is continuously formed between, along: the absolute; the width of the edge r positioning hole * pattern. In addition, a plurality of required carriers are formed. In addition, the plurality of electric wires of the present invention are the carrier films for the film carrier tape for 7 pieces of women's clothing on the same insulating film. Electronic parts are installed to form the plurality of electronic dresses: the width of the sum of the width of p is ^ ^ ^ Λη ^ ^ 7 in the length direction of the film carrier tape for cattle and women 5: two holes at the same time, the insulation In the moving direction of the film, the 疋, 孓 transport direction. Each front end part is not transmitted through the transmission hole. 5. Description of the invention (5) The stress and deformation generated during the insulation 臈. The film loading method used by the electronic parts of the present invention is as follows: The above method is used to cut a plurality of articles T manufactured by the above-mentioned method into various electronic parts A ^ i # pieces The positioning holes formed on the edges in the width direction of the film are used to form the second and third inventions for the installation of electronic parts: 疋 t 疋 · In the case of mounting a plurality of electronic parts, the positioning holes are the same as in 4. The formation was excised. The thin film carrier tape for mounting electronic parts is manufactured through a transfer hole 边缘 provided at the edge of a long insulating film. In this way, there are many advantages such as the speed of the thin tape using the transfer hole, the good quality, and the like. However, along with I's weight reduction and miniaturization, the insulation film has become thinner, and the thinner has cracked or deformed. This threat sheet is used for conveying thin belts, and is also used as a positioning dish for a carrier film. When the conveying hole is broken or deformed, a new kind of problem arises. From the viewpoint of the transfer speed of the thin film of the film carrier tape for mounting of electronic parts, it is not necessary to take it. On the other hand, the positioning of the thin tape is accompanied by extremely high accuracy. In other words, it is not necessary that the conveying speed in the thin-belt conveying hole is high, but a slight deformation of the conveying hole in the surface becomes a problem. Therefore, in the present invention, the existing conveying and At the same time as the manufacture of the sub-assembly mounting tapes for the square sub-assembly, it will be cut off. Film carrier tape, whose carrier tape is cut open, and the method of continuous feeding by inserting pins into the tape has the function of transferring the hole when the tape is conveyed to the nearest electronic part. When the above-mentioned manufacturing process cannot be correctly positioned, Medium, from the accuracy of the sample south, but the recent miniaturization, the positioning using the conveyor belt must have the accuracy of the south. Both are used for positioning> 33524 V. Description of the invention (6) The transfer holes are not sent. The use of such large changes in parent-child birth and electronic components is not necessary. The square tape is not inserted into the belt manufacturing device, etc.). In addition, the manufacturing device belt 0 is used to pass the mirror, and the thin belt is used to pass the thin surface that can be used, and the parts of the claws of the feeding hole are continuously made. It can be transported with a thin tape, and the film carrier adhesive can be used for thin film production. For example, an electron with a desired width can be used as a transmission belt for a fixed state belt. Limitation, there is a device for inserting the width of the tape, and the device is used to transfer the thin tape. Even through the use of the same speed, the same hole will not be produced when using the thin tape, and the roller will be used to transfer the bandwidth of the insulating film used. It is not necessary to replace the roller of the claw of the film carrier adhesive transfer hole. The film carrier tape used for loading is thinner than 200mm. The width of the carrier tape has been standardized to 35 bands, 48 If the width of the insulating film is set to about 150 mm, you can simultaneously manufacture, for example, 4 carrier films with a width of 35 mm, or 3 carrier films with a width of 48 mm, or both. Two carrier films with a width of 70mm. In addition, it is also possible to manufacture carrier films with two different carrier patterns such as two 35 mm wide and one 70 mm wide. Also, in the manufacturing process of such a film carrier tape In the process, the accuracy must be extremely low. For example, the process of exposing a desired pattern to a photosensitive photosensitive resin, the process of applying a solder resist layer at a certain position after forming a wiring pattern, and the inspection process. In the step, a positioning hole is formed by inserting a positioning tool into an edge portion in the longitudinal direction of the thin strip

Page 10 533524 V. Description of the invention (7) Reliable fixing can be achieved, and more precise and complicated wiring diagrams can be formed correctly. If the present invention is used, the more precise and complicated wiring patterns can be manufactured with higher precision. At the same time, multiple such cloths can be manufactured at the same time. Detailed description of the preferred embodiment of the invention The following is a description of the mounting method and manufacturing method of multiple electronic parts of the present invention. Electronic text Juan said the month though. Fig. 1 is a flow chart showing an example of a method of manufacturing a film carrier tape for a plurality of electronic parts for women's clothing according to the present invention. τ Ｍ 工 工件 ： The flow chart of 1 is used to specifically explain the film carrier tape for mounting a plurality of electrons to a plurality of electronic parts of the present invention. In this method, as shown in FIG. 2 (a), (b), (c), along the y film, the rim film 10 In the length direction, at least, and 2-4 wiring patterns are formed. < Good 2 6 strips' It is particularly good that the insulating film 10 is made of a flexible, insulating resin film group that is in contact with an acid or the like at the time of contact, and is not affected by this:: Yu Nailepin ... and even It does not deteriorate when heated during welding; ^ Poly-, polyacyl, especially in the present invention-specific examples of raw materials constituting the insulating film, amines and poly-imines, polyethers> pie, liquid crystal polymers, and the like.

2. Description of the Invention (8) The film made of imine. Listed by Benzene: 2 Margins:;? A specific example of polyimide film, < Amine, from Poly-Phenyl Dimethyl Milk? =, Pure aromatic polyamines synthesized by the family diamines are pure aromatic poly-imines that are aggregated in the Nanpi frame. ° You Fang /, diamine synthesized with biphenyl, biphenyl skeleton, pure aroma ^^ The best a-tVvw ^ -x 〇 family t called imine (for example , Trade name: / C s, manufactured by Ube Kosan Co., Ltd.). 5] 25: Ming: Good Youpan 3 is too R is 0-75mm, especially in the range of 12 · 5-75mm. ^ = The applicability is high in the case of using a thin insulation 貘. As shown in FIG. 9 (c), the carrier film formed on the surface of the insulating film 10 of 9 to 27 has been standardized, and the standard width of the carrier film currently used is 12 mm'48 mm, 70 mm. In the present invention, it is formed at the same time to have the following widths: ： 所: Π M or more. In this way, when a plurality of carrier films are formed, the width of the 缘 ba edge film 10 is set to a certain value, so that the inventory can be reduced. Therefore, the width of the insulating film 10 is set to a width that is approximately an integer multiple of the width of the carrier film that has been privatized as described above, plus the width necessary to form the positioning holes 12 at the edges in the longitudinal direction of the insulating film ( The sum of the positioning holes 12 forming portions (or edges) 6). That is, as shown in FIG. 2 (a), 'to form four 35mm wide carrier films simultaneously requires a width of 140mm; as shown in FIG. 2 (b), to form 48mm wide carrier films simultaneously, a width of 144 li is required; As shown in Figure 2 (c), to form two 70mm wide carrier films at the same time, a width of 40mm is required. In addition, in addition to the above examples having the same object pattern,

Page 12 533524 V. Description of the invention (9) '--- It is possible to combine carrier films with different carrier patterns, for example, to form two 35mm-wide carrier films and one long with k. The carrier film must be wide. In this way, when forming a plurality of standardized carrier films, it is best to: set the width of the carrier film area in the range of 140mm + 15mm, especially + set the $ in the range of 140mm + 10mm. By setting the width of the carrier film 22 == film to be within the above-mentioned range, it is possible to simultaneously produce a carrier film with a seven-edge type carrier pattern. As described above, when determining the width of the insulating film, there can be formed a plurality of wiring patterns on the insulating film, and the edge portion of the width direction of the film plus the portion forming the positioning hole: To = determine the width of the entire insulating film. The positioning holes 12 continuously formed in the edge portion of the insulating film may be formed in the same shape as the side holes in the right-hand direction. Therefore, the positioning hole 12 can be a square punched hole conveyed by the side or a diameter of φ3_6 left… _ left and right machine, the signal is a solid stone press. In the case of the # ,, g ding ^ ^., Dead " 成 & 吊 隹 吊 吊 吊 吊 吊 吊, the positioning hole forming part 6 wide household iS chip or 7 lai 5_, preferably 7 money 4mm, especially good width through hanging is about 5-10. Therefore, including this: 4 11 coffee, a particularly good total width is the degree of the insulating film of the above-mentioned carrier film forming portion 8 and the formation ° P6, and then consider the processing capacity of the device, followed by the wide processing capacity of the sum of the eyes In the present invention, the film transmission capability of the present invention, the above-mentioned insulating film of the device tape is wide. The film carrier for two-piece mounting is within the following scope of the invention. Again, in this description. The Sx V width is taken as the best bandwidth 156mm for 533524. Description of the invention (ίο) = As the above-mentioned standardized width, there is now 35mm width, 48 bands] 丄 70mm width, if it is in the width direction of the insulation film 10 The widths of the two edge openings 6 and 8 are respectively 8 mm or 6 mm in width and 1 in width as the insulating film. The width of Q is an integer multiple of the above-mentioned standardized width, and is approximately the same as the width of 156 mm. = 丄 As shown in Figure 2 (a), (b), (c), the widths of the required film carrier tapes 5 for the installation of various types of electric power ^ 2 cows are integer multiples, respectively, 1 tt ^ width, In order to set the approximate width to a fixed width again, add a band edge (positioning hole forming portion) 6 to the nearest two sides =, and change the width of the band edge 6 according to the approximate width. Together, the bandwidth is roughly set to a fixed value. More G, that is, SI ί = and the standardized width is changed, and the new method can also use a new fixed value. The standard value is 35_, 48 Then, 70 li, the new value of the standard value or the standard value of U is Η0, and the integer is J. "Sample: Like: t is not required to change the device, etc. ' In the case of a new type of carrier film, the same solution is highly likely to be adopted, and it can be considered that the value gate thus obtained can be loaded with two A to the right. Therefore, when setting a new standard value or new load = when necessary, the width of the carrier film can be considered as-soil, 12 mm ± 2 mm, 18 mm ± 2 mm, 24 mm ± 2 mm, 59 mm ±: left: . Even if the standard value is changed as described above, by using the above-mentioned insulating film, it is possible to sufficiently correspond to a value within the range of the insulating film which has a particularly good insulation m " " of about i56 mm wide. ,

533524

A conductive metal layer is laminated on the insulating cymbal as described above. The electric metal layer can be pasted on the insulating concrete through an adhesive, or it can be laminated without using such a desiccant. In addition, after the metal thin film is formed on the insulating film by a machine shot method, a conductive metal such as copper, which will be described later, may be plated thereon, or an insulating resin may be coated on the conductive metal by using This insulating resin is cured to laminate a conductive metal layer. V. Description of the invention Gl) In addition, the conductive metal layer may be either on the surface or laminated only in addition to positioning the positioning hole 12 in the present invention and the prior art tool inserted therein, which can be accurately placed in a predetermined position, Since there is no transfer, the strength of long-size film carrier adhesives rarely becomes a special problem. However, even if the strength of the positioning hole without using the transfer claw is sufficient, the metal laminated layer has high strength over the entire surface of the insulating film. It is laminated on the rest of the insulating film except for the entire hole forming portion. The transfer holes 16 are different from each other. Insert the positioning claws of the carrier film for mounting the electronic parts into the positioning holes 丄 2 ▼ For the purpose of transfer, the thickness of the insulation film is extremely thin. It is also impossible to say that in this case, the conductive gold can be combined to combine the two, so that the strength of the width direction of the insulating film formed in the method of the present invention is the highest, If the stacking is completed because the conductive metal layer should be the same as the conductive metal layer in this part, it is not necessary to stack the conductive layer. Since there are no transmission claws inserted into the positioning holes on the outside, there is no need to strengthen the conductive metal layer. The insulating film is discarded together with the desired metal layer. Also, ‘the conductive metal layer is usually formed between the adjacent blades 8 that form a passenger ’s eight δ — * — 9 and the wiring pattern of the evening stripe, that is, the positioning holes μ formed at both edge portions in the width direction.

Surface of the insulating film 10. 2 The conductive metal layer used by J for this purpose, but it is best to use good conductivity and pattern formation J: There are rolled steel foil and electrolytic copper foil, but it is best to use electrolytic steel to form a more refined =. The suspension of the electric power used here is preferably in the range of 5-18 Mm; the electric and real power is in the k-like layer of conductive metal, and there are 4 holes in the insulating film. The positioning hole is provided with :: hole and 'f-shot perforation. In addition, in this step: Edge film: f: There are no positioning holes, but it is preferable at this stage to pick up the film for the mounting of electronic parts. In addition, the simultaneous installation and installation = loading; device holes, through-holes such as cutting holes for cutting wires when bending the ribbon. When the insulation is overloaded? Two through holes, stacking 7 lead / wiring diagrams, ^ α & π transmission holes Η, / Λ sex metal [Article 1 菊 @ 宰 的 导 4 / Article side transmission holes 16 No. 2 positioning holes! ^ Good use-material; at least using-i out rollers and a pair of traction rollers for conveying> lift aluminum metal foil, easy copper foil. In the width direction of the thickness of the copper wire, the dense wiring pattern can be formed on the same insulating tape by punching the edges of the insulating film. The conductive metal layer corresponding to the edge can often be formed in a thin bending cut The side of the transmission hole in the widthwise upper part of the flexible metal layer is formed on the side of the knee, and the transmission transmission hole 16 is formed. For Lepton, the most: Use transmission 533524

Since neither of the transfer pins is inserted into the transfer hole 16 and the first hole, the second positioning hole 12 is used at this stage. Subsequently, such an overlying photoresist film is formed. The photoresist film surface ' is preferably coated with the photoresist film while coating the photoresist film pair lepton ' with a pair of feed rollers. When the surface of the conductive metal layer of the through hole is uniformly coated on the conductive metal layer, the insulating film is also moved in the lengthwise direction using at least one pair of pulling rollers. After the photoresist film is coated, for example,胄 Use the apparatus shown in Figure 7 to expose the desired pattern on the photoresist film. At the time of this exposure, it is necessary to correctly position the insulating film 10 wound on the take-up roller 55 and sent out by the delivery roller 53. Due to the slight deviation of the insulating film 10, it will be aligned. The wiring diagram has a bad influence. Therefore, for example, the positioning pin 52 of the positioning tool 51 shown in FIG. 3 is inserted into the positioning hole 12 formed at the outermost side in the width direction of the insulating film, thereby fixing the insulating film reliably. Then, exposure is performed using the exposure device 83. Next, the positioning tool 51 is moved backward to pull out the positioning pin 5 2 of the positioning tool 51 from the positioning hole 12, and the exposed photoresist film is sent out to the developing device by a pair of transfer light 6 1. In the process (developing solution 6 3), development is performed, and then the traction roller 54 is transported in the direction of the winding shaft 56, and a desired pattern made of a photoresist film is formed on the surface of the conductive metal layer. And wound on the winding shaft 56. The pattern formed by the photoresist film is used as a masking material, and the insulating film is passed through the etchant to dissolve the exposed conductive metal layer, and the masking material is protected by the photoresist film. A portion of the conductive metal layer is left undissolved and remains on the surface of the insulating film to form a wiring pattern. In this way,

533524 V. Description of the invention (14) After cleaning with a domain, the remaining photoresist is decomposed and then washed with water to remove the masking material from the (masking material). In this way, as the subsequent steps of the photoresistance map, in the process of development, etching, and photoresist JJ two pattern exhaustion, since the transmission of the insulating film does not require such an accurate decision, use at least- Send the light 'at least-pair transmission = speed wide light, etc.' with the same pair of rollers to hold the insulation film in the same two :: out, so you can not use positioning holes or pass the edge film. The L-hole is stably transmitted in this way to form a wiring diagram. In addition to the formed terminal part, a soldering protection layer is coated to protect the formation: = When this soldering protection layer is applied, it must be left in the wiring. The connection part between the lead formed in the figure and the electronic component is stipulated in other regulations. Welding protective layer. Even when the soldering protective layer is coated, for example, the positioning pin 52 of the positioning tool 51 shown in FIG. 3 is shown. It is inserted into the positioning holes 12 formed at the edge portions on both sides of the insulation * 10, and the insulation film is fixed, and the welding protection layer is applied to the position where the welding protection layer is applied. After applying the anti-welding protective layer, pull the positioning tool 5 丨 backward pin 5 2 out of the positioning hole 12 and use the same pair of ^ 53, a pair of transfer rollers 61, a pair of traction rollers 54 and the like to transfer After the insulation film 10 is pre-cured in the drying oven 66, it is wound on a winding shaft 56 together with an embossing guide (not shown), and then the winding shaft is sent to another drying furnace to increase the protective layer. Curing. Dissolved i completely ^ light of: waiting for the control of: • traction to send the absolute end. In the shape of the cover, the film shall be fixed to the dry-rolling and welding prevention 533524. Fifth invention description (15) The film is held between a pair of feed rollers. Then cut with a slitting machine to make the insulation tape = carrier tape independent. At this point, the shape is removed. Therefore, a part of the positioning hole at the end of the second cut is cut and the film carrier tape for mounting is cut and mounted on the shaft. The electronic parts wound around the shaft are used to transport the film carrier tape or the square edges. The holes are used in their original state. The other two positioning holes, which have not been used yet and are maintained, are only inserted into the two edges of the edge film when exposed and coated, and the positioning carrier tape is used when the protection layer is not completely protected Send. Film for mounting electronic parts on Yujo. So ’exposure or frost! ^ μ high. * The anti-bumping protective layer #Positioning accuracy is extremely high. As mentioned above, before the tape is cut, it can be installed in the film as required in the experience process, as shown in Figure 9. If the inspection process is performed again, The positioning pin 52 of the tool 51 is inserted into the installation position, and the positioning tool 12 shown in FIG. 3 is used to inspect a plurality of electrical patterns through visual inspection or film support for mounting of positioning holes on both edges. Recognition of CCD. Camera 67. In the fire, it is indicated that it is equipped with "for use", especially by using a computer. Fortunately, check the pattern obtained: check the pattern obtained: = check the standard pattern is not generated = do not use the transmission hole 16 to transfer the insulating film 10 = use a tappet The deformed # of the conveying hole 16 is caused by: positioning with accompanying, non-hanging accuracy. because

533524 V. Description of the invention (16) __ The wiring diagram generated due to the low positioning accuracy is not recognized by the pattern of the computer, and the accuracy of the inspection is reduced by 4. In Figure 9, 55 is a car with a car. 1. Improve with a person. And then, around the axis. 53 is for sending light, 54 is for drawing, 丨 is light, and 57 is for rolling. Because of its high accuracy, it can be made with high precision even if it is not correct. * 复杂 The complicated wiring diagram of the crane is also small. The multiple parts of the μ wiring diagram make the company— /, there are complex structures formed in sufficient shape. In addition, even if it is; 也 = film carrier tape can be pattern recognition and inspection with high accuracy. The wiring diagrams of X, Y, and X can also be obtained by using a computer. Fig. 6 (A) shows a state diagram of a process flow chart obtained by multiplying a plurality of electronic cymbals obtained by the method # 1 with the method of the present invention. In addition: ^, the method of positioning holes using the film carrier tape will transfer the fixed table for the transfer of the plurality of electronic parts manufactured according to the existing invention shown in FIG. 4 into the positioning holes 16 State diagram enlarged with this hole. Insulation film of both] =; This position should be 丨 when the body tape is used. . Meter. The length of the phase carrier tape is also the same as in FIG. 6. The transmission of the insulating film 10 is carried out by using a lepton to hold the insulating medium 10:, as shown in FIG. 7 to FIG. 9. When the anti-welding protective layer is being inspected and monitored, the positioning pin of the bit tool is inserted into the positioning hole to fix the stator: as shown in FIG. 3. All the transmission of the middle insulation film uses a roller. In contrast, as for the mounting of a plurality of electronic parts as shown in Fig. 6 (β), page 20, 533524 V. Description of the invention (17) The film carrier tape will be provided on each component. The positioning pins in the second side in the width direction of the insulating film 10 are inserted into the edge film. The positioning result of the thin tape carrier tape used in the method of the present invention is shown in the figure, when the two electronic parts are installed, and the direction of movement of the insulating film =, the shape is maintained. There is no deformation at the front end edges and edges. Sub-transport direction During sub-transport, the belt that is subjected to the maximum transmission stress is intended to cause the belt to not undergo stress deformation due to the transmission stress. 】 = Side, as shown in this side, insert the pin for transmission instead, as shown in Figure 6, the transmission hole is located in the transmission of the insulation film, the electrical insulation of the zero insulation element / use of the transmission = Body ;: Each front edge of the transfer direction of the insulating film in the transmission hole ㈣㈣ is deformed by the stress generated by the transmission hole when the film can be edged; 71: The hole transmits the edge of the 'insulated edge portion 70' The deformation is the same as the shape of the front end of the interpolation = platinum = transmission direction, and the shape of the pin of the% hole corresponds to the corner 80, which often causes cracks 81. Although the amount of deformation is obvious in each case, it is obvious that the transmission holes are used in the above-mentioned film. The deformation can be formed on one of the multiple electronic component installation factors, i. An important primary film with reduced accuracy of the wiring diagram: wide strips: film carrier tapes for component mounting, absolutely 2, 1, 2, and mD1, which are wider than the tapes of the prior art + right, and stacked in The conductivity of such wider tapes is also worsened. Therefore, the transmission force for transmitting such a wide belt. On the other hand, the thickness of the insulating film gradually changes

V. Description of the invention (18) Thin, accompanied by the gradual decrease of this insulation ^, for a plurality of electronic parts ^ thick ',,, and the mechanical strength of the edge film is gradually necessary as the above-mentioned film for transmitting women's clothing The carrier tape is subjected to the transfer. The strength of the transmission hole becomes unacceptable. Therefore, according to the present invention, the transmission method is used instead of the roller used in the entire process until now. Method, and the manufacturing process of the film carrier tape, which requires high-precision positioning, is divided into processes that require high precision, and that is a high-precision process, and the current positioning is correct, so that two = 2, bit tools Insertion into the positioning hole to achieve the other steps will pass the position accuracy of ::, Θ, for this, since the fixed hole is not used, the deformation of the positioning hole is prevented. In this way, the insulating film used for setting can be transmitted by rollers. The insulating film can be made with a high degree of freedom, and the degree of freedom can be increased. 'The insulating film of the same width can be used to produce a carrier film. That is, by using about 156 coffees: by ίΪ 二 ίίίί Almost various groups of standardized carrier films 1⑽❶ / 中 ^ Κ. /, U produced, the discarded insulation film is only 5-15% of the entire 100% of the wide output, preferably at β — 1η〇 / 从 从, u ^ ^ made by Xi Yu, Zhi Xi anti-life 7 It can be installed with very high = clothing = evening. Electronic components are thin: The limit of the width of the edge film is only the width of the position that must be set at a high precision, and it does not substantially affect the other parts of the device. 1 Change, only by changing the design width of the positioning tool, the width of the insulating film that can be used can be changed. Therefore, even if the carrier film other than the standardized width is made, only a part of the changing device needs to be changed. Can meet its specifications, so even when manufacturing ^ page 22 533524 11 _ V. Description of the invention (19) When the product is modified or a new specification carrier film can be filled quickly ΓΓ Each of the formed electronic strips has a separate film on each of them. The positioning holes used for positioning have become useless. Materials required: multiple pieces of electronic disasters manufactured in the method of the present invention Anji = Knife cut off and discarded. In addition, it is necessary to cut and wind on a separate :: film carrier tape, and each of the film carrier tapes used for mounting electronic parts is cut in two pieces. The transmission holes have not been used. You can also: : The transmission hole is a high-precision positioning device for women. δχ is used as an electronic component. By using the width of the insulating film—manufactured multiple electronic components, the predetermined width can also be changed. Since the width of the carrier tape is not required to be changed to the width of a carrier tape: m The width of the film used for component installation can save the operation of various equipment parts of the film carrier tape for root installation, so that the production efficiency can be improved. The width of the tape can be changed to a certain value. Zero storage times with low usage ::: To: equipment-parts, take a certain number of film carrier tape a. In addition, this type of carrier tape requires various carrier tapes. — Film for mounting electronic components with wide widths Page 23 533524 V. Description of the invention (20) v and above, an embodiment of the present invention has been described, but the present invention is not limited to the embodiments described above, needless to say The present invention can be applied without departing from the scope, purpose and effect of the present invention. As described above, the present invention is different from the prior art in that a plurality of films for mounting electronic parts can be provided in a series of manufacturing processes, which can greatly improve the manufacturing capability of the film carrier tape for mounting electronic parts. Carrier tape. μ Even when the width of the film carrier tape for mounting electronic parts is required to be various, it is not necessary to manufacture a plurality of thin parts for mounting electronic parts corresponding to the film carrier tape for mounting electronic parts having different widths. The film carrier tape eliminates the need to replace various equipment parts corresponding to the width of a plurality of types of film carrier tapes for mounting multiple electronic parts, which can greatly increase the manufacturing capacity using a series of manufacturing processes. In addition, when manufacturing a film carrier tape for mounting electronic parts, the base film is conveyed by a roller, and when a toothed reel is used for conveyance using a Beton hole formed on the base film, Due to the stress and deformation, the through-hole can be used to achieve high-precision positioning, which can make the product fail rate.

533524 Brief description of the drawings 1 FIG. 1 is an example showing a method of manufacturing a plurality of ^^ 1 of the present invention, a film carrier tape for component mounting, and FIG. 2 is a flowchart schematically showing the process of each example. F X for the part installation. The multiple electric wires manufactured by the process example described above form four electric wires; zero =? With glue :: plan view of the example. ⑷Table: ^ The film load for the installation of the component Λ indicates the production form of the body glue; the present invention is a perspective view of the film support for the installation of the solid component. 的 The positioning pin used in the yoke example Example Figure 4 is a sample of the current process of manufacturing a multi-row stopper tape with a wide width of the base film using a thin film. ^^ Column of electronic parts carrier tape Fig. 6 is a schematic diagram of an example of a part of the device of a plurality of electronic parts f of the invention. 4 (B) β is an exemplary diagram showing the state of the positioning hole of the present invention. The θ diagram 疋 shows a conventional transmission hole. Fig. 6 shows the pattern of the multiple mines of the present invention in a schematic manner; step 1 = a device diagram when the pattern is exposed when the carrier tape is used. Figure 9: Figure 9 is the device when the second layer is coated with anti-welding protective layer: film assembly for drawing, AT: symbol for body drawing, page 25, 533524 Simple description of the drawing * 1 For mounting of multiple electronic parts Film carrier tape for film mounting 5 Film carrier tape for mounting electronic parts 6 Band edge (positioning hole forming portion) 8 Carrier forming portion 10 Insulating film 12 Positioning hole 16 Transfer hole 51 Positioning tool 52 Positioning pin 5 3 Feed roller 0 54 Pull roller 5 5 Take-up shaft 56 Winding shaft 6 1 .Transfer roller 63 Development device 66 Drying device 67 CCD camera 70 Conveying direction 80 corners in front. _ 81 裂 crack _

Page 26

Claims (1)

533524, method of applying for patent scope 1 method, a manufacturing method of a film carrier tape for the installation of multiple types of electronic parts, at least two electronic films are formed on one side or both sides of the same insulating film at the same time. : The film width of the sum of the width of the positioning hole forming portion of the above-mentioned insulation part, at least the insulating film == edge media is conveyed along the length direction-edge, and-the edge is in the spacer = the edge hole forming portion is -Determining the width of the household ^ At the same time, a plurality of required insulation materials are formed in the lengthwise direction of the insulating film in the positioning holes formed in the two edge portions :, method, in order to transmit in the lengthwise direction It is not necessary to use the positioning holes and transmission holes formed on the insulating film. The thin edges 1 and 2 are used for the mounting of the sub-components. 4: Near ::: In the width direction of the above-mentioned insulating film, The corresponding correspondences of the positioning holes forming the positioning holes in the length direction of the insulating film are formed; the plurality of required load pattern patterns are formed near the edge of the insulating film along the length of the insulating film. According to Shen Qing's patent scope item 1, multiple electronic capacitors it + # ra, manufacturing method of carrier tape, # in the above =: 533524 for installation 6. When applying for patent scope _— Between the positioning holes, a pattern is formed along the length direction of the insulating film, and transmission holes corresponding to the formation of a plurality of items on the length direction are also formed. Fig. 5. According to the method for manufacturing a plurality of electric film carrier tapes described in item 丨 of the scope of the patent application, the method described above is used to insert a positioning tool into the positioning hole. Zhongyu and τ Zhi's position is to fix the insulating film. «Bu according to the Chinese patent system! The method for manufacturing a plurality of electronic parts and film carrier tapes according to the item, wherein the towel is in the range of 150 to 165 mm. ^ Visibility is 7. According to the method of manufacturing multiple electronic parts described in item 丨 of the scope of the patent application, the method of manufacturing the multiple load patterns 图案 described above has been standardized. 8. According to the method for manufacturing a plurality of electronic component film carrier tapes described in item 丨 of the patent application scope, the width of the plurality of carrier patterns formed in the above includes transmission holes formed in the length direction of the respective carrier patterns. The part is any of 7mm ± 1mm, 9m ± 2mm, 12mm ± 2mm, 18mm ± 2mm, 24mm ± 2mm, 35mm ± 2mm, 48mm ± 2mm, 59mm ± 2mm, or 70mm clay 2mm. 9. According to item 1 of the scope of patent application for the installation of multiple electronic parts Page 28 533524 A patent application method for manufacturing a thin fan carrier tape, the width of the positioning hole forming part of the dragon is near the two edges, and the visibility is 7mm ± 5πηπ in each edge part. 1 〇 According to the old patent of the application patent 笳 jg 篦〗 @@, the multiple electronic parts described in item 1 are housed in the power supply L to form a positioning hole near the two parts of the insulating material ㈣ 1 j H (2) A method for manufacturing a plurality of electronic parts described in item i of the patent fan park: a method for manufacturing a thin film carrier tape, wherein when the width of the conductive metal layer laminated on the surface for women's clothing is 10 ()%, a carrier is formed. = The total ratio of the width of the conductive metal layer is 90% or more. Project Department 1 2. A method for manufacturing a thin film carrier tape according to the plurality of electronic parts described in the patent application No. 1 of the application, wherein the above insulation The membrane can be used in the range of 5-125 m. Degree of drought 1 3. The method for manufacturing a plurality of thin film carrier tapes for electronic components as described in item 1 of the application patent, wherein the manufacturing of the plurality of electronic & In the method, after forming a plurality of electronic component mounting and film carrier tapes, the plurality of electronic components are taken in the length direction, and the M film carrier tape for Dingwenzhuang is cut into each of the respective pieces to make each electronic part ^ Film carrier tape is independent. Text Page 29 533524, patent application scope 2¾ ί ί The manufacturing method of a plurality of electronic component mounting / carrier carrier tapes described in item 1 of the patent application scope, wherein the first and the second patterns are cut along the top and bottom after being formed ^ a出 # Ϊ i ί Cut in the length direction to make each load pattern independent, and when the electronic part Ansang uses a carrier tape, the cut-out is not formed at =: using ㈤Thin film carrier # tape and the insulation film: the entire part 5_15% of 100% width. The visibility occupies the insulating film. According to any of the items described in claims 1 to 14 of the claimed scope of the invention, a method for manufacturing a thin tape carrier tape for evening instrument installation. The electric tape is cut to form a positioning hole formed by On the edge in the width direction 16, a plurality of single-sided or two thin-film carrier tapes with multiple electronic love a insulating films are mounted on the same carrier tape with a plurality of electronic parts, two electronic parts, and a plurality of electronic parts. Film carrier tape for use, wherein the pattern width of the object is an integer multiple: the carrier tape has at least the width of the required hole formation portion, and both are formed on the film carrier for positioning sub-components near the two edge portions. Adhesive tape: at the same time as the potential holes are formed, the front-end edge portions in the feed direction of the two edge portions in the lengthwise direction of the insulation, the%, the stress direction generated by the belt transmission of the positioning holes-stress deformation . / When transferring the insulation film through the transfer hole again Page 30 533524 / 、、 Scope of patent application : According to the plurality of electronic component f film carrier tapes for electronic components described in item 6 of the scope of the patent application, in which the positioning holes are formed along the length of the insulating film near the two edges in the width direction of the above-mentioned insulation board Between the fixed holes, a load-bearing pattern required by Yubar is formed along the length of the insulating film, and transfer holes corresponding to the required load-bearing pattern formed in the length direction are also formed. 1 8. According to The plurality of thin film carrier tapes for mounting electronic parts described in the scope of the patent application No. 16, wherein the width of the above-mentioned insulating film is in the range of 150-16 5 minutes. 1 9. According to the scope of the patent application No. 16 The film carrier tape for mounting a plurality of electronic parts, wherein the width of the plurality of carrier patterns formed above is a standardized value. 20. According to the sixteenth aspect of the scope of the patent application for the mounting of a plurality of electronic parts, The film carrier tape, wherein the width of the plurality of load patterns formed above includes the transfer hole formed in the length direction of each load pattern is 7mm ± 1mm, 9mm 2mm, 12mm 2mm, 18mm Soil 2mm ′ 24mm ± 2mm, 35mm ± 2mm, 48mm ± 2mm, 59mm ± 2mm, or any of 70mm ± 2mm. 2 1. For the installation of multiple electronic parts according to item 16 of the scope of patent application Page 31 533524 6. The patent application film carrier tape, wherein the positioning hole formed near the two edge portions described above has a width of 7mm ± 5mm at each edge portion. 2 2. According to item 16 of the scope of the patent application, a plurality of film carrier tapes for mounting electronic parts, wherein the average thickness of the above-mentioned insulating film is in the range of 5-125 // m. 2 3. A plurality of film carrier tapes for mounting electronic parts according to any one of items 16 to 2 of the scope of application for a patent, wherein the film carrier tapes for mounting a plurality of electronic parts are cut at the same time The positioning hole forming portion is cut out to obtain a film carrier tape for mounting electronic components. Page 32