TW527860B - Electrical connecting structure of a tape carrier package for an LCD driver - Google Patents

Abstract

An electrical connecting structure of a tape carrier package for an LCD driver is provided. The present electrical connecting structure comprises a circuit board having a plurality of conductive terminals, a conductive member having a plurality of rows of conductive portions formed thereon and a tape carrier package of an LCD driver having a plurality of input/output leads. The conductive member is disposed between the circuit board and the tape carrier package. The pitch of the conductive portions is smaller than that of the conductive terminals and that of the input/output leads such that the conductive portions can electrically connect the conductive terminals to the input/output leads. The present electrical connecting structure also can be provided in a mounting structure of an LCD driver tape carrier package with a circuit board for advantageously performing failure analysis.

Description

527860

V. Description of the invention ο) 5-1 Field of the invention: The present invention relates to a structure for providing electrical connection between two circuit boards; in particular, it relates to a tape carrier package suitable for use in a film carrier package. It is connected with the circuit board. < < Electrical connection -2 Background of the invention: An electrode on a liquid crystal display tape-automated tape carrier. The display driver of the display driver of the acid film of the film type of the wheel-in lead 10 has _ wafer wafer 18. Input Roll-type carrier package 4 stand 1 ^ Xia Xia 6 extends to the crystal display driver and wheel in?丨 Line 1 2 is usually printed by bonding. A picture is a film-type film-bearing edge film 1 1 2 and the wheel bearing position lead 1 2 1 0 ~ film-type wafer 1 8 and output bow 丨 _ roll Schematic diagram of film-bearing f circuit board made with automatic bonding technology (TAB) connected to its LCD panel. Traditionally, TAB technology is used to make f-packages. This V is a crystal, and the package 10 has a material of polyethylene and is formed on a film-type insulating film layer 1 | line 14. Film-type carrier package pass r: for carrying the liquid crystal display driver ί position 16 extends to the plastic carrier 1 4 is from the wafer carrier system ′ 'Yu Yi 1 0 the other side. —The liquid line is carried at the wafer carrying position 16 and connected to '4'. According to the above, 527860 can be completed. V. Description of the invention (2) After a liquid crystal display is formed, the liquid crystal display 11 is checked, and the installation method is to set the liquid crystal on the detector). The method of detecting the film bearing 1 4 'by checking in the lead 1 2 method is to use the wire 14 and the phase probe is very easy. This traditional electric probe requires a card equivalent to the card. The film carrier package 10. No: The driver chip 18 is mounted on the film-type insulation film layer. Electrical analysis (failure analysis) is usually performed to determine whether the connection is good. Conventional electrical testers are not driven by a film carrier package 1 〇 Probe cards (Probe card) placed in (probe station) directly contact the LCD display driver package 1 0 input leads 1 2 / or manual lead wire of output lead 1 4. For this traditional electrical detection method, align the probe with the input lead 2 / or output lead: bad time-consuming. When the electrical test is repeated, in May, j lead 1 2 / Or the output lead 1 4. Furthermore, = ff side requires the use of a detection machine and a detection card, and the H cymbal detection card is about NT $ 20,000, which is inconvenient for detection. Therefore, this A traditional electrical detection method is very much based on this, and it is urgent to connect the ugly electrical detection device. A: # The electrical detection measures and / or the improved type of the carrier-type package. i East lice detection is more convenient.

Page 6 V. Description of the invention (3) 5-3 Purpose and summary of the invention · The roll-loading system is to provide a type of liquid crystal display driver film. The film-type is constructed in C ', which sets the conductive interface to the touch. Between 4 and a circuit board, to improve the electrical connection of the two types, the JSF series 5 provides a variety of LCD drive drivers, sealing ~: electrical connection structure, to facilitate this, according to: Perform electrical testing. This I roll type carrier is another object of the present invention. The γ carrier package and a printed circuit = a film type support for a liquid crystal display can be used for the bonding structure of the liquid crystal display: Will destroy the film-type carrier package for repeated electrical inspection and output / input leads on the seal.

The present invention is a film type of VK seal printing electric display =-and has mechanical stability in structure = ςk, which is easy to assemble and spend as described above. Ϊ́ 之 ΐ = Ming provides a connection structure for the liquid crystal display driver σσ, and the joint structure with the circuit board, and its use in film-type bearing. The electrical connection structure of the present invention includes a circuit board and a conductive part of a circuit board. Electrical ^ lead and multiple wheels: two: roll-type carrier package: Xia Yan surface :, with type bearing Ming · · v W wire. Monk ^ > I, there is a hard line between each package and the conductive parts are located in the circuit: the distance between several round circuit boards and the film contact, and the distance between the lead and the lead F is slightly between the board and a And the distance between the blocks that are less than the output / inferior to each other is less than the parent's φ & / Hot '] Induction Green +% Conductive Contacts ¥ Electrical Contacts Electricality Far # Green distance. Here and there women's gums? The connection to a power supply block is to seal the heart-shaped coil carrier out of the bow. Another—Fangzhu—support board ... The circuit board joint structure of the conductive component of the present invention is a film-type carrier board including an electric liquid crystal display driver circuit board, which is provided at the electrical contact of the circuit board. . It is supported that the η π pair with some conductive contacts has these one to 3 〒 electrical 稷 points. Support: "It is correspondingly matched with the second part of the second table f. The support plate has a chamfered edge and is adjacent to these conductive connections-1; the contact-position. The guide = and-the slit system is located in the corresponding two conductive parts The surface is: v electrical contacts located in the slits of the support board, and this v electrical block is electrically connected to individual pitches. LCD driver :: The pitch is smaller than the carrier package of the conductive contacts ) Is a two-film carrier package (tape package includes-film type support = 1 under the support board. This film type · carrier seal chip. This film type jeca Γ rier) and a liquid crystal display driver LCD driver : 7 (there is a wafer bearing position to place the carrier away from the wafer carrier II, and a plurality of input leads are located near the wafer bearing position of the film carrier = side 'and a plurality of output leads are located at the slit. The roll-type bearing is the other pair of sides and the distance between the corresponding support plates,, and is greater than between the conductive blocks of the conductive parts.

V. Description of the invention (5) The distance between the film-type carriers of one of the conductive contacts of each transmission board is provided for the film-type carrier. The wires connected to the circuit board can be processed by the film-type circuit board of the circuit board indicator. Film-type failure analys output leads. Out leads. Bottom film type device package electrical contacts, electrical coupler seal carrier is), through these systems for the load carrier seal can be guided, so it is glued to external packaging and circuit packaging is convenient without breaking the conductive area. Connected to the electrical component roll-type conductive end plate and repeatedly damaged the rubber block electrical carrier. Sealed by its conductive carrier. The roll-type bearing is used to connect the package to the package by using this structure. The invention liquid in the wheel of the liquid crystal block can be sealed by the electric load detector. It has the following characteristics: Of

5-4 Invention Details: 造. Electrical connection for the connection of the type-type carrier package = the film that is not a driver issued by Japan and Japan The film carrier package (t =: a ... in the LCD driver driver structure (―gs ^

The connection structure of the electrical connection between the circuit boards can be provided as an example. In accordance with the drawings, a detailed enlarged and exploded schematic diagram of two circuits 0 according to the following preferred embodiment is provided. This company

The second diagram on page 9 is the connection structure for the electrical connection of the board according to the present invention. 2 527860 V. Description of the invention (6) Conductive contact (first rt number circuit board 2 N with 1 inns) 2 2 2 The second circuit board 2 of the second conductive contact (1) has a first conductive first conductive contact 22. The total length of the second conductive board 2 is greater than the distance between these second conductive contacts is smaller than the distance between the first conductive contacts 3 and 3. In this way, the first conductive contact 3 can be made. In other words, the first circuit board 2 3 of the conductive portion, the parallel circuits 3 2 and 2 2 3 and the connection structure 2 0 include a plurality of first conductive terminas 1) 2 1 1 has a plurality of conductive blocks (the conductive part 2 2 on its surface and one having a plurality of second conductive terminals) ^ 2 3. The conductive member 22 is disposed between the surface of the first electrical contact 211 and the surface of the second circuit board 2 2 3 3. The total length of the conductive blocks 2 1 1 and the total length of the first conductive contacts 2 1 3. Conductive block 2 2 2 The distance between contacts 2 1 1 and the second conductive contact are electrically connected to the second conductive contact 2 2 2 1 1 via the conductive block 2 2 of the conductive member 2 2 series of electrical contact The first circuit board $ provides an electrical connection between the two. (Conductive ft) Electricity, 2 2 is-the pressure of a plurality of metal wires on the surface will make the conductive member 2 2 elastic 2 1 and the younger-circuit board 2 3 electric component 2 2 and the first-circuit board 2 i. 'And this elastic force increases the conductive contact pressure, and improves the electrical contact. The circuit board 23 is referred to the third A figure of the contact surface. The conductive member 2 is preferably a surface with gold plating.

No. 10 527860 V. Description of the invention (7) J genus: (g〇ld ,: ed fllaments) 2 2 4 strip stone eve rubber _ ^ 2 2 〇 ° This figure is the strip stone eve rubber element 2 2 Q The cross section and: f eight Figure Λ magnified top view of this strip-shaped element 22 ° The distance between the mineral gold metal wires 2 2 4 is preferably 0.03 mm. In this connection structure 20, the first circuit board m-conducting contact may be an input two output of a printed circuit board, and two is a removable wiring board.

Wlring board), such as a film-type carrier seal of a product, a lead input lead; Sleeve strip output leads and complex numbers In addition to the male figure shown in the second figure, the k-plane structure is created. The conductive member 2 and the second structure 2 0: is an electrical interface between the-circuit board 23 and the board 21 and the -three. In this case, even if the electrical contacts between the first and second electrical boards are misaligned, they can still be in contact with each other via the conductive boards 2-3. … Piece 2 2 allows a good electrical connection between the two to be applied to the present invention. ^ 2:: J :: = connected connection structure. Manufacture 2 〇 and-printed circuit board connection: structure:: f: H The structure of the joint structure 40 of the preferred embodiment of the roll-type carrier package is shown; according to Ming = Five, the top view of the joint structure 40 is shown. And understand the map, and the fifth 'Explanation of the invention (8) The next day s knot _ — fish Fr? Rm four pictures' LCD monitor sound crying gland sister board 4 2 circuit board bonding structure 2 〇 including-; board ": F device package bow area moves ..--support plate 4 3,-conductive parts 4 4 brush circuit horse film-type film carrying crying device 4; 4-LCD display p

UuUe 4 1 〇 is formed on its-side, and at least! Ϊ ,! 1

Uiude Plece) 4 workers in the opening-4 industrial and financial guides: 1 of-the surface protrudes outward 'and a plurality of first and opposite sides of the opening from the top brother 4 1 〇, and the opposite guide, 4 1 2 Yu Ding Lengyan 4 1 1 separated. The printed circuit board 4 2 is provided below the surface of the top plate 41 having the guide member 4. The seventh figure is a schematic bottom view of the printed circuit board 42. = ^ = 反 4 2-has a second opening 4 2 0 formed on one side thereof to close the first opening. 4, 1 0, and at least one pair of first guide holes (guide h. Two already 4 2 1 for receiving the guide 4 1 1 'and a plurality of conductive terminals 4 2 2 are formed here. The second opening 4 2 0 between the holes 4 2 1-the surface of the printed circuit board 4 2 on the non-contact top plate 41 and the plurality of second through holes 4 2 3 on the opposite sides of the second opening 4 2 0, and Spaced from the first guide hole 4 2 1 and aligned with the first through hole 4 1 2 of the top plate 41. The distance between the conductive contacts 4 2 2 is 0 ·, 3 mm. 0 The support plate 4 3 is provided on the printed circuit. The plate 4 2 has a conductive contact 4 2 2 below the surface. The supporting plate 4 3 has a third opening 4 3 0 corresponding to the second opening 4 2 0 and a slit 4 3 1 is provided at the corresponding conductive contact.

527860

V. Description of the invention (9) 4 2 2 / upright, opening 4 3 0 opposite side for receiving two pairs of second guide holes 4 3 2 in the third hole 4 3 3 in the third opening 4 3 4 1 1 and a plurality of third vias spaced apart and aligned with the second through-hole 4 = opposite side 'and are opposite to the second via 4 3 2 the conductive member 4 4 is provided on the supporting electric member 4 4 and has a plurality of conductive regions 4 3 of the slit 4 3 1 in. (Conductor) (not shown) on its surface: block (conductive Portions individual conductive contacts 4 2 2. conductive 2 electrically connected to the printed circuit board 4 2 4 4 2 distance. Conductive parts 4 ^, distance It is smaller than the conductive contact line (the conductive filamen may have a plurality of gold patterns on the surface, and the conductive member 44 is preferably a flexible element. Refer to the third A gold-plated filament): the surface has mineral gold Metal wires (the distance between them is 0.3 mm.) Silicon-like rubber elements. Gold-plated metal wires are under the holding plate 4 of the LCD driver. The sixth picture is glue: 5 Intent. Film carrier package 4 5 includes 5 and A liquid crystal display driver chip 452. Adhesive = bearing system is an insulating film layer, such as a polyethylenimide film layer: one of the crystal bearing driver chip 4 5 2 is a carrier; including a plurality of input leads 4 5 4 is formed away from the wafer support = 4 film carrier 4 5 丄 one side, and the complex J position is formed near the wafer bearing position 4 5 3 glue out bow 丨 another type of carrier 5. Description of the invention (10 )-Side 'and corresponding support plate 4 3 Third guide hole 4 5 6 Between the chip carrier m2 and at least one pair, it is used to accommodate the guide 4 丄 丄. The distance between the inputΰ 3 and the output lead 4 5 5 is larger than the conductive part: 22 = 4 5 4 and the output of each output The lead wires 4 5 5 can pass through the distance between the H blocks of the conductive part so that the conductive blocks connected to the printed circuit board 4 2-lead 4 4 are electrically conductive 4 5 4 and the output lead / r = jade contact 4 2 2. The input lead 6 is =:!:? Supports the film carrier package 4 5. The bottom plate 4 Hr is set to the roller carrier package 45 in its parts ... and a plurality of fourth through holes are provided for the storage guide 4 6 1 opposite Side and ^ = such as screw holes in the support plate 4 3 in the recess.-The groove 4 6 4 is formed in the recess 4 6 1 = the hole 4 3 3 is aligned between 2 'and is fitted with the film carrier seal accordingly. "Four guide holes 4 6 = 4 5 3. The grooves 4 6 4 enable the glue Hu ^ to be placed in the recess 4 64 of the bottom plate 4 6. ° σ 封 羞 4 5 is more stable with a plurality of retaining pieces (Not shown), the hole 4 1 2, the second through hole 4 2 3, and ^ pass through the-through 4 6 3 to fix the joint structure 4 0; or 2 3 and the fourth through hole 4 1 1 It is conducive to the top plate 4 丄, anti 4 1 guide film loading Device seal "5 and base plate support plate 43, V. Description of the invention (11) The accessor 1 of the present invention is a roll-type carrier seal Pei II, ^ 4 0 can promote the glue of the LCD monitor driver. The electrical connection of 4 5 5 can be printed to the external conductive terminal through the output lead of the printed second / bearing package 4 5. The conductive contact 4 2 2 of the anti-film 4 2 2 electrically coupled driver of the film type: mouth :: circuit board 4 2 'LCD display faUure analysisf I: 4 f can easily perform electrical inspection (film 4 of the driver of the display driver, Refining the bonding structure 40, the LCD display 4 2 repeatedly carries the electric load = 4 5 can pass through the printed circuit board. In addition, this liquid will not damage its output leads 4 5 5. Brush the thunder road; te 4 will be 9 ~ The bonding structure of the film carrier 4 of the Buje driver and the India > 丨 & s joint structure 4 0 can be adapted to use the following electrical detection method = _: The film carrier package of the Bu driver 4 5 Electrical properties • Yoshiko Yoshiko • Emission microscope fοr muitlplayer inspecti〇n (em [) detection method, electron beam detector (beam pr〇ber) detection method, and infrared beam induction Infra-red 〇ptical beam induced resistance change (IR-〇birch) detection method, etc. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention; Completed without departing from the spirit disclosed by the present invention Equivalent changes or modifications should be included in the following patent application fyj \ j. The diagram briefly explains the packaging intention: the film carrier connection structure of the traditional LCD display driver =: = the preferred embodiment The second electrical diagram A is a three-dimensional schematic diagram of the first piece of the present invention; the electrically conductive part of the electrical connection structure in the third part B is the electrically conductive part of the thirty-eighth picture of the present invention. The second C picture is the third a A schematic cross-sectional view; a schematic top view of the conductive component of the figure; the fourth figure is a liquid crystal display diagram of the film carrier package and electricity according to the present invention; two J: body embodiment; a three-dimensional exploded view of the circuit board bonding structure; The fifth figure is a schematic view of the bonding structure of the fourth figure; and the sixth figure is a schematic top view of the liquid of the present invention; the display of the film carrier package of the display m; the seventh figure is the bottom of the printed circuit board of the fourth figure of the bonding structure; schematic diagram

527860 The schematic representation of the main part of the symbol: 10 Film carrier package 11 Film insulation film layer 12 Input lead 14 Output lead 16 Chip carrying position 1 8 LCD driver chip 2 0 Connection structure 2 1 First circuit board 2 11 First conductive contact 2 2 Conductive part 2 2 2 2 0 Silicon rubber element 2 2 2 Conductive block 2 2 4 Forged metal wire 2 3 Second circuit board 2 3 3 Second conductive contact 4 1 Top plate 4 10 First opening 4 11 Guide 4 12 First through hole 4 2 Printed circuit board 4 2 0 Second opening 4 2 1 First guide hole 4 2 3 Second through hole

Page 527 860

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Claims (1)

6. The scope of the patent application structure: The film bearing of the driver is included. The bearing is an electrically connected circuit board with a package, which has a plurality of lightning conducting techniques.-Conductive parts, whose surface is equipped with electrical connections Point ::: Crystal display driver: two: conductive block; and ... flexible number of wheel out leads and multiple 侔 J-type carrier packages, the surface of which is the lead thru Qiu ○ wheel into the bow line;: film Type carrier package: η = $ and the liquid crystal display driver; " The distance between the conductive contacts and the blocks is smaller than the conductive blocks. The π electrical contact is electrically connected to these surfaces with a plurality of conductive metals :: The releasable conductive component is-^ till H12Λ '^ ^ n · ^ # ^ The surface has a plurality of the above-mentioned conductive Cui silicone rubber elements. G0ld —Plated fUaments: The electrical connection structure of the liquid crystal device package described in item 丨 of the patent. ; ^ 2 The film on the surface of the circuit board with these conductive contacts is provided with a 'Hai Sha roll-type carrier seal page 19 ^ 27860 VI. Application for a patent on the surface of the surface between. The film of the liquid crystal display driver described in item 4 of the formula ϊ s i ϊ range has an electrical connection structure, in which the above-mentioned conductive member is a strip-shaped flexible element having a plurality of metal wires. The electric connection structure of the film package of the liquid crystal display driver described in Item 5 of the Type 6 (I) patent scope, wherein the above-mentioned conductive member is 7, and a strip-shaped interchangeable element obtained by a plurality of mineral gold metal wires. ’Brush the circuit board. Τ 丄 切 I The electrical board is a printed 8. — a type of film carrier package (tape ca board joint structure, which includes ... rier packase) and the circuit — opening ί amp & Ϊ | # conductive f contacts On the surface and when the opening is on one side and adjacent to the conductive contacts, and a small surface "= hold: ;; = 路: = and other conductive contacts, the table and- = The 11th port-conducting ... electrical components are provided in the narrow part of the support plate, and the surface has a plurality of conductive blocks 5HV electrical component points, and the distance between these conductive blocks is short. Page 20 527860 6. Scope of patent application: a film carrier tape carrier package for liquid crystal display driver is mounted on the support handle, and the type carrier package includes a knee roll carrier (tape = 2 squares, the film crystal display) Driver wafer, the film carrier and the liquid position to carry the liquid crystal display driver wafer: the multi-layer carrier is located at the film carrier away from the wafer carrier, and the input lead and the output lead are located near the wafer carrying position Addiction ^ two and complex]: Opposite side and The narrow carrier of the board should be supported: the bow wire is electrically connected to the SJ road through the conductive blocks: each-the output point; and one conductive and one base board of the circuit board is used to carry the film type The bearing-recessed part is used to place the film carrier seal; the bottom plate has 9. If the patent application scope is the 8th board bonding structure, A in the upper, /: Ge film carrier package and circuit in the first-open ... The ΠΪ further includes at least a pair of first-guide holes in the second M, and the support plate further includes at least a pair of second guides, an opposite side of the opening and aligned with the channel ^ 丨 type carrier The package further includes a hole, the film and the output leading edge η #, and the ¥ 2 ¥ hole in the wafer bearing position further includes at least ″ and aligned with the second guide hole and the bottom plate three guide hole. Ν hole It is located in the recess and aligned with the film carrier package and circuit as described in Item 0 of the Patent Application Scope No. 527860 /, patent application scope __ $ = 合 结构 ', and also contains a pair of guides Pass through the ^: holes, the third guide holes and the fourth guide holes, the first The board, the roll-type carrier seal and the bottom plate are aligned with each other. 'The glue as described in item 8 of the scope of patent 4 = = dead structure' ... the circuit board described above is more packaged; the opposite side with the circuit °, The support plate further includes a plurality of-= s, and also includes a plurality of: a second one :: waiting for the first through hole, and a second second through hole of the bottom plate on the opposite sides of the recess, aligned with the = · The board is connected as described in the above application. ^ Wai / 11 The film carrier package spot electrical holes, the second through holes and the third through holes, the first through-hole solid edge joint structure. 1 3 · If applied The film plate joint structure described in item 8 of the patent scope, the above-mentioned bottom plate in # further includes 袈 and the circuit. The groove is correspondingly matched with the film-type carrier package = q recess. < The wafer carrying position 1 4 · The film-type, plate-bonding structure described in item 8 of the scope of patent application, further comprising a top plate disposed on the circuit: the package and the circuit have a third opening on one side of the top plate and Xianglu ^ fang, the top plate, and at least-the pair of guides are located in the third opening ;,-"Xuandi-the opposite side of the opening, these guides are Page 22 527860 VI. The scope of patent application extends from one surface of the top plate opposite to the electric plate, and passes through the first guide hole, the second guide holes, the third guide holes and the first : ° guide hole. 15. The bonding structure of the film carrier package as described in item 8 of the scope of the patent application, wherein the above-mentioned circuit board includes a printed circuit board. 16. The film carrier package as described in the scope of the patent application in item 8 In the board bonding structure, the above-mentioned conductive member is a surface; a flexible element that belongs to a line. 1 to 17 • The film-type road plate joint structure described in item 丨 6 of the scope of patent application, wherein the above-mentioned conductive component is a silicone rubber element with a surface of "human line." / Gold-plated gold 18 Including the joint structure of the film-type carrier package and the printed circuit board, the top plate is printed on the first plate, which has a first opening on one side and at least one opposite side of the first opening, and a pair of ¥ 件 丨 入 ～ The side facing the outer sleeve is a printed circuit board, which is located on the top plate with the guides ^ 1 out. The printed circuit board has a second opening on one side ^, under the surface-opening 'And at least one pair of first vias for receiving these :: one of the conductive contacts should be read on one side of the second opening and the re-brushed circuit board does not contact one surface of the top plate; The supporting board is provided on the printed circuit board with the conductive contacts. Page 23 527860 VI. Application scope of the patent. Below this surface, the second lead hole of the second pair of conductors is located at one of the electrical contact points; one conductive ... the opposite sides of the two openings are used to accommodate these conductive multiple conductive areas. ： Ίί: ϊ In the slit, the conductive part is square, and the glue is provided on the support plate ❻❻ 器 ϋW, and the film-type wide-type bearing H and-liquid crystal carry the liquid crystal display driver chip. ::-wafer bearing position 2 the wafer bearing position of the glue: type bearing It several input leads are located on the output lead are located near the wafer bearing i-side, and plural other-opposite sides, JM head should support The roll-on carrier of the board = greater than the conductive areas of the conductive parts: = = between the output leads ^ Out leads are connected through the conductive blocks so that each-the conductive contact, 卩And at least-paired with the circuit board of the brush circuit board and the bows of the wheels, for collection; the wafer carrier bottom plate is used to carry the film type bearing Type carrier package ¥ hole in the recess β for receiving the guides T 7Pair 19: The film-type carrier package and printing 527860 as described in item 18 of the scope of patent application, the scope of patent application -------- ---_ = circuit board bonding structure, among which the above-mentioned board person, Shao Nei , And correspondingly to the chip bearing position. 5 A groove is formed in the recess 20. The glue circuit board bonding structure described in item 8 of the patent application scope, wherein the above-mentioned conductive part type carrier package and a flexible element printed with a plurality of metal wires. It is a flexible component with a surface as described in 21. The film brush circuit board bonding structure as described in item 20 of the patent application range, wherein the above-mentioned conductive part is a flexible element carrying one and printed with a plurality of gold-plated metal wires. '·', The surface has a complex 22. The film-type hole described in item 18 of the scope of patent application is opposite to the-opening, and the printed circuit board further includes a complex =:? A through hole in the second opening Opposite sides, aligned with the first and the rain, the support plate further includes a plurality of third through holes at the third opening ^ = flush with the second through holes, and the bottom plate further includes a plurality of fourth The holes are on opposite sides of the recess and are aligned with the third through holes. ^ Za23. The bonding structure of the film carrier package and the brush circuit board as described in item 22 of the scope of the patent application, which further includes a plurality of retaining members passing through the first through holes, the second through holes, the Wait for the third through holes and the fourth through holes to fix the joint structure. Page 25 ---- '--- 1 527860 24 _ ^ 盥 禋 The use of the film carrier package m and the printed circuit board bonding structure described in item 18 of the patent application scope, wherein the above bonding structure The system is adapted to perform electrical inspection of the liquid crystal display driver wafer Λ * by using a radiation microscope (emi sslon micrscope f fr, mUltlplayer inspection) for pi layer inspection. 25 · The use of the bonding structure of a film carrier package and a printed circuit board as described in Item 18 of the scope of application for a patent, wherein the above bonding structure is suitable for an electron beam detector (elect r on-be am prober) ) Perform electrical inspection of the LCD driver chip. _ 2 6 · —The use of the bonding structure of the film carrier package and the printed circuit board as described in item 8 of the patent application scope, wherein the above bonding structure is suitable for infra-red induced resistance change method (infra-red optical beam induced resistance change). 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