TW521444B - Manufacturing method of organic planar light-emitting device - Google Patents

Abstract

A manufacturing method of organic planar light-emitting device is disclosed, wherein the organic planar light-emitting device comprises a transparent electrode plate, an organic electroluminescence layer and a metal cathode, the manufacturing method of organic planar light-emitting device comprises the following steps: a forming step of transparent electrode substrate, an isolation layer forming step, a hardening step, a forming step of organic electroluminescence layer and a metal cathode forming step, wherein the forming step of transparent electrode substrate is to form plural transparent anodes which are mutually separated on the transparent substrate; the isolation layer forming step is to form isolation layer around the transparent anode by the way of ink-jet printing; the hardening step is to harden the isolation layer to form the transparent electrode plate; the forming step of organic electroluminescence layer is to form an organic electroluminescence layer on the transparent electrode plate having a transparent anode and isolation layer formed; and the metal cathode forming step is to plate metal cathode on the organic electroluminescence layer.

Description

^^ 1444 V. Description of the invention (1) [Field of the invention] The present invention relates to a method for manufacturing a planar light-emitting device by using an inkjet printing method, and particularly a method for manufacturing a planar light-emitting device with a middle insulating layer Organic [Know-how] Source: First J: = fb High brightness, flatness, thinness, and energy-saving At present; electricity ... pole: Research ::: w (〇LED) became a general organic planar light-emitting device in Lu 2 The basic structure consists of 23 pots of organic light-emitting layer 22 and-metal cathode 2 = 212 transparent electricity: plate 21 further includes-transparent substrate 211, a plurality of f layers (lsolation a 213. The current stage is lithography Cheng Er must use the h) process to make the insulation layer, but it is easy to cause environmental pollution. First (StriPPer), during processing, the type: edge layer: There are three ways to make the structure, transfer coating "4 ί 3 = Γ solution as the insulating layer material, in a spin sequence to expose, bake, develop and bake Baking: Two: = The second method is to use a non-photoresist type polymer. The second coating 'baking method is made on a transparent substrate: m material, which is coated with a photoresist by rotation, baking, Exposure, display; 5 'successively, etch, photoresist, and photoresist removal

Page 4 521444 V. Description of the invention (2) and baking to make insulation * Shiyi type and photosensitive / non-photosensitive type hardening ° The third type is to use screen printing square material, the method is to present A special solution is used as an insulating layer material < $ 扣 liWk s /, a special screen is placed on the substrate, and an insulating layer structure is produced by printing light: heating). Change the crying type Erjiaxi: the plane light-emitting device and t, the machine used in the entire process is the type of Zhongxi I: p expensive, see the production chain half: shell and the right steps are complicated and time-consuming 'used in cost considerations Organic solvents and photoresist are not processed on environmental protection. The production of photomasks or screens increases the manufacturing cycle and cost of the product. [Summary of the Invention] The purpose of the present invention is to provide a method for manufacturing an organic flat light emitting device with low cost, fast and simple manufacturing process, short manufacturing cycle, and reduced environmental pollution.

To achieve the above object, the present invention provides a method for manufacturing an organic planar light-emitting device, wherein the organic planar light-emitting device includes a transparent electrode plate, an organic electroluminescent layer, and a metal cathode. The method for manufacturing an organic planar light-emitting device includes the following steps: a transparent electrode substrate forming step, an insulating layer forming step, a curing step, an organic electroluminescent layer forming step, and a metal cathode forming step. Wherein, in the step of forming the transparent electrode substrate, a plurality of transparent anodes separated from each other are formed on the transparent substrate; in the step of forming the insulating layer, an insulating layer is formed around the transparent anode by inkjet printing; in the curing step In order to form a transparent electrode plate, the insulating layer is cured. In the organic electro-excitation light layer forming step, a transparent layer is formed.

Page 521444 In the step of forming the cathode on the transparent electrode plate of the edge layer, 20% of an organic electroluminescent layer is used; 1) The technique of plating on the organic electroluminescent layer is only necessary for curing and curing. Significant reduction in size, V. Description of the invention (3) Ming anode and insulator and metal metal cathode. And the conventional transparent electrode plate ink printing method in a fixed area, and no time is required. Furthermore, the photoresist can be used as a printing plate, and it can not only have a large number of patterns in the field. The present invention is a marginal layer that uses three steps, such as alignment and printing, and does not blame complicated machines for lithographic processes, which causes environmental problems. Short manufacturing cycle and conformity to innovation. Using inkjet to form organic flat insulation materials can only be reduced, which can be saved without using. In addition, the product-like printing method without manufacturing costs can be used to form surface light-emitting devices. The steps on the special manufacturing process of spraying on the transparent substrate can reduce the production cost and time, use the developer, and eliminate the need for a photomask or screen. [It is preferable to use the organic flat reference method (SOI,), a detailed description of the embodiment of the formation of the transparent embodiment] The following will refer to the relevant drawings to explain a price according to an embodiment of the present invention. Surface light emitting device manufacturing method. The middle phase π π-from the time of the example Tan Gu *-/, τ the same elements will be represented by the same 5 tigers. Referring to FIG. 2 ′ a plugged female ground ^ type of organic planar light-emitting device 1 of this embodiment includes the following steps: a transparent retort basin ^ ^ cutting substrate formation step, an insulating layer formation step (S02 ), A curing step (s〇3 organic electro-excitation light layer forming step (S04) and a metal electrode step (S05). Among them, in the step of forming a transparent electrode substrate, a plurality of separated electrodes are formed on the substrate 111. Transparent anode 丨 2; In the layer forming step, the transparent anode is inkjet printed.

521444 V. Description of the invention (4) An insulating layer 1 1 3 is formed around 1 1 2; in the curing step, the insulating layer 丨 j 3 is cured to form a transparent electrode plate 1 1; in the step of forming an organic electroluminescent layer An organic electroluminescent layer 12 is formed on the transparent electrode plate 11 with the transparent anode 1 12 and the insulating layer 1 1 3 formed; and in the metal cathode forming step, the organic electroluminescent layer 12 is plated上 METAL Cathode 13. As shown in FIG. 3A, step S01 is performed on the transparent substrate 111 to form a plurality of transparent anodes 112. Here, the transparent substrate 1 1 1 may be a glass substrate, a plastic substrate, and a flexible substrate. Among them, the plastic substrate and the flexible substrate may be a polycarbonate (PC) substrate, a polyester (PET) substrate, a cyclic olefin copolymer (COC) substrate, and a metal chromium substrate. Material substrate a cyclic dilute copolymer (meta11ocene-based cyclic olefin copo1ymer, mCOC) substrate. The transparent anodes 112 are formed on the transparent substrate 111 by sputtering or ion plating, and then a transparent anode pattern is formed by lithography. At the same time, the transparent electrodes U 2 can also be formed. The strip-shaped transparent anodes 112 are separated from each other, as shown in FIG. 3B. The material of the transparent anode 11 2 may be indium tin oxide (I TO) or zinc aluminum oxide (eight 20), and its thickness is about 500 or more. As shown in FIG. 4A, in step S02, the insulating layer forming step is to form an insulating layer 113 on the transparent base plate 111 around the transparent anodes 11 2 separated from each other by inkjet printing. In the inkjet printing method in the step of forming the insulating layer, after aligning the areas around the transparent anodes 112, a

Page 7 521444

* Industrial △ net pattern V. Description of the invention (5) The inkjet head on mj / jv ejects the insulating material into an insulating layer 11 3. Please refer to FIG. 4B. The inkjet printing of the present invention is also any image sought by rm ”, such as text or not. Its advantages are that it does not require the use of a mask or screen M. Simple steps are required: You need to perform the complicated steps in the conventional technology to achieve the same effect. Among them, the 'insulating layer 113 is formed of a photosensitive polymer insulating material, which is used to define the size and area of the light source area, and It is used to avoid the non-uniform electric field generated at the edge of the transparent anode 112, which affects the service life of the element. Here, the thickness of the insulating layer 1 13 is greater than 0.05 micrometer, and its body resistance value is above 106ohni-Cm. And its characteristic size (line width / space) is more than 20 microns. Moreover, the size of the inkjet head and its shape vary with the size of the pattern to be printed and the properties of the filled insulating material, such as solution viscosity, The particle size is different. The alignment method used also changes with the required accuracy of the insulation layer pattern, for example: mechanical alignment has an alignment accuracy above 50 microns, and optical alignment has its alignment Accuracy above 1 micron In this embodiment, the photosensitive polymer insulating material may be photosensitive polyimide (PSPI), which is a photosensitive group introduced into the main structure of the polyimide to allow the polyimide to be simultaneously It has the characteristics of insulating layer and photoresist. Photosensitive polyimide can be divided into Ring Opened Negative Type PSPI (Rin§ Opened Negative Type PSPI) and Ring Closed Negative PSPI according to its molecular structure and reaction type.

521444 V. Description of Invention (6)

Type PSPI), Open Loop Positive PSPI (Ring 〇pened p〇sitive Type PSPI), and Closed Loop Positive Type Pspi (Ring Close Positive Type PSPI). Applying pspi in the process can shorten the process steps and save photoresistive materials And the photoresist process can help improve the process yield and reduce costs. As shown in FIG. 5, in step S03, it is used to cure the insulating layer 11 3 °. Since the insulating material has photosensitivity, it is cured by light exposure during the curing step of the insulating layer. Among them, an appropriate light (such as UV light) and an appropriate dose are used to cure the insulating layer 3 to form a transparent electrode plate 1 1. Referring to FIG. 6 again, in step S04, the organic electroluminescent layer is formed on the transparent electrode plate 丨 丨 formed with the transparent anode 112 and the insulating layer 113, and an organic electroluminescent layer 12 is formed. Among them, the organic electroluminescent layer 丨 2 is formed by a rhenium plating method, a spin coating method, an inkjet method, or a printing method. The light emitted by the organic electroluminescent layer 12 is blue, green, or red light. , White light, or other monochromatic light, and the thickness of the organic electro-excitation light layer 12 is about 500 times to 300 times; 丨. As shown in FIG. 7, in step s05, the metal cathode forming step is to form a metal cathode 13 on the organic electroluminescent layer 12. Among them, the metal cathode 13 is formed by a vapor deposition method or a sputtering method, and the material thereof may be aluminum, aluminum / lithium, calcium, magnesium: silver or silver, and has a thickness of about 5,000 to 5,000. The following is another embodiment of the present invention. Except for the insulating layer 3, which is formed of a photosensitive polymer insulating material, the remaining components and features are all

Page 9 1444 V. Description of the invention (7) The executions of corporal punishment are the same. As shown in FIG. 8, since the insulating layer 113 is a non-thermosensitive molecular insulating material, a margin is added during the curing step of the insulating layer.] Η 二 / 'is used to heat and cure the insulating layer at an appropriate temperature and time. . 113 to form a transparent electrode plate u, so as to form an organic planar light-emitting nozzle ink printing method can use a photomask or screen ^ a small amount of 嶋 material on the substrate to produce the required map〗 Ⅱ: Counting potential Therefore, the insulating layer on the transparent base plate can be effectively reduced from the design mode. Compared with the conventional technology, the use of ink-jet: I plane light-emitting devices reduces production costs and time, not to mention the production of clothing, clothing, and clothing, which not only avoids environmental pollution. As for the developer and the photoresist removing agent, the above are merely exemplary, and are not intended to limit the spirit and scope. Anything that does not depart from this disclosure is included in the scope of the attached patent application. Effective modification or change should include 521444 Simple description of the drawings [Simplified description of the drawings] Figure 1 is a schematic diagram of the structure of a general organic planar light-emitting device. FIG. 2 is a block diagram of a method for manufacturing an organic planar light emitting device according to this embodiment. 3A and 3B are schematic diagrams of the steps of forming a transparent electrode substrate in this embodiment. 4A and 4B are schematic diagrams of steps for forming an insulating layer in this embodiment. FIG. 5 is a schematic diagram of a curing step in this embodiment. FIG. 6 is a schematic diagram of the organic electro-excitation light layer forming step in this embodiment. FIG. 7 is a schematic diagram of a metal cathode forming step in this embodiment. FIG. 8 is a schematic diagram of a curing step according to another embodiment of the present invention. [Illustration of Symbols] 1 Organic planar light-emitting device 11 Transparent electrode plate 111 Transparent substrate 112 Transparent anode 113 Insulating layer 12 Organic electroluminescent layer 13 Metal cathode 2 Organic planar light-emitting device 21 Transparent electrode plate 22 Organic electroluminescent layer 23 Metal cathode

Page 11 521444 Brief description of drawings 211 Transparent substrate 212 213 Transparent anode Insulating layer ΗΪΙ Page 12

Claims (1)

521444 6. Application patent scope 1. A method for manufacturing an organic planar light-emitting device, wherein the organic planar light-emitting device includes a transparent electrode plate, an organic electroluminescent layer, and a metal cathode. The method for manufacturing an organic planar light-emitting device includes the following steps: A transparent electrode substrate forming step, forming a plurality of transparent anodes separated from each other on a transparent substrate; an insulating layer forming step, forming the insulating layer around the transparent anode shoulder by inkjet printing; a curing step, The insulating layer is cured to form the transparent electrode plate; an organic electroluminescent layer forming step of forming an organic electroluminescent layer on the transparent electrode plate on which the transparent anode and the insulating layer are formed; and a metal cathode forming step A metal cathode is plated on the organic electroluminescent layer. 2 · The method of manufacturing an organic flat light-emitting device as described in item 1 of the Shenjing patent scope, wherein the inkjet printing method in the step of forming the insulating layer is after aligning the areas around the transparent anodes with more than one inkjet. The ink head ejects the insulating material, and an insulating layer is formed around the transparent anodes. ， 心 ，， 3. The manufacturer of the organic flat light-emitting device according to item 1 of the 12 patent scope The transparent substrate is a glass substrate. Page 13 521444 6. Scope of patent application 4 · The method for manufacturing an organic flat light-emitting device as described in item 1 of the scope of patent application, wherein the transparent substrate is a plastic substrate. 5. The method for manufacturing an organic flat light-emitting device according to item 1 of the scope of patent application, wherein the transparent substrate is a flexible substrate. 6. The method for manufacturing an organic flat light-emitting device according to item 4 or 5 of the scope of application for a patent, wherein the transparent substrate is a polyester substrate. Manufacture of organic planar light-emitting device according to the item "If method 4 or 5 of the scope of patent application is applied, wherein the substrate is a polyimide substrate. The transparent substrate is-5 or of the organic flat-light-emitting device manufacturing 8" The first method of the scope, wherein the transparent substrate is a cycloolefin copolymer substrate, or the metal complex substrate of the organic planar light-emitting device described in item 5, a cycloolefin copolymer group) · If the fourth method of the scope of patent application, Wherein the transparent substrate is plate 0 Page 14 ^ 21444, patent application scope 10 · The manufacturing method of organic flat light-emitting device as described in item 1 of the patent application scope, wherein the transparent anodes are conductive metal oxide anodes. 11 · The method for manufacturing an organic planar light-emitting device according to item 10 of the scope of patent application, wherein the transparent anodes are indium tin oxide anodes. 12 · The beta method for manufacturing an organic flat light-emitting device as described in item 10 of the scope of patent application, wherein the transparent anodes are aluminum oxide anodes. 1 3 · The method for manufacturing an organic flat light-emitting device according to item 1 of the scope of patent application, wherein the transparent anodes are formed by a sputtering method. 1 4 · The manufacturing method of organic planar light-emitting device according to item 1 of the scope of patent application, wherein the transparent anodes are shaped by ion plating method. 15 · The organic method according to item 1 of the scope of patent application, wherein Cheng 0 plane lighting device manufacturer Page 15 521444 Circumstance 6. Application for Patent The thickness of these transparent anodes is more than 500 logic. 16. The method of manufacturing an organic flat light-emitting device according to item 1 of the patented scope of a.o-eye, wherein the insulating layer is a photosensitive polymer. 17 · The method for manufacturing an organic flat light-emitting device as described in item 1 of the Shenjing patent scope, wherein the insulating layer is a non-photosensitive polymer. 18 · The method for manufacturing an organic planar light-emitting device as described in item 1 of the Shenjing patent scope, wherein the thickness of the insulating layer is greater than or equal to 0.05 micrometers. 19. The method for manufacturing an organic flat light-emitting device as described in item 1 of the scope of patent application, wherein the volume resistance of the insulating layer is greater than or equal to 106 ohm-cm. 20 · The method for manufacturing an organic flat light-emitting device as described in item 1 of Shenqing's patent scope, wherein the characteristic size (line width / space) of the insulating layer is 20 micrometers or more. 2 1 · The manufacturer of organic flat light-emitting devices as described in item 2 of Shen Qing's patent scope Page 521 444 4 Alignment system is mechanical alignment, its alignment accuracy is above 50 microns 2 2 · Organic planar light-emitting device method as described in the second item of the patent scope of Shenyin, where the 5H alignment system is optical alignment , Its alignment accuracy is above 1 micron. 23. The method for manufacturing an organic flat light-emitting device according to item 2 of the Shen Qing patent scope, wherein the inkjet master includes more than one inkjet nozzle. 2 4 · The method for manufacturing an organic flat light-emitting device according to item 16 of the scope of patent application, wherein in the curing step, curing is performed by light exposure. 2 5 · The method for manufacturing an organic flat light-emitting device according to item 17 of the scope of patent application, wherein the curing step is cured by heating. 2 6 · The method for manufacturing an organic planar light-emitting device according to item 1 of the scope of patent application, wherein in the step of forming the organic electroluminescent layer, the organic electroluminescent layer is formed by a vapor deposition method. No. 17 S 521444 2 7 The manufacturer of organic planar light-emitting devices described in the patent application ^ 7 · As in the first method of the scope of patent application, in which the organic electroluminescent layer is in Formation of electromechanical excitation light layer / formation by spin coating method. 2 8 · The method for manufacturing an organic planar light-emitting device according to item 1 of the scope of patent application, wherein in the step of forming the organic electroluminescent layer, the organic electroluminescent layer is formed by an inkjet method. 29. The method for manufacturing an organic planar light-emitting device according to item 1 of the scope of patent application, wherein in the step of forming the organic electroluminescent layer, the organic electroluminescent layer is formed by a printing method. Q Λ, The method for manufacturing an organic planar light-emitting device according to item 1 of the scope of the patent application, wherein the thickness of the organic electro-excitation light layer is about 50 0 X to 5 00 0 |]. 31 • The method for manufacturing an organic flat light-emitting device according to item 1 of the scope of patent application, wherein the material of the metal cathode is aluminum. i Page 18 521444 VI Scope of patent application 32. The organic planar light-emitting device manufacturing method as described in item 1 of the scope of patent application, wherein the material of the metal cathode is aluminum / lithium fluoride (Al / LiF). 3 3 · The organic flat light-emitting device manufacturing method as described in item 1 of Shenyan's patent, wherein the material of the metal cathode is calcium. 34. The method of manufacturing an organic flat light-emitting device according to item 1 of the scope of the patent application, wherein the material of the metal cathode is magnesium: silver. 3 5 · According to the organic flat light emitting device method described in item 1 of the scope of patent application, the material of the metal cathode is silver. 3 6 · The organic planar light-emitting device potential & method as described in item 1 of the scope of patent application, which is used in the step of forming a metal cathode, which is shaped by evaporation method. The method for manufacturing an organic planar light-emitting device according to 1, wherein in the step of forming the metal cathode, the metal cathode is formed in a sputtering method. 521444 Page 20