五、創作說明（/ ) 一種以鑽石微粉製成的拋光片及其製法，以此方法得 到之拋光片，可直接進行對工件拋光。 尤一般而言，現今利用鑽石材料當工具，如磨輪等，已 ，遍的應用於研磨卫件，但，極精㈣拋光，如半導體的 晶片、電腦的硬碟或顯微鏡的鏡片等工件，目前卻仍使用 非鑽石磨料，例如A1203、S1C等，鑽石原料未被使用的主 要原因，❺了價格昂貴影響成本之外，最重要的是由於鑽 石太硬，所以容易於使用過程中刮傷元件，但，鑽石的硬 度其實是其當作磨料的優點’而會刮傷工件的主要原因是 因為鑽石外形不規則’所以具有銳角，此些銳角會因刺入 =件太深，以致於在工件上切削出鴻溝，造成工件的損 目前所使用的鑽石只有大於4〇〇篩目（400 u. s. 幾esh)(’t 37 m)者才有晶形，而小於400篩目的鑽石微粉 乎都是以較大顆粒的鑽石廢料壓碎所製成，而亦有極小 部份的鑽石微粉乃以爆炸法合成，這種鑽石因合成的時間 極短’晶粒來不及長出因此會形成如爆米花式的不規則形 狀這兩種鑽石微粉的晶粒形狀都很不規則，因此其表面 積很大’而且面質粗链’所以會吸附大量雜質 此類鑽石微粉抛光工件時，容易產生汙染，因此，大部份 H級的鑽石微粉不可避免的都有尖銳的突出處，另外， 由於大而扁的鑽石顆粒常會混在小而圓的鑽石粉末中，這 種有尖角的鑽石粗顆粒一般不易利用傳統的方法，在液體 中利用沉降速率的差異分出鑽石粗細，所以此類錯石不可 521013 C7 五、創作說明（V ) 避免的都包含有許多尖銳的突出處 因此，為了避免工件被鑽石所形成之銳角刮傷，所以 鑽石的粒度必須均勻，這樣每顆鑽石都能接觸到工件，它 們的壓力就會均衡，若每顆鑽石的晶形完整，沒有尖銳突 出的部份，則沒有局部產生高壓刺入的危險，所以不虞有 工件刮傷。 本發明者有鑑於前述習用之拋光方法，在製備材料以 及實際應用上確有易損傷工件之缺點存在，而+以重新發 明，即利用化學氣相沉積法（Chemical 乂叩沉Dep〇siti〇n， CVD)，得到晶形完整且顆粒度均一之鑽石微粉，將此類鑽 石微粉埋入底材之表面，使其表面平坦，以此直接進行拋 由於/、表面並無鑽石光銳的突出處，因此，可使鑽石 之壓力平均分佈於工件上，不致刮傷精密的工件。 a /為了可達到前述的創作目的，本創作所運用的技術手 段係在於提供一種以鑽石微粉製備拋光片之方法，準備一 ^材；將粒度小於5 Q/zm之鑽石微粉’或其與可溶解物 質之混合物，將之以薄層形態平鋪於底材之一側； 將一硬質平面遷附在薄層相對於底材之另側，使突出. 之鑽石微粉喪入底材中； 將未嵌人之鑽;5微粉及可溶解物質以相對應之溶劑溶 解並以水洗滌移除； 將硬質平面壓合至底材表面，使已我合之鑽石微粉壓 入底材中。V. Creation Note (/) A polishing sheet made of diamond micropowder and its manufacturing method. The polishing sheet obtained in this way can directly polish the workpiece. In general, diamond materials are currently used as tools, such as grinding wheels, etc., which have been widely used in grinding of guards, but extremely fine polishing, such as semiconductor wafers, computer hard disks or microscope lenses, etc., currently However, non-diamond abrasives are still used, such as A1203, S1C, etc. The main reason for not using diamond raw materials is the high price and the cost. The most important thing is that the diamond is too hard, so it is easy to scratch the components during use. However, the hardness of the diamond is actually its advantage as an abrasive, and the main reason for scratching the workpiece is because the diamond is irregular in shape, so it has acute angles. These acute angles will be penetrated = the piece is too deep, so that it is on the workpiece. Cutting the gap and causing damage to the workpiece. At present, only diamonds larger than 400 mesh (400 us several esh) ('t 37 m) have a crystal form, while diamond powders smaller than 400 mesh are almost larger. Granular diamond waste is crushed, and a small part of diamond fine powder is synthesized by explosive method. This kind of diamond is formed because the time of synthesis is extremely short. The grain shape of these two kinds of diamond micropowders with irregular shapes is very irregular, so the surface area is very large, and the surface is thick, so they will absorb a large amount of impurities. Such diamond micropowders are easy to cause pollution when polishing workpieces. Therefore, most of the H-level diamond powders inevitably have sharp protrusions. In addition, because large and flat diamond particles are often mixed in small and round diamond powders, such rough diamond particles with sharp corners are generally not easy. Using the traditional method, the thickness of the diamond is separated by the difference of the sedimentation rate in the liquid, so this type of wrong stone cannot be 521013 C7. V. Creation Instructions (V) Avoid many sharp protrusions. Therefore, in order to avoid the workpiece from being diamond The sharp corners formed are scratched, so the grain size of the diamond must be uniform, so that each diamond can contact the workpiece, and their pressure will be balanced. If each diamond's crystal form is complete and there are no sharp protruding parts, there will be no local production. Danger of high-pressure penetration, so there is no risk of workpiece scratches. In view of the aforementioned conventional polishing method, the present inventor does have the disadvantage of easily damaging the workpiece in the preparation of materials and practical applications, and + re-invented, that is, using the chemical vapor deposition method (Chemical DepOsiti〇n) , CVD), to obtain diamond fine powder with complete crystal form and uniform particle size, burying such diamond fine powder on the surface of the substrate to make the surface flat, so as to directly throw, because there is no sharp protrusion of the diamond on the surface, Therefore, the pressure of the diamond can be evenly distributed on the workpiece, and the precision workpiece will not be scratched. a / In order to achieve the aforementioned creative purpose, the technical means used in this creation is to provide a method for preparing polishing pieces with diamond fine powder, prepare a material; use diamond fine powder with a particle size of less than 5 Q / zm 'or its equivalent. The mixture of dissolved substances is tiled on one side of the substrate in the form of a thin layer; a hard plane is relocated to the other side of the thin layer relative to the substrate to make the diamond fine powder protruding into the substrate; Uninserted diamond; 5 micronized powder and soluble substance are dissolved in the corresponding solvent and washed and removed with water; the hard plane is pressed onto the surface of the substrate, and the fine diamond powder is pressed into the substrate.
本紙張尺度翻帽㈣鮮（cns)aJ 規格（2]〇χ 297公釐） --------------裝--- (請先閱讀背面之注意事項再填寫本頁). 訂-· -線 、創作說明（） 所述之以鑽石微粉製備拋光片之方法，其鑽石微粉具 有晶形。 、所述之以鑽石微粉製備拋光片之方法，其可溶解物質 為食鹽、糖、石灰石或塑膠粒。. ， 所述之以鑽石微粉製備拋光片之方法，其溶劑為水、 酸液或丙銅。 … 所述之以鑽石微粉製備拋光片之方法，其底材由塑膠 或金屬製成。 所述之以鑽石微粉製備拋光片之方法，其鑽石微粉以 化學氣相沉積法製得。 所述之以鑽石微粉製備拋光片之方法，其鑽石微粉的 直徑差異小於50%。 所述之以鑽石微粉製備拋光片之方法，其硬質平面為 不鏽鋼或玻璃板。 · 以上述方法所製成的拋光片，其中拋光片包括一底材 及數鑽石微粉，鑽石微粉乃固定在底材之嵌入表面，並與 其近似同一平面。 所述之拋光片，其中拋光片之鑽石微粉嵌入表面鋪設 有一薄層保護膠膜。 所述之拋光片，其中拋光片乃用以拋光硬碟、晶圓及 光纖。 所述之以鑽石微粉製備拋光片之方法，其鑽石微粉可 為立方氮化硼。 所述之拋光片，其中拋光片之鑽石微粉可為立方氮化 ^1013 C7 、創作說明（（^ ) ο ^為使貴審查委員可確實了解本案之構造裝置，及其 匕創作目的與功效，以下茲舉出一具體實施例，並配合圖 式詳細說明如下： (一）圖式部份： 第一圖係為本發明之剖面圖。 第二圖係為本發明之另一成品圖。 第二圖係為本發明之流程圖。 (一）圖號部份 (1 0)底材 (2 1 )可溶解物質 (3 0 )硬質平面 (Β)鋪設薄層 (D)清洗 法，參看第 再鋪設 本紙張尺度適用中國國家標準（CNS)A4規格⑵0 X 297公着） 請 先 閱 讀 背 面 之 注 意 事 項 再 .5裝 本· 頁 (2 0 )薄層 (22)鑽石微粉 (Α)準備底材 (C)加壓 (Ε)二次加壓 本务明之以鑽石微粉製成的拋光片及其製… ^圖所示，首先準備底材（Α)，準備一底材（1 〇) 薄層（Β) ’即將利用化學氣相沉積法，得到之鑽石微粉（2 2 )’與可溶解物質（2 i )混合’上述之可溶解物 . 1 )可為食鹽、糖、石灰石或_粒#，再以到刀將上述 之鑽石微粉（2 2 )與可溶解物f ( 2丄）混合物，於上 述之底材（1 0 )上舖成乾式薄層（2 Q )，然後再進行加 昼（C)’以-拋光的硬質平面（3Q)，其材質如不錄 鋼、玻璃板等，輕壓上述薄層（2 〇 )，使此硬質平面（3 〇)底部接觸到之薄層（2〇) +突出鑽石微粉（22) 訂 線 五、創作說明（f ;) ㈣分，因所施之虔力而使突出之鑽 底部之底材（1〇)内，如此，與硬質平面=(20) 之薄声ί 9 η、工 ”炅貝十面（3 〇 )貼附 曰 ）面，其表面則為平整形態，這時再進行、、主 ;⑻步驟，將薄層（20)中之未 微似)及可溶解物質⑴）倒掉，並把： 沖洗^ 對溶解上述可溶解物質（21)的溶劑加以 水、酸液、及丙銅等等，無論此“用何種 ^取後皆需以水再做沖洗，接著再做二次加遷⑻，以 :=(30)將部份嵌入底材（1〇)令的鑽石完全 讀（1◦) 0，並配合將底材（1 Q )平敷使其密 4此硬質平面（30)上’使鑽石微粉（22)僅略凸 出於底材（1 〇 )，與其近似同一平面。 由於利用化學氣相沉積法得到之鑽石微粉（2 2 )，因 j其生長緩慢’所以可使得到的鑽石晶形完整且顆粒度均 一 ’再配合傳統利用沉降分級則可得到較習用更為均勻之 鑽石微私（2 2 )，且在使用時除了選用粒度小於5 〇以肌 之鑽石微粉外，其中最大之鑽石微粉（2 2 )與最小之鑽 錢粉（2 2)其直徑差異亦不超過5〇%，使其粒度盡 量統-，上述之鑽石微粉（2 2 )可為立方氮化侧。 上述的可/谷解物質（2 1 )乃用以控制鑽石微粉（2 2 )的間距亦即其集中程度’由於鑽石微粉（2 2 )顆粒 不大’而且底材（1 〇)材質柔軟，因此鑽石嵌入處局部 可能稱為變形，但並不會影響其平整程度，因此，產品的 切013 C7 D7 五、創作說明（厶 平垣度即與壓膜 面之硬質平面（30)相同。 本發明之方法所置得之拋光片，參看第二圖所示，其 基材為-底材（1 〇 )，於上述底材(1 〇)之一面有間隔嵌 有鑽石微粉（2 2 )，使鑽石微粉（2 2 )與底材（丄〇 )八 形成一平面，亦可在鑽石微粉2)嵌入的底材表面，再 塗佈一極薄層的保護膠膜（圖上未標示），用以加強保護。 比 的 、本發明之方法的優點之製程極為簡單，且不需分散劑 及潤濕劑處理鑽石粉末，因此節省成本，更重要的是所有 鑽石不論大小其頂部都會在同一高度，與習用之方法 較，習用的刮刀成形法膠的頂面平整，但其内所含鑽石 回度邠會芩差不齊，因此，拋光時更不會刮傷工件。 可 電 此法亦可用於取代電鍍製法的拋光盤，此時的底材 用不2鋼片，或甚至鋁片，取代底材。這個方法不僅比％ 鍍法簡單快速而且沒有環保問題，更重要的是鑽石的平二 $距可以δ周整，習用之電鑛法鑽石會靠在一起使集中度過 另，上述之方法乃製成一單層的拋光墊，亦可將其混 ^金屬或树脂製成具有多層鑽石微粉的拋光體，如磨輪 等。 同 、綜上所述，本發明之以鑽石微粉製成的拋光片及其製 法可用於抛光晶圓及其他高附加價值的產口口口，如硬碟、 磁頭及光纖等’這種鑽石微粉因不具銳角，因此不會到傷 521013 C7 _D7_ 五、創作說明（j ) 晶圓，若以此鑽石微粉嵌入塑膠片可直接拋光晶圓’而這 項新技術可突破目前不能以鑽石直接拋光晶圓的瓶頸而使 半導體的製程更上層樓。 (請先閒讀背面之注意事項再填寫本頁) 裝 -線 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）This paper size flip cap (cns) aJ specifications (2) 〇χ 297 mm) -------------- installed --- (Please read the precautions on the back before filling in this Page). Order-· -line, creation instructions () The method of preparing polishing tablets with diamond powder, the diamond powder has a crystal form. 2. The method for preparing a polishing sheet using diamond powder, wherein the soluble substance is salt, sugar, limestone or plastic granules. In the method for preparing a polishing sheet with diamond fine powder, the solvent is water, acid solution or copper propylene. … The method for preparing polishing sheet with diamond powder, the substrate is made of plastic or metal. In the method for preparing a polishing sheet using diamond fine powder, the diamond fine powder is prepared by a chemical vapor deposition method. In the method for preparing a polishing sheet using diamond fine powder, the diameter difference of the diamond fine powder is less than 50%. In the method for preparing a polishing sheet using diamond fine powder, the hard plane is stainless steel or glass plate. · The polishing sheet made by the above method, wherein the polishing sheet includes a substrate and several diamond micropowders, and the diamond micropowders are fixed on the embedded surface of the substrate and are approximately on the same plane. In the polishing sheet, the diamond fine powder of the polishing sheet is embedded with a thin protective film on the surface. In the polishing sheet, the polishing sheet is used for polishing a hard disk, a wafer, and an optical fiber. In the method for preparing a polishing sheet using diamond fine powder, the diamond fine powder may be cubic boron nitride. The polishing sheet, in which the diamond fine powder of the polishing sheet can be cubic nitride ^ 1013 C7, creation instructions ((^) ο ^ ^ In order for your review committee to understand the construction device of this case, and its purpose and effect, The following is a specific embodiment and detailed description in conjunction with the drawings: (1) Schematic part: The first figure is a cross-sectional view of the present invention. The second figure is another finished product of the present invention. The second figure is the flow chart of the present invention. (1) Part of the drawing (1 0) Substrate (2 1) Soluble substance (3 0) Hard surface (B) Laying a thin layer (D) Cleaning method, see section Lay this paper to apply the Chinese National Standard (CNS) A4 specification (0 X 297). Please read the precautions on the back first. 5 Pack this book · Page (2 0) Thin layer (22) Diamond powder (Α) Prepare the bottom (C) Pressing (E) Secondary Pressing This is a polishing sheet made of diamond micropowder and its production ... ^ As shown in the figure, first prepare the substrate (A), prepare a substrate (1 〇) thin Layer (B) 'the diamond fine powder (2 2) to be obtained by chemical vapor deposition method' is mixed with the soluble substance (2 i) 'The above-mentioned solubles. 1) may be table salt, sugar, limestone or grain #, and then the above-mentioned substrate is a mixture of the diamond fine powder (2 2) and the soluble f (2 丄) to the knife. (1 0) Lay a dry thin layer (2 Q), and then add day (C) 'to-polished hard plane (3Q), the material of which is not steel, glass plate, etc., lightly press the above thin layer (20), so that the thin layer (20) + the protruding diamond fine powder (22) is brought into contact with the bottom of this hard plane (30). Make the inside of the substrate (10) at the bottom of the protruding drill so that it is attached to the thin surface of the hard plane = (20) ί 9 η, the tenth surface (30) attached to the surface, and its surface is Flatten the form, and then perform the steps of 、 and ⑻ to pour out the thin layer (20) and the soluble matter ⑴), and rinse: ^ For the solvent in which the soluble matter (21) is dissolved Add water, acid solution, copper propylene, etc. No matter what kind of ^ you use, you need to rinse it with water, and then do a second addition and relocation, insert part into the substrate with: = (30) (1 〇) Let the diamond read completely (1◦) 0, and cooperate to flatten the substrate (1 Q) to make it dense. 4 On this hard plane (30), 'make the diamond fine powder (22) only slightly protrude from the substrate (1 〇), approximately the same plane. Because the diamond fine powder (2 2) obtained by chemical vapor deposition method has slow growth, it can make the obtained diamond crystals complete and uniform in grain size. When combined with the traditional use of sedimentation grading, it can be more uniform than conventional ones. Diamond micro-private (2 2), in addition to using diamond fines with a particle size of less than 50, the diameter difference between the largest diamond micro-powder (2 2) and the smallest diamond micro-powder (2 2) does not exceed 50%, to make the particle size as uniform as possible, the above-mentioned diamond fine powder (2 2) can be a cubic nitrided side. The above-mentioned disintegratable substance (2 1) is used to control the spacing of the diamond fine powder (2 2), that is, its concentration degree 'because the diamond fine powder (2 2) has small particles' and the material of the substrate (1 〇) is soft, Therefore, the part where the diamond is embedded may be called deformation, but it will not affect its flatness. Therefore, the product is cut 013 C7 D7. 5. Creation instructions (the flatness is the same as the hard plane (30) of the film surface. The present invention As shown in the second figure, the polishing sheet obtained by this method has a substrate of-substrate (10), and diamond fine powder (2 2) is embedded in a space on one side of the substrate (10), so that The diamond fine powder (2 2) forms a flat surface with the substrate (丄 〇). It can also be coated on the surface of the substrate where the diamond fine powder 2) is embedded, and then coated with a very thin layer of protective film (not marked on the picture). To strengthen protection. Compared with the advantages of the method of the present invention, the manufacturing process is extremely simple, and no dispersant or wetting agent is needed to process the diamond powder, so the cost is saved, and more importantly, all diamonds have the same height at the top, regardless of the size. In comparison, the top surface of the conventional doctor blade molding method is flat, but the diamonds contained in it will be uneven, so the workpiece will not be scratched during polishing. This method can also be used to replace the polishing disc of the electroplating method. In this case, the substrate is replaced by a steel sheet or even an aluminum sheet. This method is not only simpler and faster than the% plating method, but also has no environmental protection problems. What's more important is that the diamond's flat square distance can be adjusted by δ. Conventional electro-mineral diamonds can be brought together to make the concentration go through. To form a single-layer polishing pad, it can also be mixed with metal or resin to make a polishing body with multiple layers of diamond powder, such as a grinding wheel. As mentioned above, the polishing sheet made of diamond micropowder according to the present invention and the manufacturing method thereof can be used for polishing wafers and other high value-added products such as hard disks, magnetic heads, and optical fibers. Because it does not have sharp angles, it will not hurt 521013 C7 _D7_ V. Creative Instructions (j) Wafer. If this diamond micro-powder is embedded in the plastic sheet, the wafer can be polished directly. Round bottlenecks make the semiconductor process even higher. (Please read the precautions on the back before filling in this page) Packing-thread This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)