JPH0911119A - Pad for polishing glass plate, and method for polishing the same - Google Patents

Pad for polishing glass plate, and method for polishing the same

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Publication number
JPH0911119A
JPH0911119A JP10161296A JP10161296A JPH0911119A JP H0911119 A JPH0911119 A JP H0911119A JP 10161296 A JP10161296 A JP 10161296A JP 10161296 A JP10161296 A JP 10161296A JP H0911119 A JPH0911119 A JP H0911119A
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Prior art keywords
surface
polishing
glass plate
sheet
high molecular
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JP10161296A
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Japanese (ja)
Inventor
Toru Iseda
Yoichi Ozawa
徹 伊勢田
洋一 小沢
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Asahi Glass Co Ltd
旭硝子株式会社
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Abstract

PROBLEM TO BE SOLVED: To manufacture a polishing pad for polishing the surface of a glass plate which can effectively remove the undulation and ruggedness of the surface by forming in a specified pitch grooves with a specified width in a main region of the surface of a high molecular sheet having a specified Young's modulus. SOLUTION: A polishing pad to polish a glass substrate for a liquid crystal display, photomask or the like has a high molecular sheet 1 bonded through a double-sided adhesive tape 6 to a surface table 5 and formed on the surface with grooves 2. On the high molecular sheet is disposed a glass plate 4 hold by a soft sheet with a frame 7 bonded similarly to the surface table 5. Then, the high molecular sheet 1 has at least IGPa of Young's modulus and 0.5-1.0mm of the thickness measured on the basis of the material testing standard. The sheet 1 used is formed on a main region of the surface with grooves having 0.1-0.2mm of width and spaced from each other by a pitch of 1-10 times the groove width and uses for example polypropylene resin, hard vinyl chloride.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、液晶ディスプレイ用ガラス基板、フォトマスク用ガラス基板、磁気ディスク用ガラス基板等の表面を研磨するためのガラス板研磨用パッドおよびそれを用いたガラス板の研磨方法に関する。 The present invention relates to a glass substrate for a liquid crystal display, the polishing of the photo glass substrate for a mask, a glass plate polishing pad and for polishing the surface of a glass substrate for a magnetic disk glass plate using the same a method for.

【0002】 [0002]

【従来の技術】液晶ディスプレイ等に使用されるガラス板の火造り面は完全な平滑面ではなく、多少のうねり、 Fire-polished surface of the Related Art glass plate to be used in a liquid crystal display or the like is not a complete smooth surface, some of the swell,
マイクロコルゲーションや凹凸、傷を有している。 Micro corrugation and uneven, has a flaw. また、ブロック状のガラス塊からスライス加工により切り出されるガラス板も多くのうねりや凹凸、傷を有している。 Also, the many glass plates are cut out by slicing the block-like glass gobs waviness or irregularities, has a wound. そのため、これらのガラスは研磨により平滑な鏡面に加工される場合が多い。 Therefore, in many cases these glasses to be processed into a smooth mirror by polishing.

【0003】しかし、これらの製品に占める研磨加工コストの割合は大きい。 [0003] However, the proportion of polishing cost as a percentage of these products is large. その削減のために、フロート法ガラス板成形法におけるマイクロコルゲーションの低減策、うねり変形の少ないフュージョン法の開発、高い表面品質が得られる精密プレス成形法等が提案され、開発されてきたが、研磨工程を省略できるまでには至っておらず、依然として研磨コストの比率は高い。 Because of its reduced, measures to reduce the micro corrugation in the float glass plate forming method, the development of small waviness deformation fusion process, is proposed a high surface quality precision press molding method and the like obtained, have been developed, polished step not reached the stage can be omitted, still the ratio of the polishing cost is high.

【0004】研磨コストが大きくなる一つの原因は、ガラス板表面を、除去したい凹凸の高低差の何倍も研磨除去しなくてはならないためである。 [0004] cause of one of the polishing cost becomes large, the glass plate surface, many times the height difference of the irregularities to be removed in order that must be polished away. 例えば、振幅が0. For example, the amplitude is 0.
5μmで周期が10mmである緩やかなうねりを0.1 The gentle undulations period is 10mm in 5 [mu] m 0.1
μmにまで減らすには、酸化セリウムを含浸した硬質発泡ポリウレタンパッドと酸化セリウムを含む研磨液を用いて研磨を行った場合、表面層を平均5μmも研磨して除去しなければならなかった。 To reduce to the [mu] m, when performing polishing using a polishing liquid containing rigid polyurethane foam pad and cerium oxide impregnated with cerium oxide, average 5μm The surface layer also had to be removed by polishing.

【0005】また鋳鉄定盤と#1500番のカーボランダムを含む研磨液を用いた研磨では、平均2μmの研磨除去を行った後、カーボランダム粉によって形成されたマイクロクラックを除去するため、さらに酸化セリウムによる研磨が必要であり、酸化セリウムによる4μmの研磨も含め合計6μmの研磨除去が必要であった。 [0005] In polishing using a polishing liquid containing carborundum cast iron plate and # 1500 No., after polishing removal average 2 [mu] m, for removing micro-cracks formed by carborundum powder, further oxidation It requires polishing by cerium, polishing and removing a total of 6μm including polishing of 4μm by cerium oxide is required.

【0006】このように、比較的に緩やかなうねりについて、効率的に、僅かの研磨量で除去するとともに、厚み偏差、表面粗さを十分に小さくすることは難しかった。 [0006] Thus, the gentle undulations relatively, efficiently, thereby removing a slight amount of polishing, it is difficult to sufficiently reduce the thickness deviation, a surface roughness.

【0007】 [0007]

【発明が解決しようとする課題】本発明の目的は、従来技術が有していた前述の欠点の解消にある。 An object of the present invention is to provide a, lies in eliminating the aforementioned drawbacks the prior art has had. すなわち、 That is,
少ない研磨量で周期3〜30mm程度の表面のうねり、 Surface waviness period of about 3~30mm a small polishing amount,
凹凸を効率的に除去し、かつ十分に小さい厚み偏差および表面粗さを得るためのガラス板研磨用パッドおよびガラス板の研磨方法を提供することを目的とする。 Unevenness was efficiently removed, and an object of the invention to provide a method of polishing a glass plate polishing pad and the glass plate to obtain a sufficiently small thickness variation and surface roughness.

【0008】 [0008]

【課題を解決するための手段】本発明は前述の課題を解決すべくなされたものであり、材料試験規格に基づいて測定されたヤング率が1GPa以上で厚さが0.5〜1 The present invention SUMMARY OF] has been made to solve the problems described above, the measured Young's modulus based on the material testing standard thickness at least 1 GPa 0.5 to 1
0mmの高分子シートからなり、表面の主要な領域に幅0.1〜2.0mmの溝が溝幅の2〜10倍のピッチで形成されていることを特徴とするガラス板用研磨パッドを提供する。 It consists 0mm polymeric sheet, a polishing pad for a glass plate, wherein a groove width 0.1~2.0mm major regions of the surface are formed by 2 to 10 times the pitch of the groove width provide.

【0009】また、裏面を軟質シートを介して固定保持したガラス板の表面を上記のガラス板用研磨パッドで研磨するガラス板の研磨方法を提供する。 Further, to provide a polishing method for a glass plate for polishing the surface of the glass plate back surface of the fixed holding through the soft sheet in the polishing pad glass plate above.

【0010】以下、図面に従って本発明のガラス板研磨用パッドについて説明する。 [0010] Hereinafter, the glass plate polishing pad of the present invention will be described with reference to the accompanying drawings. 図1において、1は高分子シート、2は溝、3は軟質シート、4はガラス板、5は定盤、6は両面粘着テープ、7はガラス板を保持するための枠である。 In Figure 1, 1 is a polymer sheet, 2 is groove, 3 soft sheet, 4 a glass plate, 5 platen 6 is double-sided adhesive tape, and 7 denotes a frame for holding the glass plate.

【0011】本発明の構成要素である高分子シート1 [0011] The polymeric sheet 1, which is a component of the present invention
は、材料試験規格に基づいて測定された値が1GPa以上のヤング率を有する樹脂であり、ある程度の耐熱性と耐アルカリ性のあるものが好ましい。 The value measured on the basis of the material testing standard is a resin having the above Young's modulus 1 GPa, preferably those with a certain degree of heat resistance and alkali resistance. 例えば、ポリプロピレン樹脂、硬質塩化ビニル樹脂、ポリカーボネート樹脂、メタクリル樹脂、ポリアセタール樹脂などが使用できる。 For example, polypropylene resin, hard vinyl chloride resins, polycarbonate resins, methacrylic resins, such as polyacetal resin.

【0012】ヤング率が1GPa未満の高分子シートでは、周期3〜30mm程度のうねりに対して凹凸の形状に応じて変形しやすく、かかるうねりの凸部に集中的な加工力が働きにくいため、うねりを効果的に取り除くことができない。 [0012] Since the polymer sheet less than Young's modulus 1 GPa, easily deformed according to the shape of the irregularities with respect to waviness period of about 3 to 30 mm, intensive processing force to the convex portion of such waviness is hard work, it is not possible to remove the swell effectively. なお、ここでいうヤング率は、JISやASTMなどの材料試験規格に基づいた値である。 Incidentally, the Young's modulus referred to herein is a value based on the material testing standards such as JIS or ASTM. 実際に研磨が行われるような加圧下では、弾性率は変化する場合がある。 The pressure as actually grinding is carried out, it can vary the elastic modulus. たとえば、ヤング率は1桁以上低い場合もあり得る。 For example, Young's modulus can be also an order of magnitude or more lower.

【0013】高分子シート1の厚さは、0.5〜10m [0013] The thickness of the polymer sheet 1, 0.5~10m
mとされるが、さらには1〜5mmとすることが、溝加工を施す際に必要な剛性と、研磨定盤に貼付け、剥離する際に必要な柔軟性の点から望ましい。 Although are m, more it is 1 to 5 mm, and rigidity necessary for grooving, Paste on the polishing table, desirable from the viewpoint of flexibility required when peeling. また、溝2の幅を0.1〜2mmとすることにより、研磨液の流れを良くし、研磨速度を高いレベルに確保できる。 Further, with the 0.1~2mm the width of the groove 2, to improve the flow of the polishing liquid can be ensured polishing rate to a higher level. さらに、溝2のピッチを溝幅の2〜10倍とすることにより、研磨速度を高いレベルに確保できる。 Further, the pitch of the grooves 2 by 2 to 10 times the groove width can be ensured polishing rate to a higher level. また、溝は直線でも曲線でもよく、平行に形成しても、格子状や菱形状に形成してもよい。 The groove may be curved in a straight line, even formed in parallel, it may be formed in a lattice or diamond-shaped.

【0014】なお、溝2の深さは、研磨液の流れを良くする点から0.1mm以上とすることが望ましい。 [0014] The depth of the grooves 2, it is desirable to 0.1mm or more from the viewpoint of improving the flow of the polishing liquid.

【0015】一方、本発明の高分子シート1の代わりに、鋳鉄やアルミニウムなどの金属定盤を用いた場合は、溝の加工が困難になるうえ、溝の周縁にバリを生じやすく、傷の原因になる。 Meanwhile, instead of the polymer sheet 1 of the present invention, in the case of using a metal plate such as iron or aluminum, after which machining of the grooves is difficult, easily burrs on the periphery of the groove, wound cause. この点で本発明の高分子シートは、金属定盤に比べて優位性が高い。 Polymeric sheet of the present invention in this regard is highly advantages over metal plate.

【0016】高分子シートは、面内の厚さが不均一であったり面内の平坦度が不十分な場合がある。 The polymeric sheet may flatness is insufficient in a non-uniform thickness or surface in the plane. したがって、表面の凸部を遊離砥粒によるラップ研磨あるいは砥石による研削などの機械的手段を用いて平坦化してもよい。 Thus, mechanical means such as grinding the convex portion of the surface by lapping or grinding by free abrasive grains may be planarized using.

【0017】軟質シート3はガラス板4の裏面側を吸着保持するためのものである。 The soft sheet 3 is intended for attracting and holding the back surface side of the glass plate 4. 軟質シート3としては、軟質ゴム、軟質の発泡ポリウレタン樹脂、または発泡ポリエチレン樹脂および発泡なしの軟質ポリエチレン樹脂等が使用できる。 The soft sheet 3, soft rubber, soft polyurethane foam resin or a foamed polyethylene resin and without blown flexible polyethylene resins can be used. 軟質シートの厚さを0.5〜2mm、好ましくは0.8〜1.5mmとすることが、大きい周期の凹凸の形状に応じて変形し、小さい周期の凹凸の形状に応じて変形しないために望ましい。 The thickness of 0.5~2mm of soft sheet, since preferably be 0.8 to 1.5 mm, deformed according to the shape of the large cycle irregularities, not deformed according to the shape of a small cycle irregularities desirable. 同様の理由により、軟質層の硬さはJIS:S6050で規定される硬さ試験(日本ゴム協会規格SRIS0101で規定される通称「C硬度」)で80以下、好ましくは40〜60 For the same reason, the hardness of the softer layer is JIS: is the hardness test specified in S6050 (aka defined by Japan Rubber Association Standard SRIS0101 "C hardness") at 80 or less, preferably 40 to 60
とされるのがよい。 It is what is.

【0018】 [0018]

【作用】ガラス板表面を平滑に加工する場合、問題となる表面の凹凸は、その凹凸の周期から3通りに分類できる。 [Action] When processing smoothly the surface of glass plate, irregularities of the surface in question may be classified into three types from the period of the unevenness.

【0019】第1に周期1mm以下のいわゆる表面粗さと呼ばれるもの、第2に周期3〜50mm程度のうねりと呼ばれるもの、第3に周期50mm以上の反りや肉厚偏差と呼ばれるものなどである。 The first to a so-called surface roughness of the periodic 1mm or less, what is referred to as waviness period of about 3~50mm Second, third etc. in what is referred to as the period at least 50mm warpage or thickness deviation. 軟質ウレタンなどの研磨パッドを用いる従来のポリッシュにおいては、表面粗さを小さくでき、鋳鉄定盤などを用いる従来のラッピングにおいては、反りや肉厚偏差を改善させることができる。 In the conventional polishing using a polishing pad, such as a soft urethane, it is possible to reduce the surface roughness, in the conventional lapping using cast iron plate, thereby improving the warpage or thickness deviation.

【0020】一方、本発明のガラス板研磨用パッドによる加工方法では、うねりを効果的に取り除くことができる。 Meanwhile, in the processing method according to the glass plate polishing pad of the present invention, it is possible to remove waviness effectively. それは、周期50mm以上の反りや肉厚偏差と呼ばれる凹凸に対してはガラス板の裏面側を保持するために設けられた軟質シートとガラス板自身が変形して凹凸を吸収し、周期3〜30mm程度のうねりに対しては本発明のガラス板研磨用パッドが凹凸の形状に応じて変形せずに、周期3〜30mm程度のうねりの凸部に積極的に加工力が働いて、ガラス板が加工されるためである。 It, for the irregularities called period 50mm or more warpage and thickness variation absorbing the unevenness deformed flexible sheets and the glass plate itself is provided to hold the rear surface side of the glass plate, the period 3~30mm for the degree of swell without deformation in accordance with the shape the glass plate polishing pad of unevenness of the present invention, work is actively working force to the convex portion of the waviness period of about 3 to 30 mm, the glass plate This is because to be processed.

【0021】 [0021]

【実施例】厚さ3mmのポリカーボネート樹脂シート(ヤング率2.5GPa)をオスカー式研磨機の下定盤に両面粘着テープにて固定し、彫刻刀にて表面に放射状に幅1mmの溝を、溝と溝のピッチが3〜6mmとなるように形成した。 EXAMPLES The polycarbonate resin sheet having a thickness of 3 mm (Young's modulus 2.5 GPa) were fixed with double-sided adhesive tape lower platen Oscar type polishing machine, a groove radial width 1mm on the surface at chisel, the grooves the pitch of the grooves is formed to have a 3 to 6 mm. また、軟質ポリウレタンシートと枠を設けた上定盤に、厚さ1.1mm、縦横の寸法300m Further, the upper platen having a soft polyurethane sheet and the frame, thickness 1.1 mm, length and width dimensions 300m
mのソーダライムシリカガラス板を取り付けて、平均粒径2μmの酸化セリウム研磨液を供給しながら面圧50 Attached soda lime silica glass plate m, the surface pressure 50 while supplying a cerium oxide polishing liquid having an average particle diameter of 2μm
g/cm 2で研磨を行い、平均厚さ1μmだけ研磨除去した。 was ground in g / cm 2, it was polished and removed by an average thickness of 1 [mu] m. 加工前のガラス板表面には高低差0.4μm、周期10mm前後のうねりが存在していたが、この加工後にはうねりの高低差は0.1μmを下回る値となり、しかも、良好な表面であった。 Unprocessed height difference 0.4μm the glass plate surface, although the period 10mm around the waviness is present, the height difference between the undulation after the processing becomes a value below 0.1 [mu] m, moreover, there a good surface It was. また、厚み偏差の劣化は0.3μm以内であった。 In addition, the deterioration of the thickness deviation was within 0.3μm.

【0022】なお、続いてガラス板を鏡面研磨するために他のオスカー式研磨機にてスエード調のポリウレタンパッドを用いて平均厚さ1μmだけ研磨したところ、 [0022] Incidentally, subsequently was polished glass plate by an average thickness of 1μm by using the polyurethane pad suede at other Oscar-type polishing machine to mirror polishing,
傷、マイクロクラックとも認められない極めて良好な表面を得た。 Wounds, to obtain a very good surface that does not recognized as microcracks.

【0023】比較例として、厚さ1.0mm、縦横の寸法30cmの硬質発泡ポリウレタンシート(ヤング率: [0023] As a comparative example, a thickness of 1.0mm, rigid polyurethane foam sheet (Young's modulus of the vertical and horizontal dimensions 30cm:
0.1GPa以下)をオスカー式の研磨機の下定盤に両面粘着テープにて固定し、上定盤に厚さ1.1mm、縦横の寸法300mmのソーダライムシリカガラス板を取り付けて、平均粒径2μmの酸化セリウム研磨液を供給しながら面圧50g/cm 2で研磨を行った。 0.1GPa or less) were fixed with double-sided adhesive tape lower platen of a polishing machine Oscar type, thickness of 1.1mm to the upper platen, attached soda lime silica glass plate vertical and horizontal dimensions 300 mm, average particle size polishing was performed at a surface pressure 50 g / cm 2 while supplying a cerium oxide polishing liquid 2 [mu] m. 加工前のガラス板表面には実施例と同様に高低差0.4μm、周期10mm前後のうねりが存在していたが、加工後にうねりの高低差を0.1μmを下回る値とするために、平均厚さ2μmの研磨除去が必要であった。 Before processing the glass plate height difference 0.4μm similarly to the embodiment on the surface, but the period 10mm around the waviness is present, the height difference of the undulation to the value below 0.1μm after processing, average polishing and removing a thickness of 2μm was required. なお、ガラス板周辺の減りが激しく、ガラス板の厚み偏差の劣化が1 Incidentally, severe decreases near the glass plate, the deterioration of the thickness deviation of the glass plate 1
μmとなり、実施例よりも大きくなった。 μm, and the becomes larger than the embodiment.

【0024】 [0024]

【発明の効果】以上詳述したように、本発明により少ない研磨加工量で、うねりが少なく、かつ傷やマイクロクラックが浅く少ないガラス板表面が作り出せ、しかも加工時間が大幅に短縮でき、品質向上、生産量増大とコスト削減が実現できた。 As described above in detail, in polishing amount lesser present invention, swell less and able to create scratches or microcracks shallow small glass plate surface, yet the processing time can be greatly shortened, quality , production volume increases and cost savings can be realized. また、研磨パッドに研磨砥粒が目詰まりしないため研磨パッドのドレッシングが不要となり、稼働率が向上し、傷発生による歩留まりの低下も少なくなった。 Further, the dressing of the polishing pad for polishing abrasive grains does not clog the polishing pad is not necessary, improved utilization rate became less decrease in yield due to scratch.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の実施例の断面図。 Figure 1 is a cross-sectional view of an embodiment of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

1:高分子シート 2:溝 3:軟質シート 4:ガラス板 1: Polymer Sheet 2: Groove 3: soft sheet 4: Glass plate

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】ガラス板の表面を研磨する研磨パッドであって、材料試験規格に基づいて測定されたヤング率が1 1. A polishing pad for polishing the surface of the glass plate, measured Young's modulus based on the material testing standard 1
    GPa以上で厚さが0.5〜10mmの高分子シートからなり、表面の主要な領域に幅0.1〜2.0mmの溝が溝幅の2〜10倍のピッチで形成されていることを特徴とするガラス板用研磨パッド。 Thickness using a GPa or higher, a polymer sheet of 0.5 to 10 mm, the groove width 0.1~2.0mm major regions of the surface are formed by 2 to 10 times the pitch of the groove width polishing pad glass plate according to claim.
  2. 【請求項2】裏面を軟質シートを介して固定保持したガラス板の表面を、材料試験規格に基づいて測定されたヤング率が1GPa以上で厚さが0.5〜10mmの高分子シートからなり、表面の主要な領域に幅0.1〜2. The surface of 2. A glass plate back surface of the fixed holding through the soft sheet, the measured Young's modulus based on the material testing standard thickness at least 1GPa is, a polymer sheet of 0.5~10mm , width in the major regions of the surface 0.1 to 2.
    0mmの溝が溝幅の2〜10倍のピッチで形成されているガラス板用研磨パッドを用いて研磨することを特徴とするガラス板の研磨方法。 The polishing method of the glass plate 0mm groove characterized by polishing using a polishing pad for a glass plate which is formed by 2 to 10 times the pitch of the groove width.
JP10161296A 1995-04-27 1996-04-23 Pad for polishing glass plate, and method for polishing the same Withdrawn JPH0911119A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP7-103948 1995-04-27
JP10394895 1995-04-27
JP10161296A JPH0911119A (en) 1995-04-27 1996-04-23 Pad for polishing glass plate, and method for polishing the same

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JP10161296A JPH0911119A (en) 1995-04-27 1996-04-23 Pad for polishing glass plate, and method for polishing the same

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998006541A1 (en) * 1996-08-08 1998-02-19 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
JPH1170463A (en) * 1997-05-15 1999-03-16 Applied Materials Inc Polishing pad with grooved pattern for use in chemical and mechanical polishing device
WO2001017725A1 (en) * 1999-09-02 2001-03-15 Teijin-Metton Kabushiki Kaisha Polishing pad
US6273806B1 (en) 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
EP1211023A1 (en) * 1999-03-30 2002-06-05 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998006541A1 (en) * 1996-08-08 1998-02-19 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
JPH1170463A (en) * 1997-05-15 1999-03-16 Applied Materials Inc Polishing pad with grooved pattern for use in chemical and mechanical polishing device
US6273806B1 (en) 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6645061B1 (en) 1997-05-15 2003-11-11 Applied Materials, Inc. Polishing pad having a grooved pattern for use in chemical mechanical polishing
US6699115B2 (en) 1997-05-15 2004-03-02 Applied Materials Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6824455B2 (en) 1997-05-15 2004-11-30 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6749714B1 (en) 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
EP1211023A1 (en) * 1999-03-30 2002-06-05 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
EP1211023A4 (en) * 1999-03-30 2005-11-30 Nikon Corp Polishing body, polisher, polishing method, and method for producing semiconductor device
US6547644B1 (en) 1999-09-02 2003-04-15 Teijin-Metton Kabushiki Kaisha Polishing pad
WO2001017725A1 (en) * 1999-09-02 2001-03-15 Teijin-Metton Kabushiki Kaisha Polishing pad

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