TW519869B - Heat dissipation structure of lead frame encapsulation and method for increasing the heat dissipation of lead frame encapsulation - Google Patents

Heat dissipation structure of lead frame encapsulation and method for increasing the heat dissipation of lead frame encapsulation Download PDF

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Publication number
TW519869B
TW519869B TW91112710A TW91112710A TW519869B TW 519869 B TW519869 B TW 519869B TW 91112710 A TW91112710 A TW 91112710A TW 91112710 A TW91112710 A TW 91112710A TW 519869 B TW519869 B TW 519869B
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Taiwan
Prior art keywords
lead frame
heat dissipation
frame package
circuit board
printed circuit
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TW91112710A
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Chinese (zh)
Inventor
Shr-Jang Gu
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Via Tech Inc
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Publication of TW519869B publication Critical patent/TW519869B/en

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Abstract

The present invention provides a heat dissipation structure of a lead frame encapsulation and a method for increasing the heat dissipation performance of a lead frame encapsulation. The heat dissipation structure of a lead frame encapsulation comprises: a lead frame encapsulation; and a printed circuit board having a contact face contacting the lead frame encapsulation. The method for increasing the heat dissipation performance of a lead frame encapsulation comprises: (a) coating a flux on the printed circuit board; and (b) contacting the bottom of a lead frame encapsulation with the printed circuit board. Thus, the heat generated by the lead frame encapsulation can be dissipated to the atmosphere through the printed circuit board, thereby eliminating the cost of designing a high performance heat dissipation system, and the cost of designing a lead frame encapsulation having a higher heat dissipation efficiency, while increasing the heat dissipation efficiency of an ordinary lead frame encapsulation and a high heat dissipation efficiency lead frame encapsulation, enabling them to be used in an electric product having a higher processing speed, and extending the operation life of the chip in the lead frame encapsulation.

Description

519869 五、發明說明ο) 【發明領域】 本發明將印刷電路板上的露銅區塗佈上一層助焊劑, 將一導線架封裝體(如四面封裝體)藉由該助焊劑當媒界, 而將該導線架封裝體之底面接觸在該印刷電路板上的露銅 區,並利用該印刷電路板上的露銅區及助焊劑相較於空氣 有較好的導熱效果,而提昇該導線架封裝體的散熱效率, 使其可用於處理速度更快的電子產品上。 【發明背景】 目前業界的導線架封裝體焊接於印刷電路板上時(如 第一圖及第二圖所示),一導線架封裝體1 a的複數個接 腳1 1 a係焊接於印刷電路板2 a上,且該導線架封裝體 1 a的一底面1 2 a和該印刷電路板2 a的一上表面2 1 a並無接觸,故該導線架封裝體1 a的該底面1 2 a和該 印刷電路板2 a的該上表面2 1 a間,由近乎絕熱的空氣 所佔有,如此一來該導線架封裝體1 a内之和該複數個接 腳1 1 a以金線1 4 a連接的晶片1 3 a之熱夏’將無法 經由該導線架封裝體1 a之該底面1 2 a而傳導至該印刷 電路板2 a ,僅能藉由該印刷電路板2 a由大氣環境散熱 ,或是該導線架封裝體1 a的熱能傳導至該接腳1 1後, 再傳導至該印刷電路板2 a散熱。 並且,將導線架封裝體裝設於處理速率較高之電子產 品的印刷電路板上時,需要搭配設計焉效能的散熱糸統’ 或高散熱率的導線架封裝體,例如:具有内嵌散熱片的四 面封裝體、具有外露式内嵌散熱片的四面封裝體及具有外519869 V. Description of the invention ο) [Field of the invention] The present invention applies a layer of flux to a copper exposed area on a printed circuit board, and uses a lead frame package (such as a four-sided package) as a medium through the flux. The bottom surface of the lead frame package contacts the copper exposed area on the printed circuit board, and the copper exposed area and the flux on the printed circuit board have a better thermal conductivity effect than air, and the wire is improved. The heat dissipation efficiency of the rack package allows it to be used in electronic products with faster processing speeds. [Background of the Invention] When the lead frame package of the current industry is soldered to a printed circuit board (as shown in the first and second figures), a plurality of pins 1 a of a lead frame package 1 a are soldered to the printing On the circuit board 2 a, and a bottom surface 1 2 a of the lead frame package 1 a is not in contact with an upper surface 2 1 a of the printed circuit board 2 a, so the bottom surface 1 of the lead frame package 1 a The space between 2 a and the upper surface 2 1 a of the printed circuit board 2 a is occupied by almost adiabatic air. In this way, the lead frame package 1 a sums the plurality of pins 1 1 a with gold wires. 1 4 a connected chip 1 3 a hot summer 'will not be able to be conducted to the printed circuit board 2 a through the bottom surface 1 2 a of the lead frame package 1 a, and only through the printed circuit board 2 a Heat is dissipated in the atmospheric environment, or the thermal energy of the lead frame package 1 a is conducted to the pin 11 and then conducted to the printed circuit board 2 a to dissipate heat. In addition, when the lead frame package is mounted on a printed circuit board of an electronic product with a high processing rate, it needs to be matched with a design 焉 efficient heat dissipation system 'or a high heat dissipation rate lead frame package, for example, with embedded heat dissipation. Sheet four-sided package, four-sided package with exposed embedded heat sink, and

第4頁 519869 五、發明說明(2) 露焊墊的四面封裝體等,如此才能防止導線架封裝體内之 晶片不會因熱量過高而毀損。但上述的高散熱率之導線架 封裝體的封裝成本遠高於一般的導線架封裝體,且高效能 的散熱系統也需要耗費較多的製造成本。 綜上所述,習知的導線架封裝體如使用於處理速度較 高的電子產品,需要耗費較多的成本來設計高效能的散熱 系統,及設計散熱效率較高的導線架封裝體,如此將提高 電子產品的製造成本,及由於習知的導線架封裝體散熱效 率較差,如此將縮短導線架封裝體内之晶片的使用壽命。 【發明目的】 本發明的目的在於提供一種導線架封裝體的散熱結構 及其提昇導線架封裝體散熱效能之方法,使導線架封裝體 藉由助焊劑而接觸於印刷電路板上的露銅區,讓導線架封 裝體產生之熱能藉由印刷電路板而散熱至大氣環境中,如 此可省去需要耗費較多的成本來設計高效能的散熱系統, 及設計散熱效率較高的導線架封裝體,並提昇一般的導線 架封裝體及高散熱效率的導線架封裝體之散熱效率,使其 可用於處理速度更快的電子產品上,並且延長導線架封裝 體内之晶片的使用壽命。 【發明特徵】 本發明提供一種導線架封裝體的散熱結構及其提昇導 線.架封裝體散熱效能之方法,該導線架封裝體的散熱結構 ,包括:一導線架封裝體;及一印刷電路板具有一接觸面 ,係接觸於該導線架封裝體,且該接觸面係塗佈散熱良好Page 4 519869 V. Description of the invention (2) Four-sided package with exposed pads, etc. This can prevent the chip inside the lead frame package from being damaged due to excessive heat. However, the packaging cost of the above-mentioned lead frame package with high heat dissipation rate is much higher than that of a general lead frame package, and a high-performance heat dissipation system also requires a relatively large manufacturing cost. To sum up, if the conventional lead frame package is used in a high-speed electronic product, it needs to spend a lot of cost to design a high-efficiency heat dissipation system, and to design a lead frame package with high heat dissipation efficiency. It will increase the manufacturing cost of electronic products, and due to the poor heat dissipation efficiency of the conventional lead frame package, the service life of the chip inside the lead frame package will be shortened. [Objective of the Invention] The object of the present invention is to provide a heat dissipation structure of a lead frame package and a method for improving the heat dissipation efficiency of the lead frame package, so that the lead frame package contacts the exposed copper area on the printed circuit board through a flux. The thermal energy generated by the lead frame package is dissipated to the atmosphere through the printed circuit board. This can save the costly design of a high-performance heat dissipation system and a lead frame package with high heat dissipation efficiency. And improve the heat dissipation efficiency of the general lead frame package and high heat dissipation efficiency lead frame package, so that it can be used for faster processing of electronic products, and extend the service life of the chip inside the lead frame package. [Inventive Features] The present invention provides a heat dissipation structure of a lead frame package and a method for improving the heat dissipation performance of the lead frame package. The heat dissipation structure of the lead frame package includes: a lead frame package; and a printed circuit board. A contact surface is in contact with the lead frame package, and the contact surface is coated and dissipated well

519869 五、發明說明(3) 之絕緣物質。該提昇導線架封裝體散熱效能之方法,其步 驟包括:a ·將印刷電路板上塗佈助焊劑 :及b ·將一導線架封裝體的底面接觸於該印刷電路板。 為使 貴審查委員能更進一步瞭解本發明之特徵及技 術内容,請參閱以下有關本發明之詳細内容與附圖,茲舉 一個較佳可行之實施例並配合圖式詳細說明如後,相信對 本發明當可由此得一深入且具體之瞭解。 【實施例】 本發明導線架封裝體的散熱結構(如第三圖及第四圖 所示),包括:一導線架封裝體1 ;及一印刷電路板2具 有一露銅區2 2 ,該露銅區2 2塗佈上一層助焊劑3 ,該 助焊劑3的材質為樹脂或松脂,該露銅區2 2以助焊劑3 為媒界,係面接觸於該導線架封裝體1 。 本發明提昇導線架封裝體散熱效能之方法(如第五圖 所示),包括下列步驟: a ·將一印刷電路板2上預留一要接觸導線架封裝體1的 露銅區2 2 ,在該露銅區2 2上塗佈一層助焊劑3 , 該助焊劑3的材質可為樹脂或松脂,並將該露銅區2 2上的助焊劑3加熱至2 2 0 — 2 6 0 °C的融熔狀態 ;及 b ·將該導線架封裝體1之複數個插腳1 1焊接於印刷電 路板2上,並同時讓該導線架封裝體1之一底面1 2 接觸於具有該助焊劑3的該露銅區2 2上,並將該助 焊劑3冷卻至室溫狀態,即得到固接在該露銅區2 2519869 V. Insulation substance of invention description (3). The method for improving the heat dissipation efficiency of a lead frame package includes the steps of: a. Coating a printed circuit board with a flux: and b. Contacting a bottom surface of the lead frame package with the printed circuit board. In order for your review committee to further understand the features and technical contents of the present invention, please refer to the following detailed contents and drawings of the present invention, and hereby give a preferred and feasible embodiment and explain it in detail with the drawings. The invention should have a deep and concrete understanding. [Embodiment] The heat dissipation structure of the lead frame package (as shown in the third and fourth figures) of the present invention includes: a lead frame package 1; and a printed circuit board 2 having an exposed copper area 2 2, the The exposed copper area 22 is coated with a layer of flux 3, and the material of the flux 3 is resin or rosin. The exposed copper area 22 uses the flux 3 as a medium, and the system surface contacts the lead frame package 1. The method (shown in the fifth figure) for improving the heat dissipation efficiency of the lead frame package of the present invention includes the following steps: a. Reserve a copper exposed area 2 2 on a printed circuit board 2 to contact the lead frame package 1, A layer of flux 3 is coated on the exposed copper area 2. The material of the flux 3 may be resin or rosin, and the flux 3 on the exposed copper area 2 2 is heated to 2 2 0 — 2 6 0 °. The molten state of C; and b. The plurality of pins 11 of the lead frame package 1 are soldered to the printed circuit board 2 and at the same time, one bottom surface 1 2 of the lead frame package 1 is in contact with the flux. 3 on the exposed copper area 2 2, and the flux 3 is cooled to room temperature, and is fixedly connected to the exposed copper area 2 2

519869 五、發明說明(4) 上的該導線架封裝體1 。 本發明提供一種導線架封裝體的散熱結構及其提昇導 線架封裝體散熱效能之方法,該導線架封裝體的散熱結構 ,包括:一導線架封裝體;及一印刷電路板具有一接觸面 ,係接觸於該導線架封裝體。該提昇導線架封裝體散熱效 能之方法,其步驟包括:a ·將印刷電路板上塗佈助焊劑 ;及b ·將一導線架封裝體的底面接觸於該印刷電路板。 如此,可使導線架封裝體之整體散熱效能提昇,使該導線 架封裝體内之晶片產生的熱量可以經由導線架封裝體底面 傳導至印刷電路板,並經由印刷電路板散熱至大氣環境中 ;現將導線架封裝體(如四面封裝體)的底面填滿助焊劑 及其底面只具有空氣時的情形做一數值模擬實驗(實驗1 和實驗2 )及實際量測實驗(實驗3和實驗4 ),結論如 下所述: 實驗1 ·取一厚度1 · 4mm,具有208支插腳的四面 封裝體置於雙層印刷電路板上時,當其内部之晶 片平均發熱功率為2 · 2 W時,且該四面封裝體 之底面填滿助焊劑時,相較於該四面封裝體之底 面充滿空氣時,該四面封裝體的上表面中心溫度 降低了 1 1 . 4 °C ,且該四面封裝體上表面中心 至環境的熱阻降低了 1 7 % 。 實驗2·取一厚度1·4mm,具有208支插腳的四面 封裝體置於四層印刷電路板上時,當其内部之晶 片平均發熱功率為2 · 2 W時,且該四面封裝體 S'519869 V. The leadframe package 1 in the description of the invention (4). The invention provides a heat dissipation structure of a lead frame package and a method for improving the heat dissipation efficiency of the lead frame package. The heat dissipation structure of the lead frame package includes: a lead frame package; and a printed circuit board having a contact surface. It is in contact with the lead frame package. The method for improving the heat dissipation performance of a lead frame package includes the steps of: a. Coating a printed circuit board with a flux; and b. Contacting a bottom surface of the lead frame package with the printed circuit board. In this way, the overall heat dissipation efficiency of the lead frame package can be improved, so that the heat generated by the chip in the lead frame package can be conducted to the printed circuit board through the bottom surface of the lead frame package, and dissipated to the atmospheric environment through the printed circuit board; A numerical simulation experiment (Experiment 1 and Experiment 2) and an actual measurement experiment (Experiment 3 and Experiment 4) are performed with the bottom surface of the lead frame package (such as a four-sided package) filled with flux and when the bottom surface only has air. ), The conclusion is as follows: Experiment 1 · Take a four-sided package with a thickness of 1.4 mm and 208 pins and place it on a double-layer printed circuit board. When the average heating power of the wafer inside it is 2.2 W, And when the bottom surface of the four-sided package is filled with flux, the center temperature of the upper surface of the four-sided package is reduced by 11.4 ° C compared to when the bottom surface of the four-sided package is filled with air, and the four-sided package is The surface-to-ambient thermal resistance is reduced by 17%. Experiment 2 · Take a four-sided package with a thickness of 1.4mm and 208 pins on a four-layer printed circuit board. When the average heating power of the wafer inside it is 2 · 2 W, and the four-sided package S '

519869 五、發明說明(5) 底度心 之溫中 體心面 裝中表 封面上 面表體 四上裝 該的封 於體面 較裝四 相封該 ,面且 時四, 劑該。C 焊,9 助時· 滿氣4 填空1 面滿了 底充低 之面降 有 具 及 腳 拒 支 。8 ο 2 %有 4具 2 , 了m 低m 降4 阻· 熱1 的度 境厚 環一 至取 3 驗 實 電 ·, 刷2時 印為劑 層率焊 雙功助 於熱滿 置發填 體均面 裝平底 封片之 面晶體 四之裝 的部封 片内面 熱其四 散當該 嵌,且 内時, 式上時 露板W 外路2 面該 四且 該, ,。C 時5 氣· 空3 滿了 充低 面降 底度 之溫 體心 裝中 封面 面表 四上 該的 於體 較裝 相封 ο τγΗ 了 低 降 阻 熱 的 境 環 至 心 中 面 表 上 體 裝 封 面。 四% 有電 具刷 及印 腳層 插四 支於 8置 ο體 2裝 有封 具面 ,四 m的 m片 4熱 •散 1山欣 度内 厚式 一露 取外 4 驗 實 2時 為劑 率焊 功助 熱滿 發填 均面 平底 片之 晶體 之裝 部封 内面 其四 當該 ,且 時, 上時 板W 路2 面該 四且 該,,。c 時7 氣· 空4 滿了 充低 面降 底度 之溫 體心 裝中 封面 面表 四上 該的 於體 較裝 相封 6 IX 了 低 降 阻 熱 的 境 環 至 心 中 面 表 上 體 裝 封 面。 四% 熱並 散, 體昇 裝提 封能 架效 線熱 導散 昇的 提體 明裝 發封 本架 ,線 果導 結將 驗能 實實 的確 述, 上法 合方 綜之 能 效 處效 於高 用計 使設 如來 體本 裝成 封的 架多 線較 導費 的耗 知要 習需 決, 解品 • 產 1± 子 :電 點的 優高 述較 下度 有速 具理 519869 五、發明說明(6) 能的散熱系統之問題;2 ·不需要設計高散熱效率的導線 架封裝體,而即可達到較高的散熱效率,減少設計高散熱 效率的導線架封裝體所耗費之成本;3 ·提昇一般的導線 架封裝體及高散熱效率的導線架封裝體的散熱效率,使其 可用於處理速度更快的電子產品上;4 ·延長導線架封裝 體内之晶片的使用壽命。 當然,以上所述僅為本發明之一較佳實施例,其不應 用以侷限本發明之實施範圍,任何熟習該項技藝者在不違 背本發明之精神所作之任何修改均應屬於本發明之範圍, 因此本發明之保護範圍當以下列所述之申請專利範圍做為 依據。519869 V. Description of the invention (5) The temperature of the bottom of the heart, the body-centered face, the surface of the watch, the face of the body, the face of the body, the top of the body, the top of the body, the face of the body, the face of the body, the face of the time, the time, and the agent. C welding, 9 assists, full gas, 4 fill in the blank, 1 surface is full, the bottom surface is low, and the feet are rejected. 8 ο 2% there are 4 sets of 2 m, low m, 4 drop resistance, 1 degree of heat 1 to thick 3 to take 3 to verify the electricity, 2 when the brush 2 is printed as a flux rate welding dual-function to help fill the hot filling The inner surface of the part of the package that is mounted on the surface of the flat bottom cover and the surface of the crystal is scattered when it is embedded, and when it is inside, the exposed board W is on the outside. At time C, 5 air and air 3 are filled with a warm body with a low surface and low base. The cover on the cover surface should be sealed on the cover surface. ΤγΗ The low-resistance heat environment is extended to the upper surface of the heart surface. Install the cover. 4% have electric appliance brushes and foot prints, insert four in 8 units, 2 are equipped with sealing surfaces, 4 m in 4 pieces of heat, 4 are hot and loose, 1 degree of inner thickness, 1 are exposed, and 4 are verified. 2 hours Fill the inner surface of the mounting surface of the crystal of the flat flat film for the flux rate welding to assist the heating. The four sides should be, and the upper side of the W board should be four, and the above. c Hour 7 Qi · Air 4 Full body with low surface temperature and low temperature. The cover on the front surface of the body should be sealed as shown on the cover. 6 IX The low-resistance heat-resistance environment is extended to the surface of the heart. Install the cover. 4% heat and dissipate, body lift, lift, seal, energy efficiency It is necessary to learn how to set up a multi-line rack in a sealed package as compared to the cost of the guide. The solution is to produce 1 ± son: the superior description of the electrical point is more reasonable than the following. 519869 5 Explanation of the invention (6) The problem of efficient heat dissipation system; 2 · It is not necessary to design a lead frame package with high heat dissipation efficiency, but high heat dissipation efficiency can be achieved, reducing the cost of designing a lead frame package with high heat dissipation efficiency Cost; 3 · Improve the heat dissipation efficiency of general lead frame packages and high heat dissipation efficiency lead frame packages, which can be used for faster electronic products; 4 · Extend the service life of the chip inside the lead frame package . Of course, the above is only a preferred embodiment of the present invention, and it should not be used to limit the implementation scope of the present invention. Any modification made by those skilled in the art without departing from the spirit of the present invention shall belong to the present invention. Scope, so the protection scope of the present invention should be based on the patent application scope described below.

519869 圖式簡單說明 第一圖為習知的導線架封裝體焊接於印刷電路板上之側視 圖。 第二圖為習知的導線架封裝體焊接於印刷電路板上之剖視 圖。 第三圖為本發明的導線架封裝體焊接於印刷電路板上之側 視圖。 第四圖為本發明的導線架封裝體焊接於印刷電路板上之剖 視圖。 第五圖為本發明提昇導線架封裝體散熱效能之方法的步驟 流程圖。519869 Brief Description of Drawings The first figure is a side view of a conventional lead frame package soldered to a printed circuit board. The second figure is a cross-sectional view of a conventional lead frame package soldered to a printed circuit board. The third figure is a side view of a lead frame package of the present invention soldered to a printed circuit board. The fourth figure is a sectional view of a lead frame package of the present invention soldered to a printed circuit board. The fifth figure is a flowchart of the steps of the method for improving the heat dissipation efficiency of the lead frame package according to the present invention.

體 裝 封 架 線腳面片 導接底晶 /^^ I—/ 明 ^ a a a # 習 3 r-H 〇〇 CO 14a 金線 2 a 印刷電路板 2 1a 上表面 1 導線架封裝體 2 印刷電路板 11 接腳 2 1 上表面 12 底面 2 2 露銅區 13 晶片 3 助焊劑 第10頁Body-mounting frame lead pin piece to connect the bottom crystal / ^^ I— / 明 ^ aaa # Xi 3 rH 〇〇CO 14a Gold wire 2 a Printed circuit board 2 1a Upper surface 1 Lead frame package 2 Printed circuit board 11 pin 2 1 Top surface 12 Bottom surface 2 2 Copper exposed area 13 Wafer 3 Flux page 10

519869 圖式簡單說明 14 金線 11111519869 Schematic illustration 14 Gold 11111

Claims (1)

519869 六、申請專利範圍 1 · 一種導線架封裝體的散熱結構,包括: 一導線架封裝體;及 一印刷電路板具有一接觸面,係接觸於該導線架封裝 體,且該接觸面係塗佈散熱良好之絕緣物質。 2 ·如申請專利範圍第1項所述之導線架封裝體的散熱結 構,其中該導線架封裝體為一四面封裝體。 3 ·如申請專利範圍第1項所述之導線架封裝體的散熱結 構,其中該印刷電路板設有一露銅區。 4 ·如申請專利範圍第1項所述之導線架封裝體的散熱結 構,其中該絕緣物質係一助焊劑。 5 ·如申請專利範圍第4項所述之導線架封裝體的散熱結 構,其中該助焊劑為樹脂或松脂。 6 · —種提昇導線架封裝體散熱效能之方法,其步驟包 括: a ·將印刷電路板上塗佈助焊劑;及 b ·將^一導線架封裝體的底面接觸於該印刷電路板。 7 ·如申請專利範圍第6項所述之提昇導線架封裝體散熱 效能之方法,其中該步驟a更包括在印刷電路板上預 留一露銅區的步驟。 8 ·如申請專利範圍第6項所述之提昇導線架封裝體散熱 效能之方法,其中該步驟a更包括讓助焊劑熔融的步 驟。 9 ·如申請專利範圍第8項所述之提昇導線架封裝體散熱 效能之方法,其中該步驟a的助焊劑熔融溫度為2 2519869 VI. Application Patent Scope 1. A heat dissipation structure of a lead frame package, comprising: a lead frame package; and a printed circuit board having a contact surface contacting the lead frame package, and the contact surface is coated Insulating material with good heat dissipation. 2 · The heat dissipation structure of the lead frame package according to item 1 of the scope of patent application, wherein the lead frame package is a four-sided package. 3. The heat dissipation structure of the lead frame package according to item 1 of the scope of patent application, wherein the printed circuit board is provided with an exposed copper area. 4. The heat dissipation structure of the lead frame package according to item 1 of the scope of the patent application, wherein the insulating substance is a flux. 5. The heat dissipation structure of the lead frame package according to item 4 of the scope of the patent application, wherein the flux is resin or rosin. 6-A method for improving the heat dissipation efficiency of a lead frame package, the steps include: a. Coating a printed circuit board with a flux; and b. Contacting a bottom surface of the lead frame package with the printed circuit board. 7. The method for improving the heat dissipation efficiency of the lead frame package according to item 6 of the scope of patent application, wherein step a further includes a step of preserving an exposed copper area on the printed circuit board. 8. The method for improving the heat dissipation efficiency of the lead frame package as described in item 6 of the scope of patent application, wherein step a further includes a step of melting the flux. 9 · The method for improving the heat dissipation efficiency of a lead frame package as described in item 8 of the scope of patent application, wherein the flux melting temperature of step a is 2 2 第12頁 519869 六、申請專利範圍 0 - 2 6 Ο X:。 1 0 ·如申請專利範圍第6項所述之提昇導線架封裝體散 熱效能之方法,其中該步驟b更包括將該印刷電路板 之複數個插腳焊接於該印刷電路板上之步驟。 1 1 ·如申請專利範圍第6項所述之提昇導線架封裝體散 熱效能之方法,其中該步驟b更包括讓助焊劑冷卻至 室溫的步驟。 1 2 ·如申請專利範圍第6項所述之提昇導線架封裝體散 熱效能之方法,其中該助焊劑的材質為樹脂或松脂。 1 3 ·如申請專利範圍第6項所述之提昇導線架封裝體散 熱效能之方法,其中該導線架封裝體為一四面封裝 體0Page 12 519869 VI. Application scope 0-2 6 Ο X :. 10 · The method for improving the heat dissipation efficiency of a lead frame package as described in item 6 of the scope of patent application, wherein step b further includes a step of soldering the plurality of pins of the printed circuit board to the printed circuit board. 1 1 · The method for improving the heat dissipation efficiency of a lead frame package as described in item 6 of the scope of patent application, wherein step b further includes a step of cooling the flux to room temperature. 1 2 · The method for improving the heat dissipation efficiency of a lead frame package as described in item 6 of the scope of patent application, wherein the material of the flux is resin or rosin. 1 3 · The method for improving the heat dissipation performance of a lead frame package as described in item 6 of the scope of patent application, wherein the lead frame package is a four-sided package 0 第13頁Page 13
TW91112710A 2002-06-11 2002-06-11 Heat dissipation structure of lead frame encapsulation and method for increasing the heat dissipation of lead frame encapsulation TW519869B (en)

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