TW517452B - Method for manufacturing piezoelectric element - Google Patents

Abstract

The present invention provides a method for manufacturing a piezoelectric element in which a substrate of piezoelectric material having high planarity and parallelism can be formed without having any adverse effect on the resonance characteristics thereof. The method for manufacturing a piezoelectric element comprises: a step for making trenches on the surface of a reinforcing plate, and a step for bonding the reinforcing plate to a substrate formed of piezoelectric material by introducing an adhesive having fluidity into the trenches of the reinforcing plate. Thus, the reinforcing plate can be bonded to the substrate formed by the piezoelectric material with predetermined strength. Also, by polishing the substrate formed by the piezoelectric material and which is bonded to said reinforcing plate, a substrate of piezoelectric material having high planarity and parallelism can be formed. Furthermore, since the adhesive layer can be dissolved simply by organic solvent, etc., the reinforcing plate can be peeled off in the state without applying any physical strength on the substrate formed of the piezoelectric material. Therefore, the resonance characteristics of the substrate formed of the piezoelectric material can be effectively kept.

Description

517452, Description of the invention (1) [Background of the invention] (Field of the invention) The present invention relates to a method for manufacturing piezoelectric elements such as ++, +, t, and 70 electrical components, and particularly relates to a substrate composed of piezoelectric elements. A manufacturing method of a piezoelectric element in which a substrate made of a piezoelectric material is processed in a state in which a reinforcing plate is attached. [Explanation of the background technology] Kinki Prefecture P has seen an increase in the amount of information of electronic devices and the increase in speed, and there has been an increase in the demand for high frequency of electronic device vibration frequency and clock pulse frequency. Because of this, for example, a crystal oscillator, which is an example of a piezoelectric element made of a piezoelectric material, is also required to have a fundamental wave resonance frequency of 100 MHz or more. The thickness sliding crystal oscillator determines its resonance frequency by its thickness. Therefore, if the crystal plate has the fundamental wave resonance frequency at 100MHzu, the crystal plate must be thinned to less than 20 // m. However, the crystal plate is too thin and easily broken. Conventionally, in order to prevent the above-mentioned problems, a method for reducing the thickness of a crystal plate to a predetermined thickness in a state in which a reinforcing plate is attached with an adhesive on the crystal plate has been adopted. In more detail, first, an adhesive is applied to the bonding surface of the reinforcing plate, and then the crystal plate and the reinforcing plate are bonded. In addition, the crystal plate is thinned to a predetermined thickness in a state where the reinforcing plate is bonded and reinforced. However, in the above conventional method, due to the adhesive applied on the bonding surface of the reinforcing plate, the fluidity is generally not good, and there is a problem that it is not easy to uniformly spread on the bonding surface of the reinforcing plate. Therefore, it is difficult to form a uniform adhesive layer on the bonding surface of the reinforcing plate and the crystal plate. But if the bonding surface of the crystal plate and the reinforcing plate

C: \ 2D-CODE \ 90-09 \ 90114937.ptd Page 5 517452 V. Description of the invention (2) f The tincture layer is not uniformly formed. When it is under the adhesion L of the reinforcing plate and the crystal plate, the crystal is targeted at the crystal. When the surface of the plate is processed and ground to a predetermined thickness, the flatness and parallelism of the crystal plate may be degraded. Therefore, the above-mentioned conventional method cannot form a crystal plate having a high degree of flatness and parallelism. Therefore, in the past, some people proposed in Japanese Patent Laid-Open No. 8-4647 No. 5 a silicon crystal plate surface as a reinforcing plate. The crystal plate crops were rationally bonded by intermolecular force without using an adhesive, and then the crystals were bonded. Plate grinding technology to around 丄 5. In this proposed technique, 'the absence of sticking J is used to avoid the problems of low quality of the plane f and parallelism of the crystal plate caused by the unevenness of the adhesive layer. $ t p # is connected to B, so after the processing is completed, the crystal is peeled from the silicon crystal plate to subject the crystal plate to physical stress. Therefore, it is possible to make force due to its accessibility; the problem ... If the use of intermolecular molecules fails to form ^ sound i can not achieve the required degree of resistance to grinding, [invention of disclosure] X flatness and flatness Problem with the crystal plate. The object of the present invention is a method that can form a substrate that does not change the manufacturing method of a piezoelectric element, and can produce a substrate that has a resonance characteristic of a completed substrate (crystal plate). Construction method of piezoelectric material with high parallelism and flatness Another object of the present invention is between a reinforcing plate and a substrate formed by a piezoelectric material which is a manufacturing method for providing a piezoelectric element.

517452, Description of the invention Those who form a uniform adhesive layer on the ground. Another purpose of February is to provide a combination of piezoelectric elements, which are bonded to a solid substrate between a reinforcing plate and a substrate made of a repeatable material. j The method of manufacturing a piezoelectric element made of a sturdy board and a house electric material: ΐ :: The piezoelectric element manufacturing method of item 1 in which a recess is formed on the surface of the board, and the reinforcing board contains: a base; 'The recessed part referred to in the present invention refers to a substrate composed of a recessed plate and a dust-electric material, which is guided by a flowable adhesive into the two reinforcing plates at the same time. The predetermined: strong; phase = substrate that can be reinforced. In addition, the adhesive layer can be composed of a dusty electrical material, so it can be removed from the piezoelectric material after the processing is completed. The strength can peel the reinforcing plate. ：: Material = Into the substrate. The resonance characteristics of the substrate change. It can avoid making the dust-electricity material structure in the second patent application scope of the piezoelectric patent scope, the first method will increase the j clothing & method, the application of the bonding step, including the substrate made of strong board materials In the state of adding == the substrate made of electrical material is a dynamic adhesive, on page 7 of the reinforcing plate C: \ 2D-CODE \ 90-09 \ 90114937.ptd 5. Description of the invention (4) Joint surface Under pressure and lightning, the state plate and the piezoelectric material that make the joint surface of the substrate with fluidity ^^ contact each other δ f penetrate into the joint surface. This can be used to strengthen the mixture layer. Between the substrates constituted by the kilograms, the thickness of the adhesive layer is simply formed. The scope of the patent application is No. 3-the scope of the patent application, or 2. The manufacturing method of the pad is extended to at least the reinforced structure. The formation of the concave portion of the reinforcing plate is at least extended to the form of the concave portion of the reinforcing plate and the piezoelectric material = the concave portion of the reinforcing plate and the piezoelectric material can still be removed from the reinforcing plate and the piezoelectric material ::: 'Simple import adhesive. The bonding part of the substrate is called the lightning protection in the scope of the patent scope No. 4 in the structure of the scope of the patent scope: the manufacturing method, the substrate pair formed by the electric material before the application of the step of joining with the reinforcing plate The joint surface of the plate and the piezoelectric material; :: = step, the stomach step is a needle mirror surface processor. In this way, by using pin 2 = 妾 T, the joint surface of the substrate is added, and the force mouth is:; = of; the joint surface and the junction surface of the substrate composed of the piezoelectric material d: the reinforcing plate and the piezoelectric core can be made The spotting agent can increase the permeability, and it can be used to easily form a uniform bond on the joint surface of the substrate made of 拎% ΪΙΓ. The two of the right will strengthen the joint surface of the substrate made of the house electrical material and / or the reinforced plate. For mirror processing, the optical plane method (optlcal flat) can be used.

IH C: \ 2D-CODE \ 90-09 \ 90114937.ptd $ 8 pages 517452 5 Description of the invention (5) =! The flatness of the substrate made of electrical materials. Can be based on ,. ° The flatness of the substrates composed of the piezoelectric materials made by Guomao early when bonding: Please refer to the manufacturing method of the piezoelectric element in item 5; in the structure of the second item, the reinforcement plate includes Other materials, :: Ϊ Expansion: The material is similar to the thermal expansion of a substrate made of piezoelectric material, similar to the coefficient of thermal expansion of a substrate made of piezoelectric material; Difficulties with the prince of piezoelectric materials led to a low quality of flatness. : = The item of manufacturing method of the piezoelectric element in Item 6 of the profit range: In the structure, after the base made of the piezoelectric material is: to do strong; after the second step of fe & The steps are to grind the joint surface of the two plates and the joint surface of the substrate made of piezoelectric material into 椹: ΐ If: and then dissolve the reinforcing plate of the piezoelectric material and the reinforcing plate by dissolving the adhesive. In item 6 of the scope of the patent application, if no physical stress is applied to the substrate made of the electromechanical material, 解 5 = Solution 2: The substrate made of piezoelectric material can be peeled from the reinforcing plate = the result, 纟 does not affect the piezoelectric material The resonance characteristics of the formed substrate Ϊ ΐ: The substrate made of piezoelectric material can be peeled from the reinforcing plate. ^ The method for manufacturing a piezoelectric element in item 7 of the scope of the claim, including the first row of steps, that is: ① the step of forming a recess on the reinforcing plate; ② the substrate composed of the entire electrical material is attached to the surface of the reinforcing plate C: \ 2D-CODE \ 90-09 \ 90114937.ptd 517452 V. Description of the invention (6)-The first type of bonding of the thermosetting property is introduced at the side end of the joint surface of the board and the piezoelectric material Step of introducing the second moldable compound with fluidity from the concave portion of the reinforcing plate at the same time so as to join the reinforcing plate with the substrate made of piezoelectric material ^; ③ in a state where the reinforcing plate and the substrate made of piezoelectric material are joined基板 The substrate made of the material is cut into a predetermined size to form a lightning funeral step. ④The second adhesive with fluidity is dissolved. 乂 ^ = The second adhesive is bonded to the piezoelectric material sheet.

Si: of Π ::: The first type of adhesive is used to form a strong dihedral item V of electric material A. With this structure, a power-increasing material sheet can be easily formed, such as: Nitsa :::: "electric material sheet. Therefore, even if the piezoelectric material has a thick y /, θ strong plate, it can be easily moved. If the patented scope is m-shaped, it can still be easily transported. The method of manufacturing piezoelectric pieces includes, in its application, at least the pores formed on the surface of the reinforcing plate formed on the surface of the reinforced plate and the scope of the patent application is 8 items. The surface is formed as a recessed hole. At least join the reinforcing plate? The reinforcing plate * Φ of the pore milk is guided through the 2% adhesive to make the reinforcing plate and the adhesive 6 into the pores. The simple agent is located on the reinforced substrate. At this time, because the i: layer is present on the reinforcing plate and repeated electricity :::: can be substantially bonded. When the substrate is bonded to the stubborn substrate, the substrate composed of the Department of Electrical Materials will be researched. : \ 2D-GQDE \ 90-09 \ 90114937.ptd page 10) on 7452 V. Description of invention (7) f 1, no Due to the extreme deviation of the parallel sound d θ caused by the sound of the adhesive and the sound of the substrate, the piezoelectric material can be formed to have a high level; the problem of low quality. The result is the plate. And because It can be equal to the addition of the substrate made of the base material of the material. It can be dissolved early in the process. When the piezoelectric substrate is peeled off, it can also be buried. The reinforcement plate must be added from the electrical material. Physical strength ;; :::: dissolves and peels the reinforcing plate, which does not effectively prevent the piezoelectric material from forming :: :: the substrate made of it. From this' 可 tf ^, -i IS 8 ^ ^ ^ ^ ^ The composition of the beautiful 柘 ### The self-contained invention can be made on a substrate that does not make the piezoelectric material apply for the scope of patent No. 9 to No. 7. Please refer to the backbone of the social structure of the No. 8 patent. In its application, porous ceramic reinforced board ° 'reinforced board with porosity, is a reinforced board with porous porosity, by the special :: f; brother 9 items, the system is used more, as long as the adhesive Introduction; Xi Li? There are many air holes on the surface of the strong plate. The two solid rolling between the substrates made of this material ^ L In the reinforcing plate may be the piezoelectric material, the reinforcing plate disk simply = 'state substantially no adhesive layers range patent item 10; "constituting the bonded substrate. The dust in the structure of item 9 of the patent range includes porous ferrous iron, porous materials, and Sicombe ceramic reinforced boards, including one of the reinforced boards. Apply for patent ^ Aluminum, porous carbon and other materials are optional.] Consumption in the 10th item, available; 10, the traditional materials such as ceramic reinforced board 1. . Recruitment agency Shu Xi Kongbei reinforced board. 4. Earlier misappropriation of commercially available materials as

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517452

Adverse effects. That is, if the average pore diameter of the pores of the porous ferrous iron is greater than 5 # m, when grinding the substrate made of piezoelectric material, the piezoelectric material located on the pores of the reinforcing plate may be caused by the grinding pressure. The formed substrate trowel has a ^: shape problem. At this time, the problem of low parallelism quality of the US plate composed of piezoelectric materials occurs. In item 3 of the scope of the patent application, in order to prevent such problems, the average pore diameter of the pores of the porous ferrous iron is formed within 5. μ The method for manufacturing a piezoelectric element in item 14 of the scope of the patent application, is as follows: Step ① It is to form a pore with at least the pores on the joining surface. 将 The adhesive is introduced into the pores of the reinforcing plate; step ③ The substrate composed of electric power and bonding is bonded to the surface of the reinforcing plate; in step ④, the substrate made of piezoelectric material on the reinforcing plate is polished. As mentioned above, the adhesive is introduced into the office, which is located on the substrate. At this time, because the adhesive is recognized as a rolled hole on the surface of the strong plate, there can be virtually no adhesion = the shape energy of the joint surface of the substrate composed of the reinforcing plate and the piezoelectric material; The substrates made of materials are bonded. 2: Needle not: ϊ 1The substrate made of piezoelectric material on Zeng Qiang plate is polished i, the parallel production of the substrate and the deviation of i ^ make the structure of piezoelectric material _ ^ ten degrees and dry surface The problem of low quality. The result is a beautiful plate made of piezoelectric material with parallelism and flatness. After the soil plate is processed, the reinforcing plate is made of piezoelectric material.

JW452 V. Description of the invention (10) When the substrate is peeled off, you can also add physical strength to the person;: 1 material = peeling the reinforcing plate without the need to avoid the substrate formed by the piezoelectric material. . As a result, there may be patent application scope No. 15: pressure; vibration: nature: change. In the structure of item 14 of the patent, please refer to: ^ 造 方 * 'in its claim: the step of introducing the adhesive into the debate # & > Drilling agent, after packaging, will be in the strong pores And on the surface of the reinforced board, the part outside the pores of the Dancai reinforced board is privately entered today. I would like to request the 15th + of the patent scope, and borrow the following steps: Application for air hole filling of reinforced board ... :: The adhesive can only be formed on the reinforced board and the piezoelectric material at the core = point agent, and there is no adhesive layer on the joint surface between the substrates, which is essentially a substrate Joined together: 'Make the reinforcing plate and the piezoelectric element in the scope of the piezoelectric material in the 16th item & early in the structure of the :::: surrounding item 8' with the enhancement and size of air holes ! Set a plurality of substrates made of dust and electricity materials. Patent claimed: In this 16th item, 'With this structure, a plurality of substrates composed of the above-mentioned piezoelectric material 2 can be arranged on a reinforcing plate with air holes, so it is not necessary to use a carrier material 1 t. This can be eliminated due to The thermal effect of the bonding of the substrate composed of the reinforcing plate and the piezoelectric material causes the deformation between the reinforcing plate and the carrier, so it can also avoid the piezoelectric t due to the deformation between the reinforcing plate and the carrier. The quality of the flatness and parallelism of the substrate formed by the material is low. As a result, the flatness and flatness of the substrate made of the piezoelectric material can be improved. The manufacturing method of the piezoelectric element in the 17th scope of the patent application is

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2. Description of the invention (π) In the structure of item 1 of the patent scope, any of the piezoelectric materials containing crystals or LasGas S i Ou is included in the structure of the patent. In this case, by using such a piezoelectric material, a substrate can be simply formed with a base having excellent flatness and parallelism == [the preferred embodiment of the present invention] The embodiment of the present invention will be described below with reference to the drawings. (First Embodiment) Referring to FIG. 9, the steps of the crystal oscillator in the first embodiment will be described below. The crystal oscillator is an example of the "piezoelectric element" of the present invention. First, as shown in Figure 1, prepare a 15n] inx 15mmx lmm reinforcement board (1). The thermal expansion coefficient of the reinforcing plate (1) is preferably formed of a material similar to the thermal expansion coefficient of the crystal plate (2) described later. For example, in this embodiment, a reinforcing plate (丨) made of Al203-TiC is used. Secondly, as shown in FIG. 2, a plurality of grooves (la) are formed on the joining surfaces of the reinforcing plate (1). The groove (la) is formed by a rectangular shape having a width of about 0.1 mm and a depth of about 0.2 mm. The groove (la) is formed at both end portions of the reinforcing plate (1). The groove (1 a) is an example of the "recessed part" of the present invention. Next, as shown in Fig. 3, prepare a crystal plate (2) with a size of i2mmx I2mmx 0.2mm. The crystal plate (2) is an example of the "substrate made of a piezoelectric material" of the present invention. In this state, as shown in FIG. 3, mirror surface processing is performed on both sides of the crystal plate (2) so that the thickness of the crystal plate (2) becomes 0.07 min. At the same time, the surface and the back surface of the crystal plate (2) are processed into Mirror. In this mirror processing, the surface roughness of both surfaces of the crystal plate (2) is processed to Ra value (average thickness of center line) 〇 〇 〇 3

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〇.〇〇 ... above, it is difficult to achieve the degree of j round. V. Description of the invention (12) // m or less is preferred. Because, it is difficult to form a uniform adhesive layer between the frequency of the crystal plate 增强 and the enhancement plate, and it is also difficult to form a strong plate. The person, as shown in FIG. 5, has a disk-shaped loading table (3 in this embodiment), a reinforcing plate ⑴. The surface of ^ = strong plate ⑴ is mirror-finished. The reinforcing plate ⑴:,: surface force ::: It is advisable to process the surface roughness of the reinforcing plate (Π to "value 001 or less. This is because if the surface roughness of the joining surface of the reinforcing plate (1) reaches Ra value 〇 · 〇 1 or more, the surface of the adhesive layer formed between the crystal plates (2) will be corrugated (concavo-convex), and it will be difficult to form a uniform adhesive layer. On the contrary, if the surface roughness of the reinforcing plate (1) is Ra value 0 · (Π or less, the permeability of the adhesive to the surface of the reinforcing plate (1) will increase, so a uniform adhesive layer can be simply formed between the crystal plate (2) and the reinforcing plate (1). As above As described above, after the joining surface of the reinforcing plate (1) is subjected to mirror processing, as shown in FIG. 6, 'the mirror plate (2) with mirror processing on both sides is attached to the joining surface of the reinforcing plate (1) and then pressurized. The pressure is pressed by a pressure of 20 × 1 〇4Pa-30 × 1 04Pa. In this state, the wax-based adhesive is injected into the reinforcing plate (1) with a device such as a di spenser. ) In the trench (la), and then pressurized on the upper part of the crystal plate (2) with the aforementioned pressure, at a temperature of about 100 ° C. Heat for 12 hours. In addition, wax-based adhesives use low-viscosity adhesives with fluidity. In this example, phthalic rubber (made by Kasei Seiko Co., Ltd.) is used to dissolve acetone (acet ο ne). ). That is, the phthalate rubber with a concentration of 17% by mass was mixed with European rubber and acrylic S at a mixing ratio of 1: 5. Furthermore, the concentration of phthalate rubber

517452 V. Description of the invention (13) It is suitable to be in the range of 15 to 20%. If the concentration of the phthalic adhesive is more than 20 ° I ° / ◦, the fluidity is poor, so that the problem that the adhesive is not easily dispersed uniformly may occur. Therefore, the concentration of the phthalic gum is preferably set in a range of 15% by mass to 20% by mass. Here, in the first embodiment, since both surfaces of the crystal plate (2) are mirror-finished and the surface of the reinforcing plate (1) is also mirror-finished, the reinforcing plate (1) and the crystal plate (2) are bonded. ), Interference fringes displayed at the joint interface between the crystal plate (2) and the reinforcing plate (1) can be observed by the optical plane method. As a result, the bonding state of the crystal plate (2) can be simply adjusted to have a high flatness based on the measurement results. The optical plane method refers to a method of displaying interference fringes on a measurement surface and observing the flatness from the interference fringes. After the bonding step of the reinforcing plate (1) and the crystal plate (2) shown in FIG. 6, as shown in FIG. 7, 'the reinforcing plate (1) and the crystal plate (2) are bonded, and the crystal plate (2) is ground. On the surface, the thickness of the crystal plate (2) is machined to a thickness of 20 mm or less. In this grinding process, first use F0 # 30 0 0 grindstone grains (particle size 3 ~ 6 #m) for rough grinding. Then, oxidized honing stone grains (average particle size: 0.5 m) were used as the final processing and grinding. In this grinding process, an electrical micrometer (e 丨 ec t r i c micro-meter) is used to measure the height from the top of the reinforcing plate (1) to the top of the crystal plate (2), so as to control the thickness of the crystal plate (2). Through the above-mentioned polishing, in this embodiment, a crystal plate (2 with a flatness of 0 · 2 // π1 · / 2mm CKP-V) or less, a high flatness of 以下 1 or less and a parallelism of 形成 can be formed. ). This makes it possible to form a crystal plate (2) having excellent resonance characteristics without causing side vibrations.

C: \ 2D-CODE \ 90-09 \ 90114937.ptd Page 17 517452 V. Description of the invention (14) Then, as shown by a dot chain line in FIG. 8, the crystal plate (2), for example, using resin (resi η ) After the grinding stone is cut, the adhesive (phthalein) between the reinforcing plate (1) and the crystal plate (2) is dissolved with an organic solvent (acetone), and the crystal plate (2) is peeled from the reinforcing plate (1). . Thereby, a crystal plate (2) as shown in Fig. 9 can be obtained. The crystal plate (2a) is an example of the "piezoelectric material sheet" of the present invention. In the crystal oscillator step of the first embodiment, as described above, a groove (1 a) of the reinforcing plate (1) is formed, and a flowable adhesive (17 mass% phthalophthalate) is injected into the groove (1 a ') is introduced into the groove (1 a) with a flowable adhesive, which can simply penetrate the joint surface of the reinforcing plate (丨) and the crystal plate (2) to form a uniform adhesive layer. Then, the crystal plate (2) bonded to the reinforcing plate (1) with the uniform adhesive layer is ground to a predetermined thickness, and a crystal plate having N parallelism and 1¾ flatness can be formed. Also, after the crystal plate (2) is cut to a predetermined size, and then the adhesive is dissolved, the crystal plate (2) can be simply peeled off the reinforcing plate (1) without applying a physical force to the crystal plate (2). As a result, the crystal plate (2) can be peeled from the reinforcing plate (1) without adversely affecting the resonance characteristics of the crystal plate (2). In addition, in a state where the reinforcing plate (1) and the crystal plate (2) are bonded and pressurized, a flowable adhesive (17% by mass of phthalic adhesive) is introduced, thereby bonding the reinforcing plate (1). In a state where the bonding surface of the surface and the crystal plate (2) are in contact with each other, an adhesive having fluidity is introduced into the bonding surface, so that an adhesive layer having a uniform thickness can be simply formed. Moreover, in the above-mentioned first embodiment, the material (A12 03-T i C) of the reinforcing plate (丨) has a coefficient of thermal expansion that is similar to that of the crystal plate (2).

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f 'This can effectively prevent thermal stress from occurring at the bonding surface between the reinforcing plate (1) and the crystal plate when the temperature changes. Therefore, it is possible to prevent the flatness quality from being lowered due to the deformation between the reinforcing plate (丨) and the crystal (2). (Second Embodiment) The steps of the second embodiment will be described below with reference to Figs. 10 to 15. First, in the second embodiment, after the same steps as those in the i-th embodiment shown in FIGS. 1-5 to 5 are performed, the process moves to the steps shown in FIG. In the step shown in Fig. 丨, the pressure is applied while the crystal plate (2) is bonded to the joining surface of the reinforcing plate (1) provided with a plurality of grooves (113). This pressurizing method is the same as that in the i-th embodiment, in which the upper part of the crystal plate (2) is pressed with a pressure of 20 X 10 Pa to 30 X 104 Pa. Furthermore, the groove (a) is an example of the "recess" of the present invention, and the crystal plate (2) is an example of the "substrate made of a piezoelectric material" of the present invention. In this state, 'the thermosetting adhesive is injected into the side ends of the joint surface of the reinforcing plate (丨 丨) and the crystal plate (1 2), and the reinforcing plate (丨 丨) and the crystal plate (1 2) are connected to 丨The extending direction of the structure (iia) forms a right angle. Thus, the surface of the reinforcing plate portion (丨 丨 c) can be impregnated with the thermosetting adhesive. The thermosetting adhesive can be, for example, an Abel adhesive (manufactured by Moble Stark). Then, the same procedure as in the first embodiment shown in FIG. 6 is performed, in which a wax-based adhesive (17% by volume of rubber) is injected into the groove (1 1 a) of the reinforcing plate (1 1). As a result, the phthalic glue will permeate the surface of the reinforcing plate portion (llc) located between the grooves (11a). Then, it is heated at about 100 ° C for about 12 hours under the above-mentioned pressure and pressure on the upper part of the crystal plate (2). Thereby, the crystal plate (丨 2) can be joined to the reinforcing plate (11).

C: \ 2D-CODE \ 90-09 \ 90114937.ptd P.19 517452 After the description of the invention (16), as shown in Figure 11, grind the top of the crystal plate (丨 2), and place the crystal plate (^ 2) It is processed to a thickness of 20 "or less. The grinding conditions at this time are the same as those of the first known example. After that, as shown in Fig. 12, the crystal plate (1 2) is cut to a predetermined size. As shown in Figure 13, the reinforcing plate (丨 j) is cut to the position of a chain line from the back of the reinforcing plate (; [丨). Thus, as shown in Figure 丨 4, it is separated into a crystal plate (j2a) and The part of the reinforcing plate (Ub) and (llc). The part shown in FIG. 14 is immersed in acetone to dissolve the crystal plate (丨 2a) and the reinforcing plate (jib) and located in the groove (Ua). Wax adhesive (phthalein). The thermosetting adhesive located between the sheet (12a) and the reinforcing plate part (llc) is not dissolved in the acrylic resin. By this, the reinforcing plate can be separated. Part (nb) is peeled off from the crystal body (12a). As a result, as shown in FIG. 15, only the plate 4 is formed into a shape (11c) bonded to the surface of the crystal plate (j2a). Person, crystal The sheet (1 2 a) is an example of the "piezoelectric material sheet" of the present invention. In the eighth embodiment, the crystal plate (12a) having the reinforcing plate portion t (llc) bonded to a part of the surface can be simply formed through the above steps. Therefore, the crystal piece (12a) can be easily carried by holding the reinforcing plate portion (Uc). As a result, even if the crystal piece (1 2 a) is miniaturized, the handling of the crystal piece (1 2 a) can be easily handled. (Third Embodiment) Referring to Figs. 16 to 24, the steps of the third embodiment will be described below. / In the step of the third embodiment, "-211 series porous ferrous iron having a large number of pores on its surface was used as a reinforcing plate (21). The method of forming" Zn series porous ferrous iron "is first described at 65. -75% by mass of FeO, 15 ~ 20% by mass

C: \ 2D-CODE \ 90-09 \ 90114937.ptd 517452 Explanation (17) " -----__ of MnO and 10 to 15 mass% of 211〇, plus pure water and A 1⑽ (Japan : Chemical name of highly viscose fiber)). And the mixture is given two false k. The pseudo-firing is performed at about 85 (rc ~ 90) (rc for about 4-6 hours. Then, using a baU mill, the pseudo-firing mixture is pulverized into fine particles of about 1 "= 3 // m. After adding the binder to dry, it will form rice flour with good fluidity (granulate). Then press it with a press to form the desired shape of compression, and then press it at about 12,000 ° C-1300 ° C. High-temperature sintering. Finally, grinding and final processing are completed-the size and shape of the Zn-based porous ferrous iron. In order to form high-density ferrous iron with few porosity, it is usually sintered with Η IP ( (Hydrostatic hydrostatic press) to increase density. However, in the third embodiment, the purpose is to form porous ferrous iron with multiple pores. Therefore, the treatment of HIP densification is not performed. As described above, Mη- After the reinforcing plate (21) of Zn-based porous fertilizer grain iron, as shown in FIG. 16, the reinforcing plate (21) is arranged on a disc-shaped carrier (100). In this state, The surface of the reinforcing plate (2 丨) is mirror-finished. The mirror-finishing of the reinforcing plate (2 1) is the same as the first embodiment described above. The surface roughness of the reinforcing plate (21) is preferably processed to Ra value below 0.01. If the mirror-processed Mn-Zn porous ferrous iron reinforced plate (2 1) section is enlarged to observe, It has the shape shown in Figure 丨 7. Referring to Figure 17 ', it can be seen that a plurality of crystalline particles j (21a) are arranged on the surface of the reinforcing plate (21). And pores (21b) are formed between the crystalline particles (2 ia). ). This pore (2 1 b) is an example of the "recess" of the present invention. In addition, the density of the pores (2 1 b) of the porous ferrous iron is 4,000 / mm2 or more and 100%. 〇 / mm2 is preferable. The reason is as follows: if porous

C: \ 2D-CODE \ 90-09 \ 90ll4937.ptd Page 21 517452 V. Description of the invention (18) The density of the pores (2 1 b) of the fertile grain iron is less than 4 0 0 / mm2, because of the pores The number of (2 1 b) is reduced, so that the amount of the adhesive filling the air inlet hole (2 1 b) is also reduced. As a result, a problem of insufficient adhesive strength occurs. In addition, if the density of the pores (2 lb) of the porous ferrous iron exceeds 100 000 holes / mm2, the number of the pores (2 lb) increases, and the quality of the flatness of the surface of the reinforcing plate (2 1) is deteriorated. Therefore, in the steps described later, when the crystal plate (2 3) bonded to the reinforcing plate (2 1) is ground, a problem occurs in that the parallelism and flatness of the crystal plate (2 3) are deteriorated. In the third embodiment, in order to prevent such problems, the density of the pores lb) of the porous ferrous iron is preferably not less than 40,000 pieces / mm2 and not more than 100,000 pieces / mm2. In addition, the average surface pore diameter of the pores (2 1 b) of the porous ferrous iron is preferably 5 // m or less. The reason is as follows: If the average surface pore diameter of the pores (2 1 b) of the porous fertilizer grain iron is larger than 5 # m, the crystal plate (2 3) may be ground due to grinding in the steps described later. The pressure of the stone causes the part of the crystal plate (2 3) located on the air hole (2 1 b) of the reinforcing plate (2 1) to sink into the air inlet hole and deform. At this time, a problem arises that the parallelism quality of the crystal plate (23) is low. To prevent such problems, in the third embodiment, the average pore diameter of the pores (丨 b) of the porous ferrous iron is preferably less than 5 / z m. Following mirror processing of the reinforcing plate (2 1) shown in FIGS. 16 and 17, as shown in FIGS. 8 and 19, a wax-based adhesive (22) is applied to the reinforcing plate (21) with a brush or the like. Of the joint surface. This wax-based adhesive (22) is the same as that in the i-th embodiment, and uses an adhesive having a low fluidity viscosity. That is, a phthalic glue and a high-flow phthalic glue having a concentration of 7% by mass, which is mixed at a mixing ratio of 1 to 5. A highly fluid phthalic adhesive (adhesive) having such a concentration of 17% by mass is applied to a reinforcing plate (21). The adhesive (22) is shown in FIG. 19 ^ 517452 V. Description of the invention (19) enters the surface pores (21b) of the reinforcing plate (21) and is formed on the surface of the reinforcing plate (2 1) at a predetermined thickness. on. In addition, the adhesive (2 2) formed by the phthalic rubber diluted with acetone and having flowability, after coating, the same component of acrylic g will evaporate. Therefore, the .zhan mixture (2 2) formed by diex will be in a solid state.乂 After the adhesive (2 2) is solidified in this way, the adhesive (2 2) is ground to remove the adhesive (22) located on the surface of the stubborn plate (21). Therefore, as shown in FIG. 20, only the adhesive (22) is filled in the air holes (21b) on the surface of the reinforcing plate (21), and the surface of the reinforcing plate (21) other than the air holes (Sichuan) is absent; ; ((”; 之;” state. Then, as shown in FIG. 21, the crystal plate (2 3) with mirror processing on both sides is attached to the bonding surface of the reinforcing plate (2 1) under pressure and bonded. The step of pressure bonding is to press the upper part of the crystal plate (23) with a pressure of 20 X 1 04Pa-30 X 1 〇4pa, and heat it at about 100 ° C for about 3-12 hours. The adhesive (2 2) originally filled into the pores (2 1 b) on the surface of the reinforcing plate (2 1) was once again in a molten state. With the adhesive (2 2), the reinforcing plate (2 1) and the crystal plate ( 2 3) Bonding. At this time, the heating time is preferably about 丨 0 ~ 丨 2 hours. Because 'this can avoid the deformation of the crystal plate due to the difference in the shrinkage of the crystal plate', the bonding is performed. Furthermore, the crystal The plate (2 3) is an example of the "substrate made of a piezoelectric material" of the present invention. As described above, after the crystal plate (23) is bonded to the reinforcing plate (21), as shown in FIG. (21) The surface of the crystal plate (2 3) is ground in a state of being bonded to the crystal plate (23). Thereby, the crystal plate (2 3) is processed to a thickness of 20 / zm or less. The grinding conditions in this step, This is the same as the first embodiment.

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517452

5. Description of the invention (21) The resonance characteristics of the plate (2 3) change. # ΐFrom the embodiment 3, compared with the first embodiment, the material efficiency of the plate. That is, ′, the part bonded to the reinforcing plate (j 2 is the part of the crystal plate 中 in the step shown in Fig. 7, (right plate (gate 2) 0) is located on the groove (la)

(A, cut 0) In the case of the plate (2), the portion outside the groove (la) is used as the crystal plate (2a). In the case of Toasty, qA, and I, the third place in the province, the third place. In the example, because the reinforcing plate (21) two ... groove = exists, in the step shown in FIG. 23, the crystal plate (23)% is cut, All parts can be adopted as the crystal plate (23a) (refer to FIG. 24). As a direct result, compared with the first embodiment, the manufacturing method of the third embodiment can improve the crystal

Material efficiency of the body board (2 3). In the third embodiment, after the adhesive (phthalein) is introduced into the pores (2 1 b) of the reinforcing plate (21) and on the surface of the reinforcing plate (21), the reinforcing plate (2 j) is The adhesive (22) other than the pores (2lb) is ground and removed, so that the adhesive (2 2) can be simply filled into the pores (2 1 b) of the reinforcing plate (2 1). With the adhesive filled in the pores (2 1 b), the reinforcing plate (2) can be placed in a state where the bonding surface of the reinforcing plate (2 1) and the crystal plate (23) is substantially free of an adhesive layer. 1) and the crystal plate (2 3). In addition, in the third embodiment, the adhesive (22) is left in the pores (2 1 b) of the reinforcing plate (21), and the reinforcing plate (2 1) and the crystal plate (2 3) are used. Pressure bonding. At this time, when the reinforcing plate (2 1) and the crystal plate (2 3) are pressure-bonded, if there is a gap between the reinforcing plate (2 1) and the crystal plate (2 3), the air hole (2 1 b) The adhesive (22) may ooze out to the joint interface between the reinforcing plate (21) and the crystal plate (23). However, even if the adhesive (2 2) oozes to the bonding interface, the bleed

C: \ 2D-C0DE \ 90-09 \ 90114937.ptd page 25 517452 V. Description of the invention (22) :: The adhesive layer is only extremely thin at 0 · 1 " m. Therefore, no thick adhesive layer is present on the reinforcing plate (21) s ^ surface, so that the processed crystal plate (23) is flat; (and 23 flat): the degree of mouth is low There are no problems. =, The embodiments disclosed this time should be regarded as all examples, not meanings. The scope of the present invention is disclosed not by the description of the above embodiments but by the scope of patent application, and also includes the meaning equivalent to the scope of patent application and all changes within the scope of the patent application. For example, in the first and second embodiments described above, Hj3-Tic whose thermal expansion coefficient is similar to that of the crystal plate is used as the material of the reinforcing plate, but the present invention is not limited to this, as long as it is a material that approximates the thermal expansion coefficient of the crystal plate , Other materials can also be used. For example, crystal, aluminum, quartz glass, and the like. Moreover, even materials whose thermal expansion coefficient does not approximate that of the crystal plate can be used. For example, a Mn-Zπ-based or Ni-Zn-based ferrous iron material may be used. If such fertile iron with high workability is used, it has the advantage of being easy to process. In addition, in the first and third embodiments, a phthalic adhesive having a concentration of 7% by mass was used as the adhesive with fluidity, but the present invention is not limited to this. 〇 is an adhesive with fluidity, even if other Adhesive, 'can also achieve the same effect ^. For example, ALCWAX (manufactured by Nippon Chemical Co., Ltd.) may be used without any solvent. Furthermore, the adhesive with fluidity used in the present invention is preferably an adhesive with a flow charm of about # 10cp_30cp under the condition of loot. In addition, the towels of the first and second embodiments are formed by forming the grooves of the reinforcing plate into a rectangular shape C: \ 2D-CODE \ 90-09 \ 90114937.ptd 517452 5. Description of the invention (23) Shape, but the present invention does not p groove 'The same two can be obtained: ^ ,: the concave and convex of the v-shape or other shapes, and the concave 2. : 戈 更 进-, ’It is also possible to provide such grooves and minute guides: adhesives on the surface of the reinforcing plate. In the present invention, it is < concave and convex, and is generally referred to as a concave portion. In addition, the above-mentioned first and 箓 9 6 丄 penetrate to both sides of the reinforcing plate 2㈣: the grooves of the reinforcing plate are formed to extend the ends of both sides of the reinforcing plate. Also mr, it is not necessary to extend through to the groove of the connecting plate of the increase plate, as long as it extends at least to the end of the reinforced = 1, joint portion. In this way, in the reinforced board: 2: It is also possible to introduce the adhesive from the joint of the reinforced board and the crystal board; In the third embodiment, Mn-Zn-based porous fertilizer iron is used as the reinforcing plate (21). However, the present invention is not limited to this, and Ni-Zim-based porous fertilizer iron may be used. Also, the use of porous Taurman other than porous ferrous iron has the same effect. For example, porous pores or porous carbon may be used. It is not limited to porous ceramics. The same effect can be obtained as long as the reinforcing plate has pores on the bonding surface. In addition, in the third embodiment described above, the surface of the reinforcing plate (2 1) was coated with a flowable adhesive (丨 7 mass% phthalic adhesive), and then the other parts of the pores (2 1 b) The adhesive (2 2) is removed by grinding, and only the adhesive (2 2) is left in the pores (2 1 b). However, the present invention is not limited to this. The method other than coating and grinding the adhesive is used in the pores. (2 1 b) may leave the adhesive (2 2). In the first to third embodiments, an example of a substrate made of a crystal plate as a piezoelectric material is shown. However, the present invention is not limited to this. A crystal may be used.

C: \ 2D-CODE \ 90-09 \ 90114937.ptd Page 27 517452 V. Description of the invention (24) Except for the body, for example, steel dopant (La3Ca5Si〇4), tanta: lc acid lithium) or ln (un called: sharp acid: the same effect can be obtained. The substrate made of ， can also form a recess (groove or pore) in the reinforcing plate, and a sexual adhesive is introduced into the recess, so that the recess can be introduced. , 'The substrate formed by the motor is strengthened with a predetermined strength: the upper adhesive is bonded to the piezoelectric material of the reinforcing plate;

f, shapeable; ί:;: 所 ::: A plate with high parallelism and flatness. Also, because the adhesive sound can be simply settled, it is dissolved in the mine material :: organic solvent, etc., the material is processed, the plate is processed, and the reinforcing plate is peeled from the piezoelectric material: 0 "as long as the adhesive layer is dissolved, π Physical electricity must be added, and the substrate made of materials can be peeled off. This can effectively prevent the resonance characteristics of substrates made of electrical materials from changing. In this way, in the dimension, substrates made of piezoelectric materials In the state of resonance characteristics, a substrate made of a piezoelectric material having high parallelism and flatness can be formed. In addition, in the above-mentioned first to third embodiments, an example of a method for manufacturing an oscillator is used to explain the piezoelectric element. Manufacturing method 'However, the present invention is not limited to this, and can be widely applied to manufacturing methods of other piezoelectric elements such as filters. In addition, in the third embodiment described above, as shown in FIGS. 16 to 21, a disc shape is used. After arranging a plurality of reinforcing plates (21) with pores on the carrier table (100), an example of bonding the crystal plate (23) to the reinforcing plate (21) by using an adhesive is described, but the present invention does not Limited to this, as a third embodiment, as shown in FIG. 25 # Stage without using carrier material 'is prepared having pores of e.g.

imii C: \ 2D-CODE \ 90-09 \ 90114937.ptd Page 28

517452 V. Description of the invention (25) A large reinforcing plate (31) of 60 · X 60 mm x 7 mm, and a plurality of (two in this modification example) crystal plates are arranged on the large reinforcing plate (3 1) ( The substrate (2 3) made of a piezoelectric material may be bonded to the reinforcing plate (2 1) by using an adhesive, and the crystal plate (2 3) may be joined. If this structure is adopted, the reinforcing plate and the material table can be avoided because the heat is not used because the material table is not used, and the body plate (the substrate made of piezoelectric material) can be avoided because of the reinforcing plate and the material table. Problem. As a result, the flatness and parallelism of the crystal substrate can be improved. Deformation problems occur between the reinforcing plate and the crystal plate when they are joined. As a result, the quality of the flatness and parallelism of the crystal is low due to the deformation problem that occurs between the plate (2 3) (made of piezoelectric material

[Explanation of component number] 1 reinforced plate la groove 2 crystal plate 2a crystal plate 11 reinforced plate 11a groove lib reinforced plate portion lie reinforced plate portion 12 crystal plate 12a crystal plate 21 reinforced plate 21a crystal particle 21b

517452

C: \ 2D-CODE \ 90-09 \ 90114937.ptd Page 30 517452 Brief Description of Drawings Figure 1 is a perspective view showing the steps of a crystal oscillator in the first embodiment of the present invention. Fig. 2 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 3 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 4 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 5 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 6 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 7 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 8 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 9 is a perspective view showing the steps of the crystal oscillator in the first embodiment of the present invention. Fig. 10 is a perspective view showing the steps of the crystal oscillator in the second embodiment of the present invention. — FIG. 11 is a perspective view showing the steps of the crystal oscillator in the second embodiment of the present invention. Fig. 12 is a perspective view showing the steps of a crystal oscillator in a second embodiment of the present invention.

C: \ 2D-C0DE \ 90-09 \ 90I14937.ptd Page 31 517452 Brief Description of Drawings Figure 13 is a perspective view showing the steps of the crystal oscillator in the second embodiment of the present invention. Fig. 14 is a perspective view showing the steps of the crystal oscillator in the second embodiment of the present invention. Fig. 15 is a perspective view showing the steps of the crystal oscillator in the second embodiment of the present invention. Fig. 16 is a perspective view showing the steps of a crystal oscillator in a third embodiment of the present invention. FIG. 17 is an enlarged sectional view of the reinforcing plate in the step shown in FIG. 16. Fig. 18 is a perspective view showing the steps of a crystal oscillator in a third embodiment of the present invention. FIG. 19 is an enlarged sectional view of the reinforcing plate in the step shown in FIG. 18. Fig. 20 is an enlarged sectional view showing the steps of the crystal oscillator in the third embodiment of the present invention. Fig. 21 is a perspective view showing the steps of the crystal oscillator in the third embodiment of the present invention. Fig. 22 is a perspective view showing the steps of the crystal oscillator in the third embodiment of the present invention. Fig. 23 is a perspective view showing the steps of the crystal oscillator in the third embodiment of the present invention. Fig. 24 is a perspective view showing the steps of the crystal oscillator in the third embodiment of the present invention. Fig. 25 is a perspective view showing the steps of a crystal oscillator in a modification of the third embodiment of the present invention.

C: \ 2D-CODE \ 90-09 \ 90114937.ptd Page 32

Claims (1)

517452 ^, --- No. 9011 in July, 'application patent scope 1 & two kinds of manufacturing methods of piezoelectric elements, including: a step of forming a concave portion on the surface of a reinforcing plate; and strong: 导入 The introduction of the concave portion has A step of bonding a substrate made of an additive material with a flowable adhesive. Medium · If the method of manufacturing a piezoelectric element according to item 丨 of the patent application range, before the steps, the plate where the strength plate and the substrate made of the aforementioned piezoelectric material are joined is processed by the factory to make the reinforcing plate and the aforementioned piezoelectric material. Base mixture, state τ 'Introducing the fluid-phase adhesive bonding plate and the substrate phase composed of the aforementioned piezoelectric material from the aforementioned recessed portion, the manufacturing method of the electric element of item 3 or 2 of the foregoing range, direct electric material It is formed by extending at least to the end of the joint portion of the reinforcing plate and the pressed substrate. In, ^ 1 = the manufacturing method of the piezoelectric element in the first range of the benefit range, the front surface of the substrate and the reinforcing plate in the step of joining the substrate, the mirror surface and the piezoelectric material constitute the base 5. If the patent is applied for Scope item 丨 the aforementioned reinforced plate, # sentence includes and also the electrical and electronic methods, where & U # includes a material with a thermal expansion coefficient similar to that of the substrate formed by the aforementioned piezoelectric material1 The piezo-electric material structure includes a method for manufacturing a piezoelectric element as described in item 1 of the patent application scope, which is further composed of the aforementioned piezoelectric material. T After the step of strengthening the bonding surface of the reinforcing plate, ~ Joint Surface of Substrates Made of Electrical Materials, P.33 517452 The substrate made of electrical materials is from ___ Case No. 90114937_ June 6. The scope of patent application: the step of grinding to a predetermined plate thickness; and the step of peeling the pressure-reinforcing plate by dissolving the adhesive after grinding. 7 · —A method for manufacturing a piezoelectric element, comprising the steps of: forming a recess on a reinforcing plate; attaching a substrate made of the aforementioned piezoelectric material to the surface of the reinforcing plate, and removing the substrate from the reinforcing plate and the aforementioned pressure; A thermosetting first adhesive is introduced to the side of the substrate ^ of the substrate made of the electric material, and a second adhesive having fluidity is introduced from the concave portion of the aforementioned reinforcing plate, so that the aforementioned reinforcing plate is constituted by the aforementioned piezoelectric material. Substrate bonding step; 步骤 a step of cutting the substrate made of the piezoelectric material into a predetermined size to form a piezoelectric material sheet in a state where the foregoing reinforcing plate is bonded to the substrate made of the piezoelectric material; and The two adhesives with flowability are dissolved, so that only the aforementioned reinforcing plate bonded to the piezoelectric material sheet via the second adhesive is partially peeled off, and the piezoelectric material sheet is not peeled off via the first adhesive. Steps to strengthen the board. 8 · The method for manufacturing a piezoelectric element according to item 1 of the patent application, wherein the recess formed on the surface of the aforementioned reinforcing plate includes an air hole formed on at least the joint surface of the aforementioned reinforcing plate. 9 · The method for manufacturing a piezoelectric element according to item 8 of the patent application, wherein the reinforcing plate having the pores as described above includes a porous ceramic reinforcing plate 0 1 0 · The piezoelectric element according to item 9 of the patent application Manufacture method, which 517452 Λ_η Amendment No. 90114937 Six-t. In the scope of the patent application, the reinforcing plate composed of the aforementioned porous ceramics is a kind of material selected from the group consisting of porous ferrous iron, porous aluminum, and porous carbon. Composition of reinforcing plates. 11. The method for manufacturing a piezoelectric element according to item 10 of the patent application scope, wherein the step of forming the aforementioned porous ferrous iron includes: a step of sintering the ferrous iron shaped body; and the aforementioned ferrous iron shaped body After sintering, the final processing step is performed. 12. The method for manufacturing a piezoelectric element according to item 10 or 11 of the scope of patent application, wherein the pore density of the aforementioned porous ferrous iron is 4,000 pieces / mm2 or more, 10,000 pieces, # Followings. Zhong 13. Second application, please /:] The method of manufacturing a piezoelectric element in the range of item 10, which:. In addition, the average pore diameter of the iron pores in the ferric grains of Xikongbei is based on the following: 1 · A method of manufacturing a piezoelectric element, which is formed at least in the connection of # θ 女 广 a ', and guides the adhesive = : the step of strengthening the plate with random holes on the surface; the step of stiffening the holes of the reinforcing plate in 1 V; joining the substrates made of piezoelectric material; Steps of grinding. The substrate made of electric material is added. 5 · As in the patent application, the second step of the electric manufacturing method of the aforementioned stepping agent is introduced. The step 4 of removing the adhesive outside the hole is the step 4 of the reinforcing plate. 4 * 517452 _Case No. 90114937_ Revised Year of the Month _ 6. Application for Patent Scope 1 6. The manufacturing method of the piezoelectric element according to item 8 of the Patent Scope, where the reinforcing plate with the aforementioned air holes is provided with A size of a substrate made of the plurality of piezoelectric materials is arranged on the substrate. 1 7. The method for manufacturing a piezoelectric element according to item 1 of the scope of the patent application, wherein the substrate made of the aforementioned piezoelectric material contains any one of a crystal and a lanthanum gallium silicide (1 ^ 3088581014). \\ 326 \ 2d- \ 91-ll \ 90114937.ptc Page 36