516153 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 A7 B7 五、發明説明（1 ) 【創作領域】 本發明是有關於-種晶圓對正的方法，特別是指一種 可快速自動對正之晶圓自動對正的方法。 【習知技藝說明】 按，台灣現已是世界晶圓代工的重鎮，然，隨著全球 化競爭的日趨劇烈，如何在最短的時間内將產品完成並送 至客戶手中已成為一相當重要的課題。 習知一種手動對正晶圓的方法是搭配一晶圓切割機 100使用’如第一、二、三圖所示，該切割機1 〇〇具有一 可沿X軸方向左右移動，且可繞z軸方向自轉的切割工作 台1，以供置放一晶圓101、一組可同步沿γ軸方向前後 移動的刀軸2及攝影機3，且該刀軸2可獨自地沿z軸方 向上下移動，並设有一刀片2 〇丨、一可操控驅動該切割工 作口 1、該刀軸2及該攝影機3的中央處理器4，及一與該 中央處理器4連結的顯示器5,請再參閱第异、四圖，當 4曰曰圓101置於該切割工作台i上時，該晶圓i 〇 i的影像 可由該攝影機3之一鏡頭301，經一類比/數位轉換器4〇卜 一影像記憶裝置4〇2，及該中央處理器4，而於該顯示器5 之一視窗501中顯示，由第四圖中可知，該晶圓1〇1上形 成有多數可切割分離的矩形單位晶片1〇11，該等單位晶片 101 1均具有二切割方向x、y，並呈陣列式排列，且彼此間 均間隔有一切割道1012，而該視窗501具有一標記502， 該標記502是由一中央縱線503、一中央水平線5〇4、一上 下標線506所組成’其中，該上、下標線5〇5、 、又適用 準（CNS ) A4· ( 21〇x297公釐)" " --- 第3頁 ----------t--------、玎------^ (請先閲讀背面之注意事項再填寫本頁) 516153 A7516153 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (1) [Creation Field] The present invention relates to a method for wafer alignment, especially a wafer that can quickly and automatically align. Right approach. [Description of Know-how] According to Taiwan, Taiwan is now the world's major foundry. However, with the increasingly fierce global competition, how to complete and deliver products to customers in the shortest time has become a very important issue. Subject. A method of manually aligning a wafer is known to be used with a wafer cutting machine 100. As shown in the first, second and third figures, the cutting machine 100 has a movable left and right along the X-axis direction, and can be wound around The cutting table 1 that rotates in the z-axis direction is used to place a wafer 101, a set of knife axes 2 and a camera 3 that can be moved forward and backward synchronously in the γ-axis direction, and the knife axis 2 can be moved up and down in the z-axis direction alone Move, and is provided with a blade 2 0, a central processing unit 4 which can control and drive the cutting workport 1, the knife shaft 2 and the camera 3, and a display 5 connected to the central processing unit 4, please refer to In the fourth and fourth figures, when the circle 101 is placed on the cutting table i, the image of the wafer i 〇i can be taken by a lens 301 of the camera 3 through an analog / digital converter 40. The image memory device 4202 and the central processing unit 4 are displayed in a window 501 of the display 5. As can be seen from the fourth figure, the wafer 101 is formed with a plurality of detachable rectangular unit wafers. 1011, the unit wafers 101 1 have two cutting directions x, y, and are arranged in an array. There is a cutting path 1012 at a distance from each other, and the window 501 has a mark 502, which is composed of a central vertical line 503, a central horizontal line 504, and an upper and lower marking line 506. Among them, the upper, The subscript line 505, and also applicable to the standard (CNS) A4 · (21〇x297 mm) " " --- Page 3 ---------- t ------ -、 玎 ------ ^ (Please read the notes on the back before filling this page) 516153 A7
506可以該中央水平線5G4為對稱中心、，而同步反向地上 下移動，以調整彼此間的寬度，而由第四圖中亦可知，該 晶圓101之單位晶片1011的切割方向χ、y均沒有對正該 視窗501的標記502，故，該刀片2〇1無法進行切割工作， 此時，即需以目視該顯示器5之視窗5〇1，並配合手動調 整該切割工作自1及該攝影機3的方式，將該晶目ι〇ι對 正，其步驟如下： (請先聞讀背面之注意事項再填寫本頁) 一、 如第五圖所示，驅動該切割工作台丨，使該切割 作。1以其台面中心點（x〇，y〇 )為迴轉中心點，繞z軸 方向轉動，使該晶圓1〇1之單位晶片1011的切割方向X， 轉動至一與該中央水平線504平行的水平線上，當然，此 目測結果未必是真水平。 經濟部智慧財產局員工消費合作社印製 二、 如第六圖所示，驅動該攝影機3沿γ軸方向移動， 使該標記5 02移入其中一切割道i i 2内，並調整該上、下 標線505、506之間的寬度至與該切割道ι〇12等寬切齊， 以利於操作者觀看、對正，或再微調旋轉角度，當目視確 認已對正，利用該中央理處器4將該晶圓1〇1之影像對應 於該標記502中心點的座標（X1，yi )記錄下來。 二、如第七圖所示，驅動該切割工作台1沿X軸方向 平移一適當距離’若平移後該上、下標線5〇5、5〇6與該切 告1J道1 0 12沒有切齊，則需再驅動該切割工作台1繞z軸 轉動’及驅動該攝影機3沿Y軸方向移動，以使該上、下 標線505、506與該切割道1012切齊，待調整完成後，再 α 5玄t央玉里處器4將該晶圓1 〇 1之影像對應於該標記5〇2 不紙恨K度通用中國國家標準（CNS ) A4規格（210X297公釐〉 第4頁 516153 五、發明説明（ 中心點的座標（Χ2, π)記錄下來。 =，該中央處理器4可藉由座標(xi，yi)、(x2，y2)， 二：7 4整角度’並藉由該中央處理器4驅動該切割工 口 1繞z軸轉動，以確使該晶圓101之單位…〇ιι 的切割方向X與該標記502對正，而界業為了保險起見， 均會在切割方向x對正完成後，驅動該切割工作台轉動九 十度’再以相同步驟對㈣方向yit行對正，並使該標記 的中^點調整至任二切割道ι〇ΐ2的交會中心點處，如 第八圖所不’然後’才會進行切割該晶圓101的工作。 誠然，此種手動調整方式配合該中央理處器4的輔助 調整，可達到對正該晶圓101的目地，但，此種手動調整 方式而依罪操作者目視該視窗501方能完成，且每換一片 晶圓均需再重新手動對正一次，故，速度慢且耗時，、因而 使業者無法有效縮短交期，而大大地影響業者的競爭力。 為了解決上述的缺失，日商笛思科公司（506 The central horizontal line 5G4 can be used as a symmetrical center, and can be moved up and down in synchronization to adjust the width between each other. As can be seen from the fourth figure, the cutting directions of the unit wafer 1011 of the wafer 101 are both χ and y. The mark 502 of the window 501 is not aligned, so the blade 001 cannot perform cutting work. At this time, it is necessary to visually view the window 501 of the display 5 and cooperate to manually adjust the cutting work from 1 and the camera. 3, to align the crystals, the steps are as follows: (Please read the precautions on the back before filling in this page) 1. As shown in the fifth figure, drive the cutting table 丨Cutting made. 1 With the center point of the table (x0, y0) as the center of rotation, rotate around the z-axis direction, so that the cutting direction X of the unit wafer 1011 of the wafer 101 is rotated to a parallel to the central horizontal line 504 On the horizon, of course, this visual result may not be true. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 2. As shown in the sixth figure, the camera 3 is driven to move in the γ-axis direction, so that the mark 5 02 is moved into one of the cutting lanes ii 2 and the superscript and subscript are adjusted The width between the lines 505 and 506 is equal to the width of the cutting path ι〇12 to facilitate the operator's viewing, alignment, or fine-tuning the rotation angle. When visually confirm that the alignment has been made, use the central processor 4 The image of the wafer 101 corresponding to the coordinates (X1, yi) of the center point of the mark 502 is recorded. 2. As shown in the seventh figure, drive the cutting table 1 to translate an appropriate distance along the X-axis direction. 'If the upper and lower subscript lines 5505 and 506 and the notice 1J lane 1 0 12 are not translated after translation, For cutting, you need to drive the cutting table 1 to rotate around the z-axis and drive the camera 3 to move in the Y-axis direction, so that the upper and lower marking lines 505 and 506 are aligned with the cutting path 1012, to be adjusted. After that, the image of the wafer 1 〇1 corresponds to the mark 502 of α 5 玄 t 中 玉里 器 4 General paper Chinese national standard (CNS) A4 size (210X297 mm> page 4) 516153 V. Description of the invention (The coordinates of the center point (χ2, π) are recorded. =, The central processor 4 can use coordinates (xi, yi), (x2, y2), 2: 7 4 full angle 'and borrow The chopper 1 is driven by the central processing unit 4 to rotate around the z-axis to ensure that the cutting direction X of the unit of the wafer 101 is aligned with the mark 502. For the sake of insurance, the industry will After the cutting direction x alignment is completed, drive the cutting table to rotate ninety degrees' and then align the direction yit in the same steps, and center the mark. The ^ point is adjusted to the center of the intersection of any two cutting paths ι〇2, as shown in the eighth figure, then the work of cutting the wafer 101 will not be performed. It is true that this manual adjustment method cooperates with the central processor. The auxiliary adjustment of 4 can achieve the purpose of aligning the wafer 101. However, this manual adjustment method can be completed according to the operator's visual inspection of the window 501, and each wafer needs to be manually aligned again. Therefore, the speed is slow and time-consuming, so that the industry cannot effectively shorten the delivery time, which greatly affects the competitiveness of the industry. In order to solve the above-mentioned shortcomings, the Japanese commercial company Cisco (
Abrasive Systems，Ltd·)推出另一種具有雙鏡頭的切割機， 經濟部智慧財產局員工消費合作社印製 該切割機的兩個鏡頭是為不同倍率且間隔—間隙（約々公 刀至5. 5公分），藉由使用該二鏡頭同時取像，以縮短晶圓 對正所需的時間，但’在實際使用上，因其裝設兩個鏡頭， 故，反而造成該切割機整體成本昇高，且若待切割晶圓的 尺寸卜於其間隙，則亦無法適用，造成其適用性不佳。 【創作概要】 口此，本發明之目的，即在於提供一種可快速自動對 頭之切搭配使用之晶圓自動對正 本、，氏張尺家縣“）Α4· ----勺 第5頁 516153 五、發明説明（4 ) 方法。 於是’本發明之晶圓自動對正的方法 於一切割機，該切割機具有去疋運用 J /口 X軸方向左右救 可繞Z軸方向自轉的切割工作A， ，且 α 以{、置放一晶[H、 可同步沿Υ軸方向前後移勒 Ν 一組 便移動的刀軸及攝影機， 獨自地沿Ζ軸方向上下蒋翻 孩刀軸可 台、该刀軸及該攝影機的中央處理器，及一 J作 器連結的顯示器，且置放 …中央處理 差么 放於该切割工作台上的該晶圓可定 義為一母片晶圓，該母片曰J ^ 單位晶片，該等單位” θθ π成有多數可切割分離的 々一 „ ° 片均為相同形狀，且呈陣列式排列， 母一單位晶片均具有至少-+Τ7 —丨‘ — 夕一切剎方向，在該等切割方向上 母一單位晶片均各定羞古 , '各疋義有-切割距離’而當該母片晶圓置 …切割工作台上’且以目視該顯示器配合手動調整該切 割工作台及該攝影機的方式，將該母片晶圓對正後，該攝 影機可將該母片晶圓上之其中—單位晶片的影像攝下儲 存，並將其定義為-母樣本，如此，當要切割其他相同規 秸之B曰圓時’可以該方法加以自動對正，該方法包含以下 /驟·、知零.將放置有另一晶圓的該切割工作台及該 攝如機驅動调整至_原點。二、採樣：透過該攝影機拍攝 存取該晶圓的影像，並與該母樣本進行影像比對，從而選 取出至少二與該母樣本符合之單位晶片，並將其各定義為 子樣本，且记錄其中心點座標值。三、計算間距：計算 ^ 子樣本之中心點間的間距。四、計算間距餘數··選擇 單位晶片的其中一切割方向的切割距離，將 第ό頁 (請先閲讀背面之注意事項再填寫本頁) ----訂- 經濟部智慧財產局員工消費合作社印製 二子樣本的間距對該切割距離取餘數。五、判斷並選取 餘數最小的其中一組子樣本。六、驅動該切割工作台繞z 軸方向轉動，使該組子樣本之一切割方向轉動至一水=線 上。七、再驅動該切割工作台沿x軸方向平移，及驅動該 攝影機沿Y軸方向平移’使該晶圓位於一下刀，點，如此， 即可使該晶圓自動對正。 【圖式之簡單說明】 h本發明之其他特徵及優點，在以下配合參考圖式之幸 佳實施例的詳細說明中，將可清楚的明白，在圖式中： 第-圖是習知—種晶圓切割機之立體外觀示意圖； 闻第二圖是該種切割機拆除-外部殼體後的立體示! 圖； 第三圖是該種切割機之系統連結示意圖； 第四圖是該種切割機之一滿佘％ 一 ,^ 钱之視1^顯不一置放於一切割工 '"上之一晶圓影像的局部平面示意圖； 第五圖是該種切割機之手動調整示意圖（一）； 第六圖是該種切割機之手動調整示意圖（二）； 第七圖是該種切割機之手動調整示意圖（三）； 第八圖是該種切割機之㈣調整完成示； 第九圖是本發明之晶圓自 · 例建立-母樣… 方法的-較佳實施 甘樣本的平面示意圖； 第十圖是該較佳實施例之流程圖； :十一圖是該較佳實施例採樣之平面示意圖； 第十二圖是該較佳實施例之 部 智 慧 五、發明説明（6 示意:了—圖疋第十二圖中之該晶圓轉動九十度後的平面 第m佳實施例之自動對正完成示意圖;及 面示意圖。冑夕數，、角形早位晶片之晶圓的平 【較佳實施例之詳細說明】 本發明之晶圓自動對正的方 #丄…，， 孕乂佳貫施例，是與 该切吾彳機100搭配使用，但，並 、 太 不杓限本發明之應用範圍， 在匕特予陳明。請參閱第九圖， 台i上的晶圓可定義為一母片θπ置放於該切割工作 ^ ^ ‘、’ 片日日圓10 ,該母片晶圓10上 形成有夕數可切割分離 um -… 办早位曰曰片11，該等單位晶片 戸弓碎士 歹】式排列’且彼此間均 間隔有一切割道12，在 隹通一切告彳方向X、y上每一單位曰Abrasive Systems, Ltd.) introduced another cutting machine with dual lenses. The two lenses of the cutting machine printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs are of different magnifications and space-gap (about 々 male knife to 5.5 (Cm), by using the two lenses to take images at the same time, to shorten the time required for wafer alignment, but 'In actual use, because it is equipped with two lenses, the overall cost of the cutter will increase. And, if the size of the wafer to be cut lies in the gap, it cannot be applied, resulting in poor applicability. [Creation summary] At the same time, the purpose of the present invention is to provide an automatic wafer alignment tool that can be quickly and automatically cut and used with the head, "Zhangjiajia County") A4 · ---- spoon page 5 516153 V. Description of the invention (4) Method. So the method of automatic wafer alignment of the present invention is in a cutting machine, which has a cutting work that uses the J / port X-axis direction to save the rotation around the Z-axis direction. A, and α is {, a crystal is placed [H, a group of moving knife axes and cameras can be simultaneously moved forward and backward along the Z axis direction, and the knife axis can be moved up and down along the Z axis alone. The knife axis and the central processing unit of the camera, and a display connected to a J-worker, and placed ... the wafer placed on the cutting table can be defined as a mother wafer, the mother The pieces are J ^ unit wafers, and the units "θθ π are formed into a plurality of dicable and separable wafers. The slices are all the same shape and arranged in an array. The mother unit wafers have at least-+ Τ7 — 丨 '— In the direction of all brakes, in the direction of cutting The unit wafers are all set, "Everything is right-the cutting distance" and when the mother wafer is placed on the "cutting table" and the display table is used to manually adjust the cutting table and the camera, the After the mother wafer is aligned, the camera can take an image of one of the mother wafers and store the image of the unit wafer, and define it as a mother sample. In this way, when you want to cut other B of the same specification "Yuanyuanshi" can be automatically aligned by this method, the method includes the following steps / steps, knowing zero. The cutting table and the camera drive with another wafer placed on it are adjusted to the _ origin. Second, sampling : Shooting and accessing the wafer image through the camera, and comparing the image with the mother sample, so as to select at least two unit wafers that match the mother sample, define each of them as sub-samples, and record their Coordinate value of center point. 3. Calculate the distance: Calculate the distance between the center points of the sub-samples. 4. Calculate the remainder of the distance. · Select the cutting distance in one of the cutting directions of the unit wafer. Precautions (Fill in this page) ---- Order-The distance between the two sub-samples printed by the Employee Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs takes the remainder of the cutting distance. 5. Judge and select one of the sub-samples with the smallest remainder. 6. Drive the cutting The worktable is rotated around the z-axis direction, so that the cutting direction of one of the group of sub-samples is turned to a water line. 7. Drive the cutting worktable to translate in the x-axis direction, and drive the camera to translate in the Y-axis direction to make the The wafer is located at the knife and point, so that the wafer can be automatically aligned. [Simplified description of the drawing] h Other features and advantages of the present invention are described in the following detailed description of the lucky embodiment with reference to the drawing Will be clearly understood in the drawings: Figure-Figure is a conventional three-dimensional appearance schematic diagram of a wafer cutting machine; heard the second figure is a three-dimensional view of the cutting machine after removal of the outer casing! Figure; The third picture is a schematic diagram of the system connection of this kind of cutting machine; the fourth picture is one of this kind of cutting machine. Schematic diagram of a partial plane of a circular image; The diagram is the manual adjustment diagram of the cutting machine (1); the sixth diagram is the manual adjustment diagram of the cutting machine (2); the seventh diagram is the manual adjustment diagram of the cutting machine (c); the eighth diagram is The completion of the adjustment of the cutting machine is shown in the ninth figure. The ninth figure is a schematic plan view of the preferred embodiment of the wafer sample creation method-the master sample ... method of the present invention; the tenth figure is the flow of the preferred embodiment. Figures: Figure 11 is a schematic plan view of the sampling of the preferred embodiment; Figure 12 is a part of the wisdom of the preferred embodiment V. Description of the invention A schematic diagram of the automatic alignment completion of the mth preferred embodiment of the plane after the circle is rotated ninety degrees; and a schematic diagram of the surface. The number of squares, the flatness of the angular early wafer [Detailed description of the preferred embodiment] The wafer of the present invention automatically aligns the square # 丄 ..., which is the same as the cutting example. The machine 100 is used in combination, but it does not limit the scope of application of the present invention to Chen Ming. Referring to the ninth figure, the wafer on the stage i can be defined as a mother wafer θπ placed in the cutting work ^ ^ ',' pieces of Japanese yen 10, and the mother wafer 10 is formed with a number of cuttable separation um -... The early stage is called slice 11. These units are arranged in a chip-like manner, and there is a cutting path 12 spaced from each other. Each unit is in the direction X and y where all directions are communicated.
11均各定義有一切割距離D 蓉於兮〜Β 切割距離D1(D2) 等於。亥早位日日片“的 (見度）加上該切割道12的寬 又）且该二切割距離D1、D?沾且危η 的長度是分別等於任二單 ^日日片11之中心點間距D3、D4 、七+ α、 的長度’而當操作者以上 述之目視該顯示器5之親窗并 工柞△, 之視固5〇1，並配合手動調整該切割 作口 1及該攝影機3的方式，將哕母H曰π Λ將°亥母片晶圓10對正後， 讀衫機3可將該母片晶圓1〇上之其中—單 影像攝下儲存，並將Α義 日日片11的 疋義為一母樣本13，如 割其他相同規格之曰圓0士 γ丄. 田要切 …規才°之0曰0¥’可以本發明之方法加以自動對 正，：配合參閱第十圖，該方法包含以下步驟： 1-— 、歸零:該中央處理器4合將於罢女口 該母月 第8頁 (請先閲讀背面之注意事項再填寫本頁} iφ—ί------訂--r--,--Each of 11 defines a cutting distance D Rong Yuxi ~ B The cutting distance D1 (D2) is equal to. The length of the "Hai early-day Japanese-Japanese film" plus the width of the cutting lane 12) and the length of the two cutting distances D1 and D? Are equal to the center of any two single-day Japanese-Japanese film 11 The distance between the dots D3, D4, seven + α, 'and when the operator looks at the close window of the display 5 with the above eyes and works 柞, the fixed 501, and cooperate to manually adjust the cutting opening 1 and the In the way of the camera 3, after aligning the mother mother with π Λ and aligning the mother wafer 10, the shirt reader 3 can store one of the mother wafer 10—single image, store it, and store A The meaning of Yiri-Japanese film 11 is a mother sample 13. If you cut other rounds of the same specifications, the circle is 0 shi 丄 丄. Tian Yaoqian ... rules 0 ° 0 0 'can be automatically aligned by the method of the present invention, : Refer to the tenth figure with cooperation, this method includes the following steps: 1 ---, return to zero: the central processing unit 4 will be in the female month and the mother month page 8 (Please read the precautions on the back before filling in this page} iφ--ί ------ order--r-,-
• I 1- I 516153 曰曰 、發明説明（ 圓10相同之晶圓20 (該晶圓2〇之每一單位晶片2丨均 與該單位晶片11同尺寸，且具有相同的切割方向χ、乂、 切割距離m、D2)的該切割工作台、及該攝影機3驅動 調整至一原點，使該攝影機3的鏡頭3〇1可位於該切割工 作台1的上方。 一、採樣：請參閱第十一圖，該中央處理器4透過該 攝影機3之鏡頭301拍攝存取該晶圓2〇的影像，並與該母 樣本1 3進行影像比對，從而選取出與該母樣本1 3符合之 單位晶片’並將其各定義為一子樣本，本實施例中採得三 個完整的子樣本22、23、24,且記錄其中心點座標值，此 外，在此步驟若無法選取到至少二個子樣本（例如在該晶 圓2〇邊界），該中央處理器4會驅動該切割工作台工沿χ 軸方向平移，及驅動該攝影機3沿γ轴方向平移，以使該 攝影機3可拍攝到至少二個子樣本的影像。 ^ 三、計算間距：請參閱第十一圖，該中央處理器4會 刀別计异任二子樣本22及23、23及24、22及Μ之中心 點間的間距si、S2、S3。 3四、計算間距餘數··在本實施例中，該中央處理器4 是將任二子樣本22及23、23及24、22及24的間距Sl、 =、S3，先對該切割方向χ的切割距離〇ι取餘數，餘數 ^者表示該組子樣本是同樣地位於該切割方向x上。 五、判斷亚選取餘數最小的其中一組子樣本··由第九、 圖可知、亥-子樣本23、24之中心點間的間距S2是 幾乎等於任一。口 定 (考慮製造誤 第9頁 ^------、玎------^ Γ請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 516153 五、發明説明（8 差及浮點運算的誤差）• I 1- I 516153 Description of the invention (wafer 10 with the same wafer 20 (each unit wafer 2 of the wafer 20 is the same size as the unit wafer 11 and has the same cutting direction χ, 乂, Cutting distance m, D2), the cutting table and the camera 3 are driven and adjusted to an origin, so that the lens 3 of the camera 3 can be located above the cutting table 1. I. Sampling: Please refer to section Figure 11. The CPU 4 captures and accesses the image of the wafer 20 through the lens 301 of the camera 3, and compares the image with the mother sample 13 to select the one that matches the mother sample 13 “Unit wafer” and each of them is defined as a sub-sample. In this embodiment, three complete sub-samples 22, 23, and 24 are taken, and the coordinate values of their center points are recorded. In addition, if at least two Sub-samples (for example, at the wafer 20 boundary), the central processing unit 4 drives the cutting table worker to translate along the x-axis direction, and drives the camera 3 to translate along the γ-axis direction, so that the camera 3 can capture Images of at least two sub-samples. ^ Third, calculation room : Please refer to the eleventh figure. The CPU 4 will calculate the distances si, S2, and S3 between the center points of the two sub-samples 22 and 23, 23 and 24, 22, and M. 3 Fourth, calculate the remainder of the distance In this embodiment, the central processing unit 4 sets the pitches S1, =, and S3 of any two sub-samples 22 and 23, 23 and 24, 22, and 24, and first takes the remainder of the cutting distance 〇m in the cutting direction χ. The remainder ^ indicates that the group of sub-samples are also located in the cutting direction x. V. Judging one of the sub-samples with the smallest remaining number of sub-samples. · From the ninth, the figure shows, the center of sub-samples 23 and 24 The distance S2 between the points is almost equal to any one. It is fixed (considering manufacturing errors, page 9 ^ ------, 玎 ------ ^ Γ Please read the precautions on the back before filling this page) Economy Printed by the Ministry of Intellectual Property Bureau's Consumer Cooperatives 516153 V. Description of the Invention (8 Differences and Errors in Floating-Point Arithmetic)
差），且该中心點間距D3 I等於切割 距離D1 ’故，該—A 子樣本23、24的間距Μ對該切割距離 D1所取的餘數將為逼斤 _ ,' ^ 近零，即，該中央處理器4會取選哕 二子樣本23、24為餘數最小的—組子樣本，此外，若在二 步驟所取到的餘數是大於一 ^ 、預。又的A差值，即表示該晶圓 2〇與該母片晶圓10規格不同’是誤放於該切割工作台i 上’則該中央處理器4會立即停止後續步驟的進行，並發Difference), and the center point distance D3 I is equal to the cutting distance D1 '. Therefore, the remainder taken by the distance M of the —A sub-samples 23 and 24 to the cutting distance D1 will be __,' ^ near zero, that is, The central processing unit 4 selects the second sub-samples 23 and 24 as the smallest remaining group of sub-samples. In addition, if the remainder obtained in the two steps is greater than one square, the pre-sampling. Another A difference means that the wafer 20 has a different specification from the mother wafer 10 'is misplaced on the cutting table i', the CPU 4 will immediately stop the subsequent steps and concurrently
出錯誤訊息。 X 、’、由步私四、五可知該組子樣本23、24是同樣地位 ^ X刀方向X上，凊參閱第十二圖，則該中央處理器4 會驅動該切割工作台i以其台面中心點（x〇，y。）為迴轉中 〜點，繞z軸方向轉動，使該組子樣本23、24之切割方 向X轉動至-水平線上，此時，請再參閱第十三圖，為了 保險起見，該中央處理器4會再驅動該切割工作台丨繞z 軸方向轉動九十度，以使該二子樣本23、24之另一切割方 向y亦轉動至一水平線上，並再重複進行步驟二至步驟 六，且在進行步驟四時，是以另一切割距離D2來取餘數， 藉此’以進行第二重自動對正。 七、最後，請參閱第十四圖，該中央處理器4會再驅 動該切割工作台1沿X軸方向平移，及驅動該攝影機3沿 Y軸方向平移，以使該標記5〇2的中心點調整移動至任二 切割道25的交會中心點處，如此，即是使該晶圓2〇位於 一可供該刀片201切割的下刀點。 因此’藉由上述步驟，即可使該晶圓20完成自動對正 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 第10頁 (請先閲讀背面之注意事項再填寫本頁) k. 訂 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 五、發明説明（9 的動作。 經由以上的說明，可再將本發明的優點歸納如下. 後二本發明將第一片母片晶圓以手動調整方式對』 餘相同規格之晶圓即可交由該中央處理器 明之方法自動對正，故，本發明的對正速度快、有效率且 不易出錯:使業者可在最短時間内將成品交至客戶手中享且 進而提兩業者的競爭力。 二、本發明之方法只需具有單—鏡頭的切割機，即可 進仃操作’故，可有效降低生產設備成本，且不會產生雔 鏡頭切割機之適用性不佳的問題。 又 值得-提的是’如第十五圖所示，本發明亦可應用於 —形成有多數六角形單位晶片31之晶_上，其中，該等 單位晶片的三組對邊可區分為三切割方向…χΐ2。、 如。’則在步驟六時，該晶圓3〇可進行第二重自動對正及 第三重自動對正，…亦可達到與上述相同的目的與功 效。 知納上述’本發明之晶圓自動對正的方法’不僅可快 速自動對正’並可與具單鏡頭之切割機搭配使用，故確實 能達到發明之目的。 f隹X上所述者，僅為本發明之一較佳實施例而已，當 不月b以此限定本發明實施之範圍，即大凡依本發明申請專 利範圍及創作說明書内容所作之簡單的等效變化與修飾， 皆仍屬本發明專利涵蓋之範圍内。 丨請先聞讀背面之注意事頃#真^,艮ί) ---- 、1Τ 線- 本紙張尺度適用(CNS) A4· ( 210x297公慶J 第11頁 516153 A7 B7 五、發明説明（l〇 ) 【元件標號對照】 習知圖示中之元件標號： 經濟部智慧財產局員工消費合作社印製 100…切割機 1…切割工作台 1 01…晶圓 1011…單位晶片 1012…切割道 2…刀轴 201···刀片 3…攝影機 301…鏡頭 4···中央處理器 401…類比/數位轉換器 402···影像記憶裝置 5···顯示器 501…視窗 5 0 2…標記 503··.中央縱線 504···中央水平線 505…上標線 506···下標線 本發明圖式中之元件標號： 10…母片晶圓 11…單位晶片 12…切割道 13…母樣本 2 0…晶圓 21…單位晶片 22…子樣本 23…子樣本 24…子樣本 2 5…切割道 30···晶圓 31···單位晶片 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 第12頁An error message appears. X, ', according to Steps IV and V, it can be known that the group of sub-samples 23 and 24 have the same status ^ X knife direction X, 凊 refer to the twelfth figure, then the central processing unit 4 will drive the cutting table i The center point of the table (x0, y.) Is the middle point of the rotation, and rotates around the z-axis direction, so that the cutting direction X of the sub-samples 23 and 24 is turned to the-horizontal line. At this time, please refer to the thirteenth figure again For security reasons, the central processing unit 4 will drive the cutting table again and rotate 90 degrees around the z-axis direction, so that the other cutting direction y of the two sub-samples 23 and 24 is also rotated to a horizontal line, and Repeat step 2 to step 6 again, and when step 4 is performed, take the remainder at another cutting distance D2, thereby 'to perform the second automatic alignment. 7. Finally, referring to the fourteenth figure, the central processing unit 4 will then drive the cutting table 1 to translate in the X-axis direction, and drive the camera 3 to translate in the Y-axis direction so that the center of the mark 50 The point adjustment is moved to the intersection center point of any two cutting lanes 25, so that the wafer 20 is located at a lower cutting point where the blade 201 can be cut. Therefore, 'with the above steps, the wafer 20 can be automatically adjusted to the original paper size to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) page 10 (please read the precautions on the back before filling this page) k. Order printed by the consumer property cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. The description of the invention (9 actions. Through the above description, the advantages of the present invention can be summarized as follows. The invention aligns the first mother wafer by manual adjustment. The remaining wafers of the same specifications can be automatically aligned by the central processor. Therefore, the alignment of the present invention is fast, efficient, and not prone to errors. : Allows the operator to deliver the finished product to the customer in the shortest time and further enhances the competitiveness of the two operators. 2. The method of the present invention can be operated only by a single-lens cutting machine, so it can be effective Reduce the cost of production equipment, and do not cause the problem of poor applicability of the lens cutting machine. It is also worth mentioning that 'as shown in Figure 15, the present invention can also be applied to-formation On the crystal of most hexagonal unit wafers 31, among which the three sets of opposite sides of the unit wafers can be divided into three cutting directions ... χΐ2, such as ... ', then in step 6, the wafer 30 can be subjected to the first The double automatic alignment and the third automatic alignment can also achieve the same purpose and effect as above. Knowing that the above-mentioned "method of automatic wafer alignment of the present invention" can not only be quickly and automatically aligned, but also be compatible with The cutting machine with a single lens can be used in combination, so it can indeed achieve the purpose of the invention. The above-mentioned f 隹 X is only a preferred embodiment of the present invention. When this is the case, the scope of the implementation of the present invention is limited by this. That is, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the creative description of the present invention are still covered by the patent of the present invention. 丨 Please read the notes on the back first # 真 ^, 根 ί) ---- 、 1Τ Line-This paper is suitable for (CNS) A4 · (210x297 Gongqing J p.11 516153 A7 B7 V. Description of the invention (10) [Comparison of component numbers] Component numbers in the conventional illustration: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 100 ... cutting machine 1 ... cutting table 1 01 ... wafer 1011 ... unit wafer 1012 ... cutting line 2 ... shaft 201 ... blade 3 ... camera 301 ... lens 4 ... central processing unit 401 ... analog / digital conversion Device 402 ... Video memory device 5 ... Display 501 ... Window 5 0 2 ... Mark 503 ... Center vertical line 504 ... Center horizontal line 505 ... Superscript line 506 ... Subscript line Element number in: 10 ... mother wafer 11 ... unit wafer 12 ... scribe line 13 ... mother sample 2 0 ... wafer 21 ... unit wafer 22 ... sub sample 23 ... sub sample 24 ... sub sample 2 5 ... scribe line 30 ··· Wafer 31 ··· Unit wafer (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) Page 12