514766 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（） 發明背景： 本發明係一種货光模組導光板模仁及其製造方法，特 別是指一種使用Μ製造非印刷式黄光模組導光板之宽光模 組導光板模仁及其製造方法。 、 按，在液晶顯示器（LCD)之中，背光模組係為相當 • 重要的零組件’其功用主要為提供液晶顯示器顯示畫面所 需要的光源。 如圖11所示’係一液晶顯示器背光模組的構造，其中 主要包括··一光源1，係可產生一線性的光線；及一反射 罩2，係呈弧形，且可將該光源丨的光線朝向一特定方向反 射；及一導光板3，係設置在光源1的一側，其可將該光源 1所產生的光線從該導光板3的一側導引到該導光板3的另 外一側；及一擴散片裝置4，係設置在導光板3的上方，用 以將導光板3所反射的光線擴散，而使得整個液晶顯示器 的畫面產生均句，且呈面狀的光線；及一反射板6，係設 置在導光板3的底面。 其中該導光板3係以透明導光材質製成的板狀體，其 靠近該光源1的一端的厚度較厚，而另一端的厚度較薄， 且其底面設置有若干的反射子5，該若干反射子5係與導光 板3具有不同的折射係數，因此使得光源1的光線傳遞到該 若干反射子5的時候，可以將光線朝向導光板3的頂面反射 ，而使得光源1所產丰的光線可Μ朝向導光板3的頂面方向 擴散開來。同時，由於光源1的光線在導光板3內傳遞時， 其光線的強度會隨著距離光源的遠近而減弱，因此該導光 一2 一 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） I 裝---------訂-----II — -線 (請先閱讀背面之注意事項再填寫本頁) 514766 經濟部中央標準局員工消費合作社印製 A7 _ _B7___五、發明説明（） 板3背面於靠近該光源1之一側的反射子密度較低，而在遠 離光源一端的反射子5的密度較高，因此使得該導光板3能 夠藉由反射子5不同密度的安排，而獲得均勻且一致的輝 度。 習用的導光板3與其反射子5的構造大致上可分為二類 :一為印刷式的導光板，而另一種則為非印刷式的導光板 。印刷式導光板3的構造如圖11所示，其係將含有光亂反 射粒子的透明樹脂以印刷方式塗附在導光板3的货面，而 形成前述的反射子5。該種印刷式的導光板3由於光線必須 穿過樹脂方能夠接觸到光亂反射粒子，因此使得反射子5 所能夠反射的光線強度減弱，因此而影響到了整個背光模 組所能夠產生之光線強度，因此造成其嚴重的缺點。 如圖12所示，係為另外一種非反射式導光板3A的構造 ，該種非反射式導光板3A的構造係於透明的導光板3A的背 面Μ切割或是直接射出成形的方式，設置有若干凹入或突 出的反射子5Α，藉由該若干反射子5Α達到擴散光線的目的 。該種非印刷式導光板3的主要優點係為其反射子5Α直接 與光線接觸，因此能夠反射的光線強度優於印刷式的導光 板，而且其製造過程中可以免除印刷反射子5的程序，因 此可以簡化製程，且降低不良率，並提高生產速度。 上述的反射子5々可以利用切削加工的方式在導光板3Α 的费面刻畫凹入的溝槽的方式製造而成，也可Μ使用一個 具有凹入或是凸點的撗仁，在射出成形時直接在導光板3Α 的背面形成上述的反射子5Α。如圖13至圖21所示，係為一 一3 — (請先閱讀背面之注意事項本頁) 裝· 訂 線- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 83. 3.10,000 514766 lit部私慧財產局員工消費合作社印製 Α7 Β7 五、發明説明（） 種用Μ生產該種非印刷式導光板3M吏用之模仁的製造方法 ，其製造程序如下： 首先’如圖13所，係於一"個平面基板10上塗上一^層 的光阻劑11，然後再如圖14所示地將光阻劑11以曝光顯影 ，而使得光阻劑11在平面基板10的表面形成若干突出的圖 案。然後再如圖15所示，將保留於平面基板1〇上的光阻劑 11經由熱整形的程序，使該若干光阻劑11形成圓狐形突出 的形狀；然後再如圖16所示，再於平面基板10與光阻劑11 的表面塗附一層的_晶種12。 當平面基板10表面完成鎳晶種12後，再如圖17所示， 以電鏡的方式在鎳晶種12的上方累積一層的鎳金屬，形成 一個模仁13，然後再如圖18所示，將橫仁13與平面基板10 脫離。與平面基板1〇脫離的模仁13的表面形成若干凹凸的 形狀，因此可藉以形成該導光板3Α的表面形狀。 如圖19所示，當模仁13與平面基板10脫離後，由於平 面基板10的黄面可能有不平整的狀態，因此必須以研磨方 式將模仁13的背面磨平。在研磨進行之前，必須在模仁13 底面塗上一層保護膠14，再放置到研磨機上進行研磨，以 避免模仁13的表面受到破壞。而當模仁13背面研磨完成後 ，便可將保護膠14除去。 如圖20所示，當橫仁13製造完成後，可將模仁13裝置 於用以射出形成前述之導光板3Α的横具中，並利用該模仁 13的凹凸表面形成上述導光板3Α的表面形狀，因此脫模之 後，便形成上述的導光板3Α (如圖21所示）。 一4 一 本紙張尺度適用中國國家標準（CNS ) Α4規格（21〇><297公釐） 1· 111 n. _ I . n 訂 11 I !線 (.請先閱讀背面之注意事項再填寫本頁) 514766 經濟部智慧財產局員工消費合作社印製 A7 _B7__五、發明説明（） 然而，該習用的導光板模仁的製造方法卻存有下歹u問 題，其中該平面基板10的表面必須先種植一層的鎳晶種12 ，然後再以電鑄方式在鎳晶種12上成形前述的模仁13 ’因 此在模仁13的表面會保留有該鎳晶種12。而該鎳晶種12在 模仁13與平面基板10脫離時，會因為鎳晶種12與平面基板 10與光阻劑11表面的附著力，而產生剝離的狀態，因此影 響橫仁13的表面粗度，同時也增加了模仁13製造的不良率 。同時該鎳晶種12與模仁13相互間的结合度不如一體成形 的材料一般地理想，因此在使用過程中，橫仁13表面的鎳 晶種12極容易剝離，因此造成模仁13損壞的情形，而影響 到了橫仁13的使用壽命。 由於以上之原因使得習用的非印刷式導光板3A的製造 上存有相當嚴重之缺點，發明人有鑑於此，乃苦思细索， 積極研究，加Μ多年從事相關產品研發之經驗，並經不斷 試驗及改良，終於發展出本發明。 發明概述： 本發明之主要目的，在於提供一種可以提高非印刷式 導光板模仁之表面光度，且延長模仁使用壽命之背光模組 導光板模仁及其製造方法。 本發明之另一目的，在於提供一種簡化導光板模仁之 製造程序，並減低模仁製造不良率之黄光模組導光板模仁 及其製造方法。 本發明為達成上述及其他目的，其所採用之技術手段 、元件及其功效，玆採一較佳實施例，並配合相關圖式詳 一5 — 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） (請先閲讀背面之注意事項再填頁) •裝· 訂 -線 514766 A7 ， _______B7_______五、發明説明（） 細說明如下。 圖式說明： 圖1至圖10係為本發明之货光模組導光板橫仁製造流程的 連續示意圖。 圖11係為習用之印刷式導光板，及货光模組的組合剖面圖。 圖12係為一種習用的非印刷式導光板的剖面圖。 圖13至圖21係為習用之非印刷式導光板模仁製造流程的連 您濟部%.慧財產局員工消費合作社印製· 續示意圖 圖號說明： 1 光源 3、3A導光板 5、5A反射子 10平面基板 12 $梟晶種 14保護膠 20平面基板 22光阻劑ί 30銅晶種 40模仁 50保護膨 60導光板 詳細說明： 2反射罩 4擴散片裝置 6反射板 11光阻劑 13模仁 21聚亞醯胺 23光阻劑圖案 裝 . 訂 線 (請先閱讀背面之注意事項再填寫本頁) 61反射子 如圖1至圖1〇所示，本發明之背光模組（back Hght) 導光板（light guide)模仁及其製造方法主要的製造流 一6 - ^氏張尺度適用中國國I標準（CNS ) A4規格（2l〇X297公釐） 514766 A7 B7 五、發明説明（） 程包括：首先，如圖1所示，係於一平面基板20的表面塗 附一層的聚亞醯胺21，然後再於聚亞醯胺21的表面塗上一 層光阻劑22。該程序中，聚亞_胺21的主要目的係為增加 電鑄完成後之模仁的表面光度，然而該程序並非絕對必要 ，也可Μ選擇省略該步驟，而只在平面基板20表面塗上光 阻劑22。 光阻劑22與聚亞醯胺21的塗佈方法可Μ選用旋轉塗怖 (spin coating)、浸沾式（dip)、滾筒式（roll)，、噴塗 式（spray)、擠壓式（slot die)等方式。同時，光阻劑22 也不限制其成份，可為正光阻劑也可為負光阻劑。 接著如圖2所示，Μ曝光顯影方式將光阻劑22顯影， 而使得光阻劑22部份被去除，部份保留於平面基板20的表 面，而形成若干密佈的光阻劑圖案23。接著如圖3所示， 再以熱整型方式將平面基板20表面的光阻劑圖案23整型為 所需要的形狀。在該實施例中，光阻劑圖案23被整型為圓 弧狀，不過在某些實施例中，該光阻劑圖案23並不需經過 熱整型，因此該熱整型的步驟係為可選擇的步驟。 如圖4所示，本發明最關鍵的步驟係為當光阻劑圖案 23整型完成後，便可再Μ灘鑛、蒸鑛、或噴鍍等方式在平 面基板20與光阻劑圖案23的表面植附一層的銅金屬，而形 成一銅晶種30，然後再如圖5所示，於銅晶種30的表面Μ 電鑄方式成形一模仁40。該模仁40的電鑄材料可以選擇鎳 (Ni)、_古合金（NiCo)、或混合碳化矽（SiC)的高硬度材 質。 一Ί 一 本紙張尺度適用中國國家標準（CNS ) A4規格（2!〇Χ297公釐） -----參-- ^- (請先閱讀背面之注意事項再頁) 訂 線 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 514766 I t -- A7 、 B7 五、發明説明（） 然後再如圖6及圖7所示，將橫仁40與平面基板20脫離 後，可再於模仁表面塗上一層保護膠50，然後再將模仁40 放置於研磨機器上，將模仁40的费面磨平。 如圖8所示，當模仁40研磨完成後，並將保護膠去除 後，必須再Μ蝕刻方式將模仁40表面的銅晶種30去除。此 時由於銅晶種30與模仁40係為不同材質，所Μ在蝕刻銅晶 種30時，模仁40的材料可以完整地被保留。 φ 如圖9及圖10所示，該横仁40製造完成後，可將模仁 40裝置於用Μ射出成形的模具中，並利用該模仁40的凹凸 表面形成導光板60的表面形狀，因此脫模之後，便形成一 導光板60。該導光板60如圖10所示，由於模仁40表面的凹 凸形狀，因此在其一側表面形成有若干的反射子61。同時 ，該導光板60成形完成後，可再進一步地進行熱整型的程 序。 ~ 本發明之方法，由於模仁40與平面基板20之間存有一 層銅晶種30作為隔離，而該銅晶種30在模仁成形後會再藉 β由触刻的方式將其去除，所Μ使得模仁40完成後表面不會 附有一層以噴鍍或濺鍍等方式產生的晶種層。 因此，Μ本發明之方法所製造完成的模仁40在與平面 基板20脫離時，銅晶種30雖然也會有剝離的現象產生，但 是由於該銅晶種30在事後會將其蝕刻去除，所Μ根本不會 造成模仁40表面粗糙的情形發生，因此可Μ提高模仁40的 表面光度。Μ本發明的方法與習用的方法相較下，本發明 方法所製成的模仁40的表面光度可以達到小於〇·8ηπι 一8一 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X297公釐） — 裝 訂 線 (請先閲讀背面之注意事項再填寫本頁) 514766 A7 _B7 _ 五、發明説明（） (nm = l〇- 9 m)的精度，而以習用方法所製成者約只能夠達 到0.05^/m = 10 — 9 m)的表面光度，因此本發明所能夠 達成的模仁40表面光度的要求顯然優於習用的技術。同時 更可避免晶種層與橫仁脫離，而形成不良品的情形，因此 能夠提升模仁40的製造良率。而且，本發明的方法所製造 的模仁40其表面不會留有一層脆弱的晶種層，因此在長時 間使用後，並不會因為模仁表面之晶種曆剝離，而造成損 ° 一9 一 (請先閱讀背面之注意事項再頁) •裝· 、1Τ 線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4规格（21 〇 X 297公釐）514766 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () Background of the invention: The present invention relates to a light guide plate mold core for a light module and a method for manufacturing the same. A light guide plate mold core for a wide light module that groups light guide plates and a manufacturing method thereof. , Press. In the LCD, the backlight module is equivalent. • The important component ’is mainly used to provide the light source required for the LCD display screen. As shown in FIG. 11 'is a structure of a backlight module of a liquid crystal display, which mainly includes a light source 1 which can generate a linear light; and a reflection cover 2 which is arc-shaped and can be used as the light source 丨Light is reflected in a specific direction; and a light guide plate 3 is disposed on one side of the light source 1 and can guide the light generated by the light source 1 from one side of the light guide plate 3 to the other of the light guide plate 3 One side; and a diffusion sheet device 4 arranged above the light guide plate 3 to diffuse the light reflected by the light guide plate 3 so that the entire LCD screen produces uniform and planar light; and A reflecting plate 6 is disposed on the bottom surface of the light guide plate 3. The light guide plate 3 is a plate-shaped body made of transparent light guide material. The thickness of one end near the light source 1 is relatively thick, and the thickness of the other end is relatively thin. The plurality of reflectors 5 have different refractive indexes from the light guide plate 3, so that when the light from the light source 1 is transmitted to the plurality of reflectors 5, the light can be reflected toward the top surface of the light guide plate 3, so that the light source 1 produces abundant The light rays may diffuse toward the top surface of the light guide plate 3. At the same time, since the light of the light source 1 is transmitted in the light guide plate 3, the intensity of the light will be weakened as the distance from the light source, so the light guide 2-1 paper size applies to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) I installed --------- Order ----- II — -line (Please read the precautions on the back before filling out this page) 514766 Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 _ _B7___ V. Description of the invention () The density of the reflector on the back of the plate 3 near one side of the light source 1 is low, and the density of the reflector 5 on the side far from the light source is higher, so that the light guide plate 3 can be used by The reflectors 5 are arranged at different densities to obtain uniform and consistent luminance. The structure of the conventional light guide plate 3 and its reflector 5 can be roughly divided into two categories: one is a printed light guide plate, and the other is a non-printed light guide plate. The structure of the printed light guide plate 3 is shown in FIG. 11. A transparent resin containing light-scattering reflective particles is printed on the cargo surface of the light guide plate 3 to form the aforementioned reflector 5. Since this type of printed light guide plate 3 must pass through the resin to be able to contact the light reflection particles, the intensity of the light reflected by the reflector 5 is weakened, which affects the intensity of the light generated by the entire backlight module. , Thus causing its serious disadvantages. As shown in FIG. 12, it is a structure of another non-reflective light guide plate 3A. The structure of the non-reflective light guide plate 3A is formed by cutting the back surface of the transparent light guide plate 3A or by direct injection molding. A plurality of concave or protruding reflectors 5A are used to achieve the purpose of diffusing light. The main advantage of this non-printing light guide plate 3 is that its reflector 5A is in direct contact with light, so the intensity of the light that can be reflected is better than that of the printed light guide plate, and the process of printing the reflector 5 can be eliminated in the manufacturing process. Therefore, the process can be simplified, the defect rate can be reduced, and the production speed can be increased. The above-mentioned reflector 5々 can be manufactured by cutting the recessed grooves on the free surface of the light guide plate 3A by cutting, or it can be used for injection molding with a concave or convex coix. At this time, the above-mentioned reflector 5A is directly formed on the back surface of the light guide plate 3A. As shown in Figures 13 to 21, it is a one-to-one 3-(Please read the precautions on the back page first) Binding · Binding-This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) 83. 3.10,000 514766 lit Printed by the Consumers ’Cooperative of the Intellectual Property Office of the Ministry A7 B7 V. Description of the invention () A method for manufacturing the non-printing light guide plate 3M mold core used by M. The manufacturing process is as follows: First 'As shown in FIG. 13, a layer of photoresist 11 is coated on a flat substrate 10, and then the photoresist 11 is exposed and developed as shown in FIG. 14, so that the photoresist 11 is in the A number of protruding patterns are formed on the surface of the planar substrate 10. Then, as shown in FIG. 15, the photoresist 11 remaining on the planar substrate 10 is subjected to a thermal shaping process to form the plurality of photoresist 11 into a round fox shape. Then, as shown in FIG. 16, A layer of seed crystal 12 is coated on the surfaces of the planar substrate 10 and the photoresist 11. After the nickel seed 12 is completed on the surface of the planar substrate 10, as shown in FIG. 17, a layer of nickel metal is accumulated on the nickel seed 12 by an electron microscope to form a mold core 13, and then as shown in FIG. 18, Disengage the horizontal core 13 from the flat substrate 10. The surface of the mold core 13 separated from the planar substrate 10 has a number of uneven shapes, so that the surface shape of the light guide plate 3A can be formed. As shown in FIG. 19, when the mold core 13 is detached from the flat substrate 10, the yellow surface of the flat substrate 10 may be uneven, so the back surface of the mold core 13 must be ground by grinding. Before grinding, a layer of protective glue 14 must be applied to the bottom surface of the mold core 13 and then placed on the grinder for grinding to prevent the surface of the mold core 13 from being damaged. After the back of the mold core 13 is ground, the protective glue 14 can be removed. As shown in FIG. 20, after the manufacture of the horizontal core 13 is completed, the mold core 13 may be installed in a crosspiece for forming the aforementioned light guide plate 3A, and the concave-convex surface of the mold core 13 is used to form the light guide plate 3A. The surface shape, so that after the demolding, the above-mentioned light guide plate 3A is formed (as shown in FIG. 21). 1 4 A paper size applies the Chinese National Standard (CNS) A4 specification (21〇 < 297 mm) 1 · 111 n. _ I. N Order 11 I! Line (. Please read the precautions on the back before reading) (Fill in this page) 514766 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7__ V. Invention Description () However, the manufacturing method of the conventional light guide plate mold has the following problems. Among them, the flat substrate 10 A layer of nickel seed 12 must be planted on the surface, and then the aforementioned mold core 13 ′ is formed on the nickel seed 12 by electroforming, so the nickel seed 12 will remain on the surface of the mold core 13. When the nickel seed 12 is detached from the planar substrate 10, the nickel seed 12 is peeled off due to the adhesion between the nickel seed 12 and the surface of the planar substrate 10 and the photoresist 11 and thus affects the surface of the horizontal seed 13. The thickness also increases the defect rate of mold core 13. At the same time, the degree of bonding between the nickel seed 12 and the mold core 13 is not as ideal as that of an integrally formed material. Therefore, during use, the nickel seed 12 on the surface of the cross core 13 is easily peeled off, which causes damage to the mold core 13 Situation, which affects the service life of Hengren 13. Due to the above reasons, there are quite serious shortcomings in the manufacture of the conventional non-printing light guide plate 3A. In view of this, the inventors have thought hard, actively researched, and added years of experience in research and development of related products. Through continuous testing and improvement, the present invention has finally been developed. Summary of the invention: The main object of the present invention is to provide a backlight module light guide plate mold which can improve the surface luminosity of the non-printing light guide plate mold core and prolong the service life of the mold core and a manufacturing method thereof. Another object of the present invention is to provide a yellow light module light guide plate mold core that simplifies the manufacturing process of the light guide plate mold core and reduces the manufacturing defect rate of the mold core, and a manufacturing method thereof. In order to achieve the above and other objectives, the present invention adopts the technical means, components and effects thereof, and adopts a preferred embodiment, and cooperates with the related drawings in detail. 5 — This paper standard is applicable to the Chinese National Standard (CNS) A4 specification. (210X297mm) (Please read the precautions on the back before filling in the page) • Binding · Binding-Line 514766 A7, _______B7_______ V. Description of the invention () The detailed description is as follows. Description of the drawings: Figures 1 to 10 are continuous schematic diagrams of the manufacturing process of the light guide plate transverse kernel of the light module of the present invention. FIG. 11 is a combined sectional view of a conventional printed light guide plate and a cargo light module. FIG. 12 is a cross-sectional view of a conventional non-printing light guide plate. Figure 13 to Figure 21 are the conventional non-printing light guide plate mold core manufacturing process for the Ministry of Economic Affairs. Printed by the Consumers' Cooperative of the Hui Property Bureau. Continued schematic drawing description: 1 light source 3, 3A light guide plate 5, 5A Reflector 10 plane substrate 12 $ 枭 crystalline seed 14 protective glue 20 plane substrate 22 photoresist ί 30 copper seed 40 mold kernel 50 protection expanded 60 light guide plate Detailed description: 2 reflection cover 4 diffuser device 6 reflection plate 11 photoresist Agent 13 mold kernel 21 polyurethane 23 photoresist pattern package. Thread (please read the precautions on the back before filling this page) 61 reflector as shown in Figure 1 to Figure 10, the backlight module of the present invention (Back Hght) Light guide mold core and its manufacturing method Main manufacturing flow-6-^ Zhang scale is applicable to China National Standard (CNS) A4 specifications (210x297 mm) 514766 A7 B7 V. Invention The description () process includes: first, as shown in FIG. 1, a layer of polyurethane 21 is coated on the surface of a flat substrate 20, and then a layer of photoresist 22 is coated on the surface of polyurethane 21. In this procedure, the main purpose of polyimide 21 is to increase the surface gloss of the mold core after electroforming, but this procedure is not absolutely necessary. You can also choose to omit this step and only coat the surface of the planar substrate 20 Photoresist 22. The coating method of the photoresist 22 and the polyimide 21 can be selected from spin coating, dip, roll, spray, and slot. die) and so on. At the same time, the photoresist 22 is not limited in composition, and may be a positive photoresist or a negative photoresist. Then, as shown in FIG. 2, the M exposure and development method develops the photoresist 22, so that part of the photoresist 22 is removed and part of the photoresist 22 remains on the surface of the planar substrate 20 to form a plurality of dense photoresist patterns 23. Next, as shown in FIG. 3, the photoresist pattern 23 on the surface of the planar substrate 20 is shaped into a desired shape by a thermal shaping method. In this embodiment, the photoresist pattern 23 is shaped into an arc shape. However, in some embodiments, the photoresist pattern 23 does not need to undergo thermal shaping. Therefore, the thermal shaping step is Optional steps. As shown in FIG. 4, the most critical step of the present invention is that after the photoresist pattern 23 is shaped, the flat substrate 20 and the photoresist pattern 23 can be formed on the planar substrate 20 and the photoresist pattern 23 by means of ore mining, vaporization, or sputtering. A layer of copper metal is planted on the surface of the substrate to form a copper seed 30. Then, as shown in FIG. 5, a mold kernel 40 is formed on the surface of the copper seed 30 by electroforming. The electroforming material of the mold core 40 can be selected from nickel (Ni), palladium alloy (NiCo), or silicon carbide (SiC) high hardness materials. A paper size applies to the Chinese National Standard (CNS) A4 specification (2! 〇 × 297 mm) ----- Refer to-^-(Please read the precautions on the back before page) Intellectual property of the Ministry of Economics Printed by the Bureau ’s Consumer Cooperatives Printed by the Ministry of Economics ’Intellectual Property Bureau ’s Consumer Cooperatives’ printed 514766 I t-A7, B7 V. Description of the invention () Then, as shown in Figures 6 and 7, the Hengren 40 is separated from the flat substrate 20 After that, a layer of protective glue 50 can be coated on the surface of the mold kernel, and then the mold kernel 40 is placed on a grinding machine to smooth the surface of the mold kernel 40. As shown in FIG. 8, after the mold kernel 40 is ground and the protective glue is removed, the copper seed crystal 30 on the surface of the mold kernel 40 must be removed by M etching. At this time, since the copper seed crystal 30 and the mold kernel 40 are different materials, when the copper seed crystal 30 is etched, the material of the mold kernel 40 can be completely retained. φ As shown in FIG. 9 and FIG. 10, after the Yoko 40 is manufactured, the die 40 can be installed in a mold formed by M injection, and the surface shape of the light guide plate 60 can be formed by using the uneven surface of the die 40. Therefore, a light guide plate 60 is formed after demolding. As shown in Fig. 10, the light guide plate 60 has a concave-convex shape on the surface of the mold core 40, so that a number of reflectors 61 are formed on one side surface. At the same time, after the light guide plate 60 is formed, the thermal shaping process can be further performed. ~ In the method of the present invention, since a layer of copper seed 30 exists as a separation between the mold core 40 and the flat substrate 20, and the copper seed 30 is removed by β by etching after the mold core is formed, The M prevents the surface of the mold core 40 from being attached with a seed layer produced by spraying or sputtering. Therefore, when the mold kernel 40 manufactured by the method of the present invention is detached from the planar substrate 20, although the copper seed crystal 30 may also be peeled off, the copper seed crystal 30 will be removed by etching afterwards. Since the surface roughness of the mold core 40 does not occur at all, the surface brightness of the mold core 40 can be improved. Μ Compared with the conventional method, the surface luminosity of the mold kernel 40 made by the method of the present invention can reach less than 0 · 8ηπι—the paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 °). X297 mm) — gutter (please read the precautions on the back before filling this page) 514766 A7 _B7 _ V. The accuracy of the description of the invention () (nm = 10- 9 m), and the custom made method It can only reach a surface luminosity of about 0.05 ^ / m = 10-9 m). Therefore, the surface luminosity requirement of the mold core 40 that can be achieved by the present invention is obviously better than the conventional technology. At the same time, it is possible to avoid the situation where the seed layer is separated from the horizontal kernel and a defective product is formed. Therefore, the manufacturing yield of the mold kernel 40 can be improved. In addition, the mold kernel 40 produced by the method of the present invention does not leave a fragile seed layer on the surface, so after a long period of use, it will not cause damage due to the peeling of the seed crystal on the surface of the mold kernel. 9 I (Please read the precautions on the back first, and then the page) • Packaging, 1T Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Employee Consumption Cooperatives This paper is printed in accordance with the Chinese National Standard (CNS) Α4 specification (21 0X 297 mm)