AOC-06-01-TW M303393 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種背光模組之導光板微結構，尤指一種 該導光板底面形成非印刷式之微透鏡陣列的圖形。 【先前技術】 - 第一圖所示，即為一種習用LED背光模組立體分解圖， 其係由一導光板（11)、反射片（12)及複數個發光二極體（13) 所構成。如第二圖所示，該等發光二極體（13)係電性連接在 ® —電路板（14)上，其所發出之光線可穿過透光之導光板（11)， 並經由反射片（12)反射而從上方之出光面射出，必要時需於 出光面上方設一擴散片（圖未示），另使用一遮光片（15)覆蓋 在發光二極體（13)上方，防止光透出及於發光處產生亮帶。 惟查，上揭習知背光模組（10)，其發光源係設於導光板 (11)的侧邊，易因光源入射角度不良，而導致整個背光模組 (10)亮度不均勻的現象，乃無法有效散佈至出光面，影響其發 光輝度、均勻度及色彩混合度等。 # 因此，習用之導光板（11)有的會將表面設成粗糙面或網 點圖型（Pattern),藉以增加發光效益及混光效果；惟查，習用 導光板（11)表面之圖形，有的使用印刷方式所形成，但此種構 '造之圖形，其對於增加發光效益有其侷限。而另一種方式係 - 以蝕刻咬花製程或雷射雕刻製程製作導光板母模，再射出成 型導光板；但蝕刻製程會有蝕刻時間過長，蝕刻表面過於平 滑，蝕刻深度與直徑有其極限等問題點，另蝕刻與雷射製程 之母模結構的重現性不好，當模具有損壞時，不易製作相同 -5-AOC-06-01-TW M303393 VIII. New Description: [New Technology Field] This paper is about the microstructure of a light guide plate of a backlight module, especially the non-printing microlens array on the bottom surface of the light guide plate. Graphics. [Prior Art] - The first figure shows an exploded view of a conventional LED backlight module, which is composed of a light guide plate (11), a reflection sheet (12) and a plurality of light emitting diodes (13). . As shown in the second figure, the light-emitting diodes (13) are electrically connected to the circuit board (14), and the light emitted by the light-emitting diodes (11) can pass through the light-transmitting light guide plate (11) and is reflected. The sheet (12) is reflected and emitted from the upper surface, and if necessary, a diffusion sheet (not shown) is disposed above the light-emitting surface, and a light-shielding sheet (15) is used to cover the light-emitting diode (13) to prevent Light is emitted and a bright band is produced at the illuminating place. However, it is found that the backlight module (10) is provided on the side of the light guide plate (11), which is easy to cause uneven brightness due to the incident angle of the light source, resulting in uneven brightness of the entire backlight module (10). , can not be effectively spread to the light surface, affecting its luminous brightness, uniformity and color mixing. # Therefore, some light guide plates (11) will be used to set the surface as a rough surface or a dot pattern (Pattern) to increase the luminous efficiency and the light mixing effect. However, the pattern of the surface of the light guide plate (11) is used. It is formed by using a printing method, but such a structure is limited in its ability to increase luminous efficiency. The other way is to make the light guide master by etching the biting process or the laser engraving process, and then projecting the light guide plate; but the etching process has too long etching time, the etching surface is too smooth, and the etching depth and diameter have their limits. Such as the problem point, the reproducibility of the etched and laser process master mold structure is not good, when the mold is damaged, it is not easy to make the same -5-
M3 03 3 93 AOC-06-01-TW 的陣列圖形結構，致使背光模組的品質難以一致及揮控，故 仍有改善空間。 以往的微機電製程，均是以透明基板如玻璃上蒸鍍獲得 之金屬材來施行，而非以矽體為基材，故製程上有改善之處。 【新型内容】 緣是，本創作之主要目的，係在提供一種背光模組之導 光板微結構，其利用微機電系統(MEMS)製程來製作母模，再 射出成型導光板，可以明確定義微透鏡陣列的圖型，使得微 透鏡陣列結構之再現性高，可更有效管理背光模組的品質。 本創作之又一目的，則在提供一種背光模組之導光板微 結構，其微透鏡陣列（MLA)具有幫助發光源射入光線的均勻 擴散，增加發光效益及混光效果。 為達上述目的，本創作之技術手段包含： 一導光板，係由光學級塑料以金屬模仁射出成型；以及 在該導光板底面形成非印刷式之微透鏡陣列 (Micro-lens array，MLA)的圖型（Pattern) 〇 依據前揭特徵，本創作之微透鏡陣列（MLA)包括呈内凹 及外凸型態的圖型（Pattern)皆可。且所述圖型包括·半圓 形、碗形、橢圓形、凸弧形等其中任一型態所構成者。 【實施方式】 首先，請參閱第三圖所示，其係揭示一種微機電系統 (MEMS)製程中石夕體型微加工（silicon bulk micro machining) 製作矽基板模仁（20)的示意圖，其主要係於一基板（21)上塗 佈光阻（22)，然後利用光罩（23)及光源（24)曝光而顯影（25)，M3 03 3 93 AOC-06-01-TW The array pattern structure makes the quality of the backlight module difficult to control and control, so there is still room for improvement. In the past, the microelectromechanical process was carried out by using a metal material obtained by vapor deposition on a transparent substrate such as glass, instead of using a carcass as a substrate, so that there was an improvement in the process. [New content] The main purpose of this creation is to provide a light guide plate microstructure of a backlight module, which uses a microelectromechanical system (MEMS) process to make a master mold, and then shoots a light guide plate, which can clearly define the micro The pattern of the lens array makes the microlens array structure highly reproducible, and the quality of the backlight module can be more effectively managed. Another object of the present invention is to provide a light guide plate microstructure of a backlight module, and the microlens array (MLA) has a uniform diffusion of light incident on the light source to increase the luminous efficiency and the light mixing effect. In order to achieve the above objectives, the technical means of the present invention comprises: a light guide plate which is formed by optical mold plastic injection molding; and a non-printed micro lens array (MLA) is formed on the bottom surface of the light guide plate. Pattern According to the predecessor features, the microlens array (MLA) of the present invention includes both a concave and a convex pattern. And the pattern includes a semicircular shape, a bowl shape, an elliptical shape, a convex arc shape, and the like. [Embodiment] First, referring to the third figure, a schematic diagram of a silicon bulk micro machining in a microelectromechanical system (MEMS) process for fabricating a germanium substrate mold core (20) is disclosed. Applying a photoresist (22) on a substrate (21), and then developing (25) by using a photomask (23) and a light source (24).
A〇C-G6_Gi-TW M3 03 3 93 作等向性蝕刻（26)，接著去光阻（22)，且於該母模上濺鍍種子 層（27)而完成矽基板模仁（2〇)之製程。 接著，睛參閱第四圖所示，其係揭示一鎳或鎳合金所構 成之金屬模仁製程之示意圖，其係在石夕基板模仁（20)上電鑛 镍（28)，接著以電鑄（Electroforming)加工翻鑄，並以濕蝕刻而 形成矽基微透鏡陣列母模之微透鏡陣列金屬模仁（29)。惟 剷述之石夕基板模仁（2〇)及金屬模仁（29)並非本創作之專利 標的，本創作係利用此一 MEMS製程來製作具有微透鏡陣列 的導光板，故以下僅對導光板特徵作說明，至於MEMS製程 容不贅述。 如第五圖所示，其揭示一種本創作之導光板（30)，其係由 甲基丙烯酸甲醋（Polymethylmethacrylate，PMMA)，聚碳酸酉旨 (Polycarbonate，PC)等光學級粒以金屬模仁（29)射出成型，據以 使得該導光板（30)底面形成非印刷式之微透鏡陣列（MLA) 的圖型（31),本實施例中，該微透鏡陣列係包括設成半圓形、 碗形及橢圓形等内凹圖型（31)，但不限定於此。即該圖型亦 可設成第六圖所示之外凸圖型（32)，其僅需金屬模仁（29)再 翻鑄呈凹模型態，即可射出第六圖所示之導光板（30)結構。 而外凸之微透鏡陣列包括設成半圓形、凸弧形及橢圓形等 其中任一所構成。 基於如是構成，本創作之導光板結構具有如下之功效增 進需再闡明者： 1·本創作導電板（30)之微結構係為非印刷式所成型，而 是採用一體射出之微透鏡陣列的圖型，故對於導光板（3 0)由 側面光（40)到正面出光（5〇)之輝度及混光均勻度等，皆有顯A〇C-G6_Gi-TW M3 03 3 93 isotropically etched (26), then went to the photoresist (22), and the seed layer (27) is sputtered on the master to complete the 矽 substrate mold (2〇 ) The process. Next, the eye is shown in the fourth figure, which is a schematic diagram showing a process of forming a metal mold by nickel or a nickel alloy, which is applied to a nickel alloy (28) on a stone substrate (20), followed by electricity. Electroforming is performed by casting and forming a microlens array metal mold core (29) of a ruthenium-based microlens array master by wet etching. However, the description of the Shixi substrate mold core (2〇) and the metal mold core (29) is not the patent of this creation. This creation uses this MEMS process to fabricate a light guide plate with a microlens array, so the following is only for the guide. The characteristics of the light board are explained, and the MEMS process capacity is not described. As shown in the fifth figure, it discloses a light guide plate (30) of the present invention, which is composed of a polymethylmethacrylate (PMMA), a polycarbonate (PC) optical grade particle, and a metal mold. (29) injection molding, so that the bottom surface of the light guide plate (30) forms a pattern (31) of a non-printed microlens array (MLA). In this embodiment, the microlens array includes a semicircle , concave shape (31) such as bowl shape and oval shape, but is not limited thereto. That is, the pattern can also be set to the convex pattern (32) shown in the sixth figure, which only needs the metal mold core (29) to be cast into a concave model state, and the light guide plate shown in the sixth figure can be emitted. (30) Structure. The convex microlens array includes any one of a semicircular shape, a convex arc shape, and an elliptical shape. Based on the composition, the light guide plate structure of the present invention has the following effects and needs to be clarified: 1. The microstructure of the conductive plate (30) of the present invention is formed by a non-printing type, but an integrated microlens array is used. The pattern, so the brightness of the light guide plate (30) from the side light (40) to the front light (5〇) and the uniformity of the light mixing are all obvious.
M3 03 3 93 AOC-06-01-TW 著提昇。 2.利用MEMS製程的黃光技術，可以明確的定義出微透 鏡陣列的圖形與以往蝕刻咬花製程不易控制相較之下，更能 再現原始設計。 ’ 3·利用MEMS製程光點可以非均勻分佈，在射出成型時, 能幫助減少塑料的流阻因此在成型時，能接近原始設計。 4·利用MEMS蝕刻製程，可精確控制蝕刻深度，搭配光 ' 罩圖案的設計，更可以設計不同深寬比之微透鏡陣列圖形。 • 5·可以製作不同曲率形狀之微透鏡陣列，利用微透鏡陣 列密度變化與粗糙度的不同，可針對LED光源更有效率達 到改變光行進的方向，提高整體背光模組之均勻性與輝度。 6·可利用多次電鍍來製作凹模或凸模，讓微透鏡陣列的 設計能更多元化。 7·以往蝕刻咬花製程或雷射製程製作導光板之母模結 構的再現性不好，當模具有損壞時，不易製作相同的微透^ 陣列結構，利用MEMS製程再現性較高，可更有效管理背光 • 模組產品的品質。 表丁、上所述，本創作所揭示之構造，為昔所無，且確能達到 預期之功效，並具可供產業利用性，完全符合新型專利要件 ， 祈請貴審查委員核賜專利，以勵創新，無任德感。 惟，上述所揭露之圖式、說明，僅為本創作之較佳實施例 大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或等效 變化，仍應包括在本案申請專利範圍内。M3 03 3 93 AOC-06-01-TW Lifting. 2. Using the yellow light technology of the MEMS process, it can be clearly defined that the micro-mirror array pattern can reproduce the original design in comparison with the conventional etching and biting process which is difficult to control. 3. The MEMS process spot can be non-uniformly distributed, which can help reduce the flow resistance of the plastic during injection molding and thus can be close to the original design during molding. 4. MEMS etching process can be used to precisely control the etching depth. With the design of the light mask pattern, it is possible to design micro lens array patterns with different aspect ratios. • 5·Mixed lens arrays with different curvature shapes can be made. With the difference in density and roughness of the microlens array, the LED light source can be more efficiently changed to change the direction of light travel, and the uniformity and brightness of the overall backlight module can be improved. 6. Multiple-plating can be used to make a die or punch to make the design of the microlens array more diversified. 7. In the past, the reproducibility of the master mold structure of the light-shielding process or the laser process to make the light guide plate is not good. When the mold is damaged, it is not easy to make the same micro-transparent array structure, and the MEMS process has higher reproducibility and can be more Effectively manage backlighting • The quality of the module product. In the above description, the structure revealed by this creation is the past, and it can achieve the expected effect, and it can be used for industrial utilization. It fully complies with the new patent requirements, and asks the review committee to grant the patent. Inspire innovation, no sense of morality. However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Those skilled in the art who are familiar with the art, the modifications or equivalent changes made in the spirit of the case should still be included in the scope of the patent application.
AOC-06-01-TW AOC-06-01-TWM3 03 3 93 【圖式簡單說明】 第一圖係習用一種導光模組之分解立體圖。 第二圖係習用一種導光模組之剖示圖。 第三圖係本創作使用之矽基板模仁成型示意圖。 第四圖係本創作使用之鎳模仁成型示意圖。 第五圖係本創作之一導光板結構剖示圖。 第六圖係本創作另一導光板結構剖示圖。 【主要元件符號說明】 (20) 矽基板模仁 (21) 基板 (22) 光阻 (23) 光罩 (24) 光源 (25) 顯影 (26) 等向性蝕刻 (27) 種子層 (28) 電鍍鎳 (29) 金屬模仁 (30) 導光板 (31) 、（32)圖型 (40)入光 (50)出光AOC-06-01-TW AOC-06-01-TWM3 03 3 93 [Simple description of the diagram] The first figure is an exploded perspective view of a light guide module. The second figure is a cross-sectional view of a light guiding module. The third figure is a schematic diagram of the molding of the substrate mold used in the present creation. The fourth picture is a schematic diagram of the formation of nickel molds used in this creation. The fifth figure is a sectional view of the structure of the light guide plate of the present invention. The sixth figure is a sectional view of another light guide plate structure of the present invention. [Main component symbol description] (20) 矽 substrate mold core (21) substrate (22) photoresist (23) photomask (24) light source (25) development (26) isotropic etching (27) seed layer (28) Electroplated nickel (29) metal mold core (30) light guide plate (31), (32) pattern (40) light (50) light