TW513378B - Micro droplet generator having off-shooter, symmetrical heating fins and method for manufacturing the same - Google Patents

Abstract

This invention provides a micro droplet generator having off-shooter, symmetrical heating fins and method for manufacturing the same. This method implements two thick photoresist forming steps and one nickel electro-plating step. The first thick photoresist forming step forms a spraying chamber between a funnel-shaped liquid manifold and a spray orifice for liquid flow. The second thick photoresist forming step makes a mold for making a injector passagewat in communication with the spray orifice. The nickel electro-plating step forms an orifice plate at a top of the spraying nozzle. The orifice plate is penetrated by the spray orifice communicating with the spray flowing channel in the spray nozzle so as to allow liquid droplets being sprayed therefrom.

Description

513378 V. Description of the invention (1) [Application range of the invention] The present invention relates to a micro-spray generator, in particular to a thermal bubble-type micro-spray with a polarized symmetrical heating plate: a manufacturing method. Wang Weijiao [Background of the Invention] Since the manufacturing technology of printers has become popular, the printing posture has been widely used on personal computers. There are all kinds of printers; only in the rapid development and application in industry, even the deployment of even one, two, two, almost all printers. = The printing structure of the greedy family machine in the court can be divided into the following _: 1, inkjet printing 3. Thermal bubble type. As early as in the 1980s, it was 2. electrostatic type; bubble type inkjet printer was launched. This is not only like the maturity and progress of industrial thermal technology, but also means that the manufacturing of human-powered two-meter machines has taken a big step. In the structure of the inkjet printer, the micro-spraying liquid produces 1CrO-DrOPlet Generator, which is commonly called the inkjet head, and takes the basic mechanical device. The users have important points for black, straight and / or medium jets with high jetting frequency and high spatial resolution, and have good inkjet performance. Is it possible that the 'lower' inkjet heads are currently produced on the market as inkjet printers that are mainly produced in two types. Thermal bubble inkjet printer = Tian jf piezoelectric and thermal bubble bubble generator; in other words, tritium, bag, + bubble generator is driven by thermal energy means-bubble two 32 meter Use the set mouth. Another type is the piezoelectric inkjet seeker, which is ejected from the inkjet chamber.

Page 4 513378 V. Description of the invention (2) The ink is squeezed out to form ink droplets. As for the thermal bubble inkjet printer, the principle is to conduct a current to an electrode to heat the water in the inkjet chamber. When the ink is in a localized boiling state, a swell, bubble is formed from the ink. This bubble acts a bit like a compression pump, pushing the ink from the inkjet chamber ::! Through a nozzle to form a drop of ink. When the current supply is cut off, the two 'bubbles immediately rupture the ink and backfill the ink into the inkjet chamber for the next inkjet action due to the influence of the surface tension of the retracted liquid surface. The inkjet properties of the IS (thermal bubble inkjet printer) that ejects ink are roughly ink drops and stars, and the mutual interference (CrOss Talk) and Satemte Drooplets of adjacent ink chambers. Factors such as the formation of == column: there are satellite ink droplets in the formation, then the shadow is sharp, and the adjacent inkjet chamber and flow channel are sharp. In order to improve the thermal bubble inkjet prints, aim. The point is bound to be the first to be overcome in the research and development. [Objective and summary of the invention] The problem of the above-mentioned conventional technology is a kind of symmetric production of a #radiating symmetrical heating plate. It is summarized as follows: The manufacturer of the Suga liquid generator The manufacturing method of the present invention includes a surface material and a bottom surface of the Shi Xi substrate; the Shi Xi substrate is provided-with the above table formation-the thickness is at least 1 0 0 0 Angstroms The first-Insulation = The surface of the bottom can be removed by SiO 2 and Nitride (彖 二 (材 去除 材 材 材 材 ((((((((((((二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二, 去除 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二Surface second insulation

513378 V. Description of the invention (3) layer to form-openings; using a solution containing hydrogen peroxide (κ 甲 甲 甲 Press ((CH3) 4 draw)), wet-engraved on the ^ mouth ^ substrate to form A funnel-shaped liquid inlet (Manifold). The top-insulating layer is formed on the top-a ring-shaped symmetrical heating plate (the material can be made of pure button (TaAl), halogenated to (Η〇2), boronized fault (z ,, ㈤ ) And # (Pt) any one of them); deposition and pattern transfer-the electrical wire is connected to the heating sheet to form electrical conduction; a third insulating layer is deposited on the top of the heating sheet and the first insulating layer ( The material can be one of silicon nitride (SlsN4) and carbonized carbide (SiC); spin-coated on it with a thickness of at least (material Fengxi μ τ, si, y, ba, y, y) Evening: 2: Brother 1 photoresist layer; pattern transfer to a liquid spray chamber in this brother 1 photoresist layer by UV exposure; depositing a metal seed layer (material can be chromium (Cr) or nickel ( Μ)), and a pattern hole is transferred in the metal seed layer; a first layer having a thickness of at least 嶋 is spin-coated on the metal seed layer And the pattern is transferred to the spray hole; the second photoresist layer is removed except the top of the spray hole; a nickel layer is plated on the top of the metal seed layer, and the second photoresist layer on the I-end of the J hole is sealed in In the nickel layer, the spray is removed by wet etching; on the lower surface of the Shixi substrate 4, a reactive ion residue " 1 is used to remove an insulating layer, so that the liquid inlet and the first insulating layer can be shielded by 钲. The form exists; finally, the second photoresist layer in the liquid spraying chamber is removed by wet etching to complete the micro liquid jet generator of the present invention. The silicon substrate has an upper surface and a lower surface; a first and a first Another object of the present invention is to provide a micro-spray generator with a polarization-symmetric: L-piece. This device is mainly divided into the following parts

Page 6 MJ378 5. Description of the invention (4) The insulating layer is formed on the upper and lower surfaces of the silicon substrate, respectively, and the thickness of the first and second insulating layers is at least 1000 Angstroms (Angstroms) A), the material of the through-end can be selected from SiO2 and SiO2, and the funnel-shaped liquid inlet is formed between the silicon substrate and the second insulating layer; a ring The symmetrical heating plate is formed above the first insulating layer on the upper surface. The material can be made of aluminum button (TaM), hafnium (HfB2), hafnium boride (ZrB2), nitride button (TaN), and platinum. (Pt) any one of the electric V wires is connected with the heating sheet to form a conductive second insulating layer formed on the top of the first insulating layer and the heating sheet, a first photoresist layer, It is formed on the top of the third insulating layer, and the thickness of the first photoresist layer is at least 1 micron; a liquid spraying chamber is formed in the first photoresist layer, so that the liquid chamber is in communication with the liquid inlet for the liquid Flowing; a metal seed layer is arranged above the first photoresist layer, and the material can be chromium (Cr) or nickel (N i );-A spray hole is formed in the metal seed layer, and a nickel layer is provided on the top of the metal seed layer, the nickel layer has a perforation, and the perforation is in communication with the spray hole for liquid flow. Therefore, the objective of the present invention is to use a secondary thick photoresist, coupled with electroplated nickel technology, to manufacture a micro-spray generator (including a heating plate, an injector passageway, and a Qrifice). Plate), etc.). This can not only enable the size of the liquid jet generator to be accurately controlled, but also improve the defects of poor print quality and weak structure of traditional thermal bubble inkjet printers. Regarding the features and implementation of the present invention, the preferred embodiments are described in detail with reference to the drawings.

513378 V. Description of the invention (5) [Detailed description of the invention] The present invention discloses a generation state of a symmetric liquid having a polarization type and a manufacturing method thereof. This manufacturing method (formed by spin-coating method) is combined with a nickel-plated nickel-based spray generator. First, a first thick photoresist solution is used, and second, a second thick photoresist spin coating method is used to form a hole. Finally, electroplating is applied to the spray layer, and after the second photoresist layer is removed, droplets are ejected from the holes in the nickel layer. The micro-spray type of the present invention adopts a micro-system process technology to integrally mold the micro-spray generator produced by the present invention, a single crystal broken substrate, and a ring-shaped heating plate formed on the silicon substrate as a symmetrical structure, so that Generate droplets. In addition, due to the electrode characteristics of the ring-shaped heating plate, the problem of satellite ink droplets can be solved, the mutual interference of the phases can be suppressed, and the occurrence of pitting corrosion in the flow channel can be reduced. The off-shooter and the back-shot (Back of the heating sheet of the present invention on the silicon substrate are shown in the "Figures 1A and 1B". The polarizing type is also about to be normal at the nozzle 5 6a The arrangement of the direction is offset, and the structure is an example, and it will be explained. As for the method and steps and the polarized type are only slightly different, so regarding the manufacturing process of the micro-jet generator, < Likou Thermal Application 2 The spin-coating method can be used to measure the formation of the liquid on the top of a mold head. The main shape is heating ^ A large number of high-adjacent spray liquid (Caν i film, micro-thickness of the mouth, second thick light with 'production is completed to make a mouth The layer is used to make the end-to-requirement spray holes, which can be made by the manufacturer of the container. The structure is made of sheet. Because of this, the good quality is perpendicular to the tat i on the flow channel)

The arrangement can be mainly divided into two types: polarized Shooter. The positions of the heating plates 2 and 8 below 3 will be polarized and back-fired because the producers will not repeat them. First see "Section 2A

Page 8 513378 V. Description of the invention (6) --- Part of the drawing. The present invention uses a low pressure chemical vapor deposition method (L0w

Pressure Chemical Vapor Deposition 'LPCVD) forms a first insulating layer 6 and a second insulating layer 18 on the upper surface 12 and the lower surface 1 of Shi Xi material 10, respectively. The first insulating layer 丨 6 and the second insulating layer 丨 8 can be made of one of SiO2 and silicon nitride, and the thickness can be 100 Angstroms. ~ 2000 Angstroms (recommended optimal value is 2000 Angstroms). The Shi Xi substrate 10 is a P-type silicon wafer with an external diameter of 101 mm and a crystal plane of (100). Before performing the first insulating layer 6 and the second insulating layer 18 processing steps, chemical wet cleaning (RCA cieaning) can be performed to clean the surface of the Shixi wafer. Then put it into the furnace tube, and use the wet oxygen method (Wet Oxidation Method) to form two layers of depleted silicon with a thickness greater than 1 micron. The milk then uses the photolithography process to make a liquid inlet 20 on one side of the Shixi substrate 10, please refer to the section "Figure 2B". A first mask is used to define the relative position of the liquid inlet 20 in the silicon substrate 10. As for the first step of forming the liquid inlet 20, the second insulating layer 18 and the wet oxide layer are partially removed by dry etching (Reactive Etching, RIE). Then, a solution of potassium hydroxide (K0H) or tetramethylammonium hydroxide ((CH3) 4NOH, Tetra Methyi Ammonium Hydroxide, TMAH) is used to wet-etch (Wet Etching) the silicon substrate. 〇Etching. After the etching is finished, the silicon wafer is rinsed with deionized water.

Page 9 V. Explanation of the invention (7) "—Next, the electric lead 34 is made again by the photolithography process, please refer to the part of" Zeng: 2C "". A second photomask is used to define the position of the electrical line 34 on this silicon wafer. The electrical lead 34 may be made of a material with good electrical properties, such as Ai or copper, which is vapor-deposited on the top of the first insulating layer 16, and the pattern is transferred to the electrical lead 34. The pheno wafer was then rinsed again with deionized water. For the manufacturing process of the electrodes of the heating plate 28, please refer to the section of "Figures 2D and 2E". A metal layer of an aluminized button (TaAl) alloy (or other heating sheet materials such as hafnium (M%), hafnium boride (ZrB2), and nitride button (TaN) is deposited on the top of the electrical lead 34 of the silicon substrate 10. ) Or platinum (pt), etc.), and the pattern is transferred to this metal layer using a third photomask, so as to serve as an electrode of a circular symmetrical heating plate 28. Then, an insulating layer or a protective layer 36 is deposited on the top of the silicon substrate 10, so as to provide good structural isolation effects such as the electrodes of the heating plate 28 and the electric wires 34. This protective layer can be selected from one or two of silicon nitride (S is &), silicon dioxide (si 〇2), and silicon carbide (s soil c). Phase deposition method (Plasma Enhanced Chemical Vapor Deposition ^ PECVD). A first photoresist layer 38a is formed on the top of the protective layer 36 by spin coating and baking, as shown in FIG. 2F. The thickness of the first photoresist layer 38a is at least 1 micron ', but it is recommended that the optimal value be 25 micrometers to 30 micrometers. Then use Ultra-Violet Radiation to perform the exposure process for the first photoresist sound 38a, please refer to the section "Figure 2G". The fourth photomask is used in the first photoresist layer 38a to define the size and position of the liquid ejection chamber 40. 513378 Fifth, the description of the invention (8). As for the first photoresist layer 38a, a positive photoresist (Negative Photoresist) or a negative photoresist (Negative)

Photoresist). After exposure, part of the exposed and unexposed first photoresist layers 38a, 38b remain on the top of the silicon substrate 10. In the future, a precise positioning and size of the liquid spray chamber 40 must be made here, so + is one of the key points of the present invention. V ~ Please refer to "Figure 2H" next. A metal seed layer 46 is deposited on the top of the exposed and unexposed first photoresist layers 38a, 38b, and a pattern of a spray hole 48 is transferred in the metal seed layer 46. The metal seed layer 46 can be deposited by sputtering or vapor deposition to deposit a metal layer of chromium (Cr) or nickel (Ni) θ alloy. Then, the fifth photomask is used for the photolithography process to determine the size and position of the spray holes 48. Finally, the metal seed layer 46 after the photolithography is removed by wet etching to form a spray hole. The spin coating method is used to deposit a second photoresist layer 50a, and a spray is transferred in a pot case. The second photoresist layer 50b is formed by opening the flow channel 52, as shown in the following figure. After the above deposition process is completed, the second photoresist is then removed by 2 :: 4! The layer 50a 'allows the nozzle hole flow channel 52 to continue to remain at the top of the nozzle hole 48, as shown in the figure. Then, the nozzle plate 54 is continued to be fabricated by electroplating nickel technology, as shown in the figure. The wet etching method is used to remove 50b of the nozzle hole sheet 54 to form a layer P with the spray liquid, which is "Figure 2L." Stomach fluid to 4◦ communicating hole channel 52, this is Next, the reverse side of the Shi Xi substrate was subjected to 513378 using the reactive ion post-etching method. 5. Description of the invention (9) The etching was performed to remove the second insulating layer 18 of the silicon substrate 10, so that the liquid inlet 2 0 and The first insulating layer 16 can exist in an unshielded form, such as 7F in the "2% chart" ° For the last process of the present invention, please refer to "Figure 2N The first photoresist layer 38a is removed by using a developing solution, so that the liquid inlet 20, the liquid spray chamber 40 and the spray hole flow channel 52 are connected to each other for liquid flow. This figure is also the present invention The completed drawing of the micro-spray generator with polarized symmetrical heating sheet. For the working principle of the micro-spray generator with polarized symmetrical heating sheet, please refer to "Figures 3A ~ 3E" The funnel-shaped liquid inlet 20 and the liquid-spraying chamber 40 in the micro-spray generator are filled with I liquid. After the electrode of the ring-shaped heating plate 28 starts heating, a ring-shaped bubble 70 is generated. Next, a fine liquid column 74 passes through the nozzle hole 48 and is pushed out through the nozzle hole flow channel 52. Then, as long as the electrode of the heating sheet 28 heats the liquid sprayed to the middle, the bubble 70 will also Continue to grow and push the liquid column 74 out of the orifice flow channel 52 further, as shown in the "Figure 3β, Figure". Please refer to the "Figure 3D, 3E" section. The bubble 70 continues Grow f merge, also squeeze the fort and cut this Column 7 forms a droplet that is ejected toward the target. Oxygen bubble = will split Γ and form-liquid surface retracted state (not shown in the figure). The younger brother of this description _ Guan Example, please read "第 4 Some parts of the figure can be made in the same way, and the same can be made on 々I b 4 / on both sides of the silicon substrate 10

Heating plate 28 and individual sprays ^ R J force J day] shells are bba, 5 6b, so the spray liquid density can be improved even more

There are some inherent problems that can be solved by the polarizing method, which is an unstable phenomenon. The use of a secondary thickener is obvious. In addition to the preferred embodiments, they will be familiar with the relevant techniques and make a little bit more change. The fifth part of the description attached to the specification is the invention description (10). [Effect of the invention] The problem of mutual interference and satellite ink droplets of the liquid generator and its manufacturer (such as inkjet printer, etc.) to which the present invention is applied. In addition, the production of this micro-spraying liquid can also strengthen its structure. Although the present invention is relatively limited to the present invention, the scope of patent protection shall be deemed to prevail in any spirit and scope. Symmetric heating plate sprays traditional micro-spray generator problems, such as the phase between the flow channels, which results in poor print quality, photoresistance, plus electroplated nickel technology to precisely control the dimensions of its parts as described above, but It is not a user, and it does not depart from the present invention and its retouching. Therefore, it is defined by the scope of patent application of the present invention. Page 13 513378 The diagram is a brief description. Figure 2N is a schematic sectional view of the manufacturing process of the present invention; Figures 3A to 3E are schematic sectional views of the working process of the present invention; and Figure 4 is a schematic sectional view of the second embodiment of the present invention. [Illustration of Symbols]

Page U 10 Silicon substrate 12 Upper surface 14 Lower surface 16 First insulating layer 18 Second insulating layer 20 Liquid entering D 28 Adding tabs 34 Electrical wires 36 Protective layers 38a, 38b First photoresist layer 40 Liquid spraying chamber 46 Metal seed layer 48 Nozzle 5 0a, 50b Second photoresist layer 52 Nozzle flow channel 54 Nozzle piece 5 6a, 56b Nozzle 70 Bubble 74 Liquid column

Claims (1)

513378 VI. Scope of patent application 1. A method for manufacturing a micro-spray generator with a polarized symmetrical heating plate, comprising the following steps: providing a silicon substrate with an upper surface and a lower surface; and on the silicon substrate A first insulating layer and a second insulating layer are formed at the upper surface and the lower surface, respectively; the second insulating layer on the lower surface is removed to form an opening; and a funnel-shaped opening is formed in the opening facing the silicon substrate. Liquid inlet; forming a ring-shaped symmetrical heating sheet on the first insulating layer on the upper surface; depositing and transferring an electric wire with the pattern, and connecting with the heating sheet to form electrical conduction; and heating the sheet with the first insulation A third insulating layer is deposited on the top of the layer; a first photoresist layer is spin-coated on the third insulating layer; a pattern spraying chamber is transferred in the first photoresist layer; and the first photoresist layer is deposited A metal seed layer, and a spray hole is pattern-shifted in the metal seed layer; a second photoresist layer is spin-coated on the metal seed layer, and the pattern is transferred to the spray hole; other than the top of the spray hole is removed The second photoresist layer; electroplating a nickel layer on the top of the metal seed layer, and sealing the second photoresist layer on the top of the spray hole into the nickel layer; removing the second photoresist layer on the spray hole; Page 15 ^ Remove the liquid inlet and the first on the silicon substrate; and the second insulating layer on the lower surface, the insulating layer can be widened in an unshielded manner. 2. Remove the first light in the liquid spray chamber Barrier layer. The method for manufacturing a symmetric miniature liquid ejection generator with a polarization type described in item 1 of the stated patent scope, wherein the layers of the-and ° _., 'Sheets are at least selected from the group consisting of silicon dioxide (si 〇2) and Silicon nitride (s • material of the group consisting of wide margin. 13 4) 3. 4. It has a polarized symmetrical type as described in item 1 of the scope of patent application; a method for manufacturing a U-shaped liquid jet generator, wherein The thickness of the first and second layers is at least 100 angstroms. As described in item 1 of the scope of the patent application, it has a polarizing symmetrical force. The manufacturing method of the micro-spray generator is performed, wherein the method of removing the second insulating layer is a reactive ion etching method. q away from the heat sheet ~ insulation 5. As described in the first item of Shenyan patent scope, it has a polarizing symmetrical force. A method for manufacturing a gas micro-spray generator, wherein the liquid inlet is a solution containing potassium hydroxide (K 0 H), and is formed in the upper substrate by a wet coin method. ^ Hai Shixi, as described in item 1 of the scope of the patent application, a method for manufacturing a micro-liquid spray generator with a polarized symmetrical heating plate, wherein the liquid inlet is "using < tetrahydrogen ammonia (TM AH) The solution is formed in the Shixi substrate by a wet method. ^ The method is a method for manufacturing a micro-spray generator with a polarized symmetrical heating plate as described in item 1 of the scope of patent application, wherein the heating plate is Material to 513378 6. The scope of patent application is selected from the group consisting of aluminized button (TaAl), hafnium hafnium (HfB2), zirconium boride (z ^), tantalum nitride (TaN), and platinum (Pt). Material. 8. The method for manufacturing a micro-spray generator with a polarized symmetrical heating plate as described in the scope of the patent application, wherein the third insulating layer is at least selected from the group consisting of silicon nitride (si3N4) and silicon carbide ( Sic). 9. The manufacturing method of the quilt type fluid generator with a polarized symmetrical heating sheet as described in the first range of the patent application ', wherein the preferred thickness of the first photoresist layer is at least 1 micron. I 〇 · The method for manufacturing a micro-spray generator with a polarized symmetrical heating plate as described in item 1 of the scope of the patent application, wherein the metal seed layer is at least selected from the group consisting of chromium (C r) and nickel (N i ) In the ethnic group. ', II · The method of manufacturing a micro-spray generator with a polarized symmetrical heating plate as described in item 1 of the scope of the patent application, wherein the first and second photoresist layers are removed by a wet etching method. 12. The manufacturing method of the M-type liquid jet generator with a polarized symmetrical heating plate as described in item 1 of the scope of the patent application, wherein the thickness of the second photoresist layer is at least 2 microns. 1 1 · The method for manufacturing a micro-spray liquid generator with a polarized symmetrical heating plate as described in item 1 of the scope of patent application, wherein the spray holes are formed in the metal seed layer and formed with the heating plate Adjacent relationship. 1 4 · Miniature liquid spray generator with polarized symmetrical heating plate 6. The scope of the patent application includes: a Shixi substrate, a first and a top surface and a bottom surface in a funnel-shaped insulating layer; a ring-shaped symmetrical insulating layer above; an electrical lead, sexually conductive; a third The top of the insulating sheet; a first photoresistance and a liquid spraying chamber, the liquid chamber and the liquid heating sheet are located in the spraying a metal seed, a spraying hole, a nickel layer, a perforation, and flow. 1 5 · The micro-spraying liquid in the scope of patent application produces at least 1 ο ο 〇 angstrom. It has two extreme points; the liquid force π system and layer, layer, system 0-shaped liquid chamber layer, forming a perforated 14th device, the hot film system is formed in the connection and is located in one of the and the institute. The upper surface and the lower surface; the marginal layers are formed at the inlets of the silicon substrate, respectively, are formed on the silicon substrate and the first heating sheet system formed on the upper surface are connected to each other to form an electrical system. Formed on the top of the first insulating layer and the third insulating layer on the top of the third insulating layer; in the first photoresist layer, the spray is allowed to flow for a liquid to flow, and the addition forms a liquid spray mechanism; Above the first photoresist layer; in the metal seed layer; and on the top of the metal seed layer, the nickel layer spray holes form communication for the liquid to have a polarized symmetrical heating sheet, the first and second insulating layers Thickness 513378 6. Scope of patent application 16 · As described in item 4 of the scope of patent application, the micro-spray generator with polarized symmetrical heating plate, wherein the preferred thickness of the photoresist layer is at least 1 micron. 1 7 · The micro-spray generator with a polarized symmetrical heating plate as described in item 4 of the scope of patent application, wherein the spray hole is close to the heating plate. 1 8 · According to item 14 of the scope of the patent application, a micro-spray generator with a polarized symmetrical heating plate is described, in which the first and second insulation layers are at least selected from silicon dioxide (S i 02 ) And silicon nitride (S 丨 3 team) in the group of materials. 1 9 · As described in item 4 of the scope of the patent application, a miniature liquid spray generator with a polarized symmetrical heating plate, wherein the liquid inlet uses a solution containing potassium hydroxide (KOH) Can be formed in the silicon substrate. 2 0. The micro-liquid spray generator with a polarizing symmetrical heating plate as described in item 4 of the scope of the patent application, wherein the liquid inlet uses a solution containing tetramethylammonium hydroxide (TMAH) and wet A coin carving method is formed in the silicon substrate. 2 1 · The micro-spray generator with a polarized symmetrical heating plate as described in item 4 of the scope of patent application, wherein the material of the heating plate is at least selected from the group consisting of TaA 1 and lanthanum. (Hf B2), hafnium boride (ZrB2), nitride group (T a N), and rhyme (P 7). 2 2 · The micro-spray generator with a polarized symmetrical heating plate as described in item 14 of the scope of patent application, wherein the metal seed layer is at least selected from the group consisting of Page 513 378 Sixth, the scope of patent application, the material of the group formed by chromium (Cr) and nickel (Ni). 2 3 · The micro-spray generator with a polarized symmetrical heating plate as described in item 14 of the scope of patent application, wherein the heating plate is placed side by side in the spray hole. 24. The micro-liquid spray generator with a polarized symmetrical heating plate as described in item 4 of the patent application scope, wherein the spray hole is formed in the liquid spray chamber and forms a back-to-back relationship with the heating plate . 2 5 · As described in item 14 of the scope of the patent application, there is a polarized symmetrical symmetrical type plus a micro-spray generator, in which the micro-spray generates a cry, ", and a sheet."