TW519518B - Micro-droplet generator with liquid fast backfill mechanism and manufacturing method thereof - Google Patents

Abstract

The present invention provides a micro-droplet generator with a liquid fast backfill mechanism and a manufacturing method thereof. In terms of its design, the method has an additional second heating plate and, in terms of its process, the method comprises two thick photoresist processes and an electroplated nickel process. The first thick photoresist process is to form an injector cavity and an auxiliary injector cavity between a funnel-shaped liquid inlet and an injector orifice for liquid flow and replenishment. The second thick photoresist process is to design a mold for the manufacturing injector passageways to connect with injector orifices. The electroplated nickel process is to make an orifice plate on the top of an injector head where an injector orifice connected with an injector passageway in the injector head goes through the orifice plate to allow drops to be injected from the orifice plate.

Description

5l95i8 V. Description of the invention (1) [Scope of application of the invention] The present invention relates to a micro nozzle liquid generator, in particular to a micro-spray generator with a backfill mechanism and a manufacturing method thereof. (Micro-Droplet Generator) / Hongwu, precision micro-fluidic element forming droplets and ejecting. The rapid development of the application of Ϊelectronics technology has made micro-spray generators more and more popular, such as the production of He ink printers and color filters. The purpose of ii is to move towards high resolution ... π liquid production = used in the structure of inkjet printers, that is, commonly used in jetting black: 疋, the most basic mechanical device. The user's emphasis is on the machine § f s. At high ejection frequency and high spatial resolution, 0 is required for Z. Whether the ink head can perform well in inkjet performance. Type: ::: Inkjet printers can be divided into two types: piezoelectric type and thermal bubble type. Black t electric nozzle ink printers use piezoelectric actuators to squeeze out the ink; One type is the thermal bubble type inkjet printer 胄, which uses the second one: the heating sheet generates heat to generate a bubble, and the ink droplets are discharged from the inkjet chamber. * The velocity of the liquid column at the tail end of the ink drop is distributed unevenly, y ^ (ie, the end speed is large, and the back end speed is small), so when the ink drop ^ 桎, satellite ink drops and ink will be formed. The movement direction of the drop is not vertical, etc. In addition, when the bubble is generated, the pressure will be transmitted to the ink flow path, and there will be cross talk between the ink chambers. All of these phenomena can cause poor print quality. Μ _ f p. 4 519518

As for the hot-bubble inkjet printing ink bag + MEMS, the other key to the production of P meter is the question of ink backfilling. The traditional bubble-type addiction ^. ^. ^ Α Dagger eight inkjet head uses the surface tension of the retracted liquid surface as the driving force for ink backfill. > The blade has a very weak surface tension, which causes the ink reflow rate to be reported as f, which results in a longer time for H k π 4 & y #, Γ and water refill, which reduces the ejection frequency. In order to solve the above problems, Xi j. „R, w — Bai Zhi technology designed a Luo Yue soil with a switch gate :: 7 boxes, hunting to increase the ink supply pressure and speed up the ink reflow speed. Avoid excessive ink from overflowing from the nozzle, but also block the ink due to the accumulation of pigment particles by the gate switch. Known techniques such as US Patent No. 6,265,53 and IEEE 01 issued to Kim The inventions of Lee and others are basically the design of a single heating sheet, and the second heating sheet is not provided to accelerate the ink backfill in an active manner. [Objective and Summary of the Invention] In view of the problems of the conventional technology, the present invention The purpose of the invention is to disclose a micro liquid ejector with rapid liquid backfilling mechanism and its manufacturing method, which are summarized as follows: The manufacturing method of the present invention includes the following steps: providing a silicon substrate with an upper surface and a lower surface; A first insulating layer and a second insulating layer each having a thickness of at least 100 angstroms are formed at the upper surface and the lower surface of the substrate (the materials can be made of silicon dioxide (SiO2) and nitrogen). Silicon (Si3N4) is optional; ii); the second insulating layer on the lower surface of the silicon substrate is removed by reactive ion etching to form an opening; using potassium hydroxide (KOH) or tetraammonium hydroxide The solution of ((CH3) 4NOH) was formed into a funnel-shaped liquid inlet (Manifold) in a wet etching method in which the opening faces the silicon substrate.

519518 V. Description of the invention (3) A first heating sheet and a second heating sheet are respectively formed on both sides of the first insulating layer on the upper surface (the material can be boronized by tantalum alumina (TaAl), hafnium hafnium (HfB2)) Zirconium (ZrB2), nitride button (TaN), and platinum (Pt), any one of two,); a pair of electrical wires for deposition and pattern transfer, which are respectively connected to the first heating sheet and the second heating sheet, and Forming electrical continuity; depositing a third insulating layer (the material is selected from silicon nitride (S is ratio) and silicon carbide (si C)) on the top of the first heating substrate, the first heating layer, and the first insulating layer. First); spin-coat a first photoresist layer with a thickness of at least 丨 micron on the two insulating layers; = UV exposure to pattern transfer in this first photoresist layer a spray liquid and an auxiliary liquid chamber, and The liquid spraying chamber is in communication with the auxiliary liquid chamber for liquid movement. A metal seed layer (material can be road machine) or nickel (Ni) is deposited on the first photoresist layer, and the pattern is transferred in the metal seed layer. First (In Jector 0rifice); the metal seed layer is spin-coated with a 2 micron second photoresist layer, and the pattern is transferred to the spray ; Remove the second photoresist layer except the top of the hole; electrically and nickel the top of the metal seed layer, and seal the second photoresist layer at the top of this nozzle into the nickel layer: The second photoresist layer in the hole; at the lower surface of the silicon substrate: ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Reactive ion, remove the second insulation By the wet method = the first photoresist layer of the auxiliary liquid chamber, the liquid spray generator can be completed. Quilt like Θ

Another micro-liquid spray-producing substrate made by the present invention has a purpose of providing a device, which is mainly divided into a surface and a lower surface; the liquid is quickly backfilled into the following parts: a first and a second insulation

V. Description of the invention (4) The layers' are formed on the surface and the lower surface of the thick sound of the second insulation layer of the crushed Meigu respectively, and the first surface is made of SiO2 (Si0): 000 angstrom ( Angstroms) 'Material can be liquid-shaped carving, 隹 口 2) /, or silicon (SisN4); one of the first and the second: the force is formed on the base material and the second insulation layer Among the two sides of one ^ Λ are formed on the first insulating layer on the upper surface: rLB:) \ ^ r; rTri) —- a snowy road I see Hua Dan 1 (TaN) and beginning (Pt ); M, which is interconnected with the first heating sheet and the second heating sheet respectively Γ ^ to be electrically conductive;-the third layer is formed on the first insulation sheet and the second heating sheet The top of the sheet; a first photoresist layer is formed = the top of the third insulating layer, and the thickness of the first photoresist layer is at least 丨 micrometer, meter, and liquid, is formed in the first photoresist layer, For the liquid to flow, the first thermal film is located in the liquid spraying chamber to form a liquid spraying mechanism; the auxiliary liquid to is formed in the first photoresist layer, so that the auxiliary liquid chamber, the liquid spraying chamber and the liquid Enter The three are connected for liquid to flow. The second heating sheet is located in this auxiliary liquid chamber to form a rapid liquid backfill mechanism. A metal seed layer is disposed above the first photoresist layer. The material can be chromium ( &) or nickel (Ni);-a spray hole is formed in the metal seed layer, and a nickel layer is provided on the top of the metal seed layer, the nickel layer has a perforation, the perforation and the spray hole Connectivity is established for liquid flow. Therefore, the objective of the present invention is mainly to use a secondary thick photoresist, coupled with electroplated nickel technology, so as to manufacture a miniature liquid spray generator (including a heating plate and a nozzle passageway) with a rapid liquid backfill mechanism. And nozzles> 1 (Orifice Plate), etc.). This is not only V. Description of invention (5)

It can make the liquid jet generator θ S flea-type inkjet printer to print ::: 2: control, and can improve the traditional heat. The defect of the special blood two soil two structure of the present invention is weak. The details are as follows. / 、 Bei Zuo, k with a diagram for the best embodiment [Detailed description of the matter] The present invention is to disclose _ chain θ, generator, and its manufacturing method. : The micro-spray solution (formed by spin-coating method) for the backfilling mechanism i is to use secondary thick photoresistance technology, and can be produced with electroplated nickel technology and micro-system process technology. The spin-coating method is f = liquid generation as . First, the first thick photoresist spin coating 2 and the second chamber and an auxiliary liquid chamber are used; second, the second electron microscopy technology layer is used to form-spray holes. Finally, after the removal, the required holes s, S, are formed to make a recording layer, and the second type of photoresist layer is used to remove the spraying liquid: two systems 1: the liquid droplets are ejected from the spraying holes. The micro-molding method of the present invention is ί = = ϊ The micro-system process technology is used to integrate the micro-spraying liquid of the present study to produce weeping and pottery substrates. Here, I want to produce ^ ro, and the main material is a single-crystal silicon wafer as the forming substrate side to form a first heating sheet, and this first heating is additionally coated with the ΐ symmetrical structure 1 to produce a large number of liquids of good quality. drop. The electrode system of the first heating element has high verticality, which can solve the problem of ink droplets, suppress the mutual interference between the adjacent spray chamber and the flow channel, and reduce the pore corrosion in the flow channel ( Cavi tation). And pushed out 'bubbles were generated on the electrode of the first heating sheet in the spraying chamber' = f after the droplets were dropped, the electrodes of the second heating sheet located upstream of the spraying chamber generated air bubbles, which accelerated the liquid toward Spray room. In addition to this approach

Page 8 519518 V. Description of the invention (6) " It can shorten the backfill of the liquid when π is cut from two π to +, and it can increase the liquid droplet ejection frequency. The women's volleyball team with the heating sheet of the present invention in silicon # can be mainly divided into two types of off-shooter (Of f Shooter) and back-shooter (Back Shooter). As shown in the "Figure 1A, 1 B" + ancient-L 丄 々 A ,,, "not. Consistently, the application of the present invention is not only ^; the above two types, any liquid ejection device can apply the backfilling mechanism of the present invention to increase the liquid backfilling speed, such as Top Shot or Side Shot Shooter) 箄 夕 哈 、 右 # 士 翠. Xi Xun's spray device. The polarizing type is an arrangement in which the position of the first heating plate 28 is offset from the nozzle 56a in the normal direction. In the following, a polarizing structure is taken as an example for description. As for the rabbit shooting type, the manufacturing method and steps are slightly different from those of the polarizing type, so they will not be repeated. 8. Regarding the manufacturing process of the micro-spray generator, please first refer to the section "Figure M". The present invention uses a low pressure chemical vapor deposition method (

Pressure Chemical Vapor Deposition (LPCVD) forms a first insulating layer 16 and a first insulating layer 18 on Shi Xiji f W ^ upper surface 12 and lower surface 14 respectively. The first insulating layer 6 and the second insulating layer 8 are made of one of silicon dioxide (S 1 002) and silicon nitride (sl ratio): and the thickness thereof can be 100%. Angstroms ~ 20000 Angstroms (recommended optimal value 2000 Angstroms). The Shi Xi substrate 10 is a P-type silicon wafer with an outer diameter of 0.1 mm and a crystal plane of (100). Before performing the first insulating layer 16 and the second insulating layer = processing step, the surface of the silicon wafer can be cleaned by chemical wet cleaning (RCA Cleaning). Then put it into the furnace tube to form a two-layer gasification layer with a thickness of more than 1 micron by the wet oxygen method (Wet 0Xldation Method). sheep

Page 9 519518 V. Description of the invention (7) The recipient then used the photolithography process to make a liquid inlet 20 on one side of the Shixi substrate 10, please refer to the section of "Figure 2B". Use the first Photo Mask to define the close position of the liquid inlet 20. As for the first step of forming the liquid inlet 20, the second insulating layer 18 and the wet oxide layer are removed by using a reactive ion etching method (Reactive Ion Etching, RIE) and a dry etching method. Part. Then, using a solution of potassium hydroxide (KOH) or tetramethylammonium hydroxide ((CH3) 4N0H, Tetra Methyl Ammonium Hydroxide, TMAH), wet etching (Wet Etching) was performed on the silicon substrate 1 〇Etching. After the etching is completed, the silicon wafer is rinsed with deionized water. Second ▲ Next, the photo-lithography process is used to make the electrical wires 34a and 34b again. Please refer to the section "Figure 2C". Individual positions of a pair of electrical leads 34a, 34b are defined on the silicon wafer using a second mask. The electrical wires 34a and 34b may be made of aluminum (A 1) or copper (Cu) with good conductivity. The electrical wires 34 a and 34 b are vapor-deposited on both sides of the first insulating layer 16 and patterned respectively. Electric wires 34a, 34b. Then rinse the Shixi wafer again with deionized water. For the manufacturing process of the electrodes of the first heating sheet 28 and the second heating sheet 30, please check the section of "Figures 2D and 2E". A metal layer of an aluminized giant (TaA 丨) alloy is deposited on the tops of the electrical wires 34a, 3 4b on both sides of the silicon substrate, and the pattern is transferred to this metal layer using a third photomask, with ^ as the first The electrodes of the heating plate 28 and the second heating plate 30. Next, an insulating layer or a protective layer 36 is deposited on the top end of the silicon substrate 10, so that

Page 10 519518 V. Description of the invention (8) The electrodes of the second heating sheet 30 and the electrical wires 34a, 34b and other structures can maintain a good isolation effect. The protective layer 36 can be selected from one or two of SigN4, SiO2 and carbonization seconds (siC), and the plasma-enhanced chemical vapor deposition method ( Plasma Enhanced Cheinical Vapor Deposition 5 PECVD). A first photoresist layer 38a is formed on the top of the protective layer 36 by spin coating and baking, as shown in FIG. 2F. The thickness of the first photoresist layer 38a is at least 1 micron ', but it is recommended that the optimal value be 25 to 30 microns. Then use Ultra-Violet Radiation for exposure and privacy. Please refer to the section “2G”. A fourth photomask is used in the first photoresist layer 38a to define the size and position of the liquid ejection chamber 40 and the auxiliary liquid chamber 42. As for the first photoresist layer 38a, a positive photoresist or a negative photoresist can be used according to the design requirements.

Phatoresist). After exposure, part of the exposed and unexposed first photoresist layers 38a, 38b remain on the top of the silicon substrate 10. In the future, a precise positioning and size of the liquid injection chamber 40 and the auxiliary liquid chamber 42 'must be made here, so this step is one of the key points of the present invention. ^ Please refer to the section "Figure 2H". A metal seed layer 46 is deposited on top of the exposed and unexposed first: photoresist layers 38a, 38b, and a pattern of a spray hole 48 is transferred in the metal seed layer 46 ·. The metal seed layer 46 may be deposited or vapor-deposited to deposit a metal layer of a chromium (Cr) or hafnium (Ni) alloy. Then, a fifth photomask is used to perform the photolithography process, thereby defining the size and position of the countersink 48. Finally, the process is removed by wet etching.

Page 11 519518 V. Description of the invention (9) The photoresist layer after photolithography forms a spray hole 48. Continue to use spin-coating method to deposit the first 'duo-pattern transfer-nozzle flow channel 52, and 4; first = a' and in it ^ Wind_ photoresist layer, such as "basket? τ graph ”does not. After the above-mentioned deposition process is completed, the second light other than the top of the nozzle hole 48 is removed to start the private removal of the report hole-stop rr fan [Nine resistance layer 50 at the HU & The shape of the first resistance layer 5Ob can continue to exist in Saki [Figure 2J]. … At the top of He Kong 48 ’such as

Figure; post-recording technology to make-nozzle plate 54, such as "the 2K 5: bW Ding-Ran etching method to privately remove the second photoresist layer 50b in the nozzle plate 54, mistakenly formed and sprayed The liquid chamber is "Figure 2L". Si, Zhi He Kong Liu Yun 52, that is, the surname His Majesty uses the reactive ion money engraving method to enter the second insulating layer 18 of the second substrate 10 on the back of the Shixi substrate 10 to make the liquid inlet 2 〇 ^ The sibling edge layer 16 can exist in an unshielded form, as in the "last figure of the 2M figure", please refer to the "2N figure" section. 38a shirt agent (DeVel〇Pln§ S〇1Uti〇n) removes the first photoresistive layer path 52 open / liquid inlet 2G, liquid spray chamber 4G, auxiliary liquid chamber 42 and the nozzle flow = in a connected relationship for the liquid flow. This figure is also the part of the invention which illustrates the completion of the micro-jet generator of the ‘night body fast backfilling mechanism’. Please refer to the section “Figure 3”. This is a similar process to the two-side / four-step example. It is made on the silicon substrate 10 with the same heating sheet and individual nozzles 56a and 56b.

Page 12 519518 V. Description of the invention (10) "-It can increase the density of the spray liquid. π For the principle of micro-spray generation with rapid liquid backfilling mechanism of the present invention, please refer to the section "Fig. 4 Α ~ 4 β". The funnel-shaped liquid inlet 20, the liquid spraying chamber 40 and the auxiliary liquid chamber 42 are filled with liquid when the micro-spraying liquid is generated. The electrode on the first heating sheet 28 then starts heating n to generate a 1-shaped bubble 70a. Then, a fine liquid column 74 passes through the hole 48 and is pushed out through the orifice flow channel 52. At this stage, the second heating plate 30 in the position assistant liquid chamber 42 has not started to be heated. Then, the electrode of the heating plate 28 continues to add liquid to the liquid in the spraying chamber 40, and it continuously becomes a county at 70 a, & Furthermore, the liquid column 74 is further pushed out of the nozzle hole flow channel 52 as shown in "Figs. 4B and 4C". After ^^ Please refer to the section “Figures 4C and 4D”. The bubble W continues to grow and merge, and at the same time squeezes and cuts off the liquid column 74, and the J nozzle hole flow channel 52 is disengaged to form a droplet toward the target. The liquid is discharged: 7 The bubble 70a will crack and the A liquid is formed downward as shown in "Figure 4D"). 1-shaped heart (such as after a short period of time, in the silicon substrate 10 another-the hot sheet 30 is immediately started to start heating to generate bubbles 70b. The first brother 1 plus the electrode continues to heat the liquid in the auxiliary liquid chamber 42 And the bubble 7〇 ^ = 30: the ground from the auxiliary liquid chamber 42 toward the liquid ejection chamber 40 becomes & and will also be supplemented in the + liquid chamber 40, as shown in "Fig. 4E", or j After the liquid is full, you can start the next liquid spray. The first addition: tablets. The heat is added to generate air bubbles. During the liquid spraying process, please refer to "4F = Degree of liquid refilled from the liquid inlet 20 to the auxiliary liquid. Room 42, ... for the 70 battle one spray

^ 518

2. Description of the invention (11) Liquid circulation. [Effects of invention] Seed production! The micro-jet spray Wg clothing L '”of the quick-filling mechanism of the smart body can solve the ink back-filling speed of the traditional micro-jet generator (such as an inkjet printer, etc.) =: 2 1 degree, so the present invention has the following effects:, ^ Adding an auxiliary liquid chamber and an auxiliary two-night i-rate to the Bessin Ecology. This method is used to speed up the liquid backfilling speed, thereby improving 2. ί :::: subnickel technology 2 to make this micro-enhanced structure. 锖 Cui control In addition to the size of each part,

Although the lightness of the present invention defines each of the inventions, any ;; :: exposed as above; shed = not in the spirit and scope, when it can be :: off the artist, no; away from the Π of the present invention Defined by the scope of the patent application attached to this specification

Page 519518 Brief Description of Drawings Figures 1 A ~ 1 B are schematic cross-sectional views of the present invention; Figures 2 A ~ 2 N are schematic cross-sectional views of the manufacturing process of the present invention; Figure 3 is the second of the present invention. The schematic cross-sectional view of the embodiment; and the 4th to 4th F are the working process of the present invention.

Page 15 10 Silicon substrate 12 Upper surface 14 Lower surface 16 First insulating layer 18 Second insulating layer 20 Liquid inlet 28 First plus piece 30 Second heating piece 34a, 34b Electrical wire 36 Protective layer 38a, 38b A photoresist layer 40 liquid injection chamber 42 auxiliary liquid chamber 46 metal seed layer 48 nozzle holes 5 0a, 50b second photoresist layer 52 nozzle hole flow channel 54 nozzle plate 5 6a, 56b nozzle 519518 The diagram simply illustrates the bubble liquid column 70a, 70b 74 ΙΙΙΙΗΒΙΙΙ page 16

Claims (1)

519518 6. Scope of patent application 1. A method for manufacturing a micro-spray generator with a rapid liquid backfilling mechanism, comprising the following steps: providing a silicon substrate with an upper surface and a lower surface; on the upper surface of the silicon substrate A first insulating layer and a second insulating layer are respectively formed on the lower surface; an opening is formed by removing the second insulating layer on the lower surface; and an opening is formed in the opening toward the chopping substrate to form a funnel-shaped liquid import; A first heating sheet and a second heating sheet are respectively formed on both sides of the first insulating layer on the upper surface; a pair of electric wires are deposited and pattern transferred, the electric wires are respectively connected with the first heating sheet and the second heating A first insulating sheet is deposited on top of the first heating sheet, the second heating sheet and the first insulating layer; a first light is spin-coated on the third insulating layer; A resist layer; pattern-transferring a liquid ejection chamber and an auxiliary liquid chamber in the first photoresist layer, and the liquid ejection chamber is in communication with the auxiliary liquid chamber for liquid flow; A metal seed layer is deposited on the first photoresist layer, and a spray hole is transferred in the metal seed layer; a second photoresist layer is spin-coated on the metal seed layer, and the pattern is transferred to the nozzle; The second photoresist layer other than the top of the spray hole; electroplating a nickel layer on the top of the metal seed layer, and spraying the spray hole Page 17 519518 6. The top of the scope of patent application ;: the second photoresist layer is sealed in the recording layer; = the second photoresist layer of the nozzle; the second insulation layer on the mi face of the liquid inlet disk is obtained; In this way, an insulation layer can be stored in an unshielded form from the two liquids to the first photoresist layer with the auxiliary liquid chamber. The micro with quick liquid backfilling mechanism described in J 嗔 ΐ7 is at least selected from the π: = 仏 method, wherein the first and second insulating layers are free of silicon dioxide (Si02) and nitride. The material in the group consisting of silicon (. The method for manufacturing a liquid quick-return type liquid ejector as described in the first patent application range, wherein the thickness of the first and second insulating edges is at least 100. 〇Angle. As described in item 1 of the scope of patent application, a method for manufacturing a micro liquid ejector with a rapid liquid backfill mechanism, wherein the second insulating layer is removed by a reactive ion etching method. The method for manufacturing a micro-spray generator with a liquid rapid backfill mechanism according to the item, wherein the liquid inlet is formed in the silicon substrate by a wet etching method using a solution containing potassium hydroxide (KOH). The method for manufacturing a micro-spray generator with a rapid liquid backfill mechanism as described in item 1 of the scope of the patent application, wherein the liquid inlet uses a solution containing tetramethylammonium hydroxide (TMAH) and is wet-etched on The Shi Xi substrate 2. 3. 4. 5. 6 · Page 18 519518 6. Application for Patent Scope 7 · The method for manufacturing a micro-spray generator with rapid liquid backfill mechanism as described in item 1 of the scope of patent application, where the The materials of the first and second heating plates are at least selected from the group consisting of aluminized button (TaAl), hafnium hafnium (HfB2), zirconium boride (ZrB2), tantalum nitride (TaN), and platinum (Pt) Zhongzhicai ^ Yun ^ 5 ^ · φν * 8 · The method for manufacturing a micro-spray generator with a rapid liquid backfill mechanism as described in item 1 of the scope of patent application, wherein the third insulating layer is at least selected from nitride The material in the group consisting of silicon (S i3 Ν4) and silicon carbide (S i C). 9 · A method for manufacturing a micro-spray generator with a rapid liquid backfill mechanism as described in item 1 of the scope of patent application, wherein the The preferred thickness of the first photoresist layer is at least 1 micron. I. The manufacturing method of a micro-spray generator with a rapid liquid backfill mechanism as described in item 1 of the scope of patent application, wherein the metal seed layer is at least selected from A family of chromium (Cr) and nickel (Ni) II. The method of manufacturing a micro-spray generator with a rapid liquid backfill mechanism as described in item 1 of the scope of patent application, wherein the first and second photoresist layers are removed by wet etching. 1 2 · The method for manufacturing a micro liquid ejector with a rapid liquid backfill mechanism as described in item 1 of the scope of patent application, wherein the thickness of the second photoresist layer is at least 2 microns. 1 3 · As item 1 of the scope of patent application In the method for manufacturing a micro liquid ejector with a rapid liquid backfill mechanism, the spray holes are formed in the metal seed layer, and the heating sheet forms an adjacent relationship. Page 19 519518 VI. Scope of patent application 1 4. The manufacturing method of the micro-type liquid ejector with rapid liquid backfill mechanism as described in item 1 of the scope of patent application, wherein the nickel layer is an orifice plate. 1 5. A micro-spray generator with a rapid liquid backfill mechanism, comprising: a silicon substrate with an upper surface and a lower surface; a first and a second insulating layer formed on the silicon substrate respectively Upper and lower surfaces; a funnel-shaped liquid inlet is formed between the silicon substrate and the second insulating layer; a first and a second heating sheet are respectively formed on the first surface of the upper surface Two sides on the insulating layer; a pair of electrical wires are connected to the first heating sheet and the second heating sheet respectively to form electrical conduction; a third insulating layer is formed on the first insulating layer, the The top of the first heating sheet and the second heating sheet; a first photoresist layer formed on the top of the third insulating layer; a liquid spray chamber formed in the first photoresist layer for a Liquid flows, the first heating sheet is located in the liquid spraying chamber to form a liquid spraying mechanism; an auxiliary liquid chamber is formed in the first photoresist layer, so that the auxiliary liquid chamber, the liquid spraying chamber and the The three liquid inlets are in communication for the liquid to flow, and the first The heat sink is positioned to form an auxiliary liquid chamber of the liquid quick refilling mechanism; Page 519518 A metal seed layer is disposed above the first photoresist layer; a spray hole 'is formed in the metal seed layer; and a recording layer' is disposed at the top of the metal seed layer, and the nickel layer has a perforation, The perforation is in communication with the spray hole for the liquid to flow. 16 _ As described in item 15 of the scope of the patent application, the micro-spray generator with a rapid liquid backfill mechanism, wherein the thickness of the first and second insulation layers is at least 100 angstroms. 17 · The micro-spray generator with a rapid liquid backfilling mechanism as described in item 15 of the scope of patent application, wherein the preferred thickness of the first photoresist layer is at least 1 micron. 18 · The micro-spray generator with quick liquid backfill mechanism as described in item 15 of the scope of patent application, wherein the spray hole is close to the first heating plate. 19. The micro-spray generator with a rapid volume backfill mechanism as described in item 25 of the scope of patent application, wherein the first and second insulation layers are at least selected from the group consisting of silicon dioxide (SiO2) and nitrogen. Material in a group of silicon (ShN4). 20. The micro-spray generator with a rapid liquid backfill mechanism as described in item 5 of the patent application scope, wherein the wave body inlet is a solution containing potassium hydroxide (KOH) / Formed in a silicon substrate. 21 · The micro-spray generator with liquid plate rapid backfilling mechanism as in item 15 of the scope of patent application, in which the wave body inlet uses hydrogen and oxygen 519518 6. Scope of patent application The solution of TMAH is formed in Shi Ximei by wet money engraving. 2 2. The micro-spray generator with a rapid liquid backfill mechanism as described in item 15 of the scope of the patent application, wherein the material of the first and second heating plates is at least selected from the group consisting of tantalum aluminide (TaAl), hafnium The materials in the group consisting of (HfB2), Huar (ZrB2), Nitrile (TaN), and Gu (Pΐ). , 2 3 · The micro-spray generator with a rapid liquid backfilling mechanism as described in item 5 of the patent application scope, wherein the metal seed layer is at least selected from the group consisting of Cr (Cr) and nickel (N 丨) Of material. 2 4 · The micro-spray generator with a rapid liquid backfill mechanism as described in item 5 of the scope of the patent application, wherein the first heating sheet is placed in parallel with the spray L. 2 5 · The micro liquid spray generator with a rapid liquid backfill mechanism as described in item 15 of the scope of patent application, wherein the spray hole is formed in the liquid spray chamber and forms a back-to-back relationship with the first heating plate . 26. According to the micro-liquid spray generator with a rapid liquid backfilling mechanism described in item 5 of the scope of the patent application, the second heating sheet in the bean can generate a bubble to push the liquid in the auxiliary liquid chamber to speed up the liquid Backfill speed 2 7 · The micro-spray generator with quick liquid backfilling mechanism as described in item 15 of the scope of patent application, wherein the micro-spray generator is made in an integrated manner.