TW511418B - Method for installing resistor and capacitor in printed circuit board - Google Patents

Abstract

A method for installing resistor and capacitor in printed circuit board (PCB) includes the following steps. Plural resistors and the first capacitor electrode pattern are formed on a substrate. A liquid-phase insulation layer is coated and formed on the electrode pattern, and the liquid-phase insulation layer is baked and solidified to form the first insulation layer. The first insulation layer is lapped and flattened to expose the electrode pattern. A liquid phase photoresist layer is coated and formed on the substrate. Through the exposure and developing process, the liquid phase photoresist layer is used to expose the resistor electrode pattern. The resistor electrode pattern is plated with a metal layer having low contact resistance value through the use of electrolyzing-less plating method. The photoresist layer is stripped to expose the electrode pattern. By using a coating manner, plural resistors are formed. On the substrate, dielectric material is coated to form the second insulation layer. The second capacitor electrode pattern is formed on the second insulation layer.

Description

511418 ^^-5. Description of the invention (1) [Field of the invention The present invention relates to Yifu ^ Special :: There is a method for setting the printed electrical resistance and capacitor, 丨 /, and in the printed circuit. And the method of setting the capacitor T ti rupture. 'Previous technology to avoid thin-film electricity when amine resistors are stressed] Traditionally, printed circuit board supply tapes have been formed to have various functions = pieces of two such as integrated circuit components] Welding 嗜 The road is made of organic materials or inorganic materials: The printed circuit board consists of multiple layers and layers, so as to provide electronics + = to set up the inner circuit, the outer, and the second in the printed circuit board manufacturing technology. Two mechanical options and electrical degrees, reduce line width, etc. In order to increase the level and increase the number of through-hole electronic components in the ^ ~ direction; 2 increase the need to reduce the passive anti-volume such as capacitance and resistance on the surface of the printed circuit board, and embed the components in the ㈣ circuit to reduce the volume and advance —% On July 90, 1990] Announcement No. 444522 "Planting People on Printed Circuit Boards II: ^ Lee Gazette Announces the Process of Resistors * Method" S patents ^ ^ Resistance and metal thin film in-circuit substrate Forming a circuit and putting on it include step-hui ... [a] terminals; [b] forming-a photoresist layer is placed on top of the electrode circuit substrate required for resistance and resistance; [.] ] In the photoresist layer: ::,: and holes at the electrode end to expose the area where resistance is expected to be formed; [^ two or more polymer thick film resistor materials with a hole value filled in the above hole, one or Various resistive molecules thick film resistor materials are cured; and [f] Residual = the high C: \ Logo-5 \ Five Continents \ PK8211. Ptd $ 4 pages of invention description (2) --- ^ ΐ ί High polymer thick film resistor. The No. 444522 is only applicable to the% resistance setting and not suitable for the manufacture of resistors and capacitors. When the resistors and capacitors are embedded in the setting, not only can the printed circuit board be reduced, but the printed circuit board can also be reduced. The process. In the method for manufacturing a printed circuit board according to the present invention, two S + two electrode patterns of a resistor are arranged on the same substrate and a dielectric material is used to insert the same: a layer, a capacitor, and a dielectric. Layer, so that the resistor and capacitor are integrated and equal to f, thereby not only reducing the printed circuit board volume, but also the energy range;.; :: i: f process and capacitor embedding setting process are the same system ^ r to reduce Printed circuit board process steps. Le 1 figure reveals Polymer Lier No. 444522 ;: ^ As shown in Figure 1, a printed circuit board 10 includes-electricity = and port; and the thickness mil is repeatedly punctured by the electrode terminal 12 and only the remaining Thin thickness b. As the time passes, the thickness b is relatively thinner. The other side: resistance two :; Xinyue / molecules after printing, on the sense surface, the south of the resistance 1 1 also causes the thicker household b to have a wider and certain flow, so the polymer connection angle … The second degree is more f. At the junction of thickness a and thickness b, there is a connection angle of 11: subject to; 'strict 1' When the stress is deformed, the resistance parent, the weakest resistance to the stress, the difference between the electric call: the angle bow is the most; Product reliability corners of printed circuit boards are prone to breakage, and therefore the connection angles. Or: h electricity: Λ made on ‘if the resistance 11 is removed, the thickness of a and b is shown to avoid the resistance 1__ C: \ Logo-5 \ Five Corninents \ PK8211

Ptd, page 5 疋, description of the invention (3) 疒 ^^ 1 P: Thin-film electric circuit board:; ::: 11 "The technical problem of cracking, in view of this, * I kL product yield and reliability ^ The pattern uses liquid energy: on the manufacturing method of the circuit board C: circuit board, the bottom of the resistance electric circuit and the ;; :: material is filled to form-bottom insulation, layer, so that the film's electrical stress can be applied to the library. Eliminate the product yield caused by the thickness difference of the thin film resistor = the weakest part of the force 'thus improve the printed circuit board [Summary of Invention] Setting method month: ί 2 :: a kind of resistance and capacitance in the printed circuit board -Dielectric material; hours: two [electrode patterns are arranged on the same layer, printing: two so that resistors and capacitors are embedded and arranged on the same layer, so that the present invention and ί — dielectric circuit board volume and reducing printed circuit board manufacturing process; ί; There is a "sound" = the bottom and thickness of the film resistor are consistent, the second = the ㊁ "Ming Cheng Tan Tan < first used to resist the weak part of the stress table, Jun Xiang ii ::, the product yield and trust of the board The effect of the degree = the resistance and capacitance settings in the m circuit board. The steps are as follows. • Forming several resistors on a substrate. And the first capacitor itself is covered with wood, and the electrode pattern is coated to form a liquid: pole figure: eup. Edge: for baking and hardening to form-the first insulation layer; the second insulation core; the sub-exposed the: pole Pattern; coating on the substrate to form a -liquid :: layer, exposing the liquid photoresist layer to the resistance and exposing the resistance ^

C: \ Logo-5 \ Five Continents \ PK8211.ptd Page 6 V. Description of the Invention (4), the resistance value of the resistor is subordinate, and the resistance is formed to form several resistors; the insulation layer; In order for the present invention to be understood, the following formula is used to describe in detail the printing process of the present invention and the electric capacity of the capacitor as one of the resistors in the manufacturing process and the printed electricity of the present invention uses a liquid insulating material with the same thickness for resistance. The most stressful method of the present invention is to describe the capacitor setting method in the 2A to 2L drawings in the main technology of the aforementioned car driver Jia Guan. Please refer to FIG. 2A on a substrate 20 according to the above-mentioned sum of the capacitor electrode pattern 23 as follows. The electrode pattern in the circuit board is provided with an insulating layer and a valley embedded in the circuit board. The main technique of flattening the electrical material in the circuit board to eliminate the weak part is to use this capacity to show the present invention. The electrode pattern is plated with a low contact resistance photoresist layer by electroless plating, and the electrode pattern is exposed. The substrate is coated with a dielectric material to form a second and second insulating layer by a coating method. Electrode pattern. Other objects, features, and advantages can clarify the preferred embodiment of the invention, and in combination with the resistance and capacitor setting methods of the drawings, the resistors are mainly placed on the same layer, and a dielectric material is used as the dielectric layer of one of the capacitors. The same process steps are integrated between the resistor embedded processes. The hidden resistance and capacitance setting method also warns the resistance map as a bottom insulation layer, so that the stress caused by the difference in thickness of the bottom of the thin film resistor is operated. The content of the operation is appropriately disclosed in the preferred embodiments listed below in conjunction with related technologies. When implemented. Schematic diagram of the resistance and manufacturing steps in the printed circuit board of the preferred embodiment. First !: Preferred embodiment < Manufacturing method first> ~ Resistive electrode pattern 21 and Resistive electrode map 1 and Capacitor electrode

C: \ Logo-5 \ Five Continents \ PK8211.ptd 511418 5. Description of the invention (5) The pattern 23 is set on the same layer. The electrode patterns 21 and 23 are made of metal materials. Referring to FIG. 2B, the manufacturing method of the preferred embodiment of the present invention then performs a browning process on the polar patterns 2 1 and 23, so that the surfaces of the electrode patterns 2 1 and 23 are directed to epoxy. 〕 Has good adhesion C adhesion]. 〃 Γ t As shown in FIG. 2c, the manufacturing method of the preferred embodiment of the present invention is followed by coating the diode patterns 2 1 and 2 3 to form a liquid insulating layer, and the liquid insulating layer is baked and hardened. A first insulating layer 30 is formed, and the third insulating layer 30 covers the surface of the substrate 20. Please = As shown in FIG. 2D, the manufacturing method of the preferred embodiment of the present invention is followed by 1 1 1 and 1 3, and the edge layer 30 is ground and exposed to expose the electrode patterns 21 and M. At this time, the two resistance electrode patterns Between 21, a bottom insulating layer 30a is formed. The bottom and edge have the same height between the resistance electrode pattern 21 and the resistive electrode pattern 21, so that the bottom and thickness of the thin film resistor are consistent, so as to eliminate the stress caused by the thickness difference of the thin film resistor, which is the weakest to resist the stress. The electrode patterns 21 and 23 are subjected to browning. The user refers to FIG. 2E to form a liquid photoresist layer 31 coated on the manufacturing method according to the preferred embodiment. The liquid photo-recovers the pen pole patterns 21 and 23. Next, a hole 31a is formed in the liquid photoresist shadow method, and the hole ^ 3 is faded into 5Φ Λ before being exposed ^ The hole / wood is inserted into the resistance electrode figure 91 ", and then the resistance electrode pattern 21 is exposed, mainly for the purpose of A metal with a low contact resistance is deposited on the resist: pattern 21. Please refer to FIG. 2F for a suitable method.

C: \ Logo-5 \ Five Cont inents \ PK8211.ptd Page 8

A metal layer 2la is formed on the resistive electrode pattern 21 without metal. Electrolytic plating is performed with a low contact resistance value method. Then, as shown in the 2G diagram of the substrate a and the gold alloy, the manufacturer of the preferred embodiment of the present invention removes the far photoresist layer 31 and then exposes the electrode patterns 21 and 23. At this time, the first-insulating layer 30 and the bottom-insulating layer 30 belong to the layer 21a mainly on the surface of Ϊ20. Please refer to the application of the coated electrode diagram. Please refer to the opposite case on the second insulation resistance 22 of the weight base, and use the electrical steps to set the case according to the 2H pattern. One of the two layers is insulated from the first component, and the capacitance value does not match the other dielectric to an electrical ', and the whole layer and the capacitance capacitor are covered with a dielectric as shown. If so, the power layer.

The preferred embodiment of the present invention is a resistor 22, which is used for baking and polymerization. The preferred embodiment of the present invention is coated with a material to form a substrate 20 surface. This capacitor is a dielectric layer. The pole pattern 2 is provided at 3 places. The second edge layer 3 2 is manufactured using the subsequent example 2J of the figure. Electrical connection and hardening. Example of manufacturing the second insulation, the second insulation, the capacitance value of the second one, the second electrical method and the 2K method, followed by the two resistance method, the connection layer 32, the layer 3 2 as the insulation layer _ capacitance electrode diagram " If it is estimated that the capacitor value needs to be adjusted in the process of setting the capacitor value, the second insulating layer 32 must be removed from the capacitor electrode pattern 23. Please show

ZrA, ^ ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 2, J, the manufacturing method of the preferred embodiment of the present invention, then the second insulating layer 32 is formed by exposure development or laser sintering to form a hole 32a, and the hole 32a penetrates to the The first capacitor electrode pattern 23 is completed to expose the capacitor electrode pattern 23 again. Please refer to FIG. 2K, the manufacturing method of the preferred embodiment of the present invention.

511418 V. Description of the invention (7) Filling a capacitor material with a capacitor material by a coating method One capacitor electricity Please refer to the second capacitor electrode layer 24 and the second method to compare the method and the capacitor design to reduce the printing method The difference caused by the difference in the thickness of the circuit board is suitable for the thickness of the substrate. At this time, the pole patterns 2 3. As shown in the figure of Brother L, the capacitor material pattern 25 of the insulating layer 32 of the present invention. Therefore, the second capacitor electrode pattern 2 5 according to the bulletin No. 444522 shown in Figures 1 and 2L is suitable for the volume of the electrical circuit board and the reduction method. The stress placed by the embedded resistor acts to resist the product yield and trust. The resistance is relatively low, and the stress is easy to damage. The invention has been described as above. Anyone who is familiar with this technique can make various changes. The scope of the patent application is attached. The hole 3 2 a is baked and hardened to form an electric valley material layer 2 4 Vertically corresponds to the last material layer of the manufacturing method of the second embodiment of the car, and a second capacitor electrode pattern is formed vertically on the fourth layer. Case 23, the capacitor material constitutes a capacitor 2 δ. 1 The manufacturing method of the printed circuit board of the present invention: The resistance and capacitance of the printed circuit board of the present invention are embedded on the same layer, and the circuit board is brushed with P. In addition, the bottom of the hair is flattened to eliminate the resistance. The weak part 'in order to improve the seal _', instead of the method of Announcement No. 444522, the manufacturing method of the i S z 'resistor has the disadvantages of ,, and structure. The second example reveals that, however, it is not intended to limit & without departing from the spirit of the present invention and 22, so what is defined by the protection scope of the present invention shall prevail.

511418 Brief description of the drawings [Explanation of the drawings] Fig. 1 · Schematic diagram of polymer thick film resistors of the Republic of China Patent Gazette Bulletin No. 444522. FIG. 2A is a schematic cross-sectional view of a method for setting a resistor and a capacitor in a printed circuit board according to a preferred embodiment of the present invention. ′ FIG. 2B: A schematic cross-sectional view of a browning process for a method for setting a resistor and a capacitor in a printed circuit board according to a preferred embodiment of the present invention. Fig. 2C ····················································································· the thickness of the cross-section of the base plate can be divided into two layers; Section 2D: A schematic cross-sectional view of a method of setting a resistor and a capacitor in a printed circuit board according to a preferred embodiment of the present invention by polishing and exposing an electrode pattern. Fig. 2E ... The method for setting the resistance and capacitance in a printed circuit board according to a preferred embodiment of the present invention is a schematic I% cross-sectional view of a resistive electrode pattern after exposure and development after coating a photoresist layer. Fig. 2 F ·········································································---· · ························· Fig. 2G ·············································································· — either the dimensions of the two sides as shown in FIG. Fig. 2 (a): A schematic cross-sectional view of a method for setting a resistor and a capacitor in a printed circuit board according to a preferred embodiment of the present invention to form a resistor. FIG. 2I is a schematic cross-sectional view of an insulating layer formed by a method for setting a resistance and a capacitor in a printed circuit board according to a preferred embodiment of the present invention. Figure 2 J: A method for setting the resistance and capacitance in a printed circuit board according to a preferred embodiment of the present invention.

C: \ Logo-5 \ Five Continents \ PK8211.ptd Page 11 511418 Schematic description of the intention. FIG. 2K: A schematic cross-sectional view of a method for setting a resistance and a capacitor in a printed circuit board filled with a capacitor material according to a preferred embodiment of the present invention. FIG. 2 L is a schematic cross-sectional view of a method for setting a resistor and a capacitor in a printed circuit board to form a second capacitor electrode pattern.

[Illustration of drawing number] 10 Printed circuit board 11 Resistance 12 Resistance electrode pattern a Resistance thickness b Resistance thickness c Connection angle 20 Substrate 21 Resistance electrode pattern 21a Metal layer 22 Resistance 23 First capacitor electrode pattern 24 Capacitive material layer 25 Second capacitor electrode pattern 26 Capacitor 30 Insulating layer 3 0a Bottom insulating layer 31 Liquid photoresist layer 31a hole 32 Insulating layer 32a hole

C: \ Logo-5 \ Five Cont inents \ PK8211.ptd Page 12

Claims (1)

511418 6. The method for setting the resistance and capacitance in a printed circuit board for patent application is as follows: forming a substrate on the substrate to bake and harden the insulating layer on the electrode pattern; The step is to put the liquid in the base; remove the electric value of the metal and apply the capacitor on the base in the base. According to the application method, the hole depth is deposited to the top. According to the application method, the method is applied to the first case. Re-resistance electrode pattern, photo-resistance layer, and redistribution pattern board use-insulation layer patent scope. A capacitor is used to couple the capacitor to several resistors and the first capacitor electrode pattern; coating to form a liquid insulating layer to form a first insulating layer; flattening and exposing the electrode pattern; forming a liquid photoresist layer; The developing method is exposed again, and the resistive electrode is electroless. The plating method is plated with low contact to expose the electrode pattern; to form several resistors; the dielectric material is applied to form a second insulating layer to form a second capacitor electrode pattern to shape the first The resistance in the printed circuit board and the liquid photoresist layer of item 1 are shaped in a pattern of exposed development, which is mainly for the resistance of the metal at the resistance electrode. The resistance in the printed circuit board of item ^ I and the second insulation layer form another hole, and the hole electrode pattern is completed, and then the capacitor material is exposed, and the hole is painted, and the liquid is baked and polymerized. Pole figure resistor C: \ Logo-5 \ Five Continents \ PK8211.ptd Page 13 511418 6. Apply for a patent to form a capacitor material layer; a second capacitor electrode pattern is formed vertically on the dielectric layer of the second insulation layer, The first capacitor electrode pattern, the capacitor material layer and the second capacitor electrode pattern constitute a capacitor. 4. The method for setting the resistance and capacitance in the printed circuit board according to item 3 of the scope of the patent application, wherein the second insulating layer forms the hole by way of exposure development. 05. The resistance in the printed circuit board according to item 3 of the scope of the patent application and The capacitor setting method, wherein the second insulating layer forms the hole in a laser manner. 6. The method for setting the resistance and capacitance in a printed circuit board according to item 1 of the scope of patent application, wherein the first insulating layer forms a flat bottom insulating layer at the bottom of the resistor. C: \ Logo-5 \ Fi ve Cont inents \ PK8211.ptd Page 14