TW510503U - Distributing structure of wafer's testing pad and burning pad - Google Patents
Distributing structure of wafer's testing pad and burning padInfo
- Publication number
- TW510503U TW510503U TW88220270U TW88220270U TW510503U TW 510503 U TW510503 U TW 510503U TW 88220270 U TW88220270 U TW 88220270U TW 88220270 U TW88220270 U TW 88220270U TW 510503 U TW510503 U TW 510503U
- Authority
- TW
- Taiwan
- Prior art keywords
- pad
- wafer
- burning
- distributing structure
- testing
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88220270U TW510503U (en) | 1999-11-25 | 1999-11-25 | Distributing structure of wafer's testing pad and burning pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88220270U TW510503U (en) | 1999-11-25 | 1999-11-25 | Distributing structure of wafer's testing pad and burning pad |
Publications (1)
Publication Number | Publication Date |
---|---|
TW510503U true TW510503U (en) | 2002-11-11 |
Family
ID=27656800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88220270U TW510503U (en) | 1999-11-25 | 1999-11-25 | Distributing structure of wafer's testing pad and burning pad |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW510503U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103443633A (zh) * | 2011-10-19 | 2013-12-11 | 硅谷有限公司 | 用于测试半导体器件的接触件的制造方法 |
TWD195624S (zh) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | 半導體元件用構件 |
TWD195586S (zh) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | 半導體元件用構件 |
TWD195587S (zh) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | 半導體元件用構件 |
-
1999
- 1999-11-25 TW TW88220270U patent/TW510503U/zh not_active IP Right Cessation
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103443633A (zh) * | 2011-10-19 | 2013-12-11 | 硅谷有限公司 | 用于测试半导体器件的接触件的制造方法 |
CN103443633B (zh) * | 2011-10-19 | 2015-10-07 | 硅谷有限公司 | 用于测试半导体器件的接触件的制造方法 |
TWD195624S (zh) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | 半導體元件用構件 |
TWD195586S (zh) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | 半導體元件用構件 |
TWD195587S (zh) | 2017-09-27 | 2019-01-21 | 日商濱松赫德尼古斯股份有限公司 | 半導體元件用構件 |
USD864882S1 (en) | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD864883S1 (en) | 2017-09-27 | 2019-10-29 | Hamamatsu Photonics K.K. | Part for semiconductor device |
USD865690S1 (en) | 2017-09-27 | 2019-11-05 | Hamamatsu Photonics K.K. | Part for semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1030543A1 (en) | Novel formulations of pharmacological agents, methods for the preparation thereof and methods for the use thereof | |
EP1227821A4 (en) | THERAPEUTIC COMPOSITIONS AND METHOD FOR USE THEREOF | |
EP1018987A4 (en) | NEO-CARTILAGE AND ITS METHODS OF USE | |
HK1048247A1 (en) | Stable carotene-xanthophyll beadlet compositions and methods of use | |
EP1003916A4 (en) | ANTI-SENSE OLIGONUCLEOTID COMPOSITIONS AND METHODS FOR MODULATING JNK PROTEINS | |
EP0975371A4 (en) | ANTISENSE OLIGONUCLEOTIDE COMPOSITIONS AND METHOD FOR MODULATING THE ACTIVATING PROTEIN 1. | |
HUP0004802A3 (en) | Nicotine compositions and methods of formulation thereof | |
EP0959908A4 (en) | NOVEL CONTRAST MEDIA CONTAINING A TARGETING AGENT FOR DIAGNOSTIC AND THERAPEUTIC USE | |
PL336213A1 (en) | Gnrh antagonists modified at positions 5 and 6 | |
HU229606B1 (en) | Novel combination of loteprednol and antihistamines | |
EP1154997A4 (en) | PHARMACEUTICALLY ACTIVE COMPOUNDS AND METHODS OF USE | |
GB9725946D0 (en) | Lipid compositions and their use | |
TW510503U (en) | Distributing structure of wafer's testing pad and burning pad | |
ZA983239B (en) | Stable active human ob protein compositions and methods | |
EP0959887A4 (en) | PHARMACEUTICALLY ACTIVE COMPOUNDS AND METHODS OF USING THE SAME | |
TW495035U (en) | Distribution structure of test pad network connection of wafer | |
EP1041986A4 (en) | PHARMACEUTICAL ACTIVE COMPOUND AND METHODS OF USE | |
EP1015559A4 (en) | SERPIN-1 (RASP-1), ASSOCIATED WITH REGENERATION, AND APPLICATION METHOD | |
TW369922U (en) | Modified structure of Takundo pad | |
TW391276U (en) | Structure improvement in assembly of goggle pad | |
TW355322U (en) | Structure for cup and cup pad | |
TW320028U (en) | Improved structure of cup pad | |
TW398300U (en) | Improved structure of base ball and soft ball | |
TW346825U (en) | Structure for protection pad of goggles | |
TW325687U (en) | Structure of medical armrest pad |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |