TW510503U - Distributing structure of wafer's testing pad and burning pad - Google Patents

Distributing structure of wafer's testing pad and burning pad

Info

Publication number
TW510503U
TW510503U TW88220270U TW88220270U TW510503U TW 510503 U TW510503 U TW 510503U TW 88220270 U TW88220270 U TW 88220270U TW 88220270 U TW88220270 U TW 88220270U TW 510503 U TW510503 U TW 510503U
Authority
TW
Taiwan
Prior art keywords
pad
wafer
burning
distributing structure
testing
Prior art date
Application number
TW88220270U
Other languages
English (en)
Inventor
John Liu
Noty Tseng
Original Assignee
Chipmos Technolgies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technolgies Inc filed Critical Chipmos Technolgies Inc
Priority to TW88220270U priority Critical patent/TW510503U/zh
Publication of TW510503U publication Critical patent/TW510503U/zh

Links

TW88220270U 1999-11-25 1999-11-25 Distributing structure of wafer's testing pad and burning pad TW510503U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88220270U TW510503U (en) 1999-11-25 1999-11-25 Distributing structure of wafer's testing pad and burning pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88220270U TW510503U (en) 1999-11-25 1999-11-25 Distributing structure of wafer's testing pad and burning pad

Publications (1)

Publication Number Publication Date
TW510503U true TW510503U (en) 2002-11-11

Family

ID=27656800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88220270U TW510503U (en) 1999-11-25 1999-11-25 Distributing structure of wafer's testing pad and burning pad

Country Status (1)

Country Link
TW (1) TW510503U (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103443633A (zh) * 2011-10-19 2013-12-11 硅谷有限公司 用于测试半导体器件的接触件的制造方法
TWD195624S (zh) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 半導體元件用構件
TWD195586S (zh) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 半導體元件用構件
TWD195587S (zh) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 半導體元件用構件

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103443633A (zh) * 2011-10-19 2013-12-11 硅谷有限公司 用于测试半导体器件的接触件的制造方法
CN103443633B (zh) * 2011-10-19 2015-10-07 硅谷有限公司 用于测试半导体器件的接触件的制造方法
TWD195624S (zh) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 半導體元件用構件
TWD195586S (zh) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 半導體元件用構件
TWD195587S (zh) 2017-09-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 半導體元件用構件
USD864882S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees