TW506247B - Heat sink with high-density heat dissipation fins and its assembling method - Google Patents

Abstract

The present invention relates to a heat sink with high-density heat dissipation fins, which comprises: a base; and a heat dissipation sheet member composed of a plurality of heat dissipation sheets connected to one another in a detachable manner, wherein each heat dissipation sheet includes a bottom plate and a fin vertical with the bottom plate. Each bottom plate forms the bottom face of the heat dissipation sheet member, and the bottom face is adhered to the surface of the base.

Description

506247 Case No. 90117132 V. Description of the invention (1) The field of invention is more advanced. This case is about a method of assembling a heat sink with high-density heat sink fins: Background of the invention (CirCUit deviceS) is widely used in computer systems. Take the CPU (Central Processing Unit) as an example. 'Combined with a large number of # under normal operation.' If it is too hot, it can easily cause the system to crash and make the operation unstable. . In order to avoid overheating, these chips usually need to use a heat sink to remove excess heat. The heat sink is usually made of materials with high heat transfer coefficients such as copper and copper. It includes a base and multiple heat sinks. Fins (fi η) 'are connected and perpendicular to the upper surface of the base to increase the surface area of the heat sink, and the lower surface of the heat sink base is placed above the wafer and in contact with the surface of the wafer. The heat is removed and removed. In recent years, the power of the chip has increased a lot, so a lot of heat is generated. Therefore, the current production of heat sinks is mainly to expand the heat dissipation area of the heat sink fins and develop heat dissipation with high density fins. Device. The shape of the radiator is usually parallel finned heat sink. The manufacturing methods are usually extrusion process, gang sawing process and bonded process. In the above methods, The clearance and number of the radiating fins of the heat sink made by pressing are limited by the shape of the die and the ability to withstand pressure to dissipate heat.

Page 4 506247 _Case No. 90117132_ Modification of Year and Month_ V. Description of the Invention (2) The gap between the fins is too small and the fingertips of the die mouth are likely to break during the injection process, so the extrusion method is not suitable for high density heat dissipation. Fin heat sink. The cutting rule depends on the thickness, number, height, and clearance of the desired fins. A metal saw is used to cut off part of the metal block to form a plurality of grooves. The radiator produced by the cutting method must cut off part of the metal block, resulting in material waste. The sticking rule is to first provide a base with a plurality of grooves on the base, and then stick individual fins to the grooves. The main disadvantage of using a paste method to make a heat sink is that the number of grooves on the base needs to be determined in advance depending on the number of fins to be assembled, which lacks flexibility, at the same time not only has a higher assembly cost, but also has a poor support effect on the fins. . Therefore, this case proposes a heat sink with high-density heat dissipation fins and an assembly method thereof, which has the characteristics of flexible assembly and saving assembly time, so as to avoid the problems faced by conventional techniques. SUMMARY OF THE INVENTION The object of the present invention is to provide a heat sink with high-density heat dissipation fins, wherein the distance, thickness and height of the fins can be set in advance. Another object of this case is to propose a heat sink with high-density heat-dissipating fins, which can be assembled with different numbers of fins as required, so the assembly is quite flexible. Another object of this case is to propose a method for assembling a heat sink with high-density heat dissipation fins to reduce assembly time. On the one hand, the case proposes a heat sink with high-density heat dissipation fins, which includes:

Page 5 506247 _Case No. 90117132_ 年月 日 _Hi_ V. Description of the invention (3) A base; and a heat sink assembly made of a plurality of heat sinks which are detachably connected to each other, each of which The heat sink includes a base plate and a fin perpendicular to the base plate; wherein each base plate forms a bottom surface of the heat sink component, and the bottom surface is adhered to the surface of the base. As described above, the heat sink with high-density heat dissipation fins, wherein two sides of the bottom plate are respectively provided with a first --- ^ slot, and an outer side of the first card slot is provided with a --- ^ hook. The heat sink with high-density heat dissipation fins as described above, wherein the horizontal distance between the first hook and the bottom plate is equal to the thickness of the fins. The heat sink with high-density heat-dissipating fins as described above, wherein the first hook is composed of two upward protruding pieces. As described in the heat sink with high-density heat dissipation fins, wherein the top edge of the fin extends outward to form two engaging portions, and each engaging portion is relative to the first slot and the position of the first --- ^ hook. A second card slot and a second card hook are respectively provided. The heat sink with high-density heat dissipation fins as described above, wherein the horizontal distance between the second card hook and the bottom plate is equal to the thickness of the fin. The heat sink with high-density heat-dissipating fins as described above, wherein the second hook includes two downward-facing protrusions. The heat sink with high-density heat-dissipating fins as described above, wherein a fan is further carried above the heat-radiating fin assembly. On the other hand, this case proposes a heat sink with high-density heat dissipation fins.

Page 6 506247 _Case No. 90117132_ Revised Year of the Month _ V. Description of the Invention (4) The system includes: a base; and a heat sink assembly, which is formed by connecting a plurality of heat sinks to each other. The heat sink includes a base plate and a fin. Two sides of the base plate are respectively provided with a first card slot, and a first hook is set on the outer side of the first card slot. The first hook includes two upward protruding pieces. And the fin is perpendicular to the bottom plate, the top edge of the fin extends outward to form two engaging portions, and each engaging portion is provided with a second engaging slot relative to the position of the first engaging slot and the first engaging hook. And a second hook, the second hook includes two downward protruding pieces, wherein each bottom plate forms a bottom surface of the heat sink component, and the bottom surface is adhered to the surface of the base. The heat sink with high-density heat dissipation fins as described above, wherein the horizontal distance between the first hook and the bottom plate is equal to the thickness of the fins. The heat sink with high-density heat dissipation fins as described above, wherein the horizontal distance between the second hook and the bottom plate is equal to the thickness of the fins. The heat sink with high-density heat-dissipating fins as described above, wherein a fan is further carried above the heat-radiating fin assembly. In another aspect of the present case, a method for assembling a heat sink with high-density heat dissipation fins is provided. The method includes: (a) providing a plurality of heat sinks, wherein each heat sink includes a bottom plate and a fin perpendicular to the bottom plate; 'Where the first side of the bottom plate is provided with a first card slot, and the first side of the first card slot is provided with a first card hook, and the top edge of the fin extends outward to form two engaging portions, each engaging portion is opposite A second card slot and a second card are respectively provided at the positions of the first card slot and the first card hook.

Page 7 506247 _Case No. 90117132_ Amendment of the month and year _ V. Description of the invention (5) Hook; (b) Insert the first hook and the second hook of one of the two heat sinks separately The first card slot and the second card slot of another heat sink to complete a heat sink assembly, wherein the bottom plate of each heat sink forms the bottom surface of the heat sink assembly, and (c) the bottom surface of the heat sink assembly Adhering to the surface of a base completes the heat sink with high-density fins. As described in the method for assembling a heat sink with high-density heat dissipation fins, wherein the horizontal distance between the first hook and the bottom plate is equal to the thickness of the fins. As described in the method for assembling a heat sink with high-density heat dissipation fins, wherein the horizontal distance between the second hook and the bottom plate is equal to the thickness of the fins. As described in the method for assembling a heat sink with high-density heat-dissipating fins, wherein the first hook is composed of two upwardly protruding tabs. The method for assembling a heat sink with high-density heat-dissipating fins as described above, wherein the second hook includes two downward-facing protrusions. The method for assembling a heat sink with high-density heat-dissipating fins as described above, wherein a fan is further carried above the heat-dissipating element. In another aspect of the present case, a method for assembling a heat sink with high-density heat dissipation fins is provided. The method includes: (a) providing a plurality of heat sinks, wherein each heat sink includes a bottom plate and a fin perpendicular to the bottom plate; Wherein, two first sides of the bottom plate are respectively provided with a first card slot, and a first card hook is provided on the outer side of the first card slot, and the top edge of the fin extends outward to form two engaging portions, each engaging portion is opposite A second card slot and a second card are respectively provided at the positions of the first card slot and the first card hook.

Page 8 506247 _Case No. 90117132_Year Month and Day_ί ±± _ V. Description of the invention (6) Hook; (b) The first hook and the second card of one of the two heat sinks The hooks are respectively inserted into the first card slot and the second card slot of another heat sink to complete a first heat sink assembly having a first number of heat sinks and a second heat sink assembly having a second number of heat sinks, respectively; (c) The bottom surface of the first heat sink component and the bottom surface of the second heat sink component are respectively adhered to a base surface, and a space is provided between the bottom surface of the first heat sink component and the second heat sink component. Space for the buckle. In this case, a deeper understanding can be obtained through the following drawings and detailed description: Description of the preferred embodiment The first figure shows a perspective view of the heat sink of the preferred embodiment of the case, wherein the heat sink f 1 is mainly composed of a base plate 11 And a fin 12 which is perpendicular to each other, a first card slot 111 is set on two sides of the bottom plate 11 and a first hook 112 is set on the outer side of the first card slot, wherein the first hook mainly includes Two upward tabs 11 2 1 and 11 2 2. The top edge of the fin 12 extends outward to form two engaging portions 15. Each engaging portion 15 is provided with a second card slot 151 and a second card with respect to the first card slot 1 11 and the first card hook 112, respectively. Hook 152 (the second hook includes two downward protruding pieces 1521 and 1522). The horizontal distance between the first hook 112 and the second hook 1 5 2 and the bottom plate 11 is approximately equal to the thickness of the fins 12. The second figures (a) and (b) respectively show an assembly view and a perspective view of two heat sinks in the preferred embodiment of the present invention. The first card hook 112 and the second card of the heat sink Π

Page 9 506247 _Case No. 90117132_ Year and Month Amendment _ V. Description of the invention (7) Hook 1 5 2 is inserted into the first card slot 2 1 1 and the second card slot 2 5 1 of the other heat sink f 2 respectively, Due to the unique elasticity of the metal material (such as aluminum or copper), the heat sink fin 2 and the heat sink fl can be fixed to each other. Furthermore, since the horizontal distance between the first hook 112 and the bottom plate 11 is approximately equal to the thickness of the fins 1 2 (or 22), after the heat sink fl and f 2 are combined, the bottom plates 1 1 and 21 contact each other to form a Flat underside. Please refer to the second figure (c), continue to assemble another heat sink in the manner of the second figure (a), and then complete a heat sink assembly F. In the third figure, the bottom surface of the heat sink component F is adhered to the surface of a metal base 3, and the heat sink with high-density heat sink fins is completed in this case. The fourth figure is another specific embodiment of the heat sink with high-density heat sink fins, which respectively assembles a first heat sink assembly F 1 having a first number of heat sinks and a second heat sink having a second number of heat sinks. After the sheet component F 2 is adhered to the bottom surface of the base 4 respectively, there is a space 41 for receiving a fastener (not shown) between the two components F 1 and F 2. In this case, the lower surface of the base of the heat sink with high-density heat dissipation fins is placed above the wafer and in contact with the surface of the wafer, thereby directing the heat of the wafer to the fins. Of course, a fan (not shown) can be further carried on the top of the heat sink assembly, so as to use forced convection to move the derived heat to the ambient air. In summary, the heat sink with high density heat sink fins and the assembly method thereof The characteristics are as follows: (1) The fin pitch (equivalent to the thickness of the base plate 11), thickness (equivalent to the thickness of the fin 12), and height (equivalent to the height of the fin 12) of the heat sink in this case can be set in advance, so heat dissipation Device quality is easy to grasp.

Page 10 506247 Case No. 90〗 17132_ Fifth, the description of the invention (8) Amendment) This case can be assembled as required, so the assembly is quite flexible. ° The number of fins of the heat sink assembly. (3) Compared with the conventional sticking method, a base with corresponding grooves needs to be made. · The number of fins to be assembled is provided in advance with a flat surface. As for the base 3 (or 4), the cost of the clothes 1f is lower. (D) Assemble the cymbals by pasting. z # 衣 ”, the corresponding groove on the base is quite expensive, and the time required to form the clothes in this case can be greatly reduced. (5) The support effect of the fins assembled by conventional adhesive methods is not good (due to ^ & ministry support), the fins of the radiator in this case are made of card slots and hooks ^ "Scoop Γ1ΐ: The upper and lower sides and the two sides have a clamping effect, so the positioning effect is good. Molds and forks are broken, and the disadvantages of material waste caused by the cutting method are summarized. As mentioned above, the high-density bulk and privacy provided by this case and its manufacturing method are easy to assemble and flexible. And the advantages of the t-heater, and can avoid the shortcomings encountered in the know-how, this / good invention, progress and practical invention, apply for the law according to the law. Shelley, a new case can be obtained by persons familiar with the skill Ren Shijiang thinks and protects all who want to protect the scope of the patent application. I decorated, 506247 _ Case No. 90117132 _ year, month, and amendment _ The diagram briefly illustrates the first picture: the heat dissipation of the preferred embodiment of this case The perspective view of the second image (a) and (b): the case is better Example 2 Assembly drawing and perspective view of two heat sinks. Second picture (c): The heat sink assembly after the assembly of the preferred embodiment of the case. Third picture: One of the preferred heat sinks with high density heat sink fins. The fourth figure of the embodiment: Another preferred embodiment of the heat sink with high-density heat dissipation fins in this case is explained with reference to the main component symbols: f 1 Scattering * '' X plate 11 base plate 111 first slot 112 first hook 1121 protruding piece 1122 protruding piece 12 fin 15 engaging portion 151 second slot 152 second hook 1521 protruding piece 1522 protruding piece f 2 heat sink 211 first slot

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Claims (1)

506247 _Case No. 90117132_ Modification of Year of the Month _ 6. Scope of Patent Application 1. A heat sink with high-density heat sink fins, which includes: a base; and a heat sink component, which is composed of a plurality of heat sinks. They are detachably connected to each other. Each of the heat sinks includes a base plate and a binding piece perpendicular to the base plate. Two sides of the base plate are respectively provided with a first slot, and the outer side of the first card slot is provided. A first hook, and the first-hook hook includes two upward protruding pieces; wherein each bottom plate forms a bottom surface of the heat sink component, and the bottom surface is adhered to the surface of the base. 2. The heat sink with high-density heat-dissipating fins as described in item 1 of the scope of the patent application, wherein the horizontal distance between the first and second hooks and the bottom plate is equal to the thickness of the fins. 3. The heat sink with high-density heat-dissipating fins according to item 1 of the scope of patent application, wherein the top edge of the fins extends outward to form two connecting portions, each connecting portion is opposite to the first card slot and the A position of the first hook is provided with a second card slot and a second card hook respectively. 4. The heat sink with high-density heat-dissipating fins as described in item 3 of the scope of patent application, wherein the horizontal distance between the second hook and the bottom plate is equal to the thickness of the fins. 5. The heat sink with high-density heat-dissipating fins as described in item 3 of the scope of patent application, wherein the second hook includes two downward-facing protrusions. 6. The heat sink with high-density heat-dissipating fins according to item 1 of the scope of patent application, wherein a fan is further carried above the heat-dissipating element. 7. —A kind of radiator with high-density fins, which includes: Page 14 506247 _ Case No. 90117U9 dated to _ VI. Patent application scope a base; and a heat sink assembly, which is made up of a plurality of heat sinks connected to each other, each of which includes a base plate and A fin 'is provided with a first card slot on two sides of the bottom plate, and a first hook is provided on the outer side of the / card slot. The first hook includes two upward protruding pieces, and the fins are connected with The bottom plate is vertical, and the top edge of the fin extends outward to form two engaging portions. Each engaging portion is respectively provided with a second card slot and a second card position with respect to the positions of the first card slot and the first card hook. The second hook includes two downward protruding pieces, wherein each bottom plate forms a bottom surface of the heat sink component, and the bottom surface is adhered to the surface of the base. 8 · The heat dissipation of the high-density heat-dissipating fins as described in item 7 of the scope of the patent application is ′, wherein the horizontal distance between the --- th hook and the bottom plate is equal to the thickness of the fins. 9 · The heat dissipation of the high-density heat-dissipating fins as described in item 7 of the scope of the patent application is wherein the horizontal distance between the second hook and the base plate is equal to the thickness of the fins. lj The heat dissipation with high-density heat sink fins as described in item 7 of the scope of the patent application, where a fan is further carried above the heat sink assembly. ^. A method for assembling a heat sink with high-density heat-dissipating fins, the package (a) provides a plurality of heat-dissipating fins, wherein each heat-dissipating fin includes a bottom ^ ^-a fin perpendicular to the bottom plate, wherein The two sides of the bottom plate are respectively provided with a slot, and a first hook is provided on the outer side of the first card slot, and the top edge of the fin extends outward to form two engaging portions, each engaging portion is opposite to the 506247 _Case No. 90117132_year month_i ± ^ ._ Sixth, the scope of the patent application-the ^ slot and the-^ hook are respectively provided with a second card slot and a second card hook, and the first The card hook system includes two upward protruding pieces, and the second card hook system includes two downward protruding pieces; (b) the first hook and the second hook of one of the two heat sinks are respectively Insert the first card slot and the second card slot of another heat sink to complete a heat sink assembly, wherein the bottom plate of each heat sink forms the bottom surface of the heat sink assembly; (c) the heat sink assembly The bottom surface is adhered to the surface of a base to complete the heat sink with high-density fins. 1 2. The method for assembling a heat sink with high-density heat-dissipating fins according to item 11 of the scope of patent application, wherein the horizontal distance between the first hook and the bottom plate is equal to the thickness of the fins. 1 3. The method for assembling a heat sink with high-density heat dissipation fins as described in item 11 of the scope of patent application, wherein the horizontal distance between the second hook and the bottom plate is equal to the thickness of the fins. 1 4. The method for assembling a heat sink with high-density heat-dissipating fins as described in item 11 of the scope of patent application, wherein a fan is further carried above the heat-dissipating element assembly. 1 5. —A method for assembling a heat sink with high-density heat sink fins, comprising: (a) providing a plurality of heat sinks, wherein each heat sink includes a bottom plate and a fin perpendicular to the bottom plate, The second side of the bottom plate is provided with a first '-^ slot, and the first side of the first card slot is provided with a first'-^ hook, and the top edge of the fin extends outward to form two connecting portions, each connecting portion Relative to this Page 16 506247 _Case No. 90117132_Year_Month__ Sixth, the scope of the patent application of the first card slot and the first card hook are respectively provided with a second card slot and a second card hook, and the first-^ hook The second hook includes two downward projections; (b) the first hook and the second hook of one of the two heat sinks are respectively inserted into another The first card slot and the second card slot of a heat sink to complete a first heat sink assembly having a first number of heat sinks and a second heat sink assembly having a second number of heat sinks; The bottom surface of the first heat sink component and the bottom surface of the second heat sink component are respectively adhered to a base surface, wherein a bottom surface of the first heat sink component and the second heat sink component are provided with an accommodation fastener. space. 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