經濟部智慧財產局員工消費合作社印製 505603 A7 B7_ 五、發明說明（） 發明領域： 本發明係有關於晶圓包裝之缓衝墊，特別是有關於可 將圓形晶圓盒包裝在方形晶圓盒包裝材所用的晶圓包裝之 缓衝墊。 發明背景： 由於一般晶圓以及積體電路的造價非常昂貴，因此在 運送晶圓的過程以及包裝過程中，都必須非常小心。一般 晶圓盒的形狀有兩種：圓形以及方形。第1圖所繪示為一 般圓形晶圓盒之示意圖，而第2圖所繪示為一般方形晶圓 盒之示意圖。請參照第1圖與第2圖，其中，不論圓形晶 圓盒10或方形晶圓盒20所能包裝的晶圓數量通常為25 片，只是為避免較薄晶圓遭受破片，厚度在15mil以下的 晶圓12較適用於利用圓形晶圓盒10來包裝，而厚度在 15mil以上的晶圓22較適用於利用方形晶圓盒20來包裝。 上述的mil係為英制測量單位，相當於0.001 英吋或25.4 微米（micron) 〇 除了利用晶圓盒將晶圓包裝起來，在運送或郵寄晶圓 盒產品時，晶圓盒的外部更需要利用晶圓盒包裝材包裝起 來，此晶圓盒包裝材除了要具有一定的硬度以可承受外力 本紙張尺度適用中國國家標準（CNS)A4規格（21〇x 297公t ) U——>---------- I n D I · 1-1 11 ϋ J H I 1 一alf * -· n n n n ϋ ill I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 505603 A7 ____B7_ 五、發明說明（） 而不變形，更要具有一定的彈性以吸收外力而保護内部的 晶圓與晶圓盒，一般可利用如聚嫦烴系發泡體高分子來製 作晶圓和包裝材。為配合晶圓盒有下列形式之晶圓盒可供 利用：圓形晶圓盒之包裝材、方形晶圓盒之包裝材、以及 雙方形晶圓盒之包裝材。 第3a圖所繪示為一般圓形晶圓盒包裝材之上視圖，而 第3b圖所繪示為一般圓形晶圓盒包裝在圓形晶圓盒包裝 材之示意圖。請參照第3a圖與第3b圖，其中，圓形晶圓 盒包裝材30中具有凹槽32，此凹槽32的空間恰好可容納 一個圓形晶圓盒1 0，而不使圓形晶圓盒1 0之周遭有多餘 的空隙。將圓形晶圓盒1 0包裝在兩個相對的圓形晶圓盒包 裝材3 0之間，即可在運送過程中達到保護晶圓的目的。 第4a圖所繪示為一般方形晶圓盒包裝材之上視圖，而 第 4b圖所繪示為一般方形晶圓盒包裝在方形晶圓盒包裝 材之示意圖。請參照第4a圖與第4b圖，其中，方形晶圓 盒包裝材40中具有凹槽42，此凹槽42的空間恰好可容納 一個方形晶圓盒20，而不使方形晶圓盒20之周遭有多餘 的空隙。利用兩個相對的方形晶圓盒包裝材40來包裝方形 晶圓盒20，即可在運送過程中達到保護晶圓的目的。 另外，請參照第5圖，還有一種可裝置兩個方形晶圓 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公坌） -------------^ ---------^--------» (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 505603 A7 ____B7___ 五、發明說明（） 盒20的雙方形晶圓盒包裝材50。第5圖所繪示為一般方 形晶圓盒包裝在雙方形晶圓盒包裝材之示意圖，其中，為 配合客戶以及晶圓數量需要，此雙方形晶圓盒包裝材5 0中 具有兩個凹槽52，每個凹槽52的空間恰好可容納單一方 形晶圓盒20，不但單一方形晶圓盒20之周遭沒有多餘的 空隙，兩方形晶圓盒20之間也有部分具彈性之塑膠材料做 為保護。利用兩個相對的雙方形晶圓盒包裝材50來包裝兩 個方形晶圓盒20，即可在運送過程中達到保護晶圓的目 的。 發明目的及概述： 由於一般利用晶圓盒包裝材來包裝晶圓盒時，需就不 同形狀的晶圓盒來選擇利用晶圓盒包裝材，因此需要製造 不同形狀的晶圓盒包裝材以及外部的包裝紙盒，而造成晶 圓運送成本的增加。再者，若客戶所需要的晶圓產品之厚 度不等，而需利用不同形狀之晶圓盒與晶圓盒包裝材來包 裝、運送，可能造成客戶無法同時收取兩種晶圓產品的困 擾。 鑒於上述之習知包裝的缺點中，因此，本發明的目的 之一係提供一種晶圓包裝之緩衝墊，使圓形晶圓盒可緊密 貼合於方形晶圓盒包裝材中，並使方形晶圓盒包裝材對圓 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------^ ---1------^ (請先閱讀背面之注意事項再填冩本頁) 505603Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505603 A7 B7_ V. Description of the invention () Field of the invention: The present invention relates to cushioning pads for wafer packaging, and in particular, it is possible to pack round wafer boxes in square crystals. Wafer packaging cushion for round box packaging materials. Background of the Invention: Because the cost of general wafers and integrated circuits is very expensive, care must be taken in the process of wafer transportation and packaging. There are two types of wafer cassettes: round and square. Figure 1 shows a schematic diagram of a generally circular wafer box, and Figure 2 shows a schematic diagram of a general square wafer box. Please refer to Figure 1 and Figure 2. Among them, the number of wafers that can be packed in the round wafer box 10 or the square wafer box 20 is usually 25, but to prevent thin wafers from being damaged, the thickness is 15mil. The following wafer 12 is more suitable for packaging using a circular wafer box 10, and the wafer 22 having a thickness of 15 mil or more is more suitable for packaging using a square wafer box 20. The above mil is an inch measurement unit, which is equivalent to 0.001 inches or 25.4 micron. In addition to packaging wafers with wafer boxes, when shipping or mailing wafer box products, the outside of the wafer box needs to be used. The wafer box packaging material is packaged. This wafer box packaging material must have a certain degree of hardness to withstand external forces. The paper size applies the Chinese National Standard (CNS) A4 specification (21〇x 297 g t) U —— >- --------- I n DI · 1-1 11 ϋ JHI 1-alf *-· nnnn ϋ ill I (Please read the notes on the back before filling this page) Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption Cooperative Printed 505603 A7 ____B7_ 5. Description of the invention () Without deformation, it must have a certain elasticity to absorb external forces and protect the wafers and wafer cassettes inside. Generally, it can be produced by using polymers such as polyfluorene hydrocarbon foams. Wafers and packaging materials. To match the wafer box, the following types of wafer boxes are available: packaging materials for round wafer boxes, packaging materials for square wafer boxes, and packaging materials for double square wafer boxes. Figure 3a is a top view of a general circular wafer box packaging material, and Figure 3b is a schematic diagram of a general circular wafer box packaging material. Please refer to FIG. 3a and FIG. 3b, wherein the circular wafer box packaging material 30 has a groove 32, and the space of the groove 32 can just accommodate a circular wafer box 10 without making the circular crystal There is extra space around the round box 10. Packing the circular wafer box 10 between two opposite circular wafer box packaging materials 30 can protect the wafer during transportation. Figure 4a is a top view of a general square wafer box packaging material, and Figure 4b is a schematic diagram of a general square wafer box packaging material in a square wafer box packaging material. Please refer to FIG. 4a and FIG. 4b, wherein the square wafer box packaging material 40 has a groove 42, and the space of the groove 42 can just accommodate a square wafer box 20, without There are extra spaces around. By using two opposing square wafer box packaging materials 40 to package the square wafer box 20, the purpose of protecting the wafer can be achieved during the transportation process. In addition, please refer to Figure 5. There is also a paper size that can install two square wafers. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 cm) ------------- ^ --------- ^ -------- »(Please read the precautions on the back before filling out this page) Printed by the Employee Consumption Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 505603 A7 ____B7___ V. Description of Invention () The double-sided wafer box packaging material 50 of the box 20. Figure 5 shows a schematic diagram of a general square wafer box packaged in a double-sided wafer box packaging material. Among them, in order to meet the needs of customers and the number of wafers, the double-sided wafer box packaging material 50 has two recesses. The groove 52 and the space of each groove 52 can just accommodate a single square wafer box 20. Not only is there no extra space around the single square wafer box 20, there are also some elastic plastic materials between the two square wafer boxes 20. For protection. The two square wafer cassettes 20 are packaged with two opposite square-shaped wafer cassette packaging materials 50, so that the purpose of protecting the wafer can be achieved during the transportation process. Purpose and summary of the invention: Since wafer box packaging materials are generally used to package wafer boxes, wafer box packaging materials of different shapes need to be selected for use. Therefore, wafer box packaging materials of different shapes and external Packaging cartons, resulting in increased wafer shipping costs. In addition, if the thickness of wafer products required by customers is different, and different shapes of wafer boxes and wafer box packaging materials are needed for packaging and transportation, it may cause customers the difficulty of receiving two wafer products at the same time. In view of the shortcomings of the conventional packaging, one object of the present invention is to provide a cushioning pad for wafer packaging, so that a circular wafer box can be closely fit into a square wafer box packaging material, and The wafer box packaging material applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) to the round paper size. -------- ^ --- 1 ------ ^ (Please read first (Notes on the back are provided on this page) 505603
五、發明說明（） 經濟部智慧財產局員工消費合作社印製 圓现與内"卩39圓的保護程度和圓形晶圓盒包裝材一樣 良好。 一艮據以上所述之目的，本發明提供一種晶圓包裝之緩 衝墊可用來使方形晶圓盒之方形晶圓盒包裝材，用以包 裝圓开y a日圓益，並保護圓形晶圓盒内之數個晶圓，本發明 圓I裝之緩衝墊包括：方形平板，此方形平板係包括正 面與I面，其中此方形平板之正面係用以承接圓形晶圓 UHL，另外，位於方形平板之正面具有數個柱狀物，此柱狀 物係位於方形平板之邊角，並用以固定圓形晶圓盒；而位 於方形平板之背面具有數個另一桎狀物，此些另一柱狀物 係用以支撐方形平板與圓形晶圓盒。 其中’本發明晶圓包裝之緩衝墊上述之方形平板係符 合方形晶圓盒包裝材之内側尺寸，在包裝該圓形晶圓盒 時’可貼合於方形晶圓盒包裝材中。另外，上述位於方形 平板正面之柱狀物具有三個側面，在包裝該圓形晶圓盒 時’其中一側面係與圓形晶圓盒互相貼合，其他側面係與 方形晶圓盒包裝材之内側相互貼合。上述位於方形平板背 面之另些柱狀物，係用以支撐方形平板與圓形晶圓盒。另 外’在本發明一較佳實施例中，本發明晶圓包裝之緩衝墊， 在上述之方形平板中係具有一中空區域，且上述位於方形 平板正面之柱狀物高度係等於圓形晶圓盒之高度之一半。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公餐） -------------^--------^---------^ <請先閱讀背面之注意事項再填寫本頁) 505603 A7 B7 五、發明說明（ 裝盒狀 包圓形 盒晶 一 圓的第 晶狀裝 形形包 圓同使 使不可 可種此 了兩因 除為， ，做介 墊可媒 衝更衝 緩，缓 之中的 裝材間 包裝之 圓包材 晶和裝 明圓包 發晶盒 本形圓 方晶 在與 經濟部智慧財產局員工消費合作社印製 晶圓盒用之第一晶圓盒包裝材，另外用以包裝第二形狀晶 圓盒，本發明晶圓包裝之缓衝墊包括：具第一形狀之平板， 係具有正面與背面，其中該平板之正面係用以承接第二形 狀晶圓盒；複數個第一柱狀物位於平板之正面，此些第一 柱狀物係位於平板之邊角上，並用以固定第二形狀晶圓 盒；複數個第二柱狀物位於平板之背面，係用以支撐平板 與第二形狀晶圓盒。 其中，上述之平板係符合第一晶圓盒包裝材之内側尺 寸，並可裝入第一晶圓盒包裝材中。且上述之第一柱狀物 具有第一側面、第二側面與第三側面，在包裝該圓形晶圓 盒時，其中第一側面係與第二形狀晶圓盒互相貼合，而其 他側面係與第一晶圓盒包裝材之内側相互貼合。上述位於 方形平板背面之第二柱狀物，係用以支撐平板與第二形狀 晶圓盒。另外，在本發明一較佺實施例中，本發明晶圓包 裝之緩衝墊，在上述之方形平板中係具有一中空區域，且 上述位於平板正面之第一柱狀物高度係等於第二形狀晶圓 盒之高度之一半。當上述之第一形狀晶圓盒係為方形晶圓 盒，第一形狀係為方形，而第二形狀晶圓盒係為圓形晶圓 I I i^i in mmM9 An n n I ϋ ϋ I · n βϋ n In a·— i n 訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公餐） 經濟部智慧財產局員工消費合作社印製 505603 A7 ___B7_ 五、發明說明（） 盒時，即為前段所敘述之本發明晶圓包裝之緩衝墊。 本發明晶圓包裝之缓衝墊之特點在於具有用以承接圓 形晶圓盒之平板，此平板具有正面、背面以及數個邊角， 其中平板之正面係用以承接晶圓；以及位於平板之正面具 有至少一柱狀物，其中此至少一柱狀物係位於平板之側 邊，並用以固定圓形晶圓盒，而此至少一柱狀物係具有數 個側面，在包裝圓形晶圓盒時，其中一側面係與圓形晶圓 盒互相貼合，而其他側面係與方形晶圓盒包裝材之内側相 互貼合。另外，位於平板之背面的數個另一柱狀物，係用 以支撐方形平板與圓形晶圓盒，使晶圓在運送途中承受的 應力減少。 本發明晶圓包裝之緩衝墊可利用例如聚烯烴系發泡體 高分子等具彈性的塑膠材質所構成。利用本發明晶圓包裝 之缓衝墊，可作為不同形狀晶圓盒及其晶圓盒包裝材的轉 換，而可統一晶圓盒包裝材的形狀與尺寸，在製造與管理 方面較為方便，並不必將厚度不同的晶圓產品分開運送， 而能準時地到達客戶手中。 圖式簡單說明： 本發明的較佳實施例將於往後之說明文字中輔以下列 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公t ) ^--------^---------^ (請先閱讀背面之注意事項再填寫本頁) 505603 A7 B7 五、發明說明（ 述為為為為 闡示示f示的繪繪：f繪 細所所爿所 詳圖圖1圖 ab 更 1 2 3 3 做第第第第 形 圖 中 其 ya一 意意 示示 之之 盒盒tiil一11 晶晶 形形 圓方 般般 包 ;盒 圖圓 視晶 上形 之圓 材在 裝裝 包包 盒盒 圓圓 晶日BB 形形 圓圓 般般 圖 意 示之材 裝 包 ;盒 圖圓 視晶 上形 之方 材在 裝裝 包包 盒盒 圓圓 晶晶 形形 方方 般般一 一 為為 示示 繪繪 所所 圖圖 a b 4 4 第第 盒 圓 晶 形 方 雙 在 裝 包 盒 圓 晶 形 方 般 1 為 示 ;繪 圖所 意圖 示 5 之第 材 裝 圖 視 上 之 塾 衝 缓 圓 晶 明 發 本 為 ; 示 會 圖 # 意所 示圖 _ a 之 6 材第 裝 包 圖 圖 面視 側底 之之 塾塾 衝衝 缓緩 圓 圓 晶晶 明明 發發 本本 為為 示示 繪繪 所所所 圖圖圖 6b6c7 第第第 另 塾 缓 圓 晶 明 發 本 為 示 繪 視 上 之 例 施 實 -------------裝--- (請先閱讀背面之注意事項再填寫本頁) · 圖 及 以 圖 意 示 之 塾 衝 缓 圓 晶 明 發 本 為 示 繪 所 圖 a 8 第 為 示 繪 所圖, 方 b -8 在 第置 裝 盒 圓 晶 形 圓 將 墊 緩 圓 晶 明 發 本 用 圖 意 示 之 中 材 裝 包 盒 圓 晶 形 .線 經濟部智慧財產局員工消費合作社印製 明說 照對號 圖V. Description of the invention () Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The protection level of the present and internal "卩 39" is as good as that of the round wafer box packaging material. In accordance with the above-mentioned purpose, the present invention provides a cushioning pad for wafer packaging, which can be used to make a square wafer box packaging material for a square wafer box, to package a round wafer, and to protect a round wafer box. Among the several wafers in the present invention, the circular I-mounted cushion pad includes: a square flat plate, which includes a front surface and an I surface, wherein the front surface of the square flat plate is used to receive a circular wafer UHL, and is located in a square shape. The front side of the flat plate has several pillars, which are located at the corners of the square flat plate, and are used to fix the circular wafer box; while the back of the square flat plate has several other round objects, these other The pillars are used to support square flat plates and circular wafer boxes. Among them, the above-mentioned square flat plate of the cushion pad of the wafer packaging of the present invention conforms to the inside dimension of the packaging material of the square wafer box, and when packaging the round wafer box, it can be stuck in the packaging material of the square wafer box. In addition, the pillar on the front surface of the square flat plate has three sides. When packaging the circular wafer box, one of the sides is attached to the circular wafer box, and the other side is the packaging material of the square wafer box. The inner sides of each other fit together. The other pillars on the back of the square flat plate are used to support the square flat plate and the circular wafer box. In addition, in a preferred embodiment of the present invention, the cushioning pad for wafer packaging of the present invention has a hollow area in the above-mentioned square flat plate, and the height of the pillars on the front surface of the square flat plate is equal to a circular wafer. Half the height of the box. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 meals) ------------- ^ -------- ^ -------- -^ < Please read the notes on the back before filling this page) 505603 A7 B7 V. Description of the invention In addition to the above, the use of the media can be slower, the round packaging material packaging in the loading room and the round package hair crystal box in the shape of a round square crystal are in consumption with the Intellectual Property Bureau of the Ministry of Economic Affairs employees The first wafer box packaging material used by the cooperative for printing wafer boxes, and also used to package the second shape wafer boxes. The cushion pad of the wafer packaging of the present invention includes a flat plate with a first shape, which has a front surface and a back surface. The front side of the flat plate is used to receive the second shape wafer box; a plurality of first pillars are located on the front side of the flat plate, and these first pillars are located on the corners of the flat plate and are used to fix the second shape. Wafer box; a plurality of second pillars are located on the back of the flat plate and are used to support the flat plate and the second shape wafer box. The plate is in accordance with the inside dimension of the first wafer box packaging material, and can be inserted into the first wafer box packaging material. The first pillar has the first side, the second side, and the third side. In the case of the round wafer box, the first side surface and the second shape wafer box are adhered to each other, and the other side surfaces are adhered to the inner side of the first wafer box packaging material. The pillars are used to support the flat plate and the second-shaped wafer box. In addition, in a comparative embodiment of the present invention, the cushion pad of the wafer packaging of the present invention has a hollow area in the above-mentioned square flat plate. And the height of the first pillar on the front of the flat plate is equal to half of the height of the second shape wafer box. When the first shape wafer box is a square wafer box, the first shape is square, and the first The two-shape wafer box is a circular wafer II i ^ i in mmM9 An nn I ϋ ϋ I · n βϋ n In a · —in order --------- line (Please read the note on the back first Please fill in this page for more details) This paper size is applicable to China National Standard (CNS) A4 (210 X 2 97 public meals) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 505603 A7 ___B7_ V. Description of the invention () When the box is the cushion pad of the wafer packaging of the present invention described in the previous paragraph. It is characterized by having a flat plate for receiving a circular wafer box, the flat plate has a front surface, a back surface, and a plurality of corners, wherein the front surface of the flat plate is used for receiving wafers; and the front surface of the flat plate has at least one pillar, The at least one pillar is located on the side of the flat plate and is used for fixing the circular wafer box. The at least one pillar has several sides. When packaging the round wafer box, one of the sides is connected with The round wafer boxes are attached to each other, and the other sides are attached to the inside of the square wafer box packaging material. In addition, several other pillars located on the back of the flat plate are used to support the square flat plate and the round wafer box, so that the stress on the wafer during transportation is reduced. The cushion pad of the wafer package of the present invention can be made of an elastic plastic material such as a polyolefin foam polymer. The cushion pad for wafer packaging of the present invention can be used as a conversion between wafer boxes of different shapes and wafer box packaging materials, and the shape and size of the wafer box packaging materials can be unified, which is more convenient in manufacturing and management. It is not necessary to ship wafer products with different thicknesses, but to reach customers on time. Brief description of the drawings: The preferred embodiment of the present invention will be supplemented by the following explanatory texts. The following paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 g t) ^ ------- -^ --------- ^ (Please read the precautions on the back before filling out this page) 505603 A7 B7 V. Description of the invention (described as a drawing for the purpose of illustration: f 绘画 所The detailed diagram is shown in Figure 1. Figure 1 is ab. 1 2 3 3 Make the box shown in the figure in the first figure. The box is tiil-11. The crystal shape is a square-shaped package. The round material is packed in a bag, box, box, round, crystal, and BB. The material is shown in a circular shape; the box is round, and the square material is in the package. Shapes, squares, and squares are shown for illustration and drawing. Ab 4 4 The first box of round crystals and squares are shown in the box.上 之 塾 rushing slowly round crystal bright hair is: 会 会 图 # intends the picture _ a 6th package of the first view of the side of the package Chong Chong slowly circular crystal crystal bright hair is shown as the picture shown in Figure 6b6c7 The second second slow circular crystal bright hair is shown as an example of visual illustration ------- ------ Equipment --- (Please read the precautions on the back before filling in this page) As shown in the figure, the square b-8 in the first box is placed in a circular crystal shape, and the cushion is slowly rounded. The figure is shown in the figure, and the medium crystal box is packaged in a round shape. Number map
盒 圓 晶 形 圓 ο 1X 圓 晶 2 11 本紙張&度適用中國國家標準（CNSM4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 505603 Λ7 B7 五、發明說明（） 20 方形晶圓盒 22 晶圓 30 圓形晶圓盒包裝材 32 凹槽 40 方形晶圓盒包裝材 42 凹槽 50 雙方形晶圓盒包裝材 52 凹槽 60 晶圓包裝之缓衝墊 62 方形平板 62a 方形平板 64 正面 66 背面 68 柱狀物 68a 柱狀物 70 柱狀物 74 中間區域 76 中空區域 80 側面 82 側面 84 側面 A 圓滑邊角 Η 高度 發明詳細說明： 請參照第3b圖、第4b圖與第5圖，由於一般利用晶 圓盒包裝材來包裝晶圓盒時，需就圓形晶圓盒1 0與方形晶 圓盒20的形狀，來選擇利用圓形晶圓盒包裝材30、方形 晶圓盒包裝材40以及雙方形晶圓盒包裝材50。其中，圓 形晶圓盒1 0並不能包裝在方形晶圓盒包裝材40與雙方形 晶圓盒包裝材5 0，因為圓形晶圓盒1 0置入方形晶圓盒包 裝材40與雙方形晶圓盒包裝材50中，圓形晶圓盒10並不 能完全與凹槽42與凹槽52的内側完全貼合，而無法達到 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公t ) m m i n· n fta— Mtt i i i i i I 4 ·ϋ flu ea— en «ϋ i I 一 of fl 1 m i t&mw i I n I (請先閱讀背面之注意事項再填寫本頁) 505603 A； B7 五、發明說明（） 吸收外力以保護晶圓的功效，所 7以在日日圓運送過程中，很 容易造成晶圓的破裂與積體電路元件的損壞1 於方形晶圓盒20具有邊角，所以1 、 ，卜尺寸係大於圓形晶 圓盒1〇,因此並不能包裝在圓形晶圓盒包裝材30中。 由於 盒包裝材 加。再者 上與厚度 開包裝、 產品的困 使圓形晶 晶圓盒包 晶圓盒包 塾之上視 圖，而第 上述的缺點’ t要製造以及利用不同形狀的 以及外部的包裝紙盒’會造成晶 叫咬达成本的拇 ，若客戶所需要的產品係同時包括 曰 15nnl以下的晶圓，必須將上述兩種晶圓產。、 運送，因此可能造成客戶無法同時品分 队取兩種晶圓 擾。因此，本發明提供一種晶圓包裝之 、攻调i塾， 圓盒可緊密貼合於方形晶圓盒包裝材中， 使方形 裝材對圓形晶圓盒與内部晶圓的保護 叉狂度和圓形 裝材一樣良好。第6a圖所繪示為本發明曰 β日日圓緩衝 圖，第6b圖所繪示為本發明晶圓緩衝 ^ ^ij 6 c圖所纟會不為本發明晶圓緩衝塾之底视圖 經濟部智慧財產局員工消費合作社印製 請參照第6a圖、第6b圖與第6c圖，其中，本 晶圓包裝之緩衝墊60係包含具有正面64、背面66 數個邊角的方形平板62。另外，位於方形平板62 64係具有四個柱狀物68，這些柱狀物68+ 1糸位於方形平板 62之邊角上，其中由四個柱狀物68所圍成的巾 乂扪甲間區域74 係為圓形晶圓盒的放置處，上述之四個杈狀物68值 你用以固 發明 之 以及複 之正面 --------訂---------線 (請先閱讀背面之注意事項再填寫本頁} ίο 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 505603 經濟部智慧財產局員工消費合作社印製 Λ7 Β7 五、發明說明（） 定該圓形晶圓盒，而方形平板62之正面64係用以承接圓 形晶圓盒。另外，在方形平板62之背面66係具有數個另 一柱狀物70，這些柱狀物70係用以支撐方形平板62以及 位於柱狀物68中的圓形晶圓盒，如此可作為圓形晶圓盒之 上下兩端的應力緩衝。 而在本發明晶圓包裝之緩衝墊6 〇之一較佳實施例中， 在上述之方形平板62中更可具有中空區域76，有利於圓 形晶圓盒之放入與取出，並且將上述之柱狀物68之高度η 設計為等於圓形晶圓盒之高度之一半，如此當利用兩個晶 圓包裳之緩衝墊60來包裝圓形晶圓盒時，更可由於柱狀物 68的支撐而防止外力擠壓變形。本發明此一較佳實施例係 科用與上述晶圓包裝材相同之材質，聚烯烴系發泡體高分 子所構成，其實只要具有一定硬度與彈性的塑膠材質皆可 用來製造本發明晶圓包裝之缓衝墊60。值得注意的是，上 述晶圓包裝之缓衝墊60中的中空區域76、柱狀物68之高 度Η以及晶圓包裝之緩衝墊60的材質僅為舉例，可視產品 或實際需要而加以變更，本發明不限於此。另外，上述本 發明晶圓包裝之緩衝墊6〇之背面66上的柱狀物70也僅為 舉例，若方形平板62的厚度或添加其他元件而可達到支撐 方形平板62與晶圓盒的功用，益能防止或缓衝外力，亦可 加以改變，本發明亦不限於此。 本纸張尺度相中_家標準（CNS)A4祕（2iq χ撕公餐） ^--------^---------^ (請先閱讀背面之注意事項再填寫本頁) 505603 Λ7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 第7圖所繪示為本發明晶圓缓衝墊另一實施例之上視 圖。其中，在本發明此一較佳實施例中，係製造具有圓滑 邊角A的方形平板62a ’並在方形平板62a上製作同樣較 為圓滑的柱狀物68a。此一實施例的較佳功能係可防止在包 裝晶圓盒時’對人員及外部包裝材的破壞，且圓滑邊角A 亦具有較佳的外力緩衝作用，在包裝上也較方便。 第8a圖所緣示為本發明晶圓緩衝墊之示意圖，而第礼 圖所繪不為利用本發明晶圓緩衝墊，將圓形晶圓盒裝置在 方形晶圓盒包裝材中之示意圖。請參照第8a圖與第讣圖， 其中，上述的方形平板62係根據方形晶圓盒包裝材4〇之 内側尺寸所製作的，因&，當利用本發明晶圓包裝之緩衝 墊60上下相對以包裝其中的圓形晶圓盒1〇時，晶圓包裝 之缓衝塾60之方形平板62可貼合於方形晶圓盒包裝材^ 中。另外，上述之柱狀物68的側面84，亦係與圓形晶圓 盒10之外圍互相貼合，而同時其他之側s 82與側面84與 方形平板62 -樣，係與方形晶圓盒包裝材4q之内側相互 貼合。如此一來，由於方形晶圓包奘 /曰日圓匕展材40與本發明晶圓包 裝之緩衝塾60之間，以及太於明3阿七壯 久尽七阳日日0包裝之緩衝墊6〇與Box round crystal shape ο 1X round crystal 2 11 This paper & degree applies to Chinese national standard (CNSM4 specification (210 X 297 mm)) Printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs 505603 Λ7 B7 V. Description of invention () 20 Wafer box 22 Wafer 30 Round wafer box packaging material 32 Groove 40 Square wafer box packaging material 42 Groove 50 Double square wafer box packaging material 52 Groove 60 Wafer packaging cushion 62 Square flat plate 62a Square flat plate 64 Front 66 Back 68 Pillars 68a Pillars 70 Pillars 74 Middle area 76 Hollow area 80 Side 82 Side 84 Side A Smooth edges Η Detailed description of the invention: Please refer to Figure 3b, Figure 4b and In Figure 5, since the wafer box packaging material is generally used to package the wafer box, the shape of the round wafer box 10 and the square wafer box 20 needs to be selected to use the round wafer box packaging material 30 and the square The wafer box packaging material 40 and the double-sided wafer box packaging material 50. Among them, the circular wafer box 10 cannot be packed in the square wafer box packaging material 40 and the double-sided wafer box packaging material 50 because the circular shape Wafer cassette 1 0 placement In the square wafer box packaging material 40 and the double-sided wafer box packaging material 50, the circular wafer box 10 cannot completely fit the inside of the groove 42 and the groove 52, and cannot reach the size of this paper. It is applicable to China Standard (CNS) A4 specification (210 X 297 male t) mmin · n fta— Mtt iiiii I 4 · ϋ flu ea— en «ϋ i I of of fl 1 mi t & mw i I n I (Please read the Please fill in this page again) 505603 A; B7 V. Description of the invention () Absorption of external force to protect the effectiveness of the wafer, so during the Japanese yen transportation process, it is easy to cause the wafer to crack and damage the integrated circuit components 1 Since the square wafer box 20 has corners, the dimensions 1, 1, and 2 are larger than the round wafer box 10, and therefore cannot be packed in the round wafer box packaging material 30. Since the box packing material is added. The top view of the unpacking and thickness of the product makes the round crystal wafer box package wafer box package top view, and the above-mentioned disadvantages 't to manufacture and use different shapes and external packaging carton' will cause crystal It's called cost-effective, if the product the customer needs is Including wafers below 15nnl, the above two wafers must be produced and shipped. Therefore, customers may not be able to pick up two wafers at the same time. Therefore, the present invention provides a wafer package Alas, the round box can fit tightly into the packaging material of the square wafer box, so that the protection fork of the square packing material for the round wafer box and the internal wafer is as good as the round packing material. Figure 6a shows the β-Japanese yen buffer map of the present invention, and Figure 6b shows the wafer buffer of the present invention. Please refer to Figure 6a, Figure 6b and Figure 6c for the printing of the Consumer Cooperatives of the Ministry of Intellectual Property Bureau. Among them, the cushion pad 60 of this wafer package includes a square flat plate 62 with front and back sides 66 and 66 corners. In addition, the square plate 62 64 series has four pillars 68, and these pillars 68 + 1 糸 are located on the corners of the square plate 62, in which the towels and nails surrounded by the four pillars 68 The area 74 is the place for the circular wafer box. The four forks 68 above are the values you use to solidify and restore the front side .-------- Order --------- (Please read the precautions on the back before filling in this page} ίο This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 505603 Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs Λ7 Β7 V. Invention Explanation () The round wafer box is fixed, and the front face 64 of the square flat plate 62 is used to receive the round wafer box. In addition, the back face 66 of the square flat plate 62 has a plurality of other pillars 70. The object 70 is used to support the square flat plate 62 and the circular wafer box located in the column 68, so that it can be used as a stress buffer for the upper and lower ends of the circular wafer box. In a preferred embodiment, the above-mentioned square flat plate 62 may further have a hollow region 76, which is advantageous The shape of the wafer box is put in and taken out, and the height η of the above-mentioned pillar 68 is designed to be equal to half of the height of the circular wafer box. When the wafer box is shaped, it can be prevented from being deformed by external force due to the support of the pillar 68. This preferred embodiment of the present invention uses the same material as the above-mentioned wafer packaging material, and the polyolefin foam is high. As a matter of fact, as long as a plastic material with a certain hardness and elasticity can be used to manufacture the cushion pad 60 of the wafer package of the present invention, it is worth noting that the hollow areas 76 and pillars in the cushion pad 60 of the wafer package described above The height of the object 68 and the material of the cushioning pad 60 of the wafer package are merely examples, and can be changed according to the product or actual needs, and the present invention is not limited thereto. In addition, the back surface of the cushioning pad 60 of the wafer packaging of the present invention described above The pillars 70 on 66 are also just examples. If the thickness of the square flat plate 62 or the addition of other components can achieve the function of supporting the square flat plate 62 and the wafer box, it can prevent or buffer external forces. It can also be changed. Invention Limited to this. In this paper, _Home Standard (CNS) A4 Secret (2iq χTear Meal) ^ -------- ^ --------- ^ (Please read the Note: Please fill in this page again) 505603 Λ7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The description of the invention (Figure 7 shows a top view of another embodiment of the wafer cushion of the present invention. In this preferred embodiment of the present invention, a square flat plate 62a 'with rounded corners A is manufactured and similarly smooth columns 68a are made on the square flat plate 62a. The preferred function of this embodiment is to prevent When packaging wafer boxes, it can damage personnel and external packaging materials, and the rounded corner A also has a better external force cushioning effect, which is also more convenient for packaging. Figure 8a shows the schematic diagram of the wafer cushion pad of the present invention, and Figure Rite Figure does not show the schematic diagram of using the wafer cushion pad of the present invention to mount a circular wafer box in a square wafer box packaging material. Please refer to FIG. 8a and FIG. 8. Among them, the above-mentioned square flat plate 62 is made according to the inside dimension of the square wafer box packaging material 40. Because of the & Compared to the round wafer box 10 packed therein, the square flat plate 62 of the wafer packing buffer 60 can be attached to the square wafer box packing material ^. In addition, the side surface 84 of the above-mentioned pillar 68 is also attached to the periphery of the circular wafer box 10, while the other sides 82 and the side surface 84 and the square flat plate 62 are similar to the square wafer box. The inner sides of the packaging materials 4q are bonded to each other. In this way, because the square wafer package / Japanese yen dagger display material 40 and the buffer package 60 of the wafer packaging of the present invention, and the Tai Yu Ming 3 years and seven years long lasting the sun and the sun 0 package cushion 6 〇With
圓形晶圓盒1 0之間並無任何空隙 L 17工隙因此可同時提供給圓形 晶圓盒1 0保護的作用。 應用本發明晶圓包裝之缝衛執Mg田 _ U衣 < 緩衝墊的原理，可使原包裝第 w u ϋ n I If · f I i al i n I · i I i I n n ft 一OJ· i— n n n ::: n m I (請先閱讀背面之注意事項再填寫本頁) 12 505603 經濟部智慧財產局員工消費合作社印製 Λ7 B7 五、發明說明（） 一形狀晶圓盒用之第一晶圓盒包裝材，來包裝第二形狀晶 圓盒’同樣可達到保護第二形狀晶圓盒内之晶圓的目的， 此晶圓包裝之緩衝墊可包括：具第一形狀之平板，此平板 係具有正面、背面以及數個邊角，可利用平板之正面來承 接第二形狀晶圓盒；另外，在平板的正面的邊角係具有數 個第一柱狀物’可用以固定該第二形狀晶圓盒；以及在平 板的背面上具有數個第二柱狀物，在包裝第二形狀晶圓盒 時’可用以支撐平板與第二形狀晶圓盒。其中，應用本發 明之原理，上述之平板係根據第一晶圓盒包裝材之内側尺 寸所製作，使晶圓包裝之緩衝墊裝入第一晶圓盒包裝材中 可互相緊密貼合，另外，上述之第一柱狀物之一側面亦與 第一形狀晶圓盒互相貼合，而其其他側面係與第一晶圓盒 包裝材之内側相互貼合。 本發明晶圓包裝之緩衝墊的特徵在於利用平板，以及 位於平板正面的柱狀物來達到支撐晶圓盒、貼合晶圓盒與 晶圓盒包裝材之間，以作為應力緩衝的目的。上述的柱狀 物位於平板的邊角，亦即包裝圓形晶圓盒時’位於方形晶 圓盒包裝材的四個角落，所達到保護的功效會較好。另外， 若再加上平板背面的其他枉狀物對晶圓和上下兩面的支 撐’保護的效果會更好。 利用本發明晶圓包裝之緩衝塾，可作為不同形狀晶圓 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) 裝--------訂-I n* n —ϋ am 11 m I (請先閱讀背面之注意事項再填寫本頁) 505603 A7 B7_ 五、發明說明（） 盒及其晶圓盒包裝材的轉換，而可簡化晶圓盒包裝材以及 外部包裝紙盒的製造與管理，且在晶圓運送時較為統一， 以同時送達客戶的手中。 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 —ϋ «II n i IX n· If n n n Is f— I m flu If «ϋ n n n« 一 01 I m In I— i an HI i·— t (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（21〇χ 297公t )There is no gap between the circular wafer cassettes 10 and the L 17 working gap can provide protection for the circular wafer cassettes 10 at the same time. Applying the principle of the Mg Tian_U clothing & cushioning pad of the wafer packaging of the present invention, the original packaging can be made 第 I n I If · f I i al in I · i I i I nn ft-OJ · i — Nnn ::: nm I (Please read the precautions on the back before filling out this page) 12 505603 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Λ7 B7 V. Description of the invention () The first crystal for a wafer box with a shape The round box packaging material can be used to package the second shape wafer box. The purpose of protecting the wafers in the second shape wafer box can also be achieved. The cushion pad of the wafer packaging may include: a flat plate having a first shape, and the flat plate. It has a front surface, a back surface, and several corners. The front surface of the flat plate can be used to receive the second shape wafer box. In addition, the front surface of the flat plate has several first pillars, which can be used to fix the second Shape wafer box; and a plurality of second pillars on the back surface of the plate, which can be used to support the plate and the second shape wafer box when packaging the second shape wafer box. Among them, applying the principle of the present invention, the above-mentioned flat plate is made according to the inside dimension of the first wafer box packaging material, so that the cushion pad of the wafer packaging can be closely adhered to each other in the first wafer box packaging material. One of the sides of the first pillar is also attached to the wafer box of the first shape, and the other sides are attached to the inside of the packaging material of the first wafer box. The cushioning pad of the wafer packaging of the present invention is characterized by using a flat plate and pillars located on the front surface of the flat plate to support the wafer box, affix the wafer box and the wafer box packaging material as the purpose of stress buffering. The above-mentioned pillars are located at the corners of the flat plate, that is, when packaging the round wafer box, it is located at the four corners of the packing box of the square crystal box, and the protection effect will be better. In addition, the effect of protecting the wafer and the upper and lower surfaces by the other objects on the back of the flat panel is better. By using the buffer of the wafer package of the present invention, it can be used as a wafer of different shapes. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 male f). -------- Order-I n * n —ϋ am 11 m I (Please read the precautions on the back before filling this page) 505603 A7 B7_ V. Description of the invention () The conversion of the box and its wafer box packaging materials, which can simplify the wafer box packaging materials and the exterior The manufacturing and management of packaging cartons are more uniform when wafers are shipped, so as to reach customers at the same time. As will be understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application for the present invention; all others completed without departing from the spirit disclosed by the present invention, etc. Effective changes or modifications should be included in the scope of patent application described below. —Ϋ «II ni IX n · If nnn Is f— I m flu If« ϋ nnn «One 01 I m In I— i an HI i · — t (Please read the notes on the back before filling this page) Ministry of Economy The paper size printed by the Intellectual Property Bureau employee consumer cooperative is applicable to the Chinese National Standard (CNS) A4 specification (21〇χ 297 g)