200918416 九、發明說明： 【發明所屬之技術領域】 結構，尤指一種適用於大 物件包裝結構。 本案係關於一種物件包裝 量運輸電子裝置或電子元件之 【先前技術】 隨著全球化之經濟發展，國 f' 4 ， β門♦多企業的產品已廣 泛仃銷出口至世界各地，由於甚口 ^ 於產口口出口的數量通常較 大，需將整批產品透過例如海運谁 ,^„ 逆進仃運輸’在運輸過程 中品經由堆高機或起重機等大型機 乂丁八生機具搬動，且會經歷多 次傳輸、搬動過程，因此在產品的包裝上需預留足㈣ ^護空間以確保產品在運送過程中不會因震動、颠薇而 導致產品受損。 尤其當運达電子裝置及電子元件時，由於電子裝置 及電子元件更為敏感及脆弱，只要—些輕微的震動缝 ι 擊即有可能使一個電子裝置或是電子元件之内部電路 文損而無法作用’因而其包裴方法及結構更為重要。 請參閱第一圖（a) ’其係為習知電子裝置或電子元件 之運送包裝盒結構不意圖，如圖所示’習知電子事置及 電子元件之包裝盒10係包含上蓋102、複數個緩衝隔 層103、至少一個隔板104以及外盒1〇5，其中，缓衝 隔層103係由複數個縱向隔片103a及橫向隔片1〇3b 交錯組合而成，且其係配合所裝設之電子裝置或電子元 200918416 件101的大小而區隔出複數個容置部103c，用以容置電 子裝置或電子元件101，以第一圖（a)為例，每一層緩衝 隔層103的縱向隔片103a及橫向隔片103b共區隔出4 個容置空間，兩相鄰之緩衝隔層103中間再以隔板104 相疊，如圖所示，包裝盒10内共有兩層緩衝隔層103， 因此習知之包裝盒10 —共可裝設8個電子裝置或電子 元件101。當要運送電子裝置或電子元件101時，其係 先將緩衝隔層103置入外盒105内，再將電子裝置或電 子元件101裝設入緩衝隔層103所區隔出之容置部103c 内，再依序放上隔板104、另一層緩衝隔層103、電子 裝置或電子元件101，最後再覆蓋上蓋102，並進行封 裝，以完成包裝盒10之裝設，由於此裝設之程序繁複， 且一但當最下層之電子裝置或電子元件101裝設有誤 需抽換時，作業人員往往需將其上覆蓋之複數個緩衝隔 層103及隔板104 —層層取出，再彎腰探入包裝盒10 内進行抽換，造成作業上的不便。 此外，在包裝盒10内，爲了防止撞擊與震動，每 一個緩衝隔層103之最外側的兩個縱向隔片103a之外 侧邊皆必須預留一長度dl，該長度dl係與包裝盒10 之内壁定義形成一緩衝空間D1，以避免該側面之撞 擊，同時，最外側的兩個橫向隔片l〇3b之外側面亦需 預留一長度為d2之緩衝空間D2，以避免該側面之撞 擊。同時，縱向隔片l〇3a及橫向隔片103b之高度皆必 須高於電子裝置或電子元件101，使得電子裝置或電子 200918416 疋件101谷设於容置部103c内時，其上亦具有一長度 為d3之緩衝空間D3,用以防止於運送過程中上下之撞 擊，然而，這些防止撞擊之預留空間Di、〇2及〇3均 屬於無法容置電子裝置或電子元件101之缓衝空間。 —凊再㈣第-圖⑻，#要大量運送電子裝置或電子 疋件101時’通常會將複數個包裝盒10相互堆疊，設 ί於載板11上’由於載板11之結構及面積係配合運送 用之堆局機或拖板車去工*^：3£ 枚皁（未圖不）而设置’因此其面積係為 1Λ大小。如圖所示’載板11上係堆疊兩層包裝盒 二:每層均签齊堆…包裝盒10，如，2 運运過程一 你此 内穿置有8、 111包裝盒10，每個包裝盒10 2有8個電子裝置或電子元件1()1，因 =可運送128個電子裝置或電子元件HH，並且= 將16個包裝盒1〇 在 將包裝盒10覆蓋^ 布或是膠膜 定，或者是先墼=疋’敢後再繫上繩索12做最後固 .繫上繩索12然後再以膠布13或是膠膜# 包裝盒10覆蓋固定 飞疋膠臈將 脫落。 /確純裝i 1G於運送過程不會 4個勺其^在f知之運送單元1内，於X方向上係旦有 二包裝盒10’每個包裝盒1〇在此方向均 為d 1之緩衝允門Γ\ 1 彳口長度 此在X方向^有:^及包裝盒1〇本身之厚度⑽，因 個厚度如，同、時在t度為以之緩衝空間D1及8 裝盒1〇,故在方向及Z方向則各具有2個包 故在Υ方向係具有4個長度為们之緩衝空^ 200918416 D2及4個包裝盒10之厚度d〇,以及在z方向亦具有* 個長度為d3之緩衝空間D3及4個包裝盒1〇之厚产 仙，因此’在習知之運送單元^，—共^生了體= 為（8dl + 8d0)X(4d2 + 4d0)x(4d3 + 4d0)之無法使用的空 間。由此可見，習知運送電子裝置及電子元件ι〇ι之^ 送單元1係透過繁複的包裝程序及方法’因而在包裝結 構内產生許多無用的緩衝空間，造成空間上的浪費以^ 包裝作業上之不便。 ' 因此，如何發展一種可改善習知技術缺失之物件包 裝結構，實為目前迫切需要解決之課題。 【發明内容】 本案之主要目的在於提供一種物件包裝結構，俾满 ^包裝時所浪費之空間以及增加可以包裝的物㈣ 量、節省成本以及方便作業人員之包裝作業。 為達上述目的，本案之一較廣義實施態樣為提供一 種物件包裝結構’至少包括：複數個緩衝隔層，每—兮 緩衝隔層係具有複數個隔片，該複數個隔片係彼此交= 義形成複數個容置部，用以容置複數個物件； = 其係可彼此堆疊設置，且每一該框體係分 二谷置空間’用以容置至少一個該緩衝隔層；以 ^ 一盍體，用以於該複數個物件_於該複數個緩衝隔 層之该複數個容置部後覆蓋該物件。 為達上述目的，本案另—較廣義實施態樣為提供一 200918416 種物件包裝結構，至少包括：至少一緩衝隔層，該缓衝 隔層係具有複數個隔片，該複數個隔片係彼此交錯接合 以定義形成複數個容置部，用以容置複數個物件；至少 -框體，其係具有-容置空間，用以容置至少—個該缓 衝隔層；以及-蓋體，用以於該複數個物件裝設於該複 數個緩衝隔層之該複數個容置部後覆蓋該物件。 【實施方式】 體現本案特徵與優點#一些典型實施例將在後段 的說明中詳細敘述。應理解的是本案能夠在不同的態樣 上具有各種的變化’其皆不脫離本案的範圍，且盆中的 說明及圖示在本質上係當作說明之用，而非用以限制本 案。 請參閱第二圖⑻，其係為構成本案較佳實施例之物 ，包襄結構示意圖’如圖所示，本案之物件包裝結構 〇主要包含一蓋體202、至少一緩衝隔層2〇3以及至少 :框體204’其中，該蓋體2〇2係可為一固體材質之上 蓋板’亦可為軟性材質之膠封層，其可依實際施作情況 而選擇蓋體202之形態與材質，且不以此 。 於-些實施例中’本案之物件包裝結構2〇包括複 數個緩衝隔層203，每-個緩衝隔層加係由縱向隔片 及橫向隔片繼彼此交錯接合而組合形成，並定 出複數個容置部施，用以容置相對應大小之電子襄 置或電子元件（未圖示）。 200918416 框體204係用以容置至少一個緩衝隔層203，每一 框體204係具有一框架204a及一底部204b，框架204a 與底部204b係定義形成一容置空間204c，且框架204a 之高度係與緩衝隔層203實質上相同，底部204b之面 積亦與緩衝隔層203之面積實質上相同，因此當緩衝隔 層203置於框體204内時，恰可緊密容設於框體204之 容置空間204c内，使得緩衝隔層203及其内之電子裝 置或電子元件於運送過程中不會產生滑動或鬆動之現 象。 當同時運送不同之電子裝置或電子元件等物件 時，可依待運送之物件大小尺寸，藉由調整縱向隔片 203a及橫向隔片203b之位置與數量，而調整每一層緩 衝隔層203之容置部203c的大小，如此一來，則可於 物件包裝結構20内以分層的方式同時裝設數種大小不 同之物件，並且，由於每一框體204之面積大小係固 定，因此即使兩相鄰之框體204内之緩衝隔層203所裝 設之電子裝置或電子元件大小不同，其相鄰之框體204 亦可整齊堆疊設置。此外，當包裝過程中作業人員發現 物件之裝設有誤時，僅需單獨抽出裝設有誤之該層框體 204，即可抽換容設於其中之物件，可增加操作上之便 利。 另外，於一些實施例中，每一框體204上亦可設置 複數個卡合構件組（如第三圖（a)所示），該卡合構件組係 為框架204a上之凸部結構204d及凹部結構204e，其凸 11 200918416 部結構204d係可與一相鄰之框體204之凹部結構204e 彼此相互對應並卡合定位，使得複數個框體204可整齊 堆疊設置（如第三圖（b)所示），如此一來，複數個框架204 在裝設物件的過程中則不會產生滑動或掉落的情形，並 且，該卡合構件組更可為一鋸齒狀之結構，或是其他可 相互卡合對應之結構，且不以此為限。 請再參閱第二圖（a)，物件包裝結構20更可包含一 外框201以及一底座205，外框201係設置於蓋體202 以及底座205之間，並包覆複數個框體204，用以形成 一立體之支撐，並再提供一外層之保護，而底座205則 係用以承載複數個框體204、緩衝隔層203以及緩衝隔 層203内之電子裝置或電子元件等物件。於此實施例 中，底座205之面積係與物件包裝結構20之載板11(如 第二圖（b)所示）之面積實質上相同。此外，該載板11可 承載該底座205且可為一棧板，但不以此為限。 另外，在蓋體202及底座205上更具有複數個溝槽 202a、205a，可選擇性地供複數個固定部件22(如第二 圖（b)所示）穿設，用以固定該物件包裝結構20。於一些 實施例中，該固定部件22可為繩索、膠帶或是其他可 供固定用之材料，且不以此為限。 請同時參閱第二圖（a)及第二圖（b)，當欲運送大量 之電子裝置或電子元件等物件時，首先將緩衝隔層203 設置於框體204中，再將待運送之物件分別裝設於緩衝 隔層203之容置部203c内，並使複數個框體204彼此 12 200918416 •整齊，疊後，放置於底座205之上，再套設外框2〇1， 並覆^上蓋體202,再以固定部件22將物件包裝結構 2〇緊密綑綁固定，最後’再將物件包裝結構20放置於 載板11上，此時可再用一膠膜23將物件包裝結構2〇 及載板11共同膠封住’以提供更穩固之保護。當然， 於一些實施例中’亦可先用膠膜23將物件包裝結構2〇 包覆，再利用固定部件22將物件包裳結構2〇以及載板 11緊密綑綁固定。 C : 當S ’本案之物件包裝結構2G在包裝裝設時爲了 避免震動及撞擊’同樣可預留部分之緩衝空間D1，、 D2’’然而由於本案之物件包|結構2〇係利用大面積框 體2曰04及可彈性調整容置部2〇3c大小之緩衝隔層期， 使侍整體之緩衝空間大幅減少。請同時參閱第二圖⑻ 及⑻，在相同面積之載板u上，物件包裝結構2〇内在 X方向僅具有2個長度為d1，之緩衝空間D1，、2個框體 (204之厚度dG，' 2個外框201之厚度d4，以及2 撕之厚度d5，，由於框體綱、外框2〇1、底座2〇5= 2度d〇、d4及d5’相對小於物件包裝結構20内之緩衝 、工間D1之長度dl’ ’因此在χ方向相對地減少許多無 的空間。同時’在γ方向及在2方向亦如前述， :^心無法利用之空間，如此—來，本案之物件包 又構2〇整體上可節省許多無用之空間，可容納更多 之電子裝置或電子元件等物件。 舉例來看，請參閱第二圖⑻，在相同载板u面積 13 200918416 ==之條件下來看’且與第—圖⑻所示之習知包 容積下’本案之物件包展結構2。内共計 叶^又1Γ個緩衝隔層203,每—個緩衝隔層挪共 。十4出40個容置部2〇3c，因此 構2 0内總共可容設2 :::件包裝< 子开# m 似/、為知相同之電子結構或f 構’ ’知之包裝結構其僅可容設128個電子結 m讀1G1，由此可見，本案之物件包裝結構2〔 了心加運送物件之數量，同時恭 可大幅節省運送之成本。費過夕之包裝箱’ 穿述’本案提供—種物件包|結構，該物件包 ί:!= 框體及緩衝隔層，使得整體之無法 空間大幅減少、相對於傳統技術可於相同的 體積下谷置相對較多之物件，減少運送成本，俾解 電子裝置或電子元件時之空間浪費以及提升包 襄作業之方便性。 飾 本案付由熟習此技術之人士任施匠思而為諸般修 然皆不脫如附申請專利範圍所欲保護者。又^ 14 200918416 【圖式簡單說明】 ΐ意=)·f知電子裝置或電子元件之運送包裝盒結構 t圖（b):習知電子裝置或電子元件之整體運送包裝示 意圖 施例之物件包裝結構示意 第二圖（a):其係為本案較佳實 圖。 r ⑻:其係為本案較佳實施例之整體物件包袭結構 體結構示意圖。 货、馬弟二圖（a)之堆豐示意圖。 15 200918416 【主要元件符號說明】 10 :包裝盒 20 :物件包裝結構 11 :載板 12 :繩索 13 :膠布 101 :電子裝置或電子元件 102 :上蓋 103、203 :緩衝隔層 103a、203a :縱向隔片 103b、203b :橫向隔片 103c、203c :容置部 104 :隔板 105 :外盒 22 :固定部件 201 :外框 202 :蓋體 202a、205a :溝槽 204 :框體 204a :框架 204b :底部 204c :容置空間 204d :凸部結構 204e :凹部結構 205 :底座 23 :膠膜 1 :運送單元 dl、d2、d3、dl’、d2’ ：長度 dO、d0’、d4’、d5’ ：厚度 Dl、D2、D3、Dl，、D2,：緩衝空間 16200918416 IX. Description of the invention: [Technical field to which the invention pertains] Structure, especially one that is suitable for packaging of large objects. This case is about the transport of electronic devices or electronic components of an object package. [With the economic development of globalization, the products of the national f' 4 , β door ♦ multi-enterprise enterprises have been widely sold and exported to all parts of the world, because of the mouth ^ The number of outlets at the mouth of the production is usually large, and it is necessary to move the whole batch of products through, for example, shipping, and the goods are transported through the main machine such as the stacker or crane. It will undergo multiple transmission and moving processes, so it is necessary to reserve enough space on the packaging of the product to ensure that the product will not be damaged due to vibration or bumps during the transportation. Especially when the electronic device is shipped And electronic components, because the electronic devices and electronic components are more sensitive and fragile, as long as some slight vibration cracks may cause the internal circuit of an electronic device or electronic components to be damaged and unable to function. The method and structure are more important. Please refer to the first figure (a) 'It is not intended to transport the package structure of the conventional electronic device or electronic component, as shown in the figure The electronic device and electronic component package 10 includes an upper cover 102, a plurality of buffer spacers 103, at least one partition 104, and an outer casing 1〇5, wherein the buffer spacer 103 is composed of a plurality of longitudinal spacers 103a and The transverse spacers 1〇3b are interlaced and combined with the size of the mounted electronic device or the electronic component 200918416 101 to partition a plurality of accommodating portions 103c for accommodating the electronic device or the electronic component 101. Taking the first figure (a) as an example, the longitudinal spacer 103a and the lateral spacer 103b of each layer of the buffer layer 103 are divided into four accommodating spaces, and the two adjacent buffer layers 103 are separated by a partition. 104 stacked, as shown, there are two layers of buffer spacers 103 in the package 10, so that the conventional package 10 can be equipped with eight electronic devices or electronic components 101. When the electronic device or electronic component 101 is to be transported The buffering layer 103 is first placed in the outer casing 105, and the electronic device or electronic component 101 is installed in the receiving portion 103c separated by the buffering layer 103, and then the partition is placed in sequence. 104, another buffer layer 103, an electronic device or an electronic component 101, and finally Covering the upper cover 102 and encapsulating it to complete the installation of the package 10, since the installation procedure is complicated, and when the lowermost electronic device or electronic component 101 is equipped with a need for replacement, the operator often The plurality of buffer spacers 103 and the spacers 104 covered thereon are taken out, and then bent into the package 10 for exchange, thereby causing inconvenience in operation. Further, in the package 10, in order to prevent For impact and vibration, a length dl must be reserved on the outer side of the outermost two longitudinal spacers 103a of each of the buffer spacers 103, and the length dl is defined to form a buffer space D1 with the inner wall of the package 10 to avoid The impact of the side surface, at the same time, the outer side of the two lateral spacers l3b also need to reserve a buffer space D2 of length d2 to avoid the impact of the side. At the same time, the height of the longitudinal spacers 103a and the lateral spacers 103b must be higher than that of the electronic device or the electronic component 101, so that when the electronic device or the electronic device 200918416 is placed in the accommodating portion 103c, there is also a The buffer space D3 of length d3 is used to prevent the upper and lower impacts during transportation. However, the space for preventing collisions Di, 〇2 and 〇3 are all buffer spaces that cannot accommodate the electronic device or the electronic component 101. . —凊再(四)第图(8),#When a large number of electronic devices or electronic components 101 are to be transported, 'a plurality of packages 10 are usually stacked on each other and placed on the carrier 11' due to the structure and area of the carrier 11 It is set to work with the stacking machine or the pallet truck for transportation *^: 3 pounds of soap (not shown), so the area is 1 inch. As shown in the figure, 'the carrier board 11 is stacked on two layers of packaging boxes 2: each layer is packed in a stack...packing box 10, for example, 2, during the transportation process, you have 8, 111 boxes 10, each of which is placed inside. The package 10 2 has 8 electronic devices or electronic components 1 () 1, because = can carry 128 electronic devices or electronic components HH, and = 16 packages 1 are placed on the package 10 to cover the cloth or glue Membrane, or 墼 疋 疋 疋 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 敢 绳索 敢 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索 绳索/ Indeed pure i 1G will not be 4 spoons in the delivery process, in the transport unit 1 of the know, in the X direction, there are two boxes 10 'each box 1 〇 in this direction are d 1 Buffering Γ 1 1 1 1 1 1 1 1 1 1 1 1 1 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度 长度Therefore, there are 2 packages in the direction and the Z direction, so there are 4 buffers in the Υ direction, and the thickness d 2009 of the 200918416 D2 and the 4 packages 10, and also * lengths in the z direction. For the d3 buffer space D3 and the four boxes of 1〇 thick, so in the conventional transport unit ^, - a total of the body = (8dl + 8d0) X (4d2 + 4d0) x (4d3 + 4d0) Unusable space. It can be seen that the conventional transporting electronic device and the electronic component ι〇ι^ delivery unit 1 pass through complicated packaging procedures and methods', thus generating a lot of useless buffer space in the packaging structure, resulting in space waste to ^ packaging operation Inconvenience. Therefore, how to develop an object packaging structure that can improve the lack of conventional technology is an urgent problem to be solved. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide an object packaging structure, which is a waste of space when packaging, and an increase in the amount of materials that can be packaged (four), cost saving, and packaging work for the operator. In order to achieve the above object, one of the more broad aspects of the present invention provides an object packaging structure that includes at least: a plurality of buffering compartments, each of which has a plurality of spacers, the plurality of spacers intersecting each other = forming a plurality of accommodating portions for accommodating a plurality of objects; = the plurality of objects can be stacked on each other, and each of the frame systems is divided into two spaces for accommodating at least one of the buffering compartments; a body for covering the plurality of objects after the plurality of receiving portions of the plurality of buffering layers. In order to achieve the above object, the present invention further provides a 200918416 object packaging structure, comprising at least one buffering layer, the buffering compartment having a plurality of spacers, the plurality of spacers being each other Interlaced to define a plurality of accommodating portions for accommodating a plurality of objects; at least a frame having a accommodating space for accommodating at least one of the buffer linings; and a cover body, The object is covered after the plurality of objects are mounted on the plurality of accommodating portions of the plurality of buffer layers. [Embodiment] The present invention is characterized by the features and advantages of the present invention. Some exemplary embodiments will be described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and illustrations in the basin are used in the nature of the description and are not intended to limit the present invention. Please refer to the second figure (8), which is a structure constituting the preferred embodiment of the present invention. The structure of the package structure is as shown in the figure. The object packaging structure of the present invention mainly comprises a cover body 202 and at least one buffer layer 2〇3. And at least: the frame body 204', wherein the cover body 2〇2 can be a solid material upper cover plate' or a soft material sealing layer, which can select the shape of the cover body 202 according to actual application conditions. With material, and not with this. In some embodiments, the object packaging structure 2 of the present invention includes a plurality of buffer spacers 203, each of which is formed by a combination of a longitudinal spacer and a lateral spacer interlaced with each other, and defines a plurality of buffers. The accommodating portion is configured to accommodate an electronic device or an electronic component (not shown) of a corresponding size. The frame 204 is for accommodating at least one buffering layer 203. Each frame 204 has a frame 204a and a bottom portion 204b. The frame 204a and the bottom portion 204b define an accommodating space 204c, and the height of the frame 204a. The area of the bottom portion 204b is substantially the same as the area of the buffer layer 203. Therefore, when the buffer layer 203 is placed in the frame 204, it can be tightly accommodated in the frame 204. In the accommodating space 204c, the buffer 203 and the electronic devices or electronic components therein are not caused to slip or loose during transportation. When different electronic devices or electronic components are simultaneously transported, the capacity of each of the buffer spacers 203 can be adjusted by adjusting the position and number of the longitudinal spacers 203a and the lateral spacers 203b according to the size of the object to be transported. The size of the portion 203c is such that a plurality of objects of different sizes can be simultaneously installed in the object packaging structure 20 in a layered manner, and since the size of each frame 204 is fixed, even two The electronic device or the electronic component installed in the buffering layer 203 in the adjacent frame 204 is different in size, and the adjacent frames 204 can also be arranged in a neat manner. In addition, when the operator finds that the object is misplaced during the packaging process, it is only necessary to separately extract the frame 204 which is misplaced, and the object accommodated therein can be exchanged, which can increase the convenience of operation. In addition, in some embodiments, a plurality of engaging member groups (as shown in FIG. 3(a)) may be disposed on each frame 204, and the engaging member group is a convex portion structure 204d on the frame 204a. And the recess structure 204e, the protrusion 11 200918416 portion structure 204d and the recess structure 204e of an adjacent frame 204 are mutually corresponding to each other and are engaged with each other, so that the plurality of frames 204 can be arranged in a neat manner (such as the third figure ( b) shown), in this way, the plurality of frames 204 do not slip or fall during the process of installing the object, and the engaging member group can be a zigzag structure, or Other structures that can be engaged with each other are not limited thereto. Referring to the second figure (a), the object packaging structure 20 further includes an outer frame 201 and a base 205. The outer frame 201 is disposed between the cover 202 and the base 205 and covers a plurality of frames 204. The 205 is used to support a plurality of frames 204, the buffer 203, and the electronic components or electronic components in the buffer 203. In this embodiment, the area of the base 205 is substantially the same as the area of the carrier 11 of the article package structure 20 (shown in Figure 2(b)). In addition, the carrier 11 can carry the base 205 and can be a pallet, but is not limited thereto. In addition, a plurality of grooves 202a and 205a are further disposed on the cover body 202 and the base 205, and a plurality of fixing members 22 (shown in FIG. 2(b)) are selectively provided for fixing the object package. Structure 20. In some embodiments, the fixing member 22 can be a rope, a tape or other material that can be used for fixing, and is not limited thereto. Please also refer to the second figure (a) and the second figure (b). When a large number of electronic devices or electronic components are to be transported, the buffer layer 203 is first placed in the frame 204, and then the object to be transported is placed. They are respectively installed in the accommodating portion 203c of the buffering layer 203, and the plurality of frames 204 are tidy and stacked on the base 205, and then the outer frame 2〇1 is covered and covered. The upper cover body 202 is further tightly bound and fixed by the fixing member 22, and finally the object packaging structure 20 is placed on the carrier board 11. At this time, the object packaging structure 2 can be further replaced by a film 23. The carrier 11 is glued together to provide a more robust protection. Of course, in some embodiments, the object packaging structure 2 may be coated with the adhesive film 23, and then the fixing member 22 is used to tightly bind the object wrapping structure 2 and the carrier plate 11. C: When S' object packaging structure 2G in this case is packaged, in order to avoid vibration and impact, 'the same buffer space D1, D2'' can be reserved. However, due to the object package|structure 2 in this case, the large area is utilized. The frame body 2曰04 and the buffering interval period capable of elastically adjusting the accommodating portion 2〇3c greatly reduce the buffer space of the servant. Please also refer to the second figure (8) and (8). On the carrier u of the same area, the object packaging structure 2 has only two lengths d1 in the X direction, the buffer space D1, and two frames (the thickness dG of 204) , 'the thickness d4 of the two outer frames 201, and the thickness d5 of the two tears, because the frame body, the outer frame 2〇1, the base 2〇5=2 degrees d〇, d4 and d5' are relatively smaller than the object packaging structure 20 The buffer inside, the length of the work room D1 dl' ', therefore, relatively reduces the amount of space in the χ direction. At the same time 'in the γ direction and in the 2 direction as mentioned above, : ^ can not use the space, so - come, this case The object package and the structure 2 can save a lot of useless space and can accommodate more electronic devices or electronic components. For example, please refer to the second figure (8), on the same carrier u area 13 200918416 == Under the condition of the 'and the same as shown in the figure (8), the volume of the package of the case is 'the object of the package structure 2. The total number of leaves ^ 1 buffer cushion 203, each buffer compartment. 4 out of 40 accommodating parts 2 〇 3c, so a total of 2 within the structure 20 can be accommodated :::: piece packaging <子开# m like / In order to know the same electronic structure or f-structure, the package structure can only accommodate 128 electronic nodes and read 1G1. It can be seen that the object packaging structure of the present case [the heart and the number of objects transported, and at the same time Save the cost of transportation. The package of the New Year's Eve 'wearing' is provided in this case - the object package | structure, the object package ί:! = the frame and the buffer compartment, so that the overall space can not be greatly reduced, compared to the traditional technology It can store relatively many objects in the same volume, reduce transportation costs, waste space in electronic devices or electronic components, and improve the convenience of packaging operations. For the sake of all kinds of repairs, it is not necessary to protect the scope of the patent application. ^ 14 200918416 [Simple description of the diagram] ΐ = =) · know the electronic device or electronic components of the packaging box structure t (b) : The schematic diagram of the overall packaging structure of the conventional electronic device or electronic component is shown in the second figure (a): it is a better example of this case. r (8): It is a schematic diagram of the overall structure of the object enveloping structure of the preferred embodiment of the present invention. The diagram of the heap of goods and Ma Di (a). 15 200918416 [Explanation of main component symbols] 10 : Package 20 : Object packaging structure 11 : Carrier 12 : Rope 13 : Tape 101 : Electronic device or electronic component 102 : Upper cover 103 , 203 : Buffer compartments 103a, 203a : Longitudinal partition Sheets 103b, 203b: lateral spacers 103c, 203c: accommodating portion 104: partition 105: outer casing 22: fixing member 201: outer frame 202: cover 202a, 205a: groove 204: frame 204a: frame 204b: Bottom portion 204c: accommodating space 204d: convex portion structure 204e: recessed portion structure 205: base 23: film 1 : transporting unit d1, d2, d3, dl', d2': length dO, d0', d4', d5': Thickness Dl, D2, D3, Dl, D2,: buffer space 16