504817 A7 B7 五、發明說明（） 發明領域： 先¾磧背面之注意事項再填寫本頁) 本發明係有關於一種積體電路之封裝製程，特別是有 關於一種改善壓模樹脂（Mold Resin)之附著力的方法；3 結 構。 發明背景： 隨著電子製造技術的不斷發展演進，以及可攜式電子 產品的蓬勃發展，如何創造出更輕、薄、短、小、高效能 的電子元件，已成為電子產業的研究重心。而在積體電路 產品之需求量日益增加的同時，亦促進了電子封裝產業的 快速發展，使得封裝技術不斷推陳出新，以符合電子產品 之需求’並進而充分發揮電子產品之功能。 經濟部智慧財產局員工消費合作社印製 電子封裝的主要目的在賦予積體電路元件一套組織 架構，藉以使積體電路元件獲得傳遞電能與電路訊號、承 載與結構保護、以及提供散熱途徑等功能，進而使其能發 揮既定的功能。由於，積體電路元件的尺寸極其細微，且 其結構也相當的脆弱。因此，為了防止在積體電路元件之 輸送與取置過程中，受到外力或環境因素的破壞，必須將 積體電路元件包裝起來，以提供足夠的機械強度及適當的 保護，亦可避免精細的積體電路受到污染。此外，積體電 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公釐） 504817 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（） 路元件必須與電阻以及電容等被動元件組合成為一個系 統，才得以發揮其應有之功能。而且，電子封裝可藉由封 裝材料之導熱功能將電子於線路間傳遞所產生之熱量去 除，以避免積體電路晶片因過熱而毀損。因此，電子封穿 就是在提供積體電路元件保護結構，並建立其組織架構P 更可為使用者提供安全簡便的操作環境。 睛參照第1圖，其係繪示習知晶片之銲墊開口佈局圖。 一般的積體電路晶片100的佈局大都係將銲墊（未繪示）配 置在晶片1 00的周圍。銲墊開口丨02的位置係對應於晶片 100上之銲墊的位置，以暴露出銲墊來提供晶片1〇〇與外 界之連接。為配合晶片100之銲墊的位置，因此銲墊開口 102的佈局同樣是位在晶片1〇〇的周圍。請參照第2圖， 其係緣示沿著第1圖之j - ί剖面線所得之晶片的剖面圖。 先在晶片1 00上覆蓋一層保護層1 〇4，以保護晶片j 〇〇内 的電路結構。再將位於銲墊上方之保護層1〇4去除，而將 錄墊暴露出來。對尺寸較大的晶片1〇〇，尚須在保護層1〇4 上覆蓋聚亞醯胺層1〇6。由於聚亞醯胺為有機材料，且其 材質較軟，因此聚亞醯胺層106可作為應力緩衝層，來保 護底下之晶片100内的電路結構。然後同樣將位於銲墊上 之聚亞醯胺層106去除，而暴露出銲塾，以利晶片1Q0與 外界之元件電性連接。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---.--------裝---- f琦先閲讀背面之注意事項再填寫本頁) ·11111(1 504817 A7 ______________ B7 五、發明說明（） —.---------裝— (請先閱讀背面之注意事項再填寫本頁) 此時’將晶片1 00置於基板1 1 〇上並以例如環氧樹脂 (Ε ρ ο X y )黏著固定。然後，進行打線步驟，而將晶片1 〇 〇上 的銲塾以極細的金屬線1〇8連接到基板1 1〇上，進而藉此 將積體電路之晶片100内的電路訊號傳輸至外界。在金屬 線108設置完成後，進行壓模封膠，而使壓模樹脂丨12將 整個晶片100以及金屬線1 〇8包覆住，而形成如第3圖所 示之結構&其中，壓模樹脂112可防止濕氣從晶片1 〇〇之 外部侵入，去除晶片100内部產生熱量，並可以機械方式 支持金屬線1 08，更可提供能夠以手取置之形體。 接著，將晶片100固定在印刷電路板（Printed Circuit Board ; PCB)(未繪示）。對球格陣列（Bail Grid Anray ; BGA) 式封裝而言，其係先在不具有金屬線108之基板110的這 一面，形成複數個成陣列型式排列的銲錫球（未繪示）。再 用回溫爐熔融銲錫球使晶片1 00與印刷電路板連接。 經濟部智慧財產局員工消費合作社印製 由於，運用回溫爐將晶片1 00固定在印刷電路板時， 回溫爐所提供的熱量，會將壓模樹脂11 2内的水分蒸發， 而產生蒸氣。這些蒸氣所產生的氣壓會導致壓模樹脂112 與聚亞醯胺層106分離，而在壓模樹脂112與聚亞醯胺層 1 06之間形成孔洞1 1 4，如第4圖所示。若蒸氣所產生的氣 壓過大，甚至會使壓模樹脂112與聚亞醯胺層106之間的 距離大幅增加，而將金屬線108扯斷，嚴重影響元件的電 本紙張尺度適用中國國家標準（CNS)A4規格（210 x297公釐） 504817 Α7 Β7 五、發明說明（) (請先閱讀背面之注意事項再填寫本頁) 性穩定度以及可靠度。另一方面，隨著晶片100尺寸的持 續擴大，對應力的影響也越敏感，其中此應力係源自於各 種材料層的熱膨脹係數（Coefficients of Thermal Expansion ; CTE)存在有極大差異的緣故。此應力同樣也會 造成封裝結構或晶片100的損壞，而導致製程良率的降 發明目的及概述： 鑒於上述習知晶片的封裝製程中，壓模樹脂對聚亞醯 胺層之附著力已不足以抵抗蒸氣氣壓，以及因各材料層之 不同熱膨脹係數所產生的應力。因而導致元件穩定度以及 可靠度大受影響，更使得晶片以及封裝結構受到破壞的可 能性大幅提升。 經濟部智慧財產局員工消費合作社印製 本發明之主要目的為提供一種改善壓模樹脂之附著力 的方法，其係在晶片上之聚亞醯胺層上增加多個輔助開 口。在後續之壓模封膠步驟中，使得用以包覆住晶片之壓 模樹脂填入這些輔助開口。而這些輔助開口内的壓模樹脂 經硬化後，便形成如樁狀結構一般。因此，藉由這些樁狀 結構可抵抗各材料層之間所產生的熱應力，而提高元件的 穩定度以及可靠度。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 504817504817 A7 B7 V. Description of the invention () Field of the invention: Note on the back of the page before filling out this page) The present invention relates to a packaging process for integrated circuits, and in particular to an improved mold resin (Mold Resin) The method of adhesion; 3 structure. Background of the Invention: With the continuous development and evolution of electronic manufacturing technology and the vigorous development of portable electronic products, how to create lighter, thinner, shorter, smaller, and more efficient electronic components has become the focus of research in the electronics industry. At the same time that the demand for integrated circuit products is increasing, it has also promoted the rapid development of the electronic packaging industry, enabling packaging technology to continue to be innovated to meet the needs of electronic products ’and to give full play to the functions of electronic products. The main purpose of printed electronic packaging for employees' cooperatives in the Intellectual Property Bureau of the Ministry of Economic Affairs is to give integrated circuit components an organizational structure, so that integrated circuit components can obtain functions such as transmitting electrical energy and circuit signals, carrying and structural protection, and providing cooling channels So that it can perform its intended function. Because the size of integrated circuit components is extremely small, and their structure is quite fragile. Therefore, in order to prevent damage to the external force or environmental factors during the transportation and handling of the integrated circuit components, the integrated circuit components must be packaged to provide sufficient mechanical strength and appropriate protection. The integrated circuit is contaminated. In addition, the printed circuit board size of the chip is applicable to the Chinese National Standard (CNS) A4 specification (210x 297 mm) 504817 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 V. Description of the invention Passive components are combined into a system to be able to perform its proper function. In addition, the electronic package can remove the heat generated by the electrons between the circuits through the heat conduction function of the packaging material to avoid the integrated circuit chip from being damaged due to overheating. Therefore, electronic sealing is to provide integrated circuit component protection structure and establish its organizational structure P to provide users with a safe and convenient operating environment. Referring to FIG. 1, it is a drawing showing a layout of pad openings of a conventional wafer. The layout of a general integrated circuit wafer 100 is generally such that pads (not shown) are arranged around the wafer 100. The position of the pad opening 02 corresponds to the position of the pad on the wafer 100 to expose the pad to provide the connection between the wafer 100 and the outside. To match the position of the pads of the wafer 100, the layout of the pad openings 102 is also located around the wafer 100. Please refer to FIG. 2, which shows the cross-sectional view of the wafer obtained along the line j-ί of FIG. 1. First, a protective layer 104 is covered on the wafer 100 to protect the circuit structure in the wafer j 00. The protective layer 104 located above the solder pad was removed, and the recording pad was exposed. For larger wafers 100, the protective layer 104 must be covered with a polyurethane layer 106. Since polyurethane is an organic material and its material is relatively soft, the polyurethane layer 106 can be used as a stress buffer layer to protect the circuit structure inside the wafer 100 below. Then, the polyurethane layer 106 on the solder pad is also removed, and the solder pad is exposed to facilitate the electrical connection of the chip 1Q0 with external components. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 11111 (1 504817 A7 ______________ B7 V. Description of the invention () —.--------- install — (Please read the precautions on the back before filling out this page) At this time 'Place the wafer 1 00 on the substrate 1 1 0 and adhered and fixed with, for example, epoxy resin (E ρ ο X y). Then, a wire bonding step is performed, and the solder pad on the wafer 100 is connected to the substrate 1 10 with a very thin metal wire 108. Then, the circuit signals in the integrated circuit wafer 100 are transmitted to the outside world. After the setting of the metal wire 108 is completed, the mold sealing is performed, so that the mold resin 丨 12 will be the entire wafer 100 and the metal wire 108 Wrap it to form the structure shown in Figure 3 & Among them, the mold resin 112 can prevent moisture from entering the wafer 1000 from outside, remove the heat generated inside the wafer 100, and can support the metal wire 1 mechanically 08, can also provide a shape that can be taken by hand. Next, the wafer 100 is fixed on a printed circuit board (Printed Cir (Cuit Board; PCB) (not shown). For a Bail Grid Anray (BGA) package, it first forms a plurality of arrays on the side of the substrate 110 without the metal lines 108. The solder ball (not shown) is used to melt the solder ball in the reheating furnace to connect the wafer 100 to the printed circuit board. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs because the wafer 100 is fixed to the printing by the reheating furnace. When the circuit board is used, the heat provided by the reheating furnace will evaporate the water in the mold resin 112 to generate steam. The air pressure generated by these vapors will cause the mold resin 112 to separate from the polyurethane layer 106, and Holes 1 1 4 are formed between the stamping resin 112 and the polyurethane layer 106, as shown in Figure 4. If the pressure generated by the vapor is too large, the stamping resin 112 and the polyurethane layer 106 may even be formed. The distance between them has increased significantly, and the metal wire 108 is torn, which seriously affects the electrical paper size of the components. The Chinese National Standard (CNS) A4 specification (210 x 297 mm) is applicable. 504817 Α7 Β7 5. Description of the invention () (please first Read the notes on the back and fill in (This page) stability and reliability. On the other hand, as the size of the wafer 100 continues to expand, it is more sensitive to the effects of stress, which is derived from the coefficients of thermal expansion of various material layers (Coefficients of Thermal Expansion; There is a great difference in CTE). This stress will also cause damage to the packaging structure or the wafer 100, which will lead to a reduction in the yield of the process. Purpose and summary of the invention: In view of the conventional wafer packaging process, the mold resin is aligned. The adhesion of the imidamine layer is not enough to resist the vapor pressure and the stress caused by the different thermal expansion coefficients of the material layers. As a result, the stability and reliability of the device are greatly affected, and the possibility of damage to the chip and the package structure is greatly improved. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics The main purpose of the present invention is to provide a method for improving the adhesion of the compression resin, which is to add a plurality of auxiliary openings to the polyurethane layer on the wafer. In the subsequent molding step, the auxiliary resin is filled with a molding resin for covering the wafer. The mold resin in these auxiliary openings is hardened to form a pile-like structure. Therefore, these pile-like structures can resist the thermal stress generated between the material layers, and improve the stability and reliability of the device. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 504817
五、發明說明（） 本發明的再一目的就是因為聚亞醯胺層上所額外增設 的多個輔助開σ ’可供壓模樹脂填入，而形成一個個二： 狀結構。藉由這些樁狀結構可增加壓模樹脂對聚亞酿胺層 的附著力，因此可提高對蒸氣氣壓的抵抗力，而避免孔洞 在壓模樹脂與聚亞醯胺層之間形成，進而提升元件的電性 穩定度以及製程良率。 根據以上所述之目的，本發明更提供了一種改善壓模 樹脂之附著力的方法，至少包括··提供一晶片於一基板 上’其中此晶片上已覆蓋有依序堆疊之一保護層以及一聚 亞醯胺層；形成複數個輔助開口於上述之聚亞醯胺層上， 並約暴露出部分之保護層；以及形成一壓模樹脂層覆蓋晶 片、聚亞醯胺層、保護層所暴露之部分、以及部分之基板， 且此壓模樹脂層填滿這些辅助開口。其中，上述之晶片上 更至少包括有複數個銲墊，且保護層以及聚亞醯胺層包括 覆蓋這些銲墊，而在聚亞醯胺層形成前，已先將覆蓋在銲 墊上之保護層去除並暴露出銲墊，因而使得聚亞醯胺層覆 蓋在銲墊上。此外，在聚亞醯胺層上形成辅助開口係利用 (請先Μ讀背面之注意事項再填寫本頁) 裝 經濟部智慧財產局員工消費合作社印製 醢，亦 亞且層 聚而脂 之。樹 上口模 墊開壓 銲塾且 在銲， 蓋個墊 覆數銲 除複蓋 去成覆 亦形括 ’ 並包 。 時’更口 同塾’開 此銲時塾 在出層銲 且露脂之 ，暴樹述 驟以模上 步藉壓滿 刻，成填 姓層形時 一 胺在同 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) 504817 A7 B7V. Description of the invention () Another object of the present invention is that a plurality of auxiliary openings σ 'which are additionally provided on the polyimide layer can be filled by the compression molding resin to form a two-like structure. These pile-like structures can increase the adhesion of the compression resin to the polyurethane layer, and thus increase the resistance to the vapor pressure, and avoid the formation of holes between the compression resin and the polyurethane layer, thereby improving Electrical stability of components and process yield. According to the above-mentioned object, the present invention further provides a method for improving the adhesion of the molding resin, which at least includes providing a wafer on a substrate, wherein the wafer is covered with a protective layer sequentially stacked and A polyimide layer; forming a plurality of auxiliary openings on the polyimide layer, and exposing a part of the protective layer; and forming a compression resin layer to cover the wafer, the polyimide layer, and the protective layer The exposed part and the part of the substrate, and the auxiliary resin layer are filled by the stamping resin layer. Wherein, the above wafer further includes at least a plurality of solder pads, and the protective layer and the polyurethane layer include covering these solder pads, and the protective layer covering the solder pads has been formed before the polyurethane layer is formed. The pad is removed and exposed, thus allowing the polyurethane layer to cover the pad. In addition, the auxiliary opening is formed on the polyurethane layer (please read the precautions on the back before filling this page). It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The die on the tree is under pressure, and the welding pad is under welding. Cover a pad, cover the welding, cover it, and cover it. At the same time, when the welding is started, the welding is exposed and the grease is exposed. The storm tree is stepped on the mold, and the amine is applied to the same paper scale as the Chinese country. Standard (CNS) A4 specification (210 X 297 male f) 504817 A7 B7
五、發明說明（ 根據以上所述之目的，本發明另 1 尺徒供了 一猶嘴凸 酿胺層結構’用於改善位於此聚亞醯，、名構上之一壓槿 樹脂對此聚亞醯胺層之附著力，其中 ^ 、 匕永亞釀胺層结槿# 形成於晶片的保護層上，而此晶片上 尽、，《稱係 至少包括複數個録 墊，且本發明之聚亞醯胺層結構至φ — ^ 包括：一聚亞醯胺薄 膜位於晶片的保護層上；上述之聚获贿 <眾亞醯胺薄臈之一 域上具有複數個銲墊開口，並將銲執I命 蛩暴路出來；以及上述 之聚亞醯胺薄膜之另一部分區域上1女、— ^ 具有後數個辅助開口， 而將保護層的一部分暴露出來。圖式簡單說明： 本發明的較佳實施例將於往後之說明文字中辅以下列 圖形做更詳細的闞述，其中： Γ清先閱讀背面之注意事項再填寫本頁) 裝 經濟部智慧財產局員工消費合作社印製 第1圖為繪不習知晶片之銲墊開口佈局圖； 第2圖為繪示沿著第1圖之J J剖面線所得之晶片的 剖面圖； 第3圖為繪不習知晶片經打線以及壓模後之剖面圖； 第4圖為繪不習知晶片經回溫爐烘烤後之剖面圖； 第5圖為繪示本發明之一較佳實施例之晶片的銲墊開 口以及輔助開口的佈局圖；第6圖為繚示沿著第5圖之]j - π剖面線所得之晶片的 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 997公餐） 504817 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（） 剖面圖；以及 第7圓為繪示本發明之一較佳實施例之晶片經打線、 壓模、以及回溫爐烘烤後之剖面圖。 圖號對照說明： 100 晶片 102 銲墊開口 104 保護層 106 聚亞醯胺層 108 金屬線 110 基板 112 壓模樹脂 114 孔洞 200 晶片 202 銲墊開口 204 辅助開口 206 保護層 208 聚亞醢胺層 210 金屬線 212 基板 214 壓模樹脂 發明詳細說明： 本發明揭露一種改善壓模樹脂之附著力的方法及結 構，其係在壓模封膠步驟時，提供壓模樹脂一個凹凸不平 的表面環境，來達到提高壓模樹脂對底下之材料層附著力 的目的。為了使本發明之敘述更加詳盡與完備，可參照下 列描述並配合第5圖至第7圖之圖示。 隨著積體電路之晶片尺寸的增加，應力對晶片結構以 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） <請先閱讀背面之注意事項再填寫本頁) 裝 504817 Α7 Β7 五、發明說明（） -------丨 ---· I I (請先閱讀背面之注意事項再填寫本頁) 及可靠度的影響也日益嚴重。無論是晶片本身的結構，或 是晶片之封裝結構，都是由各種不同的材料堆疊形成。由 於，這些材料層的熱膨脹係數不盡相同，因而使得每一材 料層對溫度變化的反應亦有所差異，而導致熱應力在不同 材料層之間產生。因此，在進行積體電路晶片之封裝製程 之初，為了降低因材料層熱膨脹係數不同所產生之熱應力 對晶片結構的影響’都會在晶片上先塗佈一層材質較軟的 材料層’一般係採用有機材料聚亞釀胺。藉以提供晶片對 外部應力的缓衝，並藉此緩衝結構減輕應力對晶片所造成 的衝擊。然而，此聚亞醯胺層與包覆於其上之壓模樹脂間 的應力卻常常被忽略掉，而造成元件可靠度降低。因此， 本發明提供一種增加壓模樹脂對聚亞醯胺層之附著力的方 法，來降低應力對封裝結構的影響。 經濟部智慧財產局員工消費合作社印製 請參照第5圖，其係繪示本發明之一較佳實施例之晶 片的銲墊開口以及辅助開口的佈局圖。在積體電路之晶片 200上，已佈植有複數個銲墊（未繪示）來提供晶片200與外 界元件的連接，其中這些銲墊通常係配置在晶片200的周 圍。由於，銲塾開口 202的位置係對應於晶片200上之銲 墊，以暴露出銲墊來提供晶片200與外界之連接，為了配 合晶片200上之銲墊的位置，因此銲墊開口 202之佈局同 樣是位在晶片200的周圍。此外，本發明另外在銲墊開口 202以外的區域增設一些辅助開口 204，其中這些開口的形 本紙張疋度適用中國國家標準（CNS)A4規格（210 X 297公釐） 504817 經濟部智慧財產局員工消費合作社印製 A7 __^___B7___ 五、發明說明（） 狀、尺寸、以及數量可依晶片2 0 0的大小以及需求而加以 變化，並不限於第5圖所示之佈局。 為了更清楚的說明，請參照第6圖，其係繪示沿著第5 圖之E - II剖面線所得之晶片的剖面圖。晶片200上之佈局 係先在已完成前段製程之晶片200上覆蓋一層質地緻密且 材質較硬的保護層206，以保護晶片200内的電路結構， 降低水氣以及外力的影響。其中，保護層206之材料可例 如為以化學氣相沉積法（Chemical Vapor Deposition ; CVD) 所形成之氮化矽（SiNx)層。再利用例如蝕刻的方式，去除焊 墊上方之保護層206，而將銲墊暴露出來。 接著，形成一層聚亞醯胺層208覆蓋在保護層206以 及銲墊上。由於，聚亞醢胺為材質較軟之有機材料，因此 目前.的封裝製程，大都採用聚亞醯胺層208來作為晶片200 之應力缓衝層，藉以減輕應力對底下之晶片200内的電路 結構的影響。再利用例如蝕刻方式，在聚亞醯胺層208上 形成複數個辅助開口 204，直至約暴露出部分之保護層 206。在形成這些辅助開口 204的同時，將覆蓋在銲墊上之 聚亞醯胺層208去除，而暴露出銲墊，以利晶片200與外 界之元件電性連接。 然後，利用例如環氧樹脂將晶片200黏著固定於封裝 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公餐） (請先閱讀背面之注意事項再填寫本頁) 裝 504817 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明（) 的基板2 1 2 Ji。再進行晶片2 〇 〇之打線步驟，以形成複數 個極細微的金屬線210，而將晶片2〇〇上的銲墊以及基板 212電性連接。藉由這些金屬線21〇，可將積體電路之晶片 200内產生的電路訊號傳輸至外界。完成晶片2〇〇之金屬 線2 1 0與夕卜界之連接後，進行壓模封膠步驟，卩壓模樹脂 214將具有金屬線210這一面的晶片2〇〇以及金屬線21〇 元全包覆住，形成如第7圖所示之結構。其中，壓模樹脂 214覆蓋聚亞醯胺層208，並填滿辅助開口 2〇4以及銲墊開 口 2 02，且將金屬線210完全包住。因此，經硬化處理後， 壓模樹脂214具有防止外界之水氣侵入晶片2〇〇内、排除 晶片200内部所產生熱量、提供金屬線2丨〇機械支持、以 及供取置之外殼型體等功能β 由於’在進行壓模封膠步驟前，已先在聚亞醯胺層2〇8 上增s又多個輔助開口 204。藉此，可提供凹凸不平坦之表 面讓壓模樹脂214於其上形成，不但在聚亞醯胺層208與 壓模樹脂214之間形成不平整的接觸介面，更增加聚亞醯 胺層208與壓模樹脂214之間的接觸面積。而且，這些填 入辅助開口 2 0 4内的壓模樹脂2 1 4經硬化處理後，就在聚 亞酿胺層208中形成一根根的樁狀結構。因此，可大幅提 升壓模樹脂214與聚亞醯胺層208之間的附著力，而改善 熱應力對封裝結構的破壞。此外，更可避免在利用回溫爐 將晶片2 0 0黏著固定於印刷電路板時，壓模樹脂2 1 4所產 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) ^ -----Μ-------- (請先10讀背面之注意事項再填寫本頁)V. Description of the invention (According to the above-mentioned purpose, another one foot of the present invention provides a still-bodied amine layer structure for improving the polyimide located on this polyimide, which is one of the famous resins. The adhesion of the imidamine layer, in which ^, 永 永 亚 dressing amine layer junction hibiscus # is formed on the protective layer of the wafer, and the wafer is said to include at least a plurality of recording pads, and the polymer of the present invention The structure of the imine layer to φ — ^ includes: a polyimide film is located on the protective layer of the wafer; the above-mentioned polyimide has a plurality of pad openings on one of the fields, and Welding I came out violently; and the other part of the polyurethane film described above has a plurality of auxiliary openings, and a part of the protective layer is exposed. The diagram simply illustrates: The present invention The preferred embodiment will be described in more detail in the following explanatory text with the following graphics, where: Γ Qing first read the precautions on the back before filling in this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Figure 1 shows the solder pads of unfamiliar wafers. Layout diagram; Figure 2 is a cross-sectional view showing the wafer obtained along the JJ section line of Figure 1; Figure 3 is a cross-sectional view of the unused wafer after wire drawing and stamping; Figure 4 is a drawing I do n’t know the cross-sectional view of a wafer after baking in a reheating furnace; FIG. 5 is a layout diagram showing a pad opening and an auxiliary opening of a wafer according to a preferred embodiment of the present invention; (Figure 5) The paper size of the wafer obtained from the j-π section line is applicable to the Chinese National Standard (CNS) A4 specification (21 × 997 meals) 504817 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Explanation () A cross-sectional view; and the seventh circle is a cross-sectional view showing a wafer after wire bonding, stamping, and reheating furnace baking according to a preferred embodiment of the present invention. Comparative description of drawing numbers: 100 wafers 102 pad openings 104 protective layer 106 polyurethane layer 108 metal wire 110 substrate 112 stamping resin 114 hole 200 wafer 202 pad opening 204 auxiliary opening 206 protective layer 208 polyurethane layer 210 Metal wire 212 Substrate 214 Stamping resin invention detailed description: The present invention discloses a method and structure for improving the adhesion of a stamping resin, which provides an uneven surface environment of the stamping resin during the step of sealing the stamping resin. The purpose is to improve the adhesion of the molding resin to the underlying material layer. In order to make the description of the present invention more detailed and complete, please refer to the following description and cooperate with the diagrams of Figs. 5 to 7. As the chip size of integrated circuits increases, the stress on the chip structure applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) at this paper size. ≪ Please read the precautions on the back before filling this page). 504817 Α7 Β7 V. Description of the invention () ------- 丨 --- · II (Please read the precautions on the back before filling this page) and the influence of reliability is also getting worse. Both the structure of the chip itself and the package structure of the chip are formed by stacking various materials. Because the thermal expansion coefficients of these material layers are not the same, the response of each material layer to temperature changes is also different, resulting in thermal stress between different material layers. Therefore, at the beginning of the packaging process of integrated circuit wafers, in order to reduce the impact of thermal stress on the wafer structure due to the different thermal expansion coefficients of the material layers, a softer material layer is usually applied on the wafer. Using organic material polyurethane. This provides the wafer with a buffer against external stress, and the buffer structure reduces the impact of the stress on the wafer. However, the stress between the polyimide layer and the mold resin coated thereon is often ignored, resulting in a decrease in component reliability. Therefore, the present invention provides a method for increasing the adhesion of the compression resin to the polyurethane layer to reduce the effect of the stress on the packaging structure. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Please refer to FIG. 5, which is a layout diagram showing a pad opening and an auxiliary opening of a wafer of a preferred embodiment of the present invention. On the chip 200 of the integrated circuit, a plurality of bonding pads (not shown) have been implanted to provide the connection between the chip 200 and the external components, and these bonding pads are usually arranged around the chip 200. Because the position of the solder pad opening 202 corresponds to the pad on the wafer 200, the pad is exposed to provide the connection between the wafer 200 and the outside world. In order to match the position of the pad on the wafer 200, the layout of the pad opening 202 It is also located around the wafer 200. In addition, the present invention additionally provides some auxiliary openings 204 in areas other than the pad openings 202. The shape of these openings is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 504817 Intellectual Property Bureau of the Ministry of Economic Affairs Printed by employee consumer cooperative A7 __ ^ ___ B7___ 5. Description of the invention () The shape, size, and quantity can be changed according to the size and demand of chip 200, and it is not limited to the layout shown in Figure 5. For a clearer explanation, please refer to FIG. 6, which is a cross-sectional view of the wafer obtained along the E-II section line of FIG. 5. The layout on the wafer 200 is first covered with a dense and hard protective layer 206 on the wafer 200 that has completed the previous process to protect the circuit structure in the wafer 200 and reduce the influence of water vapor and external forces. The material of the protective layer 206 may be, for example, a silicon nitride (SiNx) layer formed by a chemical vapor deposition method (Chemical Vapor Deposition; CVD). Then, the protective layer 206 on the pad is removed by, for example, etching, and the pad is exposed. Next, a polyurethane layer 208 is formed to cover the protective layer 206 and the bonding pad. Because polyurethane is a softer organic material, most of the current packaging processes use the polyurethane layer 208 as a stress buffer layer for the wafer 200, thereby reducing stress on the circuits in the wafer 200 below. Structural impact. Then, for example, an etching method is used to form a plurality of auxiliary openings 204 in the polyurethane layer 208 until the protective layer 206 is partially exposed. When the auxiliary openings 204 are formed, the polyurethane layer 208 covering the solder pads is removed, and the solder pads are exposed to facilitate the electrical connection between the chip 200 and external components. Then, use, for example, epoxy to fix the chip 200 to the package. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 × 297 meals) (Please read the precautions on the back before filling this page). 504817 Economy Printed by the Intellectual Property Bureau of the Ministry of Intellectual Property, Consumer Cooperatives A7, B7 5. The substrate of the invention description (2) 2 Ji. Then, a wire bonding step of the wafer 2000 is performed to form a plurality of extremely fine metal wires 210, and the pads on the wafer 2000 and the substrate 212 are electrically connected. With these metal wires 21, circuit signals generated in the integrated circuit chip 200 can be transmitted to the outside. After completing the connection between the metal wire 2 10 of the wafer 2000 and the Xibujie, the mold sealing step is performed, and the mold resin 214 will have the wafer 200 with the metal wire 210 side and the metal wire 2100 yuan. Cover it to form the structure shown in Figure 7. The stamping resin 214 covers the polyurethane layer 208, fills the auxiliary opening 204 and the pad opening 202, and completely covers the metal wire 210. Therefore, after the hardening treatment, the stamping resin 214 has the ability to prevent outside moisture from entering the wafer 2000, to eliminate heat generated inside the wafer 200, to provide metal wires 2 and to provide mechanical support, and to provide a housing type body. Function β. Since 'the polyimide layer 208 has been added with a plurality of auxiliary openings 204 before the compression molding step is performed. Thereby, an uneven surface can be provided to allow the stamping resin 214 to be formed thereon, which not only forms an uneven contact interface between the polyurethane layer 208 and the stamping resin 214, but also increases the polyurethane layer 208. The contact area with the mold resin 214. In addition, after these stamping resins 2 1 4 filled in the auxiliary openings 204 are hardened, a pile-like structure is formed in the polyurethane layer 208. Therefore, the adhesion between the mold resin 214 and the polyurethane layer 208 can be greatly improved, and the damage of the packaging structure by the thermal stress can be improved. In addition, it can also be avoided that when the wafer 200 is adhered and fixed to the printed circuit board by using a reheating furnace, the paper size produced by the compression resin 2 1 4 is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 male f) ^ ----- Μ -------- (Please read the notes on the back 10 before filling this page)
504817 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 生之蒸氣氣壓在壓模樹脂2丨4與聚亞醯胺層2〇8間形成孔 洞，進而防止金屬線2丨〇被蒸氣壓力扯斷。 本發明之一優點就是在提供一種改善壓模樹脂之附著 力的方法’其係在晶片上之聚亞醯胺層上額外設置多個輔 助開口’以提供凹凸不平的表面。在進行晶片之壓模封膠 時，壓模樹脂填入這些辅助開口，藉以在壓模樹脂與底下 之t亞釀胺層之間獲得凹凸不平的介面。因此，可達到強 化壓模樹脂對聚亞醯胺層之附著力的目的。 本發明的再一優點就是因為聚亞醢胺層上所額外增設 的多個辅助開口，可供壓模樹脂填入。壓模樹脂經硬化處 理後，在辅助開口中形成一個個的樁狀結構。藉由這些樁 狀結構可加強壓模樹脂對聚亞醯胺層的附著力。壓模樹脂 附著力的增加可提高對蒸氣氣壓以及各材料層間所產生之 熱應力的抵抗力，而避免孔洞在壓模樹脂與聚亞醢胺層之 間形成。因此，可達到提高元件的電性穩定度、增加元件 的可靠度、以及改善製程良率的目的。 如熟悉此技術之人員所暸解的’以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 本纸張尺度適用中_家標準（CNS)A4規格（210 X 297公f ) --;---------裝--------訂- (請先閱讀背面之注意事項再填寫本頁)504817 Printed by A7 B7, Consumer Cooperatives, Bureau of Intellectual Property, Ministry of Economic Affairs. 5. Description of the invention () The vapor pressure of the vapor forms a hole between the compression resin 2 丨 4 and the polyurethane layer 208, thereby preventing the metal wire 2 丨 〇 Ripped by vapor pressure. An advantage of the present invention is to provide a method for improving the adhesion of a mold resin ', which is to provide a plurality of auxiliary openings on a polyurethane layer on a wafer' to provide an uneven surface. When the die-molding of the wafer is performed, the auxiliary resin is filled into the auxiliary openings so as to obtain an uneven interface between the die-casting resin and the underlying methylene amine layer. Therefore, the purpose of enhancing the adhesion of the stamping resin to the polyurethane layer can be achieved. Still another advantage of the present invention is that the auxiliary openings provided in the polyurethane layer can be filled by the molding resin. After the compression resin is hardened, a pile-like structure is formed in the auxiliary opening. These pile-like structures can enhance the adhesion of the compression resin to the polyurethane layer. The increase in the adhesion of the compression resin can increase the resistance to the vapor pressure and the thermal stress generated between the layers of materials, and avoid the formation of holes between the compression resin and the polyurethane layer. Therefore, the purpose of improving the electrical stability of the device, increasing the reliability of the device, and improving the process yield can be achieved. As understood by those familiar with this technology, 'The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent application for the present invention; all other things that are completed without departing from the spirit disclosed by the present invention, etc. Effective changes or modifications should be included in the scope of patent application described below. This paper size is applicable to the _Home Standard (CNS) A4 specification (210 X 297 male f)-; --------- installation -------- order- (please read the first (Please fill in this page again)