TW503144B - Electronic package solder bump structure - Google Patents

Abstract

This invention provides an electronic package solder bump structure (2), which is like using a solder bump to solder circuit on IC boards; the solder bump provides solder material of a controllable constant volume when soldering micro parts; which mainly comprises: from inside outwards, the solder bump exhibits gradually decreased melting points with a metal ball core inside that is of good electrical conductivity and a higher melting point compared with outside and are encaptulated outwards with low temperature metals to provides the solder bump having a ball core with a high melting point to tolerate multiple processes without collapsing or cracking; the high melting point ball center does not contain brittle metal and thus the brittle influence from the low temperature solder material is reduced; the high melting point ball core can maintain a constant height of solder point to ensure that every solder point has the same height and thus test operation can be performed easily and reliably; although the high melting point ball core is not melted, the outer low temperature layer has been sufficiently melted into molten liquid to provide an outer low temperature layer with good fluidity and thus ensure tin-uptake performance.

Description

503144 V. Description of the invention (1) < Technical scope of the invention > β The present invention provides an electronic package solder ball structure (2), especially one: the solder ball material gradually reduces the melting temperature from the inside to the outside, according to which As the package welding of the second board of I c 5, the high melting point core has not melted and has contour lines. In addition, the m · layer has been separated into a liquid melt, so the outer low temperature layer has good fluidity, which can ensure that the tin melting point is acceptable. Repeated heating without deformation. The welded product has the strength support of tit, which is effectively reduced by the brittleness of the low-temperature welding material. The material with stronger strength can make the welded product maintain strong welding temperature production. Therefore, h ΐ manufacture 'high melting point ball' Heart surpasses turtle companion: Shrinking: Deformable and the same solder joint height, so measure two spoons and two points to make each low-resistance metal can be used to achieve solder joints with low electric ball core can be reduced. Comparison of surface dagger Expensive low-temperature metal, cost < Background description of the invention > The main function of the solder ball is to weld a small amount of welding material with a certain capacity. Ff & Control the temperature range of the temperature to be supplied to the welding IC or electronic substrate. Ot range Into the rod. Vertical is most suitable for substrate package flow, substrate (3) heating method, and the uniformity of temperature due to different air heat dissipation during actual operation. ^ Second, the difference in parts, etc., suction temperature 1 〇 ... or 2 Uncertain: serving may be lower than the set temperature. Page 4 of the fifth, description of the invention (2) Solder condensate when eating bad, eat more tin, compare (2) (as shown in Figure 1 if the implementation is not uniform) The high-temperature part of the board (5), tin tin (shown in Figure 2), is for multiple processability. Multi-layer packaging, because it can meet the requirements, does not deform during heating, but also covers the temperature to the melting point , Etc., etc. The invention of the invention has been in the industry for many years, and it is well known that its electricity is devoted to the improvement of its shortcomings, and it has repeatedly installed solder ball structures (2) < Brief description of the invention. If the department of Wen Nanwen (Shown), those who are above the floor are trapped 1) Those who are trapped in their shortcomings should respond to this situation in construction, which means that people cannot engage in electronic substrate sealing due to soldering conditions, and hope that electricity is a trial work. " The degree of soldering will be due to its lack of soldering (6 to the lower temperature parts of the solder (1) surface. It will easily fail,) and completely separate the first substrate (4). Difficulties are required, and the heating point of the solder coating fails again. The sub-substrates mounted on the sub-substrates have finally developed. It takes a lot of points to be able to melt the previous solder sub-solution when it is used for packaging. It is more clear that the layer of the hair seal | layer, j withstand j, and the lack of connection I related i its best 4 practicality can also face the collapse of the two-layer base due to temperature (see the repeated welding times will be necessary) Solder joints are sinking, turtles. Product manufacturing points are through multiple electronic seals_ The main purpose of the present invention is to eliminate the above-mentioned disadvantages. An electronic package solder ball structure (two), the solder balls are from the inside to the outside. The melting temperature is gradually reduced from the inside to the outside. Based on J c package welding, the solder ball has a high melting point and the core is not melted. It is strong and provides non-layered or substrate lines, good externality, 144 V. Description of the invention (3) The substrate welding material has high compatibility and other effects, which is the second (2) feature of the present invention, in which the welding is more expensive More low temperature metal, cost can be reduced According to another aspect of the present invention, the welding can keep the industry relatively easy to enter the present invention, and with the drawings and features, the detailed description is provided to enable it to be further described in the C or electronic invention of FIG. 3 for controllability. 'The melting point is lowered from the inside and the center of the sphere is not dissolved. The structure of the invention < the invention of the invention is tested in accordance with the drawings to refer to the contents of I ○). 、 The purpose of changing the solder ball is only to make sure that the solder ball can be used for the purpose. One step is shown in the following step. The substrate is supplied with solder, with less medium shape, easy to test, low resistance, and low cost. Out-of-heart low temperature is characterized by reliable high-melt solder joints, and the technical details are provided to provide an electrically-acceptable and inexpensive layer coating. Provide an electric point ball core, according to its height, so that each person who has its characteristics, means, and later, believes that the sub-package solder ball structure is tin or tin-copper alloy, and the amount is significantly reduced. The ball joints have the same height and efficacy. To give you a deeper and more detailed understanding of the above purpose of the present invention. Electronic package solder ball structure (2) designer. To understand the structural design and technology of the present invention, we have an electronic package solder ball structure (2). The main (100) package solders its solder balls (2 balls ϋ 3). Its main role is to weld a small amount of solder material. The present invention is made of a material that gradually reduces the melting temperature, and can be melted when the inner part exceeds 2 3 0 t. 503144 V. Description of the invention (4) The hierarchical method uses two or more layers of melting temperature. 2 o substrate (1. Differences in actual work pieces, etc., may be lower than the lower temperature when set, and the solder surface is prone to failure. ”High side (3 o refer to Figure 5 1 1) side, the solder joint collapsed. It becomes necessary to become liquid fusion many times. Multi-layer soldering can achieve heating without repeated heating to, cracking. · Spherical core (2 'low-temperature gold outer layer that can be ionized is low), the solder 0) package At the time of temperature, the part with the indefinite temperature of 10 will absorb the heat due to the air flow, and the part with the temperature will also collapse. As can be avoided in the present invention) (see the figure), the second layer of the substrate can be used to make the center of the ball and the outer layer flow. Processability, packaging, due to application requirements, in this deformation, that is, the melting point, Xi etc. 1) (see reduction method or other related methods to make the metal piled up. According to the spherical center (2 1) side system Above = melting point is metal (2 2), made of ^ The outermost layer of the ball must be coated with an anti-oxidation layer. The maximum temperature range is from 2 1 0 to 2 30 ° C, and the temperature, substrate heating method, actual density, and different factors affect the uniformity of temperature.部 $ parts, ° C or 20 ° C, etc., users: ° Γ The current solder is not condensed and eats badly. If Wenhu Ti can eat enough tin, the parts with high temperature will be used. The welding will avoid the above two kinds of temperature problems, because the solder joints have two $ 4 as shown in the figure), so when welding more than two layers (to ensure that each solder joint on the upper and lower sides of the first layer A plate (1 2) Both sides can eat tin, which will have (2 1) unmelted, and the outer low-temperature layer I is good enough to ensure tin eating ability. According to the current requirements, the development of 'multi-layer packaging will have difficulties in the construction. In this case, the solder joint must be able to withstand multiple weights. That is to say, the user who previously soldered the joint during heating repeatedly failed due to the collapse of the solder joint due to the reflow of the solder joint. The present invention has a (Shown in the figure), so it can bear the repetition. V. Description of the invention (5) Heating without deformation, the secondary liquid melts but the center of the ball deforms and collapses, so The packaging operation has become the main component of the solder etc. regarding the environmental protection of the solder. However, the bismuth core (2 1) is not as shown in Figure 6) only), because (21 is reliable and KK 5 is forbidden, the use of brittleness including indium and indium for support is still prohibited. Add again) Unfused welding It is easy to apply lead-containing tin, and then metallic metals on the substrate. The outer layer is subjected to low temperatures to #. Naibao solder balls (line. Various types of welding mothers are coated with their brittle strength and low melting point. The welding temperature of the welding material is a certain 20). Metal (when welded into a brittle shadow, although the outer layer cannot support multiple layers at the same time, even the welding materials in the world, even non-lead point metals such as M, indium, etc. 2 2) The first product has a ball core (2 1 ring, which can effectively reduce the soldering ability of the substrate material to the substrate circuit). The product can not be eaten with tin. (2 1 The product has strength that is the base metal and the solder base material:. In terms of solidification and melting, the solder joints (10 compatible methods must have good and tin adhesion), this. The phase of the outer layer refers to the shrinkage of the solder ball of the substrate is liquid fusion) The material and solder are designed with different solderability, good The strength must be discounted. The ball core can be provided by using the low melting point capacitive requirements (Solder and stress, sometimes due to the compatibility of the substrate and the war, there are a variety of materials that can be used to solder.) Although there can be good, if you consider the solder joint buckle. In the present invention, because of the stronger material, the substrate material can be used for various selective circuit connections and solder joints.) For the surface material of the package solder solder joint, its strength has a quality. So that the eating of tin The manufacturing contact is on the substrate. Other factors The substrate is on the welding material. However, the welding material ’s high melting point weldability, the temperature of the material ’s influence,

503144 V. Description of the invention (6) The ability to eat tin is easy to produce. When solidified, the cause and effect of more than two layers is the melting point of the cracked joints (2 1 less deformation, and to avoid the test, the high melting point of the core of the melting layer will be caused by the surface of the core (2 1) The number of solder joints (4 0) and the number of solder joints (4 0) with a certain number of solder joints (4 1) height phase @ See the figure in Figure 7) The main reason for welding with different shapes. ), The solder joint turtle 2 1) Surface strength of the present invention may not reach 40). So, therefore, every difference will affect the solidification shrinkage. Easy to test, the outer layer reduces the melting point and maintains the height while welding. In hundreds. High height, so that each test operation will have a different shape of the solder joint. The shrinkage will be less than one, so it will be less because it has the same strength as the substrate. The difference is that if there is a high shrinkage at the welding temperature that generates extreme stress, the welding temperature can be reduced by more than 1 0). The contact with the outer layer can be deformed. When the internal connection is completed, (1 0) can be welded. (21) can ensure that the test contact ( And reliable. (Refer to the road connection: electricity: welding point or welding, spot (40) is usually used on the substrate to make electricity (40) in the consumables contained in the welding material; drop, i: body. Pole It is easy to form resistance at the welding point, so that the temperature is good :: thermal differences between parts and reduction of stress life, work two) = ί. The invention can make the low-melting-point metal of poor conductors (; 2 in welding work ;: : And control its s. High refining penalty point (21) Use white i:. So the center of the ball, (21) can make the low Leiyang I cave tin, tin silver, tin silver copper, tin copper, Silver-copper .. -Meng, and meet the requirements of solder joints (40) low resistance.

503144 V. Description of the invention (8) The above embodiments are only used to illustrate the present invention. According to the scope of the present invention, various modifications, modifications and applications made by those skilled in the art should be included without departing from the spirit of the present invention. Those within the scope of the present invention. V. Description of the invention (7) In terms of cost, alloys, lead-free) and other low-melting metals such as Syria, indium, etc. Cheap tin or tin 2) Only the lower surface layer. Refer to Figure 8 (shown as a), (c) and the present invention) f)). 『Packing Scale Solder Point material High price Copper alloy coating As shown in the figure After the solder has been melted and melted, the surface solder is usually tin 63%. The main material is added (B I) to reduce its melting point. Because of the tin ion, the spherical center (2 1) of the present invention and the like. However, other relatively expensive low melting, so the amount of use is significantly less, 'driving solder balls (7) placed behind' may become (b) on the substrate (3); the ball (20) is placed on the substrate ( 1 layer is liquid soluble and the center of the ball (2 1), lead 3 or indium is the lower part of the point. The cost of the metal can be the substrate (compared to 0) (melt (such as 7% IN temperature and gold comparison (2 to reduce or as d Refer to Figure 9, the normal state of Xiban (4) (5) (if), or (c) the state of the circuit to form an open circuit; use solder balls (7) on the first and second a) After welding, 'may be: cracked, deformed state of (:) picture or (d) picture and the solder ball of the present invention (2〇) 2 "" as shown by e "U = 1) is formed without melting Support, so that the substrate is in a good state (as shown in f, g, h). Layer liquid, two-layer substrate (: [High-dazzling point ball heart (2 of the tin-eating condition is described on the most silk, the present invention is used in similar products) The reason is that the present invention already has an application for issuing. There are always excellent progress in the mouth and clear patent requirements, according to the law =

503144 Brief description of the drawings < Simple description of the drawings > Fig. 1: A partially enlarged plan sectional view of a conventional point. Fig. 2: An enlarged plan cross-sectional view of a part of welding with two or more layers. FIG. 3 is a partially enlarged plan view of the electronic package solder ball structure (2) of the present invention before welding. Figure 4: Schematic plan view of the contour of the solder ball structure (2) of the electronic package of the present invention after welding. FIG. 5 is a partially enlarged plan schematic view of a double-layer soldering of the electronic package solder ball structure (2) of the present invention.

Fig. 6 is a partially enlarged plan schematic view of a part of the electronic package solder ball structure (two) of the present invention before double-layer welding. Figure 7: The post-weld test plane of the electronic package solder ball structure (2) of the present invention is not intended. Fig. 8 is a schematic partial enlarged plan view of the present invention compared with a single-layer welding of a user. Fig. 9 is a partially enlarged plan view of the present invention compared with the conventional double-layer welding. < Illustration of drawing number of the drawing >

• Common parts · (1) Solder (2) Collapse (3) Substrate (4) First layer substrate (5) Second layer substrate (6) Melt phenomenon (7) Solder ball • Part of the invention ·

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Claims (1)

6. The scope of the patent application is ΐ :; install Γ to find the structure (2), its solder balls are mainly used for its characteristics ;: tin controlled supply-a fixed volume of welding material; temperature material metal into t from inside to outside Reduction of Melting Process 4: Connect the heart to provide strength support, with multiple additions to avoid cracks in the solder joints: this = good conductivity, less deformation, less shrinkage, less torture, and low cost. Construction (2; electronic sealing skirt ball joints described in Π Item 1 and intermediate ° solder balls are not delaminated from the inside out. Construction (2; electronic sealing solder balls as described in Item 1) Jie, tin # h, the use of platinum, gold, silver, tin, 揣 4P 5, tin-copper, silver-copper, and other low-resistance metals. ， '又 建 (二; ΐ = 2 ;; The electronic package solder ball junction metal or its alloy 卞 1 ”coating as described in item 1 can be made of tin 1, copper, metal, or indium (i; electronic package solder ball junction 2 according to item 1) The outermost layer of the ball must be coated with an anti-corrosion layer. The structure (2 ^ 3 = 2 surrounding the 1st Institute of Electronic Sealing Solder Ball Knot / Jia Qiao ball core can also be a multi-layer coating.