TW507504B - Structure of electronic packaging solder joint - Google Patents

Abstract

The present invention relates to a structure of electronic packaging solder joint. While being applied for soldering connection of electronic circuits on an IC board, the solder joint can provide a certain volume of solder for the soldering of small parts. The solder joint is wrapped by two or more layers of metal. The most inner layer, the core, of the solder joint is made by a metal of excellent conductivity and having a melting point higher than that of any outer layers formed by low-temperature metals. Therefore, the present invention has a core of high melting point to avoid any collapsing or cracking caused by repeat heating after multiple processes. As the high-melting-point core does not include any brittle metal, the brittleness effects of low-temperature solder can be minimized effectively. Also, since all the soldered spots are on the same height when the high-melting-point core can be kept on a certain soldering height, the test operation becomes easier and more reliable. Besides, since the core is not melt while the outer low-temperature layers have completely liquidized, the outer layers of the present invention has an excellent fluidity so to ensure good tin-soldering ability.

Description

5075U4 V. Description of the invention (l) _____ < Technical scope of the invention > The present invention provides a single-type solder ball consisting of a sub-package solder ball structure (a), especially one on a single component or two on the 'two ： The center of the melting temperature, the outer cover- When the layer is welded to the package of the substrate, the low-temperature metal is fully liquid as an IC or low-temperature layer. The high melting point core is amazed. The outer layer has good fluidity, which can ensure the strength support provided by the tin core. G = repeated heating without deformation. The welded product has a ball melting point center. The brittleness of the low temperature welding material can be used. Effectively reduce, the high outer layer and low melting point can be prepared from meat, so that the welded product retains strength and compatibility requirements are made according to :: tin capacity, that is, the temperature at which the mother is in contact with the welding material, so when the solution is dissolved 3; the center point of the south melting point exceeds the welding point without cracking, high-dazzling point ^ ^, less shrinkage s, can reduce the deformation and avoid the same height of the welding point, the 3 ball center maintains a certain welding point height, so that each mining Low resistance Π and ΓΓ test operation will be easier and more reliable. The ratio of tin or tin copper alloy made according to the present 'system will result to reduce by Globe. The surface layer covers the low-temperature metal with relatively low cost, and the cost can be less than the background description of Ma Ming. -The fixed function is to weld the small parts. [Provide the temperature range of the substrate that can be controlled and supplied to the substrate. In actual operation, due to the difference of air heat and heat dissipation, the differences in addition, interdensity, and parts are different, and the temperature of the shirt is strange. When soldering, the part may be lower than the setting. Page 4 507504 V. Description of the invention (2) The temperature is not 100 ° C or 20 ° C, etc .... The solder is not condensed or eaten properly. If the sound of the second sound of the J sound is relatively high, there will be enough tin when the temperature is relatively high :: The temperature will also be low (2? "": Shown in Figure 1) (1) The surface collapses if implemented It is uneven at the second layer or higher and the high temperature part is melted. 6 = = easy to fail. The second layer is completely separated due to the temperature plate (5) and solder (1). (See Figure 3). One layer of substrate (…. (See multiple times for processing, due to current requirements, due to construction difficulties, the second solder joint must be able to withstand the previous soldering process when the heating is repeated when the brother is repeatedly heated) When the tongue is reheated to the melting point, it cannot be caused by the solder joint π 谇 ’re-splitting: and other conditions that cause failure. For the inventor of the present invention, he has been engaged in electronic substrate packaging and industry for many years, and knows the manufacture of electronic substrate packaging. Method ^ i U ° 〇

= Efforts to improve the "disadvantages" period to make electronic substrate packaging more practical. U's hard research and repeated trials have finally invented the "4-pack structure (1)". Electronic seal of the month < Brief description of the invention > The main purpose of the present invention is to eliminate the above-mentioned shortcomings. An electronic package solder ball structure (a). Four debates 诂 ,,: ice hemp 'Shunwang, and a ball of tin that melts / combines with 1 degree from the south to the outer layer ~ the outer layer is coated with more than one layer of single-component or two-component low-temperature metals. When the substrate is packaged and soldered, the soldering = page 5 507504 V. Description of the invention (3) = The core is not melted and has a contour line. The outer liquid melted substrate has a good tin content, iil processability, post-strength strength, and substrate welding material compatibility. High performance, two, easy to test, low resistance, low cost, etc., are its characteristics (-f service :: "The purpose is to provide an electronic package solder ball structure and r main /, the center of the tin ball center Cheap tin or tin-copper can be used. The low-temperature metal of oyster shell is only covered by the surface layer, which can reduce the cost, which is its characteristic. The structure sphere center is not dazzled and can be maintained-fixed; the point height Γ makes every 3 solder balls 'testing' easy Reliable, its characteristics: The best embodiment, technology, means and effects, here are a comparison, structure and features; ㈡: "Yu believe that the above purpose of the present invention < detailed description of the invention > And the specific understanding. The present invention is to provide a designer to make it possible to further the design of the structure of the solder ball (-). The structure design and technology described in this description will be explained with reference to the drawings. Figure 3 shows the two main inventions for IC or electric early / a kind of electronic package solder ball structure (1) the outer layer is coated with more than one layer into a single 0) invention, when the f solder ball soldering, provide controllable Supply _ ~ ☆ said) The main role is to weld the welding material which is slightly less than the melting temperature of the outer layer. The present invention is based on page 6 V. Description of the invention (4) Injury or solder balls (20) with more than one component, and the composite substrate (1 0) is sealed. Due to differences in parts and the like during actual operation, the heat absorption may be lower than the lower temperature part at the set temperature. The lower to the lower temperature part may cause the solder surface to collapse and easily fail. The high wire (30) of the present invention (see Fig. 5) is shown on the side and the second layer of solder joints is collapsed. The high melting point of the knife becomes liquid-soluble, so the outer layer is repeatedly processable. Multi-layer packaging, 3 contacts can meet the requirements, repeated heating without deformation, and repeated heating to the melting point, cracking, etc. (2 1) $ 2 temperature without deformation, due to people's night But the ball core (2 low melting point solder ball with the highest temperature of 2 gas flow, different heat and 10 ° C or solder can be filled. If you can avoid it, please see Figure 4 to ensure that each substrate (1 ball center (2 Good words of fluidity, because of the situation in construction, that is, the user and other circumstances, refer to No. 5 is to add 1 again) Unglazed metal (2 2) The outer layer must be coated with primary antibody 2 3 0 ° C The thermal method and the degree are strange. When the tin is poor, the temperature problem above the layer is compared. Therefore, tin can be melted on the upper and lower sides of the second layer. The tin can be developed for external protection. The solder joint must be warmed. The previous liquid failed again. This hair), so when the temperature is connected, there is a certain 10 ~ substrate plus temperature

20 ° C tin condensate can be eaten in two or two ways) 1 solder joint 2) side 1) In the difficult situation that can not be confirmed at present, repeat and add the temperature caused by the solder joint. weld. Naibo, the range of oxide layer is actually dense. Welding practitioners. If the South temperature welding will be the first layer due to the welding point, the lower layer of the force. Multi-layer sealing, multi-layer, can withstand good welding flow, it can be tolerated, the outer support is strong to make welding. Optimum internal progress, zero time part: Γ This temperature rise part will be very tolerant to a first-degree soldering time (substrate (there is no layer that has been filled into multiple heavy solder joints and collapsed into a high melting point) Although repeated, but not again

Page 7 507504 _Circle ·· V. Description of the invention (5) Deformation and collapse, so the solder ball (20) of the present invention can be reliably and easily packaged. / In terms of soldering strength, the different soldering base materials on the substrate, and even the environmental protection issues of the world, prohibit the use of lead-containing base materials and metal materials. Lead-free materials are mainly ΐ tin ′ and other Low melting point metals such as bismuth and indium r (2; t two! Poor metallic brittle strength. The high melting point ball (2 ^) of the present invention is not 3 brittle metals. Low melting point metals (not shown in 2Θ) are only used in the outer layer Covering. Welding. ') Strength support provided. Affected by low ㈤ 陧 w ^ buckle with a ball center (2 1. Fork 茯 is also low | the brittleness of the metal can effectively reduce the compatibility of the circuit components. The substrate should be designed according to the compatibility of the substrate material: Many welding materials may not have good strength due to welding finished products. For example, =: ability to eat tin. However, material: refers to the substrate: use: selective manufacturing. 〒 material. Refers to solder balls (solder, · and solder joints) In terms of solidification shrinkage and stress, lnt). When the solder joint is liquid-smelted, the AJ solder joint is likely to have a poor heating ability on the substrate due to the temperature difference. ^: Material and other factors, when When solidifying, due to the shape of the difference ::;:, = there will be differences in the shape of v, depending on the amount of coagulation shrinkage, such as page 8 507504 V-, the description of the invention (6) ------- fruit double Welding above this layer, and rhetoric, is the main subject of cracks in the joints. This hairpin :: Different will cause great stress clothing 4 21), so less deformation when liquid dissolves, so less shrinkage, can reduce deformation 'And avoid cracks in the solder joints. "I sigh again and again" and then try to say that the high melting point sphere center of the present invention < 2 1) Shi Yu Ri Shi II is a melting solution that exceeds the soldering temperature due to the loss of the outer layer and the substrate ( 1) Reduce the height by contacting the outer outer shell, that is, the outer layer of the sphere is deformed, and the inner mouth M, the center of the garment, and the outer shell d.) Because the melting point is not reached, the ## 丄 + solder joint (40) is maintained at a high yield. Household degree. The number of points (40) can reach hundreds of points: the number of points (40) on the same substrate (10) can be fixed-fixed (40 $ two melting point sphere centers, (... can guarantee 4 1) ) Ancient sound; te η ◦) Interrogation 'makes female solder joints, test bumps (

4 1) Same degree. Therefore, the test job is touched, "as shown in Figure 7 of the C reading)" It is easier and more reliable. (Refer to resistors, solder joints or solder joints (circuit connection, soldering ^ (4 Q)) Welding materials on the substrate of the welding towel are all poor conductors of electricity. Some titanium, bismuth, indium, etc. rise and fall. Each two; = = 'Make the temperature good and so on. The present invention can; Defect; ::: Minus,' Function not. Only used on the surface of the welding material to control m = metal (22 fiber does not melt in the work So the center of the ball, acetylene) With platinum, gold, silver, tin, tin piercing, version 1 ^ 1) can make low-resistance metals, etc., and achieve welding '4 〇n _, silver steel ... Cost statement, and the requirements of sealing and welding. The alloy 'error-free solder is the main material (B " ° or —.— V. Description of the invention (7)

i Γ The H point material reduces its melting point. Because the 4 A cheaper tin or tin knives other than tin are the lower ones. …, So the usage is significantly less, and the cost can be reduced (as shown in m8, conventional solder; East (7) placed on the substrate (?) (C) i-after light soldering, it may become a comparison of (b) The normal Go (C) picture is not melted on the substrate (3); the solder ball (20) w of the present invention is welded, and the surface liquid: on the heart :) f picture )By. Eight, 4 "and 4 (as shown in Figure 6, see Figure 9, the conventional solder ball (7) is placed between the first plate (4) (5) (as shown in a), after welding, = layer base) The normal state of the picture may become (the state of b ’s formation of an open circuit; the state of θ 4 cracking and deformation “(d) FIG. 1) (1 2) f said 1 (such as e Tugan = Yudi substrate (1 1) Unmelted to form a support, 佶 Α you: After welding, the high melting point sphere center (2 best state (such as f, g, h Figure 2) the surface of the liquid melted tin condition is most useful: The similar products actually have their excellent progress. The present invention already has the elements of the invention patent. The above examples are only examples to illustrate the scope of the spirit of the invention. Various modifications made by some people, 507504 V. Description of the invention (8) Modifications and applications should be included in the scope of the present invention. Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 ) Of the double-layered schematic diagram after welding < simple description of the diagram > Fig. 1 ... is a conventional solder joint station ^ 2 Fig. Is a conventional second layer with Fig. 3: It is an electronic part of the present invention The large plane is a two-line plane display of the electronic special plane of the present invention. The partial magnification plane of the electronic back of the present invention is a partial magnification plane of the electronic front of the present invention. The schematic diagram of the electronic test plane of the present invention is a schematic diagram of the present invention and practice. < Explanation of drawing number of the drawing > • Conventional part · Enlarged plan sectional view of the part. Partial enlarged plan sectional view of the upper welding part. Schematic diagram before welding of the package solder ball structure (—). Package solder ball structure (intent. : Schematic diagram of the double-layer surface of the solder ball structure (-). Schematic diagram of the package of the solder ball structure (_). The post-weld test of the package of the solder ball structure (-) is a single-layer welding comparison. Flat (1) Solder (3) Substrate (5) Second layer substrate (7) Solder ball • Part of the invention · (2) Collapse (4) First layer substrate (6) Melt phenomenon

507504 Schematic description (1 0) Electronic substrate (1 2) Second layer substrate (21) Spherical center (3 0) Contour (4 1) Test contact 0 2 0 2 2 4 First layer substrate solder ball is low Melting point metal solder joint

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Claims (1)

56 Said 丄 901 l〇s ^ / ,, the scope of the patent application is Tan Jiewei J 2: :: f mounted solder ball structure (-), the solder ball is mainly used for its ld ::; hours: provide controllable supply-fixed Welding materials with a capacity; — a single component with more than one layer at the center of the outer layer at the capacity temperature, the outer layer is coated with solder balls; 々 or two or more components of low-temperature metals, which are deformed to reach the center of the core to provide strength. Repeated processing will inevitably lead to small solder joints with good electrical conductivity, less deformation and less shrinkage, which can avoid the effects of cracks and low cost. Please refer to the electronic package solder ball junctions described in item 1 of the patent scope. Tin compound, i. The ball experience in white *, gold, silver, tin, tin silver tin silver copper, tin copper, silver copper low resistance metal. Tin's antimony electronic package solder ball junction, 3 · According to the electronic package solder ball structure C described in item 1 of the scope of the patent application a) 'wherein the outer layer is coated with a metal, rhenium, I ..... metal or Alloyer. τ structure <) ’wherein the outermost layer of the solder ball must be covered with an anti-oxidation layer. 5 · According to the electronic package solder ball structure (1) described in the first patent of the scope of the patent application, the center of the ball can also be a multilayer coating. 4 Item 1 in the scope of patent application Page 14 2002. 08. 27.013