TW502418B - Light emitting diodes matrix with perforated metal sheets - Google Patents

Abstract

This invention uses first metal layer coupling to the first electrodes of the light emitting diodes, further uses a second metal layer to carry the light emitting diodes and coupling to the second electrodes of the light emitting diodes. The first metal and the second metal are perforated for air circulation to dissipate the heat generated from the light emitting diodes matrix.

Description

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This technique is suitable for lighting or decorative lamp panels. 2 · Background Description Figure 1 · The conventional art shows that the circuit board insulating substrate 13 has a first circuit n and a second circuit 12 on it, which are respectively coupled to the bottom electrode and the surface electrode of the light emitting diode wafer. The surface electrode of 10 is electrically coupled to the second circuit 12 in a wire 14 manner. The disadvantage of this product is the poor heat dissipation effect, so only low-power light-emitting diodes can be used. The light intensity generated by this product cannot be effectively improved, so the effect as a lighting or decorative light source is not good. Figures 2 and 1 are based on cross-sectional views taken along the AA cutting line. In this technique, two sets of metal substrates are used instead of the circuit board substrates used in the conventional technique to improve the heat dissipation effect. At the same time, through holes are formed in the metal substrate so that air can flow and the heat dissipation effect is further improved. Therefore, this product can provide a light source lamp board with a light intensity stronger than that of conventional techniques. 3 · Summary of this skill

Page 4 5. Description of the invention (2) '' --- One of the purposes of $ TECH * is to develop an illumination light source using a light emitting diode momentary light element. One of the purposes of ΐ f i is to develop a colored light plate composed of light emitting diode arrays of different colors as decorative light plates. = ^, The third purpose is to develop a light-emitting diode that combines different colors of light. A dry light panel "'provides a color-changing light source for decoration or indication. 4 · Detailed description of the technique Figure 3 · One of the metals of the first embodiment of the technique, Bess metal 22 has a through hole 271 and a through hole 273. Fig. 4 · The second metal of the first embodiment of the present technology shows that the metal 21 carries the light-emitting diode wafer 20 and is formed with a through hole 272. Figure 5 · Combination of Figure 3 and Figure 4-The embodiment of this technology shows the schematic diagram of the combined product after Figure 3 and Figure 4 are stacked. The wafer 20 corresponds to the through hole 273 and the cup formed by the through hole 273 The wall emits light, and the wall of the cup provides the function of gathering and enhancing the light. ^ The hole 2 71 and the through hole 2 7 2 are the same shape and communicate with each other to provide air circulation. For the purpose of changing the design, the shape of the through hole 271 and the through hole 272 need not be the same, the size need not be the same, and the position need not be completely Alignment can also achieve the effect of ventilation and heat dissipation.

Page 5 502418 V. Description of the invention (3) Figures 6 and 5 show the cross section of the BB cutting line showing that the wafer 20 is placed on the metal substrate 21, and the through holes 273 of the metal substrate 22 are located on the wafer 20 and form a cup Wall for wafer 20 to emit light. Through holes 2 7 1 · 2 7 2 provide air circulation for heat dissipation. The wafer 20 is coupled to the metal substrate 21 by bonding the surface electrode to the metal substrate 2 4 'and the bottom electrode of the wafer 20 is contact-coupled to the metal substrate 21. Figure 7 · One of the metals of the second embodiment of the present technology shows that the metal 21 has a through hole 272 for air circulation and heat dissipation. The wafer 20 is placed on the metal 21, and the insulating material 23 is also placed on the metal 21. Fig. 8 · The second embodiment of the technique shows that the metal 22 is placed on the metal 21 and the wafer 20 is exposed. The surface electrode of the wafer 20 is coupled to the metal 22 by a wire 24. The metal 22 has a through hole 2 7 1 '& Figure 9 · The third embodiment of the technology shows that each small unit can use multiple wafers to increase the brightness. The figure shows two wafers 2 0 · 2 0 2 · Can be arranged together. The surface electrode is coupled to the metal 22 'with a wire 2 4 respectively, and the bottom electrode is coupled to the metal 21 in a contact manner. Electrical insulating material 23 provides electrical insulating work between metal 21 and metal 22 Figure 10

Page 6 V. Description of the invention (4) _ Shows that the lower metal 22 is made with a raised platform fish to facilitate the wiring 24; the metal platform and the metal 21 door are coplanar to the right, and the rest of the description is the same as described above. There are electrically insulating materials 23. Figure 11 · The fifth embodiment of the technique shows that the wafer 20 is gold 22 with double bottom electrodes. Blades are coupled to metal 21 and metal. Figures 12 and 11 are cross-sectional views according to the CC cut line. The chip 20 has two bottom electrodes, 22 respectively; metal platform and metal 21; and metal 21 and metal are the same as described above. There are electrically insulating materials 23. The rest of the description Figure 1 · The sixth embodiment of this technology shows that metal 21 and metal 22 exist in the form of a coplanar, which is called a coplanar surface, and is contact-coupled i + M 91 with two bottom electrodes, respectively. 20 θ ^ Group 971 plus σ to metal 21 and metal 22, metal 21 ϋ For airflow and heat dissipation. The metal 22 has a through hole 272 for air circulation and heat dissipation. Figure 14 · Example 7 of this technology shows metal 211 · 212 · 213 · 214. Designed in tandem with an approximately coplanar pattern, the chip 20 is contact-coupled to the two pieces of metal bridged by the two bottom electrodes, respectively. Form a series and parallel effect.

Page 7 V. Description of Invention (5)

Figure 15 · Eighth embodiment of this technology ί: ΐΐ2Ι ·: 2 · Presence in Z: type metal 21 has through holes 271 to provide space Γ: two 22, there are through holes 272 to provide air circulation and heat dissipation. The through hole 273 is provided for the light emission of the chip 20. The surface electrode of the chip 20 is coupled to the metal 21 and the bottom electrode is turned to the metal 21.22. The lower layer is structured: string effect. Figure 16 · The ninth display chip 20 of the embodiment of this technology has a Nexus system of 7, for example, and "Yiyiqu" is an extremely observant. You can use double wires 241 · 242 · In order to electrically couple the double surface electrodes So far it belongs to the base material 2ι · 22 ·. Fig. 17 · The tenth embodiment of the present technology shows that the metal 22 carrying the wafer 20 can be made into a concave cup 25 to accommodate the wafer 0, and the function of condensing the outgoing light from the wafer 20 is further improved. Fig. 18 · The eleventh display of the embodiment of this technology = when metal 21 · 22 · is commonly used to carry the wafer 20, a concave can be made = Guna wafer 20, that is, metal 21 is made of a semi-concave cup 251, and metal 22 The semi-concave cup 252 and the semi-concave cup 251 · 252 constitute a complete concave cup, and the function of focusing the light emitted from the wafer 20 is also mentioned. The description describes the preferred embodiment of the present invention and the design drawings, but

Page 8 502418 V. Description of the invention (6) The preferred embodiments and design drawings are only examples, and are not intended to limit the scope of the right to the technology of the present invention. Anyone who implements the technology of the present invention by equal means, The implementation of the scope of rights covered by the following "application scope" does not depart from the spirit of the present invention but is a scope of profit for the applicant.

Page 9 502418 Simple illustration of the diagram 4. Simple illustration of the diagram Figure 1. Known technique Figure 2. Figure 1 A sectional view according to the AA cutting line Figure 3. One of the metals of the first embodiment of the technique Figure 4. The technique Figure 2 of the second embodiment of the metal Figure 5. Combination of Figure 3 and Figure 4 _ Example 1 of this technique Figure 6. Figure 5 Sectional view according to the BB cutting line Figure 7. Example of the second metal of the technique Figure 8 Figure 9 of the second embodiment of the technology Figure 10 of the third embodiment of the technology Figure 10 of the fourth embodiment of the technology Figure 11 of the fifth embodiment of the technology Figure 12. Cross-sectional view of the cutting line according to CC Figure 1 3. This technology Example 6 Figure 1 4 · Example 7 of the technology Figure 1 5. Example 8 of the technology Figure 1 6. Example 9 of the technology Figure 1 7. Example 10 of the technology Figure 1 8. Example 11 of the technology . Component number table wafer 1 0. 20. 20 1.202.203.

Page 10 502418 Schematic illustration of circuit 11. 12. Circuit board substrate 1 3. Wire 14.24.241 · 242. Metal substrate 21. 22. 211. 212. 213. 214. Electrical insulating material 2 3. Concave Cup 2 5 Half concave cup 25 1. 252. Through hole 271 · 272. 273.

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Claims (1)

502418 6. Scope of patent application 1 · A light emitting diode matrix lamp board with heat dissipation through holes, comprising: a plurality of light emitting diode wafers, each of which has a first electrode and a second electrode; a first metal The substrate has a first through hole to provide air circulation to improve the heat dissipation function; it is electrically lighter than the aforementioned first electrode; and a second metal substrate has a > through hole to provide air circulation to improve the heat dissipation Function; and is electrically coupled to Le Shu's second electrode. 2 · The light-emitting diode matrix lamp board with heat dissipation through holes as described in the first patent application scope, further comprising: an electrically insulating material interposed between the aforementioned first metal and the aforementioned second metal, providing The power of electrical insulation. 3. The light-emitting diode matrix lamp board with heat dissipation through holes according to item 1 of the scope of the patent application, wherein the first metal and the second metal are stacked on top of each other. 4 · The light emitting diode matrix lamp board with heat dissipation through holes as described in item 1 of the scope of patent application, wherein the first metal described by the household and the second metal are coplanar. 5 · The light emitting diode matrix lamp board with heat dissipation through holes as described in item 1 of the scope of patent application, wherein the third metal and the second metal are z 502418 6. Scope of patent application Font type. 6 · The light emitting diode matrix lamp board with heat dissipation through holes as described in item 3 of the scope of the patent application, wherein the wafer is placed on the second metal, and the first metal further includes ·· The third through hole serves as the wall of the condenser cup, and provides the function of concentrating and enhancing the light emitted from the wafer. 7. The light-emitting diode matrix lamp board with heat dissipation through holes as described in item 6 of the scope of the patent application, wherein the second metal on which the wafer is placed is further made with a concave cup 'to accommodate the aforementioned wafer. 8. The light emitting diode matrix lamp board with heat dissipation through holes as described in item 3 of the scope of patent application, wherein the first through holes and the second through holes are aligned up and down to facilitate air circulation . 9 · The light-emitting diode matrix lamp board with heat dissipation through holes as described in item 4 of the scope of the patent application, wherein the first metal and the second metal jointly carry the aforementioned wafer, and I is electrically coupled respectively One of the two electrodes on the aforementioned wafer. 10. The light-emitting diode matrix lamp board having heat dissipation through holes according to item 9 of the patent application park, wherein the first metal has a first semi-concave cup, and the second metal has a second half The concave cup, the first semi-concave cup and the second semi-concave cup constitute a complete concave cup 'to carry the aforementioned wafer. Page 13 502418 6. Scope of patent application ^ ^ ^ 7 Light-emitting diodes with heat dissipation through holes 11. As claimed in the patent application Fangu No. 5 the gold includes · the third through-hole body matrix lamp board, where Z 字 置 泰 _. ^ ^ 7, said that the light emitted from the aforementioned wafer can be concentrated on the upper layer of the metal as the wall of the condenser cup, and the function of the power set is enhanced. 12. It has a heat dissipation through hole as described in item 3 of the scope of patent application The light-emitting monopolar matrix lamp plate, wherein the second metal further has: the bump i and the aforementioned first metal surface are approximately coplanar, and they jointly carry the aforementioned wafer, and are electrically coupled to the aforementioned wafer, respectively. One of the two electrodes. Page 14