經濟部智慧財產局員工消費合作社印製 499368 7825twf.doc/0 1 2 A7 B7 五、發明說明（/ ) 本發明是有關於一種壓電式噴墨印頭及其製程，特 別是有關於一種以具有凹槽之金屬層取代習知之陶瓷厚 膜，用以形成壓電式噴墨印頭之振動層及墨腔層的結構Z 其製程。 n 傳統噴墨列印技術之主要運作原理可分爲熱泡式 (Thermal bubble)及壓電式（Piezoeiectric)。熱泡式喧 墨列印技術乃利用加熱器（Heater)將墨水瞬間氣化，產 生局壓氣泡推動墨水由噴嘴射出，由於熱泡式噴墨印頭之 製造成本較低，業己由HP及CANON成功地商業化，並 產生相當大的噴墨印表機市埸，但由於其高溫氣化之運作 原理，使得適用墨水（主要是水系溶劑）之選擇性低，使 得其延伸的應用領域有限。 壓電式噴墨列印技術係利用壓電陶瓷（Piezoelectric ceramic)因施加電壓而產生形變，擠壓液體產生高壓將液 體噴出。相對於熱泡式噴墨印頭，壓電式噴墨印頭具有下 列優點：壓電式噴墨印頭之墨水不會因爲高溫氣化產生化 學變化’影響顔色品質之狀況；由於不需使用反覆高熱應 力，故具有極佳的耐久性；壓電式噴墨印頭所使用之壓電 陶瓷的反應速度快，可提升列印速度，而熱泡式噴墨印頭 則會受到熱傳導速度之限制；壓電式噴墨印頭係藉由控制 電壓的大小，來控制壓電陶瓷之形變量，進而控制墨滴的 大小，可提升列印的品質。 第1圖爲習知之一種壓電式噴墨印頭之剖面示意圖。 傳統壓電式噴墨印頭100的製程係利用陶瓷厚膜（thick 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------裝--------訂---------線* (請先閱讀背面之注意事項再填寫本頁) 499368 7825twf.doc/0 1 2 A7 B7 五、發明說明（3 ) film)製程形成具有上電極層102( upper electrode layer)、 壓電層 104 (piezoelectric layer)、下電極層 l〇7 (lower electrode layer)、振動層 108 ( vibrating layer) 、墨腔 (請先閱讀背面之注意事項再填寫本頁) 層lio、及墨腔底膜112等陶瓷厚膜生胚 (green tape )， 並依照順序將不同層的陶瓷厚膜生胚壓合黏著在一起之 後，再進行陶瓷結構的高溫燒結。例如EPSON公司所生 產之壓電式噴墨印頭。 請同樣參考第1圖，壓電式噴墨印頭100之運作原 理係藉由上電極層102及下電極層1〇7施加電壓至壓電層 104 ’由於壓電層104之材質爲一壓電陶瓷（piezoelectric ceramic)，故壓電層104會受到電壓的影響而產生瞬間形 變，並藉由此瞬間形變來推移振動層108，以擠壓墨水腔 114 (pressure chamber)之中的墨水，並從出墨口 116將 墨水高壓噴射出以形成墨滴，而到達紙張表面造成圖文 化。 — 在習知之傳統壓電式噴墨印頭的製程中，除上電極 層、下電極層採用金屬之外，其他元件均以陶瓷厚膜製程 製作完成後’再進行對位壓合黏結以及陶瓷結構的高溫燒 結。然而’傳統壓電式噴墨印頭的製程具有下列缺點： 經濟部智慧財產局員工消費合作社印製 (1) 由於壓電式噴墨印頭的結構尺寸相當小，且其 結構具有較高之精密度，因而使各層陶瓷厚膜之間進行對 位壓合黏結的不良率相對提高； (2) 由於壓電式噴墨印頭的結構相當複雜，在高溫 燒結時往往因爲陶瓷材料之收縮量不均勻，造成內部結構 4 尺度適用中國國家標準（CNS)A4規格(2l〇T^f^7 499368 7 825twf.doc/01 2 A7 B7 五、發明說明（）） 的應力破壞，因而使成品的不良率相對提高； (3)由於壓電式噴墨印頭的結構相當複雜，在高溫 燒結時會因爲陶瓷材料之收縮量不均勻，將致使結構設計 越緻密的壓電式噴墨印頭，其成品的良率越低，因而無法 增加噴墨印頭之間的密度，而限制噴墨列印的解析度。 本發明之目的係爲解決上述的問題，提供一種壓電 式噴墨印頭及其製程，係以電鍍（electr〇plate)及微影 (photolithography)、蝕刻（etching )的方式，形成一具 有凹槽的金屬層’用以取代習知以陶瓷材料製成之振動層 及墨腔層，如此可提高成品良率及加工精密度，進而降低 製造成本。 基於本發明之目的，本發明提出一種壓電式噴墨印 頭，至少包括有一第一金屬層，其具有第一面及對應之第 二面，而一第二金屬層係配置於第一金屬層之第二面之 上，並具有至少一槽孔，其與第一金屬層之第二面構成一 凹槽，且一下電極層係配置於第一金屬層之第一面之上， 而圖案化之一壓電層則配置於下電極層之上，其中壓電層 之位置係對應凹槽之位置，而圖案化之一上電極層，形成 於壓電層之上，而一噴孔片係配置於第二金屬層之上，其 中噴孔片係與第一金屬層及第二金屬層構成一墨水腔，並 且噴孔片具有至少一噴孔，其與墨水腔相通。其中，壓電 式噴墨印頭更包括有一鈍化層，配置介於下電極層及第一 金屬層之間，而鈍化層之材質包括鈍性金屬或絕緣材料。 本發明係對應上述之壓電式噴墨印頭，提出一種壓 ----------- (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 499368 7825twf.doc / 0 1 2 A7 B7 V. Description of the invention (/) The present invention relates to a piezoelectric inkjet print head and its manufacturing process, and in particular to a piezoelectric inkjet print head and its process. The metal layer with grooves replaces the conventional ceramic thick film, and is used to form the structure of the vibration layer and the ink cavity layer of the piezoelectric inkjet print head. n The main operating principles of traditional inkjet printing technology can be divided into thermal bubble and piezoelectric (piezoeiectric). The thermal bubble type ink printing technology uses a heater to instantly vaporize the ink, and generates local pressure bubbles to push the ink out of the nozzle. Due to the low manufacturing cost of the thermal bubble inkjet print head, HP and CANON was successfully commercialized and produced a considerable market for inkjet printers. However, due to its high-temperature gasification operation principle, the selectivity of applicable inks (mainly water-based solvents) is low, making its extended application areas limited . Piezoelectric inkjet printing technology uses piezoelectric ceramics (piezoelectric ceramic) to deform due to the application of voltage, and squeezes the liquid to generate high pressure to eject the liquid. Compared with thermal bubble inkjet printheads, piezoelectric inkjet printheads have the following advantages: the ink of the piezoelectric inkjet printheads will not cause chemical changes due to high temperature gasification, which affects the color quality; Repeatedly high thermal stress, so it has excellent durability; the piezoelectric ceramic used in piezoelectric inkjet print heads has a fast response speed, which can increase printing speed, while thermal bubble inkjet print heads are subject to thermal conduction speed. Limitation: Piezoelectric inkjet printheads control the deformation of piezoelectric ceramics by controlling the size of the voltage, and then the size of the ink droplets, which can improve the quality of printing. FIG. 1 is a schematic cross-sectional view of a conventional piezoelectric inkjet print head. The manufacturing process of the traditional piezoelectric inkjet print head 100 uses a ceramic thick film (thick 3, this paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm)) ------------ -Install -------- order --------- line * (Please read the precautions on the back before filling this page) 499368 7825twf.doc / 0 1 2 A7 B7 V. Description of the invention ( 3) film) process to form an upper electrode layer 102 (upper electrode layer), a piezoelectric layer 104 (piezoelectric layer), a lower electrode layer 107 (lower electrode layer), a vibrating layer 108 (vibrating layer), an ink cavity (please Read the precautions on the back before filling in this page) Layers of ceramic thick film green tapes such as layer lio and ink chamber bottom film 112, and press and adhere the ceramic thick film green embryos of different layers together in order. The ceramic structure is then sintered at a high temperature. For example, a piezoelectric inkjet print head manufactured by EPSON. Please refer to FIG. 1 as well. The operating principle of the piezoelectric inkjet print head 100 is to apply a voltage to the piezoelectric layer 104 through the upper electrode layer 102 and the lower electrode layer 107. 'Because the material of the piezoelectric layer 104 is a pressure Piezoelectric ceramic, so the piezoelectric layer 104 will be affected by the voltage to cause instant deformation, and the instantaneous deformation will move the vibration layer 108 to squeeze the ink in the ink chamber 114 (pressure chamber), and The ink is ejected from the ink outlet 116 under high pressure to form ink droplets, and reaches the surface of the paper to cause a graphic culture. — In the conventional manufacturing process of conventional piezoelectric inkjet printheads, except for the upper electrode layer and the lower electrode layer, which are made of metal, other components are manufactured by the ceramic thick film process, and then the alignment compression bonding and ceramic are performed. High temperature sintering of the structure. However, the process of the traditional piezoelectric inkjet print head has the following disadvantages: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (1) Because the structure of the piezoelectric inkjet printhead is quite small, and its structure has a high Precision, so that the defective rate of the counter-pressure bonding between the various ceramic thick films is relatively increased; (2) Because the structure of the piezoelectric inkjet printhead is quite complicated, the shrinkage of the ceramic material is often caused during high temperature sintering Non-uniformity, causing the internal structure of 4 scales to comply with the Chinese National Standard (CNS) A4 specifications (2l0T ^ f ^ 7 499368 7 825twf.doc / 01 2 A7 B7) Stress damage of the finished product, thus making the finished product The defect rate is relatively increased; (3) Because the structure of the piezoelectric inkjet printhead is quite complicated, the shrinkage of the ceramic material is uneven during sintering at high temperature, which will cause the denser structure of the piezoelectric inkjet printhead. The lower the yield of the finished product, the density between inkjet print heads cannot be increased, and the resolution of inkjet printing is limited. An object of the present invention is to solve the above-mentioned problems, and to provide a piezoelectric inkjet print head and a process for forming the same with electroplating, photolithography, and etching. The metal layer of the groove is used to replace the vibration layer and the ink cavity layer made of the conventional ceramic material, which can improve the yield of the finished product and the processing precision, thereby reducing the manufacturing cost. Based on the purpose of the present invention, the present invention provides a piezoelectric inkjet print head, which includes at least a first metal layer having a first surface and a corresponding second surface, and a second metal layer is disposed on the first metal. Above the second surface of the layer, there is at least one slot, which forms a groove with the second surface of the first metal layer, and the lower electrode layer is arranged on the first surface of the first metal layer, and the pattern is A piezoelectric layer is disposed on the lower electrode layer, where the position of the piezoelectric layer corresponds to the position of the groove, and a patterned upper electrode layer is formed on the piezoelectric layer, and an orifice plate is formed. It is arranged on the second metal layer, wherein the nozzle hole sheet forms an ink cavity with the first metal layer and the second metal layer, and the nozzle hole sheet has at least one nozzle hole, which is in communication with the ink cavity. The piezoelectric inkjet print head further includes a passivation layer disposed between the lower electrode layer and the first metal layer, and the material of the passivation layer includes a passive metal or an insulating material. The present invention corresponds to the above-mentioned piezoelectric inkjet print head, and proposes a pressure ----------- (Please read the precautions on the back before filling this page)
訂---------線I 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 499368 A7 B7 7825twf.doc/0 1 2 五、發明說明（V ) 電式噴墨印頭之製程，首先提供一基底，並形成第一金屬 層於基底之上，其中第一金屬層具有第一面及對應之第二 面，而基底係位於第一金屬層之第一面之上。接著形成一 第二金屬層於第一金屬層之第二面之上，其中第二金屬層 具有至少一槽孔，其與第一金屬層之第二面構成一凹槽。 接著再移除基底，並形成一下電極層於第一金屬層之第一 面之上。接著形成圖案化之一壓電層於下電極層之上’其 中壓電層之位置係對應凹槽之位置。接著形成圖案化之一 上電極層於壓電層之上。最後，配置一噴孔片於第二金屬 層之上，其中噴孔片係與第一金屬層及第二金屬層構成一 墨水腔，並且噴孔片具有至少一噴孔，其與墨水腔相通。 其中，在移除基底之後，更包括形成一鈍化層於第一金屬 層之第一面之上，而介於下電極層及第一金屬層之間，而 鈍化層之材質包括鈍性金屬或絕緣材料。 同樣基於本發明之目的，本發明提出一種壓電式噴 墨印頭，至少包括：一金屬層，具有第一面及對應之第二 面，以及具有至少一凹槽，其中凹槽係凹陷於金屬層之第 二面，而凹槽之深度約略小於金屬層之厚度；一下電極層， 形成於金屬層之第一面之上；圖案化之一壓電層，形成於 下電極層之上，其中壓電層之位置係對應凹槽之位置；圖 案化之一上電極層，形成於壓電層之上；以及一噴孔片， 配置於金屬層之第二面之上，其中噴孔片係與金屬層構成 一墨水腔，並且噴孔片具有至少一噴孔，其與墨水腔相通。 其中，壓電式噴墨印頭更包括有一鈍化層，配置介於下電 6 本紙張尺度適用中國國家標準（CNS)A4規格⑵G X 297公爱) --------------------訂--------·線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 499368 7825twf.doc/012 A7 五、發明說明（f) 極層及金屬層之間，而鈍化層之材質包括鈍性金屬或絕緣 材料。 本發明亦對應上述之壓電式噴墨印頭，提出一種壓 電式噴墨印頭之製程，首先提供一基底，並形成一金屬層 於基底之上，其中金屬層具有第一面及對應之第二面，而 基底係位於金屬層之第一面之上。接著移除部分金屬層， 以形成至少一凹槽，其中凹槽係凹陷於金屬層之第二面， 而凹槽之深度約略小於金屬層之厚度。接著移除基底，並 形成一下電極層於金屬層之第一面之上。接著形成圖案化 之一壓電層於下電極層之上，其中壓電層之位置係對應凹 槽之位置。接著形成圖案化之一上電極層於壓電層之上。 最後，配置一噴孔片於金屬層之第二面之上，其中噴孔片 係與金屬層構成一墨水腔，並且噴孔片具有至少一噴孔， 其與墨水腔相通。其中，在移除基底之後，更包括形成一 鈍化層於第一金屬層之第一面之上，而鈍化層之材質包括 鈍性金屬或絕緣材料。 本發明係以電鍍及微影蝕刻的方式，利用金屬材料 取代習知之陶瓷材料，用以形成噴墨印頭之振動層及墨腔 層等結構。由於金屬之導熱性及延展性均優於陶瓷，故可 改善習知之噴墨印頭在高溫燒結時，其內部結構容易發生 應力破壞的現象，藉以提高成品良率及及加工精密度，進 而降低製造成本。 爲讓本發明之上述目的、特徵和優點能夠明顯易懂， 下文特舉一較佳實施例，並配合所附圖示，作詳細說明如 7 本紙張又度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------- (請先閱讀背面之注意事項再填寫本頁) 訂---------線 « 經濟部智慧財產局員工消費合作社印製 499368 7825twf.doc/0 1 2 A7 _B7_ 五、發明說明（S ) 下： 圖式之簡單說明 (請先閱讀背面之注意事項再填寫本頁) 第1圖爲習知之一種壓電式噴墨印頭的剖面示意圖； 第2A〜2D圖爲依照本發明之較佳實施例的壓電式 噴墨印頭之製程的剖面流程圖； 第3A〜3D圖爲本發明之較佳實施例之第一種形成 第2B圖之金屬層的剖面流程圖； 第4A〜4D圖爲本發明之較佳實施例之第二種形成 第2B圖之金屬層的剖面流程圖；以及 第5圖爲本發明之較佳實施例之具有鈍化層之壓電 式噴墨印頭的剖面示意圖。 圖式之標示說明 100 ： 壓電式噴墨印頭 102 :上電極層 104 ： 壓電層 107 :下電極層 108 ： 振動層 110 :墨腔層 112 ： 墨腔底膜 114 :墨水腔 116 ： 出墨口 200 :壓電式噴墨印頭 202、302、402 :基底 2〇4、304、404 :金屬層 經濟部智慧財產局員工消費合作社印製 205 :第一面 206 :第二面 207、 307、407 :第一金屬層 208、 308、408 :第二金屬層 210、310、410 :凹槽 212 :鈍性金屬層 214 :壓電層 216 :上電極層 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ^9368 經濟部智慧財產局員工消費合作社印製 五、發明說明（7 ) 7825twf.doc/012 A7 -------B7 218 噴孔片 220 :墨水腔 222 噴孔 324、424 :光阻層 526 鈍化層 較佳實施例 請依序參考第2A〜2D圖，其爲依照本發明之較佳 實施例的壓電式噴墨印頭之製程的剖面流程圖。首先，如 第2A圖所示，提供一基底202，其材質例如爲矽、陶瓷 及金屬等等，並以電鍍（electroplate)的方式，形成一金 屬層204 (metal layer)於基底202之上，接著再以微影 (photolithography)、蝕刻（etching)的方式，移除部分 金屬層204，以形成一凹槽210，其中凹槽210係凹陷於 金屬層204之第二面206，値得注意的是，凹槽210係以 半蝕刻（half etching)的方式所形成，故其並未完全貫穿 金屬層204，使得凹槽210之深度約略小與金屬層204之 厚度，而將金屬層204區分爲一第一金屬層207及一第二 金屬層208。其中，第一金屬層207之作用與習知之第1 圖的振動層108相同，而第一金屬層207及第二金屬層208 所構成之凹槽210則作爲習知第1圖之墨水腔114之部分 結構。 再如第2B圖所示，去除基底202，而保留具有凹槽 21〇之金屬層204。之後，如第2C圖所示，並以電鑛的方 式’形成一下電極層212 (lower electrode layer)於金屬 層204之第一面205之上，其中下電極層212之材質例如 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------- (請先閱讀背面之注意事項再填寫本頁) 訂----- 線 « 經濟部智慧財產局員工消費合作社印製 499368 7825twf.doc/0 1 2 B7 五、發明說明（没） 爲導電性佳的金屬。接著，再以網版印刷（screen Printing) 的方式，形成一圖案化之壓電層214 (piezoelectric layer) 於下電極層212之上，而圖案化之壓電層214的位置係對 應凹槽210的位置。値得注意的是，壓電層214之材質通 常爲一壓電陶瓷（Piezoelectric ceramic)，而初次網印上 之壓電層214爲一陶瓷厚膜生胚（green tape)，必須對其 進行高溫燒結，以使陶瓷厚膜生胚轉變成壓電陶瓷。其中， 壓電層214之材質包括鉛锆鈦摻合物（lead zirconate titanate，PZT)或壓電高分子，又壓電高分子包括聚二氟 乙烯（Poly ( Vinylidene Fluoride ) ，PVDF )。 在完成第2C圖所不之結構後’如第2D圖所示，再 以網版印刷的方式，形成圖案化之一上電極層216 (uppei· electrode layer)於壓電層214之上，其中上電極層216之 材質例如爲導電性佳的金屬，而上電極層216的位置係對 應壓電層214的位置。接者，再以貼合的方式，將一噴孔 片218 (nozzle plate)配置於金屬層204之第二面206之 上，其中噴孔片218係封閉先前第2C圖所示之凹槽21〇 的開口，而與第一金屬層207及第二金屬層208構成墨水 腔22〇 ( pressure chamber)之封閉空腔結構，且噴孔片218 更具有一個至數個噴孔222 ( nozzle)，其分別與墨水腔220 相通，用以作爲墨水的進出口，最後完成壓電式噴墨印頭 2〇〇之製作。値得注意的是，壓電層214若採用壓電陶瓷， 因而需要進行高溫燒結時，由於噴孔片218係在壓電層214 經過高溫燒結之後，始配置貼合於金屬層204之上，因此 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) -----------------1---訂---------線 (請先閱讀背面之注意事項再填寫本頁) 499368 7825twf.doc/012 A7 B7 五、發明說明（？） 噴孔片218之材質並不需要是耐高溫材料，而可由金屬或 聚合物（polymer)之材料所製作而成。 (請先閱讀背面之注意事項再填寫本頁) 本發明之較佳實施例的第一種形成第2B圖之具有凹 槽210的金屬層204的方法如下，請依序參考第3A〜3D 圖，其爲本發明之較佳實施例之第一種形成第2B圖之金 屬層2〇4的剖面流程圖。如第3A圖所示，首先提供一基 底3〇2，並以電鍍的方式，形成一第一金屬層307於基底 302之上。再如第3B圖所示，以曝光顯影的方式，形成 一圖案化之光阻層324於第一金屬層307之上，其中光阻 層324之厚度及分佈區域係分別與先前第2B圖之凹槽210 之深度及分佈區域相同。接著，如第3C圖所示，再以電 鑛的方式，形成一第二金屬層308於第一金屬層307之上。 之後，再去除基底302及圖案化之光阻層324，即可形成 如第3D圖所示之一具有凹槽310之金屬層304，其結構 與先前第2B圖之金屬層204相同。 經濟部智慧財產局員工消費合作社印製 本發明之較佳實施例的第二種形成第2B圖之具有凹 槽210的金屬層204的方法如下，請依序參考第4A〜4D 圖，其爲本發明之較佳實施例之第二種形成第2B圖之金 屬層2〇4的剖面流程圖。如第4A圖所示，首先提供〜基 底302，並以電鍍的方式，形成一金屬層404於基底4〇2 之上。接著，如第4B圖所示，以曝光顯影的方式，形成 一圖案化之光阻層424於金屬層4〇4之上，其中圖案化;^ 光阻層424的位置係對應先前第2B圖之第二金屬層2〇8 的凹槽210的位置。接著，如第3C圖所示，再以蝕刻的 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 499368 經濟部智慧財產局員工消費合作社印製 7825twf.doc/0 1 2 A7 B7 五、發明說明（π ) 方式，面朝基底402的方向，去除部分金屬層404，使得 金屬層404區分成第一金屬層407及第二金屬層408。之 後，去除基底402及光阻層424，即可形成第4D圖所示 之具有凹槽410的金屬層404，其結構與先前第2Β圖之 金屬層204相同。 請參考第2D圖，當壓電層214之材質爲壓電陶瓷， 而需進行高溫燒結時，爲了避免高溫燒結時熔化金屬層 204，因此，金屬層204之材質必須選擇熔點大於800°C以 上的金屬。此外，當以電鍍的方式形成金屬層204時，金 屬層204內部之殘留應力容易造成結構上的應力破壞。因 此，金屬層204之材質需選擇電鍍後的殘留應力小且延展 性佳的金屬。故金屬層204之材質可包括鎳（Ni)、銅（Ci〇、 鈀（Pd)、及其合金等金屬，或者是其他導電材料。 請同樣參考第2D圖，當壓電層214之材質採用壓電 陶瓷，而需要進行高溫燒結時，爲避免壓電層214與金屬 層204兩者在高溫環境之下發生化學反應，因而破壞壓電 陶瓷之所應有的壓電特性，下電極層212之材質可以是鈍 性金屬，藉以分隔金屬層204及壓電層214，同時爲避免 下電極層212在高溫燒結時熔化，其熔點亦需大於800°C， 因此，下電極層212之材質係可包括金（Au)、銀（Ag)、 銅（Cu)、鈿（Pt)、鈀（Pd)、其合金等金屬，或是其 他導電材料。 請參考第5圖，其爲本發明之較佳實施例之具有鈍 化層之壓電式噴墨印頭的剖面示意圖。同樣地，爲了避免 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂-------丨-線一 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 499368 7825twf.doc/0 1 2 A7 B7 五、發明說明（// ) 壓電層214於高溫燒結時，穿過下電極層212而與金屬層 204發生反應，因此，在形成金屬層204之後，更包括形 成一鈍化層526於金屬層204之上，而介於下電極層212 及金屬層204之間，用以避免壓電層214於高溫燒結時， 穿過下電極層212而與金屬層204發生反應，其中鈍化層 526之材質包括鈍性金屬（inert metal)，例如爲金、銀、 銅、鈷、銷、其合金等金屬，而鈍化層526之材質亦可包 括絕緣材料，例如爲氮化矽、氧化矽及氧化鉅等絕緣材料。 依照本發明之特徵，本發明係以金屬取代習知之陶 瓷材料’用以形成一具有凹槽之金屬層，取代習知之振動 層及墨腔層，而減少陶瓷材料的使用，由於金屬之導熱性 及延展性均優於陶瓷’故可改善陶瓷於高溫燒結時，噴墨 印頭之結構發生應力破壞的現象。 依照本發明之特徵，本發明係以電鍍及微影蝕刻的 方式製作噴墨印頭之墨水腔結構，故其尺寸精密度將遠大 於習知以陶瓷厚膜對位壓合及高溫燒結後之尺寸精密度， 因此’本發明之製程將可進一步增加噴墨印頭的密度，以 提高噴墨列印之解析度。 依照本發明之特徵，本發明係以鈍性金屬作爲下電 極層之材質，以避免在高溫燒結時，金屬層及壓電層之間 發生化學變化’因而影響到壓電層之應有的壓電特性。 依照本發明之特徵，本發明係形成一鈍化層介於下 電極層及金屬層之間’以避免在高溫燒結時，壓電層穿過 下電極層而與金屬層發生化學變化，因而影響到壓電層之 (請先閱讀背面之注意事項再填寫本頁) 訂.· •線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 經濟部智慧財產局員工消費合作社印製 499368 7825twf.doc/012 A7 一 B7 五、發明說明（/^) 應有的壓電特性。Order --------- Line I Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with China National Standard (CNS) A4 (210 X 297 mm) 499368 A7 B7 7825twf.doc / 0 1 2. V. Description of the Invention (V) In the process of the electric inkjet print head, a substrate is first provided, and a first metal layer is formed on the substrate. The first metal layer has a first surface and a corresponding second surface, and The substrate is located on the first surface of the first metal layer. Next, a second metal layer is formed on the second surface of the first metal layer, wherein the second metal layer has at least one slot hole and forms a groove with the second surface of the first metal layer. Then, the substrate is removed, and an electrode layer is formed on the first surface of the first metal layer. Next, a patterned piezoelectric layer is formed on the lower electrode layer, wherein the position of the piezoelectric layer corresponds to the position of the groove. A patterned upper electrode layer is then formed over the piezoelectric layer. Finally, an orifice plate is arranged on the second metal layer, wherein the orifice plate forms an ink cavity with the first metal layer and the second metal layer, and the orifice plate has at least one orifice, which communicates with the ink cavity. . Wherein, after removing the substrate, it further includes forming a passivation layer on the first surface of the first metal layer and interposed between the lower electrode layer and the first metal layer, and the material of the passivation layer includes a passive metal or Insulation Materials. Also based on the purpose of the present invention, the present invention provides a piezoelectric inkjet print head, which includes at least: a metal layer having a first surface and a corresponding second surface, and having at least one groove, wherein the groove is recessed in The second surface of the metal layer, and the depth of the groove is slightly less than the thickness of the metal layer; the lower electrode layer is formed on the first surface of the metal layer; and a patterned piezoelectric layer is formed on the lower electrode layer, The position of the piezoelectric layer corresponds to the position of the groove; a patterned upper electrode layer is formed on the piezoelectric layer; and an orifice plate is disposed on the second surface of the metal layer, wherein the orifice plate is An ink cavity is formed with the metal layer, and the nozzle hole sheet has at least one nozzle hole, which is in communication with the ink cavity. Among them, the piezo inkjet print head also includes a passivation layer, the configuration is between power down 6 This paper size is applicable to China National Standard (CNS) A4 specifications (G X 297 public love) ----------- --------- Order -------- · Line (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 499368 7825twf.doc / 012 A7 5. Description of the invention (f) Between the electrode layer and the metal layer, and the material of the passivation layer includes a passive metal or an insulating material. The invention also corresponds to the above-mentioned piezoelectric inkjet print head, and proposes a manufacturing process of the piezoelectric inkjet print head. First, a substrate is provided, and a metal layer is formed on the substrate. The metal layer has a first surface and a corresponding surface. The second side, and the base is located on the first side of the metal layer. Then, a part of the metal layer is removed to form at least one groove, wherein the groove is recessed on the second side of the metal layer, and the depth of the groove is slightly smaller than the thickness of the metal layer. Then, the substrate is removed, and a lower electrode layer is formed on the first surface of the metal layer. Next, a patterned piezoelectric layer is formed on the lower electrode layer, wherein the position of the piezoelectric layer corresponds to the position of the recess. Next, a patterned upper electrode layer is formed on the piezoelectric layer. Finally, an orifice plate is arranged on the second side of the metal layer, wherein the orifice plate forms an ink cavity with the metal layer, and the orifice plate has at least one orifice, which communicates with the ink cavity. Wherein, after removing the substrate, it further includes forming a passivation layer on the first surface of the first metal layer, and the material of the passivation layer includes a passive metal or an insulating material. The invention uses metal materials instead of conventional ceramic materials by means of electroplating and lithographic etching to form structures such as the vibration layer and ink cavity layer of an inkjet print head. Since metal has better thermal conductivity and ductility than ceramics, it can improve the phenomenon that the conventional inkjet print head is prone to stress damage when sintered at high temperature, thereby improving the yield of the finished product and the processing precision, thereby reducing manufacturing cost. In order to make the above-mentioned objects, features, and advantages of the present invention comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings for detailed description. For example, 7 papers are again applicable to the Chinese National Standard (CNS) A4 specification. (210 X 297 mm) ------------- (Please read the notes on the back before filling out this page) Order --------- Line «Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the employee consumer cooperative 499368 7825twf.doc / 0 1 2 A7 _B7_ V. Description of the invention (S) Below: Brief description of the drawing (please read the precautions on the back before filling this page) The first picture is a conventional pressure A schematic cross-sectional view of an electric inkjet print head; FIGS. 2A to 2D are cross-sectional flowcharts of a manufacturing process of a piezoelectric inkjet print head according to a preferred embodiment of the present invention; and FIGS. 3A to 3D are preferred views of the present invention. The first embodiment is a sectional flow chart of forming the metal layer in FIG. 2B; FIGS. 4A to 4D are the second sectional flow chart of forming the metal layer in FIG. 2B according to the preferred embodiment of the present invention; FIG. Is a schematic cross-sectional view of a piezoelectric inkjet print head with a passivation layer according to a preferred embodiment of the present invention. 100: Piezoelectric inkjet print head 102: upper electrode layer 104: piezoelectric layer 107: lower electrode layer 108: vibration layer 110: ink cavity layer 112: ink cavity bottom film 114: ink cavity 116: Ink outlet 200: Piezo inkjet print heads 202, 302, 402: Substrates 204, 304, 404: Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Metals Economy 205: First side 206: Second side 207 , 307, 407: first metal layer 208, 308, 408: second metal layer 210, 310, 410: groove 212: passive metal layer 214: piezoelectric layer 216: upper electrode layer 8 Standard (CNS) A4 (210 X 297 mm) ^ 9368 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (7) 7825twf.doc / 012 A7 ------- B7 218 Nozzle 220: Ink cavity 222 Nozzles 324, 424: Photoresist layer 526 Passive layer For a preferred embodiment, please refer to Figures 2A to 2D in sequence. It is a piezoelectric inkjet print head according to a preferred embodiment of the present invention. Process flow chart. First, as shown in FIG. 2A, a substrate 202 is provided. The material 202 is made of silicon, ceramic, metal, etc., and a metal layer 204 (metal layer) is formed on the substrate 202 by electroplating. Then, a part of the metal layer 204 is removed by photolithography and etching to form a groove 210. The groove 210 is recessed on the second surface 206 of the metal layer 204. Yes, the groove 210 is formed by half etching, so it does not completely penetrate the metal layer 204, so that the depth of the groove 210 is slightly smaller than the thickness of the metal layer 204, and the metal layer 204 is divided into A first metal layer 207 and a second metal layer 208. Among them, the function of the first metal layer 207 is the same as that of the vibrating layer 108 of the first FIG. 1, and the groove 210 formed by the first metal layer 207 and the second metal layer 208 is the ink cavity 114 of the first FIG. Part of the structure. As shown in FIG. 2B, the substrate 202 is removed, and the metal layer 204 having the grooves 21 remains. Afterwards, as shown in FIG. 2C, a lower electrode layer 212 (lower electrode layer) is formed on the first surface 205 of the metal layer 204 in the form of electricity mining, wherein the material of the lower electrode layer 212 is, for example, 9 paper sizes Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) ------------- (Please read the notes on the back before filling this page) Order ----- Line « Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 499368 7825twf.doc / 0 1 2 B7 V. Description of the invention (not) It is a metal with good conductivity. Then, a patterned piezoelectric layer 214 is formed on the lower electrode layer 212 by screen printing, and the patterned piezoelectric layer 214 is positioned corresponding to the groove 210. s position. It should be noted that the material of the piezoelectric layer 214 is usually a piezoelectric ceramic, and the piezoelectric layer 214 on the first screen printing is a ceramic thick green tape, which must be subjected to high temperature. Sintering to transform the ceramic thick-film embryo into a piezoelectric ceramic. The material of the piezoelectric layer 214 includes lead zirconate titanate (PZT) or piezoelectric polymer, and the piezoelectric polymer includes Poly (Vinylidene Fluoride) (PVDF). After completing the structure shown in FIG. 2C, as shown in FIG. 2D, a patterned upper electrode layer 216 (uppei · electrode layer) is formed on the piezoelectric layer 214 by screen printing. The material of the upper electrode layer 216 is, for example, a metal with good conductivity, and the position of the upper electrode layer 216 corresponds to the position of the piezoelectric layer 214. Then, a nozzle plate 218 is disposed on the second surface 206 of the metal layer 204 in a laminating manner. The nozzle plate 218 closes the groove 21 shown in FIG. 2C. 〇 opening, and the first metal layer 207 and the second metal layer 208 constitute a closed cavity structure of the ink chamber 22 (pressure chamber), and the nozzle plate 218 further has one to several nozzle holes 222 (nozzle), They are respectively communicated with the ink chamber 220 and are used as the inlet and outlet of the ink. Finally, the production of the piezoelectric inkjet print head 200 is completed. It should be noted that if the piezoelectric layer 214 is made of piezoelectric ceramics and high-temperature sintering is required, since the orifice plate 218 is formed after the piezoelectric layer 214 is sintered at high temperature, it is first configured and attached to the metal layer 204. Therefore, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male f) ----------------- 1 --- order -------- -Line (please read the precautions on the back before filling this page) 499368 7825twf.doc / 012 A7 B7 V. Description of the invention (?) The material of the orifice 218 does not need to be a high temperature resistant material, but can be made of metal or polymer (Polymer) materials. (Please read the precautions on the back before filling this page) The first method of forming the metal layer 204 with the groove 210 in FIG. 2B according to the preferred embodiment of the present invention is as follows. Please refer to FIGS. 3A to 3D in order. It is a cross-sectional flow chart of forming the metal layer 204 of FIG. 2B in the first embodiment of the present invention. As shown in FIG. 3A, a substrate 30 is first provided, and a first metal layer 307 is formed on the substrate 302 by electroplating. As shown in FIG. 3B, a patterned photoresist layer 324 is formed on the first metal layer 307 by exposure and development. The thickness and distribution area of the photoresist layer 324 are respectively the same as those in the previous FIG. 2B. The grooves 210 have the same depth and distribution area. Next, as shown in FIG. 3C, a second metal layer 308 is formed on the first metal layer 307 in the manner of electricity mining. After that, the substrate 302 and the patterned photoresist layer 324 are removed to form a metal layer 304 having a groove 310 as shown in FIG. 3D, which has the same structure as the metal layer 204 of the previous FIG. 2B. The consumer property cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the second method of forming the metal layer 204 with the groove 210 in FIG. 2B of the preferred embodiment of the present invention. Please refer to FIGS. 4A to 4D in order. The second embodiment of the present invention is a cross-sectional flowchart of forming the metal layer 204 of FIG. 2B. As shown in FIG. 4A, a substrate 302 is first provided, and a metal layer 404 is formed on the substrate 402 by electroplating. Next, as shown in FIG. 4B, a patterned photoresist layer 424 is formed on the metal layer 404 in a manner of exposure and development, where the patterning is performed; ^ the position of the photoresist layer 424 corresponds to the previous FIG. 2B The position of the groove 210 of the second metal layer 208. Next, as shown in Figure 3C, the etched paper size is then applied to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 499368 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 7825twf.doc / 0 1 2 A7 B7 5. In the (π) method, part of the metal layer 404 is removed facing the direction of the substrate 402, so that the metal layer 404 is divided into a first metal layer 407 and a second metal layer 408. After that, the substrate 402 and the photoresist layer 424 are removed to form a metal layer 404 having a groove 410 as shown in FIG. 4D, which has the same structure as the metal layer 204 of the previous FIG. 2B. Please refer to Figure 2D. When the piezoelectric layer 214 is made of piezoelectric ceramic and high temperature sintering is required, in order to avoid melting the metal layer 204 during high temperature sintering, the material of the metal layer 204 must be selected to have a melting point greater than 800 ° C. Metal. In addition, when the metal layer 204 is formed by electroplating, the residual stress inside the metal layer 204 is liable to cause structural stress damage. Therefore, the material of the metal layer 204 needs to be selected from metals with low residual stress after plating and good ductility. Therefore, the material of the metal layer 204 may include metals such as nickel (Ni), copper (Ci0, palladium (Pd), and alloys thereof), or other conductive materials. Please also refer to FIG. 2D. When the material of the piezoelectric layer 214 is used When high temperature sintering is required for piezoelectric ceramics, in order to avoid the chemical reaction between the piezoelectric layer 214 and the metal layer 204 under high temperature environment, thereby destroying the piezoelectric characteristics of the piezoelectric ceramic, the lower electrode layer 212 The material can be a passive metal to separate the metal layer 204 and the piezoelectric layer 214, and to prevent the lower electrode layer 212 from melting during high temperature sintering, its melting point must also be greater than 800 ° C. Therefore, the material of the lower electrode layer 212 is It may include metals such as gold (Au), silver (Ag), copper (Cu), rhenium (Pt), palladium (Pd), alloys thereof, or other conductive materials. Please refer to FIG. 5, which is a comparison of the present invention. A schematic cross-sectional view of a piezoelectric inkjet print head with a passivation layer in a preferred embodiment. Similarly, in order to avoid the application of the Chinese National Standard (CNS) A4 specification (210 X 297 mm) for this paper size ------- ------------ Order ------- 丨 -Line 1 (Please read the notes on the back first (Fill in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 499368 7825twf.doc / 0 1 2 A7 B7 V. Description of the Invention (//) When the piezoelectric layer 214 passes through the lower electrode layer 212 and sinters with the metal at high temperature The layer 204 reacts. Therefore, after the metal layer 204 is formed, it further includes forming a passivation layer 526 on the metal layer 204 and interposed between the lower electrode layer 212 and the metal layer 204 to avoid the piezoelectric layer 214 from When sintering at high temperature, it passes through the lower electrode layer 212 and reacts with the metal layer 204. The material of the passivation layer 526 includes inert metal, such as metals such as gold, silver, copper, cobalt, pins, and alloys thereof. The material of the passivation layer 526 may also include insulating materials, such as silicon nitride, silicon oxide, and oxide. According to the features of the present invention, the present invention replaces the conventional ceramic material with a metal to form a recessed material. The metal layer of the groove replaces the conventional vibration layer and ink cavity layer and reduces the use of ceramic materials. Since the metal's thermal conductivity and ductility are better than ceramics, it can improve the performance of inkjet print heads when ceramics are sintered at high temperatures. According to the characteristics of the present invention, the present invention is to produce the ink cavity structure of an inkjet print head by electroplating and lithographic etching, so its dimensional accuracy will be much greater than that of conventional ceramic thick film alignment. Dimensional precision after lamination and high temperature sintering, so the process of the present invention will further increase the density of the inkjet print head to improve the resolution of inkjet printing. According to the characteristics of the present invention, the present invention is blunt Metal is used as the material of the lower electrode layer to avoid chemical changes between the metal layer and the piezoelectric layer during sintering at high temperature, thereby affecting the piezoelectric characteristics of the piezoelectric layer. According to the features of the present invention, the present invention is to form a passivation layer between the lower electrode layer and the metal layer to prevent the piezoelectric layer from passing through the lower electrode layer and chemically changing with the metal layer during sintering at high temperature, thereby affecting Piezoelectric layer (please read the precautions on the back before filling this page). • • • The paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed 499368 7825twf.doc / 012 A7-B7 V. Description of the invention (/ ^) The proper piezoelectric characteristics.
綜上所述，本發明之壓電式噴墨印頭之製程具有下 列優點： A (1) 本發明之壓電式噴墨印頭之製程，其係以金M 取代習知之陶瓷材料，以減少陶瓷材料的使用，由於金屬 之導熱性及延展性均優於陶瓷，故可改善陶瓷於高溫燒結 時，噴墨印頭之內部結構發生應力破壞的現象。 (2) 本發明之壓電式噴墨印頭之製程，其係以電鍍 及微影蝕刻的方式製作噴墨印頭之墨水腔結構，故其精密 度將高於習知以陶瓷厚膜對位壓合及高溫燒結後之墨水腔 結構的精密度，也因此可以進一步縮短兩相鄰出墨口之間 的距離，以提高噴墨列印之解析度。 (3) 本發明之壓電式噴墨印頭之製程，其係以電鍍 的方式形成金屬層，由於金屬層之電鍍成本遠低於習知之 陶瓷材料的對位壓合及高溫燒結的成本，故可降低成品之 製造成本。 雖然本發明已以一較佳實施例揭露如上，然其並非 用以限定本發明，任何熟習此技藝者，在不脫離本發明之 精神和範圍內，當可作些許之更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範圍所界定者爲準。 14 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂-------！線|^ (請先閱讀背面之注意事項再填寫本頁)In summary, the manufacturing process of the piezoelectric inkjet printhead of the present invention has the following advantages: A (1) The manufacturing process of the piezoelectric inkjet printhead of the present invention is to replace the conventional ceramic material with gold M to Reduce the use of ceramic materials. Since the thermal conductivity and ductility of metals are better than that of ceramics, the phenomenon of stress damage to the internal structure of inkjet print heads can be improved when ceramics are sintered at high temperatures. (2) The manufacturing process of the piezoelectric inkjet print head of the present invention is to make the ink cavity structure of the inkjet print head by electroplating and lithographic etching, so its precision will be higher than that of the conventional ceramic thick film pair. The precision of the ink cavity structure after bit compression and high temperature sintering can also further shorten the distance between two adjacent ink outlets to improve the resolution of inkjet printing. (3) The manufacturing process of the piezoelectric inkjet print head of the present invention is to form a metal layer by electroplating. Since the cost of electroplating of the metal layer is much lower than the cost of registration and high temperature sintering of conventional ceramic materials, Therefore, the manufacturing cost of the finished product can be reduced. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application. 14 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -------------------- Order ------------! Thread | ^ (Please read the notes on the back before filling this page)