經濟部智慧財產局員工消費合作社印製 503182 6394twf.doc/008 ~麵丨—- — .,,,,,, __ 五、發明說明（丨） 本發明是關於一種壓電式噴墨頭之側進口製造方法， 特別是關於一種利用微影顯影技術來製作噴墨頭之墨水腔 與噴嘴的方法。 傳統噴墨列印技術之主要運作原理分爲兩類：熱泡式 (Thermal bubble)噴墨列印技術及壓電式(piez〇electric)噴墨 列印技術。熱泡式噴墨列印技術乃利用加熱器將墨水瞬間 氣化，產生高壓氣泡推動墨水由噴嘴射出；此型由於製造 成本低，業己由HP及CANON成功地商業化，產生世界 上非常大的噴墨印表機市埸；但由於其高溫氣化之運作原 理使得適用墨水（主要是水系溶劑）之選擇性低，因而衍伸 之應用領域有限。 壓電式噴墨列印技術係利用壓電致動片因施加電壓產 生形變’擠壓液體產生高壓而將液體噴出。相對於熱泡式 噴墨列印技術，壓電式噴墨列印技術具有下列優點：壓電 式噴墨列印技術之墨水不會因爲高溫氣化產生化學變化， 影響顏色品質之狀況；且由於不需使用反覆高熱應力，故 具有極佳的耐久性。壓電式噴墨列印技術所使用之壓電陶 瓷反應速度快，可提升列印速度，而熱泡式噴墨列印技術 則會受到熱傳導速度之限制。壓電式噴墨列印技術容易控 制液滴之大小’可提升列印品質。 第1A圖爲習知一個傳統壓電式噴墨頭之側面結構 圖。傳統噴墨頭的製造流程是利用陶瓷厚膜製程如刮刀成 形和網版印刷等方式先個別製造出具有上電極層111、下 電極層121、壓電致動片層112和陶瓷層122(Ceramic)的 3 -------------^---II--— -Ί — j (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 503182 6394twf.doc/008 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（> ) 壓電致動片（Actuator)、墨腔壁103、與墨腔底膜104等 陶瓷生胚材料（Green Tape)，再依照一定之模組順序將每 層厚膜生胚對準之後黏著在一起進行陶瓷結構的燒結。例 如EPSON公司所出之壓電式噴墨頭。 第1B圖爲該傳統壓電式噴墨頭之俯視結構圖。該圖 說明一種傳統噴墨頭之透明俯視圖，其中墨水腔107爲儲 存了自進墨口 105吸取至墨水腔107之墨水，墨水腔107 中之墨水可以藉由壓電致動片層之變形，將墨水由出墨口 106噴出。 在上述方法中，由於噴墨頭製程中所有的元件結構均 利用陶瓷厚膜製程分別製造完成之後，再進行對位壓合黏 結。由於噴墨頭的尺寸相當小，要求的精密度非常高，因 此這種對位壓合組裝非常不容易，致使不良率提升，並增 加製程時間和製造成本。 而且在對位壓合組裝完畢之後必須進行陶瓷結構的燒 結，由於噴墨頭的結構複雜，在燒結的時候往往會因爲陶 瓷收縮不均勻而造成應力破壞，因此產品的良率很低。 另外傳統之進墨口皆位於噴墨頭之下方，導致噴墨頭 下方必須有一儲墨區，以提供噴墨時墨水之來源。當噴墨 頭之進墨口的毛細現象吸不起墨水時，所殘餘之墨水量與 儲墨區之大小成正比，此區愈大則殘餘墨水愈多；且噴嘴 與出墨口之距離與此區之大小也成正比，此區愈大則噴嘴 愈容易阻塞。 本發明的目的是提供一種直接對位成形的方法來取代 ti — (請先閱讀背面之注意事項再填寫本頁) 訂· --線. 503182 6394twf.doc/008 A7 B7 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 五、發明說明（>；) 上述利用陶瓷厚膜壓合黏結的方法，並去除上述陶瓷結構 燒結的步驟。以解決組裝不易及燒結所造成的應力破壞問 題，使得產品良率提升，簡化製程並降低製作成本。 另外一個目的則在提供一種新的進墨口位置之設計’ 取代傳統進墨口的位置。如此可以解決噴嘴阻塞與殘餘墨 水量的問題，增加噴墨頭之使用壽命。 根據本發明之上述目的，提出一種壓電式噴墨頭之側 進口製程，首先提供一基底，並於基底中形成一個貫穿基 底之開口，其中基底之材質包括矽晶片、陶瓷片或金屬片。 接著於基底之上形成一層第一感光性高分子膜，並在第一 感光性高分子膜中形成具有多個出墨口之墨腔底膜。接著 依序形成一層或一層以上的感光性高分子膜於墨腔底膜之 上，並定義出墨腔壁圖案與進墨口圖案，而形成具多個墨 水腔與多個進墨口之墨腔壁。最後將對正好電極位置的壓 電陶瓷致動片黏著於墨腔壁頂上，以製得噴墨頭。依本發 明之方法，逐步成形製得噴墨頭，可達到提升成品的良率、 增加噴墨頭使用壽命、降低製程之時間與製作成本之目 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 式之簡單說明 第1A圖繪示一種傳統壓電式噴墨頭之側面結構示意 圖。Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 503182 6394twf.doc / 008 ~ face 丨 ——- —. ,,,,,, __ V. Description of the Invention (丨) The present invention relates to a side of a piezoelectric inkjet head Imported manufacturing method, in particular, a method for making ink cavity and nozzle of inkjet head by lithography development technology. The main operating principles of traditional inkjet printing technology are divided into two categories: thermal bubble inkjet printing technology and piezoelectric (piez〇electric) inkjet printing technology. Thermal bubble inkjet printing technology uses a heater to instantaneously vaporize the ink, which generates high-pressure bubbles to push the ink out of the nozzle. This type has been successfully commercialized by HP and CANON due to its low manufacturing cost, resulting in a very large world Of inkjet printers; however, due to its high temperature gasification operation principle, the selectivity of applicable inks (mainly water-based solvents) is low, so its application fields are limited. Piezoelectric inkjet printing technology uses a piezoelectric actuator to deform the applied voltage to produce a 'squeeze liquid' which generates high pressure and ejects the liquid. Compared with the thermal bubble inkjet printing technology, the piezoelectric inkjet printing technology has the following advantages: the ink of the piezoelectric inkjet printing technology does not cause chemical changes due to high temperature gasification, and affects the color quality; and Because it does not need to use repeated high thermal stress, it has excellent durability. Piezoelectric ceramics used in piezoelectric inkjet printing technology have fast response speeds, which can increase printing speed, while thermal bubble inkjet printing technology is limited by the speed of heat conduction. Piezo inkjet printing technology is easy to control the size of the droplets', which can improve the printing quality. Fig. 1A is a side structural view of a conventional piezoelectric inkjet head. The traditional inkjet head manufacturing process uses ceramic thick film processes such as doctor blade forming and screen printing to first individually manufacture the upper electrode layer 111, the lower electrode layer 121, the piezoelectric actuator sheet layer 112, and the ceramic layer 122 (Ceramic ) 3 ------------- ^ --- II ---- -Ί — j (Please read the notes on the back before filling out this page) This paper size applies to the Chinese National Standard (CNS ) A4 specifications (210 X 297 public love) 503182 6394twf.doc / 008 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (>) Piezoactuator (Actuator), ink chamber wall 103, It is aligned with ceramic green materials such as the ink chamber bottom film 104, etc., and then each layer of thick film green embryos is aligned according to a certain module order, and then adhered together to sinter the ceramic structure. For example, a piezoelectric inkjet head from EPSON. FIG. 1B is a top structural view of the conventional piezoelectric inkjet head. This figure illustrates a transparent top view of a conventional inkjet head, in which the ink chamber 107 stores the ink sucked from the ink inlet 105 to the ink chamber 107. The ink in the ink chamber 107 can be deformed by the piezoelectric actuated sheet. The ink is ejected from the ink outlet 106. In the above method, since all the element structures in the inkjet head manufacturing process are separately manufactured by the ceramic thick film manufacturing process, the alignment compression bonding is performed. Because the size of the inkjet head is relatively small, the required precision is very high, so this kind of alignment press-fit assembly is very difficult, which leads to an increase in the defective rate, and increases the process time and manufacturing cost. Moreover, the ceramic structure must be sintered after the alignment compression assembly is completed. Due to the complicated structure of the inkjet head, stress failure is often caused by uneven shrinkage of the ceramic during sintering, so the product yield is very low. In addition, the traditional ink inlets are located below the inkjet head, which results in an ink storage area under the inkjet head to provide the source of ink during inkjet. When the capillary of the ink inlet of the inkjet head cannot absorb the ink, the amount of residual ink is proportional to the size of the ink storage area. The larger the area, the more ink remains; and the distance between the nozzle and the ink outlet is The size of this area is also proportional. The larger the area, the easier the nozzle is blocked. The purpose of the present invention is to provide a method of direct alignment forming to replace ti — (please read the precautions on the back before filling this page) order.-Line. 503182 6394twf.doc / 008 A7 B7 Employees of the Ministry of Economic Affairs and Intellectual Property Printed by Consumer Cooperatives 5. Description of the invention (>) The above method of using ceramic thick film pressure bonding and removing the above-mentioned steps of sintering the ceramic structure. In order to solve the problem of difficult assembly and stress damage caused by sintering, the product yield is improved, the manufacturing process is simplified, and the manufacturing cost is reduced. Another purpose is to provide a new design of the ink inlet position 'to replace the position of the traditional ink inlet. This can solve the problems of nozzle clogging and residual ink volume, and increase the life of the inkjet head. According to the above object of the present invention, a side inlet process of a piezoelectric inkjet head is proposed. First, a substrate is provided, and an opening penetrating the substrate is formed in the substrate. The material of the substrate includes a silicon wafer, a ceramic sheet, or a metal sheet. Next, a first photosensitive polymer film is formed on the substrate, and an ink cavity bottom film having a plurality of ink outlets is formed in the first photosensitive polymer film. Then, one or more photosensitive polymer films are sequentially formed on the bottom film of the ink chamber, and the ink chamber wall pattern and the ink inlet port pattern are defined, so as to form an ink with multiple ink chambers and multiple ink inlet ports. Cavity wall. Finally, the piezoelectric ceramic actuating sheet at the right electrode position is adhered to the top of the ink chamber wall to prepare an inkjet head. According to the method of the present invention, the inkjet head is formed by step forming, which can improve the yield of the finished product, increase the life of the inkjet head, reduce the process time and production cost. The advantages and advantages can be more clearly understood. The following is a detailed description of a preferred embodiment and the accompanying drawings. The brief description of the formula is shown in Figure 1A, which is a schematic diagram of the side structure of a conventional piezoelectric inkjet head. .
^ .-.1.,... ..-.1 -I··. ^ ^ ^ (請先閲讀背面之注意事項再填寫本頁) n I la — 線 1·----------------------- 503182 6394twf.doc/008 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（0 ) 第1B圖繪示一種傳統壓電式噴墨頭之俯視結構示意 圖。 第2圖繪示一種依照本發明之一較佳實施例的壓電式 噴墨頭之側進口製程結構示意圖。 第3圖繪示一種依照本發明之一較佳實施例的壓電式 噴墨頭之墨腔壁與進墨口的製程結構示意圖。 第4圖繪示一種依照本發明之一較佳實施例的壓電式 噴墨頭之側面結構示意圖。 第5圖繪示一種依照本發明之一較佳實施例的壓電式 噴墨頭之立體結構示意圖。 圖式之標記說明 200 :視角方向 111，211 :上電極層 121、221 :下電極層 112、212 :壓電致動片層 122 :陶瓷層 222 :壓電陶瓷致動片 103，213，223，233、243 :墨腔壁 104，204 :墨腔底膜 105，205 :進墨口 106，206 :出墨口 107，207 :墨水腔 209 ··開口 300 :基底 6 (請先閱讀背面之注意事項再填寫本頁) .¾ ;線- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 503182 A7 B7 6394twf.doc/008 五、發明說明（<) 實施例 參照第2圖所示，其繪示一種依照本發明一較佳實施 例的壓電式噴墨頭之製程結構示意圖。首先，在該基底 300(如矽晶片或陶瓷片）上，利用蝕刻或其他方式，形成一 個貫穿基底300之開口 209，開口 209之形式包括矩型溝 渠，其尺寸大小視情形而定。 接著，於基底300之上形成一層第一感光性高分子薄 膜，利用曝光顯影的方式於第一感光性高分子薄膜中形成 具有多個出墨口 206之墨腔底膜204，其中出墨口 206之 口徑範圍包括10# m至200 μ m左右。 接著，再形成一層或一層以上的第二感光性高分子薄 膜於墨腔底膜204之上，之後利用曝光顯影的方式在第二 感光性高分子薄膜中形成具有多個墨水腔207與多個進墨 口 205之墨腔壁243。其中每一個墨水腔207之底部係由 至少具有一個出墨口 206之部分墨腔底膜204所構成，每 一個墨水腔207之四周邊壁爲至少具有一個進墨口 205之 墨腔壁203所構成。每一個墨水腔207的進墨口 205與出 墨口 206之數目可爲一個或一個以上，且進墨口 205可位 於第一感光高分子薄膜中或第二感光高分子薄膜中。 請參照第3圖，其繪示一種依照本發明之一較佳實施 例的壓電式噴墨頭之墨腔壁與進墨口的製程結構示意圖。 墨腔壁243之形成方法分成三階段，第一階段，先於墨腔 底膜204之上形成第二感光性高分子薄膜，之後，利用曝 光顯影的方式定義出墨腔壁圖案後形成墨腔壁213。 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公楚） ! I — I I t — ！ (請先閱讀背面之注意事項再填寫本頁)^ .-. 1., ... ..-. 1 -I ··. ^ ^ ^ (Please read the notes on the back before filling this page) n I la — Line 1 · ------- ---------------- 503182 6394twf.doc / 008 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (0) Figure 1B shows a traditional piezoelectric Schematic plan view of the inkjet head. FIG. 2 is a schematic structural diagram of a side inlet process of a piezoelectric inkjet head according to a preferred embodiment of the present invention. FIG. 3 is a schematic diagram showing a manufacturing process structure of an ink cavity wall and an ink inlet of a piezoelectric inkjet head according to a preferred embodiment of the present invention. FIG. 4 is a schematic side structural view of a piezoelectric inkjet head according to a preferred embodiment of the present invention. FIG. 5 is a schematic diagram of the three-dimensional structure of a piezoelectric inkjet head according to a preferred embodiment of the present invention. Explanation of the marks in the drawings 200: Viewing directions 111, 211: Upper electrode layers 121, 221: Lower electrode layers 112, 212: Piezoelectric actuator sheet layer 122: Ceramic layer 222: Piezoelectric ceramic actuator sheet 103, 213, 223 , 233, 243: Ink cavity wall 104, 204: Ink cavity bottom film 105, 205: Ink inlet port 106, 206: Ink outlet port 107, 207: Ink cavity 209 ·· Opening 300: Base 6 (Please read the Note: Please fill in this page again.); ¾; Line-This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 503182 A7 B7 6394twf.doc / 008 5. Description of the invention (<) Reference to the examples FIG. 2 is a schematic diagram showing a process structure of a piezoelectric inkjet head according to a preferred embodiment of the present invention. First, on the substrate 300 (such as a silicon wafer or a ceramic wafer), an opening 209 penetrating the substrate 300 is formed by etching or other methods. The form of the opening 209 includes a rectangular trench, and its size depends on the situation. Next, a layer of a first photosensitive polymer film is formed on the substrate 300, and an ink cavity bottom film 204 having a plurality of ink outlets 206 is formed in the first photosensitive polymer film by way of exposure and development, wherein the ink outlets The diameter range of 206 includes 10 # m to 200 μm. Next, one or more second photosensitive polymer films are formed on the ink chamber bottom film 204, and then a plurality of ink chambers 207 and a plurality of ink chambers 207 are formed in the second photosensitive polymer film by exposure and development. The ink chamber wall 243 of the ink inlet 205. The bottom of each of the ink chambers 207 is composed of a part of the ink chamber bottom film 204 having at least one ink outlet 206. The four peripheral walls of each ink chamber 207 are the ink chamber walls 203 having at least one ink inlet 205. Make up. The number of the ink inlet 205 and the ink outlet 206 of each ink chamber 207 may be one or more, and the ink inlet 205 may be located in the first photosensitive polymer film or the second photosensitive polymer film. Please refer to FIG. 3, which shows a schematic structural diagram of a process of an ink chamber wall and an ink inlet of a piezoelectric inkjet head according to a preferred embodiment of the present invention. The method of forming the ink chamber wall 243 is divided into three stages. In the first stage, a second photosensitive polymer film is formed on the ink chamber bottom film 204, and then the ink chamber wall pattern is defined by exposure and development to form the ink chamber.壁 213. 7 This paper size applies to China National Standard (CNS) A4 (210 X 297 cm)! I — I I t —! (Please read the notes on the back before filling this page)
1T 經濟部智慧財產局員工消費合作社印製 503182 A7 B7 6394twf.doc/008 五、發明說明（& ) (請先閱讀背面之注意事項再填寫本頁) 第二階段，於墨腔壁213之上接著形成第三感光性高 分子薄膜，之後，利用曝光顯影的方式定義出墨腔壁圖案 與進墨口圖案後，而形成墨腔壁223與多個進墨口 205。 第三階段，最後於墨腔壁223之上形成第四感光性高 分子薄膜，之後，利用曝光顯影的方式定義出墨腔壁圖案 而形成一墨腔壁233。墨腔壁243即由墨腔壁213、223與 233等三層墨腔壁所組成。 最後，在參考第2圖，於墨腔壁243之頂部形成具有 電極圖案的壓電陶瓷致動片層222,其中壓電陶瓷致動片 層222包括有上電極211、壓電致動片層212與下電極221， 壓電陶瓷致動片層222上的每一個上電極211與每一個下 電極221之位置與每一個墨水腔207相對應。 ··線· 參照第4圖所示，其繪示依照本發明之一較佳實施例 的壓電式噴墨頭之側面結構示意圖。另參照第5圖所示， 其繪示依照本發明之一較佳實施例的壓電式噴墨頭之立體 結構示意圖。由第4圖與第5圖可以更淸楚詳細的明白本 發明所製備之噴墨頭成型後之外觀，及噴墨頭之各元件相 對位置。 經濟部智慧財產局員工消費合作社印製 另外本發明在實施時亦可以直接利用壓電致動片作爲 基底材料，並將出墨口 206形成於最後黏結於墨腔壁上之 感光高分子薄膜上，以進一步省略開口基底的使用及簡化 製程。 另外在本發明中所使用之感光性高分子膜之材質包括 乾膜光阻、液態光阻、正光阻、負光阻、感光性之聚醯亞 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 503182 6394twf.doc/008 A7 B7 五、發明說明（9) 胺（Polyimide)或感光性之環氧樹脂（Epoxy)。感光性高 分子膜在曝光前之厚度包括10/im至500//m左右。 另外，液態光阻，爲一具有「可流動性」之液態感光 性高分子，使用時利用塗佈方式形成於基底30或墨腔底 膜24之上，之後硬化成形，再利用曝光顯影方式形成所 需要的圖案。 由上述本發明較佳實施例可知，本發明具有以下之特 徵：由於製程中墨腔底膜、墨腔壁、進墨口等皆以微影顯 影之方式持續製得，其製程時間將比傳統之製程時間迅 速，且所使用之設備成本與人力成本將會明顯的降低，而 成品的良率與噴嘴之使用壽命亦能有所提升。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍內，當可作各種之更動與潤飾。 經濟部智慧財產局員工消費合作社印製 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） • n n n ma§ n n n -ϋ Βϋ n ·ϋ · n ttn n 1 ϋ ϋ mm— 如吞，· an n _ n I 1 1 I n mmmf i-i -a— imm an i·— n n ϋ n n mmwB n MB— n n «_1 mtw ϋ n _ϋ μη· (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 503182 A7 B7 6394twf.doc / 008 V. & Description of Invention (Please read the notes on the back before filling this page) The second stage, A third photosensitive polymer film is formed next, and then the ink chamber wall pattern and the ink inlet port pattern are defined by exposure and development, and then the ink chamber wall 223 and the plurality of ink inlet ports 205 are formed. In the third stage, a fourth photosensitive polymer film is finally formed on the ink chamber wall 223, and then an ink chamber wall pattern is defined by exposure and development to form an ink chamber wall 233. The ink chamber wall 243 is composed of ink chamber walls 213, 223, and 233. Finally, in reference to FIG. 2, a piezoelectric ceramic actuator sheet 222 having an electrode pattern is formed on the top of the ink chamber wall 243. The piezoelectric ceramic actuator sheet 222 includes an upper electrode 211 and a piezoelectric actuator sheet. The positions of 212 and the lower electrode 221, and each of the upper electrode 211 and each of the lower electrode 221 on the piezoelectric ceramic actuation sheet layer 222 correspond to each of the ink chambers 207. ·· Line · Refer to FIG. 4, which is a schematic diagram showing a side structure of a piezoelectric ink jet head according to a preferred embodiment of the present invention. Referring also to FIG. 5, a three-dimensional structure diagram of a piezoelectric inkjet head according to a preferred embodiment of the present invention is shown. From Figures 4 and 5, the appearance of the inkjet head prepared by the present invention after molding, and the relative positions of the components of the inkjet head can be more clearly understood in detail. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, in the implementation of the present invention, a piezoelectric actuator can be directly used as a base material, and the ink outlet 206 is formed on a photosensitive polymer film finally adhered to the wall of the ink cavity. In order to further omit the use of open substrates and simplify the manufacturing process. In addition, the materials of the photosensitive polymer film used in the present invention include dry film photoresist, liquid photoresist, positive photoresist, negative photoresist, and photosensitive polyurea. 8 This paper size is applicable to Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) 503182 6394twf.doc / 008 A7 B7 V. Description of the invention (9) Polyimide or photosensitive epoxy resin. The thickness of the photosensitive high molecular film before exposure includes about 10 / im to 500 // m. In addition, the liquid photoresist is a liquid photosensitive polymer with "flowability". It is formed on the substrate 30 or the ink chamber bottom film 24 by a coating method during use, and then hardened and formed by exposure and development. Desired pattern. It can be known from the above-mentioned preferred embodiments of the present invention that the present invention has the following characteristics: Since the ink chamber bottom film, the ink chamber wall, and the ink inlet are continuously produced by lithography during the manufacturing process, the process time will be longer than that of the traditional process. The process time is fast, and the cost of equipment and labor will be significantly reduced, and the yield of the finished product and the service life of the nozzle can be improved. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present invention. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 9 This paper is sized according to the Chinese National Standard (CNS) A4 (210 X 297 mm) • nnn ma§ nnn -ϋ Βϋ n · ϋ · n ttn n 1 ϋ ϋ mm— If swallowed, · an n _ n I 1 1 I n mmmf ii -a— imm an i · — nn ϋ nn mmwB n MB— nn «_1 mtw ϋ n _ϋ μη · (Please read the precautions on the back before filling in this page)