五、發明說明（1) 本發明係有關於焊料，尤其是無錯的焊料，其包 ，：比例之錫、銀、銦及鉍，且焊料也可以包含一定比例 :錯添加物’再者’本發明之焊料特別適用於波浪形焊 接過程，進而可以直接取代傳統的錫/鉛焊料。 按’許多傳統的坪料以錯為主要的成分，這類 ί:具有不錯的；理特質’許多工業都廣泛地使用含錯的 包括印刷電路板的生產’例如含有錫6 3%與錯 以的焊料，就普遍用於波浪型焊接過程，然而，輝料 曰益增加’但在基於環境的考量等，未來 無錯的法律要求。 h項目，將訂定含少量或 焊料焊料的嘗試上，其傳統的無錯 動,L :! 特質’包括不良的潮濕特質、流 在使用益=戶rt相容性不佳、且浮潰過多等缺失，而 路的特定問題是焊縫突起，在印刷電 料分離m’焊接的焊縫會與鎳，金塗料等底部材 成銅會從與焊料接觸的烫έ 手化问而仏 再者，紫去ϊ: 電路板滲入無鉛焊料。 接納無錯焊料的使ί之必須作一大幅的調整，以 的# Γ = 能必須要更換，以便相容於益鉛烊料 ，尤其是使的，整廣泛被視為資源的不良使用 低於使用傳統含鉛焊料。 丁子逋^遢 第4頁 498009 五、發明說明（2) 本發明之主要目的是提供一種更能直接取代傳統鉛銲 錫的無鉛焊料，係由無鉛的合金所組成，包含特定比例之 錫、鉍、銦、銀，以及一定比例之接近或完全無鉛之添加 物’相較於已知的無斜焊料，具有大幅改善的特質，換古 之，本發明的無鉛焊料特質，不論在潮濕性、流動性、與 現有零組件塗料的相谷性、焊縫突起、銅溶解度與浮、、杳上 ’幾乎可以與傳統的含鉛焊料相比擬，且更加符合焊&制 作標準之環保需求，達到大幅提升無鉛焊料特性，2衣 只。 、便用效 本創作之另一目的係在於提供一種無錯焊料， 像使用其他無鉛焊料一樣，必須更換現有機械 ' 萝=必需 組件塗料，製造商的設施轉換成使用無鉛焊料的^ ^或= 比預期中更簡單與經濟可行。 ^裎，遠 本創作之又一目的係在於提供一種無鉛烊料， 造的物品標準不必低於使用傳統含錯焊料。,、其所製 為使貴審查委員對本案之結構、功效作更進一來 ，茲舉一較佳實施例並配合圖式，詳述如后：v之瞭解 雖然本創作將以下列之較佳實施例做^細 並不意指限定本創作於本實施例中。 、^月，但是 因此’本發明的技術層面中，提供由以 的無鉛焊料：87 2%至89 5%的錫；4 〇%至4 分所組成 至4 · 5 %的銦；3. 〇 %至3 · 5 %的銀。 、站，3 · 5 % 但本發明之 而車又佳的焊料大致上均以接近無鉛為主 焊料，則可以做到完全無鉛。V. Description of the invention (1) The present invention relates to solder, especially error-free solder, which includes: proportions of tin, silver, indium, and bismuth, and the solder may also contain a certain proportion: the wrong additive 'More' The solder of the present invention is particularly suitable for wave-shaped soldering processes, and can directly replace the traditional tin / lead solder. According to 'many traditional flat materials use fault as the main ingredient, this type of ‚: has good; rational characteristics' Many industries have widely used error-containing production including printed circuit boards', such as containing tin 63% The solder is generally used in the wave-type soldering process. However, the brightness of the solder increases, but in the environmental considerations, etc., there are no wrong legal requirements in the future. h project, will try to set a small amount of solder or solder, the traditional no-fault, L :! traits' including poor wet traits, flow benefits = poor user compatibility, and excessive floatation And other problems, and the specific problem of the road is the welding seam protrusion. In the separation of printed electrical materials, the welding seam of m 'welding will be made of copper, nickel, gold paint and other bottom materials. , Purple go: The circuit board is impregnated with lead-free solder. The acceptance of error-free solders must be significantly adjusted so that # Γ = must be replaced in order to be compatible with the beneficial lead materials, especially the whole, which is widely regarded as the poor use of resources below Use traditional leaded solder.丁 子 逋 ^ 遢 Page 4 498009 V. Description of the invention (2) The main purpose of the present invention is to provide a lead-free solder that can directly replace the traditional lead solder. It is composed of a lead-free alloy and contains a specific proportion of tin, bismuth, Indium, silver, and certain percentages of near or completely lead-free additives' have significantly improved properties compared to known oblique-free solders. In other words, the characteristics of the lead-free solders of the present invention, regardless of humidity and flow Compared with the existing component coatings, the valleys, weld protrusions, copper solubility and floatability, and sintering are almost comparable to traditional lead-based solders, and more in line with the environmental protection requirements of welding & production standards, and have greatly improved. Lead-free solder characteristics, 2 clothing only. 2. Another purpose of this effective creation is to provide an error-free solder. Like other lead-free solders, the existing machinery must be replaced. Lo = required component coatings, and the manufacturer's facilities are converted to lead-free solders. ^ Or = Simpler and more economically feasible than expected. ^ 裎, Yuan Another purpose of this creation is to provide a lead-free solder material, which does not need to be lower than the standard using traditional solder containing errors. , Its system is to make your reviewing committee to further improve the structure and effectiveness of this case, hereby give a preferred embodiment and cooperate with the drawings, detailed as follows: the understanding of v Although this creation will be based on the following better The details of the embodiment are not meant to limit the present invention to this embodiment. , ^ Month, but therefore 'in the technical level of the present invention, provided by the lead-free solder: 87 2% to 89 5% of tin; 40% to 4 points composed of 4.5% indium; 3. 〇 % To 3.5% silver. 3, 5%, but the solder of the present invention and the car is generally almost lead-free, so it can be completely lead-free.
498009498009
五、發明說明（3) 本發明 可於焊料中 本發明 料所進行的 4 · 8 %的終； 較為有 銦與3· 2%的 更好的 為了示 ，如以下所 關於戶彳 於已知的無 一項测試所 、4· 0%的銦 弟一項 (ANSI ) /J 圍下’對湖 適量的每種 量裝置，並 排列。 在浸入 二項因素， 樣品的向上: 樣品的部分」 的焊料也可以添加接近無鉛的附加物，更佳者 添加完全無錯的附加物。 的另一技術層面係提供使用包含以下成分的烊 焊接方法：從87· 2%至89. 5%的錫；從4.0%至 從3· 5%至4· 5%的銦；從3· 〇%至3· 5%的銀。 利的方法是由8 8 · 3 %的錫、4 · 5 %的Μ、4 · 0 %的 銀所組成的焊料。 是’該方法包含波浪形焊接步驟的方法。 範本發明之焊料的優秀特質，進行了幾項測試 述0 發明之焊料樣品潮濕性的第一項測試，如相較 鉛焊料與傳統焊料（油63%的錫與37%的鉛），第 使用之發明的焊料包含88· 3%的錫、4· 5%的鉍 與3 · 2 %的銀。 貝。式的第個層面包含根據美國國家標準學會 S\d-〇〇3標準，在235 〇c到的各種溫度範 ==的測量’在本測試中’先將銅樣品浸入 焊料中’而後將銅樣品連接上敏感力測 讓樣品上的垂直力可進行測量與紀錄的方式V. Description of the invention (3) The present invention can be carried out in the solder with 4 · 8% of the material; it is better to show indium and 3.2%, as shown below for households. None of the test sites, 4.0% of the indium (ANSI) / J around the 'appropriate amount of each amount of equipment to the lake, and arranged. In the two factors of immersion, the upward direction of the sample: the part of the sample. The solder can also add near-lead-free additives, and even better, add completely error-free additives. Another technical aspect of the company is the use of rhenium soldering methods that include: from 87.2% to 89.5% tin; from 4.0% to 3.5% to 4.5% indium; from 3.5.0%. % To 3.5% silver. An advantageous method is a solder consisting of 88.3% tin, 4.5% Μ, and 4.0% silver. Yes' This method includes a wave-shaped welding step. The excellent characteristics of the solder of the model, several tests were performed. The first test of the wetness of the solder sample of the invention, such as compared with lead solder and traditional solder (63% tin and 37% lead), the first use The invented solder contained 88.3% tin, 4.5% bismuth, and 3.2% silver. shell. The first level of the equation includes measurements according to the American National Standards Institute S \ d-〇〇3 standard at various temperature ranges of 235 ° C == 'In this test,' the copper sample was immersed in solder 'and then the copper Sensitive force measurement on the sample connection allows vertical force on the sample to be measured and recorded
力就可 因素是 品上的 品上之 測試之 本發明 統含鉛 濕時間 焊料附 的較佳特點，因此 第一項測試的第一 無鉛焊料。 以計算 由於焊 力量， 潮濕力 第一個 之焊料 焊料的 ，整體 著於物 這可以 個技術 此’向上拉 第二項 而作用於樣 為作用於樣 第一項 簡而言之， ’相較於傳 所呈現的潮 時間是測量 與計入考量 料表面與樣 每種情況下 等於零所需 技術層面的 在每種溫度 顯示，除此 上是低於其 質上的速度 被視為本發 層面中，整 品表面 的潮濕 的時間 結果如 下所呈 之夕卜， 他的無 ’低潮 明之焊 體上優 接觸角度改變 時間，是定義 〇 第1圖所示， 現的潮濕時間 本發明之焊料 錯焊料，潮濕 濕時間是焊料 料的性能，在 於其他的現有 2圖 性能 下。 第一項測試之第一 ，從這個圖形上可 ，傳統含錯焊料的 個技術層面的結 以看到，在相較 性此結果，與本 果以圖形顯示如第 於其他無鉛焊料的 發明之焊料不相上 第一項測試的第二個技術層面是在檨σ 曰叫&你俅口口入相關 之後的2· 0秒，測量最大的潮濕力，如上所、+、 、土 坪料 丄尸吓现，潮渴六曰 焊料與樣品之間的附著力’报明顯地，潮湯力提供焊疋 著於底層的有效力量指標，低潮濕時間是焊料的較佳牲附 。 彳奇點 第一項測试之弟二個技術層面的結果如第3圖戶一 摘述這些結果，在每種溫度之下，本發明之焊料:、、5不’ 品2· 0秒之後的最大潮濕力，與傳統含鉛蟬料差不多文入樣 498009The force factor is the better characteristic of the present invention, the lead-containing wet time solder attached to the product, so the first test is the first lead-free solder. In order to calculate the overall strength of the first solder due to the soldering force and the wet force, this technique can be used to 'pull up the second item and act on the sample.' The tide time presented by Yu Chuan is measured and taken into account the material surface and sample. In each case, the required technical level is displayed at each temperature. In addition, the speed below it is considered to be qualitative. The result of the wet time on the surface of the whole product is shown below. The change time of the optimal contact angle on the solder body with no low tide is defined as shown in Figure 1. The current wet time of the solder of the present invention is incorrect. The solder wet and wet time is the performance of the solder material, which lies in the other existing two-picture performance. The first of the first test, from this figure, we can see that the technical level of traditional solder with error contains the results. Compared with this result, this result is shown graphically with the results of other inventions of lead-free solder. The second technical aspect of the first test of soldering is to measure the maximum wet force at 2.0 seconds after 檨 σ is called & your mouth is related, as above, +,, and ground The corpse was scared, and the adhesion between the solder and the sample was reported in Chaoxi Sixth. Obviously, Chaotangli provides an effective indicator of the strength of the solder on the bottom layer, and the low humidity time is a better adhesion to the solder. The results of the two technical aspects of the first test of the singularity are as shown in Figure 3, and the results are summarized in Figure 1. At each temperature, the solder of the present invention: ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 2.0 seconds Maximum wet force, almost the same as traditional leaded cicada materials
五、發明說明（5) 有些現有的無錯焊料在某些溫度下，所呈現的潮濕力接近 傳統的含錯得料’本發明之焊料的潮濕力，在所有的、西产 下都接近傳統含錯焊料，所發明之焊料的本特質，讓本、曰 料在各種溫度之下’或是在不同溫度條件下進行的焊茅 現，接近傳統的含錯焊料。 4 第一項測試之第二個技術層面的結果以圖形顯示如 4圖，從這個圖形上可以明顯看出，本發明之焊料的^ 接近傳統的含錯焊料，為現今其他無錯烊料中最好的 從第一項測試的結果看出，本發明之焊料，在、晶 上，與傳統的含鉛焊料非常類似，明顯地，這種物理絲餅 的類似性讓本發明之焊料適合取代傳統含鉛焊料的用二 第二項測試是關於本發明之焊料與現有零組件冷1 相容性Μ列如，印刷電路板上的零組件可能有各種 料的塗料’因此用於連接已經附著 ：： 悍料是相當重要的。 w 土了十 < 苓組件的 項測試中’六種同類型的零組件以錫、全、發 、錫/乱合金與銅/磷合金的金屬塗裝電鍍呈銀 88·3〇/^^ '4.5〇/〇^μ ；4 、與3· 2%的銀，盥旦右以π Α、八 υ/。銦 ⑻卜再不同的^溫度下刀的傳種统焊的錫與 用珠滴測試方法進行潮渴時有各種X枓的零組件，使 關於潮濕力的測量，只不、岛；勺比較測1式’這類似於上述 測試中所使用的焊劑：含J =較小的規模進行，第二項 第二項測試的=不Ϊ焊劑。 於弟5圖，從這些結果中可以 五、發明說明（6) f出本發明之焊料顯示的潮濕時間，在所考量的大部分 酿度下（2 3 5 °C〜2 6 5 °C )，對於大部分的塗料而言，都類似 ^含錯焊料。而在大部分的情況下，本發明之焊料與 4 、、充έ氣&料所顯示的潮濕時間，彼此之間的差異不到半 秒鐘。 從第一項測試的結果即可明顯地看出，再與現有之零 、、且件塗料的相容性上，本發明之焊料適合直接用於取代傳 統的含鉛焊料。 ^三項測試是關於本發明之焊料是否適用於波浪形焊 ^ 在波/良幵》焊接的範例中，將印刷電路板置於盆中 挥i ΐ =解纟干料的上方，然後激起波紋擴散到整個溶解的 X. ^ ，巾田要維持在足以讓波浪的半月形接觸到電路 Λ浪的寬度與電路板相同(或是需要焊接的 相刀），波浪擴散到溶解之焊料的表面時， 下表面的所有零件全都會接觸到溶解的焊料。 抹到ΐ=:ΐ直接浸入溶解焊料的方法，這種焊料塗 板的方法必須大幅降低焊料與電路板向上表面接 現有的無鉛焊料，在用於波浪形焊接機哭^ 盆中時，在波浪形焊接機器使用多次的溶解焊料 盆中造成高度的污染，在波浪形烊接機二已知：在焊料 二處焊料盆區域，在使用波浪形焊接機 =常會提供 通過電路板的向下表面，目的是 =晶片"波浪會 A货明說明（7) “路板别進到第二焊 通過向下的表面，步的”膠合”波浪會 焊接之前清潔電路板 而的知接，因為晶片波浪是在 有污染物堆積，而使用"义，因此，在第一焊料盆區域會 為嚴重。 、 則的無鉛焊料，會讓這個問題更 ，有出料時，在經過多次使用之後 τ尸斤出現的 >予渣ϊ相當高。 銦4.〇iii3項：Γ::將成分為錫88.3%，.5%、 ，並以傳统锡二斤叙明的焊料用於傳統的波浪焊接機器 沒有變的相同方式，用來焊接電路板，而 ^ )機1^則用來容納焊料的使用。 下.2= ^ V良形焊接機器是在四種不同的焊料盆溫度 都是使用傳餘八255 °C、265 °C使用的，這些溫度範圍 此之外，匕：知波浪形焊接機器的-般溫度，除 卜輪达π速度（即電路板在盆子表面 〗8公二；：同的，度:、、,1公尺/分鐘、 料知#、#刀/里化些輪迗帶的速度都是在使用傳統含鉛焊 般的空氣下進行的。 乐—項測试則疋在一 用於i”錯的過程中，。開發出-種無船的焊劑 天測气=:、鉛的焊即是含有i3%rma固體的焊劑，在每 此夕:i日…則量並繼中的污染程度與合金成分。 過程所:Γ1去盆中的洋造秤4 ’以確定每次波浪形焊接 過柱所產生的浮渣量。 498009 五、發明說明（8) 第三項測試的結果列成圖表於第6圖，每天結束時盆 中所遺留的浮渣量以第7圖表示，盆中的蟬料污染程度（ 對於晶片波浪與膠合波浪）表示於第8圖。 從事相關行業的人在考量這些結果之後，即可理解盆 1Γ污染程度以及所產生的浮渣量，大幅低於在未更動之 統，浪形焊接機器中使用現有無鉛焊料的情況。 動性、土 Γ述’從上面的結果可以看出’由於潮濕性、流 近的特/質現有零組件塗料的相容性、焊縫突起與浮渣等相 鉛焊料。本發明的無錯焊料非常適合直接取代傳統的含V. Description of the invention (5) Some existing error-free solders exhibit a wet force close to the traditional error-containing material at certain temperatures. 'The wet force of the solder of the present invention is close to traditional under all western products. The error-containing solder, the nature of the invented solder, allows the material and material to be soldered at various temperatures or under different temperature conditions, which is close to the traditional error-containing solder. 4 The results of the second technical level of the first test are shown graphically as in Figure 4. From this figure, it can be clearly seen that the solder of the present invention is close to the traditional error-containing solder, which is among the other error-free materials today. It is best seen from the results of the first test that the solder of the present invention is very similar to the traditional lead-containing solder on the wafer. Obviously, the similarity of this physical wire cake makes the solder of the present invention suitable for replacement. The second and second test of traditional leaded solder is about the cold compatibility of the solder of the present invention with existing components. For example, the components of printed circuit boards may have various coatings. ::: It's very important. w In the item test of the "Ling Ling component", six types of components of the same type were plated with silver, metal, copper, tin / random alloy, and copper / phosphorus alloy. The silver plating was 88 · 3〇 / ^^ '4.5〇 / 〇 ^ μ; 4, and 3.2% of silver, the right to π Α, eight υ /. There are various X⑻ components when indium tin oxide is used for seed soldering of the knife at different temperatures and the bead drop test method is used for tide thirst, so the measurement of the moist force is not only islands; spoon comparison tests Formula 1 'This is similar to the flux used in the above test: with J = smaller scale, the second test of the second = non-fluxing flux. Figure 5 from the results, from these results, five, the description of the invention (6) f shows the wet time shown by the solder of the present invention, under most of the brewing considered (2 3 5 ° C ~ 2 6 5 ° C) For most coatings, it is similar to the wrong solder. In most cases, the difference between the wet time shown by the solder of the present invention and the gas filled material is less than half a second. From the results of the first test, it is obvious that the solder of the present invention is suitable for directly replacing conventional lead-containing solders in terms of compatibility with existing zero and conventional coatings. ^ Three tests are about whether the solder of the present invention is suitable for wave soldering. ^ In the wave / good soldering example, the printed circuit board is placed in a pot and waved. The ripple spreads to the entire dissolved X. ^, the towel field should be maintained enough to allow the half-moon of the wave to contact the circuit. The width of the wave is the same as that of the circuit board (or the phase knife that needs to be soldered), and the wave spreads to the surface of the dissolved solder. At this time, all parts on the lower surface will come into contact with the dissolved solder. Wipe to ΐ =: ΐ Directly immersed in the dissolving solder method. This solder coating method must greatly reduce the solder and the circuit board to the upper surface of the existing lead-free solder. When used in a wave soldering machine ^ Soldering machines use a lot of dissolved solder pots to cause a high degree of contamination. It is known in the wave soldering machine two: in the solder pot area of the solder two, when the wave soldering machine is used, the downward surface through the circuit board is often provided, The purpose is to explain the instructions for the chip "Wave Meeting A" (7) "Do not pass the board to the second solder through the downward surface. The" glue "step will clean the circuit board before soldering, because the wafer wave It is because of the accumulation of pollutants and the use of "quote", so it will be serious in the area of the first solder pot. The lead-free solder will make this problem even more. The appearance of the slag is very high. Indium 4.0.iii3: Γ :: The composition of tin is 88.3%, .5%, and the traditional tin two jins of solder are used in traditional wave welding machines. Did not change the same way, It is used to solder circuit boards, and ^) machine 1 ^ is used to accommodate the use of solder. The next .2 = ^ V good shape soldering machine is used at four different solder pot temperatures are used to pass the remaining 255 ° C, 265 ° C used outside these temperature ranges, know the general temperature of the wave-shaped welding machine, except for the speed of the π wheel (that is, the circuit board is on the surface of the bowl) 8 male and 2; the same, degrees: ,,, , 1 meter / minute, material know #, # 刀 / 里 化 The speed of some wheel belts are all carried out using the traditional lead-like soldering air. In the wrong process, we have developed a kind of non-shipping flux. Sky gas measurement = :, lead welding is a flux containing i3% rma solids, and every day: i day ... the quantity of pollution and alloy Ingredients: Process position: Γ1 remove the foreign scale 4 'in the basin to determine the amount of scum generated by each wave-shaped welding through the column. 498009 V. Description of the invention (8) The results of the third test are shown in the chart in Figure 6. Figure. The amount of scum left in the pot at the end of each day is shown in Figure 7. The pollution level of cicadas in the pot (for wafer waves and glue waves) is shown. In Figure 8. After considering these results, people in related industries can understand that the degree of contamination and the amount of scum produced in the basin 1Γ are significantly lower than those in existing unwavering soldering machines using lead-free solder. "Mobility, soil" can be seen from the results above, due to the wetness, the compatibility of existing components and coatings, the protrusions of solder joints, and scum. Error-free solder is ideal for directly replacing traditional
第11頁 498009 楚1圖··係包括所發明夕I曰少丨ΛΑ A 弟丄® 1乏知科的各種焊料 一 一 · I、/ ^A> Hx no 在不同的溫度 ，…,〜分？里坪 下，以 > 為單位的潮濕時間表。 第2圖··係將第1圖的資料以圖形表示。 在不同的溫度 第4圖 第5圖 第6圖 第7圖 苐8圖 第3圖：係包括所發明之焊料的各種焊料 下，最大的潮濕力表。 係將第3圖的資料以圖形表示。 係包括所發明之惊-Ψ4- ώ? t m a η / 枓與刖一種技術烊料在涂μ π 同塗料日守的潮濕時間表。 ”不 係代表本發明之焊料在、、古 夕每Α ΛΑ —人，在波，良形*干接機器中所使用 之具驗的貫驗條件。 係第6圖的實驗結果。 係第6圖的實驗結果。Page 11 498009 Figure 1 of Chu ... Including the invention of the invention I 丨 ΑΑ 丄 Α 丄 1 1 1 1 1 知 知 乏 various solders one by one I, / ^ A > Hx no at different temperatures, ..., ~ minutes ? Under Liping, > Wet schedule. Figure 2 ... The figure in Figure 1 is shown graphically. At different temperatures Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 8: The maximum wet force table under various solders including the solder invented. The data in Figure 3 are shown graphically. The system includes the invented surprise-Ψ4- ?? t m a η / 烊 and 刖 a technique to predict the wet schedule of the same coating day and time. "It does not represent the rigorous test conditions used in the solder of the present invention in the ancient, the ancient and the ancient, each Α ΛΑ—person, wave, good shape * dry-bonding machine. It is the experimental result of Fig. 6. It is the sixth Figure experimental results.
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