TW496578U - Semiconductor package structure to shrink the surface bonding area - Google Patents

Semiconductor package structure to shrink the surface bonding area

Info

Publication number
TW496578U
TW496578U TW90211931U TW90211931U TW496578U TW 496578 U TW496578 U TW 496578U TW 90211931 U TW90211931 U TW 90211931U TW 90211931 U TW90211931 U TW 90211931U TW 496578 U TW496578 U TW 496578U
Authority
TW
Taiwan
Prior art keywords
shrink
semiconductor package
package structure
bonding area
surface bonding
Prior art date
Application number
TW90211931U
Other languages
Chinese (zh)
Inventor
Jansen Chiu
Original Assignee
Walton Advanced Electronics Lt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walton Advanced Electronics Lt filed Critical Walton Advanced Electronics Lt
Priority to TW90211931U priority Critical patent/TW496578U/en
Publication of TW496578U publication Critical patent/TW496578U/en

Links

TW90211931U 2001-07-12 2001-07-12 Semiconductor package structure to shrink the surface bonding area TW496578U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90211931U TW496578U (en) 2001-07-12 2001-07-12 Semiconductor package structure to shrink the surface bonding area

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90211931U TW496578U (en) 2001-07-12 2001-07-12 Semiconductor package structure to shrink the surface bonding area

Publications (1)

Publication Number Publication Date
TW496578U true TW496578U (en) 2002-07-21

Family

ID=21685256

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90211931U TW496578U (en) 2001-07-12 2001-07-12 Semiconductor package structure to shrink the surface bonding area

Country Status (1)

Country Link
TW (1) TW496578U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees