TW495745B - Magnetic field element having a biasing magnetic layer structure - Google Patents
Magnetic field element having a biasing magnetic layer structure Download PDFInfo
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- TW495745B TW495745B TW089124262A TW89124262A TW495745B TW 495745 B TW495745 B TW 495745B TW 089124262 A TW089124262 A TW 089124262A TW 89124262 A TW89124262 A TW 89124262A TW 495745 B TW495745 B TW 495745B
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- magnetic
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 347
- 125000006850 spacer group Chemical group 0.000 claims abstract description 25
- 230000008878 coupling Effects 0.000 claims abstract description 17
- 238000010168 coupling process Methods 0.000 claims abstract description 17
- 238000005859 coupling reaction Methods 0.000 claims abstract description 17
- 230000005294 ferromagnetic effect Effects 0.000 claims description 18
- 239000000696 magnetic material Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 230000005415 magnetization Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 182
- 239000003302 ferromagnetic material Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 4
- 229910000914 Mn alloy Inorganic materials 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 239000002885 antiferromagnetic material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- SHMWNGFNWYELHA-UHFFFAOYSA-N iridium manganese Chemical compound [Mn].[Ir] SHMWNGFNWYELHA-UHFFFAOYSA-N 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 230000005290 antiferromagnetic effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 2
- 229910001313 Cobalt-iron alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- ROAHTDNKJAHEOL-UHFFFAOYSA-N [Fe].[Co].[Sm] Chemical compound [Fe].[Co].[Sm] ROAHTDNKJAHEOL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005303 antiferromagnetism Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- DALUDRGQOYMVLD-UHFFFAOYSA-N iron manganese Chemical compound [Mn].[Fe] DALUDRGQOYMVLD-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
- G11B5/3909—Arrangements using a magnetic tunnel junction
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
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- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3263—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being symmetric, e.g. for dual spin valve, e.g. NiO/Co/Cu/Co/Cu/Co/NiO
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/10—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having two electrodes, e.g. diodes or MIM elements
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- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B2005/3996—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects large or giant magnetoresistive effects [GMR], e.g. as generated in spin-valve [SV] devices
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- Semiconductor Memories (AREA)
Description
495745 _案號89124262 f/年^月丨Γ日_^__ 五、發明說明(1) 發明領域 本發明關於備有堆壘之第一磁層結構,及具有固定磁向 之第二磁層結構之磁場元件,及一隔片層結構將第一磁層 與第二磁層彼此分開,磁場元件尚備有偏壓裝置以施加一 縱向偏壓場至第一磁層結構。縱向偏壓場垂直導向第二磁 層結構之固定磁向。 發明背景 磁場元件曾揭示於美國專利號碼U S - A 5,7 2 9,4 1 0中。該 已知磁場元件被用做為一感測器,以讀出磁記錄之資料, 其尚有一在絕緣隧道屏蔽層相反侧之固定鐵磁層及一感測 鐵磁層。硬偏壓鐵磁材料之二層部份,一種钻始鉻合金-, 位於感測層之側邊緣附近,但分開。該層部份與感測鐵磁 層為電絕緣,但與其為磁耦合,並作為此感測層之磁矩之 縱向偏壓。已知偵測器之缺點為,硬偏壓材料之層部份甚 難控制,故僅對大執道寬度較為實際,因該磁鐵遠離,其 合成磁場為一低值,即5 -1 0 0 e,並切為同性。對高密度 記錄而言,其並非適合答案。已知感測器之另一缺點為, 該層部份為一材料製成,該材料未在感測器其他部份使 用。因此需要澱積系統之額外來源。此外,在製造期間限 定該層部份結構時,需要調額外之屏罩步驟。此外,硬磁 材料常顯出強溫度依存性。 發明簡要說明 本發明之目的為提供上述種類之一改進之磁場元件,其 方式為偏壓裝置為簡單,但能提供極高密度應用之適當答 案0
O:\67\67634.ptc 第5頁 495745 _案號 89124262 f / 年 $ 月 & 日_||i__ 五、發明說明(2) 此目的可由本發明之磁場元件達成,其特徵為偏壓裝置 包括一偏壓磁層,位於第一磁層結構之對侧,該偏壓磁層 結構提供一磁耦合場成份,與第二磁層結構之磁向垂直, 並由一磁層結構將其自第一磁層結構分開。所用之方法在 偏壓磁層結構與第一磁層結構間,造成一磁耦合通過非磁 層結構。在磁場元件之製造期間,偏壓磁層結構可利用簡 單方式以現有技術實現。在偏壓磁層結構形成期間,應加 一磁場,該磁場較第二磁層結構形成期間所加之磁場之角 大於0度,小於1 8 0度。 本發明之磁場元件可為一旋轉隧道接合元件,此情況 時,隔片層結構包括一絕緣材料隧道屏蔽層,如三氧I二 鋁,或大磁阻型旋轉閥元件。此二情形下,一極重要之磁 特性為第一磁層結構之磁滯。當此層結構之磁矩與磁源, 即通過之磁碟之磁場對齊時,可達成一與第二磁層結構之 磁矩之反平行。此效應產生電阻之改變。為防止磁場元件 輸出之失真,必須防止引入疇壁,在磁校正期間,通過第 一磁層結構移動。如磁滞存在於第一磁層結構時,缚壁可 能被引入。已證明在本發明之感測器中之磁滯已大幅降 低,或已完全消除。 本發明之磁場元件中,一磁耦場,即一縱向偏壓場位於 偏壓磁層結構與第一磁層結構之間,該磁耦合為一靜磁 場,並僅限定於局部位準,即僅為結構之粒子大小。因此 可使一較低之磁場加在其上,較硬磁材料之層部份之磁場 為小。本發明磁場元件之另一優點為,由於耦合磁場之局 部性,其均勻性較佳,並與磁場元件之尺寸及環境無關。
O:\67\67634.ptc 第6頁 495745 _案號 89124262 〒/年》月β曰 修正__ 五、發明說明(3) 通常,第一磁層結構有一磁化之易軸(Easy Axis),與 第二磁層結構之固定磁向成垂直。第一磁層結構包含一鐵 磁材料之鐵磁層,如錄鐵合金或始鐵合金,此鐵磁層被稱 為自由層。第二磁層結構包含鐵層材料之固定磁,如鎳鐵 合金,或鎳鈷合金,被稱為交換偏壓材料之固定磁,如反 鐵磁材料,即銥錳合金。 本發明磁場元件之一實施例之特徵為,偏壓磁層結構有 一固定磁向,此磁向與第二磁層結構之磁向至少成45度 角,最大成1 3 5度角。在此較佳實施例中,偏壓磁層結構 對第一磁層結構有一明顯效應,意即在第一磁層結構中之 磁滯已大幅降低。本實施例中可達成一最大縱向偏壓敗 場’其特徵為’偏壓磁層之磁向與第二磁層結構之磁向成 9 0度角。 本發明磁場元件之實施例中,非磁層結構包括一或多層 銅,釕及組及/或非磁氧化物,如三氧化二紹。如調整此 層之厚度,縱向偏壓場可被調諧,自厚銅層之5 0 e至薄銅 層之數百Oe。在旋轉閥元件中,以钽較佳,因為其高電阻 率之故。此外,钽可導出理想晶體組織。 本發明之磁場元件之一實施例之特徵為,偏壓磁層結構 包括一被固定層結構及一固定層結構,以固定被固定層結 構。被固定層結構較佳包括磁材料之鐵磁層,如,錄鐵合 金,始或銘鐵合金。 本發明磁場元件上述實施例之較佳特徵為固定層結構包 括,交換偏壓材料層,如反鐵磁材料,即鐵錳合金,銥錳 合金,或鐵磁材料,即铽鈷合金或铽鐵鈷合金。
O:\67\67634.ptc 第7頁 495745 _案號89124262 夕/年孓月,广曰 修正_— 五、發明說明(4) 如必要時,被固定層界結構可含二鐵磁層由一非磁性材 料層分開。此結構可為鐵磁材料之二層,如鎳鐵合金,或 始鐵合金,及一中間插入之非磁性材料層,如釕,銖或 銅。中間插入層導致一反鐵磁搞合於鐵磁材料磁之間。該 結構含鐵磁材料層,由一非磁材料層中間插入,通常稱為 人工反鐵磁(AAF)。 本發明磁場元件之一實施例之特徵如申請專利範圍第8 項所限定。此實施例中,磁雜散場可為最小。 本發明之磁場元件之實施例之特徵為,如申請專利範圍 第9項所限定。偏壓磁層結構之磁強度,在此實施例中得 以進一步改進。 — 本發明尚關於一含磁場元件之旋轉隧道接面裝置。本發 明之旋轉隧道接面裝置,備有本發明之磁場元件,隔片層 結構包括絕緣材料如三氧化二铭之隧道屏蔽層。 本發明尚關於一含磁場元件之大磁阻裝置。本發明之大 磁阻裝置包括本發明之磁場元件。一種絕緣材料如三氧化 二紹,或高電阻率之材料如组,鐫或19為非磁層之較佳材 料。 以上所提之裝置均可作為感測器,及場感測器供汽車應 用或磁頭之用,與磁登錄或資訊媒體合作。 本發明尚關於自磁資訊載體讀出資訊之系統,系統包括 本發明之磁場元件,或本發明之一裝置。 本發明尚關於一含本發明之磁場元件之磁記憶體,及關 於含該記憶體之電子電路。 參考申請專利範圍,應注意,申請範圍定義之不同特
O:\67\67634.ptc 第8頁 495745 _案號 89124262 fY 年 > 月 f 日___ 五、發明說明(5) 徵,均可以組合方式產生。此外,π層結構"一詞,在本文 件中可意指單層或一堆疊層。 圖式簡要說明 本發明上述特性將可自以下非限制舉例說明,及參考圖 式得以更為明顯。 圖中: 圖1為本發明磁場元件之實施例之剖面圖, 圖2為本發明之大磁阻型旋轉閥元件之實施例之剖面 圖, 圖3為本發明旋轉隧道接面裝置之實施例之剖面圖, 圖4為本發明備有磁場元件之磁場感測器之實施例之立 體圖, 圖5為本發明一系統之實施例圖解, 圖6為本發明一磁記憶體之一實施例之剖面圖, 圖7為本發明一電子電路之圖解。 值得注意的是使用相同參考符號來表示數個實施例中之 相對應部份。 圖式元件符號說明 1 基 體 3 偏 壓 磁 層 結 構 3Α 固 定 層 結 構 3Β 被 固 定 層 結 構 3Β, 鐵 磁 材 料 層 3Β2 鐵 磁 材 料 層 3Β3 插 入 層
O:\67\67634.ptc 第9頁 495745 修正 案號 89124262 f /年+月f曰 五、發明說明(6) 5 非 磁 層 結 構 7 第 一一 磁層 結 構 9 隔 片 層 結 構 11 第 二 磁 層 結 構 1 1 A 被 固 定 層 1 1B 固 定 層 100 電連接 1 0 2 磁 力 線 導 引 1 02a 端 面 104 磁 力 線 導 引 104a 端 面 106 磁 隙 200 框 架 20 2 轴 心 204 磁碟 資 訊 載 體 206 搖 臂 208 磁 場 感 測 器 300 旋轉隧道接點裝置 302 半導體 400 平 面 圖 402 選 擇 裝 置 404 磁 組 件 八7 磁 化 易 轴 m3 磁 向 Μη 磁 向
O:\67\67634.ptc 第10頁 495745 _案號89124262 年多月仏曰 修正__ 五、發明說明(7) T 電晶體 發明詳細說明 圖1之磁場元件備有由基體1支撐之一堆疊,實際上平行 之層結構。此堆疊層結構順序包含一偏壓磁層結構3,一 非磁結構5,第一磁層結構7,一隔片層結構9及第二磁層 結構1 1。基體1可由一非磁,非導體材料如矽組成。第一 磁層結構7及第二磁層結構1 1將隔片結構9夾在其間,偏壓 磁層結構3及第一磁層結構7將非磁層結構5加在其間。每 一層結3,5,7,9及11可含單一層或多層。第二磁層結構 11有一固定磁向Μη於層結構11之平面中。磁向Mu在製造期 間,基一適當磁場,在形成時,特別是第二磁層結構1 L形 成時加上。 偏壓磁層結構3,位於第一磁層結構7之對面,其有一磁 化心,其提供一與磁化M3平行,及與第二磁層結構11之磁 向心1垂直之搞合磁場成份。磁向1在形成時實現’特別在 偏壓磁層結構3之澱積時實現,方式為施加一適當磁場, 其使在第二磁層結構1 1形成時,與所加之磁場成0度至1 8 0 度角。磁向M3經由非磁層結構5,產生一磁耦合於偏壓磁層 結構3與第一磁層結構7之間,該耦合為一非常局部之靜磁 I禺合。較佳為,偏壓磁層結構3之磁向M3有一固定方向,該 方向與第二磁層結構11之磁向Μπ成至少45度至135度角。 如偏壓磁層結構之磁向Μ3與磁向Μη成9 0度則最大磁耦合場 可以達成。第一磁層結構7有一磁化易轴Α7,與第二磁層結 構1 1之固定磁向Μη平行。或者,某些應用中,最好使磁化 易轴Α7與固定磁向Mu垂直。第一磁層結構7可包括一自由
O:\67\67634.ptc 第11頁 495745 _案號89124262 7/ 年多月(厂日__ 五、發明說明(8) 層,其由鐵磁材料,NixFei_x組成。第二磁層結構1 1包括所 謂鐵磁材料之被固定層,如CoxF ei_x,或交換偏壓材料之被 固定層,如反鐵磁材料,即,F e 5 〇 Μ η 5 〇。 本發明磁場元件可用於旋轉隧道接面裝置中,此情況 下,隔片層結構9包括一電絕緣材料,如三氧化二鋁之隧 道屏蔽層,或用於大磁阻裝置中,此時,隔片層結構9包 括非磁材料層,如銅非磁材料層。 非磁層結構5可含一層或多層非磁材料銅,銥,钽或氧 化物三氧化二鋁,或其他適合之非磁材料。偏壓磁層結構 3可包括一被固定層結構之堆疊,及一固定層結構。被固 定層結構較佳含二層鐵磁材料層,如鎳鐵合金,由一層-非 磁材料如銅分隔,固定層結構較佳含一交換偏壓材料層, 如鐵猛合金,或適當鐵磁材料如錢始合金。較佳為一鐵磁 層鄰近交換偏壓材料層。或者,偏壓層結構3包括二鐵磁 材料層,由非磁材料層分開。 圖2之大磁阻裝置可含一基體及含一備有含偏壓層結構 3,非磁層結構5,第一磁層結構7,隔片層結構9及第二磁 層結構1 1之層結構堆疊。偏壓層結構3有一磁向Μ3,其與第 二磁層結構1 1之固定磁向Μη成垂直。偏壓磁層3含一被導 向層結構3 Β,及一導向層結構3 Α以固定結構3 Β。固定層3 A 包括一交換偏壓材料層,此實施例中為銥錳合金。此實施 例中,被固定層結構3 B含二層鐵磁材料之3 Bi及3 B2,由一 非磁材料之插入層3 B3分開。鐵磁材料為鈷鐵合金,此實施 例中之非磁材料為銖。層3 Bi,3 B2及3 B3之結構導致一反鐵 磁耦鐵磁層3 Bi與3 B2之間。在此實施例中,非磁層結構5含
O:\67\67634.ptc 第12頁 495745 案號 89124262 #年彡月 修正 五、發明說明(9) 一钽層。第一磁層結構7包括鐵磁材料之自由層,即鎳鐵 合金。隔片層結構9含一銅層。第二磁層結構1 1為被固定 結構,具有被固定層1 1 Α及固定層1 1 Β。第二磁層結構1 1有 其固定磁向Mn,偏壓磁層結構3提供一磁合場成份向Μπ垂 直。 圖3顯示旋轉接面裝置中包含,備於基體1上之磁場元 件,並備有一堆疊偏壓磁層結構3也非磁層結構5,第一磁 層結構7,隔片層結構9及第二磁層結構1 1。隔片層結構9 包括非磁,電絕緣材料如適當之氧化物,三氧化二鋁之隧 道屏蔽層。層結構3,5及1 1可如本實施例所述方式組成。 圖4顯示磁場感測器之一部份。此感測器含具有電連接 1 0 0之換能器Τ。換能器Τ包括一本發明之磁場元件之實施 例,即圖1至3所示之實施例。此感測器包含磁力線固定 102及104,其配置於與Τ相對位置,以形成一磁電路。磁 力線固定102及104各有一端面102a及104a形成一極,面向 感測器,一磁隙1 0 6位於二表面之間。如一磁媒體如磁 滯,磁碟或磁卡通過二面102a及104a之附近,在媒體上儲 存之貧訊在上述之磁電路中產生改變之磁力線’該磁力線 亦饋入換能器T中。換能器T將改變之磁力線轉換為電阻變 化,其可由適當連接至電連接1 0 0之測量儀器所測量。此 一感測器,亦稱為磁頭,亦可含一感應線圈,其可用於磁 資訊之記錄於磁媒體上。 圖5顯示本發明之系統,其包括框架2 0 0及一軸心2 0 2, 其可旋轉安裝在框架200上,以載負一磁碟資訊載體204, 如硬碟或磁光碟。資訊載體204可為一整合載體,或可移
O:\67\67634.ptc 第13頁 495745 _案號89124262 f/年 > 月 < 日 修正_. 五、發明說明(10) - 動載體。系統尚含一搖臂2 0 6,載負本發明之磁場感測器 2 0 8。備有驅動機以驅動軸心2 0 2及搖臂2 0 6。作業時,感 測器2 0 8掃描旋轉資訊載體2 0 4,感測器被置於資訊載體 · 2 0 4之對側,並沿徑向與載體2 0 4作相對移動。顯示之系統 . 為一資料儲存系統,亦可為一音頻及/或視頻系統。本發 明之系統亦可為自一磁帶或磁卡讀取資訊之系統。 圖6為本發明之旋轉隧道接面裝置300,其統合於一半導 體302之上’如電晶體’即碎電晶體’或二極體’即GaAs 二極體,其形成一高密度非易失性單元。 . 圖7顯示一高密度MRAM之平面圖400。平面圖400包括含 選擇裝置4 0 2,即二極體或電晶體之記憶體單元,及一磁 _ 組件4 0 4,其形式為本發明之隧道接面裝置,或本發明之 大磁阻裝置。
O:\67\67634.ptc 第14頁 495745 _案號89124262 年j月曰_修正 圖式簡單說明 第15頁 O:\67\67634.ptc
Claims (1)
- 495745 _案號 89124262 年多月 日___ 六、申請專利範圍 1 . 一種磁場元件,具有一堆疊之第一磁層結構、一第 二磁層結構,其具有一固定磁向、及一隔片結構,該隔片 結構用以將該第一磁層結構及該第二磁層結構彼此分開, 該磁場元件尚具備有一偏壓機構,用以施加一縱向偏壓場 至該第一磁層結構,其特徵為,該偏壓機構包含一偏壓磁 層結構,其位於該第一磁層結構之對面,該偏壓磁層結構 提供一磁耦合場成份,其與該第二磁層結構之磁向成垂 直,並與該第一磁層結構以一非磁層結構分開。 2. 如申請專利範圍第1項之磁場元件,其特徵為,該偏 壓磁層結構有一固定磁向,與該第二磁層結構之磁向成至 少45度及最大135度角。 — 3. 如申請專利範圍第2項之磁場元件,其特徵為,該偏 壓磁層結構之磁向與該第二磁層結構之磁向成90度角。 4. 如申請專利範圍第1項之磁場元件,其特徵為,該非 磁結構包括一铽層。 5. 如申請專利範圍第1項之磁場元件,其特徵為,該偏 壓磁層結構包括一被固定之層結構及一固定層結構,以供 固定該被固定層磁結構。 6. 如申請專利範圍第5項之磁場元件,其特徵為,該固 定層結構包括一交換偏壓材料層。 7. 如申請專利範圍第5項之磁場元件,其特徵為,該被 固定層結構包括二鐵磁層,其由一非磁材料層分開。 8. 如申請專利範圍第1項之磁場元件,其特徵為,該偏 壓磁層結構包括二鐵磁層,其由一非磁材料層分開。O:\67\67634.ptc 第16頁 495745 案號 89124262 f/年j 月曰 修正 六、申請專利範圍 9. 如申請專利範圍第6項之磁場元件,其特徵為,該偏 壓磁層結構包括二鐵磁層,其由一非磁材料層分開,其中 一鐵磁層與該交換偏壓材料層鄰近。 10. —種旋轉隧道接面裝置,其包含一磁場元件,該磁 場元件具有一堆疊之第一磁層結構、一第二磁層結構,其 具有一固定磁向、及一隔片結構,該隔片層結構包括一隧 道屏蔽層,該隔片結構用以將該第一磁層結構及該第二磁 層結構彼此分開,該磁場元件尚具備有一偏壓機構,用以 施加一縱向偏壓場至該第一磁層結構,其特徵為,該偏壓 機構包含一偏壓磁層結構,其位於該第一磁層結構之對面,該偏壓磁層結構提供一磁耦合場成份,其與該第二磁 層結構之磁向成垂直,並與該第一磁層結構以一非磁層結 構分開。11. 一種大磁阻裝置,其包含一磁場元件,該磁場元件 具有一堆疊之第一磁層結構、一第二磁層結構,其具有一 固定磁向、及^一隔片結構’該隔片結構用以將該第一磁層 結構及該第二磁層結構彼此分開,該磁場元件尚具備有一 偏壓機構,用以施加一縱向偏壓場至該第一磁層結構,其 特徵為,該偏壓機構包含一偏壓磁層結構,其位於該第一 磁層結構之對面,該偏壓磁層結構提供一磁耦合場成份, 其與該第二磁層結構之磁向成垂直,並與該第一磁層結構 以一非磁層結構分開。 12. —種自磁資訊載體讀出資訊之系統,該系統包括一 磁場元件,該磁場元件具有一堆疊之第一磁層結構、一第O:\67\67634.ptc 第17頁 495745 _案號89124262 9(年;月丨’曰_ί±^_ 六、申請專利範圍 二磁層結構,其具有一固定磁向、及一隔片結構,該隔片 結構用以將該第^一磁層結構及該第二磁層結構彼此分開’ 該磁場元件尚具備有一偏壓機構,用以施加一縱向偏壓場 至該第一磁層結構,其特徵為,該偏壓機構包含一偏壓磁 層結構,其位於該第一磁層結構之對面,該偏壓磁層結構 提供一磁耦合場成份,其與該第二磁層結構之磁向成垂 直,並與該第一磁層結構以一非磁層結構分開。 13. —種磁記憶體,其包括一磁場元件,該磁場元件具 有一堆疊之第一磁層結構、一第二磁層結構,其具有一固 定磁向、及一隔片結構,該隔片結構用以將該第一磁層結 構及該第二磁層結構彼此分開,該磁場元件尚具備有一·偏 壓機構,用以施加一縱向偏壓場至該第一磁層結構,其特 徵為,該偏壓機構包含一偏壓磁層結構,其位於該第一磁 層結構之對面,該偏壓磁層結構提供一磁耦合場成份,其 與該第二磁層結構之磁向成垂直,並與該第一磁層結構以 一非磁層結構分開。 14. 一種電子電路,其包括一磁記憶體,該磁記憶體包 括一磁場元件,該磁場元件具有一堆疊之第一磁層結構、 一第二磁層結構,其具有一固定磁向、及一隔片結構,該 隔片結構用以將該第一磁層結構及該第二磁層結構彼此分 開,該磁場元件尚具備有一偏壓機構,用以施加一縱向偏 壓場至該第一磁層結構,其特徵為,該偏壓機構包含一偏 壓磁層結構,其位於該第一磁層結構之對面,該偏壓磁層 結構提供一磁耦合場成份,其與該第二磁層結構之磁向成O:\67\67634.ptc 第18頁 495745 _案號 89124262 分年j月/广曰 修正_ 六、申請專利範圍 垂直,並與該第一磁層結構以一非磁層結構分開。O:\67\67634.ptc 第19頁
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EP (1) | EP1200972A1 (zh) |
JP (1) | JP2003526913A (zh) |
KR (1) | KR20020019017A (zh) |
CN (1) | CN1242429C (zh) |
TW (1) | TW495745B (zh) |
WO (1) | WO2001067469A1 (zh) |
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- 2000-11-16 TW TW089124262A patent/TW495745B/zh not_active IP Right Cessation
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- 2001-02-23 CN CNB018004687A patent/CN1242429C/zh not_active Expired - Fee Related
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- 2001-02-23 EP EP01927703A patent/EP1200972A1/en not_active Withdrawn
- 2001-02-23 KR KR1020017014198A patent/KR20020019017A/ko not_active Application Discontinuation
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US6950333B2 (en) | 2001-06-19 | 2005-09-27 | Matsushita Electric Industrial Co., Ltd. | Magnetic memory and method for driving the same, and magnetic memory device using the same |
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CN1242429C (zh) | 2006-02-15 |
KR20020019017A (ko) | 2002-03-09 |
WO2001067469A1 (en) | 2001-09-13 |
EP1200972A1 (en) | 2002-05-02 |
CN1364300A (zh) | 2002-08-14 |
JP2003526913A (ja) | 2003-09-09 |
US20010026470A1 (en) | 2001-10-04 |
US6438026B2 (en) | 2002-08-20 |
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