TW486712B - Decaborane ion source - Google Patents

Decaborane ion source Download PDF

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Publication number
TW486712B
TW486712B TW089120519A TW89120519A TW486712B TW 486712 B TW486712 B TW 486712B TW 089120519 A TW089120519 A TW 089120519A TW 89120519 A TW89120519 A TW 89120519A TW 486712 B TW486712 B TW 486712B
Authority
TW
Taiwan
Prior art keywords
ionization
vaporized
scope
ion
patent application
Prior art date
Application number
TW089120519A
Other languages
English (en)
Chinese (zh)
Inventor
Thomas Neil Horsky
Alexander Stuart Perel
William Keith Loizides
Original Assignee
Axcelis Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc filed Critical Axcelis Tech Inc
Application granted granted Critical
Publication of TW486712B publication Critical patent/TW486712B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00Ion beam tubes
    • H01J27/02Ion sources; Ion guns
    • H01J27/08Ion sources; Ion guns using arc discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Analytical Chemistry (AREA)
  • Electron Sources, Ion Sources (AREA)
TW089120519A 1999-10-11 2000-10-03 Decaborane ion source TW486712B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/416,159 US6288403B1 (en) 1999-10-11 1999-10-11 Decaborane ionizer

Publications (1)

Publication Number Publication Date
TW486712B true TW486712B (en) 2002-05-11

Family

ID=23648806

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089120519A TW486712B (en) 1999-10-11 2000-10-03 Decaborane ion source

Country Status (6)

Country Link
US (2) US6288403B1 (https=)
EP (1) EP1093149B1 (https=)
JP (1) JP5062458B2 (https=)
KR (1) KR100571015B1 (https=)
SG (1) SG86444A1 (https=)
TW (1) TW486712B (https=)

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* Cited by examiner, † Cited by third party
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CN105862006B (zh) * 2015-02-09 2018-06-19 汉辰科技股份有限公司 具有蒸发器的离子源
CN105719927B (zh) * 2014-12-23 2018-11-27 汉辰科技股份有限公司 离子源

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US6909839B2 (en) * 2003-07-23 2005-06-21 Advanced Technology Materials, Inc. Delivery systems for efficient vaporization of precursor source material
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US20080073559A1 (en) * 2003-12-12 2008-03-27 Horsky Thomas N Controlling the flow of vapors sublimated from solids
US7791047B2 (en) * 2003-12-12 2010-09-07 Semequip, Inc. Method and apparatus for extracting ions from an ion source for use in ion implantation
US7820981B2 (en) 2003-12-12 2010-10-26 Semequip, Inc. Method and apparatus for extending equipment uptime in ion implantation
US7342236B2 (en) * 2004-02-23 2008-03-11 Veeco Instruments, Inc. Fluid-cooled ion source
US7741621B2 (en) * 2004-07-14 2010-06-22 City University Of Hong Kong Apparatus and method for focused electric field enhanced plasma-based ion implantation
KR100620227B1 (ko) * 2004-12-14 2006-09-08 동부일렉트로닉스 주식회사 이온 주입 장치의 증발기 조절 방법
CN101495190B (zh) * 2005-03-16 2013-05-01 高级技术材料公司 用于从固体源递送试剂的系统
US7446326B2 (en) * 2005-08-31 2008-11-04 Varian Semiconductor Equipment Associates, Inc. Technique for improving ion implanter productivity
US20070178678A1 (en) * 2006-01-28 2007-08-02 Varian Semiconductor Equipment Associates, Inc. Methods of implanting ions and ion sources used for same
US7473606B2 (en) * 2006-02-22 2009-01-06 United Microelectronics Corp. Method for fabricating metal-oxide semiconductor transistors
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WO2009039382A1 (en) * 2007-09-21 2009-03-26 Semequip. Inc. Method for extending equipment uptime in ion implantation
CN102047376A (zh) * 2008-05-30 2011-05-04 艾克塞利斯科技公司 注入硼烷时在半导体基片上的粒子控制
US7812321B2 (en) * 2008-06-11 2010-10-12 Varian Semiconductor Equipment Associates, Inc. Techniques for providing a multimode ion source
US7759657B2 (en) 2008-06-19 2010-07-20 Axcelis Technologies, Inc. Methods for implanting B22Hx and its ionized lower mass byproducts
US20100019141A1 (en) * 2008-07-25 2010-01-28 Varian Semiconductor Equipment Associates, Inc. Energy contamination monitor with neutral current detection
JP5220549B2 (ja) * 2008-10-20 2013-06-26 本田技研工業株式会社 アウタロータ型多極発電機のステータ構造体
MY160165A (en) * 2009-04-10 2017-02-28 Applied Materials Inc Use special ion source apparatus and implant with molecular ions to process hdd (high density magnetic disks)with patterned magnetic domains
US8350236B2 (en) * 2010-01-12 2013-01-08 Axcelis Technologies, Inc. Aromatic molecular carbon implantation processes
US8344337B2 (en) 2010-04-21 2013-01-01 Axcelis Technologies, Inc. Silaborane implantation processes
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US9134074B2 (en) 2012-10-04 2015-09-15 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for thermal control of ion sources and sputtering targets
KR101967145B1 (ko) * 2017-04-06 2019-04-09 울박, 인크 이온원 및 이온 주입 장치

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105719927B (zh) * 2014-12-23 2018-11-27 汉辰科技股份有限公司 离子源
CN105862006B (zh) * 2015-02-09 2018-06-19 汉辰科技股份有限公司 具有蒸发器的离子源

Also Published As

Publication number Publication date
JP5062458B2 (ja) 2012-10-31
SG86444A1 (en) 2002-02-19
KR100571015B1 (ko) 2006-04-13
KR20010050893A (ko) 2001-06-25
US20010054699A1 (en) 2001-12-27
US6958481B2 (en) 2005-10-25
EP1093149A2 (en) 2001-04-18
US6288403B1 (en) 2001-09-11
JP2001135253A (ja) 2001-05-18
EP1093149A3 (en) 2003-01-02
EP1093149B1 (en) 2011-12-07

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