TW480773B - Chip-type Mianderlan antenna with multi-layered substrates - Google Patents

Chip-type Mianderlan antenna with multi-layered substrates Download PDF

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Publication number
TW480773B
TW480773B TW90105153A TW90105153A TW480773B TW 480773 B TW480773 B TW 480773B TW 90105153 A TW90105153 A TW 90105153A TW 90105153 A TW90105153 A TW 90105153A TW 480773 B TW480773 B TW 480773B
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Taiwan
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antenna
substrate
type
lines
line
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TW90105153A
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Chinese (zh)
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Sheng Yeng Peng
Ruey-Shi Chu
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Advanced Antenna Technology In
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Abstract

The present invention relates to a kind of chip-type Mianderlan antenna having multi-layered substrate, and contains the followings: two insulating plates; one or more than one substrate, which is installed between two insulating plates; and one set or more than one set of antenna circuit, which is respectively formed on each substrate. Because the antenna circuit has the circuit shape of Mianderlan antenna and dual pole characteristics, and one set of frequency can be extracted from the antenna circuit of each layer circuit, in this way, the quantity and size of substrate as well as the frequency specification of antenna can be adjusted in the manufacturing process depending on the user requirement so as to effectively obtain the selection of different frequencies. In addition, the microchip antenna can be made to really have multiple frequencies and can be made three-dimensional.

Description

五、創作說明(/) 種具多層基板之晶粒式米安德蘭天線,尤 率™天線結構,其可適用於 …目f1尤於無線產f之快速發展,使得各類電子產品 /卩、電腦、電視等)皆可以無線方式達 輸的效果’而達成此-目的之主要發射接收元件係為= 線又因為配合各類無線發射器使用頻段不所採 ==rr同,加上此類天線之產品仍二屬 夕:、’、、之、(構,此類天線產品於製程實施時,益法 1=:選擇:故往往於同一製程中只能生產固;頻 之盖,口 口亡此類天線之產品仍是以金屬導線繞線而成 、’’°、’ °此—來’即會因天線突出之部份而造成電路體 積之:曾么’這對目前各類商品所極欲達成輕薄短小之目 二:通了及加以改進的問題,又目前應用於廣頻 線:、等二電話、電腦、定位導航及“相列天 服務二二::頻:::广前述各類產品或 更大之商業價值。心關’由此可見其相關應用可獲得 由上可知,由於各式電子元件皆朝向小型化、多功能 =良,以適應各目前類各式商品發展潮流,因 應用於無線發射、接收元件之傳統天線(桿狀、 線、碟形天料),已不能滿足新時代之需求,故對於習. 用之天線的確有著更大之發展及改進空間。 為此,本發明之主要目的係提供一種於製程實施時具 五、創作說明(γ) 有多種頻段選擇之多層微小晶粒式米安德蘭天線結構。 欲達到上述目的所使用之主要技術手段係令該微小曰 粒内多層之米安德蘭天線結構包含有: 曰曰 兩絕緣板; /曰或I以上之基板’係設於兩絕緣板間,可於里 上形成金屬導線線路; 、/、 丨—組以上之米安德蘭天線線路,係各組天線線路 形成於相對上述各層基板上; 路 I米安德蘭天線線路形成於各基板後,再壓 之頻遙土〜々 線之長、寬度係以欲形成 :頻羊決疋之,各層除了具備特定的工作頻率 作頻率,即於兩相鄰之兩層基板間,相對其上: 分別形成對應穿孔,即可透過穿孔電鑛串接上下 兩層線路’即可選擇製成另一不同頻 於製程時可提jj£ Jγ 、 、,、,類天線 刷、Π : 選擇’又加上該天線係以印 而能與線路及系統整合,㈣Ϊ;溥之功能’不但體積小 好之優點。 Μ㈣具有美觀、價廉且功能 為使貴審查委員更進一 構造,茲附以圖式說明如后: (一)圖式部份: 步瞭解前述創作目的及詳細 第一圖··係本發明一 第一圖:係本發明一 第二圖:係本發明一 較佳實施例之分解圖。 車父佳實施例之外觀圖。 較佳實施例之分解俯視圖 C7 經濟部智慧財產局員工消費合作社印製 五、創作說明(多) 第四圖·係本發明一較佳實施例之剖面圖。 圖A曰B •係本發明之一實際量測數據圖,其揭示該 晶粒之米安德蘭天線欲設計之頻率係為 職、2.95GHz、3.51GHz 及 4.41GHz,而實際 量測值係為 1.75GHz、2.68GHz、3· 47GHz 及 4.35GHz。 係本發明之增益量測i,其揭示該天線最大可達 〇之增益係為—2dBil。 圖號部份: 第六圖 (1 0)晶粒天線 (1 1 )基板 (1 3 )基板 (1 5)上絕緣板 (21)線路 (2 3 )線路 (2 1 2)垂直部 本發明係 (12)基板 (14)貫孔 (1 6)下絕緣板 (2 2 )線路 (211)水平部 (3 0 )導電體 種提供高穩度及多頻率選擇之目丨叫_ 粒天線’ I閱第—圖所示係為本創作之—外觀圖,該晶粒 天線(1 0 )結構係包含有: "二絕緣板(1 5 ) ( 1 6 ); 一層或一層以上之基板(11),係設於兩絕緣板 (1 5) ( 1 6)間;其中;於本實施例中,該基板(工 1 )係為一高介質之陶瓷材質; 一組或一組以上之線路(2 ]L ),各組線路(2工) 之多層平面晶V. Creation Description (/) A grain-type Miandelian antenna with a multi-layer substrate, and a special rate ™ antenna structure, which can be applied to the rapid development of ... f1, especially wireless products, making various electronic products / 卩, Computer, TV, etc.) can achieve the effect of losing wirelessly 'to achieve this-the main transmitting and receiving elements of the purpose are = wire and because of the use of various frequency bands with different wireless transmitters = = rr same, plus this Antenna-like products still belong to the following two categories: ,,,,,,, (, and when such antenna products are implemented in the manufacturing process, Yifa 1 =: Choice: So often only in the same process can be produced; The products of this type of antenna are still made of metal wires.`` °, '° This--come' 'will cause the circuit volume to be caused by the protruding part of the antenna: What I really want to achieve is the thin and short heading No. 2: The problems that have been solved and improved, and are currently used in the broadband line: telephones, computers, positioning and navigation, and "phase sky service 22 :: frequency ::: guang The aforementioned types of products or greater commercial value. From this, you can see their relevance As you can see from the above, since all kinds of electronic components are oriented towards miniaturization and multi-functionality = good to meet the current development trend of various types of goods, because of the traditional antennas (rod, wire, The dish-shaped material) has not been able to meet the needs of the new era, so the antenna used by Xi does have more room for development and improvement. To this end, the main purpose of the present invention is to provide a method for the implementation of the process. Note (γ) Multi-layer micro-grained Munderland antenna structure with multiple frequency band options. The main technical means used to achieve the above purpose is to make the micro-middle-layer Mianderland antenna structure include: Two insulating plates; / or above I substrate is located between the two insulating plates, which can form a metal conductor line on the inside; 、 /, 丨 —Mandaran antenna lines of more than one group, which are antenna groups of each group It is formed on the substrates opposite to each of the above layers. After the antenna circuit is formed on each of the substrates, the frequency and the length of the reed line are the same as the length and width of the reed line. In order to have a specific working frequency as the frequency, that is, between two adjacent two layers of substrates, opposite to each other: the corresponding perforations are formed respectively, and the upper and lower layers of the line can be connected in series through the perforated electricity ore to choose another different During the process, you can mention jj £ Jγ, ,,,, antenna-like brushes, Π: select 'plus the antenna is printed to integrate with the line and system, ㈣Ϊ; 功能' function is not only small and good Μ㈣ is beautiful, inexpensive, and functional. In order to make your reviewing committee more structured, it is illustrated with drawings as follows: (I) Schematic part: Step by step to understand the aforementioned creative purpose and detailed first picture ... This is the present invention A first picture: It is the second picture of the present invention: It is an exploded view of a preferred embodiment of the present invention. An external view of the Che Fujia embodiment. An exploded top view of the preferred embodiment C7 Employee Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printing 5. Creation Instructions (Multi) The fourth figure is a cross-sectional view of a preferred embodiment of the present invention. Figure A and B are the actual measurement data diagrams of the present invention, which reveal that the frequency of the Mian Delan antenna of the crystal is to be designed, 2.95GHz, 3.51GHz, and 4.41GHz, and the actual measurement values are It is 1.75GHz, 2.68GHz, 3.47GHz, and 4.35GHz. It is the gain measurement i of the present invention, which reveals that the maximum gain of the antenna is -2dBil. Drawing number part: sixth figure (10) die antenna (1 1) substrate (1 3) substrate (1 5) upper insulating plate (21) line (2 3) line (2 1 2) vertical part of the present invention (12) Substrate (14) Through-hole (16) Lower insulating plate (2 2) Line (211) Horizontal section (3 0) The conductors provide high stability and multi-frequency selection. The first figure—shown here is the appearance of the creation—the structure of the chip antenna (1 0) includes: " two insulating plates (1 5) (1 6); one or more substrates ( 11), located between two insulating plates (1 5) (16); where; in this embodiment, the substrate (work 1) is a high dielectric ceramic material; one or more sets of lines (2) L), multilayer planar crystals of each group of lines (2 workers)

•I.------------^----------^---------線 (請先閱讀背面之注音?事項再填寫本頁) 480773 C7 五、創作說明(0) 以米安德蘭天線形狀形成於上述各基板( =天線線路(11) 一刷二= 參閱第二圖所示,該米安德蘭天線線路 多數[形線段連接而成,即—L形線段之水平2 1),自由端以垂直角度連接該另_L形線路垂直部 之自由端,以構成連續垂直曲折狀線路,欲 段線路之頻率值,係由兩末端得之。 第-圖及第二圖所示,係本發明一較佳實施 ;;、係為三層基板(11)壓合而成,又於各層基板 1)形成上述米安德蘭天線線路(21), =該基板(⑴上之線路⑴)之兩端21:圖 間具有一特定的工作頻率,因此,各層線路(2 斤形成之頻率值係依其線路(2丄)之長、 數、厚度等條件決定之;又,為使於該晶:天: 0)可選擇製作出另一組不同於上述三組之工作頻率 值之天線,請參閱第四圖所示,在三層基板(11)(、工 2) (13)壓合後,可於兩相鄰之基板(12)( 3) 線路(22) (23)之對應一端22A、23A相 =^貫孔(14)、,再於貫孔(14)中形成導電體 ,即可利用該導電體(3 〇 )電氣導通兩層間之 、本路(2 2 ) ( 2 3 ),此時即可自兩線路(2 2 ) ( 2 一相對另知2 2 B、2 3 B得到又一組新的頻率值, 於本實施例中導電體(3 0 )之形成係可於貫孔(丄4 ) ‘紙張尺度適用^^準(cns)aI^各(2ΐ5·_χ1^公釐 (請先閱讀背面之注意事項再填寫本頁) 訂· · •線· 經濟部智慧財產局員工消費合作社印製 D7 五、創作說明(f ) 中進行穿孔電鍍為之; 欲獲=另一新之頻率值,則再於兩基板(U) (1 3 )上所。又線路(2 1 ) ( 2 3 )之相對位置2 i B、2 3B分別形成—貫孔(14) ’再於該貫孔(i4)設一 導電體(30),以電氣連通兩線路(21)(23), 此時即可於該兩線路之接點端子2 χ a、2 3 A形成一新 之頻率值。 仍請繼續參閱第四圖所示,利用米安德天線線路(2 1 ) ( 2 2 ) ( 2 3 )可分別形成於各層之基板(丄丄) (12) (13)上’即可分別自各層基板(ιι) (ι (13)之線路(2 1 ) ( 2 2 ) ( 2 3 )兩端獲得 組頻率,再加上湘上、下層間之電連串接作業,使不 同層間之線路串接,而可選擇製不同頻率值天線,由此可 知,利用將米安德蘭天線線路以印刷、重疊之方式,可於 多層基板製程時任意選擇欲形成之頻率天線規格。、 厂由上可知,將米安德蘭天線線路實施於多層線電板並 合而成,如此-來,即可於製程時增加頻率之選擇性, 並可確實將天線平面化,進而達到於電路板實施時並突出 之問題,加上利用低溫共燒陶究材料 輕天線確實達到微小化體積,並且可增加其生產產 1=曰 外觀之吴化,故相較於習用各類頻率規格之天線於製程及 產品上,係可達到簡化繁複之製程及產品突出之特性。 因此,本發明已於空間結構設計較習用天線或不同, 並且所達成多段頻率之使用㈣f用平面天線結構所 480773 C7 __D7_五、創作說明(b) 易達成,故此一發明不但可增進產業上之利用性,並已符 合申請發明之專利要件,爰法依提出申請。 ---------------- (請先閱讀背面之注意事項再填寫本頁) 訂- --線· 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)• I .------------ ^ ---------- ^ --------- line (Please read the phonetic on the back? Matters before filling out this page ) 480773 C7 V. Creation instructions (0) Formed on the above substrates in the shape of Miandelan antenna (= antenna line (11) one brush two = see the second figure, most of the Miandelan antenna line [shape The line segments are connected, that is, the level of the L-shaped line segment 2 1). The free end is connected to the free end of the vertical part of the other _L-shaped line at a vertical angle to form a continuous vertical zigzag line. Derived from both ends. The first and second figures show a preferred implementation of the present invention; a three-layer substrate (11) is formed by lamination, and the above-mentioned Mian Delan antenna line (21) is formed on each substrate 1). , = The two ends of the substrate (line ⑴ on line ⑴) 21: There is a specific operating frequency between the pictures, so the frequency value of each layer of line (2 jin is based on the length, number, and thickness of the line (2 丄) It is determined by other conditions; in addition, in order to make the crystal: sky: 0) you can choose to make another set of antennas with different operating frequency values than the above three sets, please refer to the fourth figure, on the three-layer substrate (11 ) (、 工 2) (13) After lamination, the 22A and 23A phases of the corresponding ends of two adjacent substrates (12) (3) and the line (22) and (23) = through holes (14), and then A conductor is formed in the through-hole (14), and the conductor (30) can be used to electrically conduct the current path (2 2) (2 3) between the two layers. At this time, the two lines (2 2) ( 2 A relatively new 2 2 B, 2 3 B to obtain a new set of frequency values. In this embodiment, the formation of the conductor (30) can be performed in the through hole (丄 4). (Cns) aI ^ each (2ΐ5 · _ 1 ^ mm (please read the precautions on the back before filling this page) Order · · • Thread · Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs D7 V. Perforation plating in the creative instructions (f); = Another new frequency value, then on the two substrates (U) (1 3). And the relative positions of the lines (2 1) (2 3) 2 i B, 2 3B are formed-through holes (14) 'A conductive body (30) is further provided in the through hole (i4) to electrically connect the two lines (21) (23), and at this time, a contact terminal 2 χ a, 2 3 A of the two lines can be formed into a The new frequency value. Please continue to refer to the fourth figure, using the Meander antenna line (2 1) (2 2) (2 3) can be formed on each layer of the substrate (丄 丄) (12) (13) You can get the group frequency from both ends of the circuit (2 1) (2 2) (2 3) of each layer of substrate (ι) (ι (13)), plus the electrical connection between the upper and lower layers of Hunan. , So that the lines between different layers are connected in series, and you can choose to make antennas with different frequency values. From this, we can know that the use of printed and overlapped Mian Delan antenna lines can be arbitrarily made during the multilayer substrate process. Choose the frequency antenna specifications you want to form. The factory can know that the Mian Delan antenna line is implemented by combining multi-layer wire electrical boards. In this way, the frequency selectivity can be increased during the manufacturing process, and it can be confirmed. The planarization of the antenna, and then the prominent problems during the implementation of the circuit board, coupled with the use of low-temperature co-fired ceramic materials, the light antenna does achieve a miniaturization volume, and can increase its production output. Compared with conventional antennas of various frequency specifications in the manufacturing process and products, it can achieve simplified and complicated manufacturing processes and outstanding features of the product. Therefore, the present invention has a different space antenna design than conventional antennas, and the use of multiple frequency bands can be achieved. The flat antenna structure is used. 48773 C7 __D7_ V. Creation Instructions (b) It is easy to achieve, so this invention can not only improve the industrial The application is in accordance with the patent requirements for applying for an invention, and the application is not made according to law. ---------------- (Please read the notes on the back before filling out this page) Order ----Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is suitable for China National Standard (CNS) A4 specification (210 X 297 mm)

Claims (1)

H-OU/ ID Α8 Β8 C8 D8 、申請專利範圍 種 具多層基板之晶粒式米安德蘭天線,其包含 一杷緣板; 層或層以上之基才反,係設於上述兩絕緣板間; -組或—組以上之線路,各組線路係以米安德蘭天線 形狀形成於上述相對之基板上;其中: 前述各線路可透過列的連㈣係,提供㈣的天線 頻率值。 經濟部智慧財產局員工消費合作社印製 本〜申請專利範圍第1項所述具多層基板之晶粒式 只女德蘭天線’其中該来安德蘭天線線路係為—多數l形 線路連接而成,即一W線路之水平部之自由端以垂直角 度連接於另一L形線路垂直部之自由端,以構成連續垂直 曲折狀線路。 、…3 :如申請專·圍第2項所述具多層基板之晶粒式 米女德闌天線,上述相鄰兩層基板於形成天線線路的一相 對位置分別形成對應的貫孔,並於貫孔内設―導電體以串 接兩基板上之線路。 、…4:如中請專利範圍第3項所述具多層基板之晶拉式 米安德蘭天線,上述貫孔内係以電鍍形成導電體。 、5 .如中請專利範圍第丄、2或3項所述具多層基板 之晶粒式米安德蘭天線,上述天線線路係以印刷方式形成 於基板上。 ,6:如申請專利範圍第5項所述具多層基板之晶粒式 米女德蘭天線,其中基板係為一高介質之陶莞材質。 ----------Γ-- (請先閱讀背面之注意事項再填寫本頁) 訂 線,、--- I — I II· 本紙張尺度適用中國國家標準(CNS ) A4規格(210Χ$97公釐H-OU / ID Α8 Β8 C8 D8, the patent application scope is a grain-type Miandelan antenna with a multi-layer substrate, which includes a flanged plate; the base of the layer or more is reversed, and it is located on the above two insulating plates -Groups or-Groups of lines or more, each group of lines is formed on the above-mentioned opposite substrate in the shape of a Miandelan antenna; wherein: each of the foregoing lines can provide a chirped antenna frequency value through a series of lines. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ~ Application of the patented scope of item No. 1 of the chip-type female-type antenna with multilayer substrates That is, the free end of the horizontal portion of one W line is connected to the free end of the vertical portion of another L-shaped line at a vertical angle to form a continuous vertical zigzag line. , ... 3: As described in the application for the second type of crystal-type microphone antenna with multi-layer substrates, the adjacent two-layer substrates respectively form corresponding through holes at a relative position forming the antenna line, and The through hole is provided with a conductive body to connect the lines on the two substrates in series. , ... 4: As described in item 3 of the patent scope, a crystal-pulling Miandelan antenna with a multi-layer substrate, the above-mentioned through-holes are formed by electroplating in a conductive body. 5. As described in item 德, 2 or 3 of the patent scope of the patent, a crystalline Miandelland antenna with a multi-layer substrate, the antenna circuit is formed on the substrate by printing. 6: A crystalline Miedelland antenna with a multilayer substrate as described in item 5 of the scope of the patent application, wherein the substrate is a high dielectric ceramic material. ---------- Γ-- (Please read the notes on the back before filling in this page) Threading, --- I-I II · This paper size applies to China National Standard (CNS) A4 specifications (210 × $ 97 mm 480773 A8 B8 C8 D8 六、申請專利範圍 7 ·如申請專利範圍第6項所述具多層基板之晶粒式 米安德蘭天線,該高介質陶瓷材質係由低溫共燒製程形成 之0 (請先閱讀背面之注意事項再填寫本頁) 線 經濟部智慧財產局員工消費合作社印製 44- 本紙張尺度適用中國國家標準(〇他)八4^格(210/297公釐)480773 A8 B8 C8 D8 VI. Application for patent scope 7 · As described in the patent application scope item 6, the grain-type Miandelan antenna with multi-layer substrate, the high-dielectric ceramic material is formed by low temperature co-firing process 0 (please (Please read the notes on the back before filling in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Online Economics 44- This paper size applies to Chinese national standard (〇 他) 8 4 ^ grid (210/297 mm)
TW90105153A 2001-03-06 2001-03-06 Chip-type Mianderlan antenna with multi-layered substrates TW480773B (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7460070B2 (en) 2005-11-14 2008-12-02 Chant Sincere Co., Ltd. Chip antenna
US7571534B2 (en) 2003-11-19 2009-08-11 National Taiwan Univeristy Of Science And Technology Method for manufacturing a chip antenna
US7586155B2 (en) 2004-07-07 2009-09-08 Semi Solutions Llc. Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
US7651905B2 (en) 2005-01-12 2010-01-26 Semi Solutions, Llc Apparatus and method for reducing gate leakage in deep sub-micron MOS transistors using semi-rectifying contacts
US7683433B2 (en) 2004-07-07 2010-03-23 Semi Solution, Llc Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
US7863689B2 (en) 2006-09-19 2011-01-04 Semi Solutions, Llc. Apparatus for using a well current source to effect a dynamic threshold voltage of a MOS transistor
US7898297B2 (en) 2005-01-04 2011-03-01 Semi Solution, Llc Method and apparatus for dynamic threshold voltage control of MOS transistors in dynamic logic circuits
CN102354803A (en) * 2011-06-02 2012-02-15 西北工业大学 Ceramic Bluetooth antenna
US8247840B2 (en) 2004-07-07 2012-08-21 Semi Solutions, Llc Apparatus and method for improved leakage current of silicon on insulator transistors using a forward biased diode
CN102780080A (en) * 2011-05-13 2012-11-14 吴江华诚复合材料科技有限公司 Miniaturized ceramic chip antenna

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7571534B2 (en) 2003-11-19 2009-08-11 National Taiwan Univeristy Of Science And Technology Method for manufacturing a chip antenna
US7586155B2 (en) 2004-07-07 2009-09-08 Semi Solutions Llc. Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
US7683433B2 (en) 2004-07-07 2010-03-23 Semi Solution, Llc Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors
US8247840B2 (en) 2004-07-07 2012-08-21 Semi Solutions, Llc Apparatus and method for improved leakage current of silicon on insulator transistors using a forward biased diode
US7898297B2 (en) 2005-01-04 2011-03-01 Semi Solution, Llc Method and apparatus for dynamic threshold voltage control of MOS transistors in dynamic logic circuits
US7651905B2 (en) 2005-01-12 2010-01-26 Semi Solutions, Llc Apparatus and method for reducing gate leakage in deep sub-micron MOS transistors using semi-rectifying contacts
US7460070B2 (en) 2005-11-14 2008-12-02 Chant Sincere Co., Ltd. Chip antenna
US7863689B2 (en) 2006-09-19 2011-01-04 Semi Solutions, Llc. Apparatus for using a well current source to effect a dynamic threshold voltage of a MOS transistor
CN102780080A (en) * 2011-05-13 2012-11-14 吴江华诚复合材料科技有限公司 Miniaturized ceramic chip antenna
CN102354803A (en) * 2011-06-02 2012-02-15 西北工业大学 Ceramic Bluetooth antenna

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