478204 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（1 ) (本發明所屬之技術領域） 本發明有關於使用於攜帶型通訊機器等之天線裝置。 (先前技術） 在於攜帶電話等之通訊機器上，以往係使用螺旋狀天 線等之線狀天線，惟，這些係安裝於通訊機之箱體之外部 ，一方面成爲小型化之妨礙，同時由外力之作用於天線而 有引起破損及變形，特性劣化等之問題之危險性。再者在 安裝上須介著同軸電纜或連結器等等使零件件數增多，在 安裝成本面而言也不合宜。 爲了解決上述之方法，在日本專利公報特開平9 -6 4 6 2 7號有提案第2 6圖所示之在於電路基板上可以 表面安裝之小型天線。此天線係利用瓷質多層基板之技術 ，由而在瓷質基體3 0之內部形成螺旋型天線者。詳述之 在不同之瓷質層分別形成導體3 1。而以內側塡充導體之 穿通孔3 2，由而疊層了整體而言成爲螺旋狀導體，由疊 層了瓷層而構成爲內包了螺旋狀輻射導體之瓷質天線，又 在於基體3 0之端面形成有對於該螺旋狀導體給電用之端 子3 3。 (本發明欲解決之問題） 惟接上述之構造時，需要在於燒成前之瓷質薄片上形 成導體，而後將它疊層後燒成，所以必要考量了燒成收縮 等之設計，加上爲了收縮率維持於一定値，須要求精度非 (請先閱讀背面之注音？事項 本頁) -丨裝 訂 ί線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -4- 478204 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（2 ) 常高之製程管理，很難降低製造成本。 假定將導體形成於全部燒成完成之瓷質導體表面，惟 在於表面係平坦之瓷質塊上需要以，至少在於四個面上， 可以實施印刷法等精緻之導體形狀控制之方法來實施導體 之形成者，因此亦成爲妨礙減低成本之原因。 本發明係鑒於上述情形以提供可以減低製造成本之天 線裝置爲目的。 (解決上述課題之手段） 爲了達成上述目的，本發明之天線裝置乃，具有： 具有上下面，同時交互地形成有凹部及凸部之一對之 側面之，由介電體及磁性體中之至少一方所成之基體，及 形成於上述基體之上下面及該基體之上述一對之側面 之凸部或凹部，整體而言以螺旋狀地圍繞該基體之螺旋導 體層，而構成爲其特徵者。 於是本發明乃於上述之天線裝置中，上述側面之凸部 或凹部之至少一個乃爲了對於上述螺旋導體層給電之用之 端子爲宜。 又上述之本發明之一天線裝置中，具有覆罩形成於上 述基體上之螺旋導體層之至少一部份之由介電體及磁性體 之中之至少一方之層而構成爲宜。 在本發明之天線裝置乃在於瓷質基體表面上形成螺旋 狀輻射導體之螺旋狀天線者，而基體上下面之導體層係得 以印刷法來實施。又於側面凸部形成導體層時得採用浸漬 ir^----^------裝·—— (請先閱讀背面之注意事項再iiiir本頁) · 線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -5- 478204 A7 _ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（3 ) 法或輕筒塗裝法等等得以可以高速的實施電極塗佈之方法 而只在凸部形成電極。特別是在於凸部形成電極時，即適 用輥筒塗佈器時即與印刷相比較適合於大量生產也。 又在於凸部形成電極時，即在於安裝時對於凸部之電 極之連接上使用錫焊時，具有該焊錫不易發生架橋現象之 利點。或在於側面凹部形體導體層時，即如後述之實施形 態所示’在於穿通孔中塡充導體等之方法就可形成，此時 亦具有不易發生架橋現象之利點， 如上所述，依本發明時很容易大量生產，大幅度地可 以減低成本。 再者’形成了導體之側面凸部或側面凹部乃得以原狀 使用爲端子電極，所以很容易製造表面安裝天線。 又本發明之天線裝置，乃 具備：.由構成上述螺旋導體層之，在於上述基體之一 方之側面依序隔著間隔地被配置排列之複數之部份之中之 一所成之，對於上述螺旋導體層給電用之給電電極，及 由構成上述螺旋導體層之，在於上述基體之一方之側 面依序隔著間隔地被配置排列之複數之部份之中之其他之 一所成之對於上述螺旋導體層接地之用之接地電極而構成 爲宜。 如上所述，側面凸部或側面凹部係原狀地可利用於給 電電極及接地電極亦可。更進一步以覆罩螺旋導體地設置 介電體層或磁性體層即可以更能小型化也 又本發明之天線裝置，乃具備有··由，構成上述螺旋 (請先閱讀背面之注意事項 本頁) 裝 訂 i線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -6 - 478204 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（4 ) 導體層之上述基體之一方之側面，依序隔著間隔地配置排 列之複數之部份中之據於一方之端之部份位置所成之爲了 對於上述螺旋導體層給電之用之給電電極，及 於上述基體之，被形成了上述給電電極之側面之同一 側面之，對於上述給電電極而隔著規定之間隔地形成於鄰 接於該給電電極之位置之，爲了將上述螺旋導體層予以接 地之用之接地電極，及 自上述接地電極延伸，經由上述基體之上面，而連接 於上述螺旋導體層，由而與上述螺旋導體層之一部份協同 以資連接上述接地電極與上述給電電極用之連接導體層爲 合宜之態樣。 或由，構成上述螺旋導體層之上述基體之一方之側面 ，依序隔著間隔地配置排列之複數之部份中之據於一方之 端之部份所成之爲了對於上述螺旋導體層給電之用之給電 電極，及 於上述基體之，被形成了上述給電電極之側面之同一 側面之，對於上述給電電極而隔著規定之間隔地形成於鄰 接於該給電電極之位置之，爲了將上述螺旋導體層予以接 地之用之接地電極，及 自上述接地電極延伸’經由上述基體之上面’再經由 上述基體之被形成上述接地電極之側面之相反側之側面而 連接於上述螺旋導體層，由而與上述螺旋導體層之一部份 協同以資連接上述接地電極與上述給電電極之連接導體層 而構成者係合宜之態樣者。 (請先閱讀背面之注意事項 本頁) -丨裳 訂'· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 478204 A7 _ B7 五、發明說明（5 ) 按在於本發明中，如果令給電電極與接地電極，在於 接觸於電路基板之基體下面地予以連接狀的形成導體圖樣 時，即天線之諧振週波數會發生偏差很大之情形之虞。而 如上述，於上面或側面地連接給電電極與接地電極就可消 除上述之不合宜之可能性，可以構成高精度之天線裝置。 再者本發明之天線裝置組裝體乃具備有：具有上下面 ，同時具有交互地形成凹部及凸部之一對之側面之，由介 電體及磁性體中之至少一方所成之基體，及 形成於上述基體之上下面，及該基體之上述一對之側 面之凸部或凹部，備有全體而言，螺旋狀的圍繞該基體之 螺旋導體層之天線裝置，以及以天線裝置下面接觸之狀態 地載置有天線裝置之電路基板，上述天線裝置及具備： 經濟部智慧財產局員工消費合作社印製 由構成上述螺旋導體層之，在於上述基體之一方之側 面依序隔著間隔地被配置排列之複數之部份之中之據於一 方之端之部份之位置所成之爲了對於上述螺旋導體層給電 之用之給電電極，及於上述基體之，被形成了上述給電電 極之側面之同一側面之，對於上述給電電極而隔著規定之 間隔地形成於鄰接於該給電電極之位置之，爲了將上述螺 旋導體層予以接地之用之接地電極，及自上述接地電極延 伸，經由上述基體之下面而連接於上述螺旋導體層，由而 與上述螺旋導體層之一部份協同以資連接上述接地電極與 上述給電電極之連接導體層，具有免除了，上述天線裝置 下面之上述螺旋導體層與上述連接導體層之接觸點，與上 述電路基板之接觸之構造， -8- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 478204 A7 _ _ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（6 ) 爲其特徵者。 本發明之天線裝置組裝體係備有，在於基體下面而連 接了給電電極與接地電極之天線裝置，惟由於使該天線裝 置之螺旋導體層與接地導體層之連接點不致於與電路基板 接觸地予以構成，所以與在於天線裝置之基體之上面或側 面形成其連接點之情形同樣地可以抑制發生天線之諧振週 波數之偏差之問題，可以獲得高精度之天線也。 (發明之實施形態） 下面說明本發明之實施形態。 圖1係本發明之天線裝置之第1實施形態之斜視圖。 本天線裝置1之基體2乃具有上面2 1，下面2 2， 及交互地形成有凹部2 3 1及凸部2 3 2之一對側面2 3 。又於此基體2之上面2 1形成有連接一對側面2 3之對 應之凸部2 3 2與凸部2 3 2之導體層3。在基體2之下 面2 2形成有連接該一對側面2 3之各偏移一個之凸部 2 3 2，與凸部2 3 2之導體層4，再在於一對之側面 2 3之凸部2 3 2亦形成有導體層5，這些導體層3，4 ，5係整體而言成爲螺旋狀地圍繞基體2之螺旋導體層。 本例中基體2係於高週波帶中而比介電率（ε r )， 比透磁率（// r )呈安定且低損失以振週波數之溫度係數 (τ f )小者爲宜。本例中乃使用氧化鋁系之瓷片（於 2GHz 而 er = 8 · 5，Q=l〇〇〇，rf = 38 p P m / °C )。導體係銅、銀、金、鎳等導體電阻之低者 (請先閱讀背面之注意事項478204 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the Invention (1) (Technical Field to Which the Invention belongs) The present invention relates to antenna devices used in portable communication equipment and the like. (Prior art) In the past, communication devices such as mobile phones used linear antennas such as helical antennas. However, these devices were installed outside the casing of the communication device. On the one hand, they became a hindrance to miniaturization. The effect on the antenna may cause problems such as damage, deformation, and deterioration of characteristics. In addition, the number of parts must be increased through the installation of coaxial cables or connectors, which is also unsuitable in terms of installation cost. In order to solve the above-mentioned method, there is a proposal in Japanese Patent Laid-Open No. 9-6 4 6 2 7 as shown in FIG. 26. A small antenna that can be surface-mounted on a circuit board is shown in FIG. This antenna uses the technology of a porcelain multilayer substrate to form a spiral antenna inside the porcelain substrate 30. In detail, the conductor 31 is formed in different porcelain layers. The inner through-hole filled conductor 32 is laminated to form a spiral conductor as a whole, and a porcelain layer is laminated to form a porcelain antenna with a spiral radiation conductor inside. A terminal 33 for supplying electricity to the spiral conductor is formed on the end surface of 0. (Problems to be Solved by the Invention) However, in the above-mentioned structure, it is necessary to form a conductor on the porcelain sheet before firing, and then laminate and fire it, so it is necessary to consider the design of firing shrinkage, etc. In order to maintain the shrinkage ratio to a certain level, you must require non-accuracy (please read the note on the back? Matters page first)-丨 Binding line · This paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm)- 4- 478204 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (2) The often high process management makes it difficult to reduce manufacturing costs. It is assumed that the conductor is formed on the surface of the all-fired ceramic conductor, but the surface is a flat ceramic block, and at least on four sides, the conductor can be implemented by exquisite methods such as printing to control the shape of the conductor. The creator of it has also become a cause of hindering cost reduction. The present invention has been made in view of the above circumstances, and an object thereof is to provide an antenna device which can reduce the manufacturing cost. (Means for Solving the Problems) In order to achieve the above-mentioned object, the antenna device of the present invention includes: a side surface having a pair of concave portions and convex portions alternately formed at the same time with an upper surface and a lower surface; The base body formed by at least one side, and the convex or concave portions formed on the upper and lower sides of the base body and the side surfaces of the pair of the base body as a whole spirally surround the base body's spiral conductor layer, and are characterized by its features. By. Therefore, the present invention is in the above-mentioned antenna device, and at least one of the convex portion or the concave portion on the side is a terminal for supplying power to the spiral conductor layer. In the antenna device according to the present invention described above, it is preferable that the antenna device includes at least one of a dielectric body and a magnetic body that covers at least a part of the spiral conductor layer formed on the substrate. The antenna device of the present invention is a spiral antenna in which a spiral radiation conductor is formed on the surface of a porcelain substrate, and the conductor layers above and below the substrate are implemented by printing. When forming the conductor layer on the side convex part, it is necessary to use immersion ir ^ ---- ^ ------ installation (——Please read the precautions on the back before iiiir this page) · Line · This paper size is applicable to China National Standard (CNS) A4 Specification (210 X 297 mm) -5- 478204 A7 _ B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (3) Method or Light Barrel Coating Method The electrode coating method is used to form an electrode only on the convex portion. In particular, when electrodes are formed on the convex portions, even when a roll coater is applied, they are more suitable for mass production than printing. It also has the advantage that when soldering is used to form electrodes on the bumps, that is, when soldering is used to connect the electrodes on the bumps, bridging is unlikely to occur with the solder. Or in the case of a side-concave-shaped conductor layer, as shown in the embodiment described below, it can be formed by filling the conductor in the through-hole, etc. At this time, it also has the advantage that the bridging phenomenon is not easy to occur. When it was invented, it was easy to mass-produce, and the cost was greatly reduced. Furthermore, since the side convex portion or the side concave portion of the conductor is formed as a terminal electrode, it is easy to manufacture a surface-mounted antenna. The antenna device of the present invention includes: one of the plurality of parts constituting the spiral conductor layer and one side of one of the substrates arranged side by side at intervals; The spiral electrode layer is provided with a power supply electrode for power supply, and the spiral coil layer is formed by the other one of the plurality of parts arranged side by side on one side of the base body in sequence at intervals. A ground electrode for grounding the spiral conductor layer is suitable. As described above, the side convex portion or the side concave portion may be used as it is for the power supply electrode and the ground electrode. Further, the dielectric layer or the magnetic layer can be provided by covering the spiral conductor, which can further reduce the size of the antenna device of the present invention, and has the ... to form the spiral (please read the caution page on the back first) Binding i-line · This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) -6-478204 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (4) The above of the conductor layer The side of one side of the base body is formed by sequentially arranging the positions of the plurality of parts arranged at intervals according to the position of one end of the base body. That is, a ground electrode formed on the same side of the side of the power feeding electrode, and a ground electrode for the power feeding electrode formed at a predetermined interval adjacent to the power feeding electrode, for grounding the spiral conductor layer. , And extending from the ground electrode, connected to the spiral conductor layer through the upper surface of the base, and part of the spiral conductor layer It is appropriate that the connection conductor layer for connecting the above-mentioned ground electrode and the above-mentioned power supply electrode is suitable. Or, the side of one of the above-mentioned bases constituting the spiral conductor layer is formed by sequentially arranging the portions based on one of the plurality of portions arranged at intervals in order to supply electricity to the spiral conductor layer. The power supply electrode used is the same as the side of the base body on which the side of the power supply electrode is formed, and the power supply electrode is formed at a predetermined interval adjacent to the power supply electrode at a predetermined interval. A ground electrode for grounding the conductor layer, and extending from the ground electrode through the upper surface of the base body, and then to the spiral conductor layer through the side surface of the base body opposite to the side surface on which the ground electrode is formed, thereby It is a suitable form to form a connection conductor layer that cooperates with a part of the spiral conductor layer to connect the ground electrode and the power supply electrode. (Please read the Cautions on the back page first)-丨 Shang Dian '· This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 478204 A7 _ B7 V. Description of the invention (5) In the invention, if the power supply electrode and the ground electrode are connected to form a conductor pattern in contact with the substrate of the circuit substrate, the antenna's resonance frequency may be greatly deviated. As described above, connecting the power supply electrode and the ground electrode at the top or side can eliminate the above-mentioned unfavorable possibility, and can constitute a high-precision antenna device. Furthermore, the antenna device assembly of the present invention is provided with a base body made of at least one of a dielectric body and a magnetic body, having a top surface and a bottom surface and alternately forming a pair of concave portions and convex portions, and The antenna device formed on the base body above and below, and the convex or concave portions of the pair of side surfaces of the base body as a whole, spirally surrounds the helical conductor layer of the base body, and the antenna device is in contact with the bottom side of the antenna device. The circuit board on which the antenna device is mounted in a state is provided. The antenna device is provided with: printed by an employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Among the plural parts of the arrangement, a power supply electrode for supplying power to the spiral conductor layer according to the position of a part of one end, and a side of the base body on which the power supply electrode is formed are formed. On the same side, the power supply electrode is formed at a position adjacent to the power supply electrode at a predetermined interval. The ground electrode for grounding the spiral conductor layer, and the ground electrode extending from the ground electrode and connected to the spiral conductor layer through the underside of the base body, thereby cooperating with a part of the spiral conductor layer to connect the ground electrode and the ground electrode. The connection conductor layer of the above-mentioned power supply electrode has the structure of eliminating the contact points between the spiral conductor layer and the connection conductor layer under the antenna device, and the contact with the circuit substrate. -8- This paper size applies Chinese national standards ( CNS) A4 specification (210 X 297 mm) 478204 A7 _ _ B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of invention (6) is its characteristic. The antenna device assembly system of the present invention is provided with an antenna device that connects a power feeding electrode and a ground electrode under a substrate, but because the connection point of the spiral conductor layer and the ground conductor layer of the antenna device is not prevented from contacting the circuit substrate, Structure, similar to the case where the connection point is formed on the top or side of the base body of the antenna device, the problem of deviation of the resonance frequency of the antenna can be suppressed, and a high-precision antenna can be obtained. (Embodiment of Invention) An embodiment of the present invention will be described below. FIG. 1 is a perspective view of a first embodiment of an antenna device according to the present invention. The base body 2 of the antenna device 1 has an upper surface 21, a lower surface 2 2 and one pair of side surfaces 2 3 of a concave portion 2 3 1 and a convex portion 2 3 2 alternately formed. A conductor layer 3 is formed on the upper surface 2 1 of the base 2 to connect the corresponding convex portion 2 3 2 and the convex portion 2 3 2 of the pair of side surfaces 2 3. On the lower surface 2 2 of the base body 2 are formed convex portions 2 3 2 which are offset by one from each of the pair of side surfaces 2 3, and a conductor layer 4 of the convex portions 2 3 2, and further are convex portions of the pair of side surfaces 2 3. A conductor layer 5 is also formed in 2 3 2. These conductor layers 3, 4, and 5 are spiral conductor layers that spirally surround the base body 2 as a whole. In this example, the matrix 2 is in a high frequency band, and the specific permittivity (ε r), the specific permeability (// r) are stable, and the loss is low, and the temperature coefficient (τ f) of the vibration frequency is preferably small. In this example, an alumina-based ceramic sheet was used (er = 8 · 5, Q = 100, rf = 38 p P m / ° C at 2 GHz). The conductor resistance of copper, silver, gold, nickel and other conductors is low (please read the precautions on the back first)
本頁) * 身 了·-言 -線_ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -9 - 478204 附件1.第89115947號專利申請案 中文說明書修正頁A7民國90年9月修 B7(This page) * Bringing it in.-Speech-line _ This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) -9-478204 Annex 1. No. 89115947 Patent Application Chinese Specification Revision Page A7 Republic of China Repaired B7 in September 1990
經濟部智慧財產局員工消費合作社印％ 五、發明説明（7) 爲宣。本例內採用銀—白金膏。（Dupont社Q S — 1 7 1 )〇 下面參照圖2〜圖5，說明於圖1所示之天線裝置1 之製造過程。 首先準備如圖2所示之氧化鋁基板9。在此氧化鋁基 ® 9上，以在於後過程而能分割所欲之尺寸地設置截分線 1〇。 又於截分線上之所欲之處所設置穿通孔1 1。本例中 ’ 5 〇mmx 5 0mm，厚度1mm之氧化銘基板上所設 之截分線1 0乃縱方向5 m m間隔，橫方向1 0 m m間隔 ’將穿通孔1 1以0 . 8 0，在於橫方向之截方線之上面 2 m m間隔地予以配置。 接著在於此氧化鋁基板9之上面9 Γ，下面9 2上， 分別以圖3 ( A )，圖3 ( B )所示地形成導體圖樣1 2 ’ 1 3。形成方法係將導體膏予以網版印刷，待乾燥後以 8 5 0 °C燒成。 接著將上下導體形成後之氧化鋁基板9，以沿著形成 了穿通孔之截分線而分割成如第4圖狀。並且預先將導體 膏1 5使用滑刮板（Singe )等而延伸爲厚度0.2mm， 而在此導體膏1 5上，浸漬上述之氧化鋁基板之以穿通孔 所形成之凸部，而將導體膏1 5只塗佈於凸部之先端，乾 燥，予以燒成。 最後如圖5所示，在於以截分線而分割成爲最小單位 ，由而獲得天線裝置1。如上述，本構造之天線乃一次可 (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） -10- 478204 A7 B7 五、發明說明（8 ) 能製造多數，減少製造成本之效果很大。 圖6係本發明之天線裝置之第2實施形態之斜視圖。 本天線裝置1之基體2乃如圖1之天線裝置1之基體 2同樣，具有上面2 1 ，下面2 2，以及交互地形成有凹 部2 3 1及凸部2 3 2之一對之側面2 3。惟此圖6:所示 之天線裝置1之導體層乃與圖1所示之天線裝置之導體層 多少有所不同。圖6所示之天線裝置1乃，於上面2 1上 ，形成有連接1對之凹部231，231之導體3，在於 背面形成連接1節距偏差而成之凹部與凹部之導體4，在 於凹部內壁形成導體5，以導體3，4，5而形成螺旋狀 導體。惟這些導體層3，4，5之全體來構成螺旋狀地圍 繞基體2之導體層之點即與圖1所示之天線裝置時者相同 也。 本例中圖6所示之天線裝置1之基板2乃，與圖1所 示之天線裝置，同樣於高週波帶，而比介電率（e r )， 比透磁率（// r )呈安定且低損失，諧振週波數之溫度係 數（τ f )小者爲合宜。本例中使用氧化鋁系之瓷板（於 2GHz 而 er = 8.5、Q=1000、r f = 3 8 p p m / °C )。導體係銅、銀、金、鎳等導體電阻低者爲 合宜。本例中採用銀—白金膏。（Dupont公司〇3 — 17 1)。 下面參照表示圖6所示之天線裝置1之製造過程之圖 7〜圖7說明圖6所示之天線裝置1之製造方法。 氧化鋁基板9乃如圖7所示，在於後製程而可分割爲 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） irl,----.------裳--- (請先閱讀背面之注意事項再mr本頁) 訂"· --線. 經濟部智慧財產局員工消費合作社印製 11 - 478204 A7 ___ B7 五、發明說明（9 ) 所欲之尺寸地設置截分線1 0。又於截分線上之規定處所 設穿通孔1 1。 本例中，5 Ommx 5 Omm，厚度1mm之氧化銘 基板9上，設置截分線1 0，以縱方向5 m m間隔，橫方 向1 0 m m間隔，穿通孔1 1係〇 · 8 0者以橫方向之截 分線上以2 m m間隔地予以配置。 接著如圖8所示，在此氧化鋁基板9之穿通孔，使用 印刷法塡充導體膏，乾燥後，以8 5 0 °C燒成，形成了穿 通孔導體1 4。 接著在此氧化鋁基板9之上面9 1，下面9 2以印刷 法形成如圖9 (A)，圖9 (B)所示之導體圖樣12， 13° 最後以圖1 0所示，在於截分線1 0而分割成爲最小 單位，而可獲得天線裝置1，如上所述依本構造之天線一 次可製造多數個天線，製造成本之減低效果很大。 又本案到此爲止對於二個實施形態做說明，惟對於這 些實施形態之任一者均可以在分割氧化鋁基板9之前，或 分割之後，在於形成於氧化鋁基板上之導體層上可再形成 與氧化鋁基板9同質之層，如此構成之後，將可以使同一 波長帶域送受訊用之天線更求其小型化也。 接著說明如上述地製造而成之天線裝置之性能。本例 乃說明圖1所示之天線裝置。 將此天線裝置1載置於如圖1 1之2 5 X 5 0 m m， 厚度Ο · 8mm之評鑑用基板上。該評鑑用基板乃在絕緣 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） irl — i------裝—— (請先閱讀背面之注意事項本頁) 訂·· -線· 經濟部智慧財產局員工消費合作社印製 -12- 478204 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（1〇) 基板1 6之表面形成有條帶線1 7，背面形成接地面1 8 ，而從備於一端之S Μ A連結器1 9而經由條線1 7對於 載置於另一端之天線裝置1供給電力者。 此時之反射損失-週波數特性表示於圖1 2。 成爲諧振週波數2448MHz，反射損失爲 一 6 d B以下之帶域幅係1 3 3 Μ Η z。 又於圖1 3顯示圖1 1之X Υ面之輻射圖樣。輻射增 益乃在此面上成爲大致等方性，最大增益爲 —0 · 7dBi ，最小增益即—2 · 3dBi。 再者對於圖6所示之構成之天線裝置也實施了評鑑， 該結果亦與圖1所示之構成之天線裝置之評鑑結果大致同 等，故本例中省略其說明。 圖1 4係本發明之天線裝置之第3實施形態之斜視圖 〇 本天線裝置1之基體2乃具有上面2 1，下面2 2， 及交互地形成有凹部2 3 1及凸部2 3 2之一對側面2 3 。又於此基體2之上面2 1形成有連接對應於一對側面 23之凸部232，與凸部232之導體層3，在於基體 2之下面2 2形成有連結一對側面2 3之各偏差1節距之 凸部2 3 2與凸部2 3 2之導體層4，再於一對之側面 2 3之凸部2 3 2也形成有導體層5，由這些導體層3， 4 ’ 5而成爲整體而言螺旋狀的圍繞基體2之螺旋導體層 〇 本例中，一對側面2 3中之側面2 3 a之導體層5之 (請先閱讀背面之注意事項 本頁) 裝 Ί -2:0 線- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13- 478204 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（11) 中，整體而言構成螺旋狀的圍繞之螺旋導體層之最端部之 一個乃係給電電極5 a ’而在於鄰接於此給電電極5 a之 位置形成有與螺旋導體層脫離之接地（墊板）電極6 a ’ 再者亦形成有經由基板之上面連接該螺旋導體層與接地電 極6 a之連接導體層6 b。 本例中，基體2乃於高週波帶而比誘電率（ε r )， 比透磁率（// r )呈安定且低損失’諧振週波數之溫度係 數（r ί )小者爲合宜。本例係使用氧化鋁系之瓷板（在 於 2 G Η ζ 之狀態，而 ε r = 8 · 5，Q = 1 0 0 0、τ f = 3 8 p P m / t：)。導體係以銅、銀、金、鎳等導體 電阻之低者爲合宜。本例中使用銀-白金膏。（Dupont社 Q S - 1 7 1 )者。 下面參照表示圖1 4所示之天線裝置1之製造過程之 圖1 5〜圖1 9來說明本天線裝置1之製造方法。 首先準備如圖1 5所示之氧化鋁基板。在此氧化鋁基 板9上，得以後過程而可分割爲所欲之尺寸大小地，設置 截分線1 0。又在於截分線上之所欲之處所設置穿通孔 11° 本例乃在於5 Omx 5 〇mm，厚度1mm之氧化銘 基板上，以縱方向5 m m間隔，橫方向1 0 m m間隔地設 置截分線1 0。穿通孔1 1係在橫方向之截分線2 m m間 隔地配置穿通孔1 1。 接著於氧化鋁基板9之上面9 1，下面9 2分別如圖 1 6，圖1 7地形成導體圖樣1 2，1 3。形成方法係以 •卜丨：----；------裝—— (請先閱讀背面之注意事項再Hit本頁) 訂· _線- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -14- 478204 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（12) 網狀印刷印刷導體膏，乾燥後以8 5 0 °C來燒成。 接著，沿著形成有穿通孔之截分線將形成有上下導體 後之氧化鋁基板9，而如圖1 8地予以分割，並且使用滑 刀板等將導體膏1 5而在玻璃板等之平板1 4上延伸塗佈 爲厚度約0 · 2mm程度，而在該導體膏1 5中浸漬該前 述之氧化鋁基板之藉由穿通孔所形成之凸部，而將導體膏 1 5只塗佈於凸部之先端，乾燥後予以燒成。 最後如圖1 9所示，於截分線而分割成爲最小單位， 而獲得天線裝置1，如上所述，依本構造之天線乃一次就 可以多量地製造。減低製造成本之效果很大。 圖2 0係，本發明之天線裝置之第4實施形態之斜視 圖。說明與圖1 4所示之第3實施形態之不同之點。圖 1 4所示之第3實施形態中，接地電極6 a係與基板整體 而螺旋狀地圍繞之導體層乃經由連接導體6 b而在於基體 上面地予以連接。而圖2 0所示之實施形態即經由連接導 體6 b而在於該形成了接地電極6 a之側面2 3 a之相反 側之側面2 3 b予以連接。 圖2 1係本發明之天線裝置之第5實施形態之斜視圖 〇 本圖2 1所示之第5實施形態中以整體而言螺旋狀的 圍繞基體之螺旋導體層中，配置於一方之側面2 3 a之複 數之導體膜5之中，最端部位之導體膜爲接地電極5 b ’ 鄰接於它之導體膜爲給電電極5a ，而該接地電極5b乃 兼爲接地導體。 (請先閱讀背面之注意事項 本頁) 裝 訂·· --線- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -15- 478204 Α7 Β7 五、發明說明（13) 圖2 2乃表示另一天線裝置之例子之斜視圖。 此圖2 2所示之天線裝置乃天線裝置本身而言，屬於 本發明之天線裝置之比較例，惟亦是構成後述之本發明之 天線裝置組裝體之天線裝置。 圖2 2所示之天線裝置中，接地電極6 a係由連接導 體6 b而經由基體上面，經由形成了接地電極6 a之側面 2 3 a之相反側之側面2 3 b，再經由基體下面，而連接 於以整體而螺旋狀地圍繞基體之螺旋導體層。 下面說明如上述地予以製造之天線裝置之性能。 將此天線裝置1載置於如圖2 3之2 5 X 5 Omm， ，厚度0 · 8 m m之評鑑基板上，該評鑑基板乃，於絕緣 基板1 6之表面形成有條線1 7，背面形成有接地面1 8 ，從備於一端之S Μ A連結器1 9而經由條帶線1 7，而 對於載置於另一端之天線裝置1供給電力者。 表1係顯示如上述地予以測定之結果。「偏差3 0値 」係表示製造多數個相同規格之天線裝置時之諧振週波數 之偏差之3 σ値。 ΙΓΙ----^------裝—— (請先閱讀背面之注意事項本頁) 訂· 線· 經濟部智慧財產局員工消費合作社印製 -16- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） Η ^204 A7 B7 五、發明說明（Μ) 表1 自中心週波數2.45GHz之偏差 接點位置 偏差3 σ値 實施例1 :天線上面（圖1 4 ) 土 30MHz 實施例2 :側面（圖2 0 ) 士 60MHz 實施例3 :以端子兼用（圖2 1 ) 士 62MHz 比較例：下面（圖2 2 ) 土 155MHz 由表1可看出實施例1〜3乃與比較例相比較時有抑 制偏差之效果。 圖2 4係表示本發明之天線裝置組裝體之第1實施形 態。 圖2 4中，天線裝置1乃天線裝置下面接觸於電路基 板上面狀態地載置於電路基板9 7之由基板下面觀視之圖 〇 經濟部智慧財產局員工消費合作社印製 該天線裝置1乃，如圖2 2所示之，該接地電極之藉 由連接導體層而在於基板下面地連接於螺旋導體層之型式 之天線裝置。在於電路基板9 7上，切除該電路基板之一 部份由而設有貫穿於上下面之孔9 7 a，天線裝置1之基 體下面之連接導體層與螺旋導體層之連接部份恰好據位於 該孔9 7 a之位置，而使連接部份不會接觸於電路基板 9 7也。 圖2 5係表示本發明之天線裝置組裝體之第2實施形 態。 氏張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）— 478204 A7 五、發明說明（15) 本圖2 5也與圖2 4者一樣，以電路基板上面有天線 裝置下面接觸之狀態地將圖2 2所示之型式之天線裝置1 載置於電路基板9 7上之從基板下面觀視之圖。 電路基板9 7並沒有設置切除部份，惟天線裝置1之 連接導體及螺旋導體之連接部份係從電路基板9 7之範圍 超出。 如上所述上述之連接部份之被形成於天線裝置下面之 情形下，將電路基板之一部份予以切除或將該部份超出於 電路基板之狀態地予以載置，就可以抑制偏差。 表2係圖2 4，圖2 5之態樣之天線裝置組裝體之_ 振週波數之偏差之測定結果。 ------------I I --I (請先閱讀背面之注意事項本頁) 訂 表2 自中心週波數2.45GHz之偏差 載置方法 偏差3 σ値 接點下之基板切除部（圖2 4 ) ± 72MHz 天線突出（圖2 5 ) ± 68MHz 線- 經濟部智慧財產局員工消費合作社印製 將此表2與上述表1之最下行比較時可知諧振^丨皮^ 之偏差變小。 由上述結果本發明之天線裝置及天線裝置組裝f故 爲攜帶用通訊機用天線而具有充分之性能。 (發明之效果） 478204 A7 ______ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（16) 如上所述’依本發明時，主要乃在於介電體基體表面 形成螺旋狀輻射導體之螺旋狀天線裝置中，在於設於基體 側面之凸部或凹部中形成導體，而連接形成於上下面之導 體而做爲螺旋狀輻射導體，由而可以供給容易大量生產之 最適合於攜帶用通訊終端機之表面安裝型天線也。' 又依本發明時，主要乃於介電體基體表面形成螺旋狀 輻射導體之天線裝置中，將該螺旋狀導體與接地用線狀導 體之接點’形成於當天線載置（安裝）於電路基板時，與 電路基板不接觸之部份，由而與該接點之被形成於電路基 板之面者相比較可以將該諧振週波數之偏差抑制於較小之 値也。 圖式之簡單說明 第1圖表示本發明之天線裝置之第1實施形態之斜視 圖。 第2圖表示第1圖所示之天線裝置之製造過程之中途 階段之圖。 第3圖表示第1圖所示之天線裝置之製造過程之中途 階段之圖。 第4圖表示第1圖所示之天線裝置之製造過程之中途 階段之圖。 第5圖表示第1圖所示之天線裝置之製造過程之中途 階段之圖。 第6圖表示本發明之天線裝置之第2實施形態之斜視 (請先閱讀背面之注意事項 本頁) 裝 · --線- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -19- 478204 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（17) 圖。 第7圖表示第2圖所示之天線裝置之製造過程之中途 階段之圖。 第8圖表示第2圖所示之天線裝置之製造過程之中途 階段之圖。 第9圖表示第2圖所示之天線裝置之製造過程之中途 階段之圖。 第10圖表示第2圖所示之天線裝置之製造過程之中 途階段之圖。 第1 1圖係天線裝置之評鑑方法之說明圖。 第1 2圖表示天線裝置之反射損失-週波數特性之圖 0 第13圖表示第11圖之ZX面之輻射圖樣。 第1 4圖表示本發明之天線裝置之第3實施形態之斜 視圖。 第15圖表示第14圖所示之天線裝置之製造過程之 中途階段之圖。 第16圖表示第14圖所示之天線裝置之製造過程之 中途階段之圖。 第17圖表示第14圖所示之天線裝置之製造過程之 中途階段之圖。 第18圖表示第14圖所示之天線裝置之製造過程之 中途階段之圖。 第19圖表示第14圖所示之天線裝置之製造過程之 (請先閱讀背面之注意事項 本頁) 裝 訂'· -線· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -20- 478204 A7 ____B7 五、發明說明（18) 中途階段之圖。 第2 0圖表示本發明之天線裝置之第4實施形態之斜 視圖。 第2 1圖表示本發明之天線裝置之第5實施形態之斜 視圖。 第2 2圖表示本發明之天線裝置之另一例之斜視圖。 第2 3圖係天線裝置之評鑑方法之說明圖。 第2 4圖表示本發明之天線裝置之組裝體之第1實施 形態之圖。 第2 5圖表示本發明之天線裝置之組裝體之第2實施 形態之圖。 第2 6圖表示在電路基板上表面可以安裝之以往之小 型天線之模式圖。 (標號說明） 1 天線裝置 2 基體 經濟部智慧財產局員工消費合作社印製 3，4 ’ 5 導體層 5 a 給電電極 6 a 接地電極 6b 連接導體層 9 氧化鋁基板 10 截分線 11 穿通孔 -21 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 478204 A7 B7 五、發明說明（19) 7 8 2 2 2 3 2 3 2 導體圖樣 條帶線 接地面 S Μ A連結器 上面 下面 側面 上面 下面 凹部 凸部。 (請先閱讀背面之注 意事項再本頁} 裝 •線_ 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -22Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Consumption Cooperatives, V. Invention Description (7) is declared. In this case, silver-platinum paste is used. (Dupont Corporation Q S — 1 7 1) The following describes the manufacturing process of the antenna device 1 shown in FIG. 1 with reference to FIGS. 2 to 5. First, an alumina substrate 9 as shown in FIG. 2 is prepared. On this alumina-based ® 9, a cut-off line 10 is provided so that the desired size can be divided in a later process. A through-hole 11 is provided at a desired place on the cutting line. In this example, '50 mm x 50 mm, the thickness of 1 mm on the oxidized substrate on the cut-off line 10 is a 5 mm interval in the vertical direction, the horizontal 10 mm interval 'will pass through the hole 11 1 0. 8 0, They are arranged at intervals of 2 mm above the cross-section line in the horizontal direction. Next, conductor patterns 1 2 ′ 1 3 are formed on the upper surface 9 Γ and lower surface 9 2 of the alumina substrate 9 as shown in FIG. 3 (A) and FIG. 3 (B). The forming method is to screen print the conductor paste, and then dry it at 850 ° C. Next, the alumina substrate 9 after the upper and lower conductors are formed is divided into shapes as shown in FIG. 4 along a cut-off line in which a through-hole is formed. In addition, the conductor paste 15 is preliminarily extended to a thickness of 0.2 mm using a squeegee (Singe) or the like, and the conductor paste 15 is impregnated with the convex portion formed by the through hole of the alumina substrate described above, and the conductor is The paste 15 was applied only to the tip of the convex portion, dried, and fired. Finally, as shown in FIG. 5, the antenna unit 1 is obtained by dividing into minimum units by a cut-off line. As mentioned above, the antenna of this structure can be used once (please read the precautions on the back before filling this page). The size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) -10- 478204 A7 B7 5 Explanation of the invention (8) It can produce a large number, and the effect of reducing the manufacturing cost is great. Fig. 6 is a perspective view of a second embodiment of the antenna device of the present invention. The base body 2 of the antenna device 1 is the same as the base body 2 of the antenna device 1 of FIG. 1, and has a top surface 2 1, a bottom surface 2 2, and a pair of side surfaces 2 in which a pair of concave portions 2 3 1 and convex portions 2 3 2 are alternately formed. 3. However, the conductor layer of the antenna device 1 shown in FIG. 6 is somewhat different from that of the antenna device 1 shown in FIG. 1. The antenna device 1 shown in FIG. 6 is formed on the upper surface 21 with a conductor 3 connected to a pair of concave portions 231 and 231, and a concave portion formed on the back side and a conductor 4 connected to the concave portion are formed in the concave portion. The inner wall forms a conductor 5 and the conductors 3, 4, 5 form a spiral conductor. However, the point that all of these conductor layers 3, 4, and 5 constitute a conductor layer that spirally surrounds the base body 2 is the same as that of the antenna device shown in FIG. In this example, the substrate 2 of the antenna device 1 shown in FIG. 6 is the same as the antenna device shown in FIG. 1 in the high frequency band, and the specific permittivity (er) and specific permeability (// r) are stable. Moreover, the lower the loss, the smaller the temperature coefficient (τ f) of the resonance frequency is suitable. In this example, an alumina-based ceramic plate is used (er = 8.5, Q = 1000, r f = 3 8 p p m / ° C at 2 GHz). Conductors with low resistance such as copper, silver, gold, and nickel are appropriate. In this example, silver-platinum paste is used. (Dupont 03--17 1). Next, a manufacturing method of the antenna device 1 shown in FIG. 6 will be described with reference to FIGS. 7 to 7 showing the manufacturing process of the antenna device 1 shown in FIG. 6. The alumina substrate 9 is shown in Fig. 7, which can be divided into the paper size in the post-production process and applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) irl, ----.------ Clothes --- (Please read the precautions on the back before mr this page) Order " · --line. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 11-478204 A7 ___ B7 V. Description of Invention (9) What you want Set the cutoff line 10 to the size. In addition, through holes 11 are provided in prescribed places on the cut-off line. In this example, 5 Omm x 5 Omm, 1mm thick oxide oxide substrate 9 is provided with a cut-off line 10, spaced 5 mm apart in the vertical direction, 10 mm apart in the horizontal direction, and the through-hole 11 is 0 · 80. The horizontal cut lines are arranged at 2 mm intervals. Next, as shown in FIG. 8, through-holes in the alumina substrate 9 are filled with a conductive paste using a printing method, dried, and fired at 850 ° C to form through-hole conductors 14. Then on this alumina substrate 9, the upper surface 9 1 and the lower surface 9 2 are formed by printing as shown in FIG. 9 (A) and FIG. 9 (B). The conductor pattern 12, 13 ° is finally shown in FIG. The antenna device 1 can be obtained by dividing the line into 10 and dividing it into the smallest unit. As described above, the antenna with this structure can manufacture a large number of antennas at a time, and the effect of reducing the manufacturing cost is great. In this case, the two embodiments have been described so far. However, any of these embodiments can be re-formed on the conductive layer formed on the alumina substrate before or after the alumina substrate 9 is divided. A layer that is homogeneous to the alumina substrate 9 will have a smaller antenna size for transmitting and receiving antennas in the same wavelength band. Next, the performance of the antenna device manufactured as described above will be described. This example illustrates the antenna device shown in FIG. This antenna device 1 was placed on a substrate for evaluation, such as 2.5 x 50 mm and a thickness of 0 · 8 mm as shown in Fig. 1 1. The substrate used for the evaluation is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) at the insulation paper size. Irl — i ------ installation— (Please read the precautions on the back page first) Order ··-Line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-12- 478204 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (10) Striped lines are formed on the surface of the substrate 16 17. The ground surface 18 is formed on the back surface, and the antenna device 1 placed on the other end is supplied with power from the SMA connector 19 provided at one end via the line 17. The reflection loss-frequency characteristics at this time are shown in Fig. 12. It has a resonance frequency of 2448 MHz and a band amplitude of 1 3 3 Η z with a reflection loss of 6 d B or less. The radiation pattern of the X plane in FIG. 11 is also shown in FIG. 13. Radiation gain is roughly isotropic on this plane, with a maximum gain of -0 · 7dBi and a minimum gain of -2 · 3dBi. Furthermore, the antenna device having the configuration shown in FIG. 6 was also evaluated, and the result was also approximately the same as the evaluation result of the antenna device having the configuration shown in FIG. 1, so its explanation is omitted in this example. FIG. 14 is a perspective view of a third embodiment of the antenna device of the present invention. The base 2 of the antenna device 1 has an upper surface 2 1 and a lower surface 2 2, and concave portions 2 3 1 and convex portions 2 3 2 are alternately formed. One on the side 2 3. Also on the upper surface 21 of the base body 2 are formed convex portions 232 corresponding to the pair of side surfaces 23, and a conductor layer 3 connected to the convex portions 232, and on the lower surface 22 of the base body 2 are formed deviations connecting the pair of side surfaces 23. The conductor layer 4 of the convex portion 2 3 2 of 1 pitch and the convex portion 2 3 2, and the convex portion 2 3 2 of the pair of side surfaces 2 3 are also formed with the conductor layer 5. These conductor layers 3, 4 ′ 5 As a whole, the spiral conductor layer surrounding the base 2 is spiral. In this example, the conductor layer 5 of the side surface 2 3 a of the pair of side surfaces 2 3 (please read the precautions on the back page first) Decoration- Line 2: 0-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -13- 478204 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy One of the most end portions of the spiral conductor layer that constitutes a spiral surround is the power supply electrode 5 a ′, and a ground (pad) electrode 6 separated from the spiral conductor layer is formed at a position adjacent to the power supply electrode 5 a. a 'Furthermore, a connection between the spiral conductor layer and the ground electrode 6 a through the upper surface of the substrate is formed. Layer 6 b. In this example, it is desirable that the matrix 2 has a low temperature coefficient (r ί) in the high-frequency band with a specific electric inductivity (ε r), a stable specific magnetic permeability (// r), and a low loss ′ resonance frequency. This example uses an alumina-based ceramic plate (in the state of 2 G Η ζ, and ε r = 8 · 5, Q = 1 0 0 0, τ f = 3 8 p P m / t :). The conductor system is suitable for those with low resistance such as copper, silver, gold and nickel. A silver-platinum paste is used in this example. (Dupont company Q S-1 7 1). The manufacturing method of the antenna device 1 will be described below with reference to FIGS. 15 to 19 showing the manufacturing process of the antenna device 1 shown in FIG. 14. First, an alumina substrate as shown in FIG. 15 is prepared. The alumina substrate 9 can be divided into desired sizes by a post process, and a cut-off line 10 is set. The through-holes are set at 11 ° on the cut-off line. This example is on an oxidized substrate with a thickness of 5 mm and 50 mm. The cut-outs are set at 5 mm intervals in the vertical direction and 10 mm intervals in the horizontal direction. Line 1 0. The through-holes 11 are arranged at intervals of 2 mm in the transverse direction. Next, conductor patterns 12 and 13 are formed on the upper surface 9 1 and the lower surface 9 2 of the alumina substrate 9 as shown in FIG. 16 and FIG. 17, respectively. The forming method is: • 丨: ----; ------ install—— (Please read the precautions on the back before hitting this page) Order · _ Line-This paper size applies to China National Standards (CNS) A4 specifications (210 X 297 mm) -14- 478204 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (12) Screen printing printed conductor paste, dried and fired at 8 50 ° C . Next, the alumina substrate 9 on which the upper and lower conductors are formed is formed along the cut-off line where the through-holes are formed, and the aluminum oxide substrate 9 is divided as shown in FIG. 18. The plate 14 is extended and coated to a thickness of about 0.2 mm, and the conductor paste 15 is impregnated with the convex portions formed by the through holes of the foregoing alumina substrate, and only 15 of the conductor paste is coated. At the tip of the convex part, it is fired after drying. Finally, as shown in FIG. 19, the antenna unit 1 is obtained by dividing into minimum units at the cut-off line. As described above, a large number of antennas according to this structure can be manufactured at one time. The effect of reducing manufacturing costs is great. Fig. 20 is a perspective view of a fourth embodiment of the antenna device of the present invention. Differences from the third embodiment shown in FIG. 14 will be described. In the third embodiment shown in Fig. 14, the ground electrode 6a is connected to the substrate as a whole, and the conductive layer spirally surrounds the substrate via the connection conductor 6b. The embodiment shown in FIG. 20 is connected through the connection conductor 6b and the side surface 23b on the side opposite to the side surface 23a where the ground electrode 6a is formed. FIG. 21 is a perspective view of a fifth embodiment of the antenna device of the present invention. In the fifth embodiment shown in FIG. 21, the spiral conductor layer surrounding the base is spirally arranged on the entire side, and is disposed on one side. Among the plurality of conductor films 5 of 3 a, the conductor film at the extreme end is a ground electrode 5 b ′, and the conductor film adjacent to it is a power supply electrode 5 a, and the ground electrode 5 b is also a ground conductor. (Please read the caution page on the back first) Binding ··-Thread-This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -15- 478204 Α7 Β7 V. Description of the invention (13) Fig. 22 is a perspective view showing an example of another antenna device. The antenna device shown in FIG. 22 is a comparative example of the antenna device of the present invention as far as the antenna device itself is concerned, but also an antenna device constituting the antenna device assembly of the present invention described later. In the antenna device shown in FIG. 2, the ground electrode 6 a is connected to the conductor 6 b through the upper surface of the base body, through the side surface 2 3 b on the opposite side of the side surface 2 3 a where the ground electrode 6 a is formed, and then through the bottom surface of the base body. And connected to a spiral conductor layer that spirally surrounds the base body as a whole. The performance of the antenna device manufactured as described above will be described below. This antenna device 1 is placed on an evaluation substrate 2 5 X 5 Omm, with a thickness of 0.8 mm, as shown in Fig. 2. The evaluation substrate is formed with a line 17 on the surface of the insulating substrate 16. A ground plane 1 8 is formed on the back surface, and the power is supplied to the antenna device 1 placed on the other end from the SMA connector 19 provided at one end via the strip line 17. Table 1 shows the measurement results as described above. "Deviation 3 0 値" means 3 σ 値, which is the deviation of the resonance frequency when manufacturing a large number of antenna devices of the same specification. ΙΓΙ ---- ^ ------ Installation—— (Please read the note on the back page first) Order · Thread · Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -16- This paper size applies to Chinese national standards (CNS) A4 specification (210 X 297 public love) 204 204 A7 B7 V. Description of the invention (M) Table 1 Deviation from the center frequency of 2.45GHz Contact position deviation 3 σ 値 Example 1: Above the antenna (Figure 1 4) Soil 30MHz Example 2: Side (Figure 20) ± 60MHz Example 3: Terminals also used (Figure 2 1) ± 62MHz Comparative Example: Below (Figure 2 2) Soil 155MHz Example 1 can be seen from Table 1 ~ 3 has the effect of suppressing deviation when compared with the comparative example. Fig. 24 shows a first embodiment of the antenna device assembly of the present invention. In FIG. 24, the antenna device 1 is a view of the antenna device 1 placed on the circuit substrate 97 in a state where the antenna device 1 is in contact with the circuit substrate. The antenna device 1 is printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. As shown in FIG. 22, the ground electrode is connected to the spiral conductor layer of the antenna device by connecting the conductor layer under the substrate. On the circuit substrate 97, a part of the circuit substrate is cut away so as to provide a hole 97a penetrating through the upper and lower surfaces. The connection portion between the connection conductor layer and the spiral conductor layer under the base of the antenna device 1 is located exactly The hole 9 7 a is positioned so that the connection portion does not contact the circuit substrate 97. Fig. 25 shows a second embodiment of the antenna device assembly of the present invention. The Zhang scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) — 478204 A7 V. Description of the invention (15) This figure 2 5 is also the same as Figure 2 4 with the antenna device on the circuit board and the bottom contact The antenna device 1 of the type shown in FIG. 22 is placed on the circuit substrate 97 and viewed from below the substrate. The circuit substrate 97 is not provided with a cut-out portion, but the connection conductor and the spiral conductor connection portion of the antenna device 1 are beyond the range of the circuit substrate 97. In the case where the above-mentioned connection portion is formed under the antenna device as described above, a portion of the circuit board is cut away or the portion is placed beyond the circuit board to suppress deviation. Table 2 is the measurement result of the deviation of the _ vibration frequency of the antenna device assembly in the state of FIG. 24 and FIG. 25. ------------ II --I (Please read the note on the back page first) Order Table 2 Deviation from the center frequency 2.45GHz Mounting method Deviation 3 σ 値 Substrate under the contact Cut-off section (Figure 24) ± 72MHz antenna protruding (Figure 25) ± 68MHz line-printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs, this table 2 can be seen when comparing the lowest line with the above table ^ 丨 皮 ^ 的The deviation becomes smaller. From the above results, the antenna device and the antenna device assembly f of the present invention have sufficient performance as an antenna for a portable communication device. (Effects of the invention) 478204 A7 ______ B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (16) As mentioned above, 'in accordance with the present invention, the main reason is that a spiral radiating conductor is formed on the surface of the dielectric substrate. In the antenna device, a conductor is formed in a convex portion or a concave portion provided on the side surface of the base body, and the conductor formed on the upper and lower sides is connected as a helical radiating conductor, so that it can provide a mass-produced communication terminal most suitable for portable The machine's surface mount antenna is also available. 'According to the present invention, in the antenna device mainly forming a spiral radiating conductor on the surface of the dielectric substrate, the contact point between the spiral conductor and the grounding linear conductor is formed when the antenna is placed (installed) on When the circuit board is in contact with the circuit board, the deviation of the resonance frequency can be suppressed to a smaller value than that of the contact formed on the surface of the circuit board. Brief Description of the Drawings Fig. 1 is a perspective view showing a first embodiment of an antenna device according to the present invention. Fig. 2 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 1; Fig. 3 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 1; Fig. 4 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 1; Fig. 5 is a diagram showing a middle stage of the manufacturing process of the antenna device shown in Fig. 1; Fig. 6 shows the squint of the second embodiment of the antenna device of the present invention (please read the caution page on the back first). Installation-----This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (%) -19- 478204 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of Invention (17). Fig. 7 is a diagram showing a middle stage of the manufacturing process of the antenna device shown in Fig. 2; Fig. 8 is a diagram showing a middle stage of the manufacturing process of the antenna device shown in Fig. 2; Fig. 9 is a diagram showing a middle stage of the manufacturing process of the antenna device shown in Fig. 2; Fig. 10 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 2; FIG. 11 is an explanatory diagram of an evaluation method of an antenna device. Fig. 12 shows the reflection loss of the antenna device as a function of the cycle number. Fig. 13 shows the radiation pattern on the ZX plane of Fig. 11. Fig. 14 is a perspective view showing a third embodiment of the antenna device of the present invention. Fig. 15 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 14; Fig. 16 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 14; Fig. 17 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 14; Fig. 18 is a diagram showing a halfway stage in the manufacturing process of the antenna device shown in Fig. 14; Figure 19 shows the manufacturing process of the antenna device shown in Figure 14 (please read the precautions on the back page first) Binding '· -line · This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Centi) -20- 478204 A7 ____B7 V. Description of invention (18) A diagram of the halfway stage. Fig. 20 is a perspective view showing a fourth embodiment of the antenna device of the present invention. Fig. 21 is a perspective view showing a fifth embodiment of the antenna device of the present invention. Fig. 22 is a perspective view showing another example of the antenna device of the present invention. Fig. 23 is an explanatory diagram of the evaluation method of the antenna device. Fig. 24 is a diagram showing a first embodiment of an antenna device assembly according to the present invention. Fig. 25 is a diagram showing a second embodiment of the assembly of the antenna device of the present invention. Fig. 26 is a schematic diagram showing a conventional small antenna that can be mounted on the upper surface of a circuit board. (Label description) 1 Antenna device 2 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Basic Economics 3, 4 '5 Conductor layer 5 a Power supply electrode 6 a Ground electrode 6 b Connected to the conductor layer 9 Alumina substrate 10 Cut-off line 11 Through-hole- 21-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 478204 A7 B7 V. Description of the invention (19) 7 8 2 2 2 2 3 2 3 2 Conductor pattern strip line ground plane Μ A The upper and lower sides of the coupler have a concave portion and a convex portion. (Please read the note on the back first, then this page} 装 • 线 _ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -22