JP2000312109A - Antenna system and antenna system assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of an antenna system used for a mobile communication unit or the like. SOLUTION: This antenna system 1 is provided with a base 2, made of at least a dielectric or a magnetic body and having an upper face 21, a lower face 22 and a couple of side faces 23 on which recessed parts 231 and projections 232 are alternately formed and with conductor layers 3, 4, 5 that are formed on the upper and lower faces 21, 22 and the projections 232 or the recessed parts 23 of a pair of the side faces 23 of the base 2 and surround the base 2 into a spiral shape as a whole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an antenna device used for portable communication equipment and the like.

[0002]

2. Description of the Related Art Conventionally, linear antennas such as helical antennas have been used for communication equipment such as mobile phones. However, these antennas are mounted outside the housing of the communication equipment, which hinders miniaturization and prevents external force. May cause problems such as breakage, deformation, and characteristic deterioration by acting on the antenna. In addition, since the mounting is performed via a coaxial cable or a connector, the number of components increases, which is not preferable in terms of mounting cost.

As a method for solving this problem, Japanese Patent Laid-Open Publication No.
No. 4627 proposes a small antenna which can be surface-mounted on a circuit board as shown in FIG. In this antenna, a helical antenna is formed inside a ceramic base 30 using the technology of a ceramic multilayer substrate. That is, the conductor 31 is formed in each of the different ceramic layers, and the through hole 32 in which the conductor is filled inside is formed.
To form a spiral conductor as a whole, and by laminating ceramic layers, a ceramic antenna including a spiral radiation conductor is formed. The base 3
A terminal 33 for supplying power to the spiral conductor is provided on the end face of the spiral conductor.
Are formed.

[0004]

However, in such a structure, since a conductor is formed on the ceramic sheet before firing, and this is fired after lamination, it is necessary to design in consideration of firing shrinkage and the like, and to reduce the shrinkage rate. Extremely accurate process control is required to keep the level constant, and it is difficult to reduce manufacturing costs.

Even if all the conductors are formed on the surface of the fired ceramic conductor, in a ceramic block having a flat surface, the conductor is formed on at least four surfaces by a method such as a printing method capable of precisely controlling the conductor shape. Required, which also hinders cost reduction.

The present invention has been made in view of the above circumstances, and has as its object to provide an antenna device whose manufacturing cost is reduced.

[0007]

An antenna device according to the present invention that achieves the above object has a pair of side surfaces having upper and lower surfaces and alternately formed concave and convex portions. And a spiral conductor layer formed on the upper and lower surfaces of the substrate and the convex or concave portions of the pair of side surfaces of the substrate and surrounding the substrate in a spiral shape as a whole.

Here, in the above-mentioned antenna device of the present invention, at least one of the convex portions or concave portions on the side surface is
The terminal is preferably a terminal for supplying power to the spiral conductor layer.

The antenna device according to the present invention may have a layer that covers at least a part of the spiral conductor layer formed on the base and is made of at least one of a dielectric material and a magnetic material. preferable.

The antenna device of the present invention is a helical antenna having a spiral radiation conductor formed on the surface of a ceramic substrate, and the conductor layers on the upper and lower surfaces of the substrate can be formed by a printing method. Also, when a conductor layer is formed on the side projection,
The electrodes can be formed only on the convex portions by a method that can perform electrode application at a high speed, such as a dipping method or a coating method using a roll coater. In particular, when a roll coater is applied when an electrode is formed on a convex portion, mass productivity is superior to printing. In addition, when an electrode is formed on the projection, there is also an advantage that solder bridging is difficult to occur even when solder is used to connect the electrode of the projection during mounting. Alternatively, when a conductor layer is formed in the side recess, as shown in an embodiment to be described later, the conductor layer can be formed by a method such as filling a through hole with a conductor. As described above, according to the present invention, mass production is easy and the manufacturing cost can be significantly reduced.

Further, since the side projection or the side recess formed with the conductor can be used as a terminal electrode as it is, a surface mount antenna can be easily manufactured.

[0012] The antenna device according to the present invention may be configured such that the spiral conductor layer includes one of a plurality of portions sequentially arranged on one side surface of the base body at intervals. A power supply electrode for supplying power and another one of a plurality of portions constituting the spiral conductor layer and arranged on one side surface of the base sequentially spaced from each other, and are grounded to the spiral conductor layer. And a ground electrode for the purpose.

As described above, the side projection or the side recess may be used as it is as the power supply electrode and the ground electrode. Further, by providing a dielectric layer or a magnetic layer so as to cover the spiral conductor, further downsizing is possible.

Further, the antenna device of the present invention comprises a portion which is located at one end of a plurality of portions constituting the spiral conductor layer, which are sequentially arranged on one side surface of the substrate at intervals. A power supply electrode for supplying power to the spiral conductor layer, and a power supply electrode formed on the same side as the side on which the power supply electrode is formed, at a predetermined distance from the power supply electrode and adjacent to the power supply electrode. A ground electrode for grounding the spiral conductor layer, and extending from the ground electrode and connecting to the spiral conductor layer via the upper surface of the base, in cooperation with a part of the spiral conductor layer, the ground electrode and the power supply electrode. It is also a preferred embodiment to include a connecting conductor layer for connecting the plurality of portions, or a plurality of portions constituting the spiral conductor layer, which are sequentially arranged on one side surface of the base body at intervals. Located at one end of And a power supply electrode for supplying power to the spiral conductor layer, and a position on the same side surface as the side surface on which the power supply electrode is formed, at a position adjacent to the power supply electrode at a predetermined distance from the power supply electrode. A formed ground electrode for grounding the spiral conductor layer, a spiral extending from the ground electrode, through the upper surface of the base, and further through a side of the base opposite to the side on which the ground electrode is formed. It is also a preferable embodiment to provide a connection conductor layer that connects the ground electrode and the power supply electrode in cooperation with a part of the spiral conductor layer by being connected to the conductor layer.

In the present invention, if the conductor pattern is formed such that the power supply electrode and the ground electrode are connected on the lower surface of the base in contact with the circuit board, the resonance frequency of the antenna may vary greatly.

As described above, by connecting the power supply electrode and the ground electrode on the upper surface or the side surface, the possibility of such inconvenience is eliminated, and a high-precision antenna device is configured.

Further, an antenna device assembly according to the present invention has a base having at least one of a dielectric material and a magnetic material, which has upper and lower surfaces and a pair of side surfaces on which concave portions and convex portions are alternately formed. An antenna device having upper and lower surfaces of a base and a spiral conductor layer which is formed on a pair of side surfaces of the base and has a spiral conductor layer surrounding the base as a whole, and the antenna device contacts the lower surface of the antenna device. A circuit board mounted in a state where the antenna device is formed from a portion located at one end of a plurality of portions that are sequentially arranged on one side surface of the base and constitute a spiral conductor layer. And a power supply electrode for supplying power to the spiral conductor layer, and at a position adjacent to the power supply electrode at a predetermined distance from the power supply electrode on the same side surface as the side surface on which the power supply electrode is formed on the base. A ground electrode for grounding the spiral conductor layer, and extending from the ground electrode and connecting to the spiral conductor layer via the lower surface of the base, cooperate with a part of the spiral conductor layer and the ground electrode. A connection conductor layer for connecting to a power supply electrode is provided, and a structure is provided in which a connection point between the spiral conductor layer and the connection conductor layer on the lower surface of the antenna device is prevented from contacting the circuit board.

The antenna device assembly according to the present invention includes an antenna device in which a power supply electrode and a ground electrode are connected on the lower surface of the base. The connection between the spiral conductor layer and the ground conductor layer of the antenna device is provided. Since the points do not come into contact with the circuit board, as in the case where the connection point is formed on the upper surface or side surface of the base of the antenna device, the occurrence of the problem of variation in the resonance frequency of the antenna is suppressed, and a high-precision antenna is used. Obtainable.

[0019]

Embodiments of the present invention will be described below.

FIG. 1 is a perspective view of a first embodiment of the antenna device of the present invention.

The base 2 of the antenna device 1 has an upper surface 21,
It has a lower surface 22, and a pair of side surfaces 23 in which concave portions 231 and convex portions 232 are alternately formed. A conductor layer 3 is formed on the upper surface 21 of the base 2 to connect the corresponding protrusions 232 of the pair of side surfaces 23 to each other. The conductor layer 4 that connects the 232 with each other is formed, and the projections 232 of the pair of side surfaces 23 are further formed.
Also, a conductor layer 5 is formed, and these conductor layers 3, 4, and 5 are spiral conductor layers that surround the base 2 in a spiral shape as a whole.

The substrate 2 has a relative dielectric constant in a high frequency band.
(Εr), stable relative permeability (μr), low loss, resonance
Temperature coefficient of frequency (τ_f) Are preferred. Book
In the example, an alumina ceramic (εr at 2 GHz)
= 8.5, Q = 1000, τ _f= 38 ppm / ° C)
Was. The conductor is copper, silver, gold, nickel, etc.
Is preferred. Here, silver-platinum paste (Dupon
t company QS-171) was used.

A method of manufacturing the antenna device 1 will be described with reference to FIGS. An alumina substrate 9 as shown in FIG. 2 is prepared. A snap line 10 is provided on the alumina substrate 9 so that it can be divided into a desired size in a later step.
Also, a through hole 1 is provided at a desired place on the snap line.
1 is provided. Here, 50 mm x 50 mm, thickness 1
Snap line 10 is 5m vertically on a 2mm alumina substrate
m intervals, horizontal 10 mm intervals, the through holes 11
Those having a diameter of 8φ were arranged at intervals of 2 mm on a horizontal snap line.

Next, conductor patterns 12 and 13 were formed on the upper surface 91 and the lower surface 92 of the alumina substrate 9 as shown in FIGS. 3A and 3B, respectively. As for the forming method, the conductor paste was screen-printed, dried, and fired at 850 ° C.

Next, the alumina substrate 9 after the formation of the upper and lower conductors
Was divided along the snap line in which the through hole was formed as shown in FIG. Then, in advance, the conductor paste 15
Is spread to a thickness of about 0.2 mm on a flat plate 14 such as a glass plate using a squeegee or the like, and the conductive paste 15
Then, the protrusion formed by the through hole of the alumina substrate was immersed in the conductive paste 15 only at the tip of the protrusion.
Was applied, dried and fired.

Finally, as shown in FIG. 5, the antenna device 1 was obtained by dividing into minimum units by snap lines.
As described above, with the antenna having this structure, a large number of antennas can be manufactured at once, and the effect of reducing the manufacturing cost is great.

FIG. 6 is a perspective view of a second embodiment of the antenna device of the present invention.

The base 2 of the antenna device 1 has an upper surface 21 and a lower surface 2 similar to the base 2 of the antenna device 1 shown in FIG.
2, and a pair of side surfaces 23 in which concave portions 231 and convex portions 232 are alternately formed. However, the conductor layer of the antenna device 1 shown in FIG. 2 is slightly different from the conductor layer of the antenna device shown in FIG. 1, and the upper surface 21 of the base 2 of the antenna device 1 shown in FIG. The conductor layer 4 connecting the concave portions 231 to be formed is formed, and the conductor layer 5 connecting the concave portions 231 shifted by one of the pair of side surfaces 23 is formed on the lower surface 22 of the base 2. The conductor layer 5 is formed in the concave portions 231 on the pair of side surfaces 23.
However, it is the same as the antenna device shown in FIG. 1 in that these conductor layers 3, 4, and 5 are conductor layers that surround the base 2 in a spiral shape as a whole.

Here, the substrate 2 of the antenna device 1 shown in FIG. 2 has a stable relative dielectric constant (εr) and relative magnetic permeability (μr) in a high-frequency band and a low loss, similarly to the antenna device shown in FIG. It is preferable that the temperature coefficient (τ _f ) of the resonance frequency is small. In this example, alumina ceramics (εr = 8.5, Q = 1000, τ _f = 38 ppm at 2 GHz)
/ ° C). The conductor is preferably one having low conductor resistance, such as copper, silver, gold and nickel. Here, a silver-platinum paste (QS-171 manufactured by Dupont) was used.

Next, a method of manufacturing the antenna device shown in FIG. 6 will be described with reference to FIGS. 7 to 10 showing the manufacturing steps of the antenna device 1 shown in FIG. The alumina substrate 9
As shown in FIG. 7, a snap line 10 is provided so that it can be divided into a desired size in a later step. Also, a through hole 11 is provided at a desired location on the snap line.
Here, a 50 mm × 50 mm, 1 mm thick alumina substrate 9, snap lines 10 having a vertical interval of 5 mm, horizontal intervals of 10 mm, and through holes 11 having a diameter of 0.8φ are arranged on the horizontal snap line at intervals of 2 mm. Placed.

Next, as shown in FIG. 8, a conductive paste is filled into the through holes of the alumina substrate 9 by using a printing method.
After drying, firing was performed at 850 ° C. to form a through-hole conductor 14.

Next, conductor patterns 12 and 13 were formed on the upper surface 91 and the lower surface 92 of the alumina substrate 9 by a printing method as shown in FIGS. 9A and 9B, respectively.

Finally, as shown in FIG.
The antenna device 1 is obtained by dividing the minimum unit by 0. Thus, with the antenna having this structure, a large number of antennas can be manufactured at one time, and the effect of reducing the manufacturing cost is great.

Although two embodiments have been described here, in any of these embodiments, before or after the alumina substrate 9 is divided, the alumina layer 9 is formed on the conductor layer formed on the alumina substrate 9. Substrate 9
A layer having the same quality as that described above may be formed. By doing so, it is possible to further reduce the size of the same wavelength band transmitting / receiving antenna.

Next, the performance of the antenna device manufactured as described above will be described. Here, the antenna device shown in FIG. 1 will be described.

As shown in FIG.
It was mounted on a 5 × 50 mm, 0.8 mm thick evaluation board. This evaluation board has a strip line 17 formed on the front surface of an insulating substrate 16 and a ground surface 18 formed on the back surface, and the SMA connector 19 provided at one end is connected to the strip line 1.
7 to supply power to the antenna device 1 mounted on the other end.

The return loss-frequency characteristics at this time are shown in FIG.
Shown in Resonance frequency 2448MHz, return loss is -6d
The bandwidth below B was 133 MHz.

FIG. 13 shows the radiation pattern on the ZX plane in FIG. The radiation gain was almost isotropic in this plane, with a maximum gain of -0.7 dBi and a minimum gain of -2.3 dBi.

The evaluation was also performed on the antenna device having the configuration shown in FIG. 6, but the result is almost the same as the evaluation result of the antenna device having the configuration shown in FIG. 1, and the description is omitted here.

FIG. 14 is a perspective view of a third embodiment of the antenna device according to the present invention.

The base 2 of the antenna device 1 has an upper surface 21,
It has a lower surface 22, and a pair of side surfaces 23 in which concave portions 231 and convex portions 232 are alternately formed. A conductor layer 3 is formed on the upper surface 21 of the base 2 to connect the corresponding protrusions 232 of the pair of side surfaces 23 to each other. The conductor layer 4 that connects the 232 with each other is formed, and the projections 232 of the pair of side surfaces 23 are further formed.
Also, a conductor layer 5 is formed, and these conductor layers 3, 4, and 5 are spiral conductor layers that surround the base 2 in a spiral shape as a whole.

Here, of the conductor layers 5 on one side surface 23a of the pair of side surfaces 23, one of the ends constituting the spiral conductor layer that surrounds the entire spiral is the power supply electrode 5a. Further, a ground electrode 6a separated from the spiral conductor layer is formed at a position adjacent to the power supply electrode 5a, and a connection conductor 6b for connecting the spiral conductor layer and the ground electrode 6a via the upper surface of the base is formed. Is formed.

Here, the substrate 2 has a relative dielectric constant in a high frequency band.
(Εr), stable relative permeability (μr), low loss, resonance
Temperature coefficient of frequency (τ_f) Are preferred. Book
In the example, an alumina ceramic (εr at 2 GHz)
= 8.5, Q = 1000, τ _f= 38 ppm / ° C)
Was. The conductor is copper, silver, gold, nickel, etc.
Is preferred. Here, silver-platinum paste (Dupon
t company QS-171) was used.

Referring to FIGS. 15 to 19, which show the steps of manufacturing the antenna device 1 shown in FIG.
Will be described. An alumina substrate 9 as shown in FIG. 15 is prepared. A snap line 10 is provided on the alumina substrate 9 so that it can be divided into a desired size in a later step. Also, a through hole 11 is provided at a desired location on the snap line. Here is 50mm x 50m
Snap lines 10 having a vertical interval of 5 mm and a horizontal interval of 10 mm, and through holes 11 having a diameter of 0.8 φ were arranged on a horizontal snap line at an interval of 2 mm on an alumina substrate having a thickness of 1 mm.

Next, conductor patterns 12 and 13 were formed on the upper surface 91 and the lower surface 92 of the alumina substrate 9 as shown in FIGS. 16 and 17, respectively. As for the forming method, the conductor paste was screen-printed, dried, and fired at 850 ° C.

Next, the alumina substrate 9 after the formation of the upper and lower conductors
Was divided along the snap line in which the through hole was formed as shown in FIG. Then, in advance, the conductor paste 1
5 is stretched to a thickness of about 0.2 mm on a flat plate 14 such as a glass plate using a squeegee or the like.
5, the convex portion formed by the through hole of the alumina substrate was immersed in the conductive paste 1 only at the tip of the convex portion.
5 was applied, dried and fired.

Finally, as shown in FIG. 19, the antenna device 1 was obtained by dividing into the minimum units by the snap line. As described above, with the antenna having this structure, a large number of antennas can be manufactured at once, and the effect of reducing the manufacturing cost is great.

FIG. 20 is a perspective view of a fourth embodiment of the antenna device according to the present invention. The differences from the third embodiment shown in FIG. 14 will be described. In the third embodiment shown in FIG. 14, the ground electrode 6a is connected on the upper surface of the base via the connection conductor 6b to the conductor layer surrounding the substrate as a whole in a helical manner. In the embodiment, the connection is made via the connection conductor 6b on the side surface 23b opposite to the side surface 23a on which the ground electrode 6a is formed.

FIG. 21 is a perspective view of a fifth embodiment of the antenna device according to the present invention.

In the fifth embodiment shown in FIG. 21, among the plurality of conductor films 5 arranged on one side surface 23a of the spiral conductor layer spirally surrounding the substrate as a whole,
The endmost conductor film is the ground electrode 5b, and the conductor film adjacent thereto is the power supply electrode 5a, and the ground electrode 5b also serves as a ground conductor.

FIG. 22 is a perspective view showing another example of the antenna device.

The antenna device shown in FIG. 22 is a comparative example of the antenna device of the present invention as an antenna device itself, but is also an antenna device constituting an antenna device assembly of the present invention described later.

In the antenna device shown in FIG. 22, the ground electrode 6a passes through the upper surface of the base by the connecting conductor 6b, passes through the side surface 23b opposite to the side surface 23a on which the ground electrode 6a is formed. Via the underside,
The substrate is connected to a spiral conductor layer that surrounds the entire substrate in a spiral shape.

Next, the performance of the antenna device manufactured as described above will be described.

As shown in FIG.
It was mounted on a 5 × 50 mm, 0.8 mm thick evaluation board. This evaluation board has a strip line 17 formed on the front surface of an insulating substrate 16 and a ground surface 18 formed on the back surface, and the SMA connector 19 provided at one end is connected to the strip line 1.
7 to supply power to the antenna device 1 mounted on the other end.

Table 1 shows the results of the measurement as described above. The “variation 3σ value” represents a 3σ value of the variation in the resonance frequency when a large number of antenna devices having the same specifications are manufactured.

[0057]

[Table 1]

As can be seen from Table 1, Examples 1 to 3 are shown.
In the example, the variation is suppressed as compared with the comparative example.

FIG. 24 is a diagram showing a first embodiment of the antenna device assembly of the present invention.

FIG. 24 is a diagram of the antenna device 1 mounted on the circuit board 97 with the lower surface of the antenna device being in contact with the upper surface of the circuit board, as viewed from the lower surface of the substrate.

The antenna device 1 shown here is of the type shown in FIG. 22 in which the ground electrode is connected to the spiral conductor layer on the lower surface of the base by the connection conductor layer. The circuit board 97 is provided with holes 97a that are formed by cutting out a part of the circuit board and that penetrate the upper and lower surfaces.
The connection portion between the connection conductor layer and the spiral conductor layer on the lower surface of the base of the antenna device 1 is located at the top of the hole 97 a so that the connection portion does not contact the circuit board 97.

FIG. 25 is a diagram showing a second embodiment of the antenna device assembly of the present invention.

25, similarly to FIG. 24, an antenna device 1 of the type shown in FIG. 22 mounted on a circuit board 97 with the lower surface of the antenna device in contact with the upper surface of the circuit board is viewed from the lower surface of the substrate. FIG.

The circuit board 97 is not provided with a notch, but the connection between the connection conductor and the spiral conductor of the antenna device 1 protrudes from the circuit board 97.

As described above, even if the above-mentioned connection portion is formed on the lower surface of the antenna device, the circuit board may be partially cut out or may be mounted so that the portion protrudes from the circuit board. Can be suppressed.
Table 2 shows the measurement results of the variation in the resonance frequency of the antenna device assembly of the embodiment shown in FIGS.

[0066]

[Table 2]

Comparing Table 2 with the bottom row in Table 1 above, it can be seen that the variation in resonance frequency is small.

From the above results, it can be said that the antenna device and the antenna device assembly according to the present invention have sufficient performance as an antenna for a portable communication device.

[0069]

As described above, according to the present invention,
In a helical antenna in which a spiral radiation conductor is formed on the surface of a dielectric substrate, a conductor is formed in a convex portion or a concave portion provided on the side surface of the substrate, and the conductors formed on the upper and lower surfaces are connected to form a spiral radiation conductor. It is easy to mass-produce, and it is possible to supply an optimal surface mount antenna for a mobile communication terminal.

Further, according to the present invention, in the antenna device having the spiral radiation conductor formed on the surface of the dielectric substrate, the contact between the spiral conductor and the ground linear conductor can be reduced when the antenna is mounted on the circuit board. By forming the contact at a portion not in contact with the substrate, it is possible to suppress the variation in the resonance frequency to be smaller than that when the contact is formed on the surface serving as the circuit board.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of an antenna device according to the present invention.

FIG. 2 is a view showing a middle stage of a manufacturing process of the antenna device shown in FIG. 1;

FIG. 3 is a view showing a middle stage of a manufacturing process of the antenna device shown in FIG. 1;

FIG. 4 is a view showing a stage in the course of the manufacturing process of the antenna device shown in FIG. 1;

FIG. 5 is a view showing a middle stage of a manufacturing process of the antenna device shown in FIG. 1;

FIG. 6 is a perspective view of a second embodiment of the antenna device of the present invention.

FIG. 7 is a view showing a middle stage of a manufacturing process of the antenna device shown in FIG. 2;

FIG. 8 is a view showing a middle stage of a manufacturing process of the antenna device shown in FIG. 2;

FIG. 9 is a view showing a middle stage of a manufacturing process of the antenna device shown in FIG. 2;

FIG. 10 is a view showing a stage during the manufacturing process of the antenna device shown in FIG. 2;

FIG. 11 is an explanatory diagram of an evaluation method of the antenna device.

FIG. 12 is a diagram illustrating a return loss-frequency characteristic of the antenna device.

FIG. 13 is a view showing a radiation pattern on a ZX plane in FIG. 11;

FIG. 14 is a perspective view of a third embodiment of the antenna device of the present invention.

15 is a diagram illustrating a stage in the course of the manufacturing process of the antenna device illustrated in FIG. 14;

FIG. 16 is a view illustrating a stage in the course of the manufacturing process of the antenna device illustrated in FIG. 14;

17 is a diagram illustrating a stage in the middle of the manufacturing process of the antenna device illustrated in FIG. 14;

FIG. 18 is a diagram illustrating a stage in the course of the manufacturing process of the antenna device illustrated in FIG. 14;

FIG. 19 is a diagram illustrating a stage in the course of the manufacturing process of the antenna device illustrated in FIG. 14;

FIG. 20 is a perspective view of a fourth embodiment of the antenna device according to the present invention.

FIG. 21 is a perspective view of a fifth embodiment of the antenna device according to the present invention.

FIG. 22 is a perspective view showing another example of the antenna device.

FIG. 23 is an explanatory diagram of a method for evaluating an antenna device.

FIG. 24 is a diagram showing a first embodiment of the antenna device assembly of the present invention.

FIG. 25 is a diagram showing a second embodiment of the antenna device assembly of the present invention.

FIG. 26 is a schematic view of a conventional small antenna that can be surface-mounted on a circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Antenna device 2 Base 3, 4, 5 Conductive layer 5a Feeding electrode 6a Ground electrode 6b Connecting conductive layer 9 Alumina substrate 10 Snap line 11 Through hole 12, 13 Conductive pattern 14 Flat plate 15 Conductive paste 16 Insulating substrate 17 Strip line 18 Ground surface 19 SMA connector 21 Upper surface 22 Lower surface 23 Side surface 91 Upper surface 92 Lower surface 231 Concave portion 232 Convex portion

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Yoshiomi Go 2270 Yokoze, Yokoze-cho, Chichibu-gun, Saitama Prefecture Inside the Electrotechnical Laboratory, Mitsubishi Materials Corporation (72) Inventor Nobuchi Sakai 2270 Yokoze, Yokoze-cho, Yokoze-cho, Chichibu-gun, Saitama Address: Mitsui Materials Co., Ltd.Electronic Technology Research Laboratories (72) Inventor Hiroaki Tanisho 2270 Yokoze, Yokoze-cho, Chichibu-gun, Saitama Prefecture 2270, Yoji, Yokose F-term (Reference) 5M046 AA02 AA19 AB12 PA07 QA10

Claims (7)

[Claims] A base having at least one of a dielectric and a magnetic material, the base having a pair of side surfaces in which concave and convex portions are alternately formed, and upper and lower surfaces of the base; An antenna device, comprising: a spiral conductor layer formed in a convex portion or a concave portion on the pair of side surfaces of the base and spirally surrounding the base as a whole. 2. The antenna device according to claim 1, wherein at least one of the protrusions or recesses on the side surface is a power supply electrode for supplying power to the spiral conductor layer. 3. The antenna according to claim 1, further comprising a layer that covers at least a part of the spiral conductor layer formed on the base and is made of at least one of a dielectric material and a magnetic material. apparatus. 4. A power supply electrode for supplying power to the spiral conductor layer, the power supply electrode comprising one of a plurality of portions that are arranged on one side surface of the base body and that are sequentially spaced from each other, forming the spiral conductor layer. And a ground electrode for grounding the spiral conductor layer, comprising another one of a plurality of portions sequentially arranged on one side surface of the base, constituting the spiral conductor layer. The antenna device according to claim 1, further comprising: 5. A power supply to the spiral conductor layer, comprising a portion located at one end of a plurality of portions that are sequentially arranged on one side surface of the base and constitute the spiral conductor layer. And a spiral conductor formed at a position adjacent to the power supply electrode at a predetermined distance from the power supply electrode on the same side surface as the side surface on which the power supply electrode is formed, of the base body. A ground electrode for grounding a layer, extending from the ground electrode and connecting to the spiral conductor layer via an upper surface of the base, so that the ground electrode and the ground electrode cooperate with a part of the spiral conductor layer. The antenna device according to claim 1, further comprising: a connection conductor layer that connects to the power supply electrode. 6. A power supply to the spiral conductor layer, comprising a portion located at one end of a plurality of portions which are arranged at intervals on one side surface of the base and constitute the spiral conductor layer. And a spiral conductor formed at a position adjacent to the power supply electrode at a predetermined distance from the power supply electrode on the same side surface as the side surface on which the power supply electrode is formed, of the base body. A ground electrode for grounding a layer; an upper surface of the base extending from the ground electrode; and a side of the base opposite to a side on which the ground electrode is formed. By connecting to
The antenna device according to claim 1, further comprising: a connection conductor layer that connects the ground electrode and the feed electrode in cooperation with a part of the spiral conductor layer. 7. A base body having at least one of a dielectric and a magnetic body, having a pair of side surfaces having upper and lower surfaces and alternately formed concave portions and convex portions, and upper and lower surfaces of the base, An antenna device having a spiral conductor layer formed on the pair of side surfaces of the base and formed on the pair of side surfaces and spirally surrounding the base as a whole; and A circuit board, wherein the antenna device comprises a portion located at one end of a plurality of portions sequentially arranged on one side surface of the base constituting the spiral conductor layer, A power supply electrode for supplying power to the helical conductor layer; A ground electrode for grounding the spiral conductor layer formed, extending from the ground electrode and connecting to the spiral conductor layer via the lower surface of the base to cooperate with a part of the spiral conductor layer And a connection conductor layer for connecting the ground electrode and the power supply electrode, and a contact point between the spiral conductor layer and the connection conductor layer on the lower surface of the antenna device and contact with the circuit board are avoided. An antenna device assembly having a structure.