CN102780080A - Miniaturized ceramic chip antenna - Google Patents
Miniaturized ceramic chip antenna Download PDFInfo
- Publication number
- CN102780080A CN102780080A CN2011101228524A CN201110122852A CN102780080A CN 102780080 A CN102780080 A CN 102780080A CN 2011101228524 A CN2011101228524 A CN 2011101228524A CN 201110122852 A CN201110122852 A CN 201110122852A CN 102780080 A CN102780080 A CN 102780080A
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- CN
- China
- Prior art keywords
- layer substrate
- electrode
- radiation metal
- metal wires
- antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides a miniaturized ceramic chip antenna, comprising a first electrode layer substrate, at least one radiation layer substrate, a second electrode layer substrate and a plurality of sidewall conducting layers. A plurality of upper end electrodes are arranged on the first electrode layer substrate to serve as connecting electrodes; a first radiation metal wire and a second radiation metal wire are arranged on the radiation layer substrate, thus forming an antenna of a non-closed coil antenna together for receiving and sending signals; a plurality of lower end electrodes are arranged on the second electrode layer substrate to serve as connecting electrodes; and the plurality of sidewall conducting layers are used for mutually connecting the plurality of upper end electrodes and the plurality of lower end electrodes with the first radiation metal wire, and mutually connecting the plurality of upper end electrodes and the plurality of lower end electrodes with the second radiation metal wire.
Description
Technical field
The present invention relates to a kind of antenna, especially a kind of ceramic wafers antenna of microminiaturization.
Background technology
The present invention provides a kind of ceramic wafers antenna of microminiaturization, and it comprises: one first electrode layer substrate, at least one radiating layer substrate, a second electrode lay substrate, and a plurality of sidewall conductive layer.This first electrode layer substrate be provided with a plurality of upper end electrode, with as connection electrode; Be provided with one first radiation metal wires and one second radiation metal wires on this radiating layer substrate, it forms the antenna of a non-encapsulated coil jointly, with the transmitting-receiving signal; This second electrode lay substrate be provided with a plurality of lower end electrode, with as connection electrode; These a plurality of sidewall conductive layer, be in order to should a plurality of upper end electrode, these a plurality of lower end electrode, interconnect with first radiation metal wires, and, with a plurality of upper end electrode, a plurality of lower end electrode, interconnect with second radiation metal wires.
Summary of the invention
To the problems referred to above, the present invention provides a kind of ceramic wafers antenna of microminiaturization.
The present invention provides a kind of ceramic wafers antenna of microminiaturization, and it comprises: one first electrode layer substrate, at least one radiating layer substrate, a second electrode lay substrate, and a plurality of sidewall conductive layer.This first electrode layer substrate be provided with a plurality of upper end electrode, with as connection electrode; Be provided with one first radiation metal wires and one second radiation metal wires on this radiating layer substrate, it forms the antenna of a non-encapsulated coil jointly, with the transmitting-receiving signal; This second electrode lay substrate be provided with a plurality of lower end electrode, with as connection electrode; These a plurality of sidewall conductive layer, be in order to should a plurality of upper end electrode, these a plurality of lower end electrode, interconnect with first radiation metal wires, and, with a plurality of upper end electrode, a plurality of lower end electrode, interconnect with second radiation metal wires.
Embodiment
The present invention provides a kind of ceramic wafers antenna of microminiaturization, and it comprises: one first electrode layer substrate, at least one radiating layer substrate, a second electrode lay substrate, and a plurality of sidewall conductive layer.This first electrode layer substrate be provided with a plurality of upper end electrode, with as connection electrode; Be provided with one first radiation metal wires and one second radiation metal wires on this radiating layer substrate, it forms the antenna of a non-encapsulated coil jointly, with the transmitting-receiving signal; This second electrode lay substrate be provided with a plurality of lower end electrode, with as connection electrode; These a plurality of sidewall conductive layer, be in order to should a plurality of upper end electrode, these a plurality of lower end electrode, interconnect with first radiation metal wires, and, with a plurality of upper end electrode, a plurality of lower end electrode, interconnect with second radiation metal wires.
A kind of ceramic wafers antenna of microminiaturization, it comprises: one first electrode layer substrate, cording have a first surface and a second surface; This first surface and this second surface are opposite face; And, this first surface be provided with a plurality of upper end electrode, with as connection electrode; At least one radiating layer substrate; Be to have one the 3rd surface and one the 4th surface, the 3rd surface is an opposite face with the 4th surface, and this radiating layer substrate is with its 3rd surperficial superimposed what second surface; And; The 3rd surface of radiating layer substrate is provided with one first radiation metal wires and one second radiation metal wires, and the common antenna that forms a non-encapsulated coil of this first radiation metal wires and this second radiation metal wires is with the transmitting-receiving signal; One the second electrode lay substrate; Cording has one the 5th surface and one the 6th surface; The 5th surface is an opposite face with the 6th surface; This second electrode lay substrate system is with its 5th surperficial superimposed what the 4th surface, and the 6th surface of this second electrode lay substrate is provided with a plurality of lower end electrode, with as connection electrode; A plurality of sidewall conductive layer, be in order to should a plurality of upper end electrode, these a plurality of lower end electrode, interconnect with first radiation metal wires, and; With a plurality of upper end electrode, a plurality of lower end electrode, interconnect with second radiation metal wires, and, these a plurality of sidewall conductive layer, a plurality of upper end electrode, and a plurality of lower end electrode; Can form a plurality of external terminal electrodes jointly for welding, on should the ceramic wafers antenna configurations what one of which application circuit device of microminiaturization, and can these a plurality of external terminal electrodes be connected a signal input end; With with signal feed-in first radiation metal wires; And a plurality of external terminal electrodes are connected an earth terminal, with the second radiation metal wires ground connection, so; First radiation metal wires can see through the mode of energy coupling; Signal with this signal input end institute feed-in transfers to second radiation metal wires, to bring into play the usefulness of its antenna; And a mark, be the first surface of establishing the what first electrode layer substrate, the directivity of the ceramic wafers antenna of the recognizable microminiaturization of this mark.
Claims (1)
1. the ceramic wafers antenna of a microminiaturization, it comprises: one first electrode layer substrate is to have a first surface and a second surface; This first surface and this second surface are opposite face; And, this first surface be provided with a plurality of upper end electrode, with as connection electrode; At least one radiating layer substrate; Be to have one the 3rd surface and one the 4th surface, the 3rd surface is an opposite face with the 4th surface, and this radiating layer substrate is with its 3rd surperficial superimposed what second surface; And; The 3rd surface of radiating layer substrate is provided with one first radiation metal wires and one second radiation metal wires, and the common antenna that forms a non-encapsulated coil of this first radiation metal wires and this second radiation metal wires is with the transmitting-receiving signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101228524A CN102780080A (en) | 2011-05-13 | 2011-05-13 | Miniaturized ceramic chip antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101228524A CN102780080A (en) | 2011-05-13 | 2011-05-13 | Miniaturized ceramic chip antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102780080A true CN102780080A (en) | 2012-11-14 |
Family
ID=47124905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101228524A Pending CN102780080A (en) | 2011-05-13 | 2011-05-13 | Miniaturized ceramic chip antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102780080A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1069645A2 (en) * | 1999-07-13 | 2001-01-17 | Shinko Electric Industries Co. Ltd. | Semiconductor device with an antenna and fabrication method therefor |
| TW480773B (en) * | 2001-03-06 | 2002-03-21 | Advanced Antenna Technology In | Chip-type Mianderlan antenna with multi-layered substrates |
| CN101034766A (en) * | 2007-04-10 | 2007-09-12 | 浙江正原电气股份有限公司 | Multi-layer porcelain antenna |
| CN201038309Y (en) * | 2007-04-04 | 2008-03-19 | 浙江正原电气股份有限公司 | LTCC stacked ceramic antenna |
| CN102255143A (en) * | 2005-06-30 | 2011-11-23 | L.皮尔·德罗什蒙 | Electronic element and method of manufacture |
-
2011
- 2011-05-13 CN CN2011101228524A patent/CN102780080A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1069645A2 (en) * | 1999-07-13 | 2001-01-17 | Shinko Electric Industries Co. Ltd. | Semiconductor device with an antenna and fabrication method therefor |
| TW480773B (en) * | 2001-03-06 | 2002-03-21 | Advanced Antenna Technology In | Chip-type Mianderlan antenna with multi-layered substrates |
| CN102255143A (en) * | 2005-06-30 | 2011-11-23 | L.皮尔·德罗什蒙 | Electronic element and method of manufacture |
| CN201038309Y (en) * | 2007-04-04 | 2008-03-19 | 浙江正原电气股份有限公司 | LTCC stacked ceramic antenna |
| CN101034766A (en) * | 2007-04-10 | 2007-09-12 | 浙江正原电气股份有限公司 | Multi-layer porcelain antenna |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121114 |