TW471706U - QFN package structure and its leadframe - Google Patents

QFN package structure and its leadframe

Info

Publication number
TW471706U
TW471706U TW89215715U TW89215715U TW471706U TW 471706 U TW471706 U TW 471706U TW 89215715 U TW89215715 U TW 89215715U TW 89215715 U TW89215715 U TW 89215715U TW 471706 U TW471706 U TW 471706U
Authority
TW
Taiwan
Prior art keywords
leadframe
package structure
qfn package
qfn
package
Prior art date
Application number
TW89215715U
Other languages
Chinese (zh)
Inventor
Chen-Jen Su
Chien-Tsun Lin
Chao-Chia Chang
Yu-Hsieh Su
Ming-Hui Tseng
Original Assignee
Walsin Advanced Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walsin Advanced Electronics filed Critical Walsin Advanced Electronics
Priority to TW89215715U priority Critical patent/TW471706U/en
Publication of TW471706U publication Critical patent/TW471706U/en

Links

TW89215715U 2000-09-08 2000-09-08 QFN package structure and its leadframe TW471706U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89215715U TW471706U (en) 2000-09-08 2000-09-08 QFN package structure and its leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89215715U TW471706U (en) 2000-09-08 2000-09-08 QFN package structure and its leadframe

Publications (1)

Publication Number Publication Date
TW471706U true TW471706U (en) 2002-01-01

Family

ID=21672559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89215715U TW471706U (en) 2000-09-08 2000-09-08 QFN package structure and its leadframe

Country Status (1)

Country Link
TW (1) TW471706U (en)

Similar Documents

Publication Publication Date Title
SG91352A1 (en) Semiconductor package
AU9447701A (en) Package
SG86465A1 (en) Semiconductor package and semiconductor package fabrication method
SG102638A1 (en) Lead frame, semiconductor package having the same, and semiconductor package manufacturing method
TW458377U (en) Sensor structure of quad flat package without external leads
GB0024796D0 (en) Package
GB2368462B (en) Mounting structure of semiconductor package
TW443581U (en) Wafer-sized semiconductor package structure
TW471706U (en) QFN package structure and its leadframe
TW461589U (en) Lead frame of QFP package
SG91919A1 (en) Leadframe and semiconductor package made using the leadframe
PL112567U1 (en) Factory-protected package
TW456587U (en) Semiconductor chip package structure and its lead frame structure
TW454949U (en) Semiconductor chip package structure and its lead frame structure
TW462536U (en) Chip package structure
TW488555U (en) Stackable QFN package
TW447777U (en) Ultra-thin semiconductor package structure
AU2002228773A1 (en) A leadframe and semiconductor package
TW497757U (en) Multi-chip packaging structure
TW409942U (en) Small-sized and straight-conductor semiconductor package
TW423715U (en) Semiconductor package structure
TW422413U (en) Improved semiconductor package structure
GB0015377D0 (en) Encapsulation process and encapsulated compositions
TW461587U (en) Improved structure of the connection wire frame for semiconductor chip packaging
TW504042U (en) Improved structure of chip package

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model