TW468234B - Chuck assembly in semiconductor device manufacturing equipment - Google Patents

Chuck assembly in semiconductor device manufacturing equipment Download PDF

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Publication number
TW468234B
TW468234B TW087106019A TW87106019A TW468234B TW 468234 B TW468234 B TW 468234B TW 087106019 A TW087106019 A TW 087106019A TW 87106019 A TW87106019 A TW 87106019A TW 468234 B TW468234 B TW 468234B
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TW
Taiwan
Prior art keywords
suction cup
tip
fixing rod
sucker
chuck
Prior art date
Application number
TW087106019A
Other languages
Chinese (zh)
Inventor
Han-Sang Kim
Seung-Chul Kim
Original Assignee
Samsung Electronics Co Ltd
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Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW468234B publication Critical patent/TW468234B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

There is provided a chuck assembly in a semiconductor device manufacturing equipment for preventing that the vacuum pressure to be transferred to a chuck assembly for absorbing and fixing a wafer is discharged out through the gap between the assembly parts, and the damage or breakage of a wafer occurs due to its deviation from a chuck assembly on which it should be secured. The chuck assembly comprises: a chuck tip for mounting a wafer to be chucked on its top flat surface, wherein the chuck tip has a protrusion projected downwardly from its bottom, and a passage hole provided on its middle and penetrating through the protrusion; a chuck fixing bar which is shaped such that the protrusion of the chuck tip is inserted, and has an air passage penetrated by the passage hole when the chuck tip is inserted thereto; and a sealing member provided on the contact of the protrusion and the chuck fixing bar.

Description

經濟部智慧財產局員工消費合作社印製 46 8234 Λ7 Α7 _____ Β7 五、發明說明(i ) 發明領娀 本發明係關於半導體裝置製造設備之吸盤總成及特別 係關於半導體裝置製造設備中供容易有效的卡吸晶圓之吸 盤梢端及其固定桿。 相關技術之說明 一般而言,半導體裝置係由晶圓經由進行一系列處理 例如光加工、擴散、蝕刻、化學蒸氣沉積(CVD)及金屬沉 積等製造。製程中,晶圓由一種設備移轉至另一種設備且 容納於載具上供進行所需加工處理。 同時由載具移轉至晶圓藉移轉機器人移動至加工設備 内部之吸盤’晶圓經由吸收及黏著牢固固定於吸盤上俾進 行加工處理。 參照第1及2圖,顯示習知吸盤總成。 如第1圖所示,習知吸盤總成10包含吸盤梢端12供安 裝待卡吸晶圓於其頂平坦面上,凸部14為桿形且由其底面 中心凸起,通孔16垂直貫穿凸部14,例如吸盤梢端12中心。 此外’吸盤總成之吸盤固定桿18設置於吸盤梢端12, 其成形為可偶聯與其垂直關聯之吸盤梢端12之凸部14,其 吸盤固定桿18可由設置於底側之氣缸(未顯示)上下移動。 此外,吸盤固定桿18内側設置一個空氣通道22於凸部 14插入吸盤固定桿18時可貫穿通過通孔16。空氣通道22之 另一端連接至真空泵(未顯示),故真空泵之真空壓力移轉 至通孔16及選擇性吸著固定安裝於吸盤梢端12頂面之晶圓 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4 (請先閱續背面之注意事項再填寫本頁) 訂- .線- 經濟部智慧財產局員工消費合作社印製 468234 、 A7 B7 五、發明說明(2) 此外,凸部14包含外部螺_ 24。吸盤固定桿18包含插 件26其直徑比空氣通道22更大,及空氣通道22側壁之内部 螺絲28匹配外部螺絲24。吸盤梢端12及吸盤固定桿18係由 螺絲24,28偶聯。 此外環繞凸部14上周邊,亦即於吸盤梢端12底面及接 近凸部14’有個凸部29由其底面凸起,於吸盤梢端12與吸 盤固定桿18偶聯期間’凸部29之平坦端面接觸吸盤固定桿 18之平坦端面。 但使用前述吸盤總成時’吸盤梢端與吸盤固定桿之接 觸部位常被磨耗而損害,原因為二者經常拆卸與偶聯而於 接觸部位間產生間隙,及真空壓力通過此間隙》結果難以 正常吸收與固定晶圓,因此晶圓偏離吸盤梢端使其表面受 損破裂。 又為了防止晶圓之損害及斷裂,需要定期更換吸盤總 成之吸盤梢端及吸盤固定桿結果導致耗費成本高。 發明概述 本發明針對提供一種吸盤總成於半導體裝置製造設置 以防止待移轉至吸盤總成供吸著固定晶圓之真空壓力經由 總成部件間之間隙排放,及避免因晶圓偏離應牢固固定之 吸盤總成導致損害或破裂。 本發明之另一目的係提供一種吸盤總成於半導體裝置 製造設備’其中可延長真空吸盤及連接管路之更換時間因 此可減少更換與製造成本。 為了達成此等及其它優點,根據本發明如具體表現及 本紙張尺度適用中國國家標準(CNS〉A4規格(210 X 297公釐) —----------- *^i· f請先閲璜背面之注意事項再填寫本頁) 訂· --線- 經濟部智慧財產局員工消費合作社印製 46 8234、 Δ7 Α7 ___ Β7 _ 五、發明說明(3 ) 廣泛敘述之目的,—種於半導體装置製造設備之吸盤總成 包含··一個吸盤梢端供安裝待卡吸晶圓於其頂平坦面’其 中該吸盤梢端具有一個凸部由其底面向下方向凸起,及一 個通孔設置於其中央且貫穿通過該凸部;一個吸盤固定桿 其成形為可插入吸盤梢端凸部,及具有—個空氣通道當吸 盤梢端插入其中時可使空氣貫穿通過通孔;及一個密封件 設置於凸部與吸盤固定桿之接頭上。 此外外部螺絲形成於凸部外表面上,及内部螺絲形成 於空氣通道之内壁上對應於凸部,故吸盤梢端與吸盤固定 桿較佳可彼此螺接偶合。 此外一根外部螺絲形成於凸部外表面上,直徑比空氣 通道更大的插件成形於吸盤固定桿末端,及一根内部螺絲 成形於插件内壁,故吸盤梢端與吸盤固定桿較佳彼此螺接 偶合。 此外,密封件為環形及當吸盤梢端與吸盤固定桿彼此 偶聯時,密封件係壓縮於吸盤梢端接近凸部之周邊底側與 吸盤固定桿末端間。 密封件為環形及插入插件内,故當通孔與插件彼此偶 聯時壓縮於插件内壁與通孔末端間。 此外’密封件係由矽橡膠製成。 須了解前文概略說明及後文詳細說明僅供舉例說明之 用而意圖進一步解說申請專利範圍之本發明。 圖式之簡單說明 附圖中: 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ! '^!| 訂-------—線 (請先閱讀脅面之生意事項再填寫本頁) 6 46 8234 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(4 ) 第1圖為剖面圖顯示於半導體裝置製造設備中習知吸 盤總成之示意分解代表圖; 第2圖為剖面圖顯示於半導體裝置製造設備申習知吸 盤總成之組裝偶聯代表圖; 苐3圖為剖面圖顯示根據本發明之具體例於半導體裝 置製造設備之吸盤總成之示意分解代表圖; 第4圖為剖面圖顯示根據本發明之具體例於第3圖之吸 盤梢端及吸盤固定桿聯結期間密封件之設置;及 第5圖為剖面圖顯示根據本發明之另一具體例於第3圖 之吸盤梢端及吸盤固定桿聯結期間密封件之設置。 較佳具體例之詳細說明 現在詳細說明本發明之較佳具體例,其範例係舉例說 明於附圖^ 如第3圖所示,本發明之吸盤總成3〇粗略分成兩部分: 吸盤梢端32及吸盤固定桿42。 吸盤梢端32包含由底面向下凸起之凸部34,及於6部 34中心垂直貫穿凸部之通孔36。 此外,外部螺絲38成形於凸部34外壁,及一凸部40成 形於吸盤梢端32接近外部螺絲38之底面上。 同時’吸盤梢端32下方設置一個吸盤固定桿42,其形 狀可偶聯吸盤梢端32之凸部34,及垂直對應於吸盤梢端32 ’及空氣通道44成形貫穿吸盤固定桿42内部中心供移轉真 空壓'力。 此外插件46成形於吸盤固定桿42之空氣通道44端側, ------------------ (請先閱讀脅面之注意事項再填寫本頁) 1SJ. —1. 線· 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4 6 82 3 4、 A7 __ B7 經濟部智慧財產局員工消費合作杜印製 五、發明說明(5 ) 其直徑比空氣通道44更大。於插件46内侧形成内部螺絲48 而匹配凸部34之外部螺絲3 8。 此外如第3至5圖所示,矽形成環形密封件5〇a, 5〇b成 形於吸盤總成上。第3及4圖所示密封件5〇a係設置於插件奸 端面與凸部40之對應面間,及於吸盤梢端32與吸盤固定桿 42偶聯期間被壓縮。 此外第5圖所示密封件5〇b為環形且嵌入插件46内側, 於吸盤梢端32與吸盤固定桿42偶聯期間,被壓縮於插件46 下表面與凸部34端面間。 如前述,吸盤梢端32升高一段距離遠離吸盤固定桿42 到密封件50a,50b之厚度。 密封件50a,50b之厚度屬於預定範圍,通常為〇 75毫 来。密封件厚度成形為0.35至0.65毫米。因此可未改變吸 盤梢端32及吸盤固定桿42之長度或形狀而使用。此外’容易達成多種密封件5〇a,50b之厚度範園,及 凸部34長度或插件46深度可隨同密封件5〇a,50b之厚度之 增減調整。 如前述,密封件50a,50b阻斷間隙,該間隙經常由於 吸盤固定桿42之插件46與吸盤梢端32之凸部40經常拆卸與 偶聯而磨蝕或斷裂產生間隙,故密封件可防止真空壓力通 過聯結位置排放。 因此根據本發明,密封件被壓縮而阻斷由於磨蝕或斷 裂導致吸盤梢端與吸盤固定桿之接頭間之間隙,如此真空 壓力通過間隙排放,及正常真空壓力之移送可防止吸盤梢 (請先閱讀嘴面之注意事項再填寫本頁) 衣: 訂· •線. 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) A7 ^68234 —^ __B7___ i、發明說明(6 ) 端之晶圓偏位因而防止晶圓受損。 此外密封件可保持於吸盤梢端與吸盤固定桿之均_ 耗聯結位置,故可延長更換時間及節省成本。 -二磨 又雖然已經詳細說明本發明,但須了解可未背離如隨 附之申請專利範圍界定之本發明之精髓及範圍做出多種變 化、取代及改變。 元件標號對照 a?先閱讀脅面之注意事項再填寫本頁) %--------訂---------線丨 經濟部智慧財J.局員工消費合作杜印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 46 8234 Λ7 Α7 _____ B7 V. Description of the Invention (i) Invention Fields This invention relates to the suction cup assembly of semiconductor device manufacturing equipment and especially to semiconductor device manufacturing equipment. The sucker tip of the chuck wafer and its fixing rod. Description of Related Technology Generally speaking, a semiconductor device is manufactured from a wafer through a series of processes such as light processing, diffusion, etching, chemical vapor deposition (CVD), and metal deposition. During the process, wafers are transferred from one device to another and stored on a carrier for the required processing. At the same time, the wafer is transferred from the carrier to the wafer by the transfer robot and is moved to the suction cup inside the processing equipment. The wafer is firmly fixed on the suction cup through absorption and adhesion for processing. Referring to Figures 1 and 2, a conventional suction cup assembly is shown. As shown in FIG. 1, the conventional sucker assembly 10 includes a sucker tip 12 for mounting a wafer to be sucked on a top flat surface thereof. The convex portion 14 is rod-shaped and protrudes from the center of the bottom surface. The through hole 16 is vertical. The convex portion 14 penetrates, for example, the center of the sucker tip 12. In addition, the suction cup fixing rod 18 of the suction cup assembly is provided on the suction cup tip 12 and is formed into a convex portion 14 that can be coupled to the suction cup tip 12 vertically associated therewith. The suction cup fixing rod 18 can be provided by a cylinder (not (Display) Move up and down. In addition, an air passage 22 is provided inside the suction cup fixing rod 18, and the convex portion 14 can pass through the through hole 16 when inserted into the suction cup fixing rod 18. The other end of the air channel 22 is connected to a vacuum pump (not shown), so the vacuum pressure of the vacuum pump is transferred to the through hole 16 and the wafers fixedly mounted on the top surface of the suction cup tip 12 are selectively attracted. The paper dimensions are applicable to Chinese national standards ( CNS) A4 specification (210 X 297 mm) 4 (Please read the notes on the back of the next page before filling out this page) Order-.line-printed by the Intellectual Property Bureau Staff Consumer Cooperative of the Ministry of Economic Affairs 468234, A7 B7 V. Description of the invention ( 2) In addition, the convex portion 14 includes an outer screw_24. The suction cup fixing rod 18 includes an insert 26 having a larger diameter than the air passage 22, and the inner screw 28 of the side wall of the air passage 22 matches the outer screw 24. The sucker tip 12 and the sucker fixing rod 18 are coupled by screws 24,28. In addition, around the upper periphery of the convex portion 14, that is, the convex portion 29 is protruded from the bottom surface on the bottom surface of the suction cup tip 12 and near the convex portion 14 ', and the convex portion 29 is coupled during the coupling of the suction cup tip 12 and the suction cup fixing rod 18. The flat end surface contacts the flat end surface of the chuck fixing rod 18. However, when using the aforementioned sucker assembly, the contact part between the sucker tip and the sucker fixing rod is often worn and damaged, because the two are often disassembled and coupled to create a gap between the contact parts, and the vacuum pressure passes through this gap. The wafer is normally absorbed and fixed, so the wafer is deviated from the sucker tip and the surface is damaged and cracked. In addition, in order to prevent damage and breakage of the wafer, it is necessary to periodically replace the sucker tip of the sucker assembly and the sucker fixing rod, resulting in high costs. SUMMARY OF THE INVENTION The present invention is directed to providing a chuck assembly in a semiconductor device manufacturing arrangement to prevent the vacuum pressure to be transferred to the chuck assembly for sucking and fixing a wafer to be discharged through the gap between the components of the assembly, and to prevent the wafer from being rigid due to wafer deviation The fixed suction cup assembly causes damage or rupture. Another object of the present invention is to provide a chuck assembly in a semiconductor device manufacturing equipment ', in which the replacement time of the vacuum chuck and the connecting pipe can be extended, thereby reducing replacement and manufacturing costs. In order to achieve these and other advantages, according to the present invention, the Chinese national standard (CNS> A4 specification (210 X 297 mm)) applies to the specific performance and paper size of this paper. ------------- * ^ i · f Please read the notes on the back of the page before filling out this page.) Order---- Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 46 8234, Δ7 Α7 ___ Β7 _ V. Description of the invention (3) The purpose of extensive description -A sucker assembly for semiconductor device manufacturing equipment includes a sucker tip for mounting a wafer to be sucked on a top flat surface thereof, wherein the sucker tip has a convex portion protruding downward from a bottom surface thereof, and A through hole is provided in the center and passes through the convex portion; a sucker fixing rod is formed to be inserted into the convex end of the sucker tip, and has an air passage that allows air to pass through the through hole when the sucker tip is inserted therein; And a seal is arranged on the joint between the convex part and the sucker fixing rod. In addition, the outer screw is formed on the outer surface of the convex portion, and the inner screw is formed on the inner wall of the air passage corresponding to the convex portion. Therefore, the sucker tip and the sucker fixing rod are preferably screwed and coupled to each other. In addition, an external screw is formed on the outer surface of the convex portion, an insert having a diameter larger than the air passage is formed at the end of the suction cup fixing rod, and an internal screw is formed at the inner wall of the insert. Take the coupling. In addition, the seal is ring-shaped and when the sucker tip and the sucker fixing rod are coupled to each other, the seal is compressed between the bottom end of the sucker tip near the convex portion and the end of the sucker fixing rod. The seal is annular and inserted into the insert, so when the through hole and the insert are coupled to each other, they are compressed between the inner wall of the insert and the end of the through hole. In addition, the 'seal is made of silicone rubber. It should be understood that the foregoing brief description and the following detailed description are for illustrative purposes only, and are intended to further explain the scope of the patented invention. Brief description of the drawing In the drawing: The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm)! '^! | Order -------— line (please read the first Please fill in this page again for business matters) 6 46 8234 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (4) Figure 1 is a cross-sectional view showing the schematic disassembly of a conventional suction cup assembly in semiconductor device manufacturing equipment Representative diagram; Fig. 2 is a cross-sectional view showing the assembly and coupling representative drawing of the suction cup assembly applied to the semiconductor device manufacturing equipment; 苐 3 is a cross-sectional view showing the suction cup assembly of the semiconductor device manufacturing equipment according to a specific example of the present invention Exploded representative view; FIG. 4 is a cross-sectional view showing the arrangement of the seal during the coupling of the suction cup tip and the suction cup fixing rod according to the specific example of the present invention; and FIG. 5 is a cross-sectional view showing another embodiment of the present invention. The specific example is the setting of the seal during the connection of the sucker tip and the sucker fixing rod in FIG. 3. Detailed description of the preferred specific examples Now, the preferred specific examples of the present invention will be described in detail. The examples are illustrated in the drawings. As shown in FIG. 3, the sucker assembly 30 of the present invention is roughly divided into two parts: the sucker tip 32 和 sucker fixing lever 42. The suction cup tip 32 includes a convex portion 34 protruding downward from the bottom surface, and a through hole 36 penetrating the convex portion vertically at the center of the 6 portion 34. In addition, an external screw 38 is formed on the outer wall of the convex portion 34, and a convex portion 40 is formed on the bottom surface of the suction cup tip 32 close to the external screw 38. At the same time, a suction cup fixing rod 42 is provided below the suction cup tip 32, and its shape can be coupled to the convex portion 34 of the suction cup tip 32 and vertically corresponding to the suction cup tip 32 'and the air passage 44 is formed through the inner center of the suction cup fixing rod 42 for Transfer vacuum pressure 'force. In addition, the insert 46 is formed on the end of the air channel 44 of the suction cup fixing rod 42, ------ (Please read the precautions of the flank surface before filling this page) 1SJ. —1. Line · This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 4 6 82 3 4, A7 __ B7 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs on consumer cooperation ) Its diameter is larger than the air passage 44. An internal screw 48 is formed inside the insert 46 to match the external screw 38 of the convex portion 34. In addition, as shown in Figures 3 to 5, silicon forms a ring seal 50a, 50b formed on the suction cup assembly. The seal 50a shown in Figs. 3 and 4 is provided between the end face of the insert and the corresponding surface of the convex portion 40, and is compressed during the coupling of the suction cup tip 32 and the suction cup fixing rod 42. In addition, the sealing member 50b shown in FIG. 5 is ring-shaped and is embedded inside the insert 46, and is compressed between the lower surface of the insert 46 and the end face of the convex portion 34 during the coupling of the sucker tip 32 and the sucker fixing rod 42. As mentioned above, the suction cup tip 32 is raised a distance away from the suction cup fixing rod 42 to the thickness of the seals 50a, 50b. The thickness of the seal members 50a, 50b falls within a predetermined range, and is usually 0.75 mm. The seal thickness is shaped from 0.35 to 0.65 mm. Therefore, the chuck tip 32 and the chuck fixing lever 42 can be used without changing the length or shape. In addition, it is easy to achieve a variety of thicknesses of the seals 50a, 50b, and the length of the protrusion 34 or the depth of the insert 46 can be adjusted with the increase or decrease of the thickness of the seals 50a, 50b. As mentioned above, the seals 50a, 50b block the gap, which is often abraded or broken due to the frequent removal and coupling of the insert 46 of the suction cup fixing rod 42 and the convex portion 40 of the suction cup tip 32, so the seal can prevent vacuum Pressure is vented through the coupling position. Therefore, according to the present invention, the seal is compressed to block the gap between the end of the suction cup and the joint of the suction cup fixing rod due to abrasion or breakage, so that the vacuum pressure is discharged through the gap and the transfer of normal vacuum pressure can prevent the suction cup tip (please Read the notes on the mouth and fill in this page again.) Clothing: Customized • Thread. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) A7 ^ 68234 — ^ __B7___ i. Description of the invention (6) The wafer misalignment at the end prevents wafer damage. In addition, the sealing member can be maintained at the even coupling position of the suction cup tip and the suction cup fixing rod, so the replacement time can be extended and the cost can be saved. -Erima Although the present invention has been described in detail, it must be understood that various changes, substitutions and changes may be made without departing from the spirit and scope of the present invention as defined by the scope of the attached patent application. Comparison of component labeling a? Read the cautionary notes before filling out this page)% -------- Order --------- line 丨 Ministry of Economic Affairs, Smart Finance J. Bureau, Consumer Consumption Du Yin system

10 習知吸盤總成 28 螺絲 12 吸盤梢端 29 凸部 14, 34, 40 凸部 30 吸盤總成 16, 36 通孔 32 吸盤梢端 18, 42 吸盤固定桿 44 空氣通道 22 空氣通道 46 插件 24 > 38 外部螺絲 48 内部螺絲 26 插件 50a-b 密封件 9 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)10 Known sucker assembly 28 Screw 12 Sucker tip 29 Convex part 14, 34, 40 Convex part 30 Suction assembly 16, 36 Through hole 32 Suction tip 18, 42 Sucker fixing rod 44 Air channel 22 Air channel 46 Insert 24 > 38 external screw 48 internal screw 26 insert 50a-b seal 9 this paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

468234 、 1 DS 六 經濟部智慧財產局員Η消費合作社印製 申請專利範圍 1. 一種於半導體裝置製造設備之吸盤總成,其包含: 一個吸盤梢端供安裝待卡吸晶圓於其頂平坦面, 其中d沒盤梢端具有一個凸部由其底面向下方向凸起 ,及一個通孔設置於其中央且貫穿通過該凸部; 一個吸盤固定桿其成形為可插入吸盤梢端凸部, 及具有一個空氣通道當吸盤梢端插入其中時可使空氣 貫穿通過通孔;及 一個密封件設置於凸部與吸盤固定桿之接頭上。 2. 如申請專利範圍第1項之吸盤總成,其中一根外部螺絲 形成於凸部外表面上,直徑比空氣通道更大的插件成 形於吸盤固定桿末端,及一根内部螺綠成形於插件内 壁,故吸盤梢端與吸盤固定桿較佳彼此螺接偶合。 3. 如申請專利範園第2項之吸盤總成,其中該密封件為環 形及當吸盤梢端與吸盤固定桿彼此偶聯時,密封件係 壓縮於吸盤梢端接近凸部之周邊底側與吸盤固定桿末 端間。 4‘如申請專利範圍第2項之吸盤總成,其中該密封件為環 形及插入插件内,故當通孔與插件彼此偶聯時壓縮於 插件内壁與通孔末端間。 5,請專利範圍第1項之吸盤總成,其中該密封件係由 _製成。468234, 1 DS Six members of the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives printed patent applications 1. A suction cup assembly for semiconductor device manufacturing equipment, which includes: A suction cup tip for mounting a wafer to be sucked on the top flat surface Wherein, the end of the disc has a convex portion protruding downward from its bottom surface, and a through hole is provided in the center thereof and passes through the convex portion; a suction cup fixing rod is formed to be inserted into the convex portion of the suction cup tip, And having an air passage that allows air to pass through the through hole when the tip of the sucker is inserted therein; and a seal is provided on the joint between the convex part and the sucker fixing rod. 2. As for the suction cup assembly of the first patent application scope, one of the external screws is formed on the outer surface of the convex part, the insert with a diameter larger than the air passage is formed at the end of the suction cup fixing rod, and one internal screw green is formed at The inner wall of the plug-in, therefore, the sucker tip and the sucker fixing rod are preferably screwed together. 3. If the suction cup assembly of the patent application No. 2 item, wherein the seal is ring-shaped and when the suction cup tip and the suction cup fixing rod are coupled to each other, the seal is compressed on the bottom side of the suction cup tip near the convex portion. And the end of the suction cup fixing rod. 4’Such as the suction cup assembly of item 2 of the patent application scope, in which the seal is ring-shaped and inserted into the insert, so when the through hole and the insert are coupled to each other, they are compressed between the inner wall of the insert and the end of the through hole. 5. The suction cup assembly of item 1 of the patent scope, where the seal is made of _. 10 (晴先閱讀货面之注意事項再填寫本頁) --線· 本紙張尺度適用中國國家標準(CNS)A4規格(210 Χ 297公釐)10 (Please read the precautions on the front of the product before filling in this page) --Line · This paper size applies to China National Standard (CNS) A4 (210 x 297 mm)
TW087106019A 1997-09-30 1998-04-20 Chuck assembly in semiconductor device manufacturing equipment TW468234B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970050621A KR19990028074A (en) 1997-09-30 1997-09-30 Chuck Assembly of Semiconductor Device Manufacturing Equipment

Publications (1)

Publication Number Publication Date
TW468234B true TW468234B (en) 2001-12-11

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Application Number Title Priority Date Filing Date
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JP (1) JPH11111825A (en)
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TW (1) TW468234B (en)

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US4577100A (en) * 1983-12-27 1986-03-18 United Technologies Corporation Temperature compensated optical pressure sensor
KR100460338B1 (en) * 1998-02-04 2005-01-17 삼성전자주식회사 Susceptor for fabricating semiconductor device to prevent wafer from being dropped during fabricating process and avoid generation of particles
JP4331901B2 (en) * 2001-03-30 2009-09-16 日本碍子株式会社 Ceramic susceptor support structure
JP5810517B2 (en) * 2010-12-02 2015-11-11 富士電機株式会社 Adsorption device and adsorption method
CN103387134A (en) * 2013-07-16 2013-11-13 上海东富龙科技股份有限公司 Quick-disassembling type vacuum suction device
JP2015170617A (en) * 2014-03-04 2015-09-28 東京エレクトロン株式会社 Liquid processing apparatus

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Publication number Priority date Publication date Assignee Title
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JPH11111825A (en) 1999-04-23
KR19990028074A (en) 1999-04-15

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