4 6 81 3 〇 A7 B7 經濟部中夬標準局員工消費合作社印製 五、發明説明（1 ) 〔產業上的利用領域〕 本發明係爲關於座標輸入裝置，撿出以操作者的手指 所形成的容量變化，從該容量變化量输出特定以手指所指 示的位置之座標位置資訊。 〔先行技術〕々 被稱爲圖表的座標輸人裝置，作爲圖形或文、字資訊的 輸入裝置，正廣泛的普及著。在於此樣的座標輸入裝置， 由於選擇被顯示在顯示畫面的文字或是圖形而輸入所須的 資訊之形式，係爲以手指碰觸顯示畫面上的文字或圖形而 ··· 撿出阻抗變化作爲開關動作之阻抗形式，或以手指的接觸 檢出電極間的靜電容量變化之靜電容量形式，已被實用化 〇 此樣的輸入機構當中，用以靜電容量V形式的座標输入' 裝置的一例，在電路基板上載置以感電體材料‘命形成的基 极，用可撓式配線基板導逋電路基板與基板間的情況已被 知悉。前述基板被形成爲矩形，在其表面相互隔有所定的 1 1 間隔被形成有往X方向延伸的複興個X電」匯，。另外位於 X電極群的同方向之一端部被形成爲連接部，相同的位於 Y電極群的同一方向之一端部被形成連接部，在各連接部 分別被安裝有連接座。然且，由於將前述可撓式配線基板 的兩端連接至各連接座及前述電路基板，所以基板的X及 Y電極群介由可撓式'配線基板而被導通至電路.基板。 依此樣所概略構成的座標輸入裝置，操作者將自己的 本紙張尺度逋用中國國家標準（CMS ) A4規格（210X297公釐） :----^---—---C;嚷— (請先閔讀背面之注意事項再填寫本頁)4 6 81 3 〇A7 B7 Printed by the Consumers' Cooperative of the China Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) [Industrial Use Field] The present invention is a coordinate input device which is formed by the operator's finger The capacity change is output from the capacity change amount, and coordinate position information specifying a position indicated by a finger is output. [Advanced technology] 的 Coordinate input devices called charts are widely used as input devices for graphic, text, and character information. In such a coordinate input device, because the form of information required for inputting characters or graphics displayed on the display screen is selected, a finger touches the text or graphics on the display screen and picks up impedance changes. As an impedance form of a switching action or a capacitance form in which a capacitance change between electrodes is detected by contact with a finger, it has been put into practical use. Among such input mechanisms, an example of a device for inputting a coordinate in the form of a capacitance in the form of "V" It has been known that a base electrode formed of a conductive material is placed on a circuit substrate, and a flexible wiring substrate is used to guide the circuit substrate and the substrate. The substrate is formed in a rectangular shape, and revival X-ray sinks extending in the X direction are formed on the surface of the substrate at a predetermined interval of 1 1. In addition, one end portion located in the same direction of the X electrode group is formed as a connection portion, and one end portion located in the same direction of the Y electrode group is formed as a connection portion, and a connection seat is installed at each connection portion. However, since both ends of the flexible wiring substrate are connected to the connection bases and the circuit substrate, the X and Y electrode groups of the substrate are conducted to the circuit substrate through the flexible wiring substrate. According to the coordinate input device that is roughly constituted in this way, the operator will use the Chinese paper standard (CMS) A4 specification (210X297 mm) of his own paper size: ^^ ------ C; 嚷— (Please read the notes on the back before filling out this page)
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Mr 46 813 0 A7 B7 經濟部t央標準局男工消費合作社印裝 五、發明説明（2 ) 手指壓觸在基板的任意處所，則從X電極朝向Y電極傳送 的電力線之一部分龙吸至所接近過來..的手指，所以在被吸 收至Y電極的電力線產生變化，根據此容量變化量可以檢 出手指的位置。 〔發明所欲解決之課題〕 如上述過，在過去的靜電容量式座標輸入裝置所備有 的基板，係爲在其表面與肾面分'別被形成有X電極群與Y I 電極群，這些X及Y電極群介由可'擦式配線基板而成爲被 導通至電路基板，因而在基板的表·背兩面必須安裝被連 接至X電極群的連接座及被連接至Y電極群的璋接座。因 此，由於這些被安裝在表·背面的連接座，不僅增大座標输 入裝置全體的厚度，並月被連接至連座的2個可撓式配線 基板，必須分別從基板的側部使其擴張至外而導引至回路 ，因此可撓式配線基板往外擴張占用空間^所以造成 座镡輸入裝置全體的外形變大的裯題。 本發明由於是鑑於過去技術的情況，因此其第1目的 係爲提供薄型且小'型化的座標輸入裝置：第2目的係爲提 供可以簡單I確實的連接軟片基'板與電路基板間。 I 〔用以解決課題之手段〕 上述過本發明的第1目的，係以在表面側被設有用相 互平行的複數個電極所構成的第1電極群，同時在位於這 1 些第1電極群的同一方向_的一端部被設有穿孔部；在背面 本紙张尺度通用t國國家揉準（CNS ) A4規格（210 X 297公釐）_ ' ；----；------II (請先閔讀背面之注意事項再填寫本頁} ，ΤΓ _y 經濟部中央標準局員工消費合作社印裝 4 6 S1 3 〇 A7 _B7_ 五、發明説明（3 ) 側被設有_用與前述第1電極群正交的方向且相互平行的複 個電極所構成的第2電極群，同時在位於這些第2電極群 的同一方向之各一端部被設有第.1焊接部，且具備被設有 導通至穿孔部的第2焊接部之軟片基板；而被達成。 另外，上述過本發明的篇2目的，係在於上述的構成 ，具備被形成有連接至前述第1及第2焊接部的配線圖案 之電路基板，以在該電路基板上載置前述軟片基板’，而被 ^成0 進而，上述過本發明的第1及第2目的，係以在表面 側用相互平行的複數個電極所構成的第1電極群，在背面 側被設有用與前述第1電極群正交的方向且相互平行的複 數個電極所構成的第2電極群，並且在位於前述第1電極 群的同一方向的一端部被設有第1穿孔部之感電體基板、 及 具備被配在前述感體基板的背面側，在與前述第1穿 孔部相對的位置被形成有第2穿孔部，在與前述第2電極 群的一端部相對的位置被形成有第3穿孔部，在其被面被 設有連接至前述第2及第3穿孔部的配線圖案及驅動電路 之電路基板；及用以分別導通前述第1穿孔部與第2穿孔 部、前述第2電極群與前述第_ 3穿孔部之壓著用連接構件 :而被構成。 〔作用〕 依據申請專利範圍第1項之座、標輸入裝置，被設在軟 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） (請先聞讀背面之注意事項再填寫本頁) '衮· 訂 經濟部中央標準局員工消費合作社印製 4 6 8130 A7 B7 五、發明説明（4 ) 片基板的表面側之第1電極群介面穿孔部而被導引至軟片 基板的背面側之第2焊接部，由於可以同時從軟片基板的 背面側取出被設在軟片基板表•背兩面的2個電極群，所 以形成爲不須如過去般的施予導電連接軟片基板與電路基 板之可撓式配線基板或連接座，也不會從軟片基板與電路 .基板的側方突出可撓式配線基板。因此，軟片基板的構造 被簡略化，且達成座標輸入裝置的薄型及小型化。 依據申請專利範圍第2項之座標輸入裝置，爲了在被 配設在軟片基填的背面側之電路基板，形成連接至軟片基 板的第1及第2焊接部之配線圖案，因而在該軟片基板的 2個電極群使其導通至電路基板之際，將軟片基板只載置 &麗路基板就可以實現此座標輸入裝置。 .依據申請專利範圍第3項之座標輸入裝置，被設在軟 片基板的表面側之第1電極群係介由穿孔部而被引導至軟 片基板的背面側，被設在軟片基板的背面側之2電極群 ，同時介由壓著用連接構件而被連接至電路基板的配線圖 案，不僅可以簡單且確實的連接軟片基板與電路基板間。+ 〔實施例〕/ 以下*根據圖面說明本發明的實施例。 第1圖係爲表示本發明的一實施例之座標输入裝置的 概略構成之分解斜視圖，第2圖係爲在該.座標輸入裝置£斤 備有的軟片基板之平面圖，第3圖係爲該軟迕基板之.篇_.面 胤.，第4圖係爲表示該軟片基板的穿孔部之縱斷面圖，第 本紙張尺度逋用中國國家揉準（〇呢）八4规格（210><297公釐>_7 ：~.丨^------Q—— (請先閔讀背面之注意事項再填寫本頁) 訂 A7 B7 4 6 81 3 0 五、發明説明（5 ) 5圖係爲在第1圖的座標輸入裝置所備有的電路基板之穿 孔部分之縱斷面圖，第6圖係爲表示該電路基板與軟質基 板的連接狀態之縱斷面圖。 (請先聞讀背面之注意事項再填寫本頁) 本實施例的座標輸入裝置，係以被配設在最上部的 E_ET軟片等所形成之保護層1、及以被配設在該保護層 1的下面之P ET軟片等所形成之軟片基板2、及被配設 在被軟片基板2的下面之電路基板3，而被構成。 前述軟片基板2係爲感.電體基板，如第2圖及第3圖 所示，在其表面以所定的間隔被形成有複數X電極4，在 其背面也以所定的間隔被形成有複數個Y電極5。此情況 .、------- ，X電極4盡可能構成爲較細電極，Y電極5由於是檢出 •一.^ '- ... 經濟部中央標準局員工消費合作社印裝. 手指所接觸的情況，因而被構成爲盡可能較粗電極。Y電 極5延伸至對於X電極4爲正交的方向，此電極4，5從 平面上俯視係被配置矩陣狀。X及Y電極4 ，5例如以印 刷:在軟片基板2的表面及背面之銀糊而被構成。在X及Y 電極4 ，5的各延伸方向，平行的兩端部，爲了使其安定 周圍部的性能而分別被形成有帶狀的接地導體部6。在位钱 各、X電極4的同一方向之一端部被設有第1穿孔7 ,在位 於各Y電極.5的同一方向之一端部被形成有第1焊接點。 另外，在軟片基板2背面的一方其接地導體部6的內部被 設有第2焊接點9 ,這.些第2焊接點9係介由第1穿孔7 而導電連接至X電極4。 在前述電路基板3的一側緣部被設有對向於各第1焊 接點8的第2穿孔11，在鄰接於該側緣部的他側綠部被 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐）Mr 46 813 0 A7 B7 Printed by the Men ’s Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. 5. Description of the invention (2) When a finger presses on any place on the substrate, a part of the power line transmitted from the X electrode to the Y electrode is sucked to the place. Approaching your finger, so there is a change in the power line absorbed into the Y electrode, and the position of your finger can be detected based on this amount of capacity change. [Problems to be Solved by the Invention] As described above, the substrates provided in the conventional capacitive coordinate input devices have been formed with an X electrode group and a YI electrode group separately on the surface and the kidney surface. The X and Y electrode groups are electrically connected to the circuit substrate through the erasable wiring substrate. Therefore, a connection base connected to the X electrode group and a connection connected to the Y electrode group must be installed on the front and back surfaces of the substrate. seat. Therefore, because these connectors are mounted on the table and the back, not only the thickness of the entire coordinate input device is increased, but also two flexible wiring boards connected to the connector must be expanded from the sides of the board to It leads to the circuit from the outside, so that the flexible wiring substrate expands to occupy space 所以, which causes a problem that the overall shape of the seat input device becomes large. Since the present invention is based on the state of the art, its first object is to provide a thin and small type coordinate input device. The second object is to provide a simple and reliable connection between a flexible substrate and a circuit board. I [Means for Solving the Problems] The first object of the present invention described above is to provide a first electrode group composed of a plurality of electrodes parallel to each other on the surface side, and to locate the first electrode groups at the same time. One end of the same direction _ is provided with a perforated portion; on the back of this paper, the standard of the paper is compliant with the national standard (CNS) A4 (210 X 297 mm) _ '; ----; ------ II (Please read the notes on the back before filling this page}, ΤΓ _y Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 4 6 S1 3 〇A7 _B7_ V. The description of the invention (3) is provided with _ The second electrode group composed of a plurality of electrodes in a direction orthogonal to the first electrode group and parallel to each other is provided with a .1 welding portion at each end portion in the same direction of these second electrode groups, and is provided with This is achieved by providing a flexible substrate provided with a second soldering portion that is connected to the perforated portion. In addition, the above-mentioned second object of the present invention resides in the above-mentioned configuration and includes a connection formed to the first and second soldering portions. Circuit board with a wiring pattern such that the aforementioned circuit board is placed on the circuit board The sheet substrate is reduced to 0. Furthermore, the first and second objects of the present invention described above are a first electrode group composed of a plurality of electrodes parallel to each other on the front surface side, and are provided on the rear side with A second electrode group composed of a plurality of electrodes in a direction orthogonal to the first electrode group and parallel to each other, and an electroconductive substrate having a first perforated portion provided at one end portion in the same direction of the first electrode group, And a back surface side provided with the sensor substrate, a second perforated portion formed at a position opposed to the first perforated portion, and a third perforated portion formed at a position opposed to one end portion of the second electrode group And a circuit board connected to the second and third perforated portions of the second and third perforated portions, and a circuit board for driving the circuit; and for conducting the first perforated portion, the second perforated portion, and the second electrode group, respectively. The connection member for pressing with the aforementioned _3th perforated part: is constituted. [Function] According to the seat and mark input device of the first patent application scope, it is set on the standard of soft paper and applicable to China National Standards (CNS) A4 size (210X297 mm (Please read the precautions on the back before filling out this page) '衮 · Order printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 4 6 8130 A7 B7 V. Description of the invention (4) The first electrode group on the surface side of the substrate The second soldering portion that is guided to the back side of the flexible substrate through the interface perforated portion can be taken out from the rear side of the flexible substrate at the same time because the two electrode groups provided on the surface and the back of the flexible substrate are not required. In the past, a flexible wiring substrate or a connection base that conductively connects a flexible substrate and a circuit substrate is not protruded from the side of the flexible substrate and the circuit substrate. Therefore, the structure of the flexible substrate is simplified. The size and size of the coordinate input device are reduced. According to the coordinate input device of item 2 of the scope of patent application, in order to form a wiring pattern connected to the first and second soldering portions of the flexible substrate on a circuit substrate disposed on the back side of the flexible substrate, the flexible substrate is provided on the flexible substrate. When the two electrode groups are connected to the circuit substrate, the coordinate input device can be realized by placing a flexible substrate only on the & Lilu substrate. According to the coordinate input device of the third patent application scope, the first electrode group provided on the surface side of the flexible substrate is guided to the rear side of the flexible substrate via the perforated portion, and is provided on the rear side of the flexible substrate. The two-electrode group is simultaneously connected to the wiring pattern of the circuit board via the pressure-connecting connection member, and can not only easily and reliably connect the flexible substrate and the circuit board. + [EXAMPLES] / Hereinafter * Examples of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a schematic configuration of a coordinate input device according to an embodiment of the present invention, and FIG. 2 is a plan view of a flexible substrate provided in the coordinate input device. FIG. 3 is Chapter 4 of the soft base board. Figure 4 is a longitudinal cross-sectional view showing the perforated portion of the soft base board. The first paper size is in accordance with the Chinese national standard (0?) 8 4 size (210 >); < 297mm > _7: ~. 丨 ^ ------ Q—— (Please read the notes on the back before filling this page) Order A7 B7 4 6 81 3 0 V. Description of the invention ( 5) 5 is a longitudinal sectional view of a perforated portion of a circuit substrate provided in the coordinate input device of FIG. 1, and FIG. 6 is a longitudinal sectional view illustrating a connection state of the circuit substrate and a flexible substrate. (Please read the precautions on the back before filling out this page) The coordinate input device of this embodiment is a protective layer 1 formed by E_ET film and the like arranged on the top, and is arranged on the protective layer 1 is a flexible substrate 2 formed of a lower P ET film, and the like, and a circuit substrate 3 is disposed on the lower surface of the flexible substrate 2. The aforementioned flexible substrate 2 is a sensor substrate. As shown in FIG. 2 and FIG. 3, a plurality of X electrodes 4 are formed at predetermined intervals on a surface thereof, and are formed at predetermined intervals on a back surface thereof. There are a plurality of Y electrodes 5. In this case, the X electrode 4 is formed as thin as possible, because the Y electrode 5 is detected • One. ^ '-... Central standard of the Ministry of Economic Affairs It is printed by the Consumer Cooperative of the Bureau. It is made as thick as possible when the finger touches it. The Y electrode 5 extends to the direction orthogonal to the X electrode 4. The electrodes 4, 5 are arranged in a plan view from the plane. Matrix. X and Y electrodes 4 and 5 are formed by printing, for example, a silver paste on the surface and back of flexible substrate 2. In each extension direction of X and Y electrodes 4 and 5, parallel ends are formed. A band-shaped ground conductor portion 6 is formed for each of the stable surrounding performances. One end of the X electrode 4 in the same direction is provided with a first perforation 7 at the same position as the Y electrodes .5. A first solder joint is formed at one end portion in the direction. In addition, the ground conductor portion 6 of The second soldering points 9 are provided in the portion, and these second soldering points 9 are electrically connected to the X electrode 4 through the first through hole 7. The edge portion of one side of the circuit board 3 is provided to face each The second perforation 11 of the first welding point 8 is applied to the Chinese standard (CNS) A4 (210X297 mm) of this paper in the green part adjacent to the side edge part.
4 6 81 3D A7 B7 經 濟 央 標 準 局 貝 工 消 費 合 作 社 印 製 五、發明説明（6 ) 形成有對向於第2焊接點9的第3穿孔1 _2。在電路基板 3的中央被設有以銅箔等所形成的接地部1 3，利用該接 地部13防止從電路基板3下方的信號流入X及Y電極4 、5。在電路基板3的背面被形成有以銅箔等所形成的配 線圖案14 (圖案的全體構成係爲省略），在該配線圖案 14被焊接有已IC化的驅動電路或控制電路等的電路片 1 5，同時在配線圖案1 4的焊接部第2及第3穿孔1 1 、1 2被連接著。另外，第1焊接點8與第2穿孔1 1、 及第2焊接部點第3穿孔部1 2，係例如第6圖所示 ，以介隔設置在軟片基板2與電路基板3間的異方導電層 16而被導電連接。然而，取代異方導電層1 6，改導 電性接著劑或導電糊而接合亦可。 如以上所構成的座標輸入裝置，係在電路基板3的第 .2及第3穿孔1 1、1 2上載置異方導電層1 6的杯態·下 ，將軟：片基板2其表面側朝上壓著在電路基板3，則軟片 基板2的第1及第2焊接部8、9與電路基板3的第2及 第3穿孔1 1、1 2間伸由異方導電層1 6而被導通，因 而各X電極4的輸出係從第1穿孔7流至軟片基板2背面 的第2焊接點9，並可以從箆2焊榇點9涌渦雷路甚柅 3的第3穿孔部12而輸出至電路基板3背面的配線圖案 1 4。另外，每Y電極5的輸出係爲從第1焊接點8通過 電路基板3的第2穿孔部11而同樣的可以輸出至電路基 板3背面的配線圖案1 4。因此，將軟片基板2只載置在 電路基板3的上面可以施行兩面者間的導電連接，然且形 本紙張尺度適用辛國國家標準（〇«)入4規格（210父297公釐） (請先閲讀背面之注意事項再填寫本頁+) ,装- ,ιτ 9 0 8130 A7 B7 五、發明説明（7 ) (請先E讀背面之注意事項再填寫本頁) 辱爲不須施行軟片基板2與電路基板3的導電連接之可撓 式JB線基板或連接器，也不須從軟片基板2與電路基板3 的Ui方突出可撓式配線基板，所以可以同時縮減座標输入 裝置全體的厚度或外形大小。 〔發明之效果！r . 如以上所說明過，依據申請專利範圍第1項之座標輸 入裝置，，被設在軟片基板的表面側之第1電極群介由穿孔 部而被引導至軟片基板的背面側之第2焊接部，由於可以 從軟片基板的背面側同時取出被設在軟片基板的表•背兩 面的2個電極群，因而可以將軟片基板的構造簡略化，並 且提供薄型且小型化的座標輸入裝置。 另外，依據申請專利範圍第2項之座標輸入裝置，在 被配設在軟片基板的背面側之電路基板形被連接在軟片基 板的第1及第2焊接部之配線圓案”因而被軟片基板載置 在電路基板的簡單配裝作業下，可以使其將軟片基板的2 個電極群導通至電路基板。 經濟部中央標準局負工消費合作社印裝 進而，依據申請專利範圍第3項之座標輸入裝置，被 設在軟片基板的表面側之第1電極群係介由穿孔部而被引 導至軟片基板的背面，與被設在軟片的背面側之第2電極 群，同時介由壓著用連接構件而被連接至電路基扳的配線 圖案，因而不僅可以簡單且確實的連接軟片基板與電路基 板間，並且可以提供薄型且小型化的座標輸入裝置。 i 本紙張尺度適用中國國家標準（匚灿）八4規格（210父297公釐） 46 8130 A7 _B7_ 五、發明説明（8 ) 〔圖面之簡單說明〕 第1圖係爲本發明一實施例其座標輸入裝置的概略構 成之分解斜視圖。 第2圖係爲在該座標輸入裝置所具備的軟片基板之平 面圖。 第3圖係爲該軟片基板之底面圖。 第4圖係爲表示該軟片基板的穿孔部分之縱斷面圖。 第5圖係爲表示在第1圖的座標輸入裝置所具備的電 路基板之穿孔部分之縱斷面圖。 第6圖係爲表示該電路基板與軟片基板的連接狀態之 縱斷面圖。 〔圖號說明〕 1 :保護層 2 :軟片基板 < 3 :電路基板 4 : X電極（第1電極） 5 : Y電極（第2電極〉 經濟部中央橾隼局貝工消費合作杜印装 (請先聞讀背面之注意事項再填寫本頁) 6 :接地導體部 7 :第1穿孔， 8 :第1焊接點 9 :第2焊接酃 1 1 :第2穿孔 1 2 :第3穿孔， ， 本紙張尺度適用中國國家標準（CNS )_ A4規格（210X297公釐） 11 經濟部中央標準局員工消費合作社印裝 46 81 3Π ^4 6 81 3D A7 B7 Printed by the Central Bureau of Economic Standards, Consumer Electronics Co., Ltd. 5. Description of the invention (6) A third perforation 1 _2 facing the second welding point 9 is formed. A ground portion 13 formed of copper foil or the like is provided at the center of the circuit board 3, and the ground portion 13 prevents signals from below the circuit board 3 from flowing into the X and Y electrodes 4,5. A wiring pattern 14 made of copper foil or the like is formed on the rear surface of the circuit board 3 (the entire structure of the pattern is omitted), and circuit chips such as IC-driven circuits or control circuits are soldered to the wiring pattern 14. 15. At the same time, the second and third through holes 1 1 and 12 are connected to the soldering portion of the wiring pattern 14 at the same time. In addition, the first solder joint 8 and the second through hole 11 and the second solder joint point and the third through hole 12 are, for example, as shown in FIG. 6, with the difference between the flexible substrate 2 and the circuit board 3 interposed therebetween. The square conductive layer 16 is electrically connected. However, instead of the anisotropic conductive layer 16, a conductive adhesive or a conductive paste may be modified and bonded. The coordinate input device constructed as described above is placed in the cup state · 1 and 12 of the anisotropic conductive layer 16 on the .2 and 3 perforations 11 and 12 of the circuit board 3, and the soft: the sheet substrate 2 on the surface side Pressing upward on the circuit substrate 3, the first and second soldering portions 8 and 9 of the flexible substrate 2 and the second and third perforations 1 and 12 of the circuit substrate 3 extend between the anisotropic conductive layers 16 and Is turned on, so the output of each X electrode 4 flows from the first perforation 7 to the second welding point 9 on the back of the flexible substrate 2 and can flow from the 部 2 welding point 9 to the third perforation portion of the vortex mine road 3 12 and output to the wiring patterns 1 4 on the back of the circuit board 3. The output of each Y electrode 5 is the same as the wiring pattern 14 that can be output to the back of the circuit board 3 from the first solder joint 8 through the second through-hole portion 11 of the circuit board 3. Therefore, placing the flexible substrate 2 only on the circuit substrate 3 can perform a conductive connection between the two sides, and the paper size can be adapted to the national standard (〇 «) and 4 specifications (210 mm to 297 mm) ( Please read the precautions on the back before filling this page +), install-, ιτ 9 0 8130 A7 B7 V. Description of the invention (7) (Please read the precautions on the back before filling out this page) Disgrace does not require the use of films The flexible JB line substrate or connector for the conductive connection between the substrate 2 and the circuit substrate 3 does not need to protrude the flexible wiring substrate from the Ui side of the flexible substrate 2 and the circuit substrate 3, so the entire coordinate input device can be reduced. Thickness or size. [Effect of the invention! r. As explained above, according to the coordinate input device of the first patent application scope, the first electrode group provided on the front surface side of the flexible substrate is guided to the second rear side of the flexible substrate through the perforated portion. The soldering section can simultaneously take out two electrode groups provided on the front and back surfaces of the flexible substrate from the rear surface side of the flexible substrate, thereby simplifying the structure of the flexible substrate and providing a thin and compact coordinate input device. In addition, according to the coordinate input device of the second patent application scope, the circuit board arranged on the back side of the flexible substrate is connected to the first and second soldering portions of the flexible substrate. It can be placed on a circuit board to easily connect the two electrode groups of the flexible substrate to the circuit board. It is printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. In the coordinate input device, the first electrode group provided on the front surface side of the flexible substrate is guided to the back surface of the flexible substrate through the perforated portion, and the second electrode group provided on the rear side of the flexible substrate is pressed through the pressure at the same time. The wiring pattern is connected to the circuit board with a connection member, so it can not only simply and surely connect the flexible substrate and the circuit substrate, but also provide a thin and miniaturized coordinate input device. I This paper size applies to Chinese national standards (匚 Can) 8 4 specifications (210 father 297 mm) 46 8130 A7 _B7_ V. Description of the invention (8) [Simplified description of the drawing] The first picture is an example of the invention Example: An exploded perspective view showing the general structure of a coordinate input device. Figure 2 is a plan view of a flexible substrate provided in the coordinate input device. Figure 3 is a bottom view of the flexible substrate. Figure 4 is a view showing the A longitudinal cross-sectional view of a perforated portion of a flexible substrate. Fig. 5 is a longitudinal cross-sectional view of a perforated portion of a circuit substrate provided in the coordinate input device of Fig. 1. Fig. 6 is a circuit substrate and a soft piece. A longitudinal sectional view of the connection state of the substrate. [Illustration of the drawing number] 1: Protective layer 2: Flexible substrate < 3: Circuit board 4: X electrode (first electrode) 5: Y electrode (second electrode)> Center of the Ministry of Economy贝 贝 Shellfish consumer cooperation Du printed installation (please read the precautions on the back before filling out this page) 6: Ground conductor section 7: First perforation, 8: First welding point 9: Second welding 酃 1 1: 2nd perforation 1 2: 3rd perforation, This paper size applies the Chinese National Standard (CNS) _ A4 size (210X297 mm) 11 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 46 81 3Π ^
D I 五、發明説明（9 ) 13:電路片 1 6 :異方導體層（壓著用連接構件） (請先閱讀背面之注意事項再填寫本頁) 裝. 訂 本紙張尺度適用中國國家標準（CNS ) Α4規格（2Ι0Χ297公釐） 12DI V. Description of the invention (9) 13: Circuit chip 16: Anisotropic conductor layer (connecting member for pressing) (Please read the precautions on the back before filling out this page) CNS) Α4 specification (2Ι0 × 297 mm) 12