4 5 5 5 7 Ο Α74 5 5 5 7 Ο Α7
經濟.邱中央標準局員工消費合作社印製 〔發明領域〕 本發明係關於一種用於製造用來遮蔽電磁頻率的裝置 如繞線電感及製造包含晶片電感器及晶片磁珠（bead)在内 之晶片组件的軟鐵氧體材料。本發明亦關於一種藉由使用 該氧體材料來製造一射頻電感器的方法。更特定地，本發 明係闞於一種Ni-Cu-Zn之軟鐵氧體材料及一種使用該氧 體材科來製造繞線式或晶片式之電感器的方法，其中一低 溫燒結是可能的，該電磁特性的變化在對抗一外部應力時 是很低的，且該電磁特性很優越。 〔發明背景〕 最近，在電子及通訊裝置上有長足的進步促使小、薄 及易於安裝的電子元件的產生，藉以建構新的工業上的結 構。這產生了新的問題如環境污染及通訊疾病，這些在以 前是被忽略的。特別是，因為無線通訊裝置及多科技環境 的產生，電磁環境已經惡化。因此，世界各國實施了電磁 感應法規（FCC，CISPR，VDE，MIL)。 因此，一電磁波感應去除裝置（EMI/EMC)變成為必需 的。故而，電子元件的需求增加，且目前的技術趨努採取 了朝向多功能*高密度，及高效率的—個方向。 再者，該軟鐵氧體材料使用於製造電子元件如電磁波 感應去除装置及電源輸送裝置中的應用已依據特性，頻率 帶及此類者而被細微地分割了。 在該製造方法中，一種異於傳統的粉末冶金方法的方 2 I紙張尺度逋用中國國家標準（CNS ) Μ規格（210X297公f) ^^------^------绝’- (請先閲讀背面之注1!^#.項再填寫本頁) A7 B7 455570 五、發明説明（ 法被揭示，且層疊式的元件被蓬勃地研究且已被應用於實 際的使用中。此方法已被應用於小晶片元件如陶磁電子元 件技術領域中。 通常，被用於製造小晶片組件如晶片電感器，晶片磁 珠（beads)，晶片陣列，晶片LC濾波器及晶片列的該敕鐵 氧體材料需要一高的電感。該軟鐵氧體材料包括Mn_Zn氧 體’ Ni氧體，Ni-Zn氧體及Ni-Cu-Zn氧體。 該Mn-2n氧體具有一高的磁導性，並表現一低的電能 損失。因此，其被用作為電源供應輸送器，該電源線濾波 器及此類者的磁鐵心。然而，該Mn_Zn氧體表現一低的射 頻特性，及因而，其無法被應用於超過1 MHz的頻帶。目 前，可用於超過1 MHz頻帶的磁鐵心材料為Ni氡體，Economy. Printed by Qiu Central Bureau of Standards, Consumer Cooperative [Field of Invention] The present invention relates to a device for shielding electromagnetic frequencies such as wire wound inductors and manufacturing of chip inductors and chip beads. Soft ferrite material for wafer assemblies. The invention also relates to a method for manufacturing a radio frequency inductor by using the oxygen material. More specifically, the present invention relates to a soft ferrite material of Ni-Cu-Zn and a method for manufacturing a wound-type or wafer-type inductor using the oxygen material family, in which a low-temperature sintering is possible The change in the electromagnetic characteristics is very low when resisting an external stress, and the electromagnetic characteristics are superior. [Background of the Invention] Recently, great progress has been made in electronic and communication devices to promote the creation of small, thin, and easy-to-install electronic components, thereby constructing new industrial structures. This has created new problems such as environmental pollution and communication diseases, which were previously ignored. In particular, the electromagnetic environment has deteriorated due to the creation of wireless communication devices and multi-technology environments. Therefore, countries around the world have implemented electromagnetic induction regulations (FCC, CISPR, VDE, MIL). Therefore, an electromagnetic wave induction removing device (EMI / EMC) becomes necessary. Therefore, the demand for electronic components is increasing, and the current technology tends to take one direction towards multifunction * high density and high efficiency. Furthermore, the application of the soft ferrite material in the manufacture of electronic components such as electromagnetic wave induction removal devices and power transmission devices has been finely divided based on characteristics, frequency bands, and the like. In this manufacturing method, a square 2 I paper size different from the traditional powder metallurgy method uses the Chinese National Standard (CNS) M specification (210X297 male f) ^^ ------ ^ ------ ''-(Please read the note 1 on the back! ^ #. Before filling out this page) A7 B7 455570 V. Description of the invention (The method is disclosed, and the stacked components have been vigorously researched and have been applied to practical use This method has been applied to the technical field of small chip components such as ceramic magnetic electronic components. Generally, it is used to manufacture small chip components such as chip inductors, chip beads, chip arrays, chip LC filters, and chip arrays. The ferrite material requires a high inductance. The soft ferrite material includes Mn_Zn oxide, Ni-Zn oxide, Ni-Zn oxide, and Ni-Cu-Zn oxide. The Mn-2n oxide has a High magnetic permeability, and exhibits a low power loss. Therefore, it is used as a power supply conveyor, the power line filter and the magnetic core of these. However, the Mn_Zn ferrite exhibits a low RF characteristic , And as a result, it cannot be applied to frequency bands exceeding 1 MHz. Currently, it can be used for frequencies exceeding 1 MHz The magnetic core material of the frequency band is Ni 为,
Zn氧體及Ni-Cu-Zn氧體。 同時，該軟鐵氧體材料的傳統製造方法係以下列的方 式被實施的。亦即，一燒結程序是在的溫度 下被實施1-5個小時。然而，該等電子组件如晶片電感器 及晶片磁珠（bead)滅波器的内電極是由銀（Ag)所製造的。 上述的燒結溫度超過了銀（Ag)的溶點。因此，不僅是燒結 的溫度過高，被製造的組件在500ΚΗζ-20ΜΗζ之一般的頻 帶上亦表現很多的損失。因此，所需要的電感無法被達成。 因此，為了要降低軟鐵氧體材料的燒結溫度，通常該磁鐵 心材料的賴粒大小為〇_〇1-1 p m。因此該等顆粒的能陏可 達到接地狀態（亞穩狀態）’且介於顆粒之間之材料的移動 空間於燒結期間會增加用以提升該燒結，藉以實施一低溫 _______3 本紙張尺度適用中國國家標準（CNsTa4規格（210X2975^1 —-- (請先聞讀背面之注意事項再填寫本頁) -裝. -婵！ 經濟部t央標率局貝工消費合作社印製 455570 經濟部中央標準局員工消費合作社印製 A7 ____B7_五、發明説明（） 燒結。 然而，依賴該細微地壓碎顆粒之該製造方法須要相當 貴的設備及一相當複雜的程序，其結果為製造的成本上 升。再者，其在應用於實際的使用上會遭遇到困難。 另一個例子，有一種方法其中一種成份如B2O3被使用 (曰本專利申請案公開第昭64·4 5 7*7 1號）。 有另一種方法，其中燒結是藉由添加一助熔劑如ZnO 或V2〇5而被實施用以誘發該等粒子的一表面擴散（日本專 利申請案公開第昭60-210572號）。 然而，在低熔點化合物被添加的方法中，用來改善頻 率特性之該Co化合物的行為被阻礙，因而降低燒結的效 果。再者，在此方法中，該等添加物在低於該軟鐵氧體材 料的燒結處理溫度是以液態存在。因此，該等添加物被散 佈於晶粒邊界上用以提升燒結。因此，因為該等添加物的 分凝的關係會造成電感降低及損失。再者，它們會與銀作 成的内部電極相作用，或它們會被分佈於銀電極上。因此， 該晶片的電感器的磁特性（電感，Q係數）被減損，其結果 為產品的可靠度被降低。 〔發明概要〕 本發明是要解決上述有關傳統技術的缺點。 因此，本發明的一個目的為提供一種Ni-Cu-Zn的軟鐵 氧體材料其中有兩種複合玻璃粉末被添加，該二複合材料 即使與該基體的主要成份反應後亦表現出該電磁特性最 ----------^------1T (諳先閱讀背面之注意事項再填寫本頁) 表紙張尺度適用中國國家標準（CNS ) A4規格（2丨0X297公釐 4555 7 0 經濟部中央標準局員工消費合作杜印製 Α7 Β7 五、發明説明（） 小的減損，並顯示沒有與内部的銀電極相互反應，使得該 内部銀電極的穩定性在低燒結溫度下可被確保，及在 500ΚΗζ-20ΜΗζ的頻率下優越的特性可被確保。 本發明的另一個目的為提供一種藉由使用該Ni-Cu-Zn 軟鐵氧體材料及藉由實施一低溫燒結來製造一線圈電感 器或一晶片電感器的方法。 為了達到上述的目地，依據本發明之用來製造電感器 的該Ni-Cu-Zn軟鐵氧體材料包括一由以莫耳％來計算之 49.0-50.0。/。的？〇2〇3，5-13%的（：11〇，7.5-25%的1^〇，及 12-3 8.5的Zn〇所組成的原材料及該軟鐵氧體材料進一步 包括以重量％計算之0‘05-15%的82〇3-6丨2〇3-211〇玻璃。 在本發明的另一態樣中，依據本發明之該Ni_Cu_Zn軟 鐵氧禮包括一由以莫耳％來計算之49.0-50.01%的Fe203， 5-13%的（：11〇，7.5-25<)/。的1^0，及12-38.5的211〇所組成 的原材料及該軟鐵氧體材料進一步包括以重量％計算之由 一群包含了2.0%或更少的（：〇〇，2.0%或更少的（：〇2〇3， 及2.0%或更少之c〇3〇4 :的組群中所選取的一個或更多個 化合物；及 〇.〇5-15%的 B203-Bi203-Zn0 玻璃。 在本發明的另一態樣中，依據本發明之該製造一線圏 電感器的方法，其至少包括的步驟為： 添加0,05-15%的B203-Bi203-Zn0玻璃至一原材料 中’該原材料係由以莫耳％來計算之49.0-50.0%的Fe203， 5-13%的（：11〇，7.5-25%的1^0，及12-3 8,5的211〇所組成 的，將它們壓碎並乾燥以形成一乾燥的粉末； 5 不...氏張尺度通用中國@家操準（.CNS ) A4规格（21〇><297公嫠〉 ----------裝-- (請先閱讀背面之注意事項再填寫本頁) 、1Τ 4555 7 0 A7B7 五、發明説明（ 將該乾燥的粉末與一 5-15重量％的黏合劑相混合’該 黏合劑添加有5-10重量％的主劑及5116重量％的反應抑制 劑，並用該混合物來製成粗粒子；及 藉由使用該等粗粒子來實施—成形，及在86〇 91〇。匸 的溫度下實施燒結。 在仍為本發明的另一實施例中，依據本發明之該製造 一線圏電感器的方法，其包括的步驟為： 添加0.05-15%的B203-Bi203-Zn0破璃至一原材料 中，該原材料係由以莫耳％來計算之49.0-50.0。/。的？62〇3, 5-13%的（：11〇，7.5-25%的犯〇，及12-38.5的211〇所組成 的，將它們壓碎並乾燥以形成一乾燥的粉末； 將該乾燥的粉末混以由一群以重量。/。計算之包含了 2.0°/。或更少的CoO，2.0%或更少的c〇203，及2.0%或更 少之C〇3〇4的組群中所選取的一個或更多個化合物，並锻 燒該混合物； 將該經過鍛燒的粉末與一 5-15重量％的黏合劑相混 合，該黏合劑添加有5 -1 0重量％的主劑及5 -1 6重量°/。的反 應抑制劑，並用該混合物來製成粗粒子；及 經濟部中央標準局—工消费合作社印掣 (請先閱讀背面之注意事項再填寫本筲) 藉由使用該等粗粒子來實施一成形，及在860-910 1 的溫度下實施燒結。 在仍為本發明的另一實施例中，依據本發明之該製造 一晶片電感器的方法，其包括的步驟為： 添加0.05-15%的B203_Bi2〇3-ZnO玻璃至一原材料 中，該原材料係由以莫耳％來計算之49.0-50.0%的Fe203， 6 本紙張尺度適用中國國家標準（CNS > Μ规格（210X297公釐） 455570 A7 B7 經濟部中央標準局員工消費合作社印掣 五、發明説明（ 5-13%的（：11〇，7.5-25%的1^〇，及12-38.5的211〇所组成 的’將它們壓碎並乾燥以形成一乾燥的輪末； 以1:1-1:4的比例添加一黏合劑於該乾燥的粉末中，及 藉由施用一醤師刀片處理（doctor blade process)來要鏵多 片綠板（green sheet); 將多片該等綠板層疊起來，將一内Ag電極印於該等層 疊的板子上，再層疊多片該等綠板，並在860-910。〇的溫 度下燒結該結構；及 在該燒結的本體上形成一外電極。 在仍為本發明的另一實施例中，依據本發明之該製造 一晶片電感器的方法，其包括的步騾為： 將一由以莫耳％來計算之49.0-50.0%的Fe203，5-13% 的CuO，7.5-25%的NiO，及12-38,5的ZnO所組成的原 材料混以由一群以重量％計算之包含了 2,0%或更少的 CoO，2.0%或更少的c〇203，及2.0%或更少之Co3〇4的組 群中所選取的一個或更多個化合物；及0.05-15.0%的 Β2〇3·Βί2〇3-ΖηΟ玻璃，並將該混合物乾燥； 以1:1-1:4的比例添加一黏合劑於該乾燥的粉末中，及 藉由施用一醫師刀片處理（doctor blade process)來鋒造多 片綠板（green sheet): 將多片該等綠板層疊起來，將一内Ag電柽印於該等層 疊的板予上，再層疊多片該等綠板，並在88ο_91〇Τ的溫 度下燒結該結構：及 在該燒結的本體上形成一外電極。 (請先閱讀背面之注意事項再填寫本頁) -裝' 、πZn oxide and Ni-Cu-Zn oxide. Meanwhile, the conventional manufacturing method of the soft ferrite material is implemented in the following manner. That is, a sintering procedure is performed at a temperature of 1-5 hours. However, the internal electrodes of these electronic components, such as chip inductors and chip bead suppressors, are made of silver (Ag). The sintering temperature described above exceeds the melting point of silver (Ag). Therefore, not only the sintering temperature is too high, the manufactured components also show a lot of losses in the general frequency band of 500KΗζ-20MΗζ. Therefore, the required inductance cannot be achieved. Therefore, in order to reduce the sintering temperature of the soft ferrite material, the size of the lye particles of the magnetic core material is usually 0 to 0 to 1 p m. Therefore, the energy of these particles can reach the grounded state (metastable state) 'and the moving space of the material between the particles will increase during sintering to promote the sintering, so as to implement a low temperature _______3 This paper scale is applicable to China National Standard (CNsTa4 Specification (210X2975 ^ 1 --- (Please read the precautions on the back before filling out this page)-Install.-婵! Printed by the Central Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperative, 455570 Central Standard of the Ministry of Economic Affairs A7 printed by the Bureau ’s Consumer Cooperatives ____B7_ V. Description of the invention () Sintering. However, the manufacturing method that relies on the finely crushed particles requires quite expensive equipment and a fairly complicated procedure, and as a result, the manufacturing cost increases. Moreover, it may encounter difficulties in practical use. As another example, there is a method in which a component such as B2O3 is used (Japanese Patent Application Publication No. Sho 64 · 4 5 7 * 7 1). There is another method in which sintering is performed by adding a flux such as ZnO or V205 to induce a surface diffusion of the particles (Japanese Patent Application Laid-Open No. 60-2105 No. 72). However, in the method in which a low melting point compound is added, the behavior of the Co compound used to improve the frequency characteristics is hindered, thereby reducing the effect of sintering. Furthermore, in this method, the additives are at a low level. The sintering processing temperature of the soft ferrite material exists in a liquid state. Therefore, the additives are dispersed on the grain boundary to improve sintering. Therefore, the inductance of the additives reduces the inductance In addition, they may interact with the internal electrodes made of silver, or they may be distributed on the silver electrodes. Therefore, the magnetic characteristics (inductance, Q factor) of the inductor of the chip are reduced, and the result is a product The reliability is reduced. [Summary of the Invention] The present invention is to solve the above-mentioned shortcomings related to the conventional technology. Therefore, an object of the present invention is to provide a soft ferrite material of Ni-Cu-Zn, which has two kinds of composite glass powders. After being added, the two composite materials exhibit the most electromagnetic properties even after reacting with the main components of the matrix ------------ ^ ------ 1T (谙 Read the precautions on the back before fill (Write this page) The paper size of the table is applicable to the Chinese National Standard (CNS) A4 specifications (2 丨 0X297 mm 4555 7 0 Employee consumption cooperation of the Central Standards Bureau of the Ministry of Economic Affairs Du printed Α7 Β7 5. Description of the invention () Small impairment and display There is no mutual reaction with the internal silver electrode, so that the stability of the internal silver electrode can be ensured at a low sintering temperature, and superior characteristics can be ensured at a frequency of 500KΗζ-20MΗζ. Another object of the present invention is to provide a A method of manufacturing a coil inductor or a chip inductor by using the Ni-Cu-Zn soft ferrite material and by performing a low-temperature sintering. In order to achieve the above-mentioned object, an inductor is manufactured according to the present invention. The Ni-Cu-Zn soft ferrite material includes a 49.0-50.0 calculated in mole%. /. of? 〇2〇3, 5-13% (: 11〇, 7.5-25% of 1 ^ 〇, and 12-3 8.5 Zn〇 raw materials and the soft ferrite material further includes weight percent 0′05-15% of 82〇3-6 丨 2〇3-211〇 glass. In another aspect of the present invention, the Ni_Cu_Zn soft ferrite according to the present invention includes a calculation based on mole%. The raw materials consisting of 49.0-50.01% Fe203, 5-13% (: 11〇, 7.5-25 <) /, and 12-38.5 of 21〇 and the soft ferrite material further include Calculated by weight% from a group containing 2.0% or less (: 〇〇, 2.0% or less (: 〇 02〇3, and 2.0% or less of co304): One or more selected compounds; and B203-Bi203-Zn0 glass of 0.05 to 15%. In another aspect of the present invention, according to the method for manufacturing a one-line chirped inductor according to the present invention, At least the steps include: adding 0,05-15% of B203-Bi203-Zn0 glass to a raw material 'The raw material is 49.0-50.0% Fe203 calculated in mole%, 5-13% (: 11〇, 7.5-25% of 1 ^ 0, and 12-3 8,5 of 211 Composition, they are crushed and dried to form a dry powder; 5 ... the Zhang scale is general China @ 家 操 准 (.CNS) A4 specification (21〇 > < 297 公 嫠〉 --- ------- Packing-(Please read the precautions on the back before filling this page), 1T 4555 7 0 A7B7 V. Description of the invention (Put the dry powder with a 5-15 wt% binder 'The binder is added with 5-10% by weight of the main agent and 5116% by weight of the reaction inhibitor, and the mixture is used to make coarse particles; and by using these coarse particles to perform-forming, and at 86. The sintering is performed at a temperature of 91 ° C. In still another embodiment of the present invention, the method for manufacturing a one-line 圏 inductor according to the present invention includes the steps of: adding 0.05-15% of B203-Bi203 -Zn0 breaks glass into a raw material, which is calculated from 49.0-50.0% in mole%? 62〇3, 5-13% (: 11〇, 7.5-25% of the crime, And 12-38.5 of 2110, they are crushed and dried to form a dry powder; the dried powder is mixed by a group by weight. It contains one or more compounds selected from the group consisting of 2.0 ° /% CoO, 2.0% or less co203, and 2.0% or less Co03. Calcining the mixture; mixing the calcined powder with a 5-15 wt% binder, the binder is added with 5-10% by weight of the main agent and 5-1 6% by weight. Reaction inhibitor, and use the mixture to make coarse particles; and the Central Bureau of Standards of the Ministry of Economic Affairs-Industrial and Consumer Cooperatives (Please read the precautions on the back before filling in this 筲) to implement a forming by using these coarse particles , And sintering at a temperature of 860-910 1. In still another embodiment of the present invention, the method for manufacturing a chip inductor according to the present invention includes the steps of: adding 0.05-15% of B203_Bi2O3-ZnO glass to a raw material, the raw material It is based on 49.0-50.0% Fe203 in mol%. 6 This paper size applies to Chinese National Standards (CNS > M specifications (210X297 mm) 455570 A7 B7. Employee Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. Description of the invention (5-13% (: 11〇, 7.5-25% of 1 ^ 〇, and 12-38.5 of 21〇 'composed them crushed and dried to form a dry wheel; with 1: Add a binder to the dry powder in a ratio of 1-1: 4, and apply a doctor blade process to apply a plurality of green sheets; The plates are stacked, an inner Ag electrode is printed on the laminated plates, and then a plurality of the green plates are laminated, and the structure is sintered at a temperature of 860-910 °; and a sintered body is formed on the sintered body. External electrode. In still another embodiment of the present invention, the fabrication according to the present invention The chip inductor method includes the following steps: Calculate 49.0-50.0% of Fe203, 5-13% of CuO, 7.5-25% of NiO, and 12-38,5 in moles. The raw material consisting of ZnO is mixed with a group consisting of 2.0% or less CoO, 2.0% or less co203, and 2.0% or less Co304, calculated by weight%. One or more compounds selected from the above; and 0.05-15.0% of a glass of B2 03 · Βί20-Zη〇, and drying the mixture; adding a binder to the ratio of 1: 1-1: 4 In the dry powder, and through the application of a doctor blade process, multiple green sheets are made: a plurality of these green sheets are stacked, and an internal Ag is imprinted on the sheets. Laminate the board on top of each other, and then laminate multiple green boards, and sinter the structure at a temperature of 88 ° -91 ° T: and form an external electrode on the sintered body. (Please read the precautions on the back before filling in this Page)-installed ', π
4555 7 0 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（） 〔較佳實施例詳細説明〕 通常，軟鐵氡體材料在特性對隨著結構及成分而異的 頻帶上是不同的。本發明提供一種Ni_Cu_Zn軟鐵磁性氧體 其中在適於500ΚΗΖ-20ΜΗζ的頻帶中Zn0的成分很高及 NiO的成分很低。其基本的成分最好是由以莫耳％來計算 之49.0-50.0%的？62〇3，5-13%的（：11〇，7.5-25〇/〇的>^〇， 及12-38.5的ZnO所組成的_原材料。更佳地，該成分進 一步包含了從一由2.0%的CoO ’ Co2〇3，及Co304所構成 的組群中所選取的一化合物。 再者，於本發明中，一 Bi2〇3-ZnO玻璃以0.05-15.0重 量°/〇的量被添加於上述的混合物中。 添加上述的玻璃帶來了優點使得即使在與該軟鐵磁性 基體反應之後該電磁特性的衰減亦可被最小化。特別是， 在一晶片電感器的例子中，沒有與由Ag製成的内電極發 生的反應，且燒結的溫度被降低，這些是進—步的優點D 如果玻璃是以0.05-15.0重量％的量被添加的話，該基 體的燒結溫度可從傳統的1〇〇〇-135〇。<：(其為傳統上被使 用之低您點化合物（Bi2〇3或V2〇5))被降至860-910 °c的溫 度。再者，在此例子中，在該基體及該電極在燒結之後的 收縮期間所發生的應力可被降低，使得該内電極能更穩 定。在此處，該玻璃最好應包括1 0-40重量％的b2〇3，20-40 重量％的Bi2〇3及20-70重量％的ZnO。 特別是，在線圈電感器係使用本發明的軟鐵氧體材料 來製造的情形中，在該基體中的玻璃的行為提升了該基體 8 ---------—裝— (請先閲讀背面之注意事項再填寫本頁) 訂- 本紙張尺度適用中國國家標準（CNS > A4規格（210X297公釐） 4 5 5 5 7 0 A7 B7 經濟部中央標隼局員工消費合作社印聚 五、發明説明（） 的密度。因此，機械強度可獲得改善，及因為高表面緻密 度之故，在電鍍期間的外物附著會被抑制，藉以增進製造 降服強度。 使用於本發明中之玻璃以重量％來計算最好是包含 10-40% 的 B2〇3，20-40% 的 Bi203 及 20-70% 的 ZnO。 同時，在藉由使用本發明的敕鐵氧體材料來製造電感 器的例子中，所添加的玻璃的顆粒大小最好是0.1-10 # m。更特定地，為了要防止因為該基體的離散分佈而發生 的大晶粒增長，該玻璃的顆粒大小應為0.2-5 a m。 現在，藉由使用本發明之包含了該玻璃的乾燥粉末來 製造一線圈電感器的方法將被説明。 在線圈電感器的例子中，在包含該玻璃的粉末被乾燥 之後，立即地一 5-15重量％的黏合劑被加入，該黏合劑包 含有5-丨0重量％的主成分及5-16重量％的反應抑制刻，然 後形成粗粒子。該主成分可以是一般在製造一燒結砂心時 被使用之任何材料。例如，聚乙烯醇（PVA)或甲基纖維素 可被使用。同時，該反應抑制劑扮演了防止軟鐵磁性粒子 的附聚的角色，且此材料可為甘露醉或丙二醇（PEG)。 該經乾燥的粉末可如在一般的例子中一般地被鍛燒， 且鍛燒的溫度最好應為650-88 0 °C。更佳地，該鍛燒溫度 應為 700-850 °C。 然後該經鍛燒的粉末被作成粗粒子，且一成形被實 施，藉以產生一所想要的製造本體。該製造本體在860-910 °C的溫度被燒結，該溫度係低於一般低熔點化合物被燒結 ___ 9 本紙張尺度適用中國國家標隼（CMS ) A4規210X297公釐） ' {請先閲讀背面之注意事項再填寫本頁) 4 5 55 7 0 A7 B7 五、發明説明（） 的溫度。在燒結期間，750-900 °C的溫度區間為晶粒被對 齊且形成敏密。因此，如果温度被快速地提升的話，會形 成空穴，其結果為磁導率被降低，及該品質係數被減損。 因此，最好是應避免溫度的快速上升。例如，在上述的溫 度區間内，溫度的上升，最好應被控制在10 °C/分鐘的速 率之下。 再者，在達到該燒結溫度之後，該燒結溫度最好被維 持2-3小時。然後，在下至700 °C的區間期間，—突然的 冷卻應被避免。如果在此區間受到突然的冷卻的話，該CuO 從該基艘中被沉殿出來，而其結果為其電磁特性受到減 損。因此，應特別的小心，且在此冷卻期間，冷卻速率最 好是在5 °C /分鐘或更小。 在本發明中，其微結構非常地穩定，且可獲得下列的 特性。亦即，品質係數為150或更高，高峰區為ιοοκΗζ-20MHz ’且電感為10" Η或更大。因此，具有較優越的 電磁特性的一軟鐵氧體材料可在一與傳統的技術比較起 來為低溫的溫度下被獲得。 經濟部中央標準局員工消費合作社印製 現在’藉由使用添加有上述的玻璃之經乾燥的粉末來 製造一晶片電感器的方法將被説明。 一種以一有機高分子形式的黏合劑如PVB，甲基織維 素（MC)，油酸’丙二醇，曱苯或甘露醇以ι:1·1:4的比例 被添加於該經乾燥的粉末中。然後綠板藉由實施酱師刀片 處理（doctor blade process)而被壓鑄，接著多片綠板被層 晏起來。然後一内Ag電極被印上去，接下來多片綠板 455570 A7 !--___ 87 五、發明説明（） ~ ^-- 被層疊上去。然後此結構在880_91(KC溫度下被燒結。此 880-910 °C的燒結溫度係低於傳統的燒結溫度。然後—外 電極被形成於該被燒結的本體上，藉以獲得一依據本發明 的晶片電感器。 現在本發明將依據實際的例子來作説明。 <例1> 原材料被調整成表1的組成。這些原材料被置入—聚 氨醋罐中，然後在以該原材科的量1_3倍的比例添加蒸館 水之後藉由使用YTZ-球（Y2〇3_氧化錯球）將之壓碎及混 合，直到平均粒子大小變成1-15 # m為止。在混合完成 之後，在700-850 °C的溫度下實施鍛燒2-3小時，然後於 該罐子中實施再壓碎。於再壓碎期間，—1〇B⑷r 65Βί2〇3·25ΖηΟ玻璃粉末被加入該被鎳燒的粉末中，及該 再壓碎被實施24-48小時。當粒子大小變成〇 1-15 # m 時，藉由使用一乾燥機實施一乾燥，直到該原材料的满氣 變成每重量單位0.2-0·7%為止。 經濟部中央標準局貝工消費合作社印製 ^-------tr (請先閱讀背面之注意事項再填寫本頁) 該經乾燥的粉末被篩選成60-80篩孔大小之均句的粒 子，然後5-15重量％的一黏合劑被添加，其中5_1〇重量％ 的聚乙烯醇及5-16%的甘露醇被溶解。然後該粉末使用一 50篩孔的篩子來篩選成一均勻的粒子大小，並被製成一具 有25mm的外徑，1 8mm的内徑及4.5mm高的一複曲面的 (toroidal)砂心。在燒結期間，溫度以2 °C /分鐘的速率上升 至420 °C *且此溫度被維持4個小時，藉以實施解黏合 (debindering) ° 11 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ ' 455570 A7 _____ B7 五、發明説明（） -- 然後溫度以3 °C /分鐘的速率上升至75〇 t，再以^ π / 分鐘的速率上升至900 °C。溫度在9〇(rc被維持2 3小時， 然後實施冷卻。在實施冷卻時，其是以3。〇/分鐘的速率降 至700。(：，接下來以1〇 °C/分鐘的速率進一步降至室温。 然後在該經燒結的結構上繞上直徑〇 55mm的包漆銅 線20圏。然後電感及品質係數（q係數）在1〇KHz 4〇MHz 的頻帶下用HP4291A網路分析儀來加以測量。其結果則示 於表1中。 在下面的表1中，對於傳統的例子而言’鍛燒是在約 950 °C的溫度下被實施的。 (請先聞讀背面之注$項再填寫本頁) -裝. 訂 經濟部中央標準局員工消費合作社印製 2 本紙張尺度適用中國國家標準（.CNS ) A4規格（210X297公釐） 455570 A7 B7 五、發明説明（） 經濟.部中央標率局員工消費合作社印製 例子 化學成份 ! 主成份(莫耳％) 添加物(重量％) 電感 _ Q峰値 Fe：〇3 NiO 1 ZnO j CuO CoO C〇2〇3 C〇3〇4 Glass Bi;:〇3j V2O5 發明例1 49.5 10.1 31.35 8.85 - 0.4 - 1.5 - - 19.0 155 發明例2 49.5 10.1 31.35 3.35 0.5 - 2.0 - - 21.6 138 發明例3 49.75 14,47 30.75 5.03 - 0.5 - 2.0 - - 15.0 158 發明例4 49,75 11.51 32.71 6.03 - 0.5 - 2.0 - 15.8 163 發明例5 •- 49.5 10.0 30.5 10.0 0.5 - 1.0 - - 18,0 171 發明例6 49.5 7.5 30.5 12.5 — 0.1 - 0.5 - 24.2 152 發明例7 49.5 17.5 23.0 10.0 - 0,5 - 2.0 - 15.0 240 發明例8 49.5 15‘15 25.25 10.1 0.5 - 2.0 - 22.9 225 發明例9 49.5 15‘15 25.25 10.0 0.5 - 1.5 誉 - 20.9 232 對照例1 49*75 15.15 34,22 4.02 - 0.5 - 2.0 - - 18.0 78 對照例2 49 5 j 15.15 25.25 ίο.i 0.3 0.2 - - 0,75 - 12.4 142 對照例3 49.5 15.15 25.25 10.1 0.5 - 0.5 - 13.5 149 對照例4 49.5 15.15 25.25 10.1 - 0.5 - - 0.65 24.2 132 對照例5 49.5 15.15 25,25 10.1 0.3 - 0.2 - 0.65 - 12,0 141 對照例6 49.5 15.15 25.25 iio.l ! - 0.3 0.2 * i.o - 19.0 145 傳統例 | f f 49.5ll5,15125.25110,1 ! . - - - - - 48.5 92 (請先閲讀背面之注意事項再填寫本頁) .裝- -1° 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 13 455570 A7 _B7 五、發明説明（） 如上面表1中所示的，在發明例1-9的情形中，本發 明的條件被滿足，被證實的是，低溫燒結是可能的。再者， 電感値更大於1.5# Η，且品質係數Q約為]5〇。因此它 們顯示出優越的電磁特性。亦即，本發明之該材料的此等 特性使其能夠在一低很多的溫度，約被降低50- 1 〇〇。(：，不 實施燒結。再者，燒結後之損失低很多。 同時，在對照例2-6的情形中，該玻璃並没有被添加， 而是Bi2〇3或V2〇5添加刑被添加。因此，燒結並沒有被充 分地實施，因此其顯示一低的品質係數及一低電感。其原 因為，晶粒邊界的擴散無法只因為Bi2〇3或V2O5成份即發 生。在組成物基本上悖離本發明之組成物之對照例1的情 形中，因為低溫燒結之故其品質係數太低，因此電磁特性 被減損。 <例2> 經濟部中央標準局負工消費合作杜印繁 ^------17 (請先閲讀背面之注意事項再填寫本頁) 為了要看看電磁特性對玻璃的種類，具有不同的物理 特性的玻璃如表2中所示地被加入具有與例1相同成份的 原材料中。然後，個別的材料被製成複曲面的本體並被燒 结。然後電磁特性被測量，及其結果被顯示於下面的表3 中。在測量之前，一具有0.55mm直徑的包漆銅線被纏繞 在該複面本體上20圈，然後該測量使用HP4194A電感分 析儀來實施。 14 本紙張尺度適用中國國家標準（CNS ) A4規格（2! 0 X 297公釐> 4 5 5 5 7 Ο Α7 五、發明説明（） <表2> 成份(重量％) 熱膨脹 (ίο—7/r) 密度 (g/cc) 顆粒 大小 (u#) 軟化點 tt) 熔化 溫度 m B2〇3 ΒΪ2〇3 ΖηΟ Si〇2 Na 發明材料a 10 65 25 - - 75.3 5.60 1Λ8 522 900 發明材料b 15 65 20 - - 69.0 5.01 7.10 452 900 發明材料c 10 55 35 - - 71.0 4.90 5.30 464 900 發明材料d 10 60 30 - - 78.6 5.95 1.30 502 870 發明材料e 20 60 20 - - 88.0 2.62 4.52 505 825 對照材料A 20 - 80 - 23.0 2.14 3.70 485 1300 對照材料B 15 - 60 25 84.0 3.06 5.20 486 700 對照材料c 20 - 50 30 64,5 2,70 4.30 491 767 ---^--------^-- (請先閲讀背面之注意事項再填寫本頁) 經濟部t夹標隼局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29?公釐） 4 5 5 5 7 Ο Α7 Β7 五、發明説明（） 經濟部中央標隼局員工消費合作社印製 <表3> I 1 1 例子 波璃 化學成份 電感 UH) Q 主成份(莫耳％) 添加物(重量％) Fes〇3 NiO ZnO CuO C〇2〇3 C〇3〇4 Glass Qp Qf(KHz) i 發明例8 a 49.5 15,15 25.25 10,1 0.5 2.0 22.9 225 400 發明例10 a 49.5 15.15 25.25 10.1 - 0.5 2.0 18.7 214 420 發明例11 b 49.5 15.15 25.25 10.1 0.5 - 2.0 22,9 215 380 發明例12 c 49.5 15.15 25.25 10Λ 0.5 - 2.0 16,5 195 450 發明例13 d 49.5 15.15 25.25 10.1 0.5 - 2.0 22.5 252 380 發明例14 d 49.5 15.15 25.25 10· 1 0.5 2.0 20.9 222 420 發明例15 e 49.5 15.15 25.25 10.1 0.5 - 2.0 17.6 179 450 對照例7 A 49.5 15.15 25.25 10.1 0.5 - 2.0 12.1 162 1210 1 對照例8丨B ί 49.5 15.15 25.25 ίο.i 0.5 2.0 15.8 143 880 i 對照例9 C 49.5 15‘15 25.25 10.1 0.5 - 2.0 13.3 152 900 (請先閲讀背面之注意事項再填寫本頁) 16 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 455570 A7 B7 經濟部中央標準局負工消費合作社印製 五、發明説明（） 參照表2及表3，可被看出的是，被製造的軟鐵氧體 材料的電磁特性隨著該玻璃的成份的不同而變化很大，其 造成變形溫度點及該玻璃的的熱膨脹會有所不同。亦即， 在發明材料a-d被使用及玻璃是由1〇*400/。的B2〇3，20-70¾的BhO3及20-40%的ZnO所組成以符合本發明的條件 之發明例8及10-15的情形中，被看到的是電感値為15 p Η或更高，該品質係數為150或更高，及該品質係數高峰 頻帶（Q峰値頻帶）為100ΚΗζ-20ΜΗζ或更高。 另一方面，在B2〇3_Si02玻璃（對照材料A-C)被使用的 對照例7-9的情形中，不是電感値太低就是品質係數太 小，因而惡化了該等電磁特性。 <例3> 具有表1的成分之材料藉由使用例1的方法而被作成 粉末。然後_ PVB-甘露醇黏合劑以1:1 -1:4的比例被添 加。然後該混合物用2 00-3 2 5篩孔的篩子來將其分類成均 勻的粒子。然後，具有厚度為10 — 200 # m的綠板藉由實施 醫師刀片處理而被壓鑄。 多片該被壓鑄的綠板被層疊，一 Ag内電極被印於該等 層疊的板子上，然後多片的綠板再被層疊。然後在880-910 °C的溫度下被實施燒結1 -3小時。然後一外電極被形成於 該燒結體上，藉以完成一晶片電感器。對於多個以此方式 製成的晶片電感器而言，電磁特性是用HP4192A網路分析 儀來測量的，且其結果被顯示於下面的表4中。 _ 17 本紙張尺度適用中國國家操準（CNS > A4規格（210ΧΪ97公廣） I 1訂 n II ^ 丨 - - (請先閱讀背面之注意事項再填寫本頁) 455570 A7 B7 五、發明説明（） <表4> 例子 化學成份 電感 ("H) Q峰値 主成份(莫耳％) 添加物(重量％) Fe2〇3 ΝίΟ ΖηΟ CuO C〇0 C〇3〇3 C〇3〇4 Glass ΒΪ2〇3 V2O5 發明例Ιό 49.5 10,1 31.35 8.85 - 0A - 1‘5 - - 210 45 發明例Π 49.5 10.1 31.35 8.85 — 0.5 - 2.0 - - 240 59 發明例18 49.75 14.47 30.75 5.03 - 0.5 2.0 - - 140 42 發明例19 49,75 11.51 32.71 6.03 0.5 - 2.0 - - 155 53 發明例20 49.5 10.0 30.5 10.0 - 0.5 - 1.0 - 210 61 發明例21 49,5 7.5 30.5 12.5 - 0.1 0,5 - - 340 39 發明例22 49,5 17.5 23.0 10.0 - 0.5 - 2.0 - 164 65 (請先聞讀背面之注意事項再填寫本頁) -裝. 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家搮準（ CNS ) A4規格（210X297公釐） 45 55 7 0 A7 B7 五、發明説明（） 如上面表4中所示，在滿足本發明的條件之發明例 16-22的情形中低溫燒結是可能的。再者，在燒結之 後的該軟鐵氧體材料的電感値係大於14〇nH，及品質係數 Q為34或更问。因此被證實的是，它們都具有優越的電磁 特性。亦即，本發明之晶片電感器與沒有添加玻璃及c〇 添加劑的傳統晶片電感器比較起來具有多項的優點。亦 即’在本發明中’燒結的溫度被降低了 5 〇 _〗〇 〇。匸，及燒結 後的損失非常地低。 依據如上所述的本發明，燒結即使在一低溫下亦可被 充分地實施’使得一具有較佳的電磁特性的軟鐵氧體材料 可被獲得。再者，在製造此材料時，現有的設備可依其既 有的原態來加以應用。因此，並不需要投資昂貴的設備， 且管理這些設備的困難可被避免。因此，用於晶片電感器 之軟鐵氧體材料可以一低廉的成本來製造。 (請先閲讀背面之注意事項再填寫本頁) 裝. 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X29?公嫠）4555 7 0 A7 B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention () [Detailed description of the preferred embodiment] Generally, the soft iron carcass material is in a frequency band whose characteristics vary with structure and composition. different. The present invention provides a Ni_Cu_Zn soft ferrite ferrite in which the composition of Zn0 is high and the composition of NiO is low in a frequency band suitable for 500K500Z-20MΗζ. Its basic composition is preferably 49.0-50.0% calculated in mole%? 62〇3, 5-13% of (: 11 〇, 7.5-25 〇 / gt; ^ 〇, and 12-38.5 ZnO _ raw materials. More preferably, this component further contains A compound selected from the group consisting of 2.0% CoO 'Co203 and Co304. Furthermore, in the present invention, a Bi203-ZnO glass is added in an amount of 0.05-15.0 weight ° / 〇. In the above-mentioned mixture. The addition of the above-mentioned glass brings advantages such that the attenuation of the electromagnetic characteristics can be minimized even after reacting with the soft ferromagnetic substrate. In particular, in the case of a chip inductor, there is no The reaction of the internal electrode made of Ag, and the sintering temperature is reduced, these are further advantages. D If the glass is added in an amount of 0.05-15.0% by weight, the sintering temperature of the substrate can be changed from the traditional 100-135. ≪: (which is a traditionally used low-point compound (Bi203 or V205)) is reduced to a temperature of 860-910 ° C. Furthermore, in this example In the process, the stress occurring during the shrinkage of the substrate and the electrode after sintering can be reduced, so that the internal electricity It can be more stable. Here, the glass should preferably include 10-40 wt% b203, 20-40 wt% Bi203, and 20-70 wt% ZnO. Especially, in the coil inductor In the case where the soft ferrite material of the present invention is used for manufacturing, the behavior of the glass in the substrate enhances the substrate 8 ----------equipment-(Please read the precautions on the back before Fill out this page) Order-This paper size applies to Chinese national standards (CNS > A4 size (210X297 mm) 4 5 5 5 7 0 A7 B7 Printed by the Consumers' Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs Density. Therefore, the mechanical strength can be improved, and due to the high surface density, the adhesion of foreign objects during plating can be suppressed to improve the manufacturing yield strength. The glass used in the present invention is best calculated by weight% It is 10-40% of B203, 20-40% of Bi203, and 20-70% of ZnO. Meanwhile, in the example of manufacturing an inductor by using the samarium ferrite material of the present invention, the added The particle size of glass is preferably 0.1-10 # m. More specifically, in order to prevent The large grain growth caused by the discrete distribution of the substrate, the particle size of the glass should be 0.2-5 am. Now, the method of manufacturing a coil inductor by using the dry powder containing the glass of the present invention will be used Explanation: In the example of a coil inductor, immediately after the powder containing the glass is dried, a 5-15 wt% binder is added, the binder contains 5- 丨 0 wt% of the main component and 5 -16% by weight of the reaction inhibited the formation of coarse particles. The main component may be any material which is generally used when manufacturing a sintered sand core. For example, polyvinyl alcohol (PVA) or methyl cellulose can be used. At the same time, the reaction inhibitor plays a role in preventing agglomeration of soft ferromagnetic particles, and the material may be mannitol or propylene glycol (PEG). The dried powder can be calcined as in the general example, and the calcination temperature should preferably be 650-880 ° C. More preferably, the calcination temperature should be 700-850 ° C. The calcined powder is then made into coarse particles, and a shaping is performed to produce a desired manufacturing body. The manufacturing body is sintered at a temperature of 860-910 ° C, which is lower than the general low melting point compounds. 9 This paper size is applicable to China National Standard (CMS) A4 Regulation 210X297 mm) '{Please read first Note on the back, please fill in this page again) 4 5 55 7 0 A7 B7 V. The temperature of the invention (). During sintering, the temperature range of 750-900 ° C is such that the grains are aligned and dense. Therefore, if the temperature is rapidly increased, cavities are formed, and as a result, the magnetic permeability is reduced and the quality factor is degraded. Therefore, it is best to avoid rapid temperature rises. For example, in the above temperature range, the temperature rise should preferably be controlled at a rate of 10 ° C / min. Furthermore, after reaching the sintering temperature, the sintering temperature is preferably maintained for 2-3 hours. Then, during the interval down to 700 ° C, sudden cooling should be avoided. If suddenly cooled in this interval, the CuO is sunk from the base vessel, and as a result, its electromagnetic characteristics are impaired. Therefore, special care should be taken, and during this cooling period, the cooling rate is preferably 5 ° C / min or less. In the present invention, its microstructure is very stable, and the following characteristics can be obtained. That is, the coefficient of quality is 150 or higher, the peak region is ιοοκΗζ-20MHz ', and the inductance is 10 " Η or greater. Therefore, a soft ferrite material having superior electromagnetic characteristics can be obtained at a temperature which is lower than that of the conventional technique. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Now, a method for manufacturing a chip inductor by using the dried powder with the above-mentioned glass added will be explained. An adhesive in the form of an organic polymer such as PVB, methyl oryzanol (MC), oleic acid 'propylene glycol, toluene or mannitol is added to the dried powder in a ratio of ι: 1 · 1: 4. in. The green board is then die casted by a doctor blade process, and then multiple green boards are layered. Then an inner Ag electrode was printed, and then a number of green boards 455570 A7! --___ 87 V. Description of the invention () ~ ^-were stacked. Then the structure is sintered at a temperature of 880-91 ° C. The sintering temperature of 880-910 ° C is lower than the traditional sintering temperature. Then-an external electrode is formed on the sintered body to obtain a sintered body according to the present invention. Chip inductors. The present invention will now be described based on practical examples. ≪ Example 1 > The raw materials are adjusted to the composition of Table 1. These raw materials are placed in a polyurethane tank, and then the raw materials are used in the Add 1 to 3 times the amount of steamed hall water, crush and mix it with YTZ-balls (Y2 03_oxidation ball) until the average particle size becomes 1-15 # m. After mixing is completed, Calcination was performed at a temperature of 700-850 ° C for 2-3 hours, and then re-crushing was performed in the jar. During the re-crushing, -10B⑷r 65Βί2〇3 · 25ZηΟ glass powder was added to the nickel-fired The powder and the re-crushing are carried out for 24-48 hours. When the particle size becomes 〇1-15 # m, a drying is performed by using a dryer until the full gas of the raw material becomes 0.2-0 per weight unit. · Up to 7%. Shellfish consumption by the Central Standards Bureau of the Ministry of Economic Affairs Printed by Sakusha ^ ------- tr (Please read the precautions on the back before filling in this page) The dried powder is sieved into particles of 60-80 sieve size, and then 5-15 A weight percent of a binder is added, of which 5-10 weight percent of polyvinyl alcohol and 5-16% of mannitol are dissolved. The powder is then sieved to a uniform particle size using a 50-mesh sieve and prepared A toroidal sand core with an outer diameter of 25 mm, an inner diameter of 18 mm, and a height of 4.5 mm. During sintering, the temperature rose to 420 ° C at a rate of 2 ° C / minute * and this temperature It was maintained for 4 hours to implement debindering ° 11 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ '455570 A7 _____ B7 V. Description of the invention ()-then the temperature is 3 The rate of ° C / min is increased to 7500t, and then to 900 ° C at a rate of ^ π / min. The temperature is maintained at 90 ° C for 23 hours, and then cooling is performed. When cooling is performed, it is based on The rate of 3.0 / min dropped to 700. (:, then further reduced at a rate of 10 ° C / min To room temperature. Then, the sintered structure was wound with a lacquer-coated copper wire with a diameter of 55 mm and 20 圏. Then the inductance and quality factor (q factor) were measured with a HP4291A network analyzer at a frequency band of 10KHz and 40MHz. Measured. The results are shown in Table 1. In the following Table 1, for the traditional example, 'calcination is performed at a temperature of about 950 ° C. (Please read the note on the back first. Please fill in this page again)-binding. Printed by the Central Consumers Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperatives 2 This paper size is applicable to the Chinese National Standard (.CNS) A4 specification (210X297 mm) 455570 A7 B7 V. Invention Description () Economy. The Ministry of Standards and Standards Bureau employee consumer cooperative printed examples of chemical composition! Main ingredients (mol%) Additives (% by weight) Inductance_ Q 峰 値 Fe ： 〇3 NiO 1 ZnO j CuO CoO C〇2〇3 C〇3 〇4 Glass Bi;: 〇3j V2O5 Invention Example 1 49.5 10.1 31.35 8.85-0.4-1.5--19.0 155 Invention Example 2 49.5 10.1 31.35 3.35 0.5-2.0--21.6 138 Invention Example 3 49.75 14,47 30.75 5.03-0.5- 2.0--15.0 158 Invention Example 4 49,75 11.51 32.71 6.03-0.5-2.0-15.8 1 63 Invention Example 5 •-49.5 10.0 30.5 10.0 0.5-1.0--18,0 171 Invention Example 6 49.5 7.5 30.5 12.5 — 0.1-0.5-24.2 152 Invention Example 7 49.5 17.5 23.0 10.0-0,5-2.0-15.0 240 Invention Example 8 49.5 15'15 25.25 10.1 0.5-2.0-22.9 225 Invention Example 9 49.5 15'15 25.25 10.0 0.5-1.5 Reputation-20.9 232 Comparative Example 1 49 * 75 15.15 34,22 4.02-0.5-2.0--18.0 78 Control Example 2 49 5 j 15.15 25.25 ο.i 0.3 0.2--0,75-12.4 142 Comparative example 3 49.5 15.15 25.25 10.1 0.5-0.5-13.5 149 Comparative example 4 49.5 15.15 25.25 10.1-0.5--0.65 24.2 132 Comparative example 5 49.5 15.15 25,25 10.1 0.3-0.2-0.65-12,0 141 Comparative example 6 49.5 15.15 25.25 iio.l!-0.3 0.2 * io-19.0 145 Traditional example | ff 49.5ll5,15125.25110,1!.---- -48.5 92 (Please read the precautions on the back before filling out this page). Packing--1 ° This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 13 455570 A7 _B7 V. Description of the invention () Such as As shown in Table 1 above, in the case of Invention Examples 1-9, the conditions of the present invention are satisfied, and are It was confirmed that low-temperature sintering is possible. Furthermore, the inductance 値 is larger than 1.5 # Η, and the quality factor Q is about] 50. Therefore they show superior electromagnetic characteristics. That is, these characteristics of the material of the present invention enable it to be reduced by about 50-1,100 at a much lower temperature. (: No sintering is performed. Moreover, the loss after sintering is much lower. At the same time, in the case of Comparative Example 2-6, the glass was not added, but Bi203 or V205 was added. Therefore, sintering has not been fully implemented, so it shows a low quality factor and a low inductance. The reason is that the diffusion of grain boundaries cannot occur only because of the Bi203 or V2O5 components. It is basically contrary to the composition In the case away from Comparative Example 1 of the composition of the present invention, since the quality coefficient is too low due to low-temperature sintering, the electromagnetic characteristics are impaired. ≪ Example 2 > ----- 17 (Please read the precautions on the back before filling this page) In order to see the electromagnetic properties of glass types, glasses with different physical properties are added as shown in Table 2 and have the same properties as in Example 1. In the raw materials of the same composition. Then, the individual materials are made into a toric body and sintered. Then the electromagnetic characteristics are measured, and the results are shown in Table 3 below. Before the measurement, one with a diameter of 0.55 mm Coated copper wire It is wound around the compound body for 20 turns, and then the measurement is performed using the HP4194A inductance analyzer. 14 This paper size applies the Chinese National Standard (CNS) A4 specification (2! 0 X 297 mm > 4 5 5 5 7 Ο Α7 5. Description of the invention () < Table 2 > Composition (wt%) Thermal expansion (ίο-7 / r) Density (g / cc) Particle size (u #) Softening point tt) Melting temperature m B2〇3 ΒΪ2〇3 ZηΟ Si〇2 Na Inventive material a 10 65 25--75.3 5.60 1 Λ8 522 900 Inventive material b 15 65 20--69.0 5.01 7.10 452 900 Inventive material c 10 55 35--71.0 4.90 5.30 464 900 Inventive material d 10 60 30 --78.6 5.95 1.30 502 870 Invention material e 20 60 20--88.0 2.62 4.52 505 825 Control material A 20-80-23.0 2.14 3.70 485 1300 Control material B 15-60 25 84.0 3.06 5.20 486 700 Control material c 20-50 30 64,5 2,70 4.30 491 767 --- ^ -------- ^-(Please read the precautions on the back before filling out this page) This paper size applies to Chinese National Standard (CNS) A4 (210X29? Mm) 4 5 5 5 7 〇 Α7 Β7 V. Description of the invention () Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs < Table 3 > I 1 1 Example Wave Glass Chemical Composition Inductance UH) Q Principal Component (mole%) Additive (wt%) Fes〇3 NiO ZnO CuO C〇2〇3 C〇3〇4 Glass Qp Qf (KHz) i Invention Example 8 a 49.5 15,15 25.25 10,1 0.5 2.0 22.9 225 400 Invention Example 10 a 49.5 15.15 25.25 10.1-0.5 2.0 18.7 214 420 Invention Example 11 b 49.5 15.15 25.25 10.1 0.5-2.0 22,9 215 380 Invention Example 12 c 49.5 15.15 25.25 10Λ 0.5-2.0 16,5 195 450 Invention Example 13 d 49.5 15.15 25.25 10.1 0.5-2.0 22.5 252 380 Invention Example 14 d 49.5 15.15 25.25 10.1 0.5 2.0 20.9 222 420 Invention Example 15 e 49.5 15.15 25.25 10.1 0.5-2.0 17.6 179 450 Comparative Example 7 A 49.5 15.15 25.25 10.1 0.5-2.0 12.1 162 1210 1 Comparative Example 8 丨 B ί 49.5 15.15 25.25 ίο. i 0.5 2.0 15.8 143 880 i Comparative Example 9 C 49.5 15'15 25.25 10.1 0.5-2.0 13.3 152 900 (Please read the notes on the back before filling out this page) 16 This paper size applies to China National Standard (CNS) A4 specifications ( 210X297 mm) 455570 A7 B7 Ministry of Economic Affairs Printed by the Bureau of Standards and Consumer Cooperatives 5. Description of the invention () With reference to Tables 2 and 3, it can be seen that the electromagnetic properties of the manufactured soft ferrite materials vary with the composition of the glass. Large, it will cause different deformation temperature points and thermal expansion of the glass. That is, the inventive materials a-d are used and the glass is made of 10 * 400 /. In the case of Invention Examples 8 and 10-15 composed of B2O3, 20-70¾ BhO3 and 20-40% ZnO to meet the conditions of the present invention, it was seen that the inductance was 15 p Η or more High, the quality coefficient is 150 or higher, and the peak band (Q peak 値 band) of the quality coefficient is 100KΗζ-20MΗζ or higher. On the other hand, in the case of Comparative Examples 7-9 in which B203-Si02 glass (Comparative Materials A-C) was used, either the inductance 値 was too low or the quality factor was too small, thereby deteriorating these electromagnetic characteristics. < Example 3 > A material having the components of Table 1 was powdered by using the method of Example 1. PVB-mannitol adhesive is then added in a ratio of 1: 1 to 1: 4. The mixture was then sorted into uniform particles with a 200-3 25 mesh sieve. Then, a green board having a thickness of 10 to 200 # m was die-cast by performing a doctor blade treatment. Multiple pieces of the die-cast green board are laminated, an Ag internal electrode is printed on the laminated boards, and then multiple green boards are laminated again. It is then sintered at a temperature of 880-910 ° C for 1-3 hours. An external electrode is then formed on the sintered body, thereby completing a chip inductor. For multiple chip inductors made in this way, the electromagnetic characteristics were measured with an HP4192A network analyzer, and the results are shown in Table 4 below. _ 17 This paper size applies to China's national standards (CNS > A4 size (210 × Ϊ97)) I 1 order n II ^ 丨--(Please read the precautions on the back before filling this page) 455570 A7 B7 V. Description of the invention () ≪ Table 4 > Example Chemical composition Inductance (" H) Q peak 値 Main component (mol%) Additive (% by weight) Fe2〇3 ΝίΟ Znη〇 CuO C〇0〇〇3〇〇3〇 4 Glass ΒΪ2 03 V2O5 Inventive Example 19.5 49.5 10,1 31.35 8.85-0A-1'5--210 45 Inventive Example 49.5 10.1 31.35 8.85 — 0.5-2.0--240 59 Inventive Example 18 49.75 14.47 30.75 5.03-0.5 2.0 --140 42 Invention Example 19 49,75 11.51 32.71 6.03 0.5-2.0--155 53 Invention Example 20 49.5 10.0 30.5 10.0-0.5-1.0-210 61 Invention Example 21 49,5 7.5 30.5 12.5-0.1 0,5-- 340 39 Invention Example 22 49,5 17.5 23.0 10.0-0.5-2.0-164 65 (Please read the notes on the back before filling out this page)-Packing. Printed by the Central Consumers' Bureau of the Ministry of Economic Affairs, Consumer Cooperatives Paper size applicable to China National Standard (CNS) A4 specification (210X297 mm) 45 55 7 0 A7 B7 V. Description of the invention () As shown in Table 4 above, low-temperature sintering is possible in the cases of Inventive Examples 16-22 that satisfy the conditions of the present invention. Furthermore, the inductance of the soft ferrite material after sintering is larger than 14 nH , And the quality factor Q is 34 or more. Therefore, it has been confirmed that they all have superior electromagnetic characteristics. That is, the wafer inductor of the present invention has compared with a conventional wafer inductor without the addition of glass and CO additives. A number of advantages. That is, 'in the present invention' the temperature of sintering is reduced by 50%. The loss after sintering is very low. According to the invention as described above, sintering is performed even at a low temperature. It can also be fully implemented so that a soft ferrite material with better electromagnetic properties can be obtained. Moreover, when manufacturing this material, existing equipment can be applied in its original state. Therefore There is no need to invest in expensive equipment, and the difficulty of managing these equipment can be avoided. Therefore, soft ferrite materials for chip inductors can be manufactured at a low cost. (Please read the precautions on the back before filling out this page.) Packing. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs This paper is sized for China National Standards (CNS) Α4 (210X29?)