TW452843B - Semiconductor processing apparatus having linear conveyor system - Google Patents

Abstract

A transport system for manipulating a semiconductor wafer in a processing tool is set forth. The system includes a transport unit guide disposed within the processing tool for supporting a wafer transfer unit as the unit moves between a first position and a second position. The transport unit guide comprises a frame, a lateral guide rail mounted on the frame, and a series of magnetic segments arranged upon the transport unit guide proximate the lateral guide rail. The wafer transfer unit includes a tram translatably attached to the lateral guide rail and a wafer transfer arm assembly for manipulating the semiconductor wafer. An electromagnet is mounted on the tram in cooperative relation with the magnetic segments for moving the transfer unit along the guide rail. Actuators are used for controlling the position of the transfer unit and transfer arm assembly, and sensors are used for determining the position of the transfer unit and the transfer arm assembly. A controller is disposed remote of the wafer transfer unit and directs the movement of the transfer unit and transfer arm assembly in response to the sensors using the actuators. A communication link is established between the actuators, sensors and controller. Preferably, the communication link is a fiber optic link.

Description

Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shellfish Consumer Cooperatives 4 52 8 43 A7 ___B7_ __ V. Description of the invention () Background of the invention Manufactured from semiconductor integrated circuits and other semiconductor objects of semiconductor wafers, providing multiple metal layers on the wafer Metal coatings used as interconnects are usually necessary. The metal coatings are used to electrically connect different devices on the integrated circuit to other devices. Aluminum has traditionally been used for this type of interconnection, but copper metal cladding is preferably beta copper for semiconductor wafers, which proves to be a huge technical challenge in particular. At this time, copper metal cladding has failed to achieve economic goals due to the practical problem of forming a copper layer in a reliable and efficient manner. This part is caused by the relative difficulty in performing reactive ion etching or other selective removal of copper at appropriate manufacturing temperatures. The selective removal of copper is good to form a pattern layer and provide a conductive interactive connection between the wafer or other adjacent layers of the wafer. Because reactive ion etching cannot be used effectively, the industry seeks to overcome the problem of forming a copper pattern layer by using a metal damascene plating process, where holes are more commonly referred to as through-hole 'trenches and other recesses used in copper patterns. During the metal damascene process and subsequent metal plating steps, the wafer is first provided with a metal seed layer for conducting current. The seed layer is a very thin metal layer that can be used in one or more processes. For example, a seed layer of metal is installed using a physical vapor deposition or chemical vapor deposition process to make a layer that is 100 angstroms thick. The seed layer can be effectively made of copper, gold, nickel, palladium, and most or other metals. The seed layer is formed on a surface that is convoluted by holes, grooves, or other device features that are recessed. The convolution of this contact surface is provided in essence (please read the precautions on the back before filling in this page)-Pack-5 This scale is applicable to the Chinese storehouse standard (CNS) A4 specification (2IOX 297 male) 4528 43 Α7 Β7 V. Description of the invention () The increased difficulty forms the seed layer in a uniform manner. The unevenness in the seed layer may cause a change in the current passing through the contact surface during the subsequent plating process. This may in turn lead to unevenness in the copper layer, which is then electroplated into the seed layer. This non-uniformity can cause deformation and destruction of the final semiconductor formed. During the metal inlaying process, the copper layer electroplated into the seed layer appears as a paving layer. The paving layer is plated to a certain extent to form an overlapping layer ' to completely provide a copper layer to fill the holes, grooves and extend a certain number of purposes. This ply will typically be formed to a thickness of the order / ⑽⑽- / 5⑽⑽ίϊAngel (factory 5 micrometers). Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs --------- Clothing -------- (Please read the precautions on the back before filling this page) The metal inlaying process also includes Excessive metal material is currently removed outside holes, grooves or other recesses. The metal is removed to provide the final form of metal layer in the formed semiconductor integrated circuit. The excess plated metal can be removed ', for example using chemical mechanical planarization. Chemical mechanical planarization is a processing step 'which uses a combination of chemical remover and abrasion to grind and polish the contact surface to remove unsuitable portions of the metal layer used in the plating step. The automation of the copper electroplating process is not necessarily, and there is a need in the art for improving the semiconductor electroplating system, which can be fabricated on the copper layer of a uniform semiconductor object and manufactured in an efficient and economical manner. More particularly, there is a need to provide a copper electroplating system that is efficiently and reliably automated. ____ 5____ This paper is again applicable to China National Twin (CNS) Α4 grid (2 丨 0 × 297 mm) 4 528 43 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () The abstract is used for manipulation The conveying device of the semiconductor wafer during processing is shown. The system includes a transport unit guide placed in a processing tool for supporting a wafer transport unit when the unit moves between a first position and a second position. The conveying unit guide includes a frame, a lateral guide rail mounted on the frame, and a series of conveying unit guides with magnetic portions disposed adjacent to the lateral guide rail. The wafer transfer unit includes a rail car for mobile attachment to a side rail and a wafer transfer arm for handling the semiconductor wafer. The electromagnet is erected between the railcar and the magnetic part in a cooperative relationship, and the magnetic part is used to move the conveying unit along the guide rail. The actuator is used to control the position of the conveying unit and the arm assembly, and the sensor is used to determine the position of the conveying unit and the arm assembly. The controller is placed away from the wafer transfer unit and guides the movements of the transfer unit and the transfer arm assembly in response to a sensor using an actuator. A communication link is established between the actuator, the sensor and the controller. Preferably, the communication rod is a fiber optic link. Component symbol description ---------- If ------- ^ Order --------- line. (Please read the precautions on the back before filling this page), 10 Processing Utensil 11 Work space 12 Interface part 14 Processing part 15-17 Jane B. Round 囲 18 Locking surface 19 Machining module 20 Electroplating module The paper size is applicable to China National Standard (CNS) A4 (210 * 297 mm) ) 4 52 8 43 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention () 22 Pre-wet module 24 Resistance strip module 26 Air supplement pipe 30 User interface 32, 33 Import and export 34 Windows 35, 36 Power door 37 Air vent 38, 39 Interface module 40, 41 Cassette swing door 42, 43 Cassette lifter 44 Power shaft 45, 46 Saddle 47, 48 Cassette support 49 Cassette swing door shaft 50 Cassette tray 51 Stomach base 52 Side support 53 Groove 54 Upright part 57 Vent hole 58, 59 Draining duct 60 Wafer conveyor 62 Conveying unit 7 (Please read the precautions on the back before filling this page) ----— !! I order ---- — — lit This paper size applies to Chinese National Standard (CNS) A4 (210x 297 mm) 452843 A7 B7 V. Description of the invention (Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 62a, 62b wafers Conveying unit 63 Rail 64 Conveying unit 65 Frame 66 Unit guide 68 Path 69 Projection 70 Path 71 Drive operator 72, 73 Cable shield 74 Drive operator 75 Projection 76 Linear bearing 77 Roller 79 Electromagnet 81 Light emitter 82 Centerline 83 — Shaft 84 Rail car 85 Cover 86 Wafer conveying arm assembly 87 First protrusion 88 Second protrusion 89 Vacuum support (Please read the precautions on the back before filling this page) This paper size applies to Chinese national standards (CNS) A4 specification (210x 297 mm) 4528 43 A7 B7 V. Description of the invention () Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 90 Conveyor lift / conveyor lift assembly 91 CCD array 100 Control system 101, 102 The original controller 110 control subsystem 113-119 control subsystem / processing module control 126, 127 data chain 129 resources Chain 130-132 Main controller 140-147 Passive controller 150, 160-162 Memory mapping device 170-172 Passive processor 176, 177 Servo controller 187 Lifter lift motor 188 Lifter rotation motor 180 Interface control card 184 Processing element 185 revolutions Door motor 186 Control saddle motor 190 Turntable encoder 191 Saddle encoder 192 Rising encoder 193 Rotary encoder 194 Conveyor arm motor 9 (Read the > ±. On the back first and then fill out this page >

Loading -------- Order i tf i tr nn. ^ 1 I This paper size applies to China National Standard (CNS) A4 (210 x 297 public love) 528 4 3 A7 B7 Employees ’Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the cooperative V. Description of the invention 195 Conveyor height motor 196 Linear encoder 197 Rotary encoder 198 Conveyor height encoder 199 Absolute encoder 201 Pneumatic valve actuator 202 Operation relay 203 Bottom plate 210 Lower elbow housing 211 Bottom plate 212 Mounting screw 214 Mounting screw 216 Embossing pivot 218 Side groove 220 Leveling screw 222 Mounting screw 223 O-ring 224 Countersink 225 Flange 226 Shoulder 303 Plating tank assembly 316 Plating tank 317 External tank side wall 319 Tank bottom 10 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ------------ ^ .------- Order- ------- 1 I (I read the unintentional matter on the back before filling this page) 523 43 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () 320 cup assembly 321 fluid cup Part 323 cup bottom 324 opening 325 Body input line 330 Riser tube 322 Cup side wall 334 Shield support anode 345 Overflow chamber 362 Pipe joint 371 Dependent skirt 375 Diffuse plate 386 Diffuser height adjustment mechanism 393 Anode shield 394 Anode shield junction 401 Wafer support 401 a- 401 e Wafer holder 406 Processing head ^ 407 Manipulator arm 409 Joint pointer assembly 410 Wafer holder 414 Pointer 426 Shaft 427 Ascending motor 11 (Please read the precautions on the back before filling this page)

-------- Order ---- III i I This paper size is applicable _ National Standard (CNS) A4 specification (210 X 297 mm) 52 8 4 3 A7 B7 Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printing 5. Description of the invention (428) Rotating motor 430 Shaft 435 Incremental rotary encoder 455 Incremental upward motion encoder 456 Ascending drive shaft 478 Wafer holder 480 Rotary motor 498 Incremental rotary encoder 502 Pneumatic piston 540 Digital- Analog converter plate 541 Absolute encoder 541 Absolute encoder 544a, 544b Wafer transfer unit guide 560 Wafer transfer unit 562a, 562b Wafer transfer unit 563a, 564a Upper rail 563b, 564b Lower rail 565 Frame 566 Wafer transport unit Guide 568 Path 570 Path 571 Drive operator 572, 573 Cable shield 573 Cable shield 12 --1 ----- I --- ------ I. I --- tif I (please first Read the notes on the reverse side and fill out this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 male f) 4 52 8 4 3 A7 B7 V. Description of the invention () 574 576 576a 576b 579 582 583 584 585 586 587, 588 589 590 591, 59 2 593 594 595 596 597 598 599 604 605 607 Drive manipulator linear bearing upper linear bearing lower linear bearing electromagnet shaft axle rail car cover wafer / conveyor arm assembly protruding part wafer support conveyor arm lifter absolute encoder bottom Motor encoder, mechanical wrist absolute encoder, left absolute encoder, mechanical elbow absolute encoder, linear encoder head, orbital encoder, processing fluid tank, running pump, and discharge filter. Please fill in this page on the back of the matter.) Binding — Order --------- ^ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 4 528 43 A7 B7 V. Invention Description () 652 656 657, 658 658 800 805 810 820 824 825 830 835 850 860 865 870 875 880 900 904 906 908, 909 917 970 After adding the manifold pressure regulator fluid sensor fluid sensor input / output total Into processing module processing module / wafer holder top emission assembly pointer assembly end plate inlet exit wafer alignment station wafer alignment controller _ mechanical controller wafer Radio sensor system control computer four-axis controller Second semiconductor processing station Wafer rotor assembly Arm slot edge assembly housing 14 (Please read the precautions on the back before filling this page) ------- Order --------- Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) A7 B7 V. Description of the invention () 979 crystal Circular joint pointer 984 Rotor assembly W Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Wafer Economy 4528 ^ 3 The diagram is a simple illustration. The first diagram is an isometric perspective of the semiconductor wafer processing apparatus of the present invention. '2 The second diagram shows The cross-sectional views of the semiconductor wafer processing equipment in the first figure are taken along the line ^; Figures 3 to 8 are schematic diagrams of the semiconductor wafer processing equipment of the present invention compared to the # swing-out door of the module and the lifter. The wafer cassette is exchanged between the holding position 眞 and the extraction position; the ninth figure is an isometric perspective view of a preferred wafer cassette tray, which can be engaged with the revolving door of the interface module of the semiconductor wafer processing apparatus; tenth Figure to Fifteenth Series Form, in which the processing tool can be modularized to facilitate the longitudinal connection of continuous processing units; Figures 16 to 19 show the wafer conveying system in the embodiment of the present invention;-Figures 20 to 19 The twenty-fifth figure is a functional block diagram of an embodiment of a control system for a semiconductor wafer processing apparatus, and the twenty-seventh figure is used to control a wafer. Function block diagram of the master / slave configuration of the interface module control sub-system of the round box interface module; The twenty-eighth figure is 15 of the components of the wafer box interface module connected to the processing tool ------------ —— — — — 装 · —— — C Please S! Read the Mif on the back and fill in the book — Order --------- The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) 4 5 2 8 4 V- A7 B7 V. Description of the invention () Function block diagram of the interface module control sub-system; The twenty-ninth figure is the crystal bonded to the wafer conveyor component of the processing instrument Functional block diagram of the circular conveyor control sub-system; Figure 30 is related to the processor The functional block diagram of the wafer processing module control sub-system of the wafer conveyor component bonding; the thirty-first figure is the interface module control sub-system from the processor that is connected to the wafer interface module component of the processing instrument. Functional block diagram; The thirty-second series is a functional block diagram of the wafer conveyor control sub-system that is bonded to the wafer conveyor element of the processing instrument; and the thirty-third diagram is used for the processing of the lower surface of the plated semiconductor wafer Station cross section. (Please read the precautions on the back before filling out this page) Packing ---------I Order ---------Printed on paper scales of the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs, Chinese national standards ( CNS) A4 size (210 X 297 mm) 452843

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention () With reference to the first figure, a preferred embodiment of the semiconductor wafer processing apparatus Sichuan is shown. The processing tool may include an interface section / 2 and the processing section 3 including a semiconductor wafer cassette 76 of a plurality of semiconductor wafers. The wafer is generally designated as W and can be loaded into the processing tool or unloaded through the interface section 72. In particular, the wafer cassette / 6 is preferably loaded or unloaded through at least one inlet and outlet such as the first inlet and outlet on the processing equipment toward the outer wall. An additional second import / export W can be provided in the interface part / 2 of the processing appliance II? To improve access and import / export? 2 can be used as an input and import / export B can be used as an output. Individually, the power door i5 can be used to cover the access door i2, 55, thus isolating the inside of the processing appliance from the clean room. Each gate% can consist of two parts. The upper part and the lower part respectively move up and down into the front surface of the processing appliance to open the inlet and outlet and allow access. A wafer cassette is typically used to transport a plurality of semiconductor wafers. The wafer cassette 76 is preferably positioned to provide a stable semiconductor pattern in an up or vertical position during the transfer of a semiconductor wafer into or out of a processing tool. 'A clean room was effectively added to the front surface of the processing appliance to reduce the amount of harmful pollutants. The pollutants were inserted or moved in the wafer cassette M. ^ The paper size is applicable to China ’s family standard; U'NS) M specifications ( 2i0 X 297 mm): (Please read the precautions on the back before filling out this page) -Packing 528 43 A7 B7__ V. Description of the invention () Except during the period when the processing equipment is introduced into the processing equipment, a plurality of wafer cassettes are introduced into the processing equipment / 0 or at the same time is removed to reduce the opening of the inlet and outlet i2, and the processing equipment is exposed to the clean room environment. The interface part is added to the processing part of the processing appliance 7 · /. The processing section " includes a plurality of semiconductor wafer processing modules for performing different semiconductor processing steps. In particular, the embodiment of the processing tool shown in the first figure includes a plating module ⑼ that defines a first side surface of the processing portion. The processing part of the processing appliance effectively includes added modules, such as a pre-wet module U and a resistance strip module W, as opposed to a plating module M. Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Justice ------------------------ Install (please read the precautions on the back before filling this page) Optionally, it can be used to implement additional processing Other modules of functions are provided in the processing tool iO. The special processing performed by the processing module of the processing appliance / 0 may be different or of the same nature. Different liquid and gas processing steps are used in different continuous relationships. The processing apparatus is particularly effective in allowing a series of composite programs to be continuously operated with different processing modules, and different processing solutions can be established. The whole procedure effectively achieves no human operation and is in a highly controlled working space ", thus reducing the human operation time and the probability of contaminating semiconductor wafers. The processing module of the processing appliance is preferably a modular, interchangeable, isolated unit. The processing function performed by the processing tool 70 is changed, adding flexibility to the setting of the processing tool and allowing the processing method to be changed. Additional wafer processing modules can be added to the processing equipment ii? Or replace existing processing modules. The paper size is applicable to Chinese National Standards (CNS) Λ4 specifications (210X297 mm) 4 52 8 Printed by the Consumers' Cooperative of the China Standards Bureau of the Ministry of Economic Affairs Home A7 B7 V. Description of the invention () 19. The processing tool of the present invention preferably includes a rear locking surface M that engages the sides of the processing tool. As shown in the first figure, the air supply pipe 26 is effectively provided with an intermediate facing processing module of the processing portion. The interface portion i2, the side of the processing portion, the locking surface, and the air supplement pipe 26 preferably provide a closed working space within the processing appliance / 0. The air supplement pipe 26 may include a duct to connect a filtered air source (Not shown) Used to provide clean air into processing equipment. More specifically, the air supplement pipe 26 includes a plurality of air vent intermediate processing modules / 9 for guiding clean air into the working space. Referring to FIG. 16, a discharge duct 59 is provided adjacent to the wafer conveying unit guide 66. The frame 65 is used to remove the circulating clean air and pollutants. The exhaust duct M is connected to each processing module / 9 for attracting replenishing clean air there. In particular, clean air is captured and filled into the working space of the processing appliance ii via the air replenishing pipe 26. This air is attracted to the wafer conveying unit for 6 hours and enters the processing module 79 through a plurality of air vents · 57, which are formed in a rack or a processing deck by a discharge fan (not shown) connected to a discharge duct output. Each processing module M is directly connected to the discharge duct, 59 in the processing tool / 0. This air can be drawn out of the discharge duct 59 of the processing tool through the rear locking table 靣 or through the bottom of the surface of the processing tool. Providing an enclosed work space and controlling the environment within the work space significantly reduces the occurrence of contaminants in processing equipment. _ 10 This paper size applies to China® Home Standard (CNS) Λ4 size (210X 297 mm) I--I ^^ 1 ί -'- n-士 j / n: — ^ 1 ΐ »· -0 (please first (Please read the notes on the back and fill in this page.) Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. The group forms the side of the processing appliance it). The side of the processing instrument can be adjacent to the gray room environment. Compared with the clean room, the ash room has fewer precautionary measures to prevent pollutants. Using this specification to reduce factory costs, when the wafer module electronics of processing components and processing equipment are allowed to be obtained, the processing equipment requires normal maintenance. The user interface is provided as shown in the first figure. The user interface 30 is effectively a touch screen cathode ray tube control display that allows a finger to touch the display screen to use different control functions within the processing tool 70. An additional user interface JO is provided behind the processing equipment or within individual processing modules so that the processing equipment can function from another location to surround the processing equipment. A mobile user interface is provided to allow the operator Move around the processing equipment / (? And observe the operation of the processing elements. This user interface is used to familiarize with special functions and run to processing modules and semiconductor wafer transfer units 62, 64. Each module within the processing equipment ^^ 20, 22, 24 preferably include a window with a visual inspection of the processing chamber to allow processing equipment to run. Further, stepwise, vent holes are effectively provided in each processing module 2)), 2_ ?, N Above the surface. The processing module electronic circuit is preferably placed adjacent to the vent hole to allow circulating air to discharge the heat generated by the appropriate type of electronic circuit. 3 ___11 This paper is suitable for China 囷 S house standard soap (CNsTa ^ 格 (-{PLEASE Please read the notes on the back before filling this page) Installation * 1T 452843 A7 B7 V. Description of the invention () The working space in the interface section 72 and the processing section of the processing equipment embodiment of the Sichuan are shown in the second figure. The interface section 72 includes two interface modules 59 for operating a wafer cassette / 6 in a processing tool. The interface module 5 & 59 accepts a wafer cassette / 6 through an HD port and stores the wafer cassette for subsequent semiconductor wafer processing . In addition 'The interface module 5 < §, Storage of cassettes for removal from processing equipment 'When the processing of semiconductor wafers in individual cassettes / 6 is completed β Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Shelley Consumer Cooperatives 11 (Please read the back Please fill in this page for legal matters) Each interface module? < §, including wafer swing gate 40, W and wafer cassette. Lifter 42W. The wafer cassette revolving door 40 is used to roughly change the wafer cassette M from a stable vertical direction to a horizontal direction, and the semiconductor wafer acquisition there is improved. Each cassette lifter 42.M has an individual cassette support 47, which is intended to hold the cassette i6. Each cassette lifter 42, β is used to fix the cassettes / 6 placed in the transport position or withdraw position. The operation of the interface module 35 is described in detail below. In the embodiment of the present invention, the first interface module 55 is used as an input wafer cassette interface for receiving unprocessed semiconductor wafers into the processing jig 70. The second interface module can be used as an output cassette interface to fix processed semiconductor wafers removed from the processing equipment. The wafer transfer unit 6Z in the processing equipment can access the wafer cassette M fixed by any interface module. 12 Dimensions ^ Use Chinese storehouse standards (CNSTA4 specifications (2 丨 0X 297) 芨: 4 528 4 ο Α7 ___ Β7 V. Description of the invention () --------- Installation ------ Order { Please read the notes on the back before filling this page.) The semiconductor wafer conveyor 60 shows the intermediate processing module 22. W and the interface module Ji ?, as shown in the second figure. The wafer conveyor 6 includes a wafer transfer unit H W for transferring individual semiconductor wafers between the interface module and the wafer processing module. The wafer conveyor 60 effectively includes a transfer unit guide 66, such as an extension track, which defines a plurality of paths 6S, 70 for the wafer transfer unit in a processing tool < 52. The wafer conveyance unit 62 in the path may pass through the wafer conveyance unit ^, and along the conveyance unit guide 66 in the conveyance unit < 52, to be positioned on the second path 70 during the movement. The processing tool may include an additional wafer transfer unit to facilitate semiconductor wafer FF transfer between plating modules 20, 22, 24 and wafer interface modules 3S, J9. Employees of the Central Bureau of Standards, Ministry of Economic Affairs, printed by the cooperative. More specifically, the second arm protrusions support the semiconductor wafers. The vacuum conveys the appropriate conveying unit 62 to move the guides 66 along the conveying unit to access the wafer support. . After reaching the proper position along the unit guide 66, the first protruding portion 87 and the second protruding portion rotate to approach the wafer support 3. The second protruding portion S3 is placed above the wafer support and then lowered toward the wafer support. Engage the pointer assembly Yang 9.该 vacuum / vacuum support < 59 is removed, and the second protrusion 55 of the semiconductor wafer held by the pointer assembly in the processing module can be lowered and removed from below the semiconductor wafer. The wafer bonding pointer is fixed. The paper scale is suitable for Sichuan S Standard (CNS) Λ4 specification (2i0x297 mm) 4528 43 A7 B7 V. Description of the invention () After the processing of the semiconductor wafers 20 and 22 is completed, the wafer is transported unit < 52, < 54 Retrieve the wafer and either transport the wafer to another processing module 22, 24 or return the wafer to the wafer cassette for storage or removal from the processing tool. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs · n ^ i I---I----I s-1 i ^^^ 1 I ^ ilf ^ —J-* (Please read the notes on the back first (Fill in this page again.) Each wafer transfer unit ^ Accesses the wafer cassette adjacent to the conveyor for retrieving or placing semiconductor wafers from the cassette. In particular, the wafer transfer unit M is shown to retrieve the semiconductor wafer from the wafer cassette 76 on the elevator 42 shown in the second figure. More specifically, the connected second protruding portion and the vacuum support $ 9 are inserted into the wafer cassette. / 6, the cassette is positioned at the second protruding portion of the extraction position a and the vacuum support 59 enters below the lower surface of the bottom semiconductor wafer F fixed by the cassette i6. Vacuum can be applied by vacuum support, when vacuum support < 59 is positioned below the center of the removed semiconductor wafer F. The second protruding part, the vacuum support S9 and the semiconductor wafer V are attached here to be lifted slightly by the transfer arm lifter. Finally, the first highlight < 57 and the second protruding portion are rotated to remove the semiconductor wafer from the wafer cassette / 6. The wafer transfer unit ^ W transfers the semiconductor wafer F to the processing module 79 for processing. Since then, the wafer transfer unit < 52 can run along the path to a position adjacent to the appropriate processing module 22, 24, which is used to place the semiconductor wafer on the wafer processing support for semiconductor wafer processing = _______ 14 Thai paper size Applicable to China Valves Standard (CNS) A4 specification (ϋ〇χ 297 公 爱) ™ Printed by Employee Consumer Cooperatives of Central Standards Bureau, Ministry of Economic Affairs 52843 A7 B7 5. Description of the invention () Refer to the third to eighth interface module The operation of the interface module 56 is shown in detail. The following discussion is limited to wafer interface modules but is also applicable to wafer interface modules, as long as each wafer interface module 59 operates in substantially the same manner. Preferably, the first wafer interface module and the second wafer interface module serve as an input module and an output module of an individual semiconductor wafer cassette / 6 of a processing tool. On the other hand, two modules can act as input and output. More specifically, the wafer cassette / 6 holding the unprocessed semiconductor wafer can enter the processing instrument through the inlet and outlet W and be temporarily stored in the first wafer interface module until the semiconductor wafer is used in the cassette for processing 76 was removed. The processed semiconductor wafer can be transferred to the cassette M of the second wafer interface module, and is temporarily stored and / or removed from the processing equipment through the wafer transfer unit 62,6 ¥. The groups 55, 39 can be directly accessed by the wafer transfer unit 62 in the processing device M for transferring semiconductor wafers. According to the present invention, a plurality of wafer interface modules 55 accessible to each wafer transfer unit 62, 64 are provided, which facilitates the transfer of the semiconductor wafer F through the processing tool M. Each of the crystal map interface modules preferably includes a cassette swing door buckle and an adjacent cassette lift β. The access door ^ W is adjacent to the cassette swing door W respectively. The semiconductor wafer cassette M was imported and exported through J2, B. {Please read the precautions on the back before filling in this page.) This paper size is applicable to the Chinese standard (CNS) A4 specification (2! 0x297 mm) 452843 A7 _B7_ 5 2. Description of the invention () The processing device μ is introduced or removed. The semiconductor wafer cassette is preferably placed in a vertical position before the cassette tray 50 is transferred to the processing tool. The cassette tray is shown in the ninth figure. The vertical position of the wafer cassette and the semiconductor wafers provides a certain orientation to maintain the semiconductor wafers within the percentage of the semiconductor wafer cassettes used for transport. 3 The wafer cassette swing gates, preferably including saddles, are planned. Provide two saddles with a fixed crystal box °, and then place two wafer cassettes 76 into the processing equipment or remove them. The single opening of the individual access door JJ, 5 (5 will make the processing equipment Kawauchi working space 7 / Minimize contact with the clean room environment. Each saddle 45, including two forks that can be engaged with the cassette tray 50. The two saddles are driven by the in-box motor of the wafer box rotary door to position the crystal in a horizontal or vertical orientation. The wafer cassette 76 and the semiconductor wafers there are preferably positioned vertically for access through the access port 52, through the work of the Central Standards Bureau of the Ministry of Economic Affairs, consumer cooperation, Du Yinhua, ^ 1 ··- -^^ 1 11 ^^ 1 ^^ 1 TJ «taxi /// --It. Hi .1— r ^ i ^ 1 * U5,, -e (Please read the precautions on the back before filling this page) and level The ground is positioned in the transfer or extraction position to provide wafer access here to the wafer transfer units 62, 64. In the third figure, it is fixed by the cassette swing door The wafer cassette is also called a cassette / 5 in a fixed position (called a load position). The semiconductor wafer in the cassette M can be stored for subsequent processing. Semiconductor wafers within a circle of μm. Wafers can be stored for subsequent removal from processing equipment, and access through access □ 3 _-— 16. 'This paper wave standard is common in the national standard (CNS > Λ4 specification (210X297) ) ~~~~ ---— 4 528 4 3 Α7 Β7 V. Description of the invention () With reference to the third figure, the cassette 76 supported by the cassette elevator is also referred to as the cassette being pulled out or exchanged. Location. The semiconductor wafer is either removed from the cassette or placed in a cassette, which is passed through the wafer transfer unit. < 52, the material is positioned at the extraction position. The wafer cassette revolving door W and wafer centrifugal lifter exchange wafer cassettes to transport a wafer cassette 77 having a processed semiconductor wafer from a withdrawn position to a fixed position for removal from the processing tool M. In addition, this type of exchange can transport wafers 77 centimeters. This cassette has raw semiconductor wafers from the fixed position to the extraction position to provide a wafer transport unit. < 52_ Access the semiconductor wafer here. Printed by the Central Government Bureau of the Ministry of Economic Affairs, Consumer Cooperatives (please read the precautions on the back, and then fill out this page). The cassette U i7 exchange is described with reference to Figures 4 to 8. Specifically, the saddle # is placed under the power shaft # of the cassette elevator β. The shaft is connected to a power cassette support 47 for fixing the semiconductor cassette / 6. The shaft and wafer support attached here are reduced by ¥ 7 as shown in the fourth figure and the shaft W passes between the yoke between saddle M. Referring to the fifth figure, the inner motor of the shaft ^ rotates the wafer box support 47 around a center line through the shaft ^, and provides a wafer box U opposite to the wafer box 7 * 5, and the wafer box / 5 is a wafer box Turnstile / 0 fixed. The two saddles of the cassette revolving door M are then tilted horizontally as shown in the sixth figure. The shaft ^ of the wafer box elevator 42 is lowered and the wafer box 77 and the saddle are engaged. If the paper size is in accordance with the Chinese valve standard (CNS) A4 specification (210 × 7mm) 452843 A7 _B7 V. Description of the invention () As shown. The axis w and the wafer cent support are additionally reduced to the rotation of the wafer circle 76. Refer to the eighth figure ′ Rotating degree of the cassette swing door to exchange the cassette? 7. Cassettes / 7 with processed semiconductor wafers are accessible via inlets and outlets for removal from processing equipment. A wafer with raw semiconductors is placed for engaging the cassette support 47. The transfer process steps shown in Figures 3 to 8 can be reversed to lift the wafer cassette into the extraction section and provide access to the semiconductor wafers to the wafer transfer units 62, 64. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs --------- ^ ------ ΐτ (Please read the note on the back before filling this page) Figure 10 shows the processing device One way to organize. As shown, the device includes an input / output assembly < 5⑽, left and right processing module 卯 5, < Chuan, wafer transport system, top discharge assembly, and end plate 525. As shown in the figure * The left and right processing modules are fixed to the other with a 0-round wafer conveyor—the modules form a processing chamber with an inlet and an outlet 555. A plurality of processing modules can be fixed in a longitudinal specification to provide a Extended processing room 'This processing room can implement most of the processing procedures on each wafer, or you can choose to process most of the wafers at the same time. 3 In this case, the wafer transport system of the device M < 50 is programmed to work with one or more previous or subsequent wafer transfer system cents. The eleventh figure shows one way to configure the processing head in the device. In this embodiment, the left processing module includes three processing heads for cleaning and drying each wafer after electrochemical deposition, and Two processes before electrochemical deposition --- H _--- The paper scale is applicable to the Chinese National Standard (CNS) A4 specification (2IOX297 mm) 452843 Employees' cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs and Consumer Cooperatives printed A7 B7 V. Description of the invention ( The head is used to perform wafer wetting. In general, the left processing modules S include a support module, which has a processing head for pre-processing and post-processing of wafers relative to electrochemical copper deposition. The right module includes an electroplating module and includes five reactor heads for electrochemical copper deposition. In the embodiment of FIG. 11, a wafer alignment station is provided to determine the proper direction of the thickness of each wafer. When each wafer is processed in the device, the β wafer alignment can be recorded on each wafer according to the induction. No. or its analogs. The twelfth figure and the thirteenth figure respectively show the embodiments of the left and right processing modules. In these figures, the outer part of the housing has been removed separately and thus contacts different system components. Preferably, electronic components such as power supply, controller, etc. are placed in the processing module < 505 and above, when mobile components and the like are placed under each processing module, the fourteenth figure shows a perspective view of the input module ，, whose module has a removal plate as viewed from the inside of the device . The fifteenth figure provides a similar diagram of the external device if? The embodiment shown here is a wafer alignment station < 55 (5 and wafer alignment controller are provided in the input module category. The mechanical controller used to control the wafer transport system is placed there. To track the processed wafer, the input module 〇Stood for one or more wafer mapping sensors to sense the wafers present in each cassette. In the input module 5 other components include a system control computer < 57 ^ 5 and four-axis controllers 0 β This system control computer is generally responsible for adjusting all the rotations of the device M. 19 --------- Installation ------ Order (please read the notes on the back before filling the page on this page) This paper size is applicable to the Chinese threshold family standard 隼 {CNS) Α4 OX 297 males *) 452843 Printed by A7 of the Central Standards Bureau, Ministry of Economic Affairs, Consumer Cooperatives. V. Description of the invention () Semiconductor wafer conveyor processing equipment includes semiconductor wafer conveyors used to transport semiconductor wafers through the processing equipment. . Preferably, the semiconductor wafer conveyor 60 has access to each of the cassette interface modules ϋ J9 and each processing module 79 in a processing tool for transferring semiconductor wafers. This includes processing modules from the other side. An embodiment of a semiconductor wafer conveyor is shown in FIG. The semiconductor wafer conveyor generally includes a wafer transfer unit guide 66 preferably including an extended ridge or rail mounted on a frame (55. Alternatively, the transfer unit guide may be formed into a track or used for guiding The length of the wafer transfer unit can be changed. The length of the wafer transfer unit is changed and planned to allow the wafer transfer unit 62, 64 to access the interface module 5 and the processing module 20, 22. 24. The wafer conveyance unit guide 66 defines a movement path to the conveyance unit 61. Referring to the sixteenth figure, the ridge of the conveyance unit guide 66 includes guide rails 6J, 64 mounted on opposite sides. Each semiconductor conveyance unit 62 64, preferably with guide rails (JJ, to. Each rail can be set up with one or more conveying units < 52. Protruding part, 7J is fixed to single pilot < 56 On the opposite side, the guide is used to provide stability of the conveying unit and prevent the unit guide M from being worn. Each of the conveying units 62, 64 includes rollers 77 which are arranged to straddle individual projections 69, 7J along the unit guides. 20 This paper size applies the Chinese National Standard (CNS) Λ4 specification (210X 297mm) " Packing-(Please read the precautions on the back before filling this page) Order 452843 Printed by the Quality and Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Α7 Β7 5. Description of the invention () It can be understood that it is a wafer conveyor < 50 is formed in another specification according to the processing tool M internal interface module ϋ 39 and the processing module 20. 22, the configuration 3 duct 5 < §, 59 is preferably a fluid exhaust connection fan from each processing module i9 connecting the protruding portion and the working space for removing the circulating air from the processing space. Each wafer transports the cell center to an anvil along a separate path and is driven by a suitable driver. More specifically, the operator is driven; 7, M is erected to individual sides of the transfer unit guide M to provide a wafer transfer unit < 52, which can control the axial movement along the guide of the conveying unit < 56 3 The drive operator 7i, is a sintering magnet. A magnetic wafer is provided along the unit guide M with a wafer transfer unit 62 with detailed positions. In particular, the actuators 7 /, 74 are preferably linear brushless DC motors. These preferred drive operators 7 /, 74 utilize a series of tilting magnetic sections that are magnetically and erected in the wafer transfer unit < 5, 6 ^ individual electromagnets 79 to force the unit along the unit guide 6 < 5. The cable shield 72 is connected to the individual wafer transfer unit cores, and the frame M is used to protect communication and power cables. The cable_board7 includes a plurality of interconnecting sections to allow the wafers to be guided along the transport unit. < 52, with its range of motion. 21 --------- ^ 装 — (Please read the precautions on the back before filling in this tile) --5¾ 1- This paper size is applicable to the Chinese Standard (CNS) Α4 size (210X 297) (Centi) 452843 Huang Gongxiao Cooperative Cooperative Association B7 of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention () As shown in the seventeenth figure, the first wafer transport unit 62 is connected to the guide 6 < First side of 5 ridges. Each wafer transfer unit < 52, W includes a linear bearing 76 for engaging linear guides < 5 and 64. Furthermore, the wafer conveying units 6Z each preferably include a parallel roller 77 for engaging the protruding portion 69, which is formed on the ridge of the guide member M and provides stability. The seventeenth figure additionally shows the electromagnet 79 of the first wafer transfer unit 62, which is set up at a position that magnetically reacts with the drive actuator 77. The drive actuator 7i and the electromagnet 79 provide the axial movement and direction control of the wafer transfer unit along the transfer unit guide 66. & Semiconductor wafer transfer unit Crystal pattern conveyor < 5 (? of semiconductor wafer transport unit < 52, 64 The preferred embodiments are described in Figs. 18 and 19. Generally, the semiconductor wafer transfer unit d includes a movable frame or a rail car 54 connected to individual sides of the transfer unit guide 66, and a wafer transfer arm assembly is connected to the rail car for supporting the semiconductor wafer V. And the wafer conveyor arm lifter is used to adjust the height of the wafer conveyor arm assembly shirt β relative to the rail car ^^ Refer to Figure 18, cover < 5 * 5 surrounds the part of the rail car which faces away from the guide of the conveying unit. The rail car material includes linear bearings 76 for engaging with individual guide rails 65, and the guide rails are erected on the guides of the conveying unit Μ j paper scale towels household materials (CNS) Α4 * «· (210Χ297-ή- #) (Please read the precautions before filling this page). ^ Request.,-* 4 52843 A7 B7 V. Description of the invention (). The linear bearing 76 maintains the fixed relationship between the railcar and the conveying unit guide 66 and allows the axial movement of the railcar. The β roller 77 engages a special protruding sand for preventing the railcar material from rotating around the guide rail and providing the wafer conveying unit 62 Stability: The electromagnet system is shown to be connected to the railcar at such locations to magnetically interact with the drive operator and individual wafer transfer units of 7J to interact with each other. The wafer transfer arm assembly extends above the top of the rail car. The wafer transfer arm assembly 56 includes a first arm protruding portion connected to the shaft Si at a first end. <? 7. The second arm projection 55 is effectively connected to the first arm projection < 57 of the second end. The first arm protruding portion 87 can be rotated around the axis by 3 degrees and the second arm protruding portion can be rotated around the center line M by a degree. The center line connects the first and second protruding portions by < 57, one axis 0 printed by the Consumers ’Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ---------, select ------ ir (please read the precautions before, and fill out this (Page) The second arm protruding portion preferably includes a wafer support wiper at the end for supporting the semiconductor wafer V during transportation along the wafer conveyor. The wafer transfer arm assembly preferably includes an air chamber connected to the wafer support module 9 for using a vacuum and fixing a semiconductor wafer to provide an adjustable height of the transfer arm assembly. A protruding part S7 rotates and the second arm protrudes, allowing the transfer arm to access each semiconductor of all processing modules __ Εΐςί 1 〇Inner circle holder and each semiconductor wafer cassette is Processing load # This paper's standard is applicable to the national standard (CNS) A4 specification (2 丨 0x 297 mm > 452843 A7 B7 V. Description of the invention () The interface module 39 is fixed. This type of access process allows wafers Conveying orders 71; 62, W convey semiconductor wafers. Cover S5 has been removed from the wafer conveying unit shown in Figure 19 to show the conveying arm lifter 卯 reaching the railcar and conveying arm assembly. Conveying arm lifter Such as adjusting the relative rail car conveyor arm assembly < 56 in the vertical position, the semiconductor wafer is transported between the wafer support and the wafer holder 5 < A period of 5 rooms. Along the transport unit guide, each wafer transport unit 62, tracks < 5 'position is controlled in detail using a position designation array, such as the CCZ array W in the nineteenth figure. In a preferred embodiment of the processing device 20, each wafer holder Sii in the processing mold group has a relative light or other front-line emitter W, which is mounted on the surface of the processing module 79 shown in the second figure for The light is guided towards the transport unit guide 仏. The light emitter W may represent continuous light or be planned to generate light, and when the wafer transfer unit 62 approaches an individual wafer holder. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) The conveyor arm assembly includes a CCZ array positioned to receive light generated by the light transmitter W) 9 /. The on-axis position designation array W detects the presence of light to determine the position of the railcar along the transport unit guide 66 '. The position accuracy of the position indicator of the wafer transfer unit is preferably within a range of less than (about less than). The scale of this paper is in accordance with the Chinese National Standard (CNS). Eight materials can be seen (210X297). 5 52843 A7 B7 V. Description of the invention () I '--- ^^ 1!--I. ^^ 1-n I— " Hi / 1 ^^ ^^ 1 i I Hi ^^ 1 \ — «(Please read the intent on the back before filling out this page) It is shown on the 20th to 25th page of the wafer transfer unit Two embodiments are also provided connected to the conveying unit guide < 56 a movable frame or a rail car 5W on each side, a wafer arm assembly is movably connected to a rail car for supporting the semiconductor wafer F, and is used to adjust a crystal relative to the rail car W Wafer conveyor arm lifter with round arm total height * 5. One cover 5 magic orbit rail car-part ^ The rail car includes individual guide rails for mounting on the guide 66 of the conveying unit < 5 In turn, a linear bearing 5M is engaged. The linear bearing 5> 6 maintains a fixed relationship between the rail car 5 and the conveying unit guide 66 and allows the axial movement of the rail car J material. The electromagnet 579 magnetically reacts with the guide to drive the actuation coils 71,74. Printed by the staff of the Central Standards Bureau of the Ministry of Economic Affairs, printed by the cooperative, the total components of the wafer conveying arm 6 extend above the top of the rail car 5 heart. The wafer transfer arm assembly includes a first arm protrusion 7 connected to a shaft brother J at a first end, respectively. The second arm protrusion 5 has a wafer support 5 for supporting a semiconductor wafer W. < 59, which can be effectively connected to the second end of the first protruding part 7. The first arm protruding portion 557 rotates around the axis J (° 5 by J centigrade) and the second arm protruding portion 5 rotates 360 degrees around the central axis 5S2, and the first and second arm protruding portions 5S7 are connected through one axis, such as the first The embodiment provides an adjustable height of the conveying arm assembly 対 6 ', the protruding portion of the first arm rotates around the central axis of the shaft 5 and the rotation of the protruding portion 5 of the second arm around the axis allows the semiconductor wafer to be transported. Unit • 562 «to transport semiconductor wafers. 25 This paper size applies to China's standard of housekeeping (CNS > Α4 size (210x 297 male H 1 4 528 43) Central Zhangzhun Bureau of the Ministry of Economic Affairs, Consumer Consumption Co-print A7 B7 5 Explanation of the invention () As shown in the twenty-first figure, the cover has been removed from the wafer conveying unit) _62, revealing that the wafer conveying arm lifter is connected to the rail car 5 and the conveying arm assembly 5 该. The conveying arm lifter J 卯Adjust the conveying arm assembly of J material relative to the rail car < 5 in the vertical position during semiconductor wafer transport. The wafer transfer unit 5 < 526 of the second embodiment 'optical fiber communication path, such as optical fiber, instead of the cable W to the wafer transport unit through the digital _ analog converter plate The inertial mass of the conveying unit 562 is reduced and the reliability is improved. Preferably, this type of communication takes place between the delivery unit and the system controller $ 75. The rail car J along each wafer transport unit of the transport unit guide 66 is finely controlled by the path and the operating position. The combination of encoders is used to provide information about the three-axis space rail car 5 < ^ position ' The position of the wafer arm assembly and the second protruding portion 5 '. Absolute encoders are displayed in place and placed on the lift 590. An absolute encoder ′ ΓΡ〇π, shown in the position, is placed at the bottom of the shaft motor. The robot wrist absolute encoder 'shown at position' is placed at the end of the transmission arm assembly 556. Mechanical elbow absolute encoder; heart, 597 is provided at the bottom of the shaft. The left absolute encoder 59 (5 is placed along the bottom motor. A linear encoder 5 卯, head track encoder_5 卯 and track CC /) array absolute encoder is placed on the bottom of the base of the railcar 5 material 26 books The paper size is suitable for 1¾ house standard (CNS) Λ4 size (210x 297 mm) (please read the precautions on the back before filling the tile) Binding-order 452843 A7 B7 V. Description of the invention () Flat panel 2W, The latter is used to sense the light emitter mounted on the surface of the processing module / 9, as shown in the second figure. The foregoing allows precise and reliable positional accuracy. The setup of the wafer transfer unit is shown in Figure 22. As shown in the figure, the wafer conveyor 560 includes a wafer transfer unit guide 566, which includes an extension ridge or rail and is mounted on the frame 5M. The wafer conveying unit guide defines the movement path 5 of the wafer conveying unit guide, and the ridge of the conveying unit guide includes the upper rail 5Wa, which is erected at the center of the rail W below the other side. The semiconductor wafer transfer unit guides preferably engage each of the upper and lower guide rails 56 "and each pair of upper and lower guide rails erected on one or more transfer units ft 544a, 544b = each wafer transfer unit · 5 # α, Driven along individual paths Printed by the Consumers ’Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the note ^^ on the back, and then fill out this page) 5 Huai 570, driven by the drive operators 57i, 574 to set up the transport unit The individual sides of the guide member M provide the wafer conveying unit along the conveying unit guide to control the axial movement, such as 5 ^. The driving operator J7 is 57 · / is a linear magnetic motor for providing wafers The precise positioning of the conveying unit is along the guide 566, and preferably a linear brushless DC motor uses an angled magnetic part in series. The magnetic part is magnetically mounted on each wafer conveying unit with 6 individual solenoids 579 to force the unit along the transport unit guide 566. 27 The standard of this paper is applicable to the standard of Chinese prisoners (CNS). Λ4 is present (2! OX 297). 4 528 43 A7 B7 Printed by the Consumers ’Cooperative of the Central Government Bureau of the Ministry of Economic Affairs. 5. Description of the invention () Optical fiber cable shield 572, 57J provides communication and individual wafer transport unit J material and protects the fiber optic cables provided here. Cable shields 572, 57J include multiple interconnected sections to allow the wafer transfer unit to follow the unit guides_5 < 56 The full range of motion. As shown in FIG. 22, the wafer transfer unit W is externally connected along each side of the ridge of the unit guide 566. Each wafer transfer unit 5446 includes an upper linear bearing * 5760 for connection with the upper linear guide 56 respectively. In addition, each wafer transfer unit 5 cores include the following linear bearing joints under the linear guide 56 # 'to provide stability and load on the track more evenly distributed = Refer to Figures 22 to 24, the The upper and lower linear bearings are 576α, 57 minutes. A device can also be adjusted by extending the vertical axis of the wafer arm assembly 556 above the railcar. The wafer arm assembly is rotated in a plane as close to the absolute horizontal plane as possible. Wafer transport within circular processing equipment is important. To achieve this, the elbow housing under the transfer arm assembly, shown in Figure 25, is erected on the bottom plate of the wafer transfer unit to provide a tilt adjustment. The lower elbow casing is erected to the bottom plate '2' at 0, as shown in Fig. 21, Fig. 23, and Fig. 24, with the upper mounting screw 272 and the lower mounting screw 2 being used. The bottom plate 2 " is alternately fixed to the elevator motor 3 卯 to raise or lower the wafer arm assembly W, preferably seen in the twenty-fifth

The 2S scale is applicable to the Chinese national standard (CNS) A4 (210X297 mm) --------- Hangang ------ 1τ (Please read the precautions on the back before filling this page) 452843 Printed by A7 B7 of the Consumer Cooperatives of the Central Provincial Government Bureau of the Ministry of Economic Affairs 5. Illustration of the invention (). As seen in the twenty-sixth figure, it is placed horizontally between the upper mounting screw 2 so that the embossed pivot is 6 at the bottom A flat plate that engages a relative, but slightly smaller, lateral grooves in the lower elbow housing. The pivot is preferably shaped. The opposite lateral grooves are provided with $ to provide a gap between the bottom plate 2/7 and the bottom. Elbow housing 2 / i? With an angle of about 0.9 degrees is available in between. Combined with one or more leveling screws 220 and upper and lower mounting screws W2, 274, the lower elbow housing 2 The angular orientation and attachment of the transfer arm assembly <5 can be adjusted and fixed to provide the rotation of the transfer arm assembly as close to the absolute horizontal plane as possible during the wafer transfer within the processing tool / <?. The compliant attachment of the lower linear bearing guide 57 is important for the smooth flow of the wafer along the guide 566 The sending unit W makes up the operation. To provide this type of compliant attachment, preferably allowable buoys, 57 points in the lower linear bearing guide are obtained through the use of compliant snap-on technology. The floating latch 22 / about the mounting screw 222 is positioned, by By the O-ring, preferably F / rCW is positioned with respect to the floating pin. When the countersunk hole in the bottom plate 203 is set in the screw hole of the lower linear bearing guide 5766, as shown in the twenty-eighth figure, the screw support The floating pin 2 has flanges that alternately support the O-ring 22J. The 0-ring 225 supports the shoulder of the countersunk hole-M6. However, when the screw is tightened, the relative movement is allowed between the lower linear bearing guide Between the piece and the bottom plate to ease the movement above the guide. 29 __ ... _ 墨 — —— &quot; This paper》 • Standards apply the Chinese National Standard (CNS) Λ4 specification (210X297 mm) (Please read the back first Please note this page before filling in this page) &quot; clothing and ordering 4 52843 A7 B7 V. Description of the invention () Control system {Please read the notes on the back before filling this page) Refer to the 26th figure to show the control of processing equipment System embodiment. As shown in the figure, the control system 7⑽ generally includes at least one original controller for controlling and / or detecting all functions of the processing instrument. The control system i is preferably configured in a layered format. The original controller includes a processor to electrically connect a plurality of sub-system control units as shown in Figure 26. The control sub-system preferably controls and detects the operation of the components of the relative device (ie, wafer conveyor 60, processing module 22-24, interface module 59). The control subsystem is preferably planned to accept instructions or operating instructions such as software code from individual original controllers / W, /. The control subsystem 7 provides better process and status data to individual original controllers / 0 / ,. Du printed by the Central Bureau of Standards of the Ministry of Economic Affairs, consumer and capital cooperation. In more detail, the original controller is connected to the interface module control // 0 to control each semiconductor wafer interface module 59. In addition, the original controller is connected to the transport controller for controlling the operation of the wafer conveyor and the control of a plurality of processing modules /. .Ii5 relative to the processing equipment ^ inner semiconductor wafer processing modules 20,22. The control system i of the processing tool 70 according to the present invention includes an additional original controller M2 as shown in FIG. 26 for detecting or operating an additional sub-system. Such an additional wafer processing unit is controlled by an additional processing module. The control subsystem is preferably connected to each primary controller / 0 person / 02. The original controllers 70 /, 702 are preferably interconnected and each transfers processing data to another controller. -Electric ______30_______ This paper ft scale applies Chinese National Standard (CNS) a4 specification (21〇_X297) while it is 4 528 43 A7 ______B7 V. Description of the invention () Each original controller /, receives and sends data to individual molds Group control (please read the back matter before filling this page) The preferred embodiment of the control system in the control system / ⑽, the two-way memory mapping device is provided with an intermediate original controller and each module connected system. In particular, the memory mapping device 760, / 6 people are provided with the intermediate original controller and the main controller / 30, U /, within the control of the individual interface module and the transport controller / and the processing module. Each memory-mapped device / Yang-M2 in the control system / ⑽ is preferably a dual-port brother / provided for storing data synchronously. In particular, the original controller Mi can write data to the memory position relative to the main controller i50 and the main controller DO can read data simultaneously. On the other hand, the original controller can read the mapping memory device whose data is written by the main controller HO. Memory mapping is used to provide data transfer at processor speed. The memory mapping device is preferably provided with an intermediate user interface and the original controller for transmitting data. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economics The user interface is preferably connected to each original controller 702. The user interface may preferably be erected outside the processing appliance or at a remote location to provide processing and status data for an operator's processing appliance. Additionally, an operator can enter control sequences and processing instructions that are still used in processing appliances. The user interface is preferably supported by a general purpose computer within the processing appliance via a user interface. The general purpose computer preferably includes a 6 / UM // :: processor, but other processors may be utilized. This paper size is applicable to China National Standards (CNS) Α4 specifications (210X 297 public broadcasting) 4 5284, i Α7 V. Description of the invention () Each module controls the sub-system, including interface module control, wafer transfer controller i The control of each processing module is preferably planned in an active and passive arrangement. This module controls the secondary system UO, which is preferably enclosed in individual modules, such as wafer interface module ϋ39, wafer conveyor or processing module 2 / λ 2Z. The original controller and the relative main controller 730 are preferably implemented on a printed circuit board or / iSZ board, which is set up in a general purpose computer support user interface Kawachi. Each of the original controllers 2 and 2 preferably includes a 6 &lt; 1: C㈨0 processor provided by Moiofo / ci and each of the main and passive controllers in the control system 7⑽ preferably includes / »& / Provided processor. Each main controller 730 is connected to a separate passive controller via data link / 26, P7, / 29 as shown in Figures 27 to 30. Each data chain 72 &lt;5; 727, / 29 preferably includes an optical data medium as provided. However, the data chain U7, 729 may include another data transmission medium. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back * before filling out this page). Refer to Figure 27. The active / passive control sub-system for the interface module control is displayed. Each active and related passive specification is better than a single module (ie interface, conveyor, processing) within the processing tool i0. However, a plurality of modules are actively controlled or detected. The active / passive specification is described in Figure 27 and is applied to the other module control subsystems in addition to the interface module control / channel. 32 This paper scale is applicable to China 丨 S] Furniture ratio (CNS) M specification {2 丨 0 &gt; &lt; 297 public delay) 4528 4 A7 B7 V. Description of the invention () The original controller is connected via the memory mapping device Y To the main controller 750 in the interface module control / 70. The master controller is connected to a plurality of passive W persons / β. M passive controllers can be better connected to a single main controller to each other and each passive controller can be programmed to control and detect a single motor or processing element, or multiple motors and processing elements. The control system i⑽ of the processing apparatus preferably makes use of a flash memory. More specifically, each of the main controllers and passive controllers used to operate in the control system is effectively stored in the memory of the original controller / s with the operating instructions or codes of 7. When the power rises, the original controller inquires the main controller with (?-To 2 and downloads the appropriate operation instruction program to run each main controller. Similarly, each main controller inquires about Passive controller &quot; Heart ^ 7. After this, the master controller starts downloading the appropriate program from the original controller 7, M2 to the passive controller i-70 via the master controller / 5, and 2. Printed by the Bureau Cooperative Consumer Cooperative (please read the precautions on the back before filling this page) Each passive controller is planned to control and detect a single motor or multiple motors in the relative processing module W, interface module 5 & amp 59 and Jingtu Conveyor Yangi. In addition, each passive controller i Yang-W7 is' planned to detect and control any passive controller of the processing elements in the processing module / 9, as shown in the 30th The passive controller of the six figures is planned to control and / or detect the servo motor and processing elements. 4. 33 ^ Paper size is applicable to China Standards (CNS) A4 specifications (21〇 &gt; &lt; 297 mm &gt; 452843 Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Α7 Β7 Explanation of the invention () Each passive controller includes a passive processor connected to a plurality of port interfaces. Each interface is used to control and / or detect servo motors and processing elements. For example, one can be connected to servo control / 76, the control card is planned to operate a wafer transfer unit core α, 620. The passive processor 777 runs the wafer transfer unit Mα through the port and the servo controller i76. More specifically, the passive processor 777 runs the servo motor in the wafer conveying unit and detects the state of the motor through the servo controller. On the other hand, different passive controllers run on different components in a single processing device, such as interface modules. More special Ground 'interface module control and interface module components are described in Figure 32. β passive controller 2 turns the rotary door motor / shirt and detects the position of the rotary door buckle through the incremental rotary door encoder Υ被动. The passive controller 2 is preferably connected to the revolving door motor / magic and revolving door encoder via 0 through the servo control card (shown in Figure 35) ^ The passive controller operates / detects Turnstile The saddle controls the saddle motor and detects the saddle encoder through the servo control card. The passive processor can be connected to the interface control card for controlling and detecting the processing elements within the individual processing module. For example, 'flow sense The sensor 657 provides the information flow of the processing fluid to the processing slot in the module. The interface control card is planned to explain the data provided by the flow sensor core 7 or other processing elements into a form that is relatively passively processed. 772 所 34 — The size of this paper is applicable to the Chinese Prisoner's Standard (CNS) Λ4 specification (2Ι0χ 297 mm) --------- Drap clothes ------,? Τ ----- -A (Jing first read the back: &gt; x Italian matter and then fill out this page) 4528 43 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Bei Gong Xiao F Cooperative A7 B7 V. Description of Invention () Analysis. Furthermore, the interface control card operates a processing element, such as a flow controller, in response to instructions generated from the relative passive processor 772. The passive controller includes one or more servo controllers and one or more interfaces to control individual ports connected to the passive processors 770-772. The passive processor is used to allow the ability to control and detect the motors of different components and from a single passive controller Processing elements, on the other hand, the servo controller and interface controller include a processor mounted on the board to improve the speed of processing and operation. The data provided by the encoder or processing element to the servo controller or interface controller is immediately processed by the on-board processor, which also controls individual servo motors or processing elements to reflect the data. In this specification, the passive The processor sends data from the interface processor or servo control processor to the individual main controller and the original controller. Conveyor control sub-system The conveyor control sub-system // 5 is used to control and detect the operation of the wafer conveyor 60 and the wafer conveying unit 62α, or 5626 or 5 with a, 5 · / complement, shown on the second Nineteen figures. Normally, the transfer controller / iJ's passive controller is connected to a drive actuator 77 for moving and detecting the wafer transfer unit (52α) along the unit guides in a controlled manner. The passive controller 7 then operates the wafer transfer The unit 62α or 562α or the transfer arm assembly 56 and the semiconductor wafer transfer. Similarly, the passive controller is planned to operate the wafer transfer unit or 5626 or and drive the actuator 35. The paper size is applicable to Chinese national standards (CNS ) Λ4 gauge Luo (210X297 public sewing) I (1 i— ^ 衣 I Ϊ I It ^ {Please read the precautions on the back before filling in this page) 452843 Printed by the Central Government Bureau of the Ministry of Economic Affairs and Consumer Cooperatives Α7 Β7 Five Explanation of the invention () The interface between the passive controller and the light detector 97, which drives the actuator, and the linear encoder and wafer conveying unit 62α are shown in detail in Figure 36. The passive processor of the passive controller / 7 / is preferably connected to the servo controller 776. The passive processor 777 controls the linear portion of the wafer transport unit 62α, and drives the actuator W by operating through the servo controller 776. The photodetector moves along the guide &lt; 56 provide wafer transfer order Linear position data. In addition, a linear encoder is used to detect the position of the wafer transfer unit in detail along the guide M. The passive processor 77i can control and detect the transfer arm assembly relative to the wafer transfer unit 62α. Batch operation. In particular, the passive processor / 7 / can be connected to the inner arm of the shaft W to control the rotation of the first and second arm protrusions &lt; 57, Lee. Incremental conveyor arm rotation encoder / 97 is provided in the axis &lt; 55 of the wafer conveying unit 62α for detecting the rotation of the conveying arm assembly and providing rotation data to the servo controller 776 and the passive processor / 7 / = the passive controller is effectively connected to The stomach and stomach motor in the elevator 90 is used to control the height position of the conveying arm assembly. The height-enhancing encoder / egg is provided in the conveying arm elevator Dechengru # @ Measure the height of the conveying arm assembly. In addition, the passive controller is connected to the air supplement control_actuating _ ^-This paper size applies to the Chinese Standard (CNS) A4 specification (2 丨 0'〆297mm) --------- ^ ------ 1Τ (Please read the notes on the back before filling in this f) A7 ^ 52843 V. Description of the invention () The device (not shown) is used to control a vacuum support 59 to selectively support semiconductor wafers through an interface controller. {Please read the precautions on the back before filling this page) Absolute encoders are provided In the wafer conveyor, the interface modules 55, 59 and the processing module / 9 detect the extreme conditions of operation and protect the servo motor. For example, the absolute encoder detects a condition of 9, the conveyor arm assembly has reached the maximum height, and the absolute encoder i 关闭 can close the elevator to protect the height of the conveyor arm. The motor consumer central government bureau of the Ministry of Economic Affairs prints a similar method. The optical fiber signal communication system of the second and third embodiments of the wafer transport unit and the 5 # can be used separately. In particular, the encoder 59i placed on the lifter, the encoder 592 placed on the bottom of the shaft 5 motor, and the encoder 5m placed on the shaft, the wrist absolute encoder is placed at the end of the conveyor arm assembly and The elbow absolute encoder J97 placed on the bottom of the shaft 5 provides the rotary output of the rotary encoder shown in Figure 35. Similarly, the rising absolute encoder 596, the linear encoder J pair, the head track encoder 5 and 9 and the track CCD array absolute encoder placed along the bottom motor respectively provide the input of the thirty-fifth figure for ascending encoding. Controller 792 and absolute coding processing module control. According to the present invention, the control system Sichuan 0 preferably includes a processing module control sub-system. The paper size of each wafer processing mold in the processing device is subject to the Chinese valve standard (CNS). ) AA specification (2IOX297). Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs.

45284J Α7 Β7 V. Description of the invention () Group 22, 2 [The control system 7⑽ also includes additional processing module control. The secondary system is used to control and / or detect the additional processing module 79. Individual processing module control &quot; V, can control and detect the transfer between the relative wafer holder and wafer transfer unit or 562α, or even between semiconductor wafers = further, processing module control &quot; 5 , &quot; (5 effectively controls and / or detects the processing of semiconductor wafers F in each processing module 22, 24. Referring to the thirty figure, the passive controller operates the processing module 2 &lt;? within the plural Wafer holder buckle. On the other hand, the passive controller WJ, "6 operates and detects a single wafer holder tilt / 6. Additional passive controllers / pairs can be used to operate and detect all processing elements The material (ie flow sensor, valve actuator, heater, temperature sensor) is in a single processing module. Furthermore, as shown in Figure 37, a single passive controller operates and detects Wafer holder WO and processing elements are 4. In addition, a single passive controller is planned to operate and detect one or more wafer holders and processing elements. Passive controllers to both wafer holders and processing elements The interface is an embodiment of the control system shown in Figure 37. In particular, the servo control The 777 and the interface controller are connected to a passive port 772 connected to the passive controller W5. The passive processor / 72 operates and detects a plurality of wafer holders via the servo controller / 77 = Specially, Passive processor 772 38 This paper size applies to Chinese National Standards &lt; CNS) Λ4 specification (210X 297 mm) --------- Installation ------ Order ------ Α (Please (Please read the notes on the back before filling in this page) 43 43 Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention A motion encoder 455 is provided in the wafer holder to provide the rotation data of the manipulator arm 7 to an individual passive processor / 72 or a processor in the servo controller 777. The passive processor / 72 also controls the wafer holding The rotary motor inside the device is used to rotate a processing head 7 around the axis 429. It is between the processing position and the semiconductor wafer conveying position. The incremental rotary encoder provides rotation information about the processing head to the relatively passive processor &quot; 2. 0 is controlled by servo controller i 77 or passive processor 772 The internal processor is used to rotate the wafer holder 47 ^ during the processing of the semiconductor wafer F. The incremental rotary encoder is preferably provided to detect the rotation rate of the wafer holder 47 $ and additional information The ratio to the passive processor / 72 electroplating module controls the effective operation of the wafer holder for gripping or releasing semiconductor wafers. In particular, the passive processor / 72 operates a valve via a pneumatic valve actuator for Replenish air to the pneumatic piston, which actuates the pointer to grip the semiconductor wafer = passive controller within the plating module control operates the valve actuator 20 / to remove the air to replenish and therefore release the pointer from the semiconductor wafer, &quot; . The passive processor 272 also controls the circuit during the processing of the semiconductor wafer by operating the relay M2 through the pointer assembly. * 39 --------- Installation ------ Order ------ 1 (Please read the notes on the back before filling this page) The paper scale is applicable to the Chinese National Standard (CNS) Λ4 Specifications (2: 0x 297 mm) The Central Ministry of Economic Affairs is a member of the Shellfish Consumer Cooperative Co., Ltd. 452843 A7. 5. Description of the invention () Processing module control for better operation and detection relative to wafer processing module 20, The processing of semiconductor wafers in 22, 24 is through instruments or processing elements. With reference to Figure 33, the control operation for the electroplating processing module 20 is described. Generally, the passive processor 172 detects and / or controls the processing elements via an interface controller. The passive processor / 72 runs the pump within the control of the electroplating module to pull the manufacturing solution from the process fluid tank to the pump to discharge the filter. The process fluid passes through the filter, enters the supplemental manifold 652, and is transported through the tank charge line to multiple processes. A plating bath in which the semiconductor wafer is processed. Each tank supplement line preferably includes a fluid sensor M7 connected to the plating module to control the flow data of the process fluid. In order to respond to the fluid data, the passive processor / 72 operates the actuator of the fluid sensor in the supplement line of each tank to control the processing fluid. The passive processor also detects and controls the post-pressure regulator to maintain a predetermined pressure level in the supplemental manifold &lt; 552. The rear pressure regulator provides pressure data to the electroplating processing control module // passive processor / 72. Similarly, the processing module control subsystem / i5. The semiconductor wafer processing interface module that is planned to be controlled within the relative pre-wet module 22 and the resistance module is controlled by each interface module. Detect the operation of the interface module. More specifically, interface module control and 40 --------- 1 ------ ΐτ ——------ Λ. (Please read the notes on the back before filling this page ) This paper size is applicable to Chinese National Standard (CNS) Λ4 specification (2I0X297 gong). Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives. 452843 A7 B7. 5. Description of the invention () Detect the wafer box revolving door 0 and individual interface modules The wafer centrifugal lift d β of the group 39 is exchanged for the operation of the wafer cassette. Passive controller controlled by interface module Yangi passive processor runs and detects the function of interface module ϋ Ji ?. In particular, the passive processor / 70 operation power door 55, J6 is used to provide access to the processing equipment, and it is provided via the port J2, J5 β. On the other hand, the main control system 2㈨ operation power door is referred to the thirty-first figure for An embodiment of the interface module control section that controls the wafer interface module 35 is described. In particular, a passive processor / 70 is connected to the servo controller 775. It is not a passive processor i7 (5 is a component of the processor operation interface module% installed in the servo controller. In particular, the 'passive processor / 叩 controls the swing door motor used to operate the swing function of the swing door'. The door moving wafer cassette / 6 is between the load position and the conveying position. The incremental rotary door encoder 7 卯 detects the position of the rotary door and provides position data to the passive processor. On the other hand, the servo controller / 75 includes a The processor is used to read data from the rotary door encoder i90 and control the rotary door motor i. The servo controller / 75 changes the passive processor / 70 when the rotary door has reached the predetermined position. Each cassette rotary door includes A motor is used to control the position of the connected saddle. The passive processor 770 controls the saddle ¥ 5, 46. The proper position of the saddle motor / S6 is used to position the wafer cassette / 6 attachment level and the fullness of the paper. China National Standards (CNS) Λ4 specification (210X297 Angstroms) ---------- (Please read the precautions on the back before filling in the lettuce page) Order-Brigade 4528 4 Central Ministry of Economic Affairs, Ministry of Economic Affairs Printed by consumer cooperatives Α7 Β7 V. Description of invention () Straight One of the directions. The incremental saddle encoder is preferably provided in the wafer box gate to provide saddle and position information of M to individual passive processors / 70. Either passive processors / 70 or servo control / 7J is planned to control the operation of the wafer cassette lifter <2, which is used to transport the wafer cassette 76 between the exchange position and the withdrawal position. The passive processor is connected to the lifter motor and the lifter motor i « ^ Used to control the height and rotation of the elevator K and the box support 47. Incremental lifting encoder and incremental rotary encoder supplement the height data of the elevator 42 and the box support 47 to the passive processor 7 邛. Absolute encoders are used to pay attention Passive processor for extreme conditions * When the support 47 reaches the maximum height. The lifter motor M7 is stopped in response to the emergence of extreme conditions from the absolute encoder / wafer. The wafer 1M tray is used to hold the wafers of the wafer cassette / 6. The cassette tray 50 is shown in detail in the ninth figure. Each cassette tray 50 includes a base portion 57 and two side supports 52 which are preferably perpendicular to the upright portion of the base portion 57 are formed on opposite sides of the base portion and Upward extension β This side support 52 helps $ # hold the wafer cassette M in a fixed position during the exchange, rotation and movement of the wafer cassette 76. Each side support 52 includes a groove to preferably extend the length to be planned To join the saddle 45. # 的 分叉. 42 (Please read the precautions on the back before filling in this page) The scale of the paper is applicable to the Chinese standard ([&gt; ^) 6 4 specifications (210 '/ 297 mm) ) 4 The Central Government Bureau of the Ministry of Economic Affairs employees ’consumption cooperation rights stamp 2 8 4 j A7 B7 V. Description of the invention () The cassette tray is preferably used in the cassette interface module 55. The wafer operation period The wafer cassette is transported from the load position to the extraction position to provide access to the semiconductor wafer F to the wafer transport unit &lt; 57 in the conveyor. Plating station The thirty-third figure shows that the main components of the second semiconductor processing station 9 'are specifically applied and manufactured to function as a plating station. The two main parts of the processing station 9 cents are the wafer motor assembly, which is roughly shown as, and the plating tank assembly 303. Plating Tank Assembly Figure 33 shows the plating tank assembly 505. The plating tank assembly includes a processing tank or a plating tank having an external tank side wall W7 'and a tank bottom and a tank edge assembly. The processing tank is preferably horizontal in cross section and circular in shape, although other Shape is possible. The shovel slot assembly includes a cup assembly 320 placed in the processing slot W7. The cup assembly 520 includes a fluid cup portion that holds chemicals for the plating process. The cup assembly also has a dependency skirt 577 extending below the cup bottom brake and has a slot opening for fluid communication and collection of gas release 'when the gas chamber is filled with fluid. The cup is preferably made from polypropylene or other materials. 43 __, I binding ------ said (please read the precautions before filling in this page) The paper scale is applicable to the Chinese store standard (CNS) A4 (2 丨 OX297 mm) 452843 A7 B7 Yin Fan, the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention () A hole is connected to the polypropylene riser pipe under the bottom wall of the cup assembly 3, which can be adjusted in height relative to the threaded connection. The first end of the riser is fixed behind the anode shield J95, which shield supports the anode. The fluid input line is placed inside the riser tube. Both the riser and the fluid input line are fixed to the plating tank assembly 305 by a pipe joint. The pipe joint accommodates the height adjustment of both the riser pipe and the input line J2J. In this way, the connection between the pipe joint 562 and the riser tube facilitates the vertical adjustment of the anode position. The input line 5 is preferably made of a conductive substance, such as titanium, and is used to conduct current to the anode, and to trap fluid into the cup. The process fluid is pumped to the cup through the fluid input line and advanced through the fluid line opening 5. The plating fluid fills the air chamber 9 through the opening, such as by a liquid pump (not shown) or other suitable supplement. A weir is formed at the upper end of the cup side wall 522 to limit the height of the plating solution in the cup. This height is selected so that only the bottom surface of the wafer W contacts the plating solution. Excessive plating solution overflows the top surface into the overflow chamber. The liquid height in the overflow chamber jUJ is preferably maintained within a predetermined range for stable operation, and the height of the liquid is detected by a suitable sensor and actuator. This can be achieved using many different overflow specifications. A better specification is to use a suitable sensor to sense height conditions and discharge fluid through a discharge line, as controlled by a control valve. Possibly using a riser configuration (not shown), and this was used with a final overflow protection device in 44 paper sizes applicable to China S Family Standard (CMS) A4 specifications (210X 297 mm) --------- Buttoning clothes ----- 1T ------ ^ (Please read the notes on the back before filling in this page) 452843 A7 B7 Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs Jia plating station. More sophisticated height control systems are possible. The fluid overflowing from the overflow chamber is preferably returned to a suitable container. The fluid can be processed by additional plating compounds or other components of plating or other processing liquids and reused. In a preferred use according to the present invention, the anode system is a consumable anode &apos; which is electroplated to a semiconductor wafer with copper and other metals. Special anodes will change according to the metal to be electroplated and the electric mineral fluid used. Different consumable anodes are available for use in the anode. Figure 33 shows that a diffusion plate is provided above the anode for spreading the plating bath over wafer F. The fluid channel is provided in all the diffusion plates 7J to allow fluid communication. The height of the diffusion plate can be adjusted using a diffuser height adjustment mechanism. The anode shield 393 is fixed to the anode shield junction 594. The underside of the anode is consumed to prevent direct impact by the plating solution when the liquid passes through the processing chamber. The anode shield 595 and the anode shield junction are preferably manufactured from a dielectric such as polyvinylidene fluoride or polypropylene coal. The anodic shield is effectively approximately cm thick, and more preferably approximately 100 cm thick. The anode shield acts as insulation and protects the sides behind the anode. This also reduces the consumption of organic plating bath additives. Although the precise mechanism is not available at this time (please read the precautions on the back before filling out this page)-° This paper size is applicable to China® Home Standard (CNS &gt; A4 now (210x297)) Staff of the Central Bureau of Standards, Ministry of Economic Affairs Printed by the consumer cooperative 4 52 6 ,,. A7 ________B7 V. Description of the invention () Know that the anode shield is considered to prevent interference with a certain material, which develops over time following the anode. If the anode is not shielded The organic plating solution additive is consumed at a very large ratio. With the shielding placed, the additive is not consumed quickly. Wafer rotor assembly The wafer rotor assembly is such as 6 fixed wafers for rotation in the processing room. The wafer rotor assembly 卯 6 includes a rotor assembly having a plurality of wafer-bonding pointers, which fixes the characteristics of the wafer against the rotor. The pointer 979 is preferably used to conduct current between the wafer and the plating power supplement and It is manufactured to act as a current in accordance with different specifications. The different parts are used to rotate the rotor assembly 9 to be placed in the housing 970. The fixed housing is connected to the horizontally extending arm to rotate and is connected The arms 9⑽ and 卯 9 wafer rotor assembly 卯 6 are lifted and turned from engagement. Many improvements can be made to existing systems to deviate from the basic content. Although the present invention has been described with reference to one or more In a special embodiment, technical recognition changes can be made without departing from the spirit as issued in the scope of the attached patent application. Meal ----- 1T ------ ^ (Please read the notes on the back before filling this page ) Applicable scale @ prison 家 橾 单 (CNS) A4 size (210X297mm &gt;

Claims (1)

Printed by the Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs1. A wafer manufacturing device for microelectronics manufacturing, the wafer manufacturing device includes a wafer transfer system, the transfer system includes an intermediate support along a linear transfer path Extended, the first wafer transport unit is placed on the first side of the intermediate support and is set up for movement along the linear transport path, and the second wafer transport unit is placed on the second side of the intermediate support, the The second side is horizontally spaced from the first side, and is erected there for moving movement parallel to the first conveying unit along a linear conveying path, and the movement of the second wafer conveying unit and the first wafer The transfer unit is irrelevant; plural dummy wafer processing modules are adjacent to opposite sides of the wafer transfer system; and the first and second wafer transfer units are used to separately support individual semiconductor wafers and access each wafer process Modules are used to transfer semiconductor wafers between wafer processing stations. 2 _ The wafer manufacturing apparatus described in item 1 of the scope of patent application, at least one of the plurality of processing stations is an electroplating processing station. 3. The wafer manufacturing apparatus described in item 1 of the scope of patent application, wherein the first and second wafer transfer units move along a transfer path using individual linear magnetic motors. 4 · The wafer manufacturing device according to item 1 of the scope of patent application, wherein each wafer conveying device includes: a rail car; a wafer conveying arm connected to the rail car, the wafer conveying arm is generally ^^ 1 cr ^^ 1 ^^ 1 n I ^-^^ 1 ^^ 1 rrf E n sip, ^^ 1 ni 1 ^ 1 ^^ 1 ^^ 1 I n 1 (谙 Please read the notes on the back before filling in this (Page) This paper size is in accordance with Chinese National Standard (CNS) A4 grid (210x297 mm) 45284 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3 A8 * B8 C8 D8 2 degree movement, the wafer transfer arm has a vacuum support erected at the end for fixing a semiconductor wafer; a transfer arm lifter is used to adjust the vertical position of the wafer transfer arm relative to the rail car. 5. The wafer manufacturing apparatus according to item 1 of the scope of patent application, wherein the first and second wafer transfer units include a position sensing for determining positions of individual wafer transfer units relative to a wafer processing module. Device. 6 · The wafer manufacturing device according to item 1 of the scope of patent application, and further comprising: at least one wafer interface module is adjacent to the wafer conveyor, and the conveyor is used to support a wafer having a plurality of semiconductor wafers. A wafer cassette; the wafer interface is installed to place the wafer cassette in a protruding position to allow at least one of the first and second wafer transfer units to access a semiconductor wafer in the wafer cassette, Transfer to several wafer processing stations. 7 · The wafer manufacturing apparatus according to item 6 of the scope of patent application, wherein the at least one wafer interface includes: a wafer box swing door for moving a wafer box between a load position and a transport position … A cassette lift is adjacent to the cassette revolving door and is designed to transport the cassette and provide the cassette in the retracted position. 8. The wafer manufacturing apparatus according to item 6 of the scope of patent application, wherein the wafer processing apparatus further comprises a cassette load gate adjacent to at least one wafer interface module and installed to allow the cassette to pass therethrough. 9 · Wafer manufacturing equipment as described in item 1 of the scope of patent application and 2 nninn I »·« ^ 1 nl I ^ EI Jane (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 Specification (210 X 297 Gt) 452 8 4 3 888 8 ABCD Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. The scope of patent application further includes: The first wafer interface module is used to receive A wafer cassette including unprocessed semiconductor wafers, the first wafer interface module presents the unprocessed semiconductor wafer to a wafer module assembly at a substantially horizontal extraction position; the second wafer interface module is used for Accepting processed semiconductor wafers into a wafer cassette from below the wafer transport assembly. The first wafer interface module accepts the processed semiconductor wafers from the wafer transport assembly at a substantially horizontal insertion position. ] _ 〇 · The wafer manufacturing device described in item 1 of the scope of patent application, wherein the intermediate support: a frame; the first set of magnetic parts is in a fixed relationship with respect to the first side of the frame along the length of the linear path; The second set of magnetic parts is in a fixed relationship relative to the second side of the frame along the length of the linear path; the first and second side rails are mounted on opposite sides of the frame and support the first and second wafer transports, respectively. unit. 1 1. The crystalline wafer &quot; manufacturing device described in item 1 of the scope of the patent application, wherein both the first and second wafer transfer units include: a rail car movably attached to individual lateral guide rails; an electromagnetic The iron erected on the railcar has a common relationship with the individual magnetic parts, and is used to move the wafer transfer unit along individual guide rails; a plurality of actuator response control signals are used to control the position of the wafer transfer unit and the transfer arm assembly ; 3 This paper size applies to China National Standard Leather (CNS) Al specification mm)! I ------ til — —— ^ 1111111 · 1111! 1! 1 {Please read the precautions on the back before filling in this Page) 452843 A8 B8 C8 D8 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 6. Patent application. A number of sensors are used to detect the position of the wafer transfer unit and the transfer arm assembly. 12. The wafer manufacturing apparatus described in item 1 of the scope of patent application, and further comprising an air source interposed between the opposite wafer processing modules to supplement air to the semiconductor wafer processing apparatus. 13. The wafer manufacturing apparatus according to item 1 of the scope of patent application, wherein the wafer transport system includes at least one adjacent exhaust channel for removing air. 14. The wafer manufacturing apparatus according to item 1 of the scope of patent application, wherein the wafer processing module is interchangeable. 15 · —A conveying system for manipulating a wafer in a manufacturing part of a manufacturing device used in microelectronics manufacturing, the conveying system includes: a wafer conveying unit; a conveying unit guide is provided in a processing device for supporting the wafer Conveying unit, when the guide moves between the first position and the second position, the conveying unit guide includes a frame, which is mounted on the lateral guide rail of the frame and a series of magnetic parts are arranged on the conveying unit closest to the lateral guide rail. Guides; 'The wafer transfer unit includes a rail car movably attached to the side rail, a wafer transfer arm assembly is used to manipulate the semiconductor wafer, and an electromagnet is mounted on the rail car in a cooperative relationship to connect the magnetic part for The conveying unit is moved along the guide rail; and an angle adjusting mechanism is used to adjust the angular direction of the wafer conveying arm assembly of the horizontal plane relative to the guide rail of the rail. 1 6 · Conveying system as described in item 15 of the scope of patent application, and 4 t L Γ. In IK n ΙΪ nn-n ft In 11- 1 1 _ I 4 (Please read the precautions on the back before filling (This page) The inversion of this paper applies the Chinese National Standard (CNS) A4 (21ϋχ297 公 f) 4 A8B8C8D8 6. The scope of patent application and further includes: a plurality of actuators respond to control signals to control the conveying unit And the position of the transport arm assembly; a plurality of sensors are used to detect the position of the transport unit and the transport arm assembly. 17. The conveying system as described in item 16 of the scope of patent application, and further comprising: a controller placed away from the conveying unit, the controller responding to the signal received by the sensor and providing a control signal to the The actuator is used to guide the movement of the transfer unit and the transfer arm assembly; and to guide the movement of the transfer unit and the transfer arm assembly; and the communication link is interposed between the wafer transfer unit and the controller to facilitate the wafer transfer Control of unit operation. 1 8 _ The conveying system according to item i 7 of the scope of patent application, wherein the communication link between the wafer conveying unit and the controller is an optical communication link. 19. The transport system described in item 18 of the patent application scope, wherein one of the optical communication links includes one or more fiber optic lines extending between the wafer transport unit and the controller. 2 ◦ The conveying system as described in item 15 of the scope of patent application and further includes: a cross rail is mounted on the frame and placed below the lateral rail parallel and perpendicular to the cross rail frame; the railcar is attached to the mobile Side guides ^ ___5 This paper size applies the Chinese Standard (cns) a4 rule ------- &lt; Please read the precautions on the back before filling this page) -I— -ir-ej1 n 1 I & lt Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4528 4 3 A8 B8 C8 D8, patent application scope 2 1 · Conveyor system as described in item 20 of the patent application scope, in which the rail car is attached to the side rails and with Individual lateral mounting rails are allowed to be erected. a -------- Order --------- line &锖; 锖 Please read the precautions on the back before filling in this page) Employees ’Co-operation of Intellectual Property Bureau of the Ministry of Economy Du Yin S1S. This paper standard applies China National Standard (CNS) A4 specification (210 497 mm)