JP2001518710A - Semiconductor processing apparatus having a linear conveyor system - Google Patents

Abstract

(57) Abstract A transport system for manipulating semiconductor wafers in a processing tool (10) is described. The system includes a transport unit guide (66) disposed within the processing tool (10) to support the wafer transport unit (61) as the wafer transport unit moves between the first and second positions. Contains. The transport unit guide (66) includes a frame (65), a horizontal guide rail (63) installed on the frame (65), and the transport unit guide (66) near the horizontal guide rail (63). It has a series of deployed magnetic segments (71, 74). The wafer transfer unit (62) includes a tram (84) translatably mounted on the lateral guide rail (63) and a wafer transfer arm assembly (86) for manipulating the semiconductor wafer. An electromagnet is mounted on the tram to cooperate with the magnetic segments (71, 74) to move the transfer unit (62) along the guide rail (63). An actuator is used to control the position of the transfer unit (62) and the transfer arm assembly (86), and a sensor is used to determine the position of the transfer unit (62) and the transfer arm assembly (86). (91) is used. A controller (101) is located remotely from the wafer transfer unit (62) and uses the actuator to control the movement of the transfer unit (62) and the transfer arm assembly (86) in response to the sensor (91). Lead. A communication link has been established between the actuator, the sensors, and the controller. Preferably, the communication link is an optical fiber link.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[Citation of related application]

This application is incorporated herein by reference. S. S. N. (USS
N.) _ {Corporate Docket No. # P-96-0018} and U. S. S. N. (USSN) _ {Corporate Docket No. (P) 96-0011} is a continuation-in-part application.

[0002]

[Description of research or development sponsored by the United States]

 Not applicable.

[0003]

TECHNICAL BACKGROUND OF THE INVENTION

In the production of semiconductor integrated circuits and other semiconductor articles from semiconductor wafers, it is necessary to provide a large number of metal layers on the wafer that serve as interconnect metallizations that interconnect the various components on the integrated circuit. Often there is. conventionally,
Aluminum has been used for this interconnect; however, it is now recognized that copper metallization is preferred.

[0004] Applying copper onto semiconductor wafers has proven to be a major technical challenge. At present, commercialization of copper metallization has not been achieved due to the practical problems of forming a copper layer on a semiconductor device in a reliable and cost-effective manner. This is due, in part, to the relative difficulty of performing reactive ion etching or other selective removal of copper at appropriate manufacturing temperatures. The selective removal of copper is desirable to form a patterned layer and to provide an electrically conductive interconnect between adjacent layers of the wafer or another wafer.

[0005] Because reactive ion etching cannot be used efficiently, the industry has referred to the holes in which the pattern of copper is desired, more commonly referred to as vias, but as trenches and others. The recesses (recesses) used in the damask (damasce
ne) have sought to overcome the problem of forming a patterned copper layer by using an electroplating process. In the damascene process, the wafer is first provided with a metal seed layer that is used to conduct current during a subsequent metal electroplating process. The seed layer is a very thin metal layer, which is one of several steps.
Can be attached using more than one. For example, the seed layer of metal can be deposited using a physical or chemical vapor deposition process to create a layer on the order of 1000 angstroms. The seed layer is advantageously formed of copper, gold, nickel, palladium, and most or all other metals. The seed layer is formed on entangled surfaces in the presence of vias, trenches or other recessed device features. This entangled nature of the exposed surface makes it more difficult to form the seed layer in a uniform manner. The non-uniformity of the seed layer can cause fluctuations in the current coming from the exposed surface of the wafer during the next electroplating step. This, in turn, will lead to non-uniformities in the copper layer that is subsequently electroplated on the seed layer. Such non-uniformity may cause deformation (defo) in the final semiconductor device to be formed.
rmity) or failure (failure).

In a damascene process, the copper layer electroplated on the seed layer is in the form of a blanket layer. The blanket layer is plated to the extent that it forms an overlying layer with the goal of filling the trench or bias and providing a complete copper layer extending over these features. These blanket layers are typically 10,000-15,000 angstroms (1-1.5 micrometers).
Of the order of magnitude.

[0007] The damascene process also includes the removal of excess metal material outside the vias, trenches or other recesses. The metal is removed to provide a final patterned metal layer in the semiconductor integrated circuit being formed. The excess plating material is, for example,
It can be removed using chemical mechanical planarization. Chemical mechanical planarization is a process that uses the combined action of a chemical remover and an abrasive to grind and polish the exposed metal surface to remove unwanted portions of the metal layer applied during the electroplating process. It is a process.

[0008] Automation of the copper electroplating process was elusive, but the art includes:
There is a need for an improved semiconductor plating system that can produce a copper layer on a semiconductor article that is uniform and can be efficiently and cost effectively manufactured. In particular,
There is a substantial need to provide an effective, reliable and automated copper plating system.

[0009]

Summary of the Invention

Describes a transport system for manipulating semiconductor wafers within a processing tool. The system includes a transport unit guide disposed within the processing tool to support the wafer transfer unit as the wafer transfer unit moves between a first position and a second position. The transport unit guide comprises a frame, lateral guide rails mounted on the frame, and a series of magnetic segments disposed on the transport unit guide proximate to the lateral guide rail. Contains. The wafer transfer unit includes a tram translatably mounted on the lateral guide rail and a wafer transfer arm assembly for manipulating the semiconductor wafer. An electromagnet is mounted on the tram in cooperation with the magnetic segment to move the transfer unit along the guide rail. An actuator is used to control the position of the transfer unit and the transfer arm assembly to measure the position of the transfer unit and the transfer arm assembly (de)
Sensors are used for termining). A controller is located remote from the wafer transfer unit and directs movement of the transfer unit and transfer arm assembly using the actuator in response to the sensor. A communication link is established between the actuator, the sensor, and the controller. Preferably, the communication link is an optical fiber link.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, a preferred embodiment of the present invention for a semiconductor wafer processing tool 10 is shown. The processing tool 10 includes an interface portion 12 and a processing portion 14.
And A semiconductor wafer cassette 16 including a plurality of semiconductor wafers, generally called W, is connected to the processing tool 10 through the interface portion 12.
Loaded into or unloaded from. In particular, the wafer cassette 16 is preferably loaded or unloaded through at least one port, such as a first port 32, in the exterior facing wall of the processing tool 10. An additional second port 33 may be provided in the interface portion 12 of the processing tool 10 to improve access, and port 32 may be used as input and port 33 may be used as output. .

Each powered door 35, 36 is used to cover the access port 32, 33, thereby isolating the interior of the processing tool 10 from the clean room. Each door 35, 36 includes two parts. The upper and lower portions move up and down, respectively, into the front surface of the processing tool 10 to open the ports 32, 33 and allow access therein.

The wafer cassette 16 is typically used for transporting a plurality of semiconductor wafers. The wafer cassette 16 is oriented to supply the semiconductor wafer in a standing or vertical position during transport of the semiconductor wafer into or out of the processing tool 10. Is preferred.

The outwardly facing surface of the processing tool 10 is advantageously cleaned to minimize the number of harmful contaminants introduced into the processing tool 10 during insertion and removal of the wafer cassette 16. Join to the room. In addition, a plurality of wafer cassettes 1
6 is the opening of ports 32, 33 to the clean room environment and the processing tool 10;
May be introduced into the processing tool 10 and removed therefrom in a single pass to minimize exposure of the tool.

The interface portion 12 is joined to a processing portion 14 of the processing tool 10. The processing section 14 includes a plurality of semiconductor wafer processing modules for performing various semiconductor processing steps. In particular, the embodiment of the processing tool 10 shown in FIG. 1 includes a plating module 20 that forms a first lateral surface of the processing portion 14. The processing portion 14 of the tool 10 advantageously includes additional modules, such as a pre-wet module 22 and a resist strip module 24 opposite the plating module 20. .

Alternatively, other modules for performing additional processing functions may also be included in the processing tool 10. The particular processing performed by the processing modules of the processing tool 10 may be of different or similar nature. Various liquid and gas treatment processes can be used in various orders. The processing tool 10 is particularly advantageous in that it allows a series of complex processes to be performed in series with different processing modules set for different processing solutions. All processing requires no human handling and can be advantageously achieved in a very well-controlled workspace 11, thus reducing the handling time of human operators and the chance of fouling of the semiconductor wafer.

The processing modules of the processing tool 10 are preferably modular, interchangeable, and stand-alone units. The processing functions performed by the processing tool 10 may be changed after the processing tool 10 is installed, increasing flexibility and providing room for change in the processing method. Additional wafer processing modules may be added to the processing tool 10 or may replace the current processing module 19.

The processing tool 10 of the present invention preferably includes a rear closure surface 18 joined to the lateral side of the processing tool 10. Advantageously, as shown in FIG. 1, an air supply 26 is provided immediately opposite the processing module of the processing section 14. The interface portion 12, the side of the processing portion 14, the closing surface 18,
The air supply 26 preferably provides a work space 11 enclosed within the processing tool 10. The air supply 26 may include a duct coupled to the filtered air source (not shown) to supply clean air into the processing tool 10. More specifically, the air supply 26 may include a plurality of vents intermediate the processing module 19 to introduce clean air into the workspace 11.

Referring to FIG. 16, circulated clean air and contaminants therein (
Exhaust ducts 58, 59 are provided adjacent to the frame 65 of the wafer transport unit guide 66 to remove contaminants. Exhaust ducts 58, 59 may be coupled with each of the processing modules 19 to draw clean air supplied therethrough. In particular, clean air is supplied to the air supply unit 26.
Is supplied to the work space 11 of the processing tool 10 via the The air is exhausted to its shelf by an exhaust fan (not shown) coupled to the output of exhaust ducts 58,59.
elf) or via a plurality of vents 57 formed in a process deck, near the wafer transport units 62 and 64 and into the processing module 19. Each processing module 19 in the processing tool 10 may be directly connected to the ducts 58,59. The air may be drawn from the ducts 58, 59 of the processing tool 10 through the rear closure surface 18 or the bottom of the surface of the processing tool 10. Providing an enclosed workspace and controlling the environment within the workspace greatly reduces the presence of contaminants within the processing tool 10.

Each of the processing modules is advantageously accessed through an outer panel of a respective module that forms a side of the processing tool 10. The lateral side of the processing tool 10 may be adjacent to a gray room environment. Gray rooms have less vigilance for contamination compared to the clean room. Use of this configuration allows access to the processing components and electronics of each wafer module of the processing tool 10 that requires routine maintenance while reducing plant costs.

A user interface 30 may be provided on the front side facing out of the processing tool, as shown in FIG. The user interface 30 is the processing tool 1
Advantageously, it is a touch screen type cathode ray tube control display that allows finger contact with the display screen to provide various control functions within zero. An additional user interface 30 may be provided at the rear of the processing tool 10 or within a separate processing module so that operation of the processing tool 10 may also be provided from an alternate location around the processing tool 10. Further, a portable user interface 30 may be provided to allow an operator to move around the processing tool 10 and view the operation of the processing components therein. The user interface 30 may be used to teach designated functions and operations to the processing module 19 and semiconductor wafer transport units 62, 64.

Each module 20, 22, 24 in the processing tool 10 preferably includes a window 34 that allows for a visual inspection of the operation of the processing tool 10 from the gray room. In addition, vents 37 are advantageously provided in the top surface of each processing module 20,22,24. The electronics of the processing module are preferably located adjacent to the vent 37 which allows the circulating air to dissipate the heat generated by such electronics.

The workspace 11 within the interface portion 12 and the processing portion 14 of one embodiment of the processing tool 10 is shown in detail in FIG.

The interface section 12 includes two interface modules 38, 39 for manipulating the wafer cassette 16 in the processing tool 10. The interface modules 38 and 39 are connected to the access ports 32 and 3 respectively.
The wafer cassette 16 is received through 3 and the wafer cassette 16 is stored for further processing of the semiconductor wafer therein. In addition, the interface modules 38 and 39 store the wafer cassettes for removal from the processing tool 10 when processing of the semiconductor wafers in the respective wafer cassettes 16 is completed.

Each of the interface modules 38 and 39 includes a wafer cassette turnstile 40, 41 and a wafer cassette elevator 42,
43 may be included. Generally, the wafer cassette turn styles 40, 41
Replaces the wafer cassette 16 from a stable vertical orientation to a horizontal orientation where access to the semiconductor wafer is improved. Each wafer cassette elevator 42, 4
3 has respective wafer cassette support portions 47 and 48 for holding the wafer cassette 16. Each of the wafer cassette elevators 42 and 43 is used to position the wafer cassette 16 resting thereon at either the transfer position or the unloading position. The operation of the wafer interface modules 38, 39 will be described in detail below.

In a preferred embodiment of the present invention, the first wafer interface module 3
8 may function as an input wafer cassette interface for receiving unprocessed semiconductor wafers into the processing tool 10. The second wafer interface module 39 may function as an output wafer cassette interface for holding processed semiconductor wafers for removal from the processing tool 10. The wafer transport units 62 and 64 in the processing tool 10 access the wafer cassette 16 held by one of the wafer interface modules 38 and 39. Such an arrangement facilitates the transfer of semiconductor wafers through the processing tool 10.

The semiconductor wafer conveyor 60 is shown in FIG. 2 between the processing modules 20, 22 and 24 and the interface modules 38 and 39. The wafer conveyor 60 includes wafer transport units 62 and 64 for transferring individual semiconductor wafers W between each of the wafer interface modules 38 and 39 and the wafer processing module 19.

The wafer conveyor 60 is connected to the wafer transport unit 62 in the processing tool 10.
, 64, including a transport unit guide 66, such as a long rail, forming a plurality of paths 68,70. The wafer transport unit 62 on the first pass 68 may pass by the wafer transport unit 64 located on the second pass 70 during the movement of the transport units 62, 64 along the transport guide 66. The processing tool 10 may include additional wafer transport units to facilitate transfer of semiconductor wafers W between the wafer processing modules 20, 22, 24 and the wafer interface modules 38, 39.

More specifically, the second arm extension 88 may support the semiconductor wafer W via a vacuum support 89. The appropriate wafer transport units 62 and 64 approach the wafer support 401 by moving along the transport unit guide 66. After reaching an appropriate position along the guide 66, the first extension 87 and the second extension 88
Rotates to approach the wafer support 401. The second extension 88 is positioned on the wafer support 401 and then the wafer support 40
1 down to the engaging finger assembly 409. The vacuum is removed from the vacuum support 89, and the finger assembly in the processing module grips the semiconductor wafer W positioned therein. The second extension 88 descends and is removed from under the semiconductor wafer held by the wafer engaging finger.

Following completion of the processing of the semiconductor wafer in the appropriate processing module 20,22,24, a wafer transport unit 62,64 retrieves the wafer and removes the wafer from another processing module 20,22. , 24 or return the wafer to a wafer cassette 16 for storage or removal from the processing tool 10.

Each of the wafer transport units 62, 64 accesses a wafer cassette 16 adjacent to the conveyor 60 for collecting semiconductor wafers from the wafer cassette 16 or depositing semiconductor wafers therein. In particular, FIG. 2 shows a wafer transport unit 62 that pulls a semiconductor wafer W from the wafer cassette 16 onto the elevator 42. More specifically, the second extension 8
8 and the vacuum support 89 connected thereto are inserted into the wafer cassette 16 positioned at the pull-out position. The second extension 88 and the vacuum support 89 enter under the lower surface of the bottom semiconductor wafer W held by the wafer cassette 16. Once the support 89 is positioned below the center of the semiconductor wafer W being removed, vacuum is applied via the vacuum support 89. The second extension 88, the vacuum support 89, and the semiconductor wafer W attached thereto are slightly lifted via the transfer arm elevator 90. Finally, the first extension 8
7 and the second extension 88 are rotated to remove the semiconductor wafer W from the wafer cassette 16. The wafer transport units 62 and 64 then send the semiconductor wafer W to the wafer processing module 19 for processing.

Thereafter, the wafer transport unit 62 adjoins the appropriate processing modules 20, 22, 24 along a path 68 to deposit the semiconductor wafer on the wafer processing support 401 for processing the semiconductor wafer. Proceed to the position you want.

Interface Module Referring to FIGS. 3-8, the operation of the interface module 38 is shown in detail. The following description is limited to the wafer interface module 38, but is applicable to the wafer interface module 39 as long as each interface module 38, 39 operates in substantially the same manner.

Preferably, the first wafer interface module 38 and the second wafer interface module 39 function as respective semiconductor wafer cassette 16 input modules and output modules of the processing tool 10. Alternately, both modules can function as both inputs and outputs. More specifically, a wafer cassette 16 holding unprocessed semiconductor wafers is brought into the processing tool 10 via port 32 and until the semiconductor wafers are to be removed from the wafer cassette 16 for processing. It is temporarily stored in the first wafer interface module 38. The processed semiconductor wafers can be temporarily stored and / or removed from the processing tool 10 by a wafer transport unit 62,
The wafer is sent to the wafer cassette 16 in the second wafer interface module 39 via the second wafer interface module 64.

The wafer interface modules 38, 39 may be directly accessed by each of the wafer transport units 62, 64 in the processing tool 10 for transporting semiconductor wafers therebetween. A plurality of wafer cassette interface modules 38, 3 accessible by each wafer transport unit 62, 64
The provision of 9 facilitates the transport of the semiconductor wafer W through the processing tool 10 of the present invention.

Each wafer interface module 38, 39 preferably includes a wafer cassette turn style 40 and a wafer cassette elevator 42 adjacent thereto. The access ports 32, 33 are adjacent to the respective wafer cassette turn styles 40, 41. The wafer cassette 16 contains the processing tool 10.
Or may be removed therefrom via ports 32,33.

The wafer cassette 16 is placed in the cassette tray 5 before being sent out into the processing tool 10.
It is preferably placed in a vertical position on zero. Cassette tray 50 is shown in detail in FIG. The vertical position of the wafer cassette 16 and the semiconductor wafer therein provides a stable orientation for holding the semiconductor wafer in the wafer cassette 16 for transport.

Each of the wafer cassette turn styles 40 and 41 is formed of a wafer cassette 16.
It is preferred to include two saddles 45, 46 configured to hold Providing two saddles 45,46 allows two wafer cassettes 16 to be placed into or removed from the processing tool 10 during a single opening of each access door 35,36. This minimizes exposure of the work space 11 within the processing tool 10 to the clean room environment.

Each saddle 45, 46 has two forks that can engage with the cassette tray 50. The saddles 45, 46 are powered by a motor in the wafer cassette turn style shaft 49 to position the wafer cassette 16 in a horizontal or vertical orientation. The wafer cassette 16 and the semiconductor wafer therein are oriented vertically for passage through the access ports 32, 33, and the transfer or withdrawal position that provides access to the wafer transport units 62, 64 therein. Is preferably oriented horizontally.

In FIG. 3, the wafer cassette 16 is held by a wafer cassette turn style 40 and is also referred to as a wafer cassette 15.
n) {here also referred to as the load position}. The semiconductor wafer in the wafer cassette 16 at the holding position is stored for the next processing. Alternatively, the semiconductor wafer in the wafer cassette 16 in the holding position may be stored for subsequent removal from the processing tool 10 through access ports 32,33.

Referring to FIG. 3, the wafer cassette 16 supported by the wafer cassette elevator 42 and also referred to as the wafer cassette 17 is pulled out (ex.
in a traction position or an exchange position. Semiconductor wafers are either removed from or placed into wafer cassettes 16 located in the draw-out position via wafer transport units 62, 64.

The wafer cassette turn style 41 and the wafer cassette elevator 42 are used to transfer the wafer cassette 17 having the semiconductor wafer processed therein from the extraction position to a holding position for removal from the processing tool 10. Replace the wafer cassettes 15 and 17. In addition, such an exchange transfers a wafer cassette 15 having unprocessed semiconductor wafers therein from the holding position to the withdrawal position which provides wafer transport units 62, 64 access to the semiconductor wafers therein.

The replacement of the wafer cassettes 15 and 17 will be described with reference to FIGS. Specifically, a saddle 46 is positioned beneath the powered shaft 44 of the wafer cassette elevator 42. The shaft 44 is coupled to a powered wafer cassette support 47 to hold the wafer cassette 16. The shaft 44 and the wafer cassette support 47 attached thereto are lowered as shown in FIG. 4 and the shaft 44 passes between the forks of the saddle 46.

Referring to FIG. 5, the motor in the shaft 44 rotates the wafer cassette support 47 about an axis passing through the shaft 44, and the wafer cassette 17 on the wafer cassette 17 is held by the wafer cassette turn style 40. It is supplied in the opposite relationship to the cassette 15. Both saddles 4 of wafer cassette turn style 40
5, 46 are then tilted to a horizontal orientation as shown in FIG. The shaft 44 of the wafer cassette elevator 42 is then lowered and the wafer cassette 17 is brought into engagement with the saddle 46 depicted in FIG. The shaft 44 and the wafer cassette support 47 are lowered by an additional amount to cancel the rotation of the wafer cassette 16. Referring to FIG. 8, the wafer cassette turn style 40 is rotated by 180 degrees in order to exchange the wafer cassettes 15 and 17.

The wafer cassette 17 with the processed semiconductor wafers therein is now accessible via the port 32 for removal from the processing tool 10. The wafer cassette 15 with the unprocessed semiconductor therein is now positioned to engage with the wafer cassette support 47. The transfer process shown in FIGS. 3-8 may be reversed to lift the wafer cassette 15 into the withdrawal position which provides access of the semiconductor wafer to wafer transport units 62, 64.

FIG. 10 illustrates one way the device 10 can be modularized. As illustrated, the apparatus 10 comprises an input / output assembly 800, left and right processing modules 805, 810, a wafer conveyor system 60, a top exhaust assembly 820, and an end panel 825. As illustrated, the left and right processing modules 805, 810 may be mutually attached around the wafer transfer system 60 to form a processing chamber having an inlet 830 and an outlet 835. A plurality of these processing modules are thus configured end-to-end (in an end-to-end con
figuration) providing an elongated processing chamber which may be mounted thereby allowing each wafer to perform substantially multiple processes, or alternatively, process multiple wafers simultaneously. In such a case, the wafer transport system 60 of one apparatus 10 is programmed to cooperate with the wafer transport system 60 of one or more, previous or next transport systems 60.

FIG. 11 illustrates one way of arranging the processing heads in the apparatus 10.
In this embodiment, the processing module 805 on the left is an electrochemical
three processing heads dedicated to rinsing and drying each wafer after cal deposition) and two processing heads for performing the wetting of the wafer prior to electrochemical deposition; Consists of Generically, the left processing module 805 pre-treats the wafer against electrochemical copper deposition (pr
Configure a support module with a processing head used for e-processing and post-processing. The right module 81
O generally comprises five reactor heads that make up the plating module and are dedicated to electrochemical copper deposition. In the embodiment of FIG. 11, to ensure a unique orientation of the thickness of each wafer when it is processed in the apparatus (to e
nsure thickness proper orientation) A wafer alignment station 850 is provided. The alignment of wafers can be done by using the registration mark on each wafer (regist
ration mark or the like).

FIGS. 12 and 13 illustrate embodiments of the left and right processing modules 805 and 810, respectively. In these figures, the outer portions of each housing have been removed, thereby exposing various system components. Preferably, electronic components such as power supplies, controllers, etc. are located in the upper portion of each of the processing modules 805, 810, while moving components, etc., are located in the lower portion of each of the processing modules. Good.

FIG. 14 is a perspective view from the inside of the device 10 of the input module 800 with its panel removed. FIG. 15 provides a similar view of the input module 800 with respect to the exterior of the device 10. In the illustrated embodiment, the wafer alignment station 850 and wafer alignment controller 860 are provided in the input module 800. A robot controller 865 used to control the wafer transfer system 60 is also located therein. To keep the tracks of the wafer as they are processed, the input module 800 includes one or more wafer mapping sensors 870 that detect that the wafer is in each cassette. It is provided. Other components of the input module 800 include a system control computer 875 and a four-axis controller 880. The system control computer 875 is generally responsible for coordinating all operations of the device 10.

Semiconductor Wafer Conveyor The processing tool 10 includes a semiconductor wafer conveyor 60 for transporting semiconductor wafers through the processing tool 10. Preferably, the semiconductor wafer conveyor 60 may access each wafer cassette interface module 38, 39 and each wafer processing module 19 in the processing tool 10 to transfer the semiconductor wafer therebetween. This includes processing modules from both sides.

One embodiment of the wafer conveyor system 60 is depicted in FIG. The wafer conveyor 60 includes a wafer transport unit guide 66, which preferably has a long spine or rail mounted on a frame 65. Alternatively, the transport unit guide 66 may be formed in a track or any other shape to guide the wafer transport units 62, 64 thereon. The length of the wafer conveyor 60 may vary, and the wafer transport unit 6 to each interface module 38,39 and processing module 20,22,24.
It may be configured to allow 2, 64 accesses.

The wafer transport unit guide 66 is connected to the wafer transport unit 6
2, 64 moving paths 68, 70 are formed. Referring to FIG. 16, the spine of the transport unit guide 66 includes guide rails 63 and 64 installed on opposite sides thereof. Each semiconductor wafer transport unit 62, 64 is preferably engaged with a respective guide rail 63, 64. Each guide rail can mount one or more transport units 62,64. Extensions 69, 75 may be secured to opposing sides of the guide 66 to provide stability for the transport units 62, 64 thereto and to protect the guide 66 from wear. Each wafer transport unit 62, 64 includes a roller 77 configured to ride along a respective extension 69, 75 of a guide 66.

The wafer conveyor 60 is connected to the interface module 38 in the processing tool 10.
, 39 and the processing modules 20, 22, 24 may be formed in an alternating configuration. The ducts 58, 59 are preferably in fluid communication with an exhaust fan that removes extensions from each wafer processing module 19 and circulating air from the work space 11 of the processing tool 10.

Each wafer transport unit 62, 64 is powered along a respective path 68, 70 by a suitable driver. More specifically, a drive operator 7 on each side of the transport unit guide 66 to provide controllable axial movement of the wafer transport units 62, 64 along the transport unit guide 66.
1,74 are installed.

The drive operators 71, 74 provide a magnetic linear motor for providing precise positioning of the wafer transport units 62, 64 along guides 66.
magnetic motor). In particular, the drive operators 71 and 74 are preferably brushless DC linear motors. Such a preferred drive operator 71, 74 has a series of magnetically interacting electromagnets 79 mounted on the wafer transport units 62, 64 to propel the unit along the transport unit guide 66. A magnetic segment (a se
ries of angled magnetic segments).

Cable guards 72, 73 are coupled to the respective wafer transport units 62, 64 and frame 65 to protect communication and power cables therein. The cable guards 72, 73 include a plurality of interconnected segments to allow for full range movement of the wafer transport units 62, 64 along the transport unit guide 66.

As shown in FIG. 17, a first wafer transport unit 62 is coupled to a first side of the spine of a guide 66. Each wafer transport unit 62, 64 includes a linear bearing 76 for engagement with a linear guide rail 63, 64. In addition, the wafer transport units 62, 64 preferably each include a horizontal roller 77 to engage and provide stability with extensions 69 formed on the spines of the guide 66.

FIG. 17 additionally shows the electromagnet 79 of the first wafer transport unit 62 installed at a position that magnetically interacts with the drive actuator 71. Drive actuator 71 and electromagnet 79 provide axial movement and directional control of the wafer transport units 62, 64 along the transport unit guide 66.

Semiconductor Wafer Transport Unit A preferred embodiment of the semiconductor wafer transport units 62 and 64 of the wafer conveyor 60 will be described with reference to FIGS.

In general, each wafer transport unit 62, 64 supports a movable carriage or tram 84 coupled to a respective side of the transport unit guide 66 and a semiconductor wafer W. A wafer transfer arm assembly 86 movably connected to the tram 84; and a wafer transfer arm elevator 90 for adjusting the elevation of the transfer arm assembly 86 relative to the tram 84.

Referring to FIG. 18, a cover 85 surrounds the portion of the tram 84 facing away from the transport unit guide 66. Tram 84 includes linear bearings 76 for engaging respective guide rails 63, 64 mounted on transport unit guide 66. Linear bearings 76 hold the tram 84 in fixed relation to the transport unit guide 66 and allow axial movement of the tram 84 along it. Rollers 77 are engaged with respective extensions 69 to prevent rotation of the tram 84 about the guide rails 63, 64 and to provide stability of the wafer transport unit 62. The electromagnet 79 is also shown coupled to the tram 84 at a location that magnetically interacts with the drive actuators 71, 74 of the respective transport units 62, 64.

The wafer transfer arm assembly 86 extends above the top of the tram 84. The wafer transfer arm assembly 86 may include a shaft 83 and a first arm extension 87 coupled at a first end thereof. Second arm extension 8
8 is advantageously connected to the second end of the first extension 87. The first arm extension 87 rotates 360 degrees about the shaft 83 and the second arm extension 88 comprises the first and second arm extensions 87.
, 88 may be rotated 360 degrees about an axis 82 passing through the shaft connecting them.

Preferably, the second extension 88 is provided with a wafer support 89 at its distal end for supporting the semiconductor wafer W during its transport along the wafer conveyor 60. Preferably, the transfer arm assembly 86 includes a chamber coupled to the wafer support 89 for applying a vacuum thereto and holding a semiconductor wafer W thereon.

Adjustable lifting of the transfer arm assembly 86 and the first arm extension 8
7 with rotation about the axis of the shaft 83 and rotation of the second extension 88 about the axis 82, so that the transfer arm 86 has the respective semiconductor wafer holders 810 of all the processing modules 19 and the processing tool 10. Allows access to each of the wafer cassettes 16 held by the interface modules 38, 39 therein. Such access allows the semiconductor wafer transport units 62, 64 to transfer semiconductor wafers therebetween.

The cover 85 has been removed from the wafer transport unit shown in FIG. 19 to represent a wafer transport arm elevator 90 coupled with a tram 84 and a transport arm assembly 86. The transfer arm elevator 90 is connected to the wafer support 89
The vertical position of the transfer arm assembly 86 with respect to the tram 84 is adjusted during the process of transferring the semiconductor wafer between the wafer cassette 16 and one of the wafer holders 810 and the wafer cassette 16.

The path position of the tram 84 of each of the wafer transport units 62 and 64 along the transport unit guide 66 is precisely determined using a position indicating array, such as a CCD array 91 shown in FIG. Is controlled. In one embodiment of the processing tool 10, each semiconductor wafer holder 810 in the processing module 19 is adapted to direct a light beam toward the transport unit guide 66 as shown in FIG.
Have a corresponding light or other beam emitter 81 mounted on the surface of the light source. The light emitter 81 may represent a continuous beam or, alternatively, may be configured to generate a beam as the wafer transport units 62, 64 approach their respective wafer holders 810.

The transfer arm assembly 86 includes a CCD (CCD) array 91 positioned to receive the laser beam generated by the light emitter 81. A position indicating array 91 on the shaft 83 detects the presence of the light beam to determine the position of the tram 84 along the transport unit guide 66. The position accuracy of the wafer transport unit position indicator is preferably in the range of less than about 0.1 millimeter (less than 0.003 inches).

A second embodiment of a wafer transport unit 562 b is shown in FIGS. 20-25 and likewise, a movable carriage or tram 584 coupled to each side of the transport unit guide 66 and a semiconductor A wafer transfer arm assembly 586 movably connected to the tram for supporting a wafer W; and a wafer transfer arm elevator 590 for adjusting the elevation of the transfer arm assembly 586 relative to the tram 584. It is provided. Cover 585 is tram 584
The part is surrounded. Tram 584 includes linear bearings 576 for engaging respective guide rails 63, 64 mounted on transport unit guide 66. The linear bearing 576 connects the tram 584 to the transport unit guide 66.
To maintain a fixed relationship with respect to and allow axial movement of the tram 584 along it. An electromagnet 579 magnetically interacts with the guide 66 to drive the actuators 71,74.

A wafer transfer arm assembly 586 extends above the top of tram 584. The wafer transfer arm assembly 586 includes a first arm extension 587 coupled at a first end thereof to a shaft 583. A second arm extension 5 having a wafer support 589 for supporting the semiconductor wafer W;
88 is advantageously coupled to the second end of the first extension 587. The first arm extension 587 has a 36
The second arm extension 588 may rotate 360 degrees about an axis 582 passing through a shaft connecting the first and second arm extensions 587, 588.

As in the first embodiment, an adjustable elevation of the transfer arm assembly 586, a rotation of the first arm extension 587 about the axis of the shaft 583, and a second rotation about the axis 582. Having two rotations of the extension 588 allows the semiconductor wafer transport units 562a, 562b to transport semiconductor wafers therebetween.

As shown in FIG. 21, cover 585 has been removed from wafer transport unit 562 b, revealing wafer transfer arm elevator 590 and transfer arm assembly 586 coupled to tram 584. Transfer arm elevator 590 adjusts the vertical position of transfer arm assembly 586 relative to tram 584 during transfer of the semiconductor wafer.

In a second embodiment of the wafer transport units 562a, 562b, an optical fiber communication path, such as a fiber optic filament, is provided.
It has replaced the wires 72, 73 to the wafer transport unit through the DA converter substrate 540 on each of the wafer transport units 562a, 562b. The use of fiber optics relative to the wire harness is based on the transport units 562a, 562.
reduce the inertial mass of b and improve reliability. Preferably, such communication occurs between the transfer unit and the system controller 875.

Each wafer transport unit 562a, 562 along the transport unit guide 66
The path and operating position of the tram 584 in FIG. 3B is a combination of an encoder that provides position information in triaxial space regarding the position of the tram 584, the transfer arm assembly 586, and the second extension 588. Using precisely controlled. An absolute encoder whose position is indicated by 591 is located in the elevator 590.
One absolute encoder, the tape order brew (TPOW), is shown at 592 and is located within the base motor 593 of the shaft 583. One absolute encoder
A TPOW is shown at 594 and is located within the shaft 583. A wrist absolute encoder whose position is indicated by 595 (wrist absolu
The te encoder is located at the distal end of the transfer arm assembly 586. An elbow absolute encoder, TPOWISA, 597 is mounted on the base of the shaft 583. The lift absolute encoder 596 is arranged along the base motor 593. Linear encoder 598, head rail encoder 599, and track seed data (
A CCD) array absolute encoder 541 is located on the base plate 203 of the base of the tram 584, the latter of which is shown in FIG.
9 to detect the beam radiator 81 installed on the surface.
The above allows for precise and reliable positioning accuracy.

The wafer transport unit is installed as shown in FIG. As illustrated, the wafer conveyor 560 includes a wafer transport unit guide 566 including long spines or rails mounted on a frame 565. Wafer transport unit guide 566 provides a path 56 for movement of wafer transport units 544a, 544b.
8, 570 are formed. The spines of the transport unit guide 566 are composed of upper guide rails 563a and 564a and lower guide rails 5 installed on opposite sides thereof.
63b and 564b. Each semiconductor wafer transport unit 544a, 54
4b preferably engages each of the upper guide rails 563a, 564a and the lower guide rails 563b, 564b. Each pair of upper and lower guide rails can carry one or more transport units 544a, 544b.

Each of the wafer transport units 544 a and 544 b is connected to the transport unit guide 56.
6. Power along the respective paths 568, 570 by drive operators 571, 574 located on each side of the transport unit guide 566 to provide controllable axial movement of the wafer transport units 544a, 544b along line 6. Is given. The drive operators 571, 574 may be magnetic linear motors to provide precise positioning of the wafer transport units 544a, 544b along guides 566, and may also include units along the transport unit guides 566. Using a series of angled magnetic segments that magnetically interact with respective electromagnets 579 located on each of the wafer transport units 544a, 544b to drive the It may be a DC linear motor.

The fiber optic cable guards 572, 573 provide communication with the respective wafer transport units 544a, 544b and protect the fiber optic cables disposed therein. The cable guards 572 and 573 are connected to the transport unit guide 56.
6 may include a plurality of interconnected segments that allow for full range movement of the wafer transport units 544a, 544b.

As shown in FIG. 22, the wafer transport units 544 a and 544 b are provided with guides 566.
Along each side of the spine. Each wafer transport unit 544a
, 544b include upper linear bearings 576a for engaging upper linear guide rails 563a, 564a, respectively. Further, each wafer transport unit 544a, 544b includes a lower linear bearing 576b that engages a lower linear guide rail 563b, 564b to provide stability and a better equal distribution of the weight load on the rail. .

Referring to FIGS. 22-24, the upper and lower linear bearings 576a, 57
6b also provides a means by which the vertical axis of the wafer transfer arm assembly 586 extending above the top of the tram 584 is adjusted. It is important that during transfer of a wafer within the processing tool 10, the transfer arm assembly 586 rotate in a plane as close as possible to the absolute horizontal plane. To this end, the lower elbow housing 210 of the transfer arm assembly, shown in FIG. 25, mounted on the base plate 203 of the transport unit 544a has a tilt adjustment effect.

The lower elbow housing 210 can be seen in FIGS.
It is installed on the base plate 211 by an upper installation screw 212 and a lower installation screw 214. The base plate 211 is now fastened to the elevator motor 590 to raise or lower the transfer arm assembly 586, as better visible in FIG. As seen in FIG. 26, a corresponding, but slightly smaller, lateral groove 218 on the lower elbow housing 210
Embossed pivot 2 on the base plate 211 which engages with
16 are positioned laterally between the upper mounting screws 212. The pivot 216 is provided with the lateral groove 218 so as to provide a gap between the base plate 211 and the lower elbow housing 210 so that a tilt operation of about 0.95 degrees is possible between the base plate 211 and the lower elbow housing 210.
Is preferably given a dimension. One or more leveling screws 2
20 and the upper and lower mounting screws 212, 214 in combination, the lower elbow housing 210, and the angular orientation of the attached transfer arm assembly 586, during transfer of a wafer in the processing tool 10. The transfer arm assembly 586 can be adjusted and secured to provide rotation of the transfer arm assembly 586 as close as possible in the absolute horizontal plane.

In addition, the smooth operation of the wafer transport units 544a, 544b along the guide 566 is achieved by the driven operation of the lower linear bearing guide 576b.
t) Mounting is important. Providing such a passive attachment with the lower gearing guide 576b, preferably allowing a float of about 0.100 inches, is a passive fastening technique. Obtained by the use of A float pin 221 is positioned near the mounting screw 222, with an O-ring 223, preferably VITON, positioned near the float pin. As shown in FIG. 28, a lower bearing guide 576 is provided in a shouldered counterbore 224 of the base plate 203.
b when installed in the tapped hole 227 of FIG.
Faces the flange of the float pin 221 and the pin is now
Head to 23. The O-ring 223 then faces the shoulder 226 of the counterbore. However, even if the screw 222 is tightened, the guide 566
The lower bearing guide 576 to facilitate smooth movement over the entire
A relative movement between b and the base plate 203 is possible.

Control System Referring to FIG. 26, a control system 100 of the semiconductor wafer processing tool 10 is described.
Is shown. As illustrated, the control system 100 generally includes at least one grandmaster controller 101 for controlling and / or monitoring the overall function of the processing tool 10.

The control system 100 is preferably in a hierarchical configuration (in hierarchial configu
ration) should be deployed. The grand master controller 101 has a processor electrically connected to a plurality of subsystem control units as shown in FIG. The control subsystem preferably includes the corresponding equipment (ie, wafer conveyor 60, processing modules 20, 22, 24, interface module 3).
8, 39, etc.) should be controlled and monitored. The control subsystem is preferably an instructional command such as software code from each respective grandmaster controller 101, 102 or an operating instruction (ope).
ration instruction). The control subsystems 110, 113-119 preferably have respective grandmaster controllers 101.
, 102 may be provided with processing and status information.

More specifically, the grand master controller 101 is coupled to an interface module controller 110 that controls each of the semiconductor wafer interface modules 38.39. Further, the grand master controller 101 includes a conveyor controller 113 for controlling the operation of the wafer conveyor 60, and a plurality of processing module controllers 114 corresponding to the semiconductor wafer processing modules 20, 22 in the processing tool 10. 115. The processing tool 1 of the present disclosure
0 control system 100 includes an additional grandmaster controller 102 shown in FIG. 26 to monitor or operate additional subsystems, such as additional wafer processing modules via an additional processing module controller 119. May be. Preferably, four control subsystems are connected to each grandmaster controller 101,102. The grandmaster controllers 101, 102 are preferably connected together and each transfer processing data to the other.

Each grandmaster controller 101, 102 receives data and sends them to their respective modularized control subsystems 110-119. In a preferred embodiment of the control system 100, a bidirectional memory mapped device (bidi
A recombination memory mapped device is provided between the grandmaster controller and each modularized subsystem connected to it. In particular, the memory-mapped devices 160, 161, 162
1 and the master controller 13 in each interface module controller 110, the wafer conveyor controller 113, and the processing module controller 114.
0, 131, and 132.

Each memory-mapped device 150, 160-16 in the control system 100
2 is preferably a dual port RAM supplied by Cypress to store data synchronously. In particular, the ground master controller 101 may write data to a memory location corresponding to the master controller 130 and the master controller 130 may read the data at the same time. Alternatively, the grandmaster controller 101 may read data from a mapped memory device that is being written by the master controller 130. Using memory mapped devices 160-161 provides for data transfer at processor speed. A memory-mapped device 150 is preferably provided between the user interface 30 and the grandmaster controllers 101, 102 for transferring data therebetween.

Preferably, the user interface 30 is connected to the grandmaster controller 101.
, 102 are connected. The user interface 30 is advantageously located external to the processing tool 10 or at a remote location to provide information on the processing and status of the processing tool 10 to an operator. In addition, the operator can control sequences and processing instructions for the processing tool 10 via the user interface 30.
rectives). Preferably, the user interface 30 is supported by a general purpose computer in the processing tool 10. Preferably, the general-purpose computer includes a type 486, 100 MHz clock speed processor, although other processors may be used.

Each modularized control subsystem, including interface module controller 110, wafer conveyor controller 113, and each processing module controller 114-119, is preferably configured in a master / slave arrangement. The modularized control subsystems 110, 113-119 are housed in respective modules such as wafer interface modules 38, 39, wafer conveyor 60, or each of the processing modules 20, 22, 24. Is preferred. The grand master controller 101 and the corresponding master controllers 130, 131, 132 connected thereto are preferably a printed circuit board or IS (IS) installed in the user interface 30 supported by the general purpose computer.
A) It is preferably implemented on a substrate. Each grandmaster controller 101, 102 includes a 68EC000 processor supplied by Motorola, and each master controller 130 and slave controller in control system 100 are provided by Intel. It preferably includes the supplied 80251 processor.

As shown in FIGS. 27-30, each master controller 130, 131, 132 is connected to its respective slave controller via data links 126, 127, 129. Each data link 126, 127, 129 preferably includes an optical data medium such as an Optilink supplied by Hewlett Packard. However, data links 126, 127, 129 may include alternative data transfer media.

Referring to FIG. 27, the master / slave control subsystem for the interface module controller 110 is illustrated. The configuration of each master and associated slave is preferably one module within the processing tool 10 (ie,
(Interface, conveyor, processing). However, one master may control or monitor multiple modules. FIG.
The master / slave configuration depicted in and corresponding to the interface module controller 110 additionally includes another modularized control subsystem 113,
114 and 115 may be applied.

The grand master controller 101 is connected to the master controller 13 in the corresponding interface module controller 110 via the memory mapped device 160.
Connected to 0. The master controller 130 includes a plurality of slave controllers 140 and 14.
1, 142. Sixteen slave controllers become one master controller 130
Preferably, the slave controller is connected to -132 and each slave controller may be configured to control and monitor one motor or process component or multiple motors and process components.

The control system 100 of the processing tool 10 preferably uses a flash memory. When specified, each master controller 13 in the control system 100
The operating instructions or program codes for operating the 0-132 and slave controllers 140-147 are advantageously stored in the memory of the corresponding grand master controller 101. When the power is turned on, the grand master controller 1
01, 102 polls the corresponding master controller 130-132 and downloads the appropriate operating instruction program to operate each master controller 130-132. Similarly, each master controller 130-132 polls its respective slave controller 140-147 for identification. Thereafter, the master controllers 130-132 may be transmitted from the grand master controllers 101, 102 via the master controllers 130-132 to the respective slave controllers 140-14.
7 to start downloading the appropriate program.

Each slave controller may be configured to control or monitor one or more motors in the corresponding processing module 19, interface modules 38, 39 and wafer conveyor 60. In addition, each slave controller 14
0-147 may be configured to monitor and control the processing components 184 in each module 19. Any one slave controller, such as slave controller 145 shown in FIG. 36, may be configured to control and / or monitor the servo motor and processing component 184.

[0092] Each slave controller includes a slave processor connected to a plurality of port interfaces. Each port interface is composed of a servo motor and processing components 18
4 may be used for controlling and / or monitoring. For example, one port may be connected to a servo controller card 176 configured to operate the wafer transfer units 62a, 62b. The slave processor 171 operates the wafer transfer units 62a and 62b via the port and the servo controller 176. Specifically, the slave processor 171 operates the servo motors in the wafer transfer units 62a and 62b through the servo controller 176 and monitors the state of the motors.

Alternatively, the various slave controllers 140, 141 may operate various components within one processing tool device, such as the interface module 38. Specifically, the interface module controller 110 and the components of the interface module 38 are depicted in FIG. The slave controller 140 operates the turnstyle motor 185 and monitors the position of the turnstyle 40 via the incremental encoder 190. The slave controller 140 preferably connects to the turn style motor 185 via a servo control card (shown in FIG. 35).
And the turn style encoder 190. Slave controller 14
1 operates and monitors the saddle 45 of the turn style 40 by controlling the saddle motor 186 via the servo control card and monitoring the saddle encoder 191.

The ports of the slave processors may be connected to an interface controller card 180 to control and monitor the processing components in each processing module 19. For example, flow sensor 657 provides processing fluid delivery flow rate information to a processing bowl within the processing module. The interface controller 180 is configured to translate the data provided by the flow sensor 657 or other processing component into a form that is analyzed by a corresponding slave processor 172. Further, the interface controller 180 operates a processing component, such as the flow controller 658, in response to a command from the corresponding slave processor 172.

One slave controller 140-147 is connected to each port of the slave processors 170-172 to enable the ability to control and monitor various component motors and processing components from one slave controller. It may include one or more servo controllers and one or more interface controllers connected.

[0096] Alternatively, the servo controller and the interface controller may each include a board-mounted processor to improve the speed of processing and operation. The data supplied by the encoder or processing components to the servo controller or interface controller is immediately processed by the on-board processor, which also controls the respective servomotors or processing components in response to the data. In such an arrangement, the slave processor may transfer the data from the interface processor or servo controller processor to the respective master and grand master controllers.

Conveyor Control Subsystem The conveyor control subsystem 113 for controlling and monitoring the operation of the wafer conveyor 60 and the wafer transport units 62a, 62b or 562a, 562b or 544a, 544b therein is shown in FIG. Have been. Generally, the slave controller 143 of the conveyor controller 113 includes a drive actuator 71 for controllable movement and monitoring of the wafer transport unit 62a along the guide 66.
Is connected to Further, the slave controller 143 controls the wafer transport unit 62
a or 562a or 544a to operate the transfer arm assembly 86 and thereby transfer the semiconductor wafer. Similarly, slave controller 144 is configured to operate wafer transport unit 62b or 562b or 544b and drive actuator 74.

The interfacing between the photodetector 91 of the slave controller 143, the drive actuator 71, the linear encoder 196, and the wafer transport unit 62a is shown in detail in FIG. The slave processor 171 of the slave controller 143 is preferably connected to the servo controller 176. The slave processor 171 is connected to the drive actuator 71 via the servo controller 176.
Is operated, the linear position of the wafer transport unit 62a (linear pos
ition) may be controlled. Photodetector 91 provides linear position information for wafer transport unit 62a along guide 66. In addition, the linear encoder 196 may also be used to precisely monitor the position of the wafer transport unit 62 along the guide 66.

The conveyor slave processor 171 is connected to the corresponding wafer transport unit 62a.
Of the transfer arm assembly 86 may be controlled and monitored. Specifically, the conveyor processor 171 may be connected to a transfer arm motor 194 in the shaft 83 to controllably rotate the first and second arm extensions 87,88. An incremental transfer arm rotation encoder 197 is provided in the shaft 83 of each wafer transport unit 62a to monitor the rotation of the transfer arm assembly 86 and supply the rotation data to the servo controller 176 and the slave processor 171. It may be provided.

The slave controller 143 controls the elevation position of the transfer arm assembly 86 (elevational position).
Advantageously, it is connected to a transfer arm height motor 195 in the elevator 90 for controlling the position). An incremental transfer arm height encoder 198 may be provided in the transfer arm elevator assembly 90 to monitor the height of the transfer arm assembly 86.

In addition, a wafer support 89 is provided to selectively support the semiconductor wafer thereon.
The conveyor slave controller 143 may be connected to an air supply control valve actuator (not shown) via an interface controller to control the vacuum in

An absolute encoder 199 may be provided in the wafer conveyor 60, the interface modules 38, 39 and the processing module 19 to detect extreme operating conditions and protect the servomotor therein. Good. For example, the absolute encoder 199 may detect a condition in which the transfer arm assembly 86 has reached a maximum height, where the absolute encoder 199 switches off the elevator 90 to protect the transfer arm elevator motor 195. Good.

A similar approach may be used for the optical fiber signal communication system of the second and third embodiments of the wafer transfer units 562a, 562b and 544a, 544b, respectively. In particular, the encoder 59 located in the elevator 590
1. an echoer 592 located in the base motor 593 of the shaft 583; an encoder 594 located in the shaft 583; a wrist absolute encoder 595 located at the distal end of the transfer arm assembly 586; The elbow absolute encoder 597 disposed on the base of the rotary encoder 19 shown in FIG.
3 rotation input. Similarly, a lift absolute encoder 596, a linear encoder 598, and a head rail (head rai) arranged along the base motor 593.
l) An encoder 599 and a track CCD array absolute encoder 541 provide inputs for the lift encoder 192 and absolute encoder 199 of FIG. 35, respectively.

Processing Module Controller The control system 100 includes a processing module control subsystem 114-11 corresponding to each of the wafer processing modules 20, 22, 24 in the processing tool 10 of the present disclosure.
6 is included. The control system 100 also includes an additional wafer processing module 1
An additional processing module control subsystem 119 may be included to control and / or monitor 9.

Each processing module controller 114, 115, 116 has a corresponding wafer holder 810 and wafer transport unit 62 a, 62 b or 562 a, 562 b
Alternatively, the transfer of the semiconductor wafer W between 544a and 544b may be controlled and monitored. Further, the processing module controllers 114, 115, 116 advantageously control and / or monitor the processing of the semiconductor wafer W in each processing module 20, 22, 24.

Referring to FIG. 30, one slave controller 147 operates a plurality of wafer holders 401 c to 401 e in the processing module 20. Alternatively, one slave controller 145, 146 may have one respective wafer holder 401a, 40
1b may be operated and monitored. Additional slave controllers 148 may be used to operate and monitor all processing components 184 (ie, flow sensors, valve actuators, heaters, temperature sensors) within one processing module 19. Further, as shown in FIG. 37, one slave controller 145 is
And the processing component 184 may be operated and monitored.

In addition, one slave controller 145-148 may be configured to operate and monitor one or more wafer holders 401 and processing components 184. The interfacing of the slave controller 145 for both the wafer holder 401 and the processing components is illustrated in the control system embodiment of FIG. In particular, the servo controller 177 and the interface controller 180 are the slave controllers 1
Each port is connected to 45 slave processors 172. The slave processor 172 may operate and monitor a plurality of wafer holder components via the servo controller 177. In particular, the slave processor 172 includes an operator arm 407 around the lift drive shaft 456.
The lift motor 427 is operated to raise the pressure. An incremental lift motion encoder 455 may be provided in the wafer holder 401 to supply rotation information of the lift arms 407 to the respective slave processors 172 or processors in the servo controller 177. Slave processor 172 also rotates motor 428 in wafer holder 401 to rotate processing head 406 about shafts 429, 430 between the processing position and the semiconductor wafer transfer position.
May be controlled. An incremental rotary encoder 435 is provided for the processing head 4.
06 may be supplied to the corresponding slave processor 172.

The spin motor 480 may be controlled by a processor or a slave processor 172 in the servo controller 177 to rotate the wafer holder 478 during processing of the semiconductor wafer W held thereby. The wafer holder 4
78 to monitor the rotation speed and send the speed information to the slave processor 1.
Preferably, an incremental spin encoder 498 is provided to feed 72.

Advantageously, the plating module controller 114 operates the fingertips 414 of the wafer holder 478 to grip or release the semiconductor wafer. In particular, slave processor 172 operates a valve via pneumatic valve actuator 201 to supply air to pneumatic piston 502 to drive finger chip 414 for grasping a semiconductor wafer. The slave controller 145 in the plating module controller 114 then controls the valve actuator 2
Operate 01 to remove the air supply, thereby disengaging the finger tip 414 from the semiconductor wafer. Slave processor 172 is also connected to relay 20
2 controls the application of current through the finger assembly 824 during processing of the semiconductor wafer.

The processing module controllers 114, 115, 116 preferably operate and monitor the processing of semiconductor wafers in the corresponding wafer processing modules 20, 22, 24 via measurement or processing components 184.

Referring to FIG. 33, a control operation for the plating module 20 will be described. Generally, slave processor 172 monitors and / or controls processing component 184 via interface controller 180. A slave processor 172 within the plating module controller 114 operates a pump 605 to draw processing solution from the processing fluid reservoir 604 to the pump discharge filter 607. The processing fluid passes through the filter into a supply manifold 652 and is sent via a bowl supply line to a plurality of plating bowls where the semiconductor wafer is processed. Each bowl supply line preferably includes a flow sensor 657 connected to the plating module controller 114 to supply the processing fluid flow information thereto. In response to the flow information, the slave processor 172 may operate an actuator of a flow controller 658 in each bowl supply line to control the flow of processing fluid therethrough. Slave processor 172 also provides the supply manifold 65
Back pressure regulator (back pressure regulator) to maintain a predetermined pressure level within
regulator) 656 is monitored and controlled. The pressure regulator 656 may provide pressure information to a slave processor 172 within the plating process control module 114.

Similarly, the processing module control subsystems 115 and 116 may be configured to control the processing of the semiconductor wafer in the corresponding prewet module 22 and resist module 24.

Interface Module Controller Each interface module control subsystem 110 preferably controls and monitors the operation of the wafer interface modules 38,39.
More specifically, the interface module controller 110 controls each semiconductor wafer interface module 3 to replace the wafer cassette 16.
8, 39 of the wafer cassette turn styles 40, 41 and elevators 42, 4
Control and monitor operation 3

The slave processor 170 in the slave controller 140 of the interface module controller 110 operates and monitors the functions of the interface modules 38 and 39. In particular, slave processor 170 operates doors 35, 36 to provide access into processing tool 10 via ports 32,33.
Alternatively, the master controller 100 may operate the doors 35,36.

With reference to FIG. 31, an embodiment of the interface module control part for controlling the wafer interface module 38 will be described. In particular, the slave processor 170 is connected to the servo controller 175. A processor on board servo with a slave processor 170 or a servo controller 175
Either controller 175) may operate the components of the interface module 38. In particular, the slave processor 170 may control the turnstyle motor 185 to operate the rotation function of the turnstyle 40 that moves the wafer cassette 16 between the loading position and the transfer position. An incremental turnstyle encoder 190 monitors the position of the turnstyle 40 and provides position data to the slave processor 170. Alternatively, servo controller 175 reads information from turnstyle encoder 190 and responds in response to turnstyle motor 18.
5 may be included. Servo controller 175 alerts slave processor 170 once turnstyle 40 reaches the desired position.

Each wafer cassette turn style 40 has a saddle 45, 46 connected thereto.
A motor for controlling the positioning of the vehicle. The slave processor 170
May control the position of the saddles 45, 46 through operation of a suitable saddle motor 186 that orients the wafer cassette 16 mounted thereon in one of a vertical and horizontal orientation. Preferably, an incremental saddle encoder 191 is provided to provide positional information of the saddles 45, 46 to the respective slave processors 170.
Is preferably provided in each wafer cassette turn style 40.

Either the slave processor 170 or the servo controller 175 may be configured to control the operation of the wafer cassette elevator 42 to transfer the wafer cassette 16 between the exchange position and the withdrawal position. The slave processor 170 may be connected to an elevator lift motor 187 and an elevator rotation motor 188 to control the height and rotation of the elevator 42 and the elevator support 47. An incremental lift encoder 192 and an incremental rotary encoder 193 may supply height and rotation information of the elevator 42 and the support 47 to the slave processor 170.

The absolute encoder 199 may be used to inform the slave processor of extreme conditions, such as when the elevator support 47 reaches a maximum height. The elevator lift motor 187 may be closed in response to the presence of extreme conditions by the absolute encoder 199.

Wafer Cassette Tray A wafer cassette tray 50 for holding the wafer cassette 16 is shown in detail in FIG. Each cassette tray 50 may include a base 51 and an upright portion 54, preferably perpendicular to the base 51. Two lateral supports 52 may be formed on opposite sides of the base 51 and extend upwardly therefrom. The lateral support 52 serves to hold the wafer cassette thereon in a fixed position during movement, rotation and replacement of the wafer cassette 16. Each lateral support 52 includes a groove 53, preferably extended in its length, configured to engage the forks of saddles 45,46.

The wafer cassette tray 50 is preferably a wafer transport unit 62 in the conveyor 60 of the semiconductor wafer W from the loading position of the wafer cassette 16.
It may be used during handling of the wafer cassette 16 in the wafer cassette interface modules 38, 39 which are transferred to a withdrawal position providing access to the wafer cassette 64.

Electroplating Station FIG. 33 shows that the main components of the second semiconductor processing station 900 are specially adapted and made to serve as an electroplating station. The two main parts of the processing station 900 are represented by a wafer rotor, generally designated 906.
rotor assembly and electroplating bowl assembly 303.

Electroplating Bowl Assembly 303 FIG. 33 shows an electroplating bowl assembly 303. The processing bowl assembly comprises a process bowl or plating vessel 316 having an outer bowl side wall 317, a bowl bottom 319, and a bowl rim assembly 917. The processing bowl is preferably circular and generally cylindrical in horizontal cross section, although other shapes are possible.

The bowl assembly 303 includes the cup assembly 3 disposed in the processing bowl container 317.
20. The cup assembly 320 includes the electroplating chemical (the chem).
It includes a fluid cup portion 321 that holds the istry for the electroplating process. Also, the cup assembly extends below the cup bottom 323 and has flutes opened therethrough for fluid communication and release of any gas that collects when the lower chamber is full of liquid. A depending skirt 371 is provided. The cup is preferably made of polypropylene or other suitable material.

The lower opening in the bottom wall of the cup assembly 320 is connected to a height rise adjustable polypropylene riser tube 330 by a screw connection thereto. A first end of the riser tube 330 is attached to the rear of an anode shield 393 that supports the anode 334. Fluid inlet line 325 is located within riser tube 330. The riser tube 330 and the fluid inlet line are attached to the processing bowl assembly 303 by fitting 362. The part 362 receives the height adjustment of the riser tube and line 325 and both. Because of this, the part 362 and the riser tube 330
Connection facilitates vertical adjustment of the anode position. The intake line 325
Is preferably made of a conductive material, such as titanium, and used not only to supply fluid to the cup, but also to conduct current to the anode 334.

Processing fluid is supplied to the cup through a fluid intake line 325 and proceeds therefrom through a fluid intake opening 324. Plating fluid pump (not shown)
Or, as supplied by another suitable supply, the plating fluid may then fill chamber 904 through opening 324.

The upper edge of the cup sidewall 322 forms a weir that limits the level of electroplating solution in the cup. This level is chosen so that only the bottom surface of the wafer W is in contact with the electroplating solution. Excess solution is over the top margin
The top edge surface is poured into an overflow chamber 345. The level of fluid in the chamber 345 is preferably maintained within a range desirable for operational stability by monitoring the fluid level using appropriate sensors and actuators. This can be done in several different outflow configurat
ion). A preferred arrangement is to detect high level conditions using a suitable sensor and then drain the fluid through a drain line as controlled by a control valve. It is also possible to use a standpipe arrangement (not shown) and such is used as a final overflow prevention device in the preferred plating station. More complex level control is also possible.

The effluent from chamber 345 is preferably returned to a suitable reservoir. The liquid can then be handled with additional plating chemicals or other components of the plating or other processing liquids and reused.

In a preferred use of the present invention, the anode 334 is a consumable anode used in connection with plating copper or other metal on semiconductor material. The particular anode will vary depending on the metal being plated and other specifications of the plating solution used. A number of different consumable anodes commercially available may be used as anode 334.

FIG. 33 also shows a diffusion plate (di) supplied over the anode 334 to provide a more uniform distribution between the wafers W in the fluid plating bath.
ffusion plate) 375. Fluid passages are provided on all or a portion of the diffusion plate 375 to allow fluid communication therethrough. The height of the diffuser plate is adjustable using a diffuser height adjustment mechanism 386.

The anode shield 393 is an anode shield fastener to prevent the solution from being directly hit by the plating solution when passing into the processing chamber 904.
It is attached to the underside of the consumable anode 334 using ield fasteners 394. The anode shield 393 and anode shield fastener 394 are preferably made of a dielectric material, such as polyvinylidene fluoride or polypropylene. Advantageously, the anode shield is about 2-5 millimeters thick, more preferably 3 millimeters thick.

The anode shield serves to electrically insulate and physically protect the back side of the anode. It also reduces the consumption of organic plating liquid additives. Although the exact mechanism is unknown at this time, it is believed that the anode shield prevents the collapse of certain materials that develop over time behind the anode. If the anode is left unshielded, the organic chemical plating additive is consumed at a fairly high rate. With the shield, these additives are not quickly consumed.

Wafer Rotor Assembly The wafer rotor assembly 906 holds the wafer W to rotate in the processing chamber 904. The wafer rotor assembly 906 is configured to fit the shape of the rotor (agai
nst feature) Fingers (waf) engaged with a plurality of wafers holding the wafer
a rotor assembly 984 with er-engaging fingers 979. The fingers 979 are preferably adapted to conduct between the wafer and the plating power supply and may be made according to various configurations to act as current thieves.

The various components used to spin the rotor assembly 984 are located within a fixed housing 970. The fixed housing is connected to a horizontally extending arm 909, which in turn is connected to a vertically extending arm. Together, the arms 908, 909 allow the assembly 906 to be lifted out of engagement with the bowl assembly and rotated, thereby transporting the wafer for transfer to the next processing station. Send to assembly 60.

[0134] Many variations on the above system are possible, but not without departing from the basic disclosure. Although the present invention has been described in substantial detail with reference to one or more specific embodiments, changes may be made without departing from the scope and spirit of the invention as set forth in the appended claims. This is what the traders recognize.

[Brief description of the drawings]

FIG. 1 is an isometric view of a semiconductor wafer processing tool of the present invention.

FIG. 2 is a cross-sectional view of the semiconductor wafer processing tool shown in FIG. 1 taken along line 2-2.

FIG. 3-8 is a diagram of a wafer cassette turn style and an elevator of a preferred interface module of a semiconductor wafer processing tool of the present invention operating to exchange a wafer cassette between a holding position and a withdrawing position.

FIG. 9 is an isometric view of a preferred wafer cassette tray engageable with a turn style of an interface module of the semiconductor wafer processing tool.

FIGS. 10-15 illustrate one manner in which the processing tool may be modularized to facilitate end-to-end coupling of sequential processing units.

FIGS. 16-19 illustrate a wafer transfer system according to one embodiment of the present invention.

20-25 illustrate a further advanced wafer transport system of a further embodiment of the present invention.

FIG. 26 is a functional block diagram of an embodiment of a control system for a semiconductor wafer processing tool.

FIG. 27 is a functional block diagram of a master / slave control configuration of an interface module control subsystem for controlling a wafer cassette interface module.

FIG. 28 is a functional block diagram of the interface module control subsystem coupled with the components of the wafer cassette interface module of the processing tool.

FIG. 29 is a functional block diagram of a wafer conveyor control subsystem combined with the wafer conveyor components of the processing tool.

FIG. 30 is a functional block diagram of a wafer processing module control subsystem combined with parts of a wafer processing module of the processing tool.

FIG. 31 is a functional block diagram of a slave processor of an interface module control subsystem coupled with components of a wafer interface module of the processing tool.

FIG. 32 is a functional block diagram of a slave processor of a wafer conveyor control subsystem combined with parts of a wafer conveyor of the processing tool.

FIG. 33 is a cross-sectional view of a processing station for use in electroplating a downward facing surface of a semiconductor wafer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor wafer processing tool 11 Work space 12 Interface part 14 Processing part 15, 16, 17 Semiconductor wafer cassette 18 Rear closing surface 19 Processing module 20 Plating module 22 Pre-wet module 24 Resist strip module 26 Air supply unit 30 User interface 32 , 33 access port 34 window 35, 36 door 37 vent 38, 39 interface module 40, 41 wafer cassette turn style 42, 43 wafer cassette elevator 44 shaft 45, 46 saddle 47, 48 wafer cassette support 49 wafer cassette turn style shaft Reference Signs List 50 cassette tray 51 base 52 lateral support portion 53 groove 54 upright portion 57 vent 58, 59 exhaust duct 60 half Conductive wafer conveyor or wafer transport system 62 Wafer transport unit 63 Guide rail 64 Wafer transport unit or guide rail 65 Frame 66 Wafer transport unit guide 68, 70 Pass 69, 75 Extension 71, 74 Drive operator or actuator 72, 73 Cable guard 76 Linear Bearing 77 Horizontal roller 79 Electromagnet 81 Radiator 82 Axis 83 Shaft 84 Carriage tram 85 Cover 86 Wafer transfer arm assembly 87 First arm extension 88 Second arm extension 89 Vacuum support or wafer support 90 Transfer arm elevator 91 CSI Day (CCD) array 100 Control system 101, 102 Grandmaster controller 110 Control subsystem or Interface module controller 113 Control subsystem or conveyor controller 114, 115, 116 Control subsystem or processing module controller 119 Control subsystem or additional processing module controller 126, 127, 129 Data link 130, 131, 132 Master Controllers 140, 141, 142-148 Slave controllers 150, 160, 161, 162 Memory mapped devices 171, 172 Slave processors 176, 177 Servo controllers 180 Interface controller cards 184 Processing components 185 Turn style motors 186 Saddle motors 187 Elevator lift motor 188 Elevator rotation motor 190 Incremental encoder 191 Saddle encoder 192 Lift encoder 193 times Encoder 194 Transfer arm motor 195 Transfer arm height motor 196 Linear encoder 198 Transfer arm height encoder 199 Absolute encoder 201 Pneumatic valve actuator 202 Relay 203, 211 Base plate 210 Lower elbow housing 212 Upper installation screw or base plate 214 Lower installation screw 216 Pivot 218 Side groove 220 Level adjustment screw 221 Float pin 222 Installation screw 223 O-ring 224 Shoulder deep counterbore hole 226 Deep counterbore hole shoulder 227 Tapping hole 303 Electroplate bowl assembly 316 Processing bowl or plating container 317 Outside Bowl side wall 319 Bowl bottom 320 Cup assembly 321 Fluid cup part 322 Cup side wall 323 Cup bottom 32 4 Fluid Intake Opening 325 Fluid Inlet Line 330 Riser Tube 334 Anode 345 Overflow Chamber 362 Fitting 371 Skirt 375 Diffusion Plate 386 Diffuser Height Adjustment Mechanism 393 Anode Shield 394 Anode Shield Fastener 401 Wafer Support 401a, 401b, 401c-401e Wafer holder 406 Processing head 407 Operator arm or lift arm 409 Engagement finger assembly 414 Finger tip 427 Lift motor 428 Rotation motor 429,430 Shaft 435 Rotation encoder 455 Lift motion encoder 456 Lift drive shaft 478 Wafer holder 480 Spin Motor 498 Spin encoder 502 Pneumatic piston 540 D / A converter board 41 Truck CSD (CCD) array absolute encoder 544a, 544b Wafer transport unit 560 Wafer conveyor 562a, 562b Semiconductor wafer transport unit 563a, 564a Upper guide rail 563b, 564b Lower guide rail 565 Frame 566 Wafer transport unit guide 568, 570 Motion Path 571,574 Drive operator 572,573 Cable guard 576 Linear bearing 576a Upper linear bearing 576b Lower linear bearing 579 Electromagnet 582 Axis 583 Shaft 584 Carriage or tram 585 Cover 586 Wafer transfer arm assembly 587 First arm extension 588 Second Arm extension 589 Wafer support 590 Wafer transfer Elevator or elevator motor 591,592 Absolute encoder 593 Base motor 594 Absolute encoder 595 Wrist absolute encoder 596 Lift absolute encoder 597 Elbow absolute encoder 598 Linear encoder 599 Head rail encoder 604 Processing fluid reservoir 605 Pump 607 Pump discharge filter 652 Feed manifold back 656 Pressure regulator or pressure regulator 657 Flow sensor 658 Flow controller 800 Input / output assembly or input module 805 Left processing module 810 Right processing module or semiconductor wafer holder 820 Top exhaust assembly 824 Finger assembly 825 End panel 830 Entrance 850 Exit or wafer alignment station 860 Wafer alignment controller 865 Robot Please vessel 870 wafer mapping sensor 875 system control computer 880 4-axis controller 900 second semiconductor processing station 904 the processing chamber 906 wafer rotor assembly 908, 909 arms 917 bowl rim assembly 970 housing 979 wafer engagement Fuinga 984 rotor assembly

[Procedural Amendment] Submission of translation of Article 34 Amendment of the Patent Cooperation Treaty

[Submission date] March 29, 2000 (2000.3.29)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

──────────────────────────────────────────────────続 き Continuation of front page (81) Designated country EP (AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE), OA (BF, BJ, CF, CG, CI, CM, GA, GN, ML, MR, NE, SN, TD, TG), AP (GH, GM, KE, LS, MW, SD, SZ, UG, ZW), EA (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM), AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CZ, DE, DK, EE, ES, FI, GB, GE, GH, HU, IL, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS , LT, LU, LV, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, UA, UG, US, UZ, VN, YU, ZW (72) Inventor Schmidt, Wayne J. 59904, Calif., P. Oabox, Montana, United States 7010 (72) Inventor Coil, Kevin Dabrieux, 59904, Montana, United States Callispell P. Aobox 7010 F term (reference) 3F022 AA08 BB09 CC02 DD01 EE05 JJ16 JJ19 KK02 KK05 KK18 NN02 QQ14 5F031 CA02 FA01 FA03 FA09 FA11 FA15 FA21 FA22 GA08 GA43 GA48 LA07 MA02 MA06 MA28 MA32 NA02 Summary of units A sensor (91) is used to determine the position of (62) and the transfer arm assembly (86). A controller (101) is located remotely from the wafer transfer unit (62) and uses the actuator to respond to the sensor (91) to use the actuator to move the transfer unit (62) and the transfer arm assembly (86). Lead. A communication link has been established between the actuator, the sensors, and the controller. Preferably, the communication link is an optical fiber link.

Claims (32)

[Claims] A transport system for manipulating a semiconductor wafer within a processing portion of a processing apparatus includes a wafer transfer unit for supporting a wafer transfer unit as it moves between a first position and a second position. A transport unit guide disposed within the processing apparatus, wherein the transport unit guide has a frame, a lateral guide rail installed on the frame, and a transport guide on the transport unit guide near the lateral guide rail. A series of magnetic segments arranged, the wafer transfer unit being a tram translatably mounted on the lateral guide rails, a wafer transfer arm assembly for manipulating the semiconductor wafer, and An electromagnet mounted on the tram in cooperation with the magnetic segment to move the transfer unit along a guide rail; An actuator responsive to a control signal for controlling the position of the transfer unit and the transfer arm assembly, and a sensor for monitoring the position of the transfer unit and the transfer arm assembly, the transportation system includes: Also provided is a controller located remote from the transfer unit, the controller responsive to signals received from the sensor and for controlling the actuator to direct movement of the transfer unit and transfer arm assembly. Providing the control signal, the transport system further comprising a communication link between the wafer transfer unit and the controller to facilitate control of operation of the wafer transfer unit. A transport system for manipulating a semiconductor wafer in a processing portion of a processing apparatus. 2. The transportation system according to claim 1, wherein said communication link between said wafer transfer unit and said controller is an optical communication link. 3. The transport system of claim 2, wherein said optical communication link has one or more optical fiber lines extending between said wafer transport unit and said controller. 4. The transport system of claim 1 further comprising a further advanced lateral guide rail mounted on said frame and disposed parallel to and vertically below said lateral guide rail; A transport system wherein the tram is translatably mounted on the further advanced lateral guide rail. 5. The transport system of claim 1, further comprising an angle adjustment mechanism for adjusting an angular orientation of the wafer transfer arm assembly with respect to the tram. 6. The transport system of claim 4, further comprising an angle adjustment mechanism for adjusting the angular orientation of said wafer transfer arm assembly with respect to said tram. 7. The transportation system according to claim 4, wherein said tram is mounted on said lateral guide rail and said further lateral guide rail, respectively, using a passive mounting assembly. And transport system. 8. A semiconductor wafer processing apparatus having a central support extending along a linear transport path and a first side of the central support for translational movement along the linear transport path. A first wafer transport unit mounted on the support and a second wafer of the central support for translational movement parallel to the first transport unit along the linear transport path. Side, and a wafer conveyer system including a second wafer transport unit installed on the support portion, and a plurality of wafer processing modules adjacent to opposing sides of the wafer conveyer system. And the first and second wafer transport units are associated with each of the wafer processing modules to support individual wafers respectively and to transfer semiconductor wafers therebetween. A semiconductor wafer processing apparatus adapted to access the semiconductor wafer. 9. The semiconductor wafer processing apparatus according to claim 8, wherein said first and second wafer transport units are removed along said transport path using respective magnetic linear motors. Semiconductor wafer processing equipment. 10. The semiconductor wafer processing apparatus of claim 8, wherein each said at least one wafer transport unit is a tram and a wafer coupled to said tram for two degrees of freedom movement in a generally horizontal plane. A transfer arm, the wafer transfer arm having a vacuum support mounted at a distal end thereof for holding a semiconductor wafer, wherein the wafer transport unit also includes the wafer to the tram. A semiconductor wafer processing apparatus comprising a transfer arm elevator for adjusting a vertical position of a transfer arm. 11. The semiconductor wafer processing apparatus according to claim 8, wherein the first
And each of the second wafer transport units includes a position sensor for measuring a position of the respective wafer transport unit with respect to the wafer processing module. 12. The semiconductor wafer processing apparatus according to claim 8, further comprising at least one wafer interface module adjacent to said wafer conveyor for supporting a wafer cassette having a plurality of semiconductor wafers therein. The wafer interface is configured to submit the wafer cassette to a withdrawal position to allow at least one of the first and second wafer transport units to access the semiconductor wafer in all wafer cassettes. Semiconductor wafer processing equipment. 13. The semiconductor wafer processing apparatus according to claim 12, wherein each of the at least one wafer interface includes a wafer cassette turn style for moving a wafer cassette between a loading position and a transfer position, and the wafer. A wafer cassette elevator adjacent to the cassette and configured to transfer the wafer cassette between them and supply the wafer cassette to the unloading position. 14. The semiconductor wafer processing apparatus according to claim 12, wherein said semiconductor wafer processing apparatus further has a cassette loading door adjacent to said at least one wafer interface module and adapted to pass through a wafer cassette. A semiconductor wafer processing apparatus characterized by the above-mentioned. 15. The semiconductor wafer processing apparatus according to claim 8, further comprising a first wafer interface module for receiving a wafer cassette containing an unprocessed semiconductor wafer, wherein said first wafer interface is provided. A module is adapted to submit the unprocessed semiconductor wafer to the wafer transfer assembly in a generally horizontal withdrawal position, and the processing apparatus also includes a semiconductor wafer processed in a wafer cassette from under the wafer transfer assembly. A second wafer interface module for receiving the processed semiconductor wafer from the wafer transfer assembly in a generally horizontal insertion position. A semiconductor wafer processing apparatus. 16. The semiconductor wafer processing apparatus of claim 8, wherein the central support is a frame, and the frame supports the frame along a first side of the frame along a length of the linear path. A first set of magnetic segments having a fixed relationship, and a second set of magnetic segments having a fixed relationship to the frame along a second side of the frame along a length of the linear path. And a first and second lateral guide rail installed on opposite sides of the frame to support the first and second wafer transfer units, respectively. 17. The semiconductor wafer processing apparatus according to claim 16, wherein the first
And a tram in which each of the second wafer transfer units is translatably mounted on the respective lateral guide rail; and cooperates with the respective magnetic segment to move the wafer transfer unit along the respective guide rail. An electromagnet mounted on the tram having: a plurality of actuators responsive to control signals for controlling a position of the wafer transfer unit and a transfer arm assembly; a position of the transfer unit and the transfer arm assembly And a plurality of sensors for monitoring the temperature of the semiconductor wafer. 18. The semiconductor wafer processing apparatus according to claim 8, further comprising an air supply section between the opposite ones of said wafer processing modules for supplying air to said semiconductor wafer processing apparatus. Wafer processing equipment. 19. The semiconductor wafer processing apparatus according to claim 8, wherein said wafer conveyer system has at least one exhaust duct adjacent thereto for removing air. 20. The semiconductor wafer processing apparatus according to claim 8, wherein said wafer processing modules are interchangeable. 21. A semiconductor wafer processing apparatus, comprising: a plurality of wafer processing modules for processing a semiconductor wafer, each of said wafer processing modules being interchangeable, said apparatus also comprising: A wafer conveyor having at least one wafer transport unit adapted for controlled movement along an adjacent and generally linear transport path, the at least one wafer transport unit supporting a semiconductor wafer And a semiconductor wafer processing apparatus configured to access each of said wafer processing modules for transferring semiconductor wafers between them. 22. The semiconductor wafer processing apparatus according to claim 21, wherein the wafer conveyor moves the at least one wafer transport unit along the linear transfer path using a magnetic linear motor. Characteristic semiconductor wafer processing equipment. 23. A method for handling a semiconductor wafer in a semiconductor wafer processing apparatus having a plurality of wafer processing modules and a wafer conveyor adjacent thereto, comprising: a. Receiving at least one wafer cassette having a plurality of semiconductor wafers therein; b. Moving a first wafer transport unit along the wafer conveyor to transport a first individual wafer between one of the at least one wafer cassette and a first one of the wafer processing modules; c. Moving a second wafer transport unit along the wafer conveyor to transport a second individual wafer between one of the at least one wafer cassette and a second one of the wafer processing modules. A plurality of wafer processing modules and a wafer conveyor adjacent thereto, wherein the moving process of the first wafer transport unit and the moving process of the second wafer transport unit overlap in time. A method for handling a semiconductor wafer in a semiconductor wafer processing apparatus having the following. 24. The method of claim 23, further comprising at least one of a vertical orientation to a horizontal orientation to submit the semiconductor wafer contained therein in a generally horizontal orientation.
A step of translating two wafer cassettes in a stepwise manner. 25. The method of claim 23, further comprising: storing the wafer cassette with the unprocessed semiconductor wafer in the first interface module; and storing the wafer cassette with the processed wafer in the second interface. Storing in a module. 26. A transport system for manipulating a semiconductor wafer within a processing portion of a semiconductor processing apparatus, wherein the transport system supports the wafer transfer unit when the wafer transfer unit moves between a first position and a second position. A transport unit guide disposed within the processing apparatus, the transport unit guide comprising a frame, a lateral guide rail mounted on the frame, and the transport unit guide near the lateral guide rail. A series of magnetic segments disposed thereon, the wafer transfer unit having a tram translatably mounted on the lateral guide rails, and a wafer transfer arm assembly for manipulating the semiconductor wafer. On the tram to cooperate with the magnetic segment to move the transfer unit along the guide rails An electromagnet mounted thereon and the transport system also includes an angular adjustment mechanism for adjusting the angular orientation of the wafer transfer arm assembly with respect to the tram. A transport system for manipulating semiconductor wafers in the processing section of the processing equipment. 27. The transport system of claim 26, further comprising: a plurality of actuators responsive to control signals for controlling a position of the transfer unit and a transfer arm assembly; and a position of the transfer unit and the transfer arm assembly. And a plurality of sensors for monitoring the transport. 28. The transport system of claim 27, further comprising a controller remote from the transfer unit, the controller responsive to signals received from the sensor, the transfer unit and the transfer arm. The control system is adapted to supply the control signal to the actuator to direct movement of the assembly, and the transport system also includes the wafer transfer unit and the control to facilitate control of operation of the wafer transfer unit. A transport system comprising a communication link with a vessel. 29. The transportation system according to claim 28, wherein said communication link between said wafer transfer unit and said controller is an optical communication link. 30. The transport system of claim 29, wherein the optical communication link includes one or more optical fiber lines extending between the wafer transport unit and the controller. 31. The transport system of claim 26, further comprising a further advanced lateral guide rail mounted on the frame and disposed parallel to and vertically below the lateral guide rail, A transport system wherein the tram is translatably mounted on the further advanced lateral guide rail. 32. The transport system of claim 31, wherein said tram is mounted to said lateral guide rail and said further lateral guide rail using respective passive mounting assemblies. Characterized transportation system.