CN1129175C

CN1129175C - Semiconductor processing apparatus having linear conveyor system

Info

Publication number: CN1129175C
Application number: CN 98809734
Authority: CN
Inventors: 凯尔·汉森; 马克·迪克斯; 丹尼尔·J·伍德拉夫; 韦恩·J·施密特; 凯文·W·科伊尔
Original assignee: Semitool Inc
Current assignee: Applied Materials Inc
Priority date: 1997-09-30
Filing date: 1998-01-06
Publication date: 2003-11-26
Anticipated expiration: 2018-01-06
Also published as: WO1999017356A1; JP2001518710A; CN1272960A; EP1027730A1; AU6016498A

Abstract

Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit. The field shaping unit, for example, can be a dielectric assembly coupled to the second outlet to receive the secondary flow and configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container. The field shaping unit can also have at least one electrode compartment through which the secondary flow can pass separately from the primary flow. The electrode is positioned in the electrode compartment.

Description

Semiconductor processing device with linear conveyor system

Technical field

The application relates to semiconductor processing device.

Background technology

In the production for preparing semiconductor integrated circuit and other semiconductor product by semiconductor wafer, often need provide many metal levels to come on the wafer as the interconnecting metal coating that is electrically connected the various devices on the integrated circuit mutually.Usually carry out this interconnection with aluminium,, have now found that the copper metal backing is preferable.

Particularly, proved that using copper on semiconductor wafer is a big technical barrier.Simultaneously owing on semiconductor device, reliably and at low cost form practical problem in the copper layer, thereby also fail to realize the commercialization of copper metal backing.Partly cause is reasonably to remove than difficult reactive ion etching or other selection of implementing copper under the production temperature.Expectation select to remove copper with form patterned layer and provide between the wafer adjacent layer or this wafer and other wafer between conductive interconnection.

Owing to can not use reactive ion etching effectively, thereby industrial just seeking to use inlay (damascene) electroplating technology and form the copper patterned layer and overcome this problem, use the hole in this patterned layer of expectation copper composition, be to be called through hole more commonly, groove and other groove.In the mosaic technology method, at first provide metal seed layer to wafer, be used for conducting electric current during metal plating step subsequently.This inculating crystal layer is to use the metal level as thin as a wafer of the one or more technology coatings in several technologies.For example, use physical vapor deposition or chemical vapor deposition process to produce the layer of its thickness, form metal seed layer thus at the 1000 dust orders of magnitude.Inculating crystal layer is preferably formed by copper, gold, nickel, palladium and all other metals or most of other metal.On the surface of spiraling, form inculating crystal layer because of other device architecture part that has through hole, groove or groove.The spiral structure of this exposing surface partly makes in even mode and forms inculating crystal layer difficulty more.The non-homogeneous electric current that causes flowing through the wafer exposing surface during electroplating technology subsequently of inculating crystal layer changes.This may make the copper layer of electroplating subsequently on inculating crystal layer inhomogeneous again.This inhomogeneous damaged or inefficacy of the semiconductor device that is formed that causes.

In mosaic technology, the copper layer of electroplating on inculating crystal layer is plating (blanket) layer form.This coating layer of plating makes it form cover layer, and target is filling groove and through hole to be provided fully and to extend a certain amount of copper layer on these structure divisions.Generally the thickness by 10000-15000 dust (1-1.5 micron) order of magnitude forms this coating layer.

Mosaic technology also comprises removes the excess metal material that is present in through hole, groove or other groove outside.Remove this metal, the metal level of the composition in the semiconductor integrated circuit that will form is provided.For example utilize chemical-mechanical planarization can remove unnecessary plating material.Chemical-mechanical planarization is an immixture of utilizing chemical remover and grinding agent, grinds and polish the metal surface of exposing, and removes the processing step of not wishing part of the metal level that applies in plating step.

The automation of copper plating process is difficult to carry out, and need to improve the technology of semiconductor plating system, wherein this system can be on the homogeneous semiconductor goods production of copper layer and can be efficiently and production at low cost.More particularly, mainly need provide efficient and reliably automatic copper plating system.

Summary of the invention

A kind of transfer system of handling semiconductor wafer in handling implement is proposed.This system comprises: be configured in the delivery unit guider in the handling implement, be used for the supporting wafers delivery unit when the unit is mobile between the primary importance and the second place.The delivery unit guider comprises framework, be installed in the cross slide way on the framework and be arranged on the delivery unit guider the most a string magnet assembly of close cross slide way.The wafer handling unit comprises the track that is connected movably with cross slide way, the wafer handling arm component of handling semiconductor wafer.The relation that cooperates with magnet assembly is in orbit installed magnet to move delivery unit along guide rail.Actuator is used to control delivery unit and transferring arm module position, and transducer is used to judge delivery unit and transferring arm module position.Away from the delivery unit Configuration Control Unit, this controller is in response to the signal that receives from transducer, and control signal is offered actuator, utilizes moving of actuator guiding delivery unit and transferring arm assembly with response sensor.Between actuator, transducer and controller, set up communication link.Best, this communication link is an optical fiber link.

Description of drawings

Fig. 1 is the stereogram according to semiconductor wafer processing instrument of the present invention.

Fig. 2 is the profile along the line 2-2 intercepting of semiconductor wafer processing instrument shown in Figure 1.

Fig. 3-the 8th operates with the wafer case turnsile of the preferable interface module of the semiconductor wafer processing instrument of exchange wafer case and the schematic diagram of lift between fixed position and extracting position according to the present invention.

Fig. 9 is the stereogram with the engageable preferred wafer case pallet of the wafer case turnsile of the NIM of semiconductor wafer processing instrument.

Figure 10-15 shows that handling implement wherein is by a kind of method of modularization with the end-to-end connection that helps continuous processing unit.

Figure 16-19 shows the wafer transfer system according to one embodiment of the invention.

Figure 20-25 shows another wafer transfer system according to another embodiment of the present invention.

Figure 26 is the functional block diagram of the control system embodiment of semiconductor wafer processing instrument.

Figure 27 is the functional block diagram of master/slave genus control structure that is used for the NIM control subsystem of control wafer pod interface module.

Figure 28 is the functional block diagram with the NIM control subsystem of the element coupling of the wafer case NIM of handling implement.

Figure 29 is the functional block diagram with the wafer handling device control subsystem of the element coupling of the wafer handling device of handling implement.

Figure 30 is the functional block diagram with the processing of wafers module control subsystem of the element coupling of the processing of wafers module of handling implement.

Figure 31 is the functional block diagram with the slave processor of the NIM control subsystem of the element coupling of the wafer NIM of handling implement.

Figure 32 is the functional block diagram with the slave processor of the wafer handling device control subsystem of the element coupling of the wafer handling device of handling implement.

Figure 33 is the profile to the treatment bench of lower surface that is used for plating semiconductor wafers.

Embodiment

With reference to Fig. 1, this preferred embodiment of semiconductor wafer processing instrument 10 is shown.Handling implement 10 can comprise interface section 12 and processing section 14.By the semiconductor wafer cartridge 16 that comprises a plurality of semiconductor wafers of generally representing with W being packed in the handling implement 10 or from its unloading in interface section 12.Particularly, preferably by in the face of at least one port in the preceding outer surface of the wall of handling implement 10 as first port 32, loading or unloading wafer case 16.The second additional port 33 can be set in the interface section 12 of handling implement 10, to improve passage, can utilize port 32 as input port, port 33 is as output port.

Each powered

door

35,36 be can utilize, access port 32,33, the inside of isolation processing instrument 10 and clean room thus covered.Each 35,36 can comprise two parts.The upper and lower moves into the front surface of handling implement 10 respectively up and down, passes through from it to open port 32,33 and to allow.

General using wafer case 16 transmits a plurality of semiconductor wafers.Wafer case 16 is orientated to during handling implement 10 is sent into or sent to semiconductor wafer, stably provides semiconductor wafer by vertical or upright position therein.

Advantageously, the preceding outer surface of facing handling implement 10 can be connected with clean room, to reduce the noxious pollutant quantity that may introduce in the handling implement 10 during inserting and taking out wafer case 16.In addition, a plurality of wafer case 16 can be imported in the handling implements 10 or from wherein taking out, with the exposure of the unlatching that reduces port 32,33 and handling implement 10 for clean room environment.

The processing section 14 of interface section 12 connection processing instruments 10.Processing section 14 can comprise a plurality of semiconductor wafer processing modules of carrying out various semiconductor processes steps.Specifically, the embodiment of handling implement 10 shown in Figure 1 comprises the plating module 20 of first lateral surfaces that limits processing section 14.The processing section 14 of instrument 10 preferably includes additional module, as the module 22 of prewetting is peeled off module 24 with the resist relative with plating module 20.

In addition, in handling implement 10, also can be provided for finishing other module of additional treatments function.The particular procedure of carrying out with the processing module of handling implement 10 can be different or identical characteristics is arranged.Can be by various various liquid state and the gaseous state treatment steps of using in order.The special benefits of handling implement 10 is to allow to carry out continuously the processing of a series of complexity in the different disposal module that different disposal solution is set up.Can in the controlled working space 11 of height, advantageously finish all processing and not have manual operations, thereby reduce manual operation processing time and the chance of staiing semiconductor wafer.

But the processing module of handling implement 10 is the unit of composite type, interchangeable and independent utility preferably.After the installation of handling implement 10 increases flexibility, can change the processing capacity of carrying out by handling implement 10 and allow to change processing method.Additional processing of wafers module can add to handling implement 10 or replace existing processing module 19.

Handling implement 10 of the present invention preferably includes the back closing surface 18 that is connected with the side of handling implement 10.As shown in Figure 1, air supply 26 is preferably disposed in the middle of the relative processing module of processing section 14.The side of interface section 12, processing section 14, closing surface 18 and air are supplied with 26 and are preferably in the working space 11 that provides closed in the handling implement 10.Air supply with 26 can comprise with the coupling of source of filtered air (not shown) be used for clean air is sent into pipeline in the handling implement 10.More particularly, air supply 26 can comprise a plurality of ventilation holes of handling module 19 centres that are positioned at that are used for clean air is introduced working space 11.

With reference to Figure 16, be adjacent to dispose

discharge duct

58,59 with the clean air that shifts out circulation and pollutant wherein with the framework 65 of wafer handling unit guider 66.

Discharge duct

58,59 can be handled module 19 couplings with each, extracts the clean air of supplying with thus out.Particularly, by air supply 26 clean air is offered the working space 11 of handling implement 10.The ventilating fan (not shown) of the output coupling of utilization and

discharge duct

58,59 by being formed at a plurality of ventilation holes 57 in case or the disposable plates, is adjacent to the air suction is handled in the module 19 with wafer handling unit 62,64.The module 19 of respectively handling in handling implement 10 can be directly and

pipeline

58,59 couplings.Can be by the bottom on back closing surface 18 or the surface by handling implement 10, deflate from the

pipeline

58,59 of handling implement 10.Provide the environment in closed working space and Control work space to reduce pollutant in the handling implement 10 widely.

Each outer panels of handling each module that module preferably can be by forming handling implement 10 sides enters.The side of handling implement 10 can be near grey chamber (gray room) environment.Compare with clean room, the grey chamber has the precautionary measures less to pollutant.Utilize this structure decrease equipment cost to allow to enter treatment element and the electronic component that needs customary handling implement 10 each wafer module of keeping simultaneously.

As shown in Figure 1, can be at the outer surface configuration user interfaces 30 in handling implement front.The touch-screen negative electrode that user interface 30 preferably allows finger contact display screen to implement the various controlled function in the handling implement 10 is penetrated management and control system display.Additional user interface 30 also can be configured in the back of handling implement 10 or independently handle in the module, so that from the operation of another Position Control handling implement 10 of handling implement 10.And, portable user interface 30 can be provided, around handling implement 10, move and watch the operation of treatment element wherein to allow the operator.Can utilize user interface 30 to instruct processing module 19 and semiconductor

wafer delivery unit

62,64 to implement the function and the operation of appointments.

Each

module

20,22 and 24 in the handling implement 10 preferably includes the window 34 of permission from 10 operations of grey chamber range estimation handling implement.And ventilation hole 37 preferably is disposed in the top surface of respectively

handling module

20,22 and 24.The preferably contiguous ventilation hole 37 of electronic component of handling module is provided with, so that allow circulating air that the heat that is produced by this electronic component is dissipated.

Be illustrated in detail in the interface section 12 of embodiment of handling implement 10 and the working space 11 in the processing section 14 among Fig. 2.

Interface section 12 comprises two NIMs 38,39 that are used to handle the wafer case 16 in the handling implement 10.NIM 38,39 by access port 32,33 receive wafer case 16 and memory chip box 16 for wherein semiconductor wafer with reprocessing.In addition, when the processing finished the semiconductor wafer in each wafer case 16, the wafer case that NIM 38,39 storages are taken out from handling implement 10.

Each NIM 38,39 can comprise wafer case turnsile (turnstile) 40,41 and wafer case lift 42,43.Wafer case turnsile 40,41 usually with wafer case 16 from the stable vertical orientated horizontal alignment of being convenient to the access semiconductor wafer that is transposed to.Each wafer case lift 42,43 has each wafer case support 47,48 of fixed wafer box 16.Utilize each wafer case lift 42,43 that wafer case 16 is still on delivering position or the extracting position.Describe the operation of wafer NIM 38,39 below in detail.

In most preferred embodiment of the present invention, the first wafer NIM 38 can play and receives untreated semiconductor wafer it is positioned over input wafer case interface effect in the handling implement 10.The second wafer NIM 39 can play fixing processed semiconductor wafer so that with its output wafer case interface effect of taking out from handling implement 10.

Wafer handling unit

62,64 in handling implement 10 can be near the wafer case 16 of fixing by any wafer NIM 38,39.This transmission of disposing the semiconductor wafer that is beneficial to entire process instrument 10.

Semiconductor wafer conveyer 60 shown in Fig. 2 between

processing module

20,22,24 and NIM 38,39.Wafer handling device 60 is included in the

wafer handling unit

62,64 that transmits single semiconductor wafer W between each wafer NIM 38,39 and the processing of wafers module 19.

Wafer handling device 60 preferably includes for example delivery unit guider 66 of elongated track and so on, and this guider 66 is defined for a plurality of paths 68,70 of

wafer handling unit

62,64 in handling implement 10.Wafer handling unit 62 during transmission guider 66 in the edge of

delivery unit

62,64 moves on first path 68 can be by being arranged at the wafer handling unit 64 on the alternate path 70.Handling implement 10 can comprise additional wafer handling unit, thereby is convenient to transmit semiconductor wafer W between processing of

wafers module

20,22,24 and wafer NIM 38,39.

More particularly, Suction type frame 89 supporting semiconductor wafers W can be passed through in the second arm extension 88.By moving along delivery unit guider 66, suitable

wafer handling unit

62,64 can be near chip support 401.After guider 66 arrives appropriate locations, first extension 87 and second extension 88 are rotatable with near chip support 401.Second extension 88 is arranged on the chip support 401, subsequently downwards with chip support 401 on finger piece assembly 409 mesh.Suction type frame 89 is vacuumized, and the finger piece assembly in handling module is caught the semiconductor wafer W that is positioned at wherein.Reduce by second extension 88 then and it is removed below the semiconductor wafer of being fixed by wafer engagement finger piece.

Finish the processing of semiconductor wafer in

suitable processing module

20,22,24 after, wafer

handling unit

62,64 can be fetched wafer again and give another with this wafer and

handle module

20,22,24 or wafer turned back to and be used for being stored in handling implement 10 or from the wafer case 16 of wherein taking out.

Each

wafer handling unit

62,64 can be fetched semiconductor wafer or place semiconductor wafer therein from wafer case 16 again near the wafer case 16 adjacent with conveyer 60.Particularly, utilize lift 42 to extract the wafer handling unit 62 of semiconductor wafer W from wafer case 16 shown in Fig. 2.More particularly, second extension 88 and the Suction type frame that is attached thereto 89 insertions can be arranged in the wafer case 16 of extracting position.Second extension 88 and Suction type frame 89 stretch under the lower surface of the base semiconductor wafer W of being fixed by wafer case 16.When support 89 is positioned under the center of the semiconductor wafer W that will be removed, apply vacuum by Suction type frame 89.Can promote second extension 88, Suction type frame 89 and semiconductor wafer W attached to it slightly by transferring arm lift 90.At last, semiconductor wafer W is taken out from wafer case 16 in rotatable first extension 87 and second extension 88.Subsequently, this semiconductor wafer W can be given the processing of wafers module of handling 19 in

wafer handling unit

62,64.

After this, wafer handling unit 62 moves to and

suitable processing module

20,22,24 position adjacent along path 68, and semiconductor wafer is put on the processing of wafers support 401, carries out the processing of semiconductor wafer.NIM

With reference to Fig. 3-Fig. 8, the operation of detail display NIM 38.Following discussion is limited to wafer NIM 38, but also can be used for wafer NIM 39, because each NIM 38,39 can be operated by the identical mode of cardinal principle.

Best, the first wafer NIM 38 and the second wafer NIM 39 can play the inputting modular unit and the output module of each semiconductor wafer cartridge 16 of handling implement 10 respectively.On the other hand, these two modules all can play input and output.More particularly, can pack in the handling implement 10 and it temporarily is stored in the first wafer NIM 38, up to taking out semiconductor wafers from wafer case 16 in handling by the wafer case 16 that port 32 will fixed the semiconductor wafer that is untreated.Give wafer case 16 in the second wafer NIM 39 by

wafer handling unit

62,64 with processed semiconductor wafer, temporarily store and/or it is taken out from handling implement 10.

Can utilize each

wafer handling unit

62,64 in the handling implement 10 directly near wafer NIM 38,39, so that transmit semiconductor wafer betwixt.A plurality of transmission that can be helped carrying out in entire process instrument 10 according to the present invention semiconductor wafer W by each

wafer handling unit

62,64 approaching wafer case NIM 38,39 are provided.

The wafer case lift 42 that each wafer NIM 38,39 preferably includes wafer case turnsile 40 and is adjacent.Access port 32,33 is adjacent with each wafer case turnsile 40.Wafer case 16 can be sent in the handling implement 10 or from wherein taking out by port 32,33.

Before sending into wafer case 16 in the handling implement 10, wafer case 16 preferably is positioned on the wafer case pallet 50 with the upright position.Be shown specifically wafer case pallet 50 among Fig. 9.The upright position of wafer case 16 and semiconductor wafer wherein provides reliable orientation, transmits to keep semiconductor wafer in wafer case 16.

Each wafer case turnsile 40,41 preferably includes two

saddles

45,46 that constitute fixed wafer box 16 respectively.Two

saddles

45,46 are provided, during each

access door

35,36 single opening, two wafer case 16 being put into handling implement 10 or to take out thus, thereby reduce the exposure of the 11 pairs of clean room environment of working space in the handling implement 10.

Each

saddle

45,46 comprise two can with the fork of wafer case pallet 50 engagement.Provide power by the motor in the axle (shaft) 49 of wafer case turnsile to

saddle

45,46, wafer case 16 to be set along being oriented horizontally or vertically.Wafer case 16 and semiconductor wafer wherein preferably vertical orientatedly by access port 32,33 and transmit or the extracting position horizontal alignment so that

wafer handling unit

62,64 accesses wafer wherein.

What be also referred to as wafer case 15 is positioned at fixed position (being also referred to as " loaded " position herein) by the 40 fixing wafer case 16 of the wafer case turnsile among Fig. 3.Can be stored in the semiconductor wafer in the wafer case 16 of fixed position, so that handle subsequently.On the other hand, can be stored in the semiconductor wafer in the wafer case 16 of fixed position, so that it is removed from handling implement 10 by access port 32,33 subsequently.

Referring to Fig. 3, the wafer case 16 that is supported by wafer case lift 42 that is also referred to as wafer case 17 is positioned at taking-up or switch.Can take out semiconductor wafers or put it into wherein from the wafer case 16 that is arranged at extracting position by

wafer handling unit

62,64.

Wafer case turnsile 41 and wafer case lift 42

commutative wafer case

15,17, the wafer case 17 that will wherein have processed semiconductor wafer from extracting position is sent to the fixed position, so that it is removed from handling implement 10.In addition, the wafer case 15 that such exchange can will wherein have the semiconductor wafer that is untreated from the fixed position is sent to extracting position, but so that

wafer handling unit

62,64 accesses semiconductor wafer wherein.

The exchange of

wafer case

15,17 is described with reference to Fig. 4-Fig. 8.Particularly, saddle 46 is arranged at the charged axle 44 times of wafer case lift 42.Axle 44 is coupled with the charged wafer case support 47 of fixed wafer box 16.Reduce axle 44 and wafer case support 47 attached to it as shown in Figure 4, axle 44 passes through between the fork of saddle 46 then.

With reference to Fig. 5, the motor in axle 44 is around the axle rotation wafer case support 47 by axle 44, provides wafer case 17 thereon by the relation relative with the fixing wafer case of wafer case turnsile 40 15.Two

saddles

45,46 with wafer case turnsile 40 are inclined to horizontal alignment subsequently, as shown in Figure 6.Then reduce the axle 44 of wafer case lift 42, make wafer case 17 and saddle 46 engagements, as shown in Figure 7.Reduce axle 44 and the 47 a certain amount of rotations of wafer case support again with elimination wafer case 16.With reference to Fig. 8, wafer case turnsile 40 Rotate 180 degree are to transmit

wafer case

15,17.

The wafer case 17 that wherein has processed semiconductor wafer can be passed through port 32 now, so that shift out handling implement 10.The wafer case 15 that has the semiconductor wafer that is untreated is provided with wafer case support 47 engagement ground.Can put upside down as Fig. 3-transmission treatment step shown in Figure 8, wafer case 15 is elevated to the extracting position that can make

wafer handling unit

62,64 access semiconductor wafers.

A kind of method of Figure 10 display module equipment 10.As shown in the figure, equipment 10 comprises I/O assembly 800, a left side and right module 805,810, wafer transfer system 60, last gas deflation assembly 820 and the end plate 825 handled.As shown in the figure, a left side and the right module 805,810 of handling can be fixing around wafer transfer system 60 mutually, form the treatment chamber with inlet 830 and outlet 835.Can handle modules by fixing a plurality of these of structure end to end like this, thus provide can concerning each wafer implement relatively large basically processing or from another point of view can handle the treatment chamber of the extension of a large amount of wafers simultaneously.In this case, to wafer transfer system 60 programming of an equipment 10, its and one or more wafer transfer system 60 before or after transfer system 60 is cooperated.

Figure 11 is illustrated in a kind of method of set handling head in the equipment 10.In this embodiment, left-hand side processing module 805 comprises three processing head and two processing heads that soaked into wafer before electrochemical deposition that are used for rinsing and dry each wafer after electrochemical deposition.Usually, left-hand side is handled module 805 and is constituted the support module with processing head, and this processing head is used for wafer preliminary treatment and the reprocessing with respect to the electrochemical deposition of copper.Right-hand side is handled module 810 and is constituted the plating module usually and comprise five reaction (reactor) heads that are used for the electrochemical deposition of copper.In the embodiment of Figure 11, wafer aligned platform 850 is set, so that guarantee that the thickness of each wafer suitably is orientated when in equipment, handling.Carry out wafer orientation according to registration mark on each wafer etc.

Figure 12 and Figure 13 show that respectively left-hand side is handled module 805 and right-hand side is handled module 810.In these figure, the exterior portion of each chamber is removed, thereby exposes each system element.Best, for example the electronic component of power supply, controller etc. is arranged at the top of respectively handling

module

805 and 810, and moving meter etc. then are arranged at the bottom of respectively handling module.

Figure 14 is the perspective view of the inputting modular unit 800 that is removed of its panel that the inside of slave unit 10 is observed.Figure 15 provides the similar view with respect to the inputting modular unit 800 of equipment 10 outsides.In the embodiment that is showed, configuration wafer aligned platform 850 and wafer aligned controller 860 in inputting modular unit 800.The automatic controller 865 that is used for control wafer transfer system 60 also is arranged at wherein.When they were handled, in order to keep the track of wafer, inputting modular unit 800 disposed the wafer mapped sensors 870 of the wafer that exists in each box of one or more detections.Other element in inputting modular unit 800 comprises system's control computer 875 and four axis controllers 880.The all operations of system's control computer 875 common Mediation Devices 10.The semiconductor wafer conveyer

Handling implement 10 is included in the semiconductor wafer conveyer 60 that transmits semiconductor wafer in the entire process instrument 10.Best, semiconductor wafer conveyer 60 can be used for transmitting betwixt semiconductor wafer near each wafer case NIM 38,39 and each the processing of wafers module 19 in the handling implement 10.This comprises the processing module of each side.

Figure 16 represents an embodiment of wafer handling device 60.Wafer handling device 60 generally includes wafer handling unit guider 66, and guider 66 preferably includes ridge (spine) or the track that is installed on the elongation on the framework 65.On the other hand, delivery unit guider 66 can form track or any other is used for guiding the structure of

wafer handling unit

62,64 thereon.The length of wafer handling device 60 can change and constitute permission

wafer handling unit

62,64 and enter each NIM 38,39 and handle

module

20,22,24.

The mobile path 68,70 of the

wafer handling unit

62,64 of 66 qualifications of wafer handling unit guider and its coupling.With reference to Figure 16, the ridge of delivery unit guider 66 comprises the

guide rail

63,64 that is installed on its opposite side.Each semiconductor

wafer delivery unit

62,64 best and each

guide rail

63,64 engagement.Each guide rail can be installed one or more delivery units 62,64.Extension 69,75 can be fixed on the opposite flank of guider 66, and being used to provides the stability of

delivery unit

62,64 and protect guider 66 not to be worn.Each

wafer handling unit

62,64 comprises the cylinder 77 that constitutes on each extension 69,75 that rides over guider 66.

Should be appreciated that, can constitute wafer handling device 60 by other mode according to the configuration of handling implement 10 inner joint modules 38,39 and

processing module

20,22,24.

Pipeline

58,59 preferably from each processing of wafers module 19 with the extension and the ventilating fan fluid of circulating air that is used to remove the working space 11 of handling implement 10 be communicated with.

With 62,64 power supplies of suitable driver along 68,70 pairs of each wafer handling unit of each path.More particularly, drive each side that operator 71,74 is installed on delivery unit guider 66, controlled move axially of

wafer handling unit

62,64 along delivery unit guider 66 is provided.

Driving operator 71,74 and can being provides pinpoint linear magnetic motor along guider 66 to wafer handling unit 62,64.Particularly, drive preferably linear brushless direct current machine of operator 71,74.This preferred driving operator 71,74 utilize a series of band angles with the magnetic part that is installed in each electromagnet 79 magnetic response on the

wafer handling unit

62,64, promote these unit along delivery unit guider 66.

Be used to protect wherein communication and the cable protective device 72,73 of feed cable can be connected with framework 65 with each wafer handling unit 62,64.Cable protective device 72,73 can comprise a plurality of interconnection elements, to allow

wafer handling unit

62,64 along delivery unit guider 66 omnidistance moving.

As shown in figure 17, the first wafer handling unit 62 is coupled with first side of the ridge of guider 66.Each

wafer handling unit

62,64 comprises the linear bearing 76 with

linear guides

63,64 engagements.And each

wafer handling unit

62,64 preferably includes and is formed at extension 69 engagements on the ridge of guider 66 and the horizontal cylinder 77 of stability is provided.

Figure 17 also illustrates the electromagnet 79 that is installed on the first wafer handling unit 62 of the position of drive actuator 71 magnetic responses.Drive actuator 71 and electromagnet 79 provide

wafer handling unit

62,64 to control along moving axially with direction of delivery unit guider 66.The semiconductor wafer delivery unit

The preferred embodiment of the semiconductor

wafer delivery unit

62,64 of wafer handling device 60 is described with reference to Figure 18 and 19.

Usually, each

wafer handling unit

62,64 comprises with the movably balladeur train (carriage) or the track (tram) 84 of each side coupling of delivery unit guider 66, is used for supporting semiconductor wafers W and the wafer handling arm component 86 that is connected with track 84 movably and is used to adjust the wafer handling arm lift 90 of transferring arm assembly 86 with respect to the lifting of track 84.

With reference to Figure 18, lid 85 surrounds the part that track 84 and delivery unit guider 66 are not faced mutually.Track 84 comprises and the linear bearing 76 that is installed on each

guide rail

63,64 engagement on the delivery unit guider 66.Linear bearing 76 keeps track 84 by the fixed relationship with respect to delivery unit guider 66, and allows track 84 to move along its axis.Cylinder 77 and each extension 69 engagement are used to prevent that track 84 from rotating and providing the stability of wafer handling unit 62 around guide rail 63,64.Also be illustrated in the electromagnet 79 that is connected with track 84 with the position of each

delivery unit

62,64 and drive actuator 71,74 magnetic responses.

Wafer handling arm component 86 extends on the top of track 84.Wafer handling arm component 86 can be included in its first end and a first arm extension 87 of 83 couplings.The second arm extension, 88 the second ends best and the first arm extension 87 are coupled.Three-sixth turn can be revolved around axle 83 in the first arm extension 87, and three-sixth turn can be revolved around axle 82 in the second arm extension 88, and axle 82 is by connecting the axle of the first and

second arm extensions

87,88.

Second extension 88 preferably includes the chip support 89 at its far-end, is used at its supporting semiconductor wafers W during the transmission of wafer handling device 60.Transferring arm assembly 86 preferably includes the chamber with chip support 89 coupling, is used to make it to form vacuum and fixing semiconductor wafer W therein.

The lifting of adjustable transferring arm assembly 86 is provided, the first arm extension 87 is around the axle rotation of axle 83, second extension 88 allows transferring arm 86 near all each wafer case 16 of handling each semiconductor wafer fixture 810 of module 19 and being fixed by NIM 38,39 in handling implement 10 around axle 82 rotations thus.The approaching semiconductor

wafer delivery unit

62,64 that allows like this transmits semiconductor wafer betwixt.

As shown in figure 19, lid 85 has been removed from the wafer handling unit, to represent the wafer handling arm lift 90 that is coupled with track 84 and transferring arm assembly 86.Transmit between one in chip support 89 and wafer holder 810 and wafer case 16 during the step of semiconductor wafer, transferring arm lift 90 relative orbits 84 are adjusted the upright position of transferring arm assembly 86.

Use the position indication array of ccd array 91 among Figure 19 for example and so on, can accurately control the via positions of the track 84 of each

wafer handling unit

62,64 along delivery unit guider 66.In an embodiment of handling implement 10, each semiconductor wafer fixture 810 in handling module 19 has lip-deep corresponding light or other light-beam transmitter 81 of the processing module 19 that is installed in as shown in Figure 2, is used for towards delivery unit guider 66 lead beams.Optical transmitting set 81 can have continuous light beam or can constitute in the

wafer handling unit

62,64 and produces light beam during near each wafer holder 810.

Transferring arm assembly 86 comprises the ccd array 91 of being arranged to receive the laser beam that is produced by optical transmitting set 81.Position indication array 91 on axle 83 detects the existence of light beam to determine the position of track 84 along delivery unit guider 66.The positional precision of wafer handling cell position indicating device is preferably in the scope less than 0.003 inch (approximately less than 0.1 millimeter).

Figure 20-25 illustrates second embodiment of wafer handling unit 562b, and is furnished with the movably balladeur train or the track 584 of each side coupling of delivery unit guider 66 similarly, is used for the wafer handling arm component 586 that is connected with track 584 movably of supporting semiconductor wafers W and is used for the wafer handling arm lift 590 of relative orbit 584 adjustment transferring arm assemblies 586 liftings.The part that lid 585 surrounds track 584.Track 584 comprises and the linear bearing 576 that is installed on each

guide rail

63,64 engagement on the delivery unit guider 66.Linear bearing 576 keeps the fixed relationship of track 584 with respect to delivery unit guider 66, and allows track 584 to move along its axis.Electromagnet 579 and the reaction of guider 66 magnetic are with drive actuator 71,74.

Wafer handling arm component 586 extends on track 584 tops.Wafer handling arm component 586 is included in its first end and a first arm extension 587 of 583 couplings.Having the second arm extension, 588 the second ends best and the first arm extension 587 that are used for supporting semiconductor wafers W is coupled.Three-sixth turn can be revolved around axle 583 in the first arm extension 587, and three-sixth turn can be revolved around axle 582 in the second arm extension 588, and axle 582 is by connecting the axle of the first and second arm extensions 587,588.

As first embodiment, the lifting of adjustable transferring arm assembly 586 is provided, the first arm extension 587 is around the axle rotation of axle 583, and second extension 588 allows semiconductor wafer delivery unit 562a, 562b to transmit semiconductor wafer betwixt around axle 582 rotations thus.

As shown in figure 21, lid 585 has been removed from wafer handling unit 562b, to represent the wafer handling arm lift 590 that is coupled with track 584 and transferring arm assembly 586.During the transmission of semiconductor wafer, transferring arm lift 590 relative orbits 584 are adjusted the upright position of transferring arm assembly 586.

In second embodiment of wafer handling unit 562a, 562b, use the optical fiber communication path, for example fiber-optic filament substituted metal silk 72,73, arrive the wafer handling unit by the digital-to-analog change-over panel on each wafer handling unit 562a, 562b 540.With respect to hardness wiry, use optical fiber to reduce the inertia mass of delivery unit 562a, 562b and improved reliability.Best, between delivery unit and system controller 875, carry out this communication.

Use the combination of encoder accurately to control path and the operating position of the track 584 of each wafer handling unit 562a, 562b, get on the right track 584 to be provided at three shaft spaces, the locational positional information of transferring arm assembly 586 and second extension 588 along delivery unit guider 66.Position with 591 absolute encoders of representing is arranged in lift 590.Be arranged in the bottom motors 593 of axle 583 with the 592 absolute encoder TPOW that represent.Be arranged in axle 583 with the 594 absolute encoder TPOW that represent.With the position of the 595 wrist absolute encoders of representing far-end at transferring arm assembly 586.Ancon absolute encoder TPOWISA597 is set in the bottom of axle 583.Along bottom motors 593 lifting (lift) absolute encoder 596 is set.Linear encoder 598, a track encoder 599 and track CDD array absolute encoder 541 are positioned on the base plate 203 of track 584 bottoms, as shown in Figure 2 with above-mentioned, for detection is installed in processing module 19 lip-deep light-beam transmitters 81 latter are set.Accurate and the reliable position precision of aforementioned permission.

Figure 22 illustrates the installation of wafer handling unit.As shown in, wafer handling device 560 comprises wafer handling unit guider 566, guider 566 comprises ridge or the track that is installed on the elongation on the framework 565.Wafer handling unit guider 566 limits the mobile path 568,570 of wafer handling unit 544a, 544b.The ridge of delivery unit guider 566 comprises

upper rail

563a, 564a and lower guideway 563b, the 564b that is installed on its opposite flank.Each semiconductor

wafer delivery unit

544a, 544b preferably with each engagement of corresponding

upper rail

563a, 564a and lower guideway 563b, 564b.Paired each that goes up lower guideway can be installed one or

more delivery unit

544a, 544b.

Along 568,570 pairs of each

wafer handling unit

544a, 544b power supplies of each path, provide

wafer handling unit

544a, 544b controlled moving axially by the driving operator 571,574 that is installed on delivery unit guider 566 each side along delivery unit guider 566.Driving operator 571,574 and can being provides pinpoint linear magnetic motor along guider 566 to

wafer handling unit

544a, 544b, it also can be the linear brushless direct current machine, this motor utilize a series of band angles with the magnetic part that is installed in 579 magnetic responses of each electromagnet on each

wafer handling unit

544a, 544b, to promote these unit along delivery unit guider 566.

Fiber optic cables protector 572,573 provides and the communicating by letter and protect wherein fiber optic cables of each wafer handling unit 544a, 544b.Cable protective device 572,573 can comprise a plurality of interconnection elements, moves along the whole process of delivery unit guider 566 to allow

wafer handling unit

544a, 544b.

As shown in figure 22, each side coupling of the ridge of

wafer handling unit

544a, 544b and guider 566.Each

wafer handling unit

544a, 544b comprise respectively the last linear bearing 576a with last

linear guides

563a, 564a engagement.And each wafer handling unit 544a, the lower linear bearing 576b that 544b comprises and lower

linear guide rail

563b, 564b mesh provide the more uniform distribution of stability and load in orbit.

With reference to Figure 22-24, upper and lower

linear bearing

576a, 576b also provide a kind of device, utilize this device can be adjusted at the vertical axis of the wafer handling arm component 586 that extends on track 584 tops.During the transmission of wafer, transferring arm assembly 586 rotates extremely important in as far as possible near the face of absolute horizon in handling implement 10.For this reason, as shown in figure 25, the following ancon chamber 210 that offers the transferring arm assembly on the bottom surface 203 that is installed in delivery unit 544a is with tilt adjustments.

Shown in Figure 21,23 and 24, will descend ancon chamber 210 to be installed on the base plate 211 by last mounting screw 212 and following mounting screw 214.As the clearer expression of Figure 25, base plate 211 is fixed on the lifting motor 590 successively, to promote or reduction transferring arm assembly 586.As shown in figure 26, horizontally set between the last mounting screw 212 be pressed on the base plate 211 with following ancon chamber 210 on the corresponding also pivot 216 of transverse concave groove 218 engagements of point a little.Pivot 216 preferably is provided with size with respect to transverse concave groove 218, is provided at the tolerance between base plate 211 and the following ancon chamber 210, so that can obtain the inclination of about 0.95 degree between these two.With the combination of one or more levelling screws 220 and upper and lower mounting screw 212,214 in, the angular orientation of the transferring arm assembly 586 that can adjust and fix down ancon chamber 210 and adhere to, thereby in handling implement 10, during the transmission of wafer, transferring arm assembly 586 is being rotated as far as possible in the face near absolute horizon.

In addition, for wafer handling unit 544a, the 544b smooth operation along guider 566, submissive the adhering to of lower linear bearing guide 576b is important.Provide this submissive adhering at underdrive guide rail 576b, use submissive technique for fixing can obtain preferably to allow 0.100 inch floating.Around mounting screw 222 unsteady pin 221 is set, has around the O shape circle 223 of the preferably VITON of the pin setting of floating.When the threaded hole 227 of the underdrive guide rail 576b that packs in the counterbore that shoulder is arranged 224 at base plate 203, as shown in figure 28, the float flange 225 of pin 221 of screw 222 carryings, flange 225 itself also carries O shape circle 223.The shoulder 226 of O shape circle 223 carrying counterbores.,, also allow the relative motion between underdrive guide rail 576b and the base plate 203, be beneficial to the smooth motion on whole guider 566 even screw 222 is fastening.Control system

With reference to Figure 26, an embodiment of the control system 100 of semiconductor wafer processing instrument 10 is shown.As shown in, control system 100 generally includes at least one the big master who is used to control and/or monitor the whole functional of handling implement 10 (grand master) controller 101.

Control system 100 preferably is arranged in the structure of architectonical.As shown in figure 26, big master controller 101 comprises the processor with the unit electric coupling of a plurality of subsystem controls.The operation of the computer of relevant device (that is, wafer handling device 60 is handled

module

20,22,24, NIM 38,39 etc.) is preferably controlled and monitored to control subsystem.Control subsystem preferably constitutes the designated command or the operational order of the software coding that for example can receive from each big master controller 101,102 etc.Control subsystem 110,113-119 preferably provide processing and state information to each big master controller 101,102.

More particularly, big master controller 101 is coupled with the NIM controller 110 of each semiconductor wafer NIM 38,39 of may command.And, big master controller 101 and the conveyer controller 113 that is used for 60 operations of control wafer conveyer and handling implement 10 in a plurality of processing module controllers 114,115 corresponding to semiconductor

wafer processing module

20,22 be coupled.Control system 100 according to handling implement 10 of the present disclosure can comprise additional big master controller 102, as shown in figure 26, and by the subsystem that additional processing module controller 119 monitors or operation is additional, for example Fu Jia processing of wafers module.Four best and each big master controller 101,102 couplings of control subsystem.Big master controller 101,102 preferably is coupled and can sends the deal with data of each to another.

Each big master controller 101,102 receives data and it is transferred to the control subsystem 110-119 of each module type.In the preferred embodiment of control system 100, two-way Storage Mapping device is set in big master controller and each the module type subsystem centre that is attached thereto.Particularly, in each NIM controller 110, wafer handling device controller 113 and processing module controller 114, Storage Mapping device 160,161,162 is set in the centre of big master controller 101 and master controller 130,131,132.

The two-port RAM that each Storage Mapping device 150,160-162 are preferably provided by Cypress in control system 100 is used for the stores synchronized data.Particularly, data can be write at big master controller 101 can the while sense data corresponding to the memory location and the master controller 130 of master controller 130.On the other hand, big master controller 101 can be from the map storage facility sense data that is write by master controller 130.Utilize Storage Mapping device 160-161, provide data to transmit by processor speed.Between user interface 30 and big master controller 101,102, preferably be provided for transmitting betwixt the Storage Mapping device 150 of data.

User interface 30 best and each big master controller 101,102 coupling.User interface 30 preferably is installed on the outside of handling implement 10 or operates in order to processing and state information with handling implement 10 a long way off.In addition, by user interface 30, the operator can import the control sequence of handling implement 10 and processing instruction.Preferably support user interface 30 with the all-purpose computer in the handling implement 10.All-purpose computer preferably includes 486 100MHz processors, but also can use other processor.

Preferably constitute and comprise NIM controller 110, each module control subsystem of wafer handling device controller 113 and each processing module controller 114-119 by master/slave genus structure.Module control subsystem 110,113-119 preferably are contained in each module, for example wafer NIM 38,39, wafer handling device 60 or respectively handle

module

20,22,24.Big master controller 101 and the corresponding master controller 130,131,132 that couples with it preferably are embedded on the printed circuit board (PCB) or ISA plate that is contained in the all-purpose computer of supporting user interface 30.The 68EC000 processor that is provided by Motorola is be provided each big master controller 101,102, and 80251 processors that provided by Intel are be provided for each master controller 130 and slave controller in the control system 100.

As Figure 27-shown in Figure 30, each master controller 130,131,132 is coupled by data link 126,127,129 and each slave controller.Each data link 126,127,129 preferably includes the optical data medium, for example the Optilink that is provided by Hewlett-Packard., data link 126,127,129 can comprise other data transmission medium.

With reference to Figure 27, the master/slave genus control subsystem that is used for NIM controller 110 is shown.Each master controller and relevant slave controller structure are preferably corresponding to each module in the handling implement 10 (that is, interface, conveyer is handled)., a master controller may command or monitor a plurality of modules.Shown in Figure 27 and can additionally impose on other module control subsystem 113,114,115 corresponding to the master/slave genus structure of NIM controller 110.

By memory mapped device 160, big master controller 101 is connected with master controller 130 in the corresponding interface module controller 110.Master controller 130 and a plurality of slave controller 140,141,142 couplings.16 slave controllers preferably are coupled with single master controller 130-132, and each slave controller can constitute control and monitor single motor or treatment element, or a plurality of motor and treatment element.

The control system 100 of handling implement 10 is preferably utilized flash memory.More particularly, being used for each master controller 130-132 of operation control system 100 and operational order or the program coding of slave controller 140-147 preferably is stored in the memory of corresponding big master controller 101,102.In case power up, but the big corresponding master controller 130-132 of master controller 101,102 polls downloads suitable operational order program, operates each master controller 130-132.Equally, but each each slave controller 140-147 of master controller 130-132 poll discern.After this, master controller 130-132 can begin to download suitable program from big master controller 101,102, offers each slave controller 140-147 by master controller 130-132.

Each slave controller can constitute control and single motor or a plurality of motor of supervision in respective handling module 19, NIM 38,39 and wafer handling device 60.In addition, each slave controller 140-147 can constitute the treatment element 184 that monitors and be controlled in each module 19.Any one slave controller, for example the slave controller shown in Figure 36 145 can constitute control and/or monitor servomotor and treatment element 184.

Each slave controller comprises the slave processor with a plurality of port interface couplings.Each port interface control be can utilize and/or servomotor and treatment element 184 monitored.For example, port can be coupled with servo controller plug-in unit 176, and this plug-in unit 176 constitutes control wafer delivery unit 62a, 62b.Slave processor 171 can be by port and servo controller 176 control wafer delivery unit 62a, 62b.More particularly, by servo controller 176, the servomotor in slave processor 171 may command wafer handling unit 62a, the 62b and the state of monitoring motor.

On the other hand, the different elements in the different single handling implement devices of slave controller 140,141 may command, for example NIM 38.More particularly, Figure 32 represents the element of NIM controller 110 and NIM 38.Slave controller 140 is by the position of increment turnsile encoder 190 may command turnsile motors 185 and supervision turnsile 40.Slave controller 140 preferably couples by SERVO CONTROL plug-in card (being shown among Figure 35) and turnsile motor 185 and turnsile encoder 190.By SERVO CONTROL plug-in card control saddle motor 186 and supervision saddle encoder 191, the saddle 45 of turnsile 40 can be operated and monitor to servo controller 141.

The port of slave processor can be used for controlling and monitor that the interface controller plug-in card 180 of the treatment element of handling module 19 couples.For example, flow sensor 657 can offer the flow information that treatment fluid transmits the treatment trough in the module.Interface controller 180 constitutes the data that flow sensor 657 or other treatment element are provided and is converted to the form that can be analyzed by corresponding slave processor 172.And interface controller 180 can be according to the commands for controlling treatment element from corresponding slave processor 172, and for example flow controller 658.

Slave controller 140-147 can comprise one or more servo controllers and the one or more interface controller that each port with slave processor 170-172 couples, and is used to allow control and the surveillance coverage of single slave controller to various element motors and treatment element.

On the other hand, servo controller and interface controller can comprise airborne (onboard) processor that is used to improve processing and service speed respectively.The data that offered servo controller or interface controller by encoder or treatment element can be handled immediately by airborne processor, and according to these data, this airborne processor is each servomotor of may command or treatment element also.In this structure, slave processor can send the data from interface processor or servo controller processor to each master controller and big master controller.The conveyer control subsystem

Be used to control and monitor the conveyer control subsystem 113 of the operation of wafer handling device 60 and

wafer handling unit

62a, 62b or 562a, 562b or 544a, 544b shown in Figure 29.Usually, the slave controller 143 of conveyer controller 113 be used to control and monitor that wafer handling unit 62a couples along the drive actuator 71 that moves of guider 66.And, but the transferring arm assembly 86 of slave controller 143 handle wafer delivery unit 62a or 562a or 544a also transmits semiconductor wafer thus.Equally, slave controller 144 can constitute handle wafer delivery unit 62b or 562b or 544b and drive actuator 74.

Being shown specifically slave controller 143 among Figure 36 is connected with wafer handling unit 62a's with photodetector 91, drive actuator 71, linear encoder 196.The slave processor 171 of slave controller 143 preferably and servo controller 176 couple.Utilize by servo controller 176 and handle drive actuator 71, the linear position of servo processor 171 may command wafer handling unit 62a.Photodetector 91 can provide wafer handling unit 62a linear position information along guider 66.And, also can utilize linear encoder 196 along the position of guider 66 in order accurately to monitor wafer handling unit 62.

Conveyer slave processor 171 is gone back may command and is monitored the operation of the transferring arm assembly 86 of corresponding wafer handling unit 62a.Particularly, conveyer processor 171 can couple with the transferring arm motor 194 in the axle 83, controllably rotates the first and second arm extensions 87,88.Increment transferring arm rotary encoder 197 is configurable in the axle 83 of each wafer handling unit 62a, is used to monitor the rotation of transferring arm assembly 86 and its spin data is offered servo controller 176 and slave processor 171.

Slave controller 143 preferably couples with the interior transferring arm lifting motor 195 of lift 90, is used to control the lifting position of transferring arm assembly 86.Increment transferring arm encoding up/down device 198 is configurable in transferring arm elevator assembly 90, to monitor the lifting of transferring arm assembly 86.

In addition, conveyer slave controller 143 can be supplied with control valve actuator (not shown) by interface controller and air and couple, and is used to control selectively the vacuum in the chip support 89 of supporting semiconductor wafers thereon.

Absolute encoder 199 is configurable in wafer handling device 60, NIM 38,39 and processing module 19, detecting operation extreme condition and protection servomotor wherein.For example, absolute encoder 199 can detect the condition that transferring arm assembly 86 arrives maximum height, and absolute encoder 199 can disconnect lift 90 with protection transferring arm lifter motor 195.

Similarly method can be respectively applied for the fiber-optic signal communication system of the second and the 3rd embodiment of wafer handling unit 562a, 562b or 544a, 544b.Particularly, be arranged in the rotation input that the encoder 591 of lift 590, the encoder 592 that is arranged in axle 583 substrate motor 593, the encoder 594 that is arranged in axle 583, the ancon absolute encoder 597 that is positioned at the wrist absolute encoder 595 of transferring arm assembly 586 far-ends and is positioned at axle 583 substrates provide the rotary encoder 193 of Figure 35.Equally, lifting absolute encoder 596, linear encoder 598, a track encoder 599 and the track CDD array absolute encoder 541 that is provided with along substrate motor 593 is provided for the input of lifting encoder 192 and the absolute encoder 199 of Figure 35 respectively.The control of processing module

According to disclosure file, control system 100 preferably includes the processing module control subsystem 114-116 corresponding to each the processing of

wafers module

20,22,24 in the handling implement 10.Control system 100 also can comprise additional processing module control subsystem 119, is used to control and/or monitor additional processing of wafers module 19.

Each handle module controller 114,115,116 may command and monitor corresponding wafer holder 810 and

wafer handling unit

62a, 62b or 562a, 562b or 544a, 544b between the transmission of semiconductor wafer W.And, handle module controller 114,115,116 best may command and/or monitor the processing of respectively handling the semiconductor wafer W in the

module

20,22,24.

With reference to Figure 30, single slave controller 147 can be handled a plurality of wafer holder 401c-401e that handle in the module 20.Also can, each

single wafer fixture

401a, 401b can be handled and monitor to single slave controller 145,146.Can utilize additional slave controller 148 to handle and monitor all treatment elements 184 (that is, flow sensor, valve actuator, heater, temperature sensor) in the single processing module 19.And as shown in figure 37, wafer holder 410 and treatment element 184 can be handled and monitor to single slave controller 145.

In addition, single slave controller 145-148 can constitute and handle and monitor one or more wafer holder 401 and treatment element 184.Slave controller 145 shown in the control system embodiment among Figure 37 is connected with wafer holder 401 and treatment element.Particularly, servo controller 177 and interface controller 180 can couple with each port of the slave processor 172 that is connected to slave controller 145.A plurality of wafer holder elements be handled and be monitored to slave processor 172 can by servo controller 177.Particularly, slave processor 1 72 can be handled and promote motor 427, is used for around promoting driving shaft 456 rising operator arms 407.Increment lifter motion encoder 455 is configurable in wafer holder 401, and the rotation information of lift arm 407 is offered slave processor separately 172 or processor in the servo controller 177.Slave processor 172 is the electric rotating machine 428 in the may command wafer holder 401 also, is used for handling between position and the semiconductor wafer delivering position around axle 429,430 rotation processing 406.Increment rotary encoder 435 can will offer corresponding slave processor 172 about handling a rotation information of 406.

Handling during this fixing semiconductor wafer W, utilizing processor or slave processor 172 may command electric rotating machines 480 in being used to rotate the servo controller 177 of wafer holder 478.Preferably dispose increment rotary encoder 498 and also this rate information is offered slave processor 172 with the speed of rotation that monitors wafer holder 478.

The finger tip 414 of plating module controller 114 best handle wafer fixtures 478 is to catch or to discharge semiconductor wafer.Particularly, slave processor 172 can be by being used for air is offered pneumatic valve actuators 201 control valves of air rammer 502, to catch semiconductor wafer.After this, but the slave controller 145 control valve actuators 201 in plating module controller 114 are removed the air supply, and finger tip 414 and semiconductor wafer are broken away from.During process semiconductor wafers, by control relay 202, slave processor 172 also may command flows through the applying of electric current of finger set part 824.

Handle module controller 114,115,116 and preferably control and monitor the processing of the semiconductor wafer in the corresponding processing of

wafers module

20,22,24 by instrument or treatment element 184.

With reference to Figure 33, the control operation of plating processing module 20 is described.In general, slave processor 172 monitors and/or control and treatment element 184 by interface controller 180.Slave processor 172 operate pump 605 in plating module controller 114 are extracted treatment fluid out from treatment fluid savings container 604, emissions filter 607 is given in suction.Treatment fluid enters supply main 652 by filter, is fed in a plurality of processing plating coating grooves of process semiconductor wafers wherein by the plating coating groove service then.Each plating coating groove service preferably includes the transducer 657 of plating coating groove of handling 114 couplings of module controller with plating and being used to provide the flow information of treatment fluid.According to flow information, slave processor 172 can be handled the actuating of the flow controller 658 in each plating coating groove service, with control entire process flow quantity.Slave processor 172 also can monitor and control the back pressure adjuster 656 that is used for keeping predetermined pressure level in supply main 652.Back pressure adjuster 656 can provide pressure information to the slave processor 172 in the plating processing module controller 114.

Similarly, handle module control subsystem 115,116 and can constitute the processing that is controlled at the semiconductor wafer in corresponding prewet module 22 and protection (resist) module 24.NIM control

The operation of wafer NIM 38,39 is preferably controlled and monitored to each NIM control subsystem 110.More particularly, the operation of the wafer case turnsile 40,41 and the lift 42,43 of each semiconductor wafer NIM 38,39 is controlled and monitored to NIM controller 110, with exchange wafer case 16.

Slave processor 170 in the slave controller 140 of NIM controller 110 can be handled the function with monitoring interface module 38,39.Particularly, but slave processor 170 operated

door

35,36, so that enter handling implement 10 by port 32,33.On the other hand, but master controller 100 operated

door

35,36.

With reference to Figure 31, the embodiment of the NIM control section that is used for control wafer NIM 38 is discussed.Particularly, slave processor 170 couples with servo controller 175.The airborne servo controller 175 of slave processor 170 or processor can be handled the element of NIM 38.Particularly, slave processor 170 may command turnsile motors 185 are used to handle the spinfunction of turnsile 40, mobile wafer case 16 between load situation and delivering position.Increment turnsile encoder 190 monitors the position of turnsile 40 and provides position data to slave processor 170.On the other hand, servo controller 175 can comprise from turnsile encoder 190 sense informations with according to the processor of this information Control turnsile motor 185.In case turnsile 40 arrives the precalculated position, servo controller 175 just can be notified slave processor 170.

Each wafer case turnsile 40 comprises the motor of the location of the

saddle

45,46 that control is coupled.By operating suitable saddle motor 186, the position of slave processor 170 may command saddles 45,46 makes wafer case attached to it 16 along one of vertical and horizontal alignment orientation.Increment saddle encoder 191 preferably is disposed in each wafer case turnsile 40, offers each slave processor 170 with the positional information with

saddle

45,46.

Slave processor 170 or servo controller 175 can constitute the operation of control wafer box lift 42, so that transmit wafer case 16 between switch and extracting position.Slave processor 170 can couple with elevator lifting motor 187 and lift electric rotating machine 188, is used to control the lifting and the rotation of lift 42 and lift support 47.Increment promotes encoder 192 and increment rotary encoder 193 can offer slave processor 170 with the lifting and the rotation information of lift 42 and lift support 47.

For example when lift support 47 arrives maximum height, can utilize the slave processor of absolute encoder 199 notice extreme conditions.In response to the existence of the extreme condition that provides by absolute encoder 199, can close elevator lifting motor 187.The wafer case pallet

Be shown specifically the wafer case pallet 50 that is used for fixing wafer case 16 among Fig. 9.Each wafer case pallet 50 can comprise the upstanding portion 54 that bottom 51 and best and bottom 51 are vertical.51 opposite side also extended upward thus bottom two side supports 52 can be formed on.Between the moving of wafer case 16, rotation and commutation period, side support 52 is auxiliary to keep wafer case 16 on it in the fixed position.Each side support 52 comprises groove 53, and groove 53 preferably extends its length and constitutes and the engagement of the fork thing of

saddle

45,46.

In wafer case NIM 38,39, during the handle wafer box 16, can utilize wafer case pallet 50 in conveyer 60, wafer case 16 to be sent to the extracting position of being convenient to

wafer handling unit

62,64 access semiconductor wafer W from load situation.Plating station

Figure 33 represents particularly suitable and the main element that constitutes as the second semiconductor processes platform 900 of plating station.Two critical pieces of treatment bench 900 are generally with 906 wafer rotor assembly of representing and electroplating bath assemblies 303.Electroplating bath assembly 303

Figure 33 represents electroplating bath assembly 303.The treatment trough assembly is made of treatment trough with water jacket sidewall 317, trench bottom 319 and groove edge assembly 917 or plating container 316.Treatment trough preferably its level cross-sectionn be a circle, although other shape also can, the treatment trough shape is generally cylindrical.

Electroplating bath assembly 303 comprises the cup-shaped component 320 that is arranged in the electroplating bath container 317.Cup-shaped component 320 comprises the liquid cup part 321 of the chemicals that are fixed for electroplating processes.Cup-shaped component also have extend to glass at the bottom of relevant shirt rim 371 and recess under 323, by this recess liquid communication with discharge gas in any chamber that may be stored under the filling liquid.Cup-like portion is preferably by polypropylene or other suitable material preparation.

By being threaded, the under shed in cup-shaped component 320 base wall with can link to each other by the relative polypropylene stalk 330 that it adjusts height.The first end of stalk 330 is fixed in the rear portion of the anode shield 393 of supporting anodes 334.Liquid enters pipeline 325 and is arranged in the stalk 330.By joint 362, stalk 330 and liquid enter pipeline and treatment trough assembly 303 is fixed together.The height of joint 362 scalable stalks 303 and pipeline 325.Equally, be connected with the vertical adjusting that helps anode position between joint 362 and the stalk 330.Entering pipeline 325 is preferably prepared and is used for electric current is imported anode 324 and liquid is supplied with cup-like portion by the conductor material such as titanium.

Treatment fluid enters pipeline 325 by liquid and offers glass portion and pass through liquid inlet 324 thus.Then, when by plating liquid pump (not shown) or the supply of other suitable feedway, plating solution is by opening 324 filled chambers 904.

The top edge of cup sidewall 322 forms the dam of electroplate liquid horizontal plane in the restriction cup.Select this horizontal plane so that only the basal surface of wafer W contacts with electroplate liquid.Excessive liquid overflows this top edge surface and enters discharge chamber 345.Liquid level in the chamber 345 preferably remains in the preset range, so that utilize proper sensors and actuator to monitor the stable operation of liquid level.This can use several different discharge structures to realize.Preferred construction is to use suitable sensor upper level condition, then according to the control of control valve, by sewing the pipeline drained liquid.Also can use vertical tube structure (not shown), and used as the last discharging protective device in the preferred plating platform.Also can adopt more complicated horizontal plane control.

Preferably turn back to suitable savings container from the liquid of chamber 345 dischargings.Can utilize additional plating chemicals or other plating component or other treat liquid to handle this liquid then, and utilize again.

In according to preferred use of the present invention, anode 334 is and plating coating copper on semi-conducting material or the relevant consumable anode of other metal.Specific anode is with used very relevant with other specific plating liquid by coating metal.The multiple different consumable anodes that can commercial purchase can be used as anode 334.

Figure 33 also represents to be arranged on the diffuser plate 375 on the anode 334, is used to make the plating solution that flows on wafer W to distribute more equably.On all or part diffuser plate 375, fluid passage is set, passes through from it to allow liquid.Use the height of diffuser height adjustment mechanism 386 scalable diffuser plates.

Use anode shield fastener 394, make anode shield 393 be fixed in the downside of consumable anode 334, to prevent the direct impact of plating solution when solution enters in the treatment chamber 904.Anode shield 393 and anode shield fastener 394 are preferably by for example Kynoar or polypropylene preparation of insulating material.The thickness of anode shield is preferably about 2-5 millimeter, its thickness be about 3 millimeters better.

Anode shield is as the rear side of electricity isolation and physical protection anode.Also can reduce the consumption of organic plating solution additive.Although also do not know the mechanism that it is appropriate at present, believe that all anode shield can prevent in this time course the consumption of some material of occurring in the anode rear side.If anode does not shield, organic chemistry plating additive is with obviously bigger speed consumption so.Utilize shielding in position, these additives can not consumed apace.The wafer rotor assembly

Wafer rotor assembly 906 fixed wafer W are in order to rotation in treatment chamber 904.Wafer rotor assembly 906 comprises rotor assembly 984, and rotor assembly 984 has a plurality of wafers that wafer is fixed on the rotor structure and meshes finger piece 979.Finger piece 979 preferably is suitable between wafer and plating power supply the conducting electric current and constitutes with conduction current according to various structures.

In fixing case 970, be provided for each element of rotor assembly 984.Fixing case is connected with horizontal-extending arm 909, and arm 909 is connected with the vertical extent arm again.Arm 908 and arm 909 allow assembly 906 and plating coating groove assembly to be raised together with meshing and rotate, thereby give wafer handling module 60 with wafer, are sent to processing place subsequently.

Do not breaking away under its situation of instructing substantially, system is the preceding being carried out multiple change.Although described the present invention substantially in detail, those skilled in the art will appreciate that and to carry out various changes and can not break away from scope of the present invention and the essence that proposes by claims it according to one or more certain embodiments.

Claims

1. transfer system is used for handle wafer in the processing section of the processing unit that microelectronics is made, and this transfer system comprises:

Be configured in the delivery unit guider in the processing unit, when each wafer handling unit is used to support the first and second wafer handling unit when mobile independently between separately the primary importance and the second place, the delivery unit guider comprises framework, is installed in first and second cross slide waies on the framework opposite side and is arranged on a string magnet assembly of pressing close to cross slide way on the delivery unit guider;

The first and second wafer handling unit, the responsive control signal that each first and second wafer handling unit, the wafer handling arm component of the handle wafer that comprise the track that is connected movably with separately cross slide way, links to each other with separately track, the relation that cooperates with separately magnet assembly are installed in orbit moves the magnet of delivery unit, the actuator that moves in response to control signal control transferring arm assembly, is used to monitor that delivery unit is along the position of separately guide rail and the transducer of transferring arm module position state along guide rail separately;

Away from the controller of first and second delivery units configurations, this controller is in response to the signal that receives from transducer, and provides control signal in order to guide the mobile of first and second delivery units and transferring arm assembly separately; With

Communication link between the first and second wafer handling unit and controller is so that the operation of control wafer delivery unit.

2. transfer system according to claim 1, wherein, the communication link between wafer handling unit and the controller is an optical communication link.

3. transfer system according to claim 2, wherein, optical communication link is included in the one or more fibre circuits that extend between wafer handling unit and the controller.

4. transfer system according to claim 1 also comprises:

Be installed in the 3rd cross slide way on the framework, configured in parallel is under first cross slide way:

The track of first delivery unit that is connected movably with the 3rd cross slide way.

5. transfer system according to claim 2 also comprises:

Be installed in the 4th cross slide way on the framework, configured in parallel is under second cross slide way;

The track of second delivery unit that is connected movably with the 3rd cross slide way.

6. transfer system according to claim 1 also comprises angle-adjusting mechanism, is used to adjust the angular orientation of wafer handling arm component with respect to track.

7. transfer system according to claim 4 wherein, utilizes installation component separately that first delivery unit is connected with the 3rd cross slide way with first cross slide way.

8. transfer system according to claim 5 wherein, utilizes installation component separately that second delivery unit is connected with the 4th cross slide way with second cross slide way.

9. the chip processing device in microelectronics is made comprises:

Wafer transfer system comprises:

The center bearing bracket that property transfer path along the line extends,

Dispose and be installed in the first wafer handling unit on center bearing bracket first side, be used for property transfer path along the line translational motion,

Dispose and be installed in the second wafer handling unit on center bearing bracket second side, be used for property transfer path along the line and the translational motion abreast of first delivery unit, the second wafer handling unit is independent of the first wafer handling cell moving;

Near the opposite flank of described wafer transfer system a plurality of processing of wafers platforms; With

The described first wafer handling unit and the second wafer handling unit be suitable for supporting respectively independent wafer and be fit near at least one described processing of wafers platform be used for to or transmit wafer from least one described processing of wafers platform.

10. chip processing device according to claim 9, wherein, at least one in a plurality of treatment benches is the electroplating processes platform.

11. chip processing device according to claim 9, wherein, the described first wafer handling unit and the second wafer handling unit by using linear magnetic motor separately moves along transfer path.

12. chip processing device according to claim 9, wherein, described at least one wafer handling unit comprises:

Track;

The wafer handling arm that is connected with described track, bidimensional moves on horizontal plane, and the wafer handling arm has at its terminal Suction type frame of installing, with fixed wafer;

Adjust the transferring arm lift of the upright position of described wafer handling arm with respect to described track.

13. chip processing device according to claim 9, wherein, each the described first wafer handling unit and the second wafer handling unit comprise position transducer, are used for the position of definite wafer handling unit separately with respect to described processing of wafers module.

14. chip processing device according to claim 9 also comprises:

At least one wafer NIM is arranged near described wafer handling device, be used to support the wafer case that a plurality of wafers are arranged within it;

Described wafer interface constitutes and described wafer case can be placed on the extracting position, allowing at least one access wafer in all wafers box of the described first wafer handling unit and the second wafer handling unit, with at least one in a plurality of processing of wafers platforms of wafer handling.

15. chip processing device according to claim 14, wherein, each described at least one described wafer interface comprises:

The wafer case turnsile is used for mobile wafer case between loading position and delivering position;

Near described wafer case turnsile wafer case lift, this wafer case elevating mechanism become between it and to transmit wafer case and wafer case is provided to extracting position.

16. chip processing device according to claim 14, wherein, described chip processing device also is included near described at least one wafer NIM and constitutes and allows wafer case to load door from its wafer case of passing through.

17. chip processing device according to claim 9 also comprises:

The first wafer NIM is used to receive the wafer case that comprises untreated wafer, and the first wafer NIM is delivered to wafer handling module on horizontal extracting position with untreated wafer;

The second wafer NIM is used at the wafer of wafer case reception from the processing of wafer handling module the wafer of the second wafer NIM from accepting to handle the wafer handling module of horizontal insertion position.

18. chip processing device according to claim 9, wherein, center bearing bracket comprises:

Framework;

First group of magnet assembly, first limit on the property path direction along the line becomes fixed relationship with framework;

Second group of magnet assembly, second limit on the property path direction along the line becomes fixed relationship with framework;

The relative edge who is installed in framework goes up and supports respectively first cross slide way and second cross slide way of the first wafer handling unit and the second wafer handling unit.

19. chip processing device according to claim 18, wherein, each the first wafer handling unit and the second wafer handling unit comprise:

The track that is connected movably with cross slide way separately;

Relation installation electromagnet in orbit by matching with each magnet assembly is used for moving the wafer handling unit along each guide rail;

In response to a plurality of actuators of control signal, be used for the position of control wafer delivery unit and transferring arm assembly;

A plurality of transducers are used to monitor the position of delivery unit and transferring arm assembly.

20. chip processing device according to claim 9 also is included in the middle air of relative described processing of wafers module and supplies with, and is used for air is supplied with described chip processing device.

21. chip processing device according to claim 9, wherein, described wafer transfer system comprises at least one discharge duct of air-out in its vicinity.

22. chip processing device according to claim 9, wherein, described processing of wafers module is interchangeable.

23. the method for the wafer in the control wafer processing unit, this chip processing device has a plurality of processing of wafers modules and wafer handling device in its vicinity, and this method may further comprise the steps:

A. receive at least one wafer case that has a plurality of wafers within it;

B. move the first wafer handling unit along the wafer handling device, between at least one wafer case and one first processing of wafers module, transmit first independent wafer;

C. move the second wafer handling unit along the wafer handling device, between at least one wafer case and one second processing of wafers module, transmit second independent wafer;

Wherein, described the moving with described the moving of the second wafer handling unit of the first wafer handling unit carried out simultaneously.

24. method according to claim 23 also comprises from vertical orientated to mobile step by step at least one wafer case of horizontal alignment, to cause the wafer that wherein comprises on horizontal alignment.

25. method according to claim 23 is further comprising the steps of:

The wafer case that will have untreated wafer is stored in first NIM; With

The wafer case that will have the wafer of handling is stored in second NIM.

26. be used for the transfer system of handle wafer in the processing section of the semiconductor processing device that microelectronics is made, this transfer system comprises:

Be configured in the delivery unit guider in the processing unit, be used for the supporting wafers delivery unit when the wafer handling unit is mobile between the primary importance and the second place, the delivery unit guider comprises framework, be installed in the cross slide way on the framework and be arranged on the delivery unit guider the most a string magnet assembly of close cross slide way;

The wafer handling unit comprises and the removable track that is connected of cross slide way, is used for the wafer handling arm component of handle wafer, the magnet that is used for moving along guide rail delivery unit in orbit is installed by the relation that cooperates with magnet assembly; With

Adjust the angle-adjusting mechanism of wafer handling arm component angular orientation with respect to track.

27. transfer system according to claim 26 also comprises:

In response to a plurality of actuators of control signal, be used to control the position of delivery unit and transferring arm assembly;

28. transfer system according to claim 27 also comprises:

Away from the controller of delivery unit configuration, controller is in response to the signal that receives from transducer, and control signal is offered actuator, with moving of guiding delivery unit and transferring arm assembly; With

Communication link between wafer handling unit and controller is so that the operation of control wafer delivery unit.

29. transfer system according to claim 28, wherein, the communication link between wafer handling unit and the controller is an optical communication link.

30. transfer system according to claim 29, wherein, optical communication link is included in the one or more fibre circuits that extend between wafer handling unit and the controller.

31. transfer system according to claim 26 also comprises:

Be installed in another cross slide way on the framework, configured in parallel is under cross slide way;

With the removable track that is connected of another cross slide way.

32. transfer system according to claim 31 wherein, utilizes installation component separately, track is connected with another cross slide way with cross slide way.